Sun; Lizhong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sun; Lizhong.The latest application filed is for "polishing fluid collection apparatus and methods related thereto".

Company Profile

3.53.81

Sun; Lizhong - San Jose CA
Sun; Lizhong - Shanghai CN
Sun; Lizhong - Sunnyvale CA
Sun; Lizhong - Nashua NH
Sun; Lizhong - Budd Lake NJ
Sun; Lizhong - US
Sun; Lizhong - Emmaus PA
SUN, LIZHONG - RESIDENCE XP
Sun; Lizhong - Ottawa CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods and apparatus for zone control of RF bias for stress uniformity Grant 11,450,511 - Sun , et al. September 20, 2	2022-09-20
Polishing Fluid Collection Apparatus And Methods Related Thereto App 20220193863 - SUN; Lizhong ; et al.	2022-06-23
Methods And Apparatus For Zone Control Of Rf Bias For Stress Uniformity App 20220157563 - SUN; Lizhong ; et al.	2022-05-19
Tilted Magnetron In A Pvd Sputtering Deposition Chamber App 20210351024 - SUN; Lizhong ; et al.	2021-11-11
Method and apparatus for depositing a metal containing layer on a substrate Grant 11,170,998 - Sun , et al. November 9, 2	2021-11-09
Method And Apparatus For Tuning Film Properties During Thin Film Deposition App 20210249587 - SUN; Lizhong ; et al.	2021-08-12
Pre-conditioned chamber components Grant 11,072,852 - West , et al. July 27, 2	2021-07-27
Methods Of Forming A Metal Containing Material App 20200335332 - SUN; Lizhong ; et al.	2020-10-22
Energy storage device having an interlayer between electrode and electrolyte layer Grant 10,547,040 - Park , et al. Ja	2020-01-28
Pre-conditioned Chamber Components App 20200024725 - WEST; Brian T. ; et al.	2020-01-23
Thermography And Thin Film Battery Manufacturing App 20180131048 - KWAK; Byung-Sung Leo ; et al.	2018-05-10
Energy Storage Device Having An Interlayer Between Electrode And Electrolyte Layer App 20170301957 - Park; Giback ; et al.	2017-10-19
Thin Film Device Encapsulation Using Volume Change Accommodating Materials App 20170301897 - Young; Michael Yu-Tak ; et al.	2017-10-19
Multilayer Thin Film Device Encapsulation Using Soft And Pliable Layer First App 20170301891 - Kwak; Byung-Sung ; et al.	2017-10-19
Multilayer Thin Film Device Encapsulation Using Soft And Pliable Layer First App 20170301892 - Kwak; Byung-Sung ; et al.	2017-10-19
Thin Film Battery Device And Method Of Formation App 20170301955 - Kwak; Byung-Sung ; et al.	2017-10-19
System And Method For Maskless Thin Film Battery Fabrication App 20170301926 - Argyris; Dimitrios ; et al.	2017-10-19
Multilayer Thin Film Device Encapsulation Using Soft And Pliable Layer First App 20170301894 - Kwak; Byung-Sung ; et al.	2017-10-19
Thin Film Battery Device And Method Of Formation App 20170301954 - Kwak; Byung-Sung ; et al.	2017-10-19
SPECIAL LiPON MASK TO INCREASE LiPON IONIC CONDUCTIVITY AND TFB FABRICATION YIELD App 20170279115 - SONG; Daoying ; et al.	2017-09-28
Electrochemical Device Stacks Including Interlayers For Reducing Interfacial Resistance And Over-potential App 20170279155 - SUN; Lizhong ; et al.	2017-09-28
Lithium containing composite metallic sputtering targets Grant 9,765,426 - Kwak , et al. September 19, 2	2017-09-19
Configurations Of Solid State Thin Film Batteries App 20170149093 - Sun; Lizhong ; et al.	2017-05-25
Deposition Of Solid State Electrolyte On Electrode Layers In Electrochemical Devices App 20160343552 - SUN; Lizhong ; et al.	2016-11-24
Skin button used for wound healing App 20160249903 - Sun; Lizhong	2016-09-01
Polishing pad conditioning system including suction Grant 9,375,825 - Sun , et al. June 28, 2	2016-06-28
Pinhole-free solid state electrolytes with high ionic conductivity Grant 9,356,316 - Sun , et al. May 31, 2	2016-05-31
Polishing Pad Conditioning System Including Suction App 20150314417 - Sun; Lizhong ; et al.	2015-11-05
Electrochromic devices with Si, Sn, SiO.sub.2 and SnO.sub.2 doped anodes Grant 9,116,409 - Sun , et al. August 25, 2	2015-08-25
Solid State Electrolyte And Barrier On Lithium Metal And Its Methods App 20150079481 - SUN; Lizhong ; et al.	2015-03-19
Pinhole-free Solid State Electrolytes With High Ionic Conductivity App 20130280581 - SUN; Lizhong ; et al.	2013-10-24
Method and apparatus for electrochemical mechanical processing Grant 7,678,245 - Wang , et al. March 16, 2	2010-03-16
Consistant And Quantitative Method For Tco Delamination Evaluation App 20100052706 - SUN; LIZHONG ; et al.	2010-03-04
High-speed divider with reduced power consumption Grant 7,551,009 - Garlapati , et al. June 23, 2	2009-06-23
Blue printing ink for color filter applications Grant 7,544,723 - Sun , et al. June 9, 2	2009-06-09
Fractional-N baseband frequency synthesizer in bluetooth applications Grant 7,471,123 - Holland , et al. December 30, 2	2008-12-30
Green printing ink for color filter applications Grant 7,460,267 - Sun , et al. December 2, 2	2008-12-02
Conductive polishing article for electrochemical mechanical polishing Grant 7,422,516 - Butterfield , et al. September 9, 2	2008-09-09
High-speed Divider With Reduced Power Consumption App 20080204088 - Garlapati; Akhil K. ; et al.	2008-08-28
High-speed divider with pulse-width control Grant 7,405,601 - Garlapati , et al. July 29, 2	2008-07-29
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP Grant 7,384,534 - Sun , et al. June 10, 2	2008-06-10
Method and apparatus for chemical mechanical polishing of semiconductor substrates Grant 7,375,023 - Tsai , et al. May 20, 2	2008-05-20
Dual Reduced Agents For Barrier Removal In Chemical Mechanical Polishing App 20080045021 - Tsai; Stan D. ; et al.	2008-02-21
Methods And Apparatus For Improved Ink For Inkjet Printing App 20080030562 - Sun; Lizhong	2008-02-07
Conductive Polishing Article For Electrochemical Mechanical Polishing App 20080026681 - BUTTERFIELD; PAUL D. ; et al.	2008-01-31
Methods and apparatus for purging a substrate during inkjet printing App 20080024548 - Shang; Quanyuan ; et al.	2008-01-31
Inks for display device manufacturing and methods of manufacturing and using the same App 20080022885 - Sun; Lizhong	2008-01-31
Methods And Apparatus For Maintaining Inkjet Print Heads Using Parking Structures App 20070263026 - Shang; Quanyuan ; et al.	2007-11-15
Methods And Apparatus For Operating An Inkjet Printing System App 20070256709 - SHANG; QUANYUAN ; et al.	2007-11-08
Methods and apparatus for maintaining inkjet print heads using parking structures with spray mechanisms App 20070252863 - Sun; Lizhong ; et al.	2007-11-01
Conductive polishing article for electrochemical mechanical polishing Grant 7,278,911 - Butterfield , et al. October 9, 2	2007-10-09
Methods for reducing delamination during chemical mechanical polishing Grant 7,244,168 - Chen , et al. July 17, 2	2007-07-17
High-speed Divider With Pulse-width Control App 20070139088 - Garlapati; Akhil K. ; et al.	2007-06-21
Cu CMP polishing pad cleaning Grant 7,220,322 - Sun , et al. May 22, 2	2007-05-22
Methods And Apparatus For Adjusting Pixel Fill Profiles App 20070070105 - SUN; LIZHONG ; et al.	2007-03-29
Method for aortic graft installation App 20070067014 - Ke; Danian ; et al.	2007-03-22
Phase selectable divider circuit Grant 7,187,216 - Sun , et al. March 6, 2	2007-03-06
Blue printing ink for color filter applications App 20070014933 - Sun; Lizhong ; et al.	2007-01-18
Red printing ink for color filter applications App 20070015847 - Sun; Lizhong ; et al.	2007-01-18
Green printing ink for color filter applications App 20070015848 - Sun; Lizhong ; et al.	2007-01-18
Fractional-N baseband frequency synthesizer in bluetooth applications App 20060238226 - Holland; William Eric ; et al.	2006-10-26
Programmable frequency divider Grant 7,113,009 - Sun , et al. September 26, 2	2006-09-26
Barrier removal at low polish pressure Grant 7,104,869 - Tsai , et al. September 12, 2	2006-09-12
Methods for reducing delamination during chemical mechanical polishing App 20060172664 - Chen; Yufei ; et al.	2006-08-03
Method and apparatus for chemical mechanical polishing of semiconductor substrates App 20060166487 - Tsai; Stan D. ; et al.	2006-07-27
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus Grant 7,077,725 - Sun , et al. July 18, 2	2006-07-18
Dual reduced agents for barrier removal in chemical mechanical polishing App 20060144825 - Tsai; Stand D. ; et al.	2006-07-06
Method and apparatus for chemical mechanical polishing of semiconductor substrates Grant 7,060,606 - Tsai , et al. June 13, 2	2006-06-13
Methods for reducing delamination during chemical mechanical polishing Grant 7,037,174 - Chen , et al. May 2, 2	2006-05-02
Method and composition for the removal of residual materials during substrate planarization Grant 7,022,608 - Sun , et al. April 4, 2	2006-04-04
Tantalum removal during chemical mechanical polishing Grant 7,012,025 - Sun , et al. March 14, 2	2006-03-14
Dual reduced agents for barrier removal in chemical mechanical polishing Grant 7,008,554 - Tsai , et al. March 7, 2	2006-03-07
Spray slurry delivery system for polish performance improvement and cost reduction App 20060025049 - Sun; Lizhong ; et al.	2006-02-02
Control of removal profile in electrochemically assisted CMP Grant 6,991,526 - Sun , et al. January 31, 2	2006-01-31
Conductive polishing article for electrochemical mechanical polishing App 20050284770 - Butterfield, Paul D. ; et al.	2005-12-29
Method And Apparatus For Chemical Mechanical Polishing Of Semiconductor Substrates App 20050282380 - Tsai, Stan D. ; et al.	2005-12-22
Conductive polishing article for electrochemical mechanical polishing Grant 6,962,524 - Butterfield , et al. November 8, 2	2005-11-08
Phase selectable divider circuit App 20050242848 - Sun, Lizhong ; et al.	2005-11-03
Programmable frequency divider App 20050212570 - Sun, Lizhong ; et al.	2005-09-29
Fractional-N baseband frequency synthesizer in bluetooth applications Grant 6,946,884 - Holland , et al. September 20, 2	2005-09-20
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP App 20050145507 - Sun, Lizhong ; et al.	2005-07-07
Electrolyte composition and treatment for electrolytic chemical mechanical polishing Grant 6,899,804 - Duboust , et al. May 31, 2	2005-05-31
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP Grant 6,863,797 - Sun , et al. March 8, 2	2005-03-08
Selective removal of tantalum-containing barrier layer during metal CMP Grant 6,858,540 - Sun , et al. February 22, 2	2005-02-22
Method and apparatus for electrochemical mechanical processing App 20050000801 - Wang, Yan ; et al.	2005-01-06
Method for chemical mechanical polishing of semiconductor substrates Grant 6,821,881 - Tsai , et al. November 23, 2	2004-11-23
Method and apparatus for face-up substrate polishing Grant 6,776,693 - Duboust , et al. August 17, 2	2004-08-17
Methods for reducing delamination during chemical mechanical polishing App 20040116052 - Chen, Yufei ; et al.	2004-06-17
Method and apparatus for electrochemical-mechanical planarization Grant 6,739,951 - Sun , et al. May 25, 2	2004-05-25
Conductive polishing article for electrochemical mechanical polishing App 20040082289 - Butterfield, Paul D. ; et al.	2004-04-29
Effective method to improve surface finish in electrochemically assisted CMP App 20040072445 - Sun, Lizhong ; et al.	2004-04-15
Method and apparatus for two-step barrier layer polishing Grant 6,709,316 - Sun , et al. March 23, 2	2004-03-23
Control of removal profile in electrochemically assisted CMP App 20040053560 - Sun, Lizhong ; et al.	2004-03-18
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus App 20040050817 - Sun, Lizhong ; et al.	2004-03-18
Methods and compositions for chemical mechanical polishing Grant 6,677,239 - Hsu , et al. January 13, 2	2004-01-13
Pad cleaning for a CMP system Grant 6,669,538 - Li , et al. December 30, 2	2003-12-30
Solution to metal re-deposition during substrate planarization Grant 6,653,242 - Sun , et al. November 25, 2	2003-11-25
Method and composition for the removal of residual materials during substrate planarization App 20030216049 - Sun, Lizhong ; et al.	2003-11-20
Fractional-N baseband frequency synthesizer in bluetooth applications App 20030201805 - Holland, William Eric ; et al.	2003-10-30
Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform Grant 6,613,200 - Li , et al. September 2, 2	2003-09-02
Electrochemically assisted chemical polish Grant 6,592,742 - Sun , et al. July 15, 2	2003-07-15
Electro-chemical Plating With Reduced Thickness And Integration With Chemical Mechanical Polisher Into A Single Platform App 20030121797 - Li, Shijian ; et al.	2003-07-03
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP App 20030116445 - Sun, Lizhong ; et al.	2003-06-26
Electrolyte composition and treatment for electrolytic chemical mechanical polishing App 20030116446 - Duboust, Alain ; et al.	2003-06-26
Method and apparatus for face-up substrate polishing App 20030114087 - Duboust, Alain ; et al.	2003-06-19
VCO gain self-calibration for low voltage phase lock-loop applications Grant 6,552,618 - Nelson , et al. April 22, 2	2003-04-22
Methods and compositions for chemical mechanical polishing App 20030040182 - Hsu, Wei-Yung ; et al.	2003-02-27
Method and composition for the selective removal of residual materials and barrier materials during substrate planarization Grant 6,524,167 - Tsai , et al. February 25, 2	2003-02-25
Method and apparatus for chemical mechanical polishing of semiconductor substrates App 20030022501 - Tsai, Stan D. ; et al.	2003-01-30
Selective removal of tantalum-containing barrier layer during metal CMP title App 20030022801 - Sun, Lizhong ; et al.	2003-01-30
Low-noise, fast-lock phase-lock loop with "gearshifting" control App 20030020550 - Nelson, Dale H. ; et al.	2003-01-30
Dual reduced agents for barrier removal in chemical mechanical polishing App 20030013306 - Tsai, Stan D. ; et al.	2003-01-16
Barrier removal at low polish pressure App 20030013387 - Tsai, Stan ; et al.	2003-01-16
Electrochemically assisted chemical polish App 20030010648 - Sun, Lizhong ; et al.	2003-01-16
Low-noise, fast-lock phase-lock loop with "gearshifting" control Grant 6,504,437 - Nelson , et al. January 7, 2	2003-01-07
Method and apparatus for two-step polishing App 20020173221 - Li, Shijian ; et al.	2002-11-21
Composition for metal CMP with low dishing and overpolish insensitivity App 20020148169 - Sun, Lizhong ; et al.	2002-10-17
Method for abrasive-free metal CMP in passivation domain Grant 6,451,697 - Sun , et al. September 17, 2	2002-09-17
Method and apparatus for electrochemical-mechanical planarization App 20020111121 - Sun, Lizhong ; et al.	2002-08-15
Photochemically enhanced chemical polish App 20020104269 - Sun, LIzhong ; et al.	2002-08-08
Abrasive-free metal CMP in passivation domain App 20020092827 - Sun, Lizhong ; et al.	2002-07-18
Tantalum removal during chemical mechanical polishing App 20020090820 - Sun, Lizhong ; et al.	2002-07-11
Pad Cleaning for a CMP system App 20020090896 - Li, Shijian ; et al.	2002-07-11
VCO gain self-calibration for low voltage phase lock-loop applications App 20020075080 - Nelson, Dale H. ; et al.	2002-06-20
Method and composition for the removal of residual materials during substrate planarization App 20020068454 - Sun, Lizhong ; et al.	2002-06-06
Low voltage differential voltage-controlled ring oscillator Grant 6,396,357 - Sun , et al. May 28, 2	2002-05-28
Low Voltage Differential Voltage-controlled Ring Oscillator App 20020057135 - Sun, Lizhong ; et al.	2002-05-16
Method and apparatus for electrochemical-mechanical planarization Grant 6,379,223 - Sun , et al. April 30, 2	2002-04-30
Abrasive-free metal CMP in passivation domain App 20020022370 - Sun, Lizhong ; et al.	2002-02-21
Metal removal system and method for chemical mechanical polishing App 20010052500 - Sun, Lizhong ; et al.	2001-12-20
Elimination Of Pad Glazing For Al Cmp App 20010031558 - SUN, LIZHONG ; et al.	2001-10-18
Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus Grant 6,299,741 - Sun , et al. October 9, 2	2001-10-09
Charge pump for low-voltage, low-jitter phase locked loops Grant 6,278,332 - Nelson , et al. August 21, 2	2001-08-21
High speed wide tuning range multi-phase output ring oscillator Grant 6,075,419 - Sun , et al. June 13, 2	2000-06-13

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