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CHENG; Chihy-Yuan Patent Filings

CHENG; Chihy-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHENG; Chihy-Yuan.The latest application filed is for "method for reducing charging of semiconductor wafers".

Company Profile
4.5.7
  • CHENG; Chihy-Yuan - Tainan City TW
  • Cheng; Chihy-Yuan - Tainan TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method For Reducing Charging Of Semiconductor Wafers
App 20220301849 - CHANG; Wei-Lin ;   et al.
2022-09-22
Improving Surface Topography by Forming Spacer-Like Components
App 20220199636 - Wu; Chun-Chang ;   et al.
2022-06-23
Surface topography by forming spacer-like components
Grant 11,276,699 - Wu , et al. March 15, 2
2022-03-15
Surface Topography by Forming Spacer-Like Components
App 20200127000 - Wu; Chun-Chang ;   et al.
2020-04-23
Surface topography by forming spacer-like components
Grant 10,522,557 - Wu , et al. Dec
2019-12-31
Integrated circuit structure with guard ring
Grant 10,366,916 - Cheng , et al. July 30, 2
2019-07-30
Surface Topography By Forming Spacer-like Components
App 20190131313 - Wu; Chun-Chang ;   et al.
2019-05-02
Integrated Circuit Structure with Guard Ring
App 20180204758 - Cheng; Chihy-Yuan ;   et al.
2018-07-19
Method of Planarizating Film
App 20180076081 - Cheng; Chihy-Yuan ;   et al.
2018-03-15
Method of planarizating film
Grant 9,917,006 - Cheng , et al. March 13, 2
2018-03-13
Method of fabricating a metal grid for semiconductor device
Grant 9,153,620 - Wang , et al. October 6, 2
2015-10-06
Method Of Fabricating A Metal Grid For Semiconductor Device
App 20150249109 - Wang; Chih-Chien ;   et al.
2015-09-03

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