U.S. patent application number 15/677519 was filed with the patent office on 2017-11-30 for method for producing biphenyl-skeleton-containing epoxy resin.
The applicant listed for this patent is DIC Corporation. Invention is credited to Hiroshi Kinoshita, Kunihiro Morinaga, Yasuyo Yoshimoto.
Application Number | 20170342194 15/677519 |
Document ID | / |
Family ID | 51898460 |
Filed Date | 2017-11-30 |
United States Patent
Application |
20170342194 |
Kind Code |
A1 |
Yoshimoto; Yasuyo ; et
al. |
November 30, 2017 |
METHOD FOR PRODUCING BIPHENYL-SKELETON-CONTAINING EPOXY RESIN
Abstract
Disclosed is a method for producing a
biphenyl-skeleton-containing epoxy resin represented by Formula (1)
described below including a step of allowing polyvalent hydroxy
biphenyl obtained by a production step including a regioselective
cross-coupling reaction to react with epihalohydrin. ##STR00001##
(In the formula, k1 and l1 each represent an integer of 0 to 4, m
and n each represent an integer of 1 to 5, R.sup.1 and R.sup.2 each
independently represent a hydrocarbon group having 1 to 10 carbon
atoms which may have a substituent group, and R.sup.1 and R.sup.2
may be identical to each other or different from each other.
(Provided that left and right phenyl structures of a biphenyl
skeleton are different from each other.)
Inventors: |
Yoshimoto; Yasuyo;
(Sakura-shi, JP) ; Morinaga; Kunihiro;
(Sakura-shi, JP) ; Kinoshita; Hiroshi;
(Sakura-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
DIC Corporation |
Tokyo |
|
JP |
|
|
Family ID: |
51898460 |
Appl. No.: |
15/677519 |
Filed: |
August 15, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14890237 |
Nov 10, 2015 |
9765179 |
|
|
PCT/JP2014/062936 |
May 15, 2014 |
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15677519 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
C08G 59/063 20130101;
C07D 303/30 20130101; C07D 405/14 20130101; C08G 59/02 20130101;
C07D 405/10 20130101 |
International
Class: |
C08G 59/06 20060101
C08G059/06; C07D 405/14 20060101 C07D405/14; C07D 405/10 20060101
C07D405/10; C08G 59/02 20060101 C08G059/02; C07D 303/30 20060101
C07D303/30 |
Foreign Application Data
Date |
Code |
Application Number |
May 15, 2013 |
JP |
2013-103011 |
Claims
1-2. (canceled)
3. A biphenyl-skeleton-containing epoxy resin represented by
Formula (1): ##STR00013## in the formula, k1 and l1 each represent
an integer of 0 to 4, m and n each represent an integer of 1 to 5,
R.sup.1 and R.sup.2 each independently represent a hydrocarbon
group having 1 to 10 carbon atoms which may have a substituent
group, and R.sup.1 and R.sup.2 may be identical to each other or
different from each other, provided that left and right phenyl
structures of a biphenyl skeleton are different from each
other.
4. The biphenyl-skeleton-containing epoxy resin according to claim
3, wherein the biphenyl-skeleton-containing epoxy resin is a
2,4,4'-trihydroxy biphenyl type epoxy resin represented by Formula
(4): ##STR00014## in the formula, k1 represents an integer of 0 to
4, l1 represents an integer of 0 to 3, R.sup.1 and R.sup.2 each
independently represent a hydrocarbon group having 1 to 10 carbon
atoms which may have a substituent group, and R.sup.1 and R.sup.2
may be identical to each other or different from each other.
5. The biphenyl-skeleton-containing epoxy resin according to claim
3, wherein the biphenyl-skeleton-containing epoxy resin is a
3,4',5-trihydroxy biphenyl type epoxy resin represented by Formula
(5): ##STR00015## in the formula, k1 represents an integer of 0 to
4, l1 represents an integer of 0 to 3, R.sup.1 and R.sup.2 each
independently represent a hydrocarbon group having 1 to 10 carbon
atoms which may have a substituent group, and R.sup.1 and R.sup.2
may be identical to each other or different from each other.
Description
TECHNICAL FIELD
[0001] The present invention relates to a method for producing a
biphenyl-skeleton-containing epoxy resin and an epoxy resin.
BACKGROUND ART
[0002] A polyvalent hydroxy compound and an epoxy resin using the
polyvalent hydroxy compound have been widely used in a
semiconductor encapsulation material or an electronic component
such as a print circuit board, electronic component fields, a
conductive adhesive agent such as a conductive paste, other
adhesive agents, a matrix for a composite material, a coating
material, a photoresist material, a developing material, and the
like from a viewpoint of providing a cured product having low
shrinkage (dimensional stability) at the time of curing, and
excellent electrical insulation and chemical resistance. Recently,
in such various applications, particularly, in advanced material
fields, performance represented as heat resistance or moisture
absorption resistance, and low thermal expandability has been
required to be further improved. Further, according to the laws and
regulations with respect to environmental problems, solder having a
high melting point which does not use lead (lead free solder) has
been mainly used, and the lead free solder has a working
temperature approximately 20.degree. C. to 40.degree. C. higher
than that of eutectic solder of the related art, and thus heat
resistance which is higher than ever before has been required in
the cured product of the epoxy resin.
[0003] An epoxy resin having a biphenyl in a molecular skeleton
disclosed in PTL 1 has particularly excellent various physical
properties such as high heat resistance, low thermal expandability,
and moisture resistance. Further, the epoxy resin has crystalline
properties at an ordinary temperature, and thus has low viscosity
even in a solid resin just like in a liquid resin at the time of
being melted. Accordingly, when the epoxy resin is used in a
encapsulation material, excellent fluidity is able to be obtained
even at the time of being highly filled with silica, and thus the
epoxy resin has excellent workability and excellent performance.
However, recently, for heat resistance, higher performance has been
required, and thus it is necessary that the heat resistance is
further enhanced. In order to improve the heat resistance, an
increase in crosslinking density, that is, multifunctionalization
is effective, and as disclosed in PTL 2 and PTL 3, an epoxy resin
having a phenol compound as a skeleton in which phenols are
introduced to a biphenyl skeleton as a repeating structure is
multifunctionalized, but the molecular weight increases, and thus
an increase in a softening point or a melt viscosity occurs. In
addition, the multifunctionalization due to an increase in the
molecular weight is insufficient to correspond to the recent demand
for high heat resistance. In order to improve the heat resistance
while maintaining liquid properties or a low melt viscosity, it is
necessary that a multifunctional epoxy resin having a low molecular
weight is obtained with high purity.
CITATION LIST
Patent Literature
[0004] [PTL 1] Japanese Patent No. 3947490
[0005] [PTL 2] Japanese Patent No. 3989458
[0006] [PTL 3] Japanese Patent No. 3476027
SUMMARY OF INVENTION
Technical Problem
[0007] An object of the present invention is to provide a
biphenyl-skeleton-containing epoxy resin of which a cured product
expresses excellent heat resistance, low thermal expandability, and
high thermal conductivity, and has liquid properties or a low melt
viscosity, and a method for producing the
biphenyl-skeleton-containing epoxy resin.
Solution to Problem
[0008] As a result of intensive studies by the present inventors,
it has been found that an epoxy resin in which polyvalent hydroxy
biphenyl with high purity obtained by a regioselective
cross-coupling reaction of a phenol derivative is glycidylated has
liquid properties or a low melt viscosity, and a cured product of
the epoxy resin has excellent heat resistance, low thermal
expandability, and excellent thermal conductivity, and thus the
present invention has been accomplished.
[0009] That is, the present invention relates to [1] to [5]
described below.
[0010] [1]
[0011] A method for producing a biphenyl-skeleton-containing epoxy
resin represented by Formula (1) described below, including a step
of allowing polyvalent hydroxy biphenyl obtained by a production
step including a regioselective cross-coupling reaction to react
with epihalohydrin.
##STR00002##
[0012] (In the formula, k1 and l1 each represent an integer of 0 to
4, m and n each represent an integer of 1 to 5, R.sup.1 and R.sup.2
each independently represent a hydrocarbon group having 1 to 10
carbon atoms which may have a substituent group, and R.sup.1 and
R.sup.2 may be identical to each other or different from each
other, provided that left and right phenyl structures of a biphenyl
skeleton are different from each other.)
[0013] [2]
[0014] The method for producing a biphenyl-skeleton-containing
epoxy resin according to [1], in which the regioselective
cross-coupling reaction is a cross-coupling reaction using at least
one compound selected from aryl boronic acids and an anhydride
thereof, ester and a borate salt represented by Formula (2)
described below, and at least one compound selected from aryl
halide or aryl sulfonate represented by Formula (3) described
below.
##STR00003##
[0015] (k1 and l1 each represent an integer of 0 to 4, m and n each
represent an integer of 1 to 5, R.sup.1 and R.sup.2 each
independently represents a hydrocarbon group having 1 to 10 carbon
atoms which may have a substituent group, R.sup.1 and R.sup.2 may
be identical to each other or different from each other, R.sup.3
and R.sup.4 each independently represent a hydrogen atom, a methyl
group, a benzyl group, a tetrahydropyranyl group, a tetrahydrofuryl
group, a methoxymethyl group, an ethoxymethyl group, or a silyl
group such as a trimethyl silyl group, a tert-butyl dimethyl silyl
group, and a triisopropyl silyl group, and X represents a chlorine
atom, a bromine atom, an iodine atom, triflate, mesylate, tosylate,
or nosylate.)
[0016] [3]
[0017] A biphenyl-skeleton-containing epoxy resin represented by
Formula (1) which is obtained by the method for producing a
biphenyl-skeleton-containing epoxy resin according to [1] or
[2].
##STR00004##
[0018] (In the formula, k1 and l1 each represent an integer of 0 to
4, m and n each represent an integer of 1 to 5, R.sup.1 and R.sup.2
each independently represent a hydrocarbon group having 1 to 10
carbon atoms which may have a substituent group, and R.sup.1 and
R.sup.2 may be identical to each other or different from each
other, provided that left and right phenyl structures of a biphenyl
skeleton are different from each other.)
[0019] [4]
[0020] A 2,4,4'-trihydroxy biphenyl type epoxy resin represented by
Formula (4) which is obtained by the method for producing a
biphenyl-skeleton-containing epoxy resin according to [1] or
[2].
##STR00005##
[0021] (In the formula, k1 represents an integer of 0 to 4, l1
represents an integer of 0 to 3, R.sup.1 and R.sup.2 each
independently represent a hydrocarbon group having 1 to 10 carbon
atoms which may have a substituent group, and R.sup.1 and R.sup.2
may be identical to each other or different from each other.)
[0022] [5]
[0023] A 3,4',5-trihydroxy biphenyl type epoxy resin represented by
Formula (5).
##STR00006##
[0024] (In the formula, k1 represents an integer of 0 to 4, l1
represents an integer of 0 to 3, R.sup.1 and R.sup.2 each
independently represent a hydrocarbon group having 1 to 10 carbon
atoms which may have a substituent group, and R.sup.1 and R.sup.2
may be identical to each other or different from each other.)
Advantageous Effects of Invention
[0025] According to the present invention, it is possible to
provide a method for producing a biphenyl-skeleton-containing epoxy
resin which has liquid properties or a low melt viscosity and
exhibits excellent solvent solubility, and an epoxy resin, and a
cured product of the epoxy resin exhibits excellent heat
resistance, low linear expandability, excellent moisture
resistance, and high thermal conductivity.
BRIEF DESCRIPTION OF DRAWINGS
[0026] FIG. 1 is a GPC chart of 3,4',5-triglycidyloxy biphenyl
obtained in Example 1.
[0027] FIG. 2 is a C13NMR chart of 3,4',5-triglycidyloxy biphenyl
obtained in Example 1.
[0028] FIG. 3 is an MS chart of 3,4',5-triglycidyloxy biphenyl
obtained in Example 1.
[0029] FIG. 4 is a GPC chart of 2,4,4'-triglycidyloxy biphenyl
obtained in Example 2.
[0030] FIG. 5 is a C13NMR chart of 2,4,4'-triglycidyloxy biphenyl
obtained in Example 2.
[0031] FIG. 6 is an MS chart of 2,4,4'-triglycidyloxy biphenyl
obtained in Example 2.
DESCRIPTION OF EMBODIMENTS
[0032] Hereinafter, the present invention will be described in
detail.
[0033] According to the present invention, in producing of a
biphenyl-skeleton-containing epoxy resin represented by Formula (1)
described below in which epihalohydrin reacts with polyvalent
hydroxy biphenyl, a regioselective cross-coupling reaction is
performed in a production step of polyvalent hydroxy biphenyl
having high purity which is a raw material.
##STR00007##
[0034] (In the formula, k1 and l1 each represent an integer of 0 to
4, m and n each represent an integer of 1 to 5, R.sup.1 and R.sup.2
each independently represent a hydrocarbon group having 1 to 10
carbon atoms which may have a substituent group, and R.sup.1 and
R.sup.2 may be identical to each other or different from each
other, provided that left and right phenyl structures of a biphenyl
skeleton are different from each other.)
[0035] In the production of the biphenyl-skeleton-containing epoxy
resin of the present invention, the polyvalent hydroxy biphenyl
which is the raw material is obtained by a production method
including a regioselective cross-coupling reaction. The
regioselective cross-coupling reaction is a reaction in which when
a biphenyl structure is constructed by forming a C--C bond between
carbons on two aromatic rings, the position of two bonded carbons
is limited, and the bonding does not occur in the position of other
carbons, and polyvalent hydroxy biphenyl having high purity is able
to be obtained. That is, the regioselective cross-coupling reaction
is a reaction which progresses by substituent group-metal exchange
between a substituent group such as halogen existing on the carbon
relevant to the bonding in addition to a hydrogen atom and a metal
catalyst.
[0036] In the coupling reaction constructing the biphenyl skeleton,
for example, as in a method disclosed in PTL 1, a reaction is also
included in which a phenoxy radical is generated during the
reaction and a C--C bond is regioselectively formed, but in order
to express regioselectivity, there are many regulations such as a
limitation in the position of the hydroxyl group in the
stereoscopic structure of the raw material or a demand for
introduction of a substituent group for suppressing a side
reaction, and there are problems such as difficulty of preventing a
multimer or a byproduct from being generated.
[0037] In contrast, in the reaction progressing by the substituent
group-metal exchange between the substituent group and the metal
catalyst, the hydroxyl group may be in a position such as an ortho
position, a meta position, and a para position of a reaction point,
and thus a range of selecting a structure is wide, a homocoupling
product which is a byproduct in the cross-coupling is not
generated, and multimerization does not occur. For this reason, the
reaction is suitable for producing a precursor of a multifunctional
low molecular weight epoxy resin having high purity.
[0038] A known and common method is able to be used insofar as the
regioselective coupling reaction included in the method for
producing the polyvalent hydroxy biphenyl having high purity in the
present invention is a reaction using a raw material having a
substituent group which is able to be subjected to substituent
group-metal exchange with respect to a metal catalyst on carbon
relevant to the formation of a C--C bond.
[0039] Examples of the regioselective cross-coupling reaction
described above include a reaction in which any two of the
following aryl compounds are coupled by using the following metal
catalyst. Examples of the aryl compound include a halogeno group
such as chloro, bromo, and iodo; a silyl group such as trimethyl
silyl, trimethoxy silyl, trifluorosilyl, and chlorodimethyl silyl;
a stannyl group such as trimethyl stannyl and tributyl stannyl; a
bornyl group such as dihydroxy bornyl; a compound having a
substituent group such as a sulfonyl group such as triflate,
nonaflate, a mesylate group, and a tosylate group, or a magnesium
halide derivative or a zinc halide derivative which is activated
with magnesium or zinc by using aryl halide as a raw material. At
least one metal selected from copper, zinc, nickel, cobalt,
palladium, zirconium, manganese, germanium, bismuth, lead, indium,
and the like, or a compound thereof is preferably used as the metal
catalyst coupling any two of the aryl compounds. Examples of the
compound of the metal described above include a chloride, a
bromide, an iodide, an acetate, an acetyl acetonate salt, a
carbonate, a hydroxide, a nitrate, an organic complex, an activated
carbon carrier, and the like.
[0040] In particular, among the reaction examples described above,
a Suzuki coupling reaction (J. Organomet. Chem., 576, 147 (1999);
Synth. Commun., 11, 513 (1981)) is preferable in which an aryl
boronic acid reacts with an aryl halide or the like by using an
organic palladium complex or the like as a catalyst in the
coexistence of a base, from a viewpoint of easy availability of a
reaction substrate or simple handleability, and ease of removing a
byproduct. That is, the regioselective hetero coupling reaction of
the method for producing the polyvalent hydroxy biphenyl having
high purity in the present invention is a reaction in which at
least one compound selected from aryl boronic acids, an anhydride
thereof, and ester and a borate salt represented by Formula (2)
described below reacts with aryl halide or aryl sulfonate
represented by Formula (3) described below by using an organic
palladium complex or the like as a catalyst in the coexistence of a
base.
##STR00008##
[0041] In Formula (2) or (3) described above, k1 and l1 each
represent an integer of 0 to 4, m and n each represent an integer
of 1 to 5, R.sup.1 and R.sup.2 each independently represent a
hydrocarbon group having 1 to 10 carbon atoms which may have a
substituent group, R.sup.1 and R.sup.2 may be identical to each
other or different from each other, R.sup.3 and R.sup.4 each
independently represent a hydrogen atom, a methyl group, a benzyl
group, a tetrahydropyranyl group, a tetrahydrofuryl group, a
methoxymethyl group, an ethoxymethyl group, or a silyl group such
as a trimethyl silyl group, a tert-butyl dimethyl silyl group, and
a triisopropyl silyl group, and X represents a chlorine atom, a
bromine atom, an iodine atom, triflate, mesylate, tosylate, or
nosylate.
[0042] Examples of the hydrocarbon group having 1 to 10 carbon
atoms described above include an alkyl group such as a methyl
group, an ethyl group, an isopropyl group, and a cyclohexyl group;
an alkenyl group such as a vinyl group, an allyl group, and a
cyclopropenyl group; an alkynyl group such as an ethynyl group and
a propynyl group; an aryl group such as a phenyl group, a tolyl
group, a xylyl group, and a naphthyl group; and an aralkyl group
such as a benzyl group, a phenethyl group, and a naphthyl methyl
group. The substituent group described above may include any
substituent group insofar as the substituent group does not
considerably affect the production step of the present invention.
In consideration of a decrease in a melt viscosity of the epoxy
resin which is produced by the production step of the present
invention and an increase in crosslinking density of the cured
product of the epoxy resin, the substituent group is a hydrogen
atom or a hydrocarbon group having 1 to 4 carbon atoms, and is more
preferably a hydrogen atom, a methyl group, or an allyl group.
[0043] Examples of R.sup.3 and R.sup.4 include a hydrogen atom, a
methyl group, a benzyl group, a tetrahydropyranyl group, a
tetrahydrofuryl group, a methoxymethyl group, an ethoxymethyl
group, a silyl group such as a trimethyl silyl group, a tert-butyl
dimethyl silyl group, and a triisopropyl silyl group, and the like.
From a viewpoint of industrial availability at a low cost, a
hydrogen atom or a methyl group is preferable as R.sup.3 and
R.sup.4.
[0044] The aryl boronic acids represented by Formula (2) described
above may have a structure of an anhydride, boronic acid ester, a
borate salt, or the like which is dehydrated and trimerized.
Examples of the boronic acid ester described above include alkyl
ester such as --B(OMe)2 and B(OiPr)2; cyclic ester in which
catechol or pinacol is condensed, and the like. In addition,
examples of the borate salt include a trifluoroborate salt, a
trihydroxy borate salt, an organic cyclic triol borate salt having
bicyclo[2,2,2] octane, and the like.
[0045] X in Formula (3) described above represents a chlorine atom,
a bromine atom, an iodine atom, triflate, mesylate, tosylate, or
nosylate. From a viewpoint of easy availability and excellent
reactivity of the raw material, a bromine atom or an iodine atom is
preferable as X.
[0046] k1 and l1 in Formula (2) and Formula (3) described above
represent an integer of 0 to 4, and m and n represent an integer of
1 to 5. As the sum of m and n becomes larger, the epoxy resin
produced by the production method of the present invention is
multifunctionalized and heat resistance is improved, but
brittleness and moisture resistance deteriorate. Therefore, the sum
of m and n is preferably 2 to 8, and is more preferably 3 to 6.
[0047] A molar ratio of the aryl boronic acids represented by
Formula (2) described above and the aryl halide or the aryl
sulfonate represented by Formula (3) described above is not
particularly limited, and the molar ratio is preferably 1:1 to 5:1,
and is more preferably 1:1 to 2:1 from a viewpoint of an excellent
yield.
[0048] Examples of the metal catalyst used in the coupling reaction
between the aryl boronic acids represented by Formula (2) described
above and the aryl halide or the like represented by Formula (3)
described above include palladium-activated carbon, a zerovalent
palladium compound such as tetrakis(triphenyl phosphine) palladium
(0), bis(dibenzylidene acetone) palladium (0), and
tris(dibenzylidene acetone) dipalladium (0), and a divalent
palladium compound such as palladium acetate (II), palladium
chloride (II), bis(triphenyl phosphine) palladium (II) dichloride,
[1,1'-bis(diphenyl phosphino) ferrocene]palladium (II) dichloride,
[1,4-bis(diphenyl phosphino) butane] palladium (II) dichloride,
bis(acetonitrile) palladium (II) dichloride, bis(benzonitrile)
palladium (II) dichloride, an allyl palladium (II) chloride dimer,
cyclopentadienyl allyl palladium (II), and palladium hydroxide. In
addition, a nickel compound such as bis(triphenyl phosphine) nickel
chloride and tetrakis(triphenyl phosphine) nickel, and the like are
included in addition to the palladium compound. In addition, as
necessary, two or more types of these compounds are able to be
used. Furthermore, the palladium compound may be dissolved during
the reaction or may be supported on any carrier. Among them, a
palladium complex having tertiary phosphine as a ligand is
preferable from a viewpoint of an excellent yield, and a palladium
complex having triphenyl phosphine as a ligand is more preferable
from a viewpoint of easy availability and an excellent yield. The
used amount of a palladium catalyst is generally 0.00001 mol to 0.1
mol, and is preferably 0.001 mol to 0.05 mol, with respect to 1 mol
of the aryl halide or the aryl sulfonate.
[0049] In addition, the coupling reaction between the aryl boronic
acids represented by Formula (2) described above and the aryl
halide or the like represented by Formula (3) described above is
able to be performed in the existence of phosphines or imines.
Among them, it is preferable that the coupling reaction is
performed in the existence of triaryl phosphines, and it is more
preferable that the coupling reaction is performed in the existence
of triphenyl phosphine. When the phosphines or the imines are used,
the used amount thereof is generally 0.5 mol to 5.0 mol, and is
preferably 1.0 mol to 2.2 mol, with respect to 1 mol of the
palladium compound.
[0050] It is essential that the coupling reaction between the aryl
boronic acids represented by Formula (2) described above and the
aryl halide or the like represented by Formula (3) described above
is performed in the existence of a base. Examples of usable bases
are able to include an alkali metal hydroxide such as lithium
oxide, sodium hydroxide, and potassium hydroxide; an alkali earth
metal hydroxide such as magnesium hydroxide and calcium hydroxide;
an alkali metal carbonate such as sodium carbonate, potassium
carbonate, and cesium carbonate; an alkali metal bicarbonate such
as a sodium hydrogen carbonate and a potassium hydrogen carbonate;
an alkali metal acetate such as sodium acetate and potassium
acetate; an inorganic base such as an alkali metal phosphate such
as sodium phosphate; metal hydrides such as sodium hydride and
potassium hydride; alcohol metal salts such as sodium methoxide,
sodium ethoxide, and potassium tert-butoxide; and an organic base
such as triethyl amine, N,N-dimethyl aniline, pyridine,
4-N,N-dimethyl aminopyridine, and
1,8-diazabicyclo[5.4.0]-7-undecene, and these bases are able to be
independently used or two or more types thereof are able to be used
in combination, as necessary. Among them, the alkali metal
carbonate is preferable from a viewpoint of an excellent yield. The
used amount of the base is 0.5 mol to 5.0 mol, and is preferably
1.0 mol to 2.0 mol, with respect to 1 mol of the aryl halide or the
aryl sulfonate.
[0051] The coupling reaction between the aryl boronic acids
represented by Formula (2) described above and the aryl halide or
the like represented by Formula (3) described above is generally
performed by using a solvent. Examples of the solvent to be used
include ethers such as diethyl ether, tetrahydrofuran (THF), and
dioxane; aromatic hydrocarbons such as benzene, toluene, xylene, or
chlorobenzene; an aprotic polar solvent such as N,N-dimethyl
formamide (DMF), N,N-dimethyl acetamide, N-methyl-2-pyrrolidone,
dimethyl sulfoxide, and sulfolane; nitriles such as acetonitrile
and propionitrile; esters such as ethyl acetate and ethyl
propionate; aliphatic hydrocarbons such as pentane, hexane,
cyclohexane, and heptane; alcohols such as methanol and ethanol;
and water, and these solvents are able to be independently used or
two or more types thereof are able to be used in combination, as
necessary. The used amount of the solvent is generally 0.1 times by
weight to 50 times by weight, and is preferably 0.5 times by weight
to 20 times by weight, with respect to the aryl halide or the aryl
sulfonate.
[0052] The coupling reaction between the aryl boronic acids
represented by Formula (2) described above and the aryl halide or
the like represented by Formula (3) described above is performed at
0.degree. C. to 150.degree. C. A reaction time is different
according to a reaction temperature, a reaction substrate, a
reaction amount, and the like, and is generally in a range of 10
minutes to 20 hours.
[0053] In the production step of the polyvalent hydroxy biphenyl
having high purity in the present invention, when R.sup.3 or
R.sup.4 in Formula (2) and Formula (3) described above represents
groups other than the hydrogen atom, a protective group of the
hydroxyl group is deprotected by a known and common method after
the regioselective cross-coupling reaction.
[0054] The method for producing the biphenyl-skeleton-containing
epoxy resin of the present invention includes a step in which the
polyvalent hydroxy biphenyl having high purity synthesized by the
regioselective coupling reaction of the phenol derivative reacts
with epihalohydrin. Specifically, examples of the step described
above include a method in which a reaction is performed at a
temperature of 20.degree. C. to 120.degree. C. for 0.5 hours to 10
hours while adding the epihalohydrin at a ratio of 2 times to 10
times (in terms of mole) with respect to the number of moles of a
phenolic hydroxyl group of a phenol compound and collectively or
gradually adding a basic catalyst at a ratio of 0.9 times to 2.0
times (in terms of mole) with respect to the number of moles of the
phenolic hydroxyl group. The basic catalyst may be used in a state
of a solid or an aqueous solution thereof, and when the aqueous
solution is used, a method may be used in which the aqueous
solution is continuously added, and the water and the
epihalohydrins are continuously distillated from a reaction mixture
under reduced pressure or under normal pressure, and are further
separated, and thus the water is removed and the epihalohydrin
continuously returns into the reaction mixture.
[0055] Furthermore, when industrial production is performed, all of
the epihalohydrins used in the preparation are new in an initial
batch of epoxy resin production, but the epihalohydrins collected
from a crude reaction product and new epihalohydrins corresponding
to the eliminated epihalohydrins as consumed epihalohydrins in the
reaction are able to be used together in subsequent batches, and
this is economically preferable. At this time, the epihalohydrin to
be used is not particularly limited, and examples of the
epihalohydrin include epichlorohydrin, epibromohydrin,
.beta.-methyl epichlorohydrin, and the like. Among them, the
epichlorohydrin is preferable from a viewpoint of easy industrial
availability.
[0056] In addition, specifically, examples of the basic catalyst
described above include an alkali earth metal hydroxide, an alkali
metal carbonate, an alkali metal hydroxide, and the like. In
particular, the alkali metal hydroxide is preferable from a
viewpoint of being excellent for catalyst activation of an epoxy
resin synthesis reaction, and examples of the alkali metal
hydroxide include sodium hydroxide, potassium hydroxide, and the
like. When the catalyst is used, these basic catalysts may be used
in a state of an aqueous solution of approximately 10 mass % to 55
mass % or may be in a state of a solid. In addition, it is possible
to increase a reaction speed in the synthesis of the epoxy resin by
using an organic solvent together. Such an organic solvent is not
particularly limited, and examples of the organic solvent include
ketones such as acetone and methyl ethyl ketone, alcohols such as
methanol, ethanol, 1-propyl alcohol, isopropyl alcohol, 1-butanol,
secondary butanol, and tertiary butanol, cellosolves such as methyl
cellosolve and ethyl cellosolve, ethers such as tetrahydrofuran,
1,4-dioxane, 1,3-dioxane, and diethoxy ethane, an aprotic polar
solvent such as acetonitrile, dimethyl sulfoxide, and dimethyl
formamide, and the like. These organic solvents may be each
independently used, and two or more types thereof may be suitably
used in combination in order to adjust the polarity.
[0057] A reactant of the epoxidation reaction described above is
washed with water, and then unreacted epihalohydrin or the organic
solvent used together are distilled by distillation under heating
and reduced pressure. In addition, in order to decrease
hydrolyzable halogen in the epoxy resin, the reaction is able to be
further performed by dissolving the obtained epoxy resin again in
an organic solvent such as toluene, methyl isobutyl ketone, and
methyl ethyl ketone, and by adding an aqueous solution of an alkali
metal hydroxide such as sodium hydroxide and potassium hydroxide.
At this time, in order to increase the reaction speed, a phase
transfer catalyst such as a quaternary ammonium salt or crown ether
may be included. When the phase transfer catalyst is used, a ratio
of the used amount thereof to 100 parts by mass of the epoxy resin
to be used is preferably 0.1 parts by mass to 3.0 parts by mass.
After the reaction, the generated salt is removed by being filtered
or being washed with water, and a solvent such as toluene and
methyl isobutyl ketone is distilled under heating and reduced
pressure, and thus the biphenyl-skeleton-containing epoxy resin of
the present invention as an object is able to be obtained.
[0058] Furthermore, in the method for producing the
biphenyl-skeleton-containing epoxy resin of the present invention,
the epihalohydrin may react with the polyvalent hydroxy biphenyl
having high purity synthesized in the regioselective coupling
reaction of the phenol derivative within a range not impairing the
effect of the present invention by using other polyvalent phenols
together.
[0059] Further, according to the production method of the present
invention, the epihalohydrin reacts with 2,4,4'-trihydroxy biphenyl
represented by Formula (6) which is obtained by the production step
including the regioselective cross-coupling reaction, and thus a
2,4,4'-trihydroxy biphenyl type epoxy resin represented by Formula
(4) described below is able to be produced.
##STR00009##
[0060] (In the formula, k1 represents an integer of 0 to 4, l1
represents an integer of 0 to 3, R.sup.1 and R.sup.2 each
independently represent a hydrocarbon group having 1 to 10 carbon
atoms which may have a substituent group, and R.sup.1 and R.sup.2
may be identical to each other or different from each other.)
[0061] Specifically, examples of the method for producing the epoxy
resin include a method, including:
[0062] (i) A step of performing a reaction by using an aryl boronic
acid represented by Formula (7) and aryl halide or aryl sulfonate
represented by Formula (8) by using an organic palladium complex or
the like as a catalyst in the coexistence of a base;
[0063] (ii) A step of deprotecting a hydroxyl group when R.sup.3
and R.sup.4 of Formula (7) and Formula (8) are groups other than a
hydrogen atom; and
[0064] (iii) A step of producing a 2,4,4'-trihydroxy biphenyl type
epoxy resin represented by Formula (4) described above by allowing
epihalohydrin to react with 2,4,4'-trihydroxy biphenyl represented
by Formula (6) described above which is obtained in the step of (i)
or (ii) described above.
[0065] Here, in the step of producing the 2,4,4'-trihydroxy
biphenyl derivative represented by Formula (6) described above,
when the regioselective coupling reaction progressing by the
substituent group-metal exchange between the substituent group and
the metal catalyst is performed, the raw material and the coupling
method are not limited thereto.
##STR00010##
[0066] (k1 represents an integer of 0 to 4, l1 represents an
integer of 0 to 3, R.sup.1 and R.sup.2 each independently represent
a hydrocarbon group having 1 to 10 carbon atoms which may have a
substituent group, R.sup.1 and R.sup.2 may be identical to each
other or different from each other, R.sup.3 and R.sup.4 each
independently represent a hydrogen atom, a methyl group, a benzyl
group, a tetrahydropyranyl group, a tetrahydrofuryl group, a
methoxymethyl group, an ethoxymethyl group, or a silyl group such
as a trimethyl silyl group, a tert-butyl dimethyl silyl group, and
a triisopropyl silyl group, and X represents a chlorine atom, a
bromine atom, an iodine atom, triflate, mesylate, tosylate, or
nosylate.)
[0067] Further, according to the production method of the present
invention, the epihalohydrin reacts with 3,4',5-trihydroxy biphenyl
represented by Formula (9) which is obtained by the production step
including the regioselective cross-coupling reaction, and thus it
is possible to produce a 3,4',5-trihydroxy biphenyl type epoxy
resin represented by Formula (5) described below.
##STR00011##
[0068] (In the formula, k1 represents an integer of 0 to 4, l1
represents an integer of 0 to 3, R.sup.1 and R.sup.2 each
independently represent a hydrocarbon group having 1 to 10 carbon
atoms which may have a substituent group, and R.sup.1 and R.sup.2
may be identical to each other or different from each other.)
[0069] Specifically, examples of the production method of the epoxy
resin include a method, including:
[0070] (i) a step of performing a reaction by using the aryl
boronic acid represented by Formula (7) and aryl halide or aryl
sulfonate represented by Formula (10) by using an organic palladium
complex or the like as a catalyst in the coexistence of a base;
[0071] (ii) a step of deprotecting a hydroxyl group when R.sup.3
and R.sup.4 of Formula (7) and Formula (10) are groups other than a
hydrogen atom; and
[0072] (iii) a step of producing a 3,4',5-trihydroxy biphenyl type
epoxy resin represented by Formula (5) described above by allowing
epihalohydrin to react with 3,4',5-trihydroxy biphenyl represented
by Formula (9) described above which is obtained in the step of (i)
or (ii) described above.
[0073] Here, in the step of producing the 3,4',5-trihydroxy
biphenyl represented by Formula (9) described above, when the
regioselective coupling reaction progressing by the substituent
group-metal exchange between the substituent group and the metal
catalyst is performed, the raw material and the coupling method are
not limited thereto.
##STR00012##
[0074] (k1 represents an integer of 0 to 4, l1 represents an
integer of 0 to 3, R.sup.1 and R.sup.2 each independently represent
a hydrocarbon group having 1 to 10 carbon atoms which may have a
substituent group, R.sup.1 and R.sup.2 may be identical to each
other or different from each other, R.sup.3 and R.sup.4 each
independently represent a hydrogen atom, a methyl group, a benzyl
group, a tetrahydropyranyl group, a tetrahydrofuryl group, a
methoxymethyl group, an ethoxymethyl group, or a silyl group such
as a trimethyl silyl group, a tert-butyl dimethyl silyl group, and
a triisopropyl silyl group, and X represents a chlorine atom, a
bromine atom, an iodine atom, triflate, mesylate, tosylate, or
nosylate.)
[0075] A cured product of the 2,4,4'-trihydroxy biphenyl type epoxy
resin and the 3,4',5-trihydroxy biphenyl type epoxy resin described
above exhibits excellent heat resistance derived from a biphenyl
skeleton, low thermal expandability, and extremely excellent
thermal conductivity.
[0076] A multifunctional low molecular weight epoxy resin such as a
naphthalene type tetrafunctional epoxy resin (HP-4700, manufactured
by DIC Corporation, epoxy equivalent of 160 g/eq to 170 g/eq, a
softening point of 85.degree. C. to 95.degree. C., a melt viscosity
at 150.degree. C. of 0.3 Pas to 0.6 Pas, and a weight average
molecular weight of 648) is known as an existing epoxy resin
exhibiting excellent heat resistance. The existing epoxy resin is
able to prepare a cured product exhibiting extremely high heat
resistance, but is a solid and has a high melt viscosity, and thus
workability deteriorates, and the cured product is not able to be
independently prepared without using a curing agent. In contrast,
the 2,4,4'-trihydroxy biphenyl type epoxy resin and the
3,4',5-trihydroxy biphenyl type epoxy resin of the present
invention are a liquid or a crystal having a low melting point, and
has a low melt viscosity, and thus workability is excellent, and
for example, the cured product described above is able to be
independently prepared. In addition, the resin of the present
invention is able to be more highly filled with silica compared to
the existing resin, and thus it is possible to prepare a
encapsulation material having low thermal expandability, and more
excellent flame retardance and thermal conductivity.
[0077] In addition, most of the existing liquid epoxy resins are a
bifunctional glycidyl ether type epoxy resin such as a bisphenol A
type epoxy resin or an alicyclic epoxy resin, and thus a cured
product thereof is not able to express high heat resistance. Among
the existing liquid epoxy resins, a naphthalene type bifunctional
epoxy resin having high heat resistance (HP-4032D, manufactured by
DIC Corporation, epoxy equivalent of 136 g/eq to 148 g/eq, and
viscosity of 50 Pas to 60 Pas) does not satisfy performance
requirements in the recent advanced material fields. However, the
2,4,4'-trihydroxy biphenyl type epoxy resin of the present
invention is able to prepare a liquid encapsulation material or a
liquid adhesive agent having high heat resistance by independently
using the resins or by using the resins in combination with another
liquid epoxy resin, and is able to be developed to an application
in which higher heat resistance is required.
EXAMPLES
[0078] The present invention will be described in detail with
reference to examples and comparative examples. Furthermore, a melt
viscosity at 150.degree. C., a softening point, a melting point, a
GPC spectrum, an NMR spectrum, and an MS spectrum were measured in
the following conditions.
[0079] 1) Melt Viscosity at 150.degree. C.: Measured by using the
following device on the basis of ASTM D4287.
[0080] Device Name: MODEL CV-1S, manufactured by Codex
Corporation
[0081] 2) Softening Point Measurement Method: Measured by a ball
& ring (B&R) method using glycerin as a heat medium on the
basis of JIS K7234.
[0082] Device Name: ASP-M2 Type, manufactured by Meitec Company,
Ltd.
[0083] Temperature Rising Rate: 5/min
[0084] 3) Melting point: Measured by using a
thermogravimetry/differential thermal analyzer (TG/DTA6200,
manufactured by Hitachi High-Tech Science Corporation).
[0085] Measurement Conditions
[0086] Measurement Temperature: Room temperature to 300.degree.
C.
[0087] Measurement Atmosphere: Nitrogen
[0088] Temperature Rising Rate: 10.degree. C./min
[0089] 4) GPC: Measurement conditions are as follows.
[0090] Measurement Device: "GPC-104", manufactured by Showa Denko
K. K.,
[0091] Column: "KF-401HQ", manufactured by Showa Denko K. K.
[0092] +"KF-401HQ", manufactured by Showa Denko K. K.
[0093] +"KF-402HQ", manufactured by Showa Denko K. K.
[0094] +"KF-402HQ", manufactured by Showa Denko K. K.
[0095] Detector: RI (a differential refractometer)
[0096] Data Processing: "Empower 2", manufactured by Waters.
[0097] Measurement Conditions: Column temperature of 40.degree.
C.
[0098] Mobile Phase: Tetrahydrofuran
[0099] Flow Rate: 1.0 ml/min
[0100] Standard: (Used Polystyrene)
[0101] "Polystyrene Standard 400", manufactured by Waters.
[0102] Sample: Obtained by filtering 1.0 mass % of a
tetrahydrofuran solution in terms of solid resin using a
microfilter (50 .mu.l).
[0103] 5) NMR: NMR LA300, manufactured by JEOL Ltd.
[0104] Solvent: Acetone-d6
[0105] 6) MS: Gas chromatograph time-of-flight mass spectrometer
JMS-T100GC, manufactured by JEOL Ltd.
[0106] Ionization Mode: FD
[0107] Cathode Voltage: -10 kV
[0108] Emitter Current: 0 mA.fwdarw.40 mA [25.6 mA/min.]
[0109] Solvent: Tetrahydrofuran
[0110] Sample Concentration: 2%
Synthesis Example 1
Synthesis of 3,4',5-Methoxy Biphenyl
[0111] A solution in which 110 g of 1-bromo-3,5-dimethoxy benzene,
257 g of isopropyl alcohol (hereinafter, referred to as IPA), and
139 g of potassium carbonate were dissolved in 107 g of water in
advance was put into a flask attached with a thermometer, a
stirrer, and a reflux cooler while performing a nitrogen gas purge,
and nitrogen substitution was performed in a reaction vessel while
stirring the solution, and then 5.9 g of tetrakistriphenyl
phosphine palladium (0) was added to the solution, and a solution
in which 83 g of a 4-methoxy phenyl boronic acid was dissolved in
109 g of IPA in advance was dripped thereto. A reaction liquid was
heated and refluxed for 3 hours, and then 500 mL of water was added
to the reaction liquid, an IPA layer was separated, and a water
layer was extracted by being moved to a separating funnel and by
adding 500 mL of toluene. Each organic layer was washed with a
saturated solution of sodium chloride. A solvent was distilled
under vacuum, and then a precipitate was filtered by adding 500 mL
of toluene, and the toluene was distilled under reduced pressure.
200 mL of methanol was added to the obtained crude product, a
precipitate was filtered, the mixture was dried by using a vacuum
drier at 50.degree. C. for 5 hours, and thus 113 g of
3,4',5-trimethoxy biphenyl was obtained.
Synthesis Example 2
Synthesis of 3,4',5-Trihydroxy Biphenyl
[0112] 100 g of the 3,4',5-trimethoxy biphenyl obtained in
Synthesis Example 1, 488 g of sodium iodide, and 628 g of
acetonitrile were put into a flask attached with a thermometer, a
stirrer, and a reflux cooler while performing a nitrogen gas purge,
and then 356 g of trimethyl silane chloride was dripped thereto,
and a reaction was performed at 50.degree. C. for 18 hours. A
reaction liquid was cooled to room temperature, and 500 mL of water
was added thereto. The acetonitrile was distilled under reduced
pressure, 1 L of ethyl acetate was added thereto, a mixed liquid
was moved to a separating funnel, and an organic layer was
separated, and then a water layer was extracted by the ethyl
acetate. The combined organic layer was washed with an aqueous
solution of saturated sodium hydrogen carbonate and a saturated
solution of sodium chloride. An ethyl acetate solution was
concentrated to approximately 200 mL under reduced pressure, and a
crystal having the precipitated 3,4',5-trihydroxy biphenyl as a
main component was filtered. 50 mL of ethyl acetate and 150 mL of
toluene were added to the obtained residue and were heated and
stirred at 80.degree. C. for 10 minutes, an undissolved precipitate
was filtered, the mixture was dried by using a vacuum drier at
50.degree. C. for 5 hours, and thus 62 g of 3,4',5-trihydroxy
biphenyl was obtained.
Synthesis Example 3
Synthesis of 2,4,4'-Trimethoxy Biphenyl
[0113] A solution in which 110 g of 1-bromo-2,4-dimethoxy benzene,
257 g of IPA, and 139 g of potassium carbonate were dissolved in
107 g of water in advance was put into a flask attached with a
thermometer, a stirrer, and a reflux cooler while performing a
nitrogen gas purge, and nitrogen substitution was performed in a
reaction vessel while stirring the solution, and then 5.9 g of
tetrakistriphenyl phosphine palladium (0) was added to the
solution, and a solution in which 83 g of a 4-methoxy phenyl
boronic acid was dissolved in 109 g of IPA in advance was dripped
thereto. A reaction liquid was heated and refluxed for 3 hours, and
then 500 mL of water was added to the reaction liquid, an IPA layer
was separated, and a water layer was extracted by being moved to a
separating funnel and by adding 500 mL of toluene. Each organic
layer was washed with a saturated solution of sodium chloride. A
solvent was distilled under vacuum, and then a precipitate was
filtered by adding 500 mL of toluene, and the toluene was distilled
under reduced pressure. 200 mL of methanol was added to the
obtained crude product, a precipitate was filtered, the mixture was
dried by using a vacuum drier at 50.degree. C. for 5 hours, and
thus 105 g of 2,4,4'-trimethoxy biphenyl was obtained.
Synthesis Example 4
Synthesis of 2,4,4'-Trihydroxy Biphenyl
[0114] 100 g of the 2,4,4'-trimethoxy biphenyl obtained in
Synthesis Example 3, 488 g of sodium iodide, and 628 g of
acetonitrile were put into a flask attached with a thermometer, a
stirrer, and a reflux cooler while performing a nitrogen gas purge,
and then 356 g of trimethyl silane chloride was dripped thereto,
and a reaction was performed at 60.degree. C. for 8 hours. A
reaction liquid was cooled to room temperature, and 500 mL of water
was added thereto. The acetonitrile was distilled under reduced
pressure, 1 L of ethyl acetate was added thereto, a mixed liquid
was moved to a separating funnel, and an organic layer was
separated, and then a water layer was extracted by the ethyl
acetate. The combined organic layer was washed with an aqueous
solution of saturated sodium hydrogen carbonate and a saturated
solution of sodium chloride. An ethyl acetate solution was
concentrated to approximately 200 mL under reduced pressure, and a
crystal having the precipitated 2,4,4'-trihydroxy biphenyl as a
main component was filtered. 50 mL of ethyl acetate and 150 mL of
toluene were added to the obtained residue and were heated and
stirred at 80.degree. C. for 10 minutes, an undissolved precipitate
was filtered, the mixture was dried by using a vacuum drier at
50.degree. C. for 5 hours, and thus 52 g of 2,4,4'-trihydroxy
biphenyl was obtained.
Example 1
Synthesis of 3,4',5-Trihydroxy Biphenyl Type Epoxy Resin
[0115] 43 g of 3,4',5-trihydroxy biphenyl obtained in Synthesis
Example 2, 295 g of epichlorohydrin, and 103 g of n-butanol were
put into a flask attached with a thermometer, a dripping funnel, a
condenser, and a stirrer and were dissolved while performing a
nitrogen gas purge. The temperature was increased to 40.degree. C.,
and then 53 g of an aqueous solution of sodium hydroxide of 48 mass
% was added to the mixture for 8 hours, and after that, the
temperature was further increased to 50.degree. C., and a reaction
was further performed for 1 hour. After the reaction, 83 g of water
was added thereto, the mixture was left to stand, and then the
lower layer was removed. After that, unreacted epichlorohydrin was
distilled at 150.degree. C. under reduced pressure. 118 g of methyl
isobutyl ketone was added and dissolved in the obtained crude epoxy
resin. Further, 67 g of an aqueous solution of sodium hydroxide of
10 mass % was added to this solution, a reaction was performed at
80.degree. C. for 2 hours, and then washing was repeatedly
performed three times with water until the pH of a washing liquid
became neutral. Next, the system was dehydrated due to azeotropy, a
solvent was distilled under reduced pressure after passing through
a precision filter, and thus 62 g of 3,4',5-triglycidyloxy biphenyl
(A-1) which was a target epoxy resin was obtained. The obtained
epoxy resin (A-1) was a crystal having a melting point of
97.degree. C. in an ordinary temperature, and had a melt viscosity
(a measurement method: ICI viscosimeter method, and a measurement
temperature: 150.degree. C.) of 0.27 dPas and epoxy equivalent of
135 g/eq. A GPC chart of the obtained epoxy resin is illustrated in
FIG. 1, a C13NMR chart is illustrated in FIG. 2, and an MS spectrum
is illustrated in FIG. 3. A peak of 370 indicating the
3,4',5-triglycidyloxy biphenyl (A-1) was detected from the MS
spectrum. Furthermore, in the GPC chart of FIG. 1, a measured
molecular weight obtained from a calibration curve was shifted from
the actual molecular weight, and thus the molecular weight of each
peak was corrected on the basis of the MS spectrum.
Example 2
Synthesis of 2,4,4'-Trihydroxy Biphenyl Type Epoxy Resin
[0116] 43 g of the 2,4,4'-trihydroxy biphenyl obtained in Synthesis
Example 4, 295 g of epichlorohydrin, and 103 g of n-butanol were
put into a flask attached with a thermometer, a dripping funnel, a
condenser, and a stirrer and were dissolved while performing a
nitrogen gas purge. The temperature was increased to 40.degree. C.,
and then 53 g of an aqueous solution of sodium hydroxide of 48 mass
% was added to the mixture for 8 hours, and after that, the
temperature was further increased to 50.degree. C., and a reaction
was further performed for 1 hour. After the reaction, 83 g of water
was added thereto, the mixture was left to stand, and then the
lower layer was removed. After that, unreacted epichlorohydrin was
distilled at 150.degree. C. under reduced pressure. 118 g of methyl
isobutyl ketone was added and dissolved in the obtained crude epoxy
resin. Further, 67 g of an aqueous solution of sodium hydroxide of
10 mass % was added to this solution, a reaction was performed at
80.degree. C. for 2 hours, and then washing was repeatedly
performed three times with water until the pH of a washing liquid
became neutral. Next, the system was dehydrated due to azeotropy, a
solvent was distilled under reduced pressure after passing through
a precision filter, and thus 63 g of 2,4,4'-triglycidyloxy biphenyl
(A-2) which was a target epoxy resin was obtained. The obtained
epoxy resin (A-2) was in a liquid state having viscosity of 943 Pas
in an ordinary temperature, and had a melt viscosity (a measurement
method: ICI viscosimeter method, and a measurement temperature:
150.degree. C.) of 0.14 dPas and epoxy equivalent of 133 g/eq. A
GPC chart of the obtained epoxy resin is illustrated in FIG. 4, a
C13NMR chart is illustrated in FIG. 5, and an MS spectrum is
illustrated in FIG. 6. A peak of 370 indicating the
2,4,4'-triglycidyloxy biphenyl (A-2) was detected from the MS
spectrum. Furthermore, in the GPC chart of FIG. 4, a measured
molecular weight obtained from a calibration curve was shifted from
the actual molecular weight, and thus the molecular weight of each
peak was corrected on the basis of the MS spectrum.
Examples 3 to 8 and Comparative Examples 1 to 5
[0117] The epoxy resins (A-1 and A-2) of the present invention
obtained in Examples 1 and 2, and a
3,3',5,5'-tetramethyl-4,4'-biphenol type epoxy resin (A-3), a
naphthalene type tetrafunctional epoxy resin HP-4700 (manufactured
by DIC Corporation) (A-4) and a naphthalene type bifunctional epoxy
resin HP-4032D (manufactured by DIC Corporation) (A-5) as a
comparative epoxy resin, a phenol novolak type phenol resin TD-2131
(manufactured by DIC Corporation, hydroxyl group equivalent of 104
g/eq) and a methyl himic anhydride MHAC-P (manufactured by Hitachi
Chemical Co., Ltd., neutralization equivalent of 89 g/eq) as a
curing agent, and triphenyl phosphine (TPP) and imidazole
(2P4MHZ-PW and 2E4MZ (both are manufactured by Shikoku Chemicals
Corporation.)) as a curing accelerator were blended with each other
as the composition shown in Table 1, and heat resistance,
coefficient of linear thermal expansion, and thermal conductivity
of a cured product which was prepared according to any one of the
following curing conditions (I) to (III) were evaluated. Properties
of each of the epoxy resins and properties of the cured products
thereof are shown in Table 1.
[0118] <Curing Conditions (I)>
[0119] A blended product was poured into a mold form of 11
cm.times.9 cm.times.2.4 mm and was molded by a press at a
temperature of 150.degree. C. for 10 minutes, and then a molded
product was taken out from the mold form, and subsequently, the
molded product was cured at a temperature of 175.degree. C. for 5
hours.
[0120] <Curing Conditions (II)>
[0121] A blended product was poured into a mold form of 6
cm.times.11 cm.times.0.8 mm and was temporarily cured at a
temperature of 130.degree. C. for 2 hours, and then a molded
product was taken out from the mold form, and subsequently, the
molded product was cured at a temperature of 170.degree. C. for 2
hours and at a temperature of 250.degree. C. for 8 hours.
[0122] <Curing Conditions (III)>
[0123] A blended product was poured into a mold form of 6
cm.times.11 cm.times.0.8 mm and was temporarily cured at a
temperature of 110.degree. C. for 2 hours, and a molded product was
taken out from the mold form, and subsequently, the molded product
was cured at a temperature of 250.degree. C. for 2 hours.
[0124] <Heat Resistance (Glass Transition Temperature;
Tg(DMA)>
[0125] A temperature at which a change in elastic modulus was
maximized (a tan .delta. change rate was maximized) was evaluated
as a glass transition temperature by using a viscoelasticity
measurement device (DMA: a solid viscoelasticity measurement device
RSAII, manufactured by Rheometric Scientific Inc., a rectangular
tension method; a frequency of 1 Hz and a temperature rising rate
of 3.degree. C./min).
[0126] <Heat Resistance (Thermal Decomposition Temperature at 5%
Weight Loss)>
[0127] A thermal decomposition temperature at 5% weight loss was
measured by using a thermogravimetry/differential thermal analyzer
(TG/DTA6200, manufactured by Hitachi High-Tech Science
Corporation).
[0128] Measurement Conditions
[0129] Measurement Temperature: Room temperature to 500.degree.
C.
[0130] Measurement Atmosphere: Nitrogen
[0131] Temperature Rising Rate: 10.degree. C./min
[0132] <Linear Expansion Coefficient>
[0133] Thermomechanical analysis was performed in a tensile mode by
using a thermomechanical analyzer (TMA: TMA-50, manufactured by
Shimadzu Corporation).
[0134] Measurement Conditions
[0135] Load: 1.5 g
[0136] Temperature Rising Rate: 2 times at 10.degree. C./min
[0137] Measurement Temperature Range: 50.degree. C. to 300.degree.
C.
[0138] The measurement in the conditions described above was
performed with respect to the same sample two times, and in the
second measurement, an average expansion coefficient was evaluated
as a coefficient of linear thermal expansion in a temperature range
of 25.degree. C. to 280.degree. C.
[0139] <Thermal Conductivity>
[0140] A coefficient of thermal conductivity (2) was calculated on
the basis of an expression of .lamda.=.alpha..rho.C by using a
density (.rho.), a coefficient of thermal diffusivity (.alpha.),
and a specific heat capacity (C). A specific weight, the
coefficient of thermal diffusivity, and specific heat capacity were
respectively obtained by the following method.
[0141] (1) Specific Gravity
[0142] The specific gravity was measured by using an electronic
balance CP224S and a specific gravity measurement kit YDK01CP
(manufactured by Sartorius AG).
[0143] (2) Coefficient of Thermal Diffusivity
[0144] The coefficient of thermal diffusivity at 25.degree. C. was
measured by using a coefficient of thermal diffusivity measurement
device LFA447 Nanoflash (manufactured by NETZSCH-Geratebau
GmbH).
[0145] (3) Specific Heat Capacity
[0146] The specific heat capacity at 25.degree. C. was calculated
by using a differential scanning calorimeter EXSTAR7200
(manufactured by Hitachi High-Tech Science Corporation).
[0147] Measurement Conditions
[0148] Measurement Temperature: -20.degree. C. to 100.degree.
C.
[0149] Measurement Atmosphere: Nitrogen
[0150] Temperature Rising Rate: 10.degree. C./min
TABLE-US-00001 TABLE 1 Com- Com- Com- parative parative Comparative
parative Example 3 Example 4 Example 5 Example 6 Example 7 Example
8 Example 1 Example 2 Example 3 Example 4 Epoxy A-1 45 38 80 Resin
A-2 44 38 80 (Parts by A-3 52 80 Weight) A-4 80 A-5 80 Properties
Solid Solid Solid Liquid Liquid Liquid Solid Solid Solid Liquid
Viscosity 943 943 943 23 (Pa s) Softening 97 97 97 105 105 91 Point
(.degree. C.) (Melting (Melting (Melting (Melting (Melting Point)
Point) Point) Point) Point) Melt Viscosity 0.27 0.27 0.27 0.14 0.14
0.14 0.18 0.18 4.5 0.07 at 150.degree. C. (dPa s) Curing TD-2131 35
36 28 Agent MHAC-P 42 42 (Parts by Weight) Catalyst TPP 0.8 0.8 0.8
(Parts by 2P4MEZ-PW 0.4 0.4 Weight) 2E4MZ 1.6 1.6 1.6 1.6 1.6
Physical Tg (DMA) 205 305 Less 199 295 Less 150 193 -- 217
Properties thermal 400 369 396 398 367 395 353 365 -- 388 of Cured
decomposition Product temperature at 5% weight loss (.degree. C.)
coefficient of 120 74 84 124 77 87 151 118 -- 91 linear thermal
expansion (ppm) Thermal 0.31 0.32 0.25 -- 0.25 Conductivity (W/m K)
Curing Conditions (I) (II) (III) (I) (II) (III) (I) (III) (III)
(III) Result Gellation Occurs during Preparation of Composition
INDUSTRIAL APPLICABILITY
[0151] An epoxy resin in which polyvalent hydroxy biphenyl obtained
by a production step including a regioselective cross-coupling
reaction of a phenol derivative is glycidylated has liquid
properties or a low melt viscosity, and a cured product thereof
exhibits excellent performance in heat resistance, low thermal
expandability, and thermal conductivity.
* * * * *