U.S. patent application number 15/339168 was filed with the patent office on 2017-10-19 for system and method for maskless thin film battery fabrication.
The applicant listed for this patent is Applied Materials, Inc.. Invention is credited to Dimitrios Argyris, Byung-Sung Kwak, Giback Park, Lizhong Sun.
Application Number | 20170301926 15/339168 |
Document ID | / |
Family ID | 60038434 |
Filed Date | 2017-10-19 |
United States Patent
Application |
20170301926 |
Kind Code |
A1 |
Argyris; Dimitrios ; et
al. |
October 19, 2017 |
SYSTEM AND METHOD FOR MASKLESS THIN FILM BATTERY FABRICATION
Abstract
A method for masklessly fabricating a thin film battery,
including securing a substrate to a substrate carrier of a first
deposition chamber with a first clamping ring having an aperture,
performing a first deposition on the substrate to form a first TFB
layer, the aperture of the first clamping ring defining a footprint
of the first layer, wherein areas of the substrate covered by the
first clamping ring are excluded from the first blanket deposition,
securing the substrate to a substrate carrier of a second
deposition chamber with a second clamping ring having an aperture,
and performing a second deposition on the substrate to form a
second TFB layer over the first layer, the aperture of the second
clamping ring defining a footprint of the second layer, wherein
areas of the substrate and the first layer covered by the second
clamping ring are excluded from the second blanket deposition.
Inventors: |
Argyris; Dimitrios; (Los
Altos, CA) ; Kwak; Byung-Sung; (Portland, OR)
; Sun; Lizhong; (San Jose, CA) ; Park; Giback;
(San Jose, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Applied Materials, Inc. |
Santa Clara |
CA |
US |
|
|
Family ID: |
60038434 |
Appl. No.: |
15/339168 |
Filed: |
October 31, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
62322415 |
Apr 14, 2016 |
|
|
|
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01M 2/1094 20130101;
H01M 2/026 20130101; H01M 2/0287 20130101; B23K 2103/172 20180801;
H01M 2300/0068 20130101; H01M 2/0207 20130101; H01M 2300/0065
20130101; B23K 2101/34 20180801; C23C 14/50 20130101; H01M 10/0525
20130101; H01M 6/40 20130101; H01M 6/18 20130101; H01M 2220/30
20130101; B23K 26/0006 20130101; H01M 6/005 20130101; H01M 2/0267
20130101; H01M 4/525 20130101; H01M 10/052 20130101; H01J 37/3426
20130101; B29C 59/16 20130101; B29K 2995/0006 20130101; C23C 14/34
20130101; B29L 2031/3468 20130101; H01M 2/08 20130101; H01J
37/32715 20130101; H01M 10/0436 20130101; B23K 26/142 20151001;
B23K 26/362 20130101; H01M 4/382 20130101; Y02E 60/10 20130101;
Y02T 10/70 20130101; H01M 6/188 20130101; B23K 2101/36 20180801;
H01M 10/0585 20130101 |
International
Class: |
H01M 6/18 20060101
H01M006/18; C23C 14/50 20060101 C23C014/50; C23C 14/34 20060101
C23C014/34; H01J 37/32 20060101 H01J037/32; H01J 37/34 20060101
H01J037/34; H01M 6/40 20060101 H01M006/40 |
Claims
1. A system for maskless thin film battery (TFB) fabrication,
comprising: a first deposition chamber adapted to deposit a first
layer of the TFB on a substrate, the first deposition chamber
having a first clamping ring adapted to secure the substrate to a
first substrate carrier, the first clamping ring having an aperture
with a size and shape defining a footprint of the first layer; and
a second deposition chamber adapted to deposit a second layer of
the TFB over the first layer, the second deposition chamber having
a second clamping ring adapted to secure the substrate to a second
substrate carrier, the second clamping ring having an aperture with
a size and shape defining a footprint of the second layer.
2. The system of claim 1, wherein the first deposition chamber and
the second deposition chamber are the same deposition chamber.
3. The system of claim 1, wherein the first substrate carrier and
the second substrate carrier are the same substrate carrier.
4. The system of claim 1, wherein the aperture of the first
clamping ring has a first size and the aperture of the second
clamping ring has a second size, wherein the second size is larger
than the first size.
5. The system of claim 4, wherein a position of the first clamping
ring relative to the substrate is concentric with a position of the
second clamping ring relative to the substrate.
6. The system of claim 1, wherein the footprint defined by the
aperture of the second clamping ring is adapted to entirely cover,
and overlap edges of, the footprint defined by the aperture of the
first clamping ring.
7. The system of claim 1, further comprising a third deposition
chamber adapted to deposit a third layer of the TFB over the second
layer, the third deposition chamber having a third clamping ring
adapted to secure the substrate to a third substrate carrier, the
third clamping ring having an aperture with a size and shape
defining a footprint of the third layer.
8. The system of claim 7, wherein the first deposition chamber is
adapted to perform a blanket deposition of a positive electrode
layer, the second deposition chamber is configured to perform a
blanket deposition of a solid state electrolyte layer, and the
third deposition chamber is configured to perform a blanket
deposition of a negative electrode layer.
9. The system of claim 7, wherein the aperture of the first
clamping ring has a first size, the aperture of the second clamping
ring has a second size, and the aperture of the third clamping ring
has a third size, wherein the second size is larger than the first
size and the third size is smaller than the second size.
10. A method for masklessly fabricating a thin film battery (TFB),
comprising: securing a substrate to a substrate carrier of a first
deposition chamber with a first clamping ring having an aperture;
performing a first blanket deposition on the substrate to form a
first layer of the TFB, wherein the aperture of the first clamping
ring defines a footprint of the first layer, and wherein areas of
the substrate covered by the first clamping ring are excluded from
the first blanket deposition; securing the substrate to a substrate
carrier of a second deposition chamber with a second clamping ring
having an aperture; and performing a second blanket deposition on
the substrate to form a second layer of the TFB over the first
layer, wherein the aperture of the second clamping ring defines a
footprint of the second layer, and wherein areas of the substrate
and the first layer covered by the second clamping ring are
excluded from the second blanket deposition.
11. The method of claim 10, wherein the first deposition chamber
and the second deposition chamber are different deposition
chambers.
12. The method of claim 10, wherein the first deposition chamber
and the second deposition chamber are the same deposition
chamber.
13. The method of claim 10, wherein the substrate carrier of the
first deposition chamber and the substrate carrier of the second
deposition chamber are the same substrate carrier.
14. The method of claim 10, wherein the aperture of the first
clamping ring has a first size and the aperture of the second
clamping ring has a second size, wherein the second size is larger
than the first size.
15. The method of claim 10, wherein a position of the first
clamping ring relative to the substrate is concentric with a
position of the second clamping ring relative to the substrate.
16. The method of claim 10, wherein the second layer entirely
covers, and overlaps edges of, the first layer.
17. The method of claim 10, further comprising securing the
substrate to a substrate carrier of a third deposition chamber with
a third clamping ring having an aperture; and performing a third
blanket deposition on the substrate to form a third layer of the
TFB over the second layer, wherein the aperture of the third
clamping ring defines a footprint of the third layer, and wherein
areas of the substrate, the first layer, and the second layer
covered by the third clamping ring are excluded from the third
blanket deposition.
18. The method of claim 17, wherein the first layer is a positive
electrode layer, the second layer is a solid state electrolyte
layer, and the third layer is a negative electrode layer.
19. The method of claim 17, wherein the aperture of the first
clamping ring has a first size, the aperture of the second clamping
ring has a second size, and the aperture of the third clamping ring
has a third size, wherein the second size is larger than the first
size and the third size is smaller than the second size.
20. A method for masklessly fabricating a thin film battery (TFB),
comprising: securing a substrate to a substrate carrier of a first
deposition chamber with a first clamping ring having an aperture;
performing a first blanket deposition on the substrate to form a
positive electrode layer of the TFB, wherein the aperture of the
first clamping ring defines a footprint of the positive electrode
layer, and wherein areas of the substrate covered by the first
clamping ring are excluded from the first blanket deposition;
securing the substrate to a substrate carrier of a second
deposition chamber with a second clamping ring having an aperture;
performing a second blanket deposition on the substrate to form a
solid state electrolyte layer of the TFB over the positive
electrode layer, wherein the aperture of the second clamping ring
defines a footprint of the solid state electrolyte layer, and
wherein areas of the substrate and the positive electrode layer
covered by the second clamping ring are excluded from the second
blanket deposition; securing the substrate to a substrate carrier
of a third deposition chamber with a third clamping ring having an
aperture; and performing a third blanket deposition on the
substrate to form a negative electrode layer of the TFB over the
solid state electrolyte layer, wherein the aperture of the third
clamping ring defines a footprint of the negative electrode layer,
and wherein areas of the substrate, positive electrode first layer,
and the solid state electrolyte layer covered by the third clamping
ring are excluded from the third blanket deposition.
Description
RELATED APPLICATIONS
[0001] This application claims priority to U.S. provisional patent
application No. 62/322,415, filed Apr. 14, 2016, entitled "Volume
Change Accommodating TFE Materials" and incorporated by reference
herein in its entirety.
FIELD
[0002] The present embodiments relate generally to the fabrication
of thin film batteries, and more particularly to the fabrication of
thin film batteries using maskless deposition techniques.
BACKGROUND
[0003] Solid state Thin Film Batteries (TFB) are known to exhibit
several advantages over conventional battery technologies. These
advantages include superior form factors, cycle life, power
capability, and safety. Still, there is a need for cost effective
and high-volume manufacturing (HVM) compatible fabrication
technologies to enable broad market applicability of TFBs.
[0004] An embodiment of a TFB may include a plurality of layers
disposed in a vertically stacked arrangement, such layers including
a positive electrode layer (e.g., a cathode) and a negative
electrode layer (e.g., an anode) separated by a solid state
electrolyte. These layers are commonly formed by successive
deposition of the layers on a substrate using a deposition chamber.
The surface area or "footprint" of a deposited layer is defined
using a mask positioned above a substrate during deposition. Since
one or more layers of a TFB may have a unique footprint relative to
the other layers, a plurality of masks are normally necessary for
fabricating a TFB.
[0005] A shortcoming associated with masked deposition techniques
for fabricating TFBs is susceptibility to electrical shorting
between the positive electrode and negative electrode layers during
deposition, possibly leading to irreversible device failure.
Additionally, implementing numerous masks during device fabrication
decreases throughput and increases manufacturing costs.
[0006] Accordingly, a need remains in the art for fabrication
processes and technologies for TFBs compatible with cost effective
and HVM to enhance market applicability of TFBs.
[0007] With respect to these and other considerations the present
disclosure is provided.
BRIEF SUMMARY
[0008] An exemplary embodiment of a system for maskless TFB
fabrication in accordance with the present disclosure may include a
deposition chamber adapted to deposit a first layer of the TFB on a
substrate, the first deposition chamber having a first clamping
ring adapted to secure the substrate to a first substrate carrier.
The first clamping ring may have an aperture with a size and shape
defining a footprint of the first layer, and a second deposition
chamber adapted to deposit a second layer of the TFB over the first
layer. The second deposition chamber may have a second clamping
ring adapted to secure the substrate to a second substrate carrier,
the second clamping ring having an aperture with a size and shape
defining a footprint of the second layer.
[0009] An exemplary embodiment of a method for maskless TFB
fabrication in accordance with the present disclosure may include
securing a substrate to a substrate carrier of a first deposition
chamber with a first clamping ring having an aperture. The method
may further include performing a first blanket deposition on the
substrate to form a first layer of the TFB, wherein the aperture of
the first clamping ring defines a footprint of the first layer.
Areas of the substrate covered by the first clamping ring are
excluded from the first blanket deposition. The method may further
include securing the substrate to a substrate carrier of a second
deposition chamber with a second clamping ring having an aperture,
and performing a second blanket deposition on the substrate to form
a second layer of the TFB over the first layer. The aperture of the
second clamping ring defines a footprint of the second layer,
wherein areas of the substrate and the first layer covered by the
second clamping ring are excluded from the second blanket
deposition.
[0010] Another exemplary embodiment of a method for maskless TFB
fabrication in accordance with the present disclosure may include
securing a substrate to a substrate carrier of a first deposition
chamber with a first clamping ring having an aperture. The method
may further include performing a first blanket deposition on the
substrate to form a positive electrode layer of the TFB, wherein
the aperture of the first clamping ring defines a footprint of the
positive electrode layer. Areas of the substrate covered by the
first clamping ring are excluded from the first blanket deposition.
The method may further include securing the substrate to a
substrate carrier of a second deposition chamber with a second
clamping ring having an aperture, and performing a second blanket
deposition on the substrate to form a solid state electrolyte layer
of the TFB over the positive electrode layer. The aperture of the
second clamping ring defines a footprint of the solid state
electrolyte layer, wherein areas of the substrate and the first
layer covered by the second clamping ring are excluded from the
second blanket deposition. The method may further include securing
the substrate to a substrate carrier of a third deposition chamber
with a third clamping ring having an aperture, and performing a
third blanket deposition on the substrate to form a negative
electrode layer of the TFB over the solid state electrolyte layer.
The aperture of the third clamping ring defines a footprint of the
negative electrode layer, wherein areas of the substrate, the first
layer, and the second layer covered by the third clamping ring are
excluded from the third blanket deposition.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] FIG. 1 is a cross-section view illustrating an exemplary
thin-film battery structure contemplated for fabrication by the
disclosed systems and methods;
[0012] FIG. 2 is a schematic illustrating an exemplary deposition
chamber for implementing embodiments of the disclosed systems and
methods;
[0013] FIG. 3 is a flow diagram illustrating an exemplary method in
accordance with the present disclosure;
[0014] FIG. 4a is a cross-section view illustrating a clamped
substrate being subjected to the method of the present
disclosure;
[0015] FIG. 4b is a top view illustrating a substrate after
deposition of a first layer in accordance with the present
disclosure;
[0016] FIG. 5a is a cross-section view illustrating a clamped
substrate being subjected to the method of the present
disclosure;
[0017] FIG. 5b is a top view illustrating a substrate after
deposition of a second layer in accordance with the present
disclosure;
[0018] FIG. 6a is a cross-section view illustrating a clamped
substrate being subjected to the method of the present
disclosure;
[0019] FIG. 6b is a top view illustrating a substrate after
deposition of a third layer in accordance with the present
disclosure;
[0020] FIG. 7 is a cross-section view illustrating an exemplary
thin-film battery structure resulting from the method depicted in
FIGS. 3-6b.
[0021] FIG. 8 is a schematic illustration of a system in accordance
with the present disclosure including a plurality of
sequentially-implemented deposition chambers.
DETAILED DESCRIPTION
[0022] The present embodiments will now be described more fully
hereinafter with reference to the accompanying drawings, where some
embodiments are shown. The subject matter of the present disclosure
may be embodied in many different forms and is not to be construed
as limited to the embodiments set forth herein. In the drawings,
like numbers refer to like elements throughout.
[0023] The present disclosure relates to systems and methods for
fabricating thin film batteries (TFBs). Particularly, the disclosed
systems and methods are compatible with high throughput production
and high volume manufacturing methodologies. As will be
appreciated, high throughput production of TFBs includes certain
challenges. For example, sputter deposition of layers of a TFB can
result in electrical shorting between positive electrode and
negative electrode layers of a TFB, possibly leading to
irreversible device failure. Such issues can be exacerbated as
higher throughput is pursued to achieve the goal of reducing the
overall cost of manufacturing while maintaining the basic
requirements for layers, interfaces, device stability/stress, and
cell performance in TFBs. The disclosed systems and methods address
and overcome these issues.
[0024] In general, the disclosed systems and methods utilize
substrate clamping rings or edge exclusion rings (hereinafter
collectively referred to as "clamping rings") of different sizes
(e.g., different interior areas) for achieving concentric edge
exclusion regions on a substrate to selectively vary the surface
area of sequentially deposited layers of a TFB. For example, as
will be described in greater detail below, a substrate may be
secured to a substrate carrier (e.g., a pedestal) in a deposition
chamber using a first clamping ring. The first clamping ring may be
separate from or integral with the substrate carrier and may have a
circular, rectangular, or other shape. A blanket deposition may
then be performed on the substrate to create a first layer (e.g., a
positive electrode) of a TFB, with an interior area of the first
clamping ring defining the surface area of "footprint" of the first
layer. The first clamping ring may then be removed and the
substrate may again be clamped to a substrate carrier. The
substrate carrier may be the same substrate carrier used in the
first deposition or a different substrate carrier in the same or a
different deposition chamber, using a second clamping ring having
an interior area larger than the interior area of the first
clamping ring. A blanket deposition may then be performed on the
substrate to create a second layer (e.g., a solid state
electrolyte) of the TFB, with an interior area of the second
clamping ring defining the footprint of the second layer.
[0025] Since the interior area of the second clamping ring is
larger than the interior area of the first clamping ring, the
second layer of the TFB may overlay, and may entirely overlap the
edges of, the underlying first layer. The second clamping ring may
then be removed and the substrate may again be clamped to a
substrate carrier. The substrate carrier may be the same substrate
carrier used in the first and/or second deposition or a different
substrate carrier in the same or a different deposition chamber,
using a third clamping ring having an interior area smaller than
the interior area of the second clamping ring. A blanket deposition
may then be performed on the substrate to create a third layer
(e.g., a negative electrode) on top of the second layer. Thus,
physical separation between the first and third layers of the TFB
is ensured by the blanket deposition of the intermediate second
layer, and electrical shorting between the first and third layers
(e.g., the positive electrode and the negative electrode) is
prevented. The TFB may include various other layers as further
described below.
[0026] As will be appreciated, a variety of different TFB
architectures can be fabricated using the processes and tooling
arrangements described herein. FIG. 1 is a non-limiting,
cross-sectional view illustrating several layers of an exemplary
TFB 10 amenable to fabrication using the systems and methods
described herein. The illustrated TFB 10 may include a stack of
layers 12 fabricated on a substrate 14. The stack of layers 12 may
include a positive electrode layer 16, a solid state electrolyte
layer 18, and a negative electrode layer 20. As will be appreciated
by those of ordinary skill in the art, the TFB 10 may include
various additional layers and/or components (e.g., a cathode
current collector (CCC) layer, an anode current collector (ACC)
layer, various adhesion layers, a protective coating layer, etc.)
formed using processes and manufacturing methods not shown or
described herein. Thus, the TFB 10 illustrated in FIG. 1 is not
intended to be an accurate representation of an entire TFB device.
FIG. 1 is merely a schematic representation of a discrete portion
of a TFB amenable to fabrication using the systems and methods
described herein.
[0027] The positive electrode layer 16 may be LiCoO2 or a similar
material. The solid state electrolyte 18 may be a lithium
phosphorus oxynitride (LiPON) or similar material. The negative
electrode layer 20 may include lithium or a lithium-containing
material. In one non-limiting embodiment, the stack of layers 12
may have a thickness of 15 microns. FIG. 1 illustrates one possible
arrangement for a TFB structure amendable to fabrication using the
systems and methods described below, and the concepts disclosed
herein can be applied to various other TFB architectures (e.g.,
different battery stack arrangements).
[0028] FIG. 2 is a schematic illustrating an exemplary deposition
chamber 22 for use with the disclosed systems and methods. The
deposition chamber 22 may include a vacuum enclosure 24, a sputter
target 26, a substrate 28, a substrate carrier 30, and a clamping
ring 32. The clamping ring 32 may be independent of the substrate
carrier 30 or may be an integral component of the substrate carrier
30. In one non-limiting example, for LiPON deposition the sputter
target 26 may be Li3PO4, and a suitable substrate 28 may be,
depending on the type of electrochemical device, silicon, silicon
nitride on Si, glass, thin ceramic foils, polyethylene
terephthalate (PET), mica, metal foils such as copper, etc. The
vacuum enclosure 24 may have a vacuum pump system 34, a process gas
delivery system 36, and a power source 38 connected to the sputter
target 26. The power source 38 may include matching networks and
filters for handling RF, and in some embodiments may include
multiple frequency sources if needed. As will be described in
greater detail below, the systems and methods of the present
disclosure may involve the implementation of a plurality of
deposition chambers similar to the deposition chamber 22 in a
predefined sequence for fabricating successive layers of a TFB.
[0029] Referring to FIG. 3, a flow diagram illustrating an
exemplary method for masklessly fabricating several layers of a TFB
in accordance with the present disclosure is shown. The method will
now be described in detail in conjunction with the schematic
representations shown in FIGS. 4a-6b.
[0030] At a block 100 of the exemplary fabrication method, and as
depicted in FIG. 4a, a substrate 40 similar to the substrate 28
described above may be clamped to a substrate carrier 42 by a first
clamping ring 44 of a deposition chamber similar to the deposition
chamber 22 described above. For the sake of clarity, the substrate
40, substrate carrier 42, and first clamping ring 44 are shown in
isolation with surrounding components of the associated deposition
chamber omitted. The first clamping ring 44 may be annular and may
define a circular aperture 46 having a diameter d1. In one
non-limiting embodiment, the diameter d1 may be in a range of 100
millimeters to 450 millimeters. In various alternative embodiments,
the first clamping ring 44 and/or the aperture 46 may have a
variety of different shapes, such as rectangular, oval, triangular,
irregular, etc. as may be appropriate for a particular application.
The size and shape of the aperture 46 may correspond to a
predetermined footprint for a first layer of a TFB to be deposited
on the substrate 40.
[0031] At block 105 of the exemplary fabrication method, a first
deposition may be performed on the substrate 40 to form a first
layer 48 (see FIG. 4b) of a TFB. In one non-limiting example, the
first layer 48 may be a positive electrode layer formed of LiCoO2
or a similar material. During deposition of the first layer 48, the
portion of the substrate 40 not covered by the first clamping ring
44 (i.e., the portion of the substrate 40 directly below the
aperture 46) may be exposed to the deposition. At the same time,
the portion of the substrate 40 covered by the first clamping ring
44 (i.e., the portion of the substrate 40 immediately below the
first clamping ring 44 exclusive of the portion below aperture 46)
may be shielded from the deposition. Thus, referring to the top
view of the substrate 40 shown in FIG. 4B, the deposited first
layer 48 may have a circular footprint with a diameter d1 and may
be surrounded by an annular portion 50 of the substrate 40 free of
deposition.
[0032] At block 110 of the exemplary fabrication method, the first
clamping ring 44 may be removed from the substrate 40, releasing
the substrate 40 from the substrate carrier 42. At block 115 of the
method, the substrate 40 may be clamped to a substrate carrier 52
by a second clamping ring 54 as shown in FIG. 5a. In a non-limiting
embodiment of the present disclosure, the substrate carrier 52 and
the second clamping ring 54 may be components of a deposition
chamber separate and different from the deposition chamber 22 used
for the deposition of the first layer 48 described above. For
example, referring to FIG. 8, the system of the present disclosure
may include a first deposition chamber 22 and a separate, second
deposition chamber 25 implemented in a sequential manner. The use
of separate deposition chambers (possibly components of the same
deposition tool) may improve manufacturing throughput since, while
the substrate 40 is undergoing deposition of a second layer
(described below), another substrate may simultaneously undergo
deposition of a first layer in the manner described above. In
another embodiment of the present disclosure, the substrate carrier
52 and the second clamping ring 54 may be components of the same
deposition chamber used for the deposition of the first layer 48
described above (e.g., the substrate carrier 52 may be the same as
substrate carrier 42).
[0033] The second clamping ring 54 may define a circular aperture
56 having a diameter d2. In one non-limiting example, the diameter
d2 may be larger than the diameter d1 of the aperture 46 of the
first clamping ring 44 (e.g., given the same outer diameter, the
second clamping ring 54 may be radially thinner than the first
clamping ring 44), and may be in a range of 100 millimeters to 450
millimeters. Thus, when the substrate 40 is clamped to the
substrate carrier 52, an annular gap g may be defined radially
intermediate the second clamping ring 54 and a radial edge of the
first layer 48 on the substrate 40. In various alternative
embodiments, the second clamping ring 54 and/or the aperture 56 may
have a variety of different shapes, such as rectangular, oval,
triangular, irregular, etc. as may be appropriate for a particular
application. The size and shape of the aperture 56 may correspond
to a predetermined footprint for a second layer of a TFB to be
deposited on the substrate 40. In some embodiments, the size and
shape of the aperture 56 may be the same as the size and shape of
the aperture 46 of the first clamping ring 44.
[0034] At block 120 of the exemplary fabrication method, a second
deposition may be performed on the substrate 40 to form a second
layer 58 (see FIG. 5b) of the TFB. In one non-limiting example, the
second layer 58 may be a solid state electrolyte layer formed of a
lithium phosphorus oxynitride (LiPON) or similar material. During
deposition of the second layer 58, the first layer 48 and the
portion of the substrate 40 not covered by the second clamping ring
54 (i.e., the portion of the substrate 40 directly below the
aperture 56) may be exposed to the deposition. At the same time,
the portion of the substrate 40 covered by the second clamping ring
54 (i.e., the portion of the substrate 40 immediately below the
second clamping ring 54 exclusive of the portion below aperture 56)
may be shielded from the deposition. Thus, referring to the top
view of the substrate 40 shown in FIG. 5B, the deposited second
layer 58 may have a circular footprint with a diameter d2 and may
be radially surrounded by an annular portion 60 of the substrate 40
free of deposition. Since the diameter d2 is larger than the
diameter d1 of the footprint of the first layer 48, and since the
first layer 48 and second layer 58 are concentric, the second layer
58 may entirely cover, and may overlap the edge of, the first layer
48.
[0035] At block 125 of the exemplary fabrication method, the second
clamping ring 54 may be removed from the substrate 40, releasing
the substrate 40 from the substrate carrier 52. At block 130 of the
method, the substrate 40 may be clamped to a substrate carrier 62
by a third clamping ring 64 as shown in FIG. 6a. In a non-limiting
embodiment of the present disclosure, the substrate carrier 62 and
the third clamping ring 64 may be components of a deposition
chamber separate and different from the deposition chambers used
for the depositions of the first and second layers 48, 58 described
above. The use of separate deposition chambers may improve
manufacturing throughput since, while the substrate 40 is
undergoing deposition of a third layer (described below), other
substrates may simultaneously undergo deposition of first and
second layers in the manner described above. In another embodiment
of the present disclosure, the substrate carrier 62 and the second
clamping ring 64 may be components of the same deposition chamber
used for the deposition of the first layer 48 and/or the second
layer 58 described above (e.g., the substrate carrier 62 may be the
same as the substrate carrier 52 and/or the substrate carrier
42).
[0036] The third clamping ring 64 may define a circular aperture 66
having a diameter d3. In one non-limiting example, the diameter d3
may be smaller than the diameter d2 of the aperture 56 of the
second clamping ring 54 (e.g., given the same outer diameter, the
third clamping ring 64 may be radially thicker than the second
clamping ring 54), and may be in a range of 100 millimeters to 450
millimeters. Thus, when the substrate 40 is clamped to the
substrate carrier 62, the third clamping ring 64 may engage an
upper surface of the second layer 58. In various alternative
embodiments, the third clamping ring 64 and/or the aperture 66 may
have a variety of different shapes, such as rectangular, oval,
triangular, irregular, etc. as may be appropriate for a particular
application. The size and shape of the aperture 66 may correspond
to a predetermined footprint for a third layer of a TFB to be
deposited on the substrate 40. In some embodiments, the size and
shape of the aperture 66 may be the same as the size and shape of
the aperture 56 of the second clamping ring 54 and/or the first
clamping ring 44.
[0037] At block 135 of the exemplary fabrication method, a third
deposition may be performed on the substrate 40 to form a third
layer 68 (see FIG. 6b) of the TFB. In one non-limiting example, the
third layer 68 may be a negative electrode layer formed of lithium
or a lithium-containing material. During deposition of the third
layer 68, the portion of the second layer 58 not covered by the
third clamping ring 64 (i.e., the portion of the second layer 58
directly below the aperture 66) may be exposed to the deposition.
At the same time, the substrate 40 and the portion of the second
layer 58 covered by the third clamping ring 64 (i.e., the portion
of the second layer 58 immediately below the third clamping ring 64
exclusive of the portion below aperture 66) may be shielded from
the deposition. Thus, referring to the top view of the substrate 40
shown in FIG. 6B, the deposited third layer 68 may have a circular
footprint with a diameter d3 and may be radially surrounded by an
annular portion 70 of the second layer 58 free of deposition of the
third layer 68.
[0038] Referring to FIG. 7, a cross-sectional view illustrating the
substrate 40 and a stack 72 of the deposited first, second, and
third layers 48, 58, 68 of a TFB 15 shown. As can be seen, the
second layer 58 entirely covers the first layer 48, including the
radial edges of the first layer 48. The third layer 68, disposed
atop the second layer 58, is entirely separated from the first
layer 48 by the second layer 58. Thus, in the exemplary embodiment
of the present disclosure, wherein the first layer 48 is a positive
electrode layer, the second layer 58 is a solid state electrolyte
layer, and the third layer 68 is a negative electrode layer, the
solid state electrolyte layer entirely separates the positive
electrode layer from the negative electrode layer. The described
configuration effectively prevents electrical shorting between the
positive electrode layer and the negative electrode layer.
[0039] There are multiple advantages provided by the present
embodiments. A first advantage includes facilitating the
fabrication of successive, stacked TFB layers with varying
footprints via maskless, blanket deposition, leading to reduced
manufacturing costs and improved throughput relative to fabrication
systems and methods requiring the implementation of masks during
deposition. Another advantage includes enhanced throughput if the
various TFB layers described above are deposited using respective,
separate deposition chambers with respective clamping rings adapted
for defining the respective layers. In this manner the
configuration of a particular deposition chamber need not be
changed in the course of fabrication. Furthermore, a deposition
chamber may perform deposition of one of the TFB layers on a first
substrate while another deposition chamber simultaneous performs
deposition of another one of the TFB layers on another
substrate.
[0040] The present disclosure is not to be limited in scope by the
specific embodiments described herein. Indeed, other various
embodiments of, and modifications to, the present disclosure, in
addition to those described herein, will be apparent to those of
ordinary skill in the art from the foregoing description and
accompanying drawings. Thus, such other embodiments and
modifications are in the tended to fall within the scope of the
present disclosure. Furthermore, the present disclosure has been
described herein in the context of a particular implementation in a
particular environment for a particular purpose, while those of
ordinary skill in the art will recognize the usefulness is not
limited thereto and the present disclosure may be beneficially
implemented in any number of environments for any number of
purposes. Thus, the claims set forth below are to be construed in
view of the full breadth and spirit of the present disclosure as
described herein.
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