| Patent | Date |
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Epoxy resin composition, curable resin composition, and fiber-reinforced composite material
Grant 11,286,385 - Hayashi , et al. March 29, 2 | 2022-03-29 |
Epoxy resin, production method, epoxy resin composition and cured product of same
Grant 11,015,019 - Hirota , et al. May 25, 2 | 2021-05-25 |
Epoxy resin, epoxy resin composition including same, and cured product using said epoxy resin composition
Grant 10,982,040 - Sugimoto , et al. April 20, 2 | 2021-04-20 |
Epoxy Resin Composition, Curable Resin Composition, And Fiber-reinforced Composite Material
App 20200308393 - Hayashi; Koji ; et al. | 2020-10-01 |
Epoxy Resin, Epoxy Resin Composition Including Same, And Cured Product Using Said Epoxy Resin Composition
App 20200231741 - Sugimoto; Nana ; et al. | 2020-07-23 |
Epoxy Resin, Production Method, Epoxy Resin Composition And Cured Product Of Same
App 20190202974 - Hirota; Yousuke ; et al. | 2019-07-04 |
Epoxy compound, method for producing the same, epoxy resin composition, and cured product thereof
Grant 10,329,231 - Yoshimoto , et al. | 2019-06-25 |
Epoxy resin composition, cured product, heat radiating material, and electronic member
Grant 10,047,256 - Yoshimoto , et al. August 14, 2 | 2018-08-14 |
Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article
Grant 10,047,190 - Morinaga , et al. August 14, 2 | 2018-08-14 |
Epoxy resin, method for producing epoxy resin, curable resin composition and cured product thereof, fiber-reinforced composite material, and molded article
Grant 9,975,987 - Hayashi , et al. May 22, 2 | 2018-05-22 |
Epoxy Compound, Method For Producing The Same, Epoxy Resin Composition, And Cured Product Thereof
App 20180002261 - Yoshimoto; Yasuyo ; et al. | 2018-01-04 |
Method For Producing Biphenyl-skeleton-containing Epoxy Resin
App 20170342194 - Yoshimoto; Yasuyo ; et al. | 2017-11-30 |
Epoxy Resin, Method For Producing Epoxy Resin, Curable Resin Composition, Cured Product, Fiber Reinforced Composite Material, And Molded Article
App 20170275416 - MORINAGA; Kunihiro ; et al. | 2017-09-28 |
Method for producing biphenyl-skeleton-containing epoxy resin
Grant 9,765,179 - Yoshimoto , et al. September 19, 2 | 2017-09-19 |
Epoxy compound, method for producing the same, epoxy resin composition, and cured product thereof
Grant 9,738,580 - Yoshimoto , et al. August 22, 2 | 2017-08-22 |
Epoxy Resin, Method For Producing Epoxy Resin, Curable Resin Composition And Cured Product Thereof, Fiber-reinforced Composite Material, And Molded Article
App 20170121451 - Hayashi; Koji ; et al. | 2017-05-04 |
Epoxy Resin Composition, Cured Product, Heat Radiating Material, And Electronic Member
App 20160122604 - Yoshimoto; Yasuyo ; et al. | 2016-05-05 |
Method For Producing Biphenyl-skeleton-containing Epoxy Resin
App 20160083504 - Yoshimoto; Yasuyo ; et al. | 2016-03-24 |
Epoxy Compound, Method For Producing The Same, Epoxy Resin Composition, And Cured Product Thereof
App 20150353456 - Yoshimoto; Yasuyo ; et al. | 2015-12-10 |
Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film
Grant 8,791,214 - Takeuchi , et al. July 29, 2 | 2014-07-29 |
Active Ester Resin, Method For Producing The Same, Thermosetting Resin Composition, Cured Product Of The Thermosetting Resin Composition, Semiconductor Encapsulating Material, Pre-preg, Circuit Board, And Build-up Film
App 20140151094 - Takeuchi; Kan ; et al. | 2014-06-05 |
Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material
Grant 8,729,192 - Arita , et al. May 20, 2 | 2014-05-20 |
Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin
Grant 8,263,714 - Ogura , et al. September 11, 2 | 2012-09-11 |
Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
Grant 8,084,567 - Ogura , et al. December 27, 2 | 2011-12-27 |
Epoxy Resin Composition, Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin, Method For Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin
App 20110275739 - Ogura; Ichiro ; et al. | 2011-11-10 |
Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin
Grant 7,985,822 - Ogura , et al. July 26, 2 | 2011-07-26 |
Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
Grant 7,718,741 - Ogura , et al. May 18, 2 | 2010-05-18 |
Epoxy Resin Composition And Cured Article Thereof, Novel Epoxy Resin And Production Method Thereof, And Novel Phenol Resin
App 20100056747 - OGURA; Ichirou ; et al. | 2010-03-04 |
Epoxy Resin Composition, Cured Article Thereof, Novel Epoxy Resin, Novel Phenol Resin And Semiconductor-encapsulating Material
App 20090099303 - Arita; Kazuo ; et al. | 2009-04-16 |
Method Of Producing Phenol Resin And Method Of Producing Epoxy Resin
App 20090088535 - Arita; Kazuo ; et al. | 2009-04-02 |
Epoxy Resin Composition And Cured Article Thereof, Novel Epoxy Resin And Production Method Thereof, And Novel Phenol Resin
App 20090069490 - Ogura; Ichirou ; et al. | 2009-03-12 |
Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin
App 20080255315 - Ogura; Ichiro ; et al. | 2008-10-16 |
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