U.S. patent application number 15/194086 was filed with the patent office on 2017-12-28 for wet processing system and method of operating.
The applicant listed for this patent is TEL NEXX, Inc.. Invention is credited to Gary Boulet, Freeman Fisher, David G. Guarnaccia, Jonathan Hander, Jonathan Haynes, Arthur Keigler.
Application Number | 20170370017 15/194086 |
Document ID | / |
Family ID | 60675354 |
Filed Date | 2017-12-28 |
United States Patent
Application |
20170370017 |
Kind Code |
A1 |
Keigler; Arthur ; et
al. |
December 28, 2017 |
WET PROCESSING SYSTEM AND METHOD OF OPERATING
Abstract
An electrochemical deposition system having two or more
electrochemical deposition modules arranged on a common platform
and configured for depositing one or more metals on a substrate is
described. Each electrochemical deposition module includes an anode
compartment configured to contain a volume of anolyte fluid, a
cathode compartment configured to contain a volume of catholyte
fluid, and a membrane separating the anode compartment from the
cathode compartment. Each electrochemical deposition module further
includes a workpiece holder configured to hold opposing edges of a
flexible workpiece between first and second leg members via a
clamping mechanism, and a loader module configured to position the
flexible workpiece in the workpiece holder while holding the
flexible workpiece using an air cushion on each opposing planar
surface of the flexible workpiece.
Inventors: |
Keigler; Arthur; (Wellesley,
MA) ; Hander; Jonathan; (Westford, MA) ;
Fisher; Freeman; (Charlestown, MA) ; Haynes;
Jonathan; (Petersham, MA) ; Boulet; Gary;
(Rindge, NH) ; Guarnaccia; David G.; (Carlisle,
MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TEL NEXX, Inc. |
Billerica |
MA |
US |
|
|
Family ID: |
60675354 |
Appl. No.: |
15/194086 |
Filed: |
June 27, 2016 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C25D 21/14 20130101;
C25D 17/06 20130101; C25D 17/28 20130101; C25D 17/00 20130101; C25D
21/10 20130101; C25D 17/002 20130101; C25D 17/001 20130101 |
International
Class: |
C25D 17/28 20060101
C25D017/28; C25D 17/06 20060101 C25D017/06; C25D 17/00 20060101
C25D017/00; C25D 21/14 20060101 C25D021/14; C25D 21/10 20060101
C25D021/10 |
Claims
1. An electrochemical deposition system comprising: two or more
electrochemical deposition modules arranged on a common platform
and configured for depositing one or more metals on a substrate,
each electrochemical deposition module comprising: an anode
compartment configured to contain a volume of anolyte fluid; a
cathode compartment configured to contain a volume of catholyte
fluid; and a loading port configured to receive a set of flexible
workpieces; a loader module configured to receive a flexible
workpiece from the loading port and position the flexible workpiece
in a workpiece holder while holding the flexible workpiece using an
air cushion on each opposing planar surface of the flexible
workpiece; the workpiece holder having a header member separating
first and second leg members, the workpiece holder configured to
hold opposing edges of the flexible workpiece between the first and
second leg members via a clamping mechanism that applies electrical
contacts to the opposing planar surfaces of the flexible workpiece
with the electrical contacts surrounded by an elastomeric seal to
the flexible workpiece when held by the workpiece holder, the
holder being configured to expose both sides of the workpiece to
plating solution; a transportation mechanism configured to
transport flexible workpieces, via workpiece holders, from the
loader module to a given electrochemical deposition module and
lower a given workpiece into the given electrochemical deposition
module; an electrical system configured to apply an electrical
current to each opposing planar surface of the flexible workpiece
when held within the given electrochemical deposition module such
that each opposing planar surface is plated with metal; an unloader
module configured to remove the flexible workpiece from the
workpiece holder and convey the flexible workpiece to an unloading
port configured to receive the set of flexible workpieces.
2. The electrochemical deposition system of claim 1, wherein the
loading port and the unloading port are positioned at different
locations of the electrochemical deposition system.
3. The electrochemical deposition system of claim 2, wherein the
transportation mechanism is configured to return workpiece holders
from the unloader module to the loader module.
4. The electrochemical deposition system of claim 2, wherein the
loading port and the unloading port are located at opposite ends of
the electrochemical deposition system.
5. The electrochemical deposition system of claim 1, wherein the
electrochemical deposition system includes a chemical management
system coupled to the one or more electrochemical deposition
modules, and configured to supply at least one of the one or more
electrochemical deposition modules with one or more metal
constituents for depositing the one or more metals.
6. The electrochemical deposition system of claim 5, wherein the
chemical management system includes a helical conveyor for
conveying metal powder to a metal dispensing system.
7. The electrochemical deposition system of claim 1, further
comprising: a membrane separating the anode compartment from the
cathode compartment.
8. The electrochemical deposition system of claim 1, wherein each
electrochemical deposition module includes an agitation member
configured to agitate plating solution at opposing surfaces of the
flexible workpiece.
9. The electrochemical deposition system of claim 1, wherein when
the flexible workpiece is positioned within the given
electrochemical deposition module, each opposing planar surface of
the flexible workpiece faces an anode, wherein each flexible
workpiece defines through holes to be filled with metal.
10. The electrochemical deposition system of claim 1, wherein each
electrochemical deposition module is configured to hold less than
thirty liters of plating solution.
11. The electrochemical deposition system of claim 1, wherein the
clamping mechanism includes elastic members that impart a clamping
force on the opposing planar surfaces of the flexible
workpiece.
12. The electrochemical deposition system of claim 11, wherein the
electrochemical deposition system includes a pneumatic bladder
configured to open the clamping mechanism when inflated.
13. The electrochemical deposition system of claim 1, wherein the
common platform includes less than 16 electrochemical deposition
modules and is configured to plate 100 flexible workpieces per
hour.
14. The electrochemical deposition system of claim 13, wherein the
common platform covers a floor space of less than 250 square
feet.
15. An electrochemical deposition system comprising: two or more
electrochemical deposition modules arranged on a common platform
and configured for depositing one or more metals on a substrate,
each electrochemical deposition module comprising: a plating
solution compartment configured to contain a volume of plating
solution; a loading port configured to receive a set of workpieces;
a loader module configured to receive a workpiece from the loading
port and position the workpiece in a workpiece holder while holding
the workpiece using an air cushion on each opposing planar surface
of the workpiece; the workpiece holder having a header member
separating first and second leg members, the workpiece holder
configured to hold opposing edges of the workpiece between the
first and second leg members via a clamping mechanism that applies
electrical contacts to the opposing planar surfaces of the
workpiece with the electrical contacts surrounded by an elastomeric
seal to the workpiece when held by the workpiece holder, the holder
being configured to expose both sides of the workpiece to plating
solution; a transportation mechanism configured to transport
workpieces, via workpiece holders, from the loader module to a
given electrochemical deposition module and lower a given workpiece
into the given electrochemical deposition module; an electrical
system configured to apply an electrical current to each opposing
planar surface of the workpiece when held within the given
electrochemical deposition module such that each opposing planar
surface is plated with metal or one opposing planar surface is
plated with metal; an unloader module configured to remove the
workpiece from the workpiece holder and convey the workpiece to an
unloading port configured to receive the set of workpieces.
16. The electrochemical deposition system of claim 15, wherein an
anode and the workpiece are in contact with a same plating
solution.
Description
BACKGROUND OF THE INVENTION
[0001] This invention relates to methods and systems for
electro-chemical deposition including electroplating of various
workpieces, such as semiconductor substrates.
[0002] Electrochemical deposition systems, or workpiece surface wet
process conditioning systems, are well known for both wafer type
geometries (e.g., semiconductor wafers), characterized by
relatively rigid silicon circular disks, and for panel type
geometries, characterized by much larger and more flexible
rectangular shaped substrates. There is a need in the industry for
equipment that can process the panel workpiece with a resulting
precision of deposited metal comparable to that resulting from the
various wafer equipment, and yet has the economical productivity
comparable or better than existing panel processing equipment.
[0003] Electrochemical deposition (ECD), among other processes, is
used as a manufacturing technique for the application of films to
various structures and surfaces, such as to semiconductor wafers
and silicon work pieces, or substrates. Such films can include
metal and metal alloys, such as tin, silver, nickel, copper, or
other metal layers, or alloys thereof. Electrochemical deposition
involves positioning a substrate within a solution that includes
metal ions, and then applying an electrical current to cause metal
ions from the solution to be deposited on the substrate. Typically,
electrical current flows between two electrodes, namely, between a
cathode and an anode. When a substrate is used as the cathode,
metal can be deposited thereon. A plating solution can include one
or more metal ion types, acids, chelating agents, complexing
agents, and any of several other types of additives that assist
with plating a particular metal. Such additives can help enable
adhesion and uniform plating, and reduce film stress, among other
benefits. As plating occurs, metal from the plating solution is
consumed and thus needs to be replaced to continue electrochemical
deposition operations.
[0004] In panel processing, conventional systems use a continuous
or serial process conveyor type of handling system with panel
orientation either horizontal or vertical. As indicated above,
panel processing systems, in part as a result of their conveyor
systems, suffer from poor process uniformity and particle
generation. More generally, these systems suffer from poor
environment control. Thus, the inventors have recognized there is a
need for improved panel handling and deposition uniformity.
SUMMARY
[0005] Embodiments relate to methods and systems for
electrochemical deposition including electroplating of various
workpieces, such as semiconductor substrates and panels.
[0006] An important feature of systems used for electrochemical
deposition is their ability to produce films with uniform and
repeatable characteristics such as film thickness, composition, and
profile relative to an underlying workpiece profile.
Electrochemical deposition systems can use a primary electrolyte
(process electrolyte) that requires replenishment upon depletion.
By way of example, in metal applications the replenishment of a
metal cation solution may be required upon depletion. And, when
such replenishment cannot be performed in-situ, the replenishment
procedure may be expensive as a function of the application, and
may require significant down time of the electrochemical deposition
tool or sub module for service and process re-qualification, which
adversely affects the cost of ownership of the deposition tool.
[0007] Techniques disclosed herein, among others, include an
electrochemical deposition apparatus that provides robust workpiece
handling, improved environment control, a simplified electrolyte
circulation system, including improved chemical management for more
reliable and uniform plating, as well as short maintenance times
for greater tool availability.
[0008] According to one embodiment, an electrochemical deposition
system having two or more electrochemical deposition modules
arranged on a common platform and configured for depositing one or
more metals on a substrate is described. Each electrochemical
deposition module includes an anode compartment configured to
contain a volume of anolyte fluid, a cathode compartment configured
to contain a volume of catholyte fluid, and a membrane separating
the anode compartment from the cathode compartment. Each
electrochemical deposition module further includes a loading port
configured to receive a set of flexible workpieces, each flexible
workpiece defining through holes to be filled with metal, and a
loader module configured to receive a flexible workpiece from the
loading port and position the flexible workpiece in a workpiece
holder while holding the flexible workpiece using an air cushion on
each opposing planar surface of the flexible workpiece. The
workpiece holder has a header member separating first and second
leg members, wherein the workpiece holder is configured to hold
opposing edges of the flexible workpiece between the first and
second leg members via a clamping mechanism that applies electrical
contacts to the opposing planar surfaces of the flexible workpiece
with the electrical contacts surrounded by an elastomeric seal, and
the header member provides tension to the flexible workpiece when
held by the workpiece holder. Further yet, each electrochemical
deposition module includes a transportation mechanism configured to
transport flexible workpieces, via workpiece holders, from the
loader module to a given electrochemical deposition module and
lower a given workpiece into the given electrochemical deposition
module. An electrical system is configured to apply an electrical
current to each opposing planar surface of the flexible workpiece
when held within the given electrochemical deposition module such
that each opposing planar surface is plated with metal and the
through holes are filled with metal. An unloader module is
configured to remove the flexible workpiece from the workpiece
holder and convey the flexible workpiece to an unloading port
configured to receive the set of flexible workpieces.
[0009] The systems and techniques disclosed herein provide several
advantages. Robust workpiece handling and environment control, as
well as efficient workpiece flows, enable improved process
performance and reduced particle contamination, including process
uniformity and yield. Simplified chemical flow management
eliminates cost and complexity. Moreover, having chemical
generation systems on-board or off board proximate the processing
system provides easier management of chemical concentration.
[0010] Of course, the order of discussion of the different steps
and features as described herein has been presented for clarity
sake. In general, these steps can be performed in any suitable
order. Additionally, although each of the different features,
techniques, configurations, etc. herein may be discussed in
different places of this disclosure, it is intended that each of
the concepts can be executed independently of each other or in
combination with each other. Accordingly, the present invention can
be embodied and viewed in many different ways.
[0011] Note that this summary section does not specify every
embodiment and/or incrementally novel aspect of the present
disclosure or claimed invention. Instead, this summary only
provides a preliminary discussion of different embodiments and
corresponding points of novelty over conventional techniques. For
additional details and/or possible perspectives of the invention
and embodiments, the reader is directed to the Detailed Description
section and corresponding figures of the present disclosure as
further discussed below.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] A more complete appreciation of various embodiments of the
invention and many of the attendant advantages thereof will become
readily apparent with reference to the following detailed
description considered in conjunction with the accompanying
drawings. The drawings are not necessarily to scale, with emphasis
instead being placed upon illustrating the features, principles and
concepts.
[0013] FIG. 1 illustrates a schematic representation of an
electrochemical deposition system according to an embodiment.
[0014] FIGS. 2A and 2B provide views of an electrochemical
deposition module according to another embodiment.
[0015] FIG. 3 provides a cross-sectional view of an electrochemical
deposition module according to another embodiment.
[0016] FIG. 4 provides a perspective view of an electrochemical
deposition system according to yet another embodiment.
DETAILED DESCRIPTION
[0017] Techniques disclosed herein include an electrochemical
deposition apparatus that provides a robust workpiece handling
system, a simplified circulation system, an improved chemical
management system for more reliable and uniform plating, as well as
short maintenance times for greater tool availability
[0018] Systems and techniques disclosed herein can be embodied as
an electrochemical deposition systems or module of a system, or
workpiece surface wet process conditioning system. Example systems
include a wet processing system capable of treating or conditioning
workpieces of various types and sizes, including both wafer type
geometries (e.g., semiconductor wafers), characterized by
relatively rigid silicon circular disks, and panel type geometries,
characterized by much larger and more flexible rectangular shaped
substrates. One embodiment includes an electrochemical deposition
apparatus for depositing metal onto a substrate. FIG. 1 illustrates
a schematic representation of an electrochemical deposition system
100 according to an embodiment. The electrochemical deposition
system 100 includes two or more processing modules, to be described
below, such as electrochemical deposition modules, arranged on a
common platform and configured for depositing one or more metals on
a workpiece. Each processing module, e.g., each electrochemical
deposition module, includes an anode compartment configured to
contain a volume of anolyte fluid, a cathode compartment configured
to contain a volume of catholyte fluid, and a membrane separating
the anode compartment from the cathode compartment.
[0019] The electrochemical deposition system 100 has a loading port
to receive a set of workpieces, including a loader module 110 for
receiving the workpieces that enter electrochemical deposition
system 100 through load/input stage 112 and loading each received
workpiece into a workpiece holder 125, such as a flexible panel
holder (PH). Each workpiece may include a flexible panel, e.g., a
flexible, rectangular panel of various dimensions. The workpiece
may include one or more blind holes, or one or more through-holes
to be filled with material, such as metal. The filling of the one
or more holes can include one-side deposition, i.e., deposition
from one side of the workpiece, or two-sided deposition, i.e.,
deposition from both sides of the workpiece (e.g., in the case
where the hole is a through-hole).
[0020] To control the environment surrounding each workpiece during
loading into the workpiece holder, the loader may use an apparatus
to execute substantially contact-free handling of the workpiece by
applying an air cushion against each opposing planar surface of the
flexible workpiece during workpiece movement and loading. According
to some embodiments, the workpiece holder 125 can include a
gripable header member separating first and second leg members,
wherein the workpiece holder is configured to hold opposing edges
of the flexible workpiece between the first and second leg members
via a clamping mechanism that optionally applies electrical
contacts to the opposing planar surfaces of the flexible workpiece
with the electrical contacts surrounded by an elastomeric seal. The
header member can also provide tension to the flexible workpiece
when held by the workpiece holder 125.
[0021] Further yet, the electrochemical deposition system 100
includes a transportation mechanism configured to transport
flexible workpieces, via workpiece holder 125, from the loader
module 110 to a given processing module, e.g., electrochemical
deposition module, and lower a given workpiece into the given
processing module. For example, referring to FIG. 1, once the
workpiece holder 125, designated for processing, is loaded, it can
proceed along a process path 115 (see PH process path in FIG. 1) to
be pre-processed, as needed, in one or more pre-processing modules
120; processed in one or more processing modules 130, 132, 134,
136, 138; and post-processed, as needed, in one or more
post-processing modules 140. Pre-processing may include, but not be
limited to, cleaning and/or wetting the workpiece to be processed.
Processing may include, but not be limited to, depositing material,
such as metal, onto the workpiece. And, post-processing may
include, but not be limited to, rinsing and/or drying the
workpiece.
[0022] The electrochemical deposition system 100 further includes
an unloader module configured to remove the flexible workpiece from
the workpiece holder and convey the flexible workpiece to an
unloading port configured to receive the set of flexible
workpieces. For example, in some embodiments shown in FIG. 1,
following processing, the workpiece holder 125, carrying a
processed workpiece, can proceed to an unloader module 150, wherein
each workpiece is unloaded and transferred to an unload/output
stage 152 for exiting electrochemical deposition system 100. Once
unloaded, the workpiece holder 125 can return to the loader module
110 along return path 155 (see PH return path in FIG. 1) to receive
another workpiece. Note that multiple workpiece holders can be
used, with some workpiece holders held in a storage buffer. A more
detailed description of an example workpiece holder is found in
U.S. patent application Ser. No. 15/193,595, filed on Jun. 27,
2016, which is herein incorporated by reference in its entirety. A
more detailed description of an example workpiece loader module is
found in U.S. patent application Ser. No. 15/193,890, filed on Jun.
27, 2016, which is herein incorporated by reference in its
entirety.
[0023] The electrochemical deposition system 100 further includes a
chemical management system 160 for managing processing fluid in the
one or more processing cells, i.e., modules 120, 130, 132, 134,
136, 138, 140. Chemical management may include, but not be limited
to, supplying, replenishing, dosing, heating, cooling, circulating,
recirculating, storing, monitoring, draining, abating, etc. Further
yet, the electrochemical deposition system 100 includes an
electrical management system 170 for controlling the operability of
electrochemical deposition system 100. Electrical management may
include, but not be limited to, scheduling, coordinating,
monitoring, adjusting, communicating, etc. For example, the
electrical management system 170 can transmit and receive signals
in accordance with computer encoded instructions to control
workpiece movement through electrochemical deposition system 100,
or control chemical properties, such as chemical composition,
temperature, flow rate(s), etc., of the plural modules 120, 130,
132, 134, 136, 138, 140. Additionally, the electrical management
system 170 can be configured to apply an electrical current to one
or both opposing planar surfaces of the flexible workpiece when
held within the given electrochemical deposition module. In doing
so, one or both opposing surfaces can be plated with metal and
blind holes and/or through-holes are filled with metal.
[0024] Turning now to FIG. 2A, a view of an electrochemical
deposition module having plural ECD cells is provided according to
another embodiment. As shown, FIG. 2A provides a top view of an
anolyte reservoir 230 configured to contain a volume of anolyte
fluid 232, plural cathode compartments configured to contain a
volume of catholyte fluid, and a membrane separating the anolyte
fluid 232 from the plural cathode compartments 200. The anolyte
reservoir 230 includes an anolyte reservoir, containing the anolyte
fluid 232, within which the plural cathode compartments 200 are
positioned. The anolyte reservoir 230 may include an anolyte supply
and storage reservoir 262, wherein anolyte can be recirculated,
replenished, and/or reconditioned, and then exchanged with the
anolyte reservoir 230 using anolyte pumping system 264.
Furthermore, the anolyte reservoir 230 may include a catholyte
supply and storage reservoir 266, wherein catholyte can be
recirculated, replenished, and/or reconditioned, and then exchanged
with the plural cathode compartments 200 using catholyte pumping
system 268. Chemical management system 260 can interface with the
anolyte and catholyte supply and storage reservoirs 262, 266, and
among other things, manage fluid levels, chemical composition,
chemical quality, chemical temperature, chemical dosing, etc. For
example, the chemical management system 260 may rejuvenate the
anolyte and/or catholyte solution, including adding or replacing
water, acid, anion solution, cation solution, chelating agents,
complexing agents, leveling agents, accelerating or decelerating
agents, etc.
[0025] According to some embodiments, workpiece W can include a
flexible, rectangular substrate having dimensions ranging from
approximately 50 cm by 50 cm to 100 cm by 100 cm in size.
Consequently, the fluid depth in the anolyte reservoir 230 may
range from 90 cm to 150 cm deep, and the width of the anolyte
reservoir 230 may range from 90 cm to 150 cm. Each ECD module may
be designed comparatively narrow, for example, the width may be
designed to be less than 20 cm anode-to-anode, or anode-to-cathode.
Consequently, plural cathode comparts 200 (ECD modules) can be
arranged within an anolyte reservoir ranging up to 120 cm in
length. Immersion or partial immersion of plural cathode
compartments 200 within the anolyte reservoir 230 provides an
efficient utilization of space. And thus, one advantage, among
others, of this embodiment is a single container of anolyte fluid
232 with a simplified chemical and fluid management system serving
plural ECD modules in an economical arrangement, conserving
expenditure for equipment, chemistry, and factory footprint.
[0026] FIG. 2B provides a top view of cathode compartment 200
positioned between opposing anode assemblies 240, 241. A workpiece
holder 215 containing a workpiece W is positioned within a frame
210 which advantageously and repeatably positions the workpiece
holder 215 precisely within plus or minus 0.1 to 1.0 mm, preferably
within plus or minus 0.5 mm, with respect to other important
elements of the ECD module which influence the uniformity of the
electric field and fluid flow field at the surface of the workpiece
W. The cathode compartment 200 can include electric field shaping
elements 201, 204 positioned between approximately 3 and 10 mm of
the surfaces of the workpiece W, preferably 4 mm from the surfaces
of the workpiece W. The cathode compartment 200 can further include
fluid agitating elements 202, 205 positioned proximate the surfaces
of the workpiece W, preferably within 10 mm of the surfaces of the
workpiece W.
[0027] Ion-exchange membranes 203, 206 define the boundaries
between the cathode compartment 200 and the anode compartment
containing the opposing anode assemblies 240, 241, and provide
separation between the anolyte fluid 232 within the anode
compartment and catholyte 220 in the cathode compartment 200. One
benefit, among others, is the compact geometry provided by defining
the boundaries between the anolyte fluid 232 and the catholyte 220,
wherein during operation the fluid pressure of anolyte fluid 232
and catholyte 220 are balanced across the flexible, ion-exchange
membrane so that it is not necessary to incorporate an extensive
wall structure to contain the hydrostatic pressure of the catholyte
for each workpiece W.
[0028] Each opposing anode assembly 240, 241 can include a
multi-zone anode 242, e.g., anodes arranged as rings in a radial
direction, or anodes arranged on a grid in orthogonal directions,
for example. In this embodiment, two opposing anode assemblies 240,
241 are shown opposing the cathode compartment. However, in other
embodiments, a single anode assembly may face the cathode
compartment.
[0029] FIG. 3 provides a detailed, cross-sectional view of an ECD
module according to an embodiment. Workpiece holder 315 positions
workpiece W between electric field shaping elements 330, fluid
agitating elements 310, ion-exchange membranes 325 held by support
structure 320, and anode assemblies 340 holding anodes 342. As
illustrated, the electric field shaping elements 330 extend
proximate the exposed surfaces of the workpiece W, and are arranged
to improve uniformity of the deposition process. Additionally, as
illustrated, the fluid agitating elements 310 extend proximate the
exposed surfaces of the workpiece W, and are arranged to increase
fluid shear and enhance mass, momentum, and thermal transport near
the exposed surfaces of the workpiece W.
[0030] FIG. 4 provides a perspective view of an electrochemical
deposition system according to yet another embodiment. The
electrochemical deposition system 500 includes loader module 510
and unloader module 550 with plural processing modules 520, 530,
540 disposed there between. Processing modules 520 may include
pre-processing modules such as pre-rinse modules. Processing
modules 530 may include electrochemical deposition modules. And,
processing modules 540 may include post-processing modules such as
rinse or drying modules. While the loader module 510 and the
unloader module 550 are shown to be at distal ends of the
electrochemical deposition system 500, these loading and unloading
modules may be arranged proximate the same end of the overall
system. Workpiece W can be loaded into workpiece holder 525,
translated via workpiece transfer system 560, and oriented for
positioning within the plural processing modules 520, 530, 540.
[0031] Using systems herein, an electrochemical deposition system
can be created that uses plating solution efficiently, and has a
relatively small foot print compared to conventional deposition
systems. For example, each electrochemical deposition module can be
configured to hold less than about thirty liters of plating
solution. In some embodiments, the common platform can includes
less than about 16 electrochemical deposition modules, and can be
configured to plate 100 flexible workpieces per hour. The common
platform can cover a floor space of less than about 250 square
feet. Thus, systems herein can provide relatively high throughput
with a relatively small system and relatively little plating
solution used per workpiece.
[0032] In the preceding description, specific details have been set
forth, such as a particular geometry of a processing system and
descriptions of various components and processes used therein. It
should be understood, however, that techniques herein may be
practiced in other embodiments that depart from these specific
details, and that such details are for purposes of explanation and
not limitation. Embodiments disclosed herein have been described
with reference to the accompanying drawings. Similarly, for
purposes of explanation, specific numbers, materials, and
configurations have been set forth in order to provide a thorough
understanding. Nevertheless, embodiments may be practiced without
such specific details. Components having substantially the same
functional constructions are denoted by like reference characters,
and thus any redundant descriptions may be omitted.
[0033] Various techniques have been described as multiple discrete
operations to assist in understanding the various embodiments. The
order of description should not be construed as to imply that these
operations are necessarily order dependent. Indeed, these
operations need not be performed in the order of presentation.
Operations described may be performed in a different order than the
described embodiment. Various additional operations may be
performed and/or described operations may be omitted in additional
embodiments.
[0034] "Substrate" or "target substrate" as used herein generically
refers to an object being processed in accordance with the
invention. The substrate may include any material portion or
structure of a device, particularly a semiconductor or other
electronics device, and may, for example, be a base substrate
structure, such as a semiconductor wafer, reticle, or a layer on or
overlying a base substrate structure such as a thin film. Thus,
substrate is not limited to any particular base structure,
underlying layer or overlying layer, patterned or un-patterned, but
rather, is contemplated to include any such layer or base
structure, and any combination of layers and/or base structures.
The description may reference particular types of substrates, but
this is for illustrative purposes only.
[0035] Those skilled in the art will also understand that there can
be many variations made to the operations of the techniques
explained above while still achieving the same objectives of the
invention. Such variations are intended to be covered by the scope
of this disclosure. As such, the foregoing descriptions of
embodiments of the invention are not intended to be limiting.
Rather, any limitations to embodiments of the invention are
presented in the following claims.
* * * * *