U.S. patent application number 15/463041 was filed with the patent office on 2017-07-06 for lead-free solder composition.
The applicant listed for this patent is Antaya Technologies Corporation. Invention is credited to Joseph C. Gonsalves, Jennie S. Hwang, Alexandra Mary Mackin, John Pereira.
Application Number | 20170190004 15/463041 |
Document ID | / |
Family ID | 45755521 |
Filed Date | 2017-07-06 |
United States Patent
Application |
20170190004 |
Kind Code |
A1 |
Hwang; Jennie S. ; et
al. |
July 6, 2017 |
LEAD-FREE SOLDER COMPOSITION
Abstract
A solder composition includes about 20% to about 25% by weight
tin, about 0.03% to about 3% by weight nickel, about 66% to about
75% by weight indium, and about 0.5% to about 2% by weight silver.
The solder composition can further include about 0.1% to about 8%
by weight antimony, about 0.03% to about 4% by weight copper, about
0.2% to about 6% by weight zinc, and/or about 0.01% to about 0.3%
by weight germanium. The solder composition can be used to solder
an electrical connector to an electrical contact surface on a glass
component.
Inventors: |
Hwang; Jennie S.; (Moreland
Hills, OH) ; Pereira; John; (Rehoboth, MA) ;
Mackin; Alexandra Mary; (West Warwick, RI) ;
Gonsalves; Joseph C.; (North Attleborough, MA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Antaya Technologies Corporation |
Cranston |
RI |
US |
|
|
Family ID: |
45755521 |
Appl. No.: |
15/463041 |
Filed: |
March 20, 2017 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14288962 |
May 28, 2014 |
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15463041 |
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13363618 |
Feb 1, 2012 |
8771592 |
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14288962 |
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61439538 |
Feb 4, 2011 |
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61540213 |
Sep 28, 2011 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
B60R 16/02 20130101;
B23K 35/24 20130101; C22C 28/00 20130101; C22C 1/02 20130101; C03C
27/046 20130101; H05K 3/3457 20130101; B60Y 2410/115 20130101; H05K
1/0306 20130101; B23K 35/26 20130101 |
International
Class: |
B23K 35/26 20060101
B23K035/26; C03C 27/04 20060101 C03C027/04; H05K 3/34 20060101
H05K003/34; C22C 1/02 20060101 C22C001/02; H05K 1/03 20060101
H05K001/03; B60R 16/02 20060101 B60R016/02; C22C 28/00 20060101
C22C028/00 |
Claims
1. A solder composition, comprising: about 20% to about 25% by
weight tin; about 0.03% to about 3% by weight nickel; about 66% to
about 75% by weight indium; and about 0.5% to about 2% by weight
silver.
2. The solder composition in accordance with claim 1, further
comprising about 0.1% to about 8% by weight antimony.
3. The solder composition in accordance with claim 1, further
comprising about 0.03% to about 3% by weight copper.
4. The solder composition in accordance with claim 1, further
comprising about 0.2% to about 6% by weight zinc.
5. The solder composition in accordance with claim 1, further
comprising about 0.01% to about 0.3% by weight germanium.
6. A vehicle glass component, comprising: at least one ply of glass
having an electrically conductive component on at least one
surface; and an electrical connector electrically connected to the
electrically conductive component via a soldered joint, wherein a
solder composition forming the soldered joint comprises: about 20%
to about 25% by weight tin, about 0.03% to about 3% by weight
nickel, about 66% to about 75% by weight indium, and about 0.5% to
about 2% by weight silver.
7. The vehicle glass component in accordance with claim 6, wherein
the solder composition further comprises about 0.1% to about 8% by
weight antimony.
8. The vehicle glass component in accordance with claim 6, wherein
the solder composition further comprises about 0.03% to about 4% by
weight copper.
9. The vehicle glass component in accordance with claim 6, wherein
the solder composition further comprises about 0.2% to about 6% by
weight zinc.
10. The vehicle glass component in accordance with claim 6, wherein
the solder composition further comprises about 0.01% to about 0.3%
by weight germanium.
11. The vehicle glass component in accordance with claim 6, wherein
the electrically conductive component contains silver.
12. A method of mixing indium, nickel, silver, and tin together to
form a solder alloy, said method comprising the steps of: mixing
indium and tin together to form a first molten mixture in amounts
effective to provide about 66% to about 75% by weight indium and
about 20% to about 25% by weight tin in the solder alloy; mixing
nickel and silver together to form a second molten mixture in
amounts effective to provide about 0.03% to about 3% by weight
nickel and about 0.5% to about 2% by weight silver in the solder
alloy; adding the second molten mixture to the first molten
mixture; and mixing the first molten mixture with the second molten
mixture to form the solder alloy.
13. The method in accordance with claim 12, further comprising
adding antimony to the first molten mixture in an amount effective
to provide about 0.1% to about 8% by weight antimony in the solder
alloy.
14. The method in accordance with claim 12, further comprising
adding copper to the second molten mixture in an amount effective
to provide about 0.03% to about 4% by weight copper in the solder
alloy.
15. The method in accordance with claim 12, further comprising
adding zinc to the first molten mixture in an amount effective to
provide about 0.2% to about 6% by weight zinc in the solder
alloy.
16. The method in accordance with claim 12, further comprising
adding germanium to the first molten mixture in an amount effective
to provide about 0.01% to about 0.3% by weight germanium in the
solder alloy.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation application and claims
benefit under 35 U.S.C. .sctn.120 of U.S. patent application Ser.
No. 14/288,962, filed May 28, 2014, which claimed benefit under
U.S.C. .sctn.120 of U.S. patent application Ser. No. 13/363,618,
filed Feb. 1, 2012, now U.S. Pat. No. 8,771,592 which further
claimed benefit under 35 U.S.C. .sctn.119(e) of U.S. Provisional
Application Nos. 61/439,538 and 61/540,213, filed on Feb. 4, 2011
and Sep. 28, 2011 respectively, the entire disclosures of each of
which are hereby incorporated herein by reference.
TECHNICAL FIELD OF THE INVENTION
[0002] The invention generally is directed to a solder
composition.
BACKGROUND OF THE INVENTION
[0003] Windshields and rear windows of vehicles such as automobiles
often include electrical devices located within or on the glass.
Typically, the electrical devices are antennas or defrosters. In
order to provide an electrical connection to such an electrical
device, a small area of metallic coating is applied to the glass to
make the metalized surface which is electrically connected to the
electrical device. An electrical connector is then soldered onto
the metalized surface. The electrical (i.e., power) connector is
commonly soldered to the metalized surface of glass with a solder
that contains lead (Pb). Due to environmental concerns and/or
regulatory mandates in various countries, most industries are
currently using or planning to use non-lead solders in soldering
applications. A common non-lead solder employed in some industries
contains a high tin (Sn) content, such as more than 80% tin.
Non-lead solders used on automotive glass as described herein are
disclosed in U.S. Pat. No. 6,253,988 issued to John Pereira on Jul.
3, 2001 (hereinafter "Pereira"). Among several non-lead solders,
Pereira discloses a solder composition with a weight percentage of
64.35%-65.65% indium (In), 29.7%-30.3% tin (Sn), 4.05%-4.95% silver
(Ag), 0.25%-0.75% copper (Cu) (hereinafter the "65 Indium
Solder").
[0004] There are difficulties encountered when soldering devices to
automotive glass that are not present in other applications.
Automotive glass tends to be brittle, and the common high tin,
non-lead solders that are suitable for use in other applications
can typically cause cracking of the automotive glass. Although
materials such as ceramics and silicon might appear to be similar
in some respects to automotive glass, some solders that are
suitable for soldering to ceramic or silicon devices are not
suitable for soldering to automotive glass. Soldering two materials
with a substantial difference in coefficient of thermal expansion
(CTE) between them, such as glass and copper in this case, imposes
stress on the solder, either during cooling of the solder joint, or
during subsequent temperature excursions. The solder composition
needs to have a melting point (liquidus) that is low enough to not
cause cracking of the automotive glass during the soldering
process, because a higher melting point and correspondingly higher
processing temperature augments the adverse effects of CTE
mismatch, imposing higher stress during cooling. The melting point
of the solder composition, however, needs to be high enough not to
melt during the normal use of a car, for example, when the car is
in the sun with the windows closed or under other extreme harsh
environmental conditions. Solders that contain indium, however,
normally have much lower melting points than other solders. The 65
Indium Solder, for example, has a solidus temperature of
109.degree. C., compared to 160.degree. C. of the lead solder, and
a liquidus temperature of 127.degree. C., compared to 224.degree.
C. of the lead solder. Some vehicle manufacturers desire that glass
products should be capable of surviving elevated temperatures, for
example 110.degree. C. for one original equipment manufacturer
(OEM) and 120.degree. C. for another, without any deterioration in
performance.
[0005] Therefore, there is a need for a non-lead solder composition
suitable for use on glass that can withstand higher elevated
temperatures than compositions currently available, while
delivering all other desired properties for this application
sector.
BRIEF SUMMARY OF THE INVENTION
[0006] One embodiment includes about 4% to about 25% by weight tin,
about 0.1% to about 8% by weight antimony, about 0.03% to about 4%
by weight copper, about 0.03% to about 4% by weight nickel about
66% to about 90% by weight indium, and about 0.5% to about 9% by
weight silver. The solder composition can have a solidus
temperature in a range of between about 120.degree. C. and about
145.degree. C., and a liquidus temperature in a range of between
130.degree. C. and about 155.degree. C.
[0007] In certain embodiments, the composition further includes
about 0.2% to about 6% by weight zinc. In certain other
embodiments, the composition further includes about 0.01% to about
0.3% by weight germanium. In these specific embodiments, the
composition can include about 70% to about 86% by weight
indium.
[0008] In some embodiments, the composition includes about 7% to
about 19% by weight tin, about 0.2% to about 8% by weight antimony,
about 0.1% to about 1.5% by weight copper, about 0.1% to about 4%
by weight nickel, about 70% to about 80% by weight indium, and
about 4% to about 8% by weight silver.
[0009] In some other embodiments, the composition includes about 4%
to about 20% by weight tin, about 0.1% to about 8% by weight
antimony, about 0.1% to about 4% by weight copper, about 0.1% to
about 3% by weight nickel about 71% to about 86% by weight indium,
and about 1% to about 6% by weight silver.
[0010] In still other embodiments, the composition includes about
11% to about 17% by weight tin, about 0.5% to about 3% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 0.5% to
about 5% by weight nickel, about 72% to about 77% by weight indium,
about 4% to about 8.5% by weight silver, and about 0.3% to about
1.5% by weight zinc. In these specific embodiments, the composition
can include about 13% to about 15% by weight tin, about 0.5% to
about 2.5% by weight antimony, about 0.5% to about 1.5% by weight
copper, about 1% to about 4% by weight nickel, about 74% to about
75% by weight indium, about 5% to about 8.5% by weight silver, and
about 0.3% to about 1.5% by weight zinc. Examples of these specific
embodiments can include about 15% by weight tin, about 0.5% to
about 1.5% by weight antimony, about 0.5% to about 1.5% by weight
copper, about 1% by weight nickel, about 75% by weight indium,
about 6% by weight silver, and about 0.5% to about 1.5% by weight
zinc, such as about 15% by weight tin, about 1% by weight antimony,
about 1% by weight copper, about 1% by weight nickel, about 75% by
weight indium, about 6% by weight silver, and about 1% by weight
zinc. Other examples of these specific embodiments can include
about 14% by weight tin, about 0.5% to about 1.5% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 3% by
weight nickel, about 75% by weight indium, about 5% by weight
silver, and about 0.5% to about 1.5% by weight zinc, such as about
14% by weight tin, about 1% by weight antimony, about 1% by weight
copper, about 3% by weight nickel, about 75% by weight indium,
about 5% by weight silver, and about 1% by weight zinc. Still other
examples of these specific embodiments can include about 13% by
weight tin, about 1.5% to about 2.5% by weight antimony, about 0.5%
to about 1.5% by weight copper, about 4% by weight nickel, about
74% by weight indium, about 5% by weight silver, and about 0.5% to
about 1.5% by weight zinc, such as about 13% by weight tin, about
2% by weight antimony, about 1% by weight copper, about 4% by
weight nickel, about 74% by weight indium, about 5% by weight
silver, and about 1% by weight zinc.
[0011] In yet other embodiments, the composition consists
essentially of about 11% to about 17% by weight tin, about 0.5% to
about 3% by weight antimony, about 0.5% to about 1.5% by weight
copper, about 0.5% to about 5% by weight nickel, about 72% to about
77% by weight indium, about 4% to about 8.5% by weight silver, and
about 0.3% to about 1.5% by weight zinc. In these specific
embodiments, the composition can consist essentially of about 13%
to about 15% by weight tin, about 0.5% to about 2.5% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 1% to
about 4% by weight nickel, about 74% to about 75% by weight indium,
about 5% to about 8.5% by weight silver, and about 0.3% to about
1.5% by weight zinc. Examples of these specific embodiments can
consist essentially of about 15% by weight tin, about 0.5% to about
1.5% by weight antimony, about 0.5% to about 1.5% by weight copper,
about 1% by weight nickel, about 75% by weight indium, about 6% by
weight silver, and about 0.5% to about 1.5% by weight zinc, such as
about 15% by weight tin, about 1% by weight antimony, about 1% by
weight copper, about 1% by weight nickel, about 75% by weight
indium, about 6% by weight silver, and about 1% by weight zinc.
Other examples of these specific embodiments can consist
essentially of about 14% by weight tin, about 0.5% to about 1.5% by
weight antimony, about 0.5% to about 1.5% by weight copper, about
3% by weight nickel, about 75% by weight indium, about 5% by weight
silver, and about 0.5% to about 1.5% by weight zinc, such as about
14% by weight tin, about 1% by weight antimony, about 1% by weight
copper, about 3% by weight nickel, about 75% by weight indium,
about 5% by weight silver, and about 1% by weight zinc. Still other
examples of these specific embodiments can consist essentially of
about 13% by weight tin, about 1.5% to about 2.5% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 4% by
weight nickel, about 74% by weight indium, about 5% by weight
silver, and about 0.5% to about 1.5% by weight zinc, such as about
13% by weight tin, about 2% by weight antimony, about 1% by weight
copper, about 4% by weight nickel, about 74% by weight indium,
about 5% by weight silver, and about 1% by weight zinc. In these
specific embodiments, the solder composition can have a solidus
temperature in a range of between about 120.degree. C. and about
145.degree. C., such as in a range of between about 120.degree. C.
and about 135.degree. C., and a liquidus temperature in a range of
between 130.degree. C. and about 155.degree. C., such as in a range
of between about 130.degree. C. and about 145.degree. C.
[0012] The invention is also directed to an electrical connection
on a glass component that includes a glass component, an electrical
contact surface containing silver on the glass component, and an
electrical connector soldered to the electrical contact surface on
the glass component with a layer of a solder composition having a
mixture of elements comprising about 4% to about 25% by weight tin,
about 0.1% to about 8% by weight antimony, about 0.03% to about 4%
by weight copper, about 0.03% to about 4% by weight nickel, about
66% to about 90% by weight indium, and about 0.5% to about 9% by
weight silver. In other embodiments, an electrical connection on a
glass component includes a glass component, an electrical contact
surface containing silver on the glass component, and an electrical
connector soldered to the electrical contact surface on the glass
component with a layer of a solder composition consisting
essentially of about 4% to about 25% by weight tin, about 0.1% to
about 8% by weight antimony, about 0.03% to about 4% by weight
copper, about 0.03% to about 4% by weight nickel, about 66% to
about 90% by weight indium, and about 0.5% to about 9% by weight
silver.
[0013] The invention is also directed to a method of forming the
solder composition that includes mixing indium, nickel, copper,
silver, antimony, and tin together to form an alloy that includes
about 4% to about 25% by weight tin, about 0.1% to about 8% by
weight antimony, about 0.03% to about 4% by weight copper, about
0.03% to about 4% be weight nickel, about 66% to about 90% by
weight indium, and about 0.5% to about 9% by weight silver. In some
embodiments, the indium and tin are mixed together in a first
molten mixture, and at least nickel, copper and silver are mixed
together in solution in a second mixture which is added to the
first molten mixture. In other embodiments, the tin and nickel are
mixed together in a molten mixture, and at least copper, indium,
and silver are then added to the molten mixture. In these specific
embodiments, zinc can be added after all other metals have been
added to the molten mixture.
[0014] In some embodiments, tin is mixed in a proportion of about
7% to about 19% by weight, antimony is mixed in a proportion of
about 0.2% to about 8% by weight, copper is mixed in a proportion
of about 0.1% to about 1.5% by weight, nickel is mixed in a
proportion of about 0.1% to about 4% by weight, indium is mixed in
a proportion of about 70% to about 80% by weight, and silver is
mixed in a proportion of about 4% to about 8% by weight.
[0015] In other embodiments, a method of forming the solder
composition includes mixing indium, nickel, copper, zinc, silver,
antimony, and tin together to form an alloy that includes about 11%
to about 17% by weight tin, about 0.5% to about 3% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 0.5% to
about 5% by weight nickel, about 72% to about 77% by weight indium,
about 4% to about 8% by weight silver, and about 0.5% to about 1.5%
by weight zinc. In these specific embodiments, the composition can
include about 13% to about 15% by weight tin, about 0.5% to about
2.5% by weight antimony, about 0.5% to about 1.5% by weight copper,
about 1% to about 4% by weight nickel, about 74% to about 75% by
weight indium, about 5% to about 6% by weight silver, and about
0.5% to about 1.5% by weight zinc. Examples of these specific
embodiments can include about 15% by weight tin, about 0.5% to
about 1.5% by weight antimony, about 0.5% to about 1.5% by weight
copper, about 1% by weight nickel, about 75% by weight indium,
about 6% by weight silver, and about 0.5% to about 1.5% by weight
zinc, such as about 15% by weight tin, about 1% by weight antimony,
about 1% by weight copper, about 1% by weight nickel, about 75% by
weight indium, about 6% by weight silver, and about 1% by weight
zinc. Other examples of these specific embodiments can include
about 14% by weight tin, about 0.5% to about 1.5% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 3% by
weight nickel, about 75% by weight indium, about 5% by weight
silver, and about 0.5% to about 1.5% by weight zinc, such as about
14% by weight tin, about 1% by weight antimony, about 1% by weight
copper, about 3% by weight nickel, about 75% by weight indium,
about 5% by weight silver, and about 1% by weight zinc. Still other
examples of these specific embodiments can include about 13% by
weight tin, about 1.5% to about 2.5% by weight antimony, about 0.5%
to about 1.5% by weight copper, about 4% by weight nickel, about
74% by weight indium, about 5% by weight silver, and about 0.5% to
about 1.5% by weight zinc, such as about 13% by weight tin, about
2% by weight antimony, about 1% by weight copper, about 4% by
weight nickel, about 74% by weight indium, about 5% by weight
silver, and about 1% by weight zinc.
[0016] In addition to providing environmentally friendly lead-free
materials, the solder compositions of the invention have many
advantages, such as providing a lead-free composition that can be
used on automotive glass, delivering necessary mechanical
properties in both strength and ductility and withstanding desired
elevated service temperatures, while retaining the desired low
manufacturing process temperature.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING
[0017] The foregoing will be apparent from the following more
particular description of example embodiments of the invention, as
illustrated in the accompanying drawings in which like reference
characters refer to the same parts throughout the different views.
The drawings are not necessarily to scale, emphasis instead being
placed upon illustrating embodiments of the present invention.
[0018] FIG. 1 is an inside view of a rear window of an automobile
including an electrically operated defroster.
[0019] FIG. 2 is a side view of an electrical connector soldered to
an electrical contact on the rear window of FIG. 1, with the rear
window, electrical contact and solder being shown in section.
[0020] FIG. 3A is a schematic illustration of a flow chart of a
method of forming embodiments of solder compositions in the
invention.
[0021] FIG. 3B is a schematic illustration of a flow chart of
another method of forming embodiments of solder compositions in the
invention.
[0022] FIGS. 4A and 4B are schematic illustrations of power
connectors that can be soldered with solder compositions of the
invention.
[0023] FIG. 5 is a schematic illustration of a power connector
soldered onto a windshield with solder compositions of the
invention.
[0024] FIG. 6 is a schematic illustration of a windshield assembly
employing solder compositions of the invention.
[0025] FIG. 7 is a graph of temperature as a function of time
during one cycle of a temperature cycling test of embodiments of
solder compositions of the invention.
[0026] FIG. 8 is a schematic illustration of a pull test employing
a force gauge to test the performance of solder compositions of the
invention.
[0027] FIG. 9 is a schematic illustration of a pull test employing
a weight to test the performance of solder compositions of the
invention.
DETAILED DESCRIPTION OF THE INVENTION
[0028] The present invention provides a solder composition that is
suitable for soldering electrical components to glass for
electrically connecting to electrical devices within or on the
glass. Referring to FIG. 1, the rear window 10 of an automobile
(also called a backlight, e.g., in Europe) is employed as an
illustrative example. Window (glass component) 10 includes a window
defroster 12 consisting of electrically resistive defrosting lines
14 embedded within or deposited on the inner surface of window 10.
The defrosting lines 14 are electrically connected to a pair of
electrical contact strips (electrical contact surfaces, also
referred to as buss bars) 16 located on the inner surface of window
10. The electrical contact strips 16 consist of a conductive
coating deposited on the inner surface of window 10. Typically,
electrical contact strips 16 are formed from silver-containing
material.
[0029] There are difficulties encountered when soldering devices to
automotive glass that are not present in other applications. To
address some concerns of the original equipment manufacturers
(OEMs) regarding use of non-lead solders on automotive glass,
automotive glass suppliers such as CLEPA (European Association of
Automotive Suppliers) have developed several tests, including
temperature cycling, constant climactic humidity, climactic
temperature with humidity, and high temperature storage. To address
the concerns of the OEMs over the melting point of the solder, one
test included samples of glass soldered to connectors with the 65
Indium Solder that were stored at 105.degree. C. for 500 hours,
during which time weights of 500 grams were hung from each of the
connectors, yet no connectors detached from the glass during the
test period. The OEMs, such as the European Automobile
Manufacturers' Association (ACEA), proposed, however, those
temperatures could possibly be as high as 115.degree. C. to
120.degree. C.
[0030] The solder composition of the present invention was
developed to address the above mentioned concerns of the OEMs.
Referring to FIG. 2, the layer of solder composition 20 of the
present invention is employed to solder an electrical (i.e., power)
connector 18 to each electrical contact strip (i.e., buss bar) 16
on window 10, using standard soldering techniques, such as a
resistance soldering device, or flame, micro-flame, hot iron, hot
air, and induction heating. Soldering can be conducted in an
ambient air atmosphere, without the need for an inert gas
environment. Power lines 22 can then be electrically connected to
electrical connectors 18 to provide power to window defroster 12
(FIG. 1). Solder performance test and results are provided
below.
[0031] In one embodiment, the present solder composition 20
includes about 4% to about 25% by weight tin, about 0.1% to about
8% by weight antimony, about 0.03% to about 4% by weight copper,
about 0.03% to about 4% by weight nickel, about 66% to about 90% by
weight indium, and about 0.5% to about 9% by weight silver.
[0032] In some embodiments, the composition 20 includes about 1% to
about 7% by weight silver. In certain embodiments, the composition
20 includes about 0.2% to about 8% by weight antimony. In other
embodiments, the composition 20 includes about 3% to about 7% by
weight silver. In still other embodiments, the composition 20
includes about 1% to about 4% by weight silver.
[0033] In certain embodiments, the composition 20 further includes
about 0.2% to about 6% by weight zinc. In certain other
embodiments, the composition 20 further includes about 0.3% to
about 6% by weight zinc. In still other embodiments, the
composition 20 further includes about 3% to about 5% by weight
zinc.
[0034] In certain other embodiments, the composition 20 further
includes about 0.01% to about 0.3% by weight germanium. In these
specific embodiments, the composition 20 can include about 70% to
about 86% by weight indium.
[0035] In some embodiments, the composition 20 includes about 7% to
about 19% by weight tin, about 0.2% to about 8% by weight antimony,
about 0.1% to about 1.5% by weight copper, about 0.1% to about 4%
by weight nickel, about 70% to about 80% by weight indium, and
about 4% to about 8% by weight silver.
[0036] In certain embodiments, the composition 20 includes about
74% to about 78% by weight indium. In these specific embodiments,
the composition 20 can include about 5% to about 10% by weight tin,
or about 12% to about 19% by weight tin, or about 12% to about 16%
by weight tin. In certain other embodiments, the composition 20
includes about 74% to about 80% by weight indium. In still other
embodiments, the composition 20 includes about 0.1% to about 3% by
weight nickel. In yet other embodiments, the composition 20
includes about 0.2% to about 5% by weight antimony.
[0037] In still other embodiments, the composition 20 includes
about 11% to about 17% by weight tin, about 0.5% to about 3% by
weight antimony, about 0.5% to about 1.5% by weight copper, about
0.5% to about 5% by weight nickel, about 72% to about 77% by weight
indium, about 4% to about 7% by weight silver, and about 0.5% to
about 1.5% by weight zinc. In these specific embodiments, the
composition 20 can include about 13% to about 15% by weight tin,
about 0.5% to about 2.5% by weight antimony, about 0.5% to about
1.5% by weight copper, about 1% to about 4% by weight nickel, about
74% to about 75% by weight indium, about 5% to about 6% by weight
silver, and about 0.5% to about 1.5% by weight zinc. Examples of
these specific embodiments can include about 15% by weight tin,
about 0.5% to about 1.5% by weight antimony, about 0.5% to about
1.5% by weight copper, about 1% by weight nickel, about 75% by
weight indium, about 6% by weight silver, and about 0.5% to about
1.5% by weight zinc, such as about 15% by weight tin, about 1% by
weight antimony, about 1% by weight copper, about 1% by weight
nickel, about 75% by weight indium, about 6% by weight silver, and
about 1% by weight zinc. Other examples of these specific
embodiments can include about 14% by weight tin, about 0.5% to
about 1.5% by weight antimony, about 0.5% to about 1.5% by weight
copper, about 3% by weight nickel, about 75% by weight indium,
about 5% by weight silver, and about 0.5% to about 1.5% by weight
zinc, such as about 14% by weight tin, about 1% by weight antimony,
about 1% by weight copper, about 3% by weight nickel, about 75% by
weight indium, about 5% by weight silver, and about 1% by weight
zinc. Still other examples of these specific embodiments can
include about 13% by weight tin, about 1.5% to about 2.5% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 4% by
weight nickel, about 74% by weight indium, about 5% by weight
silver, and about 0.5% to about 1.5% by weight zinc, such as about
13% by weight tin, about 2% by weight antimony, about 1% by weight
copper, about 4% by weight nickel, about 74% by weight indium,
about 5% by weight silver, and about 1% by weight zinc.
[0038] The solder composition 20 can have a solidus temperature in
a range of between about 120.degree. C. and about 145.degree. C.,
and a liquidus temperature in a range of between 130.degree. C. and
about 155.degree. C. The solidus temperature is practically defined
as the temperature at which an alloy begins to melt. Below the
solidus temperature, the substance is completely solid, without
molten phase. The liquidus temperature is the maximum temperature
at which crystals (unmolten metal or alloy) can co-exist with the
melt. Above the liquidus temperature, the material is homogeneous,
consisting of melt only. The solder processing temperature is
higher than the liquidus temperature, by a number of degrees that
is determined by the soldering technique.
[0039] In a specific embodiment, the composition 20 includes about
14% to about 16% by weight tin, about 0.5% to about 1.5% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 0.5% to
about 1.5% by weight nickel, about 74% to about 76% by weight
indium, and about 6% to about 8% by weight silver, such as about
15% by weight tin, about 1.0% by weight antimony, about 1.0% by
weight copper, about 1.0% by weight nickel, about 75% by weight
indium, and about 7% by weight silver. Other compositions in this
embodiment can include about 14% to about 21% by weight tin, about
0.2% to about 3% by weight antimony, about 0.1% to about 4.0% by
weight copper, about 0.1% to about 3.0% by weight nickel, about 72%
to about 80% by weight indium, and about 1% to about 8% by weight
silver.
[0040] In a second specific embodiment, the composition 20 includes
about 14% to about 16% by weight tin, about 2% to about 4% by
weight antimony, about 0.5% to about 1.5% by weight copper, about
0.5% to about 1.5% by weight nickel, about 74% to about 76% by
weight indium, and about 4% to about 6% by weight silver, such as
about 15% by weight tin, about 3.0% by weight antimony, about 1.0%
by weight copper, about 1.0% by weight nickel, about 75% by weight
indium, and about 5% by weight silver.
[0041] In a third specific embodiment, the composition 20 includes
about 12% to about 14% by weight tin, about 2% to about 4% by
weight antimony, about 0.5% to about 1.5% by weight copper, about
2% to about 4% by weight nickel, about 74% to about 76% by weight
indium, and about 4% to about 6% by weight silver, such as about
13% by weight tin, about 3.0% by weight antimony, about 1.0% by
weight copper, about 3.0% by weight nickel, about 75% by weight
indium, and about 5% by weight silver, or about 14% by weight tin,
about 3.0% by weight antimony, about 1.0% by weight copper, about
2.0% by weight nickel, about 75% by weight indium, and about 5% by
weight silver.
[0042] In a fourth specific embodiment, the composition 20 includes
about 7% to about 9% by weight tin, about 4% to about 6% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 2% to
about 4% by weight nickel, about 74% to about 76% by weight indium,
about 4% to about 6% by weight silver, and about 2% to about 4% by
weight zinc, such as about 8% by weight tin, about 5.0% by weight
antimony, about 1.0% by weight copper, about 3.0% by weight nickel,
about 75% by weight indium, about 5% by weight silver, and about
3.0% by weight zinc.
[0043] In a fifth specific embodiment, the composition 20 includes
about 7% to about 9% by weight tin, about 4% to about 6% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 0.5% to
about 1.5% by weight nickel, about 74% to about 76% by weight
indium, about 4% to about 6% by weight silver, and about 4% to
about 6% by weight zinc, such as about 8% by weight tin, about 5.0%
by weight antimony, about 1.0% by weight copper, about 1.0% by
weight nickel, about 75% by weight indium, about 5% by weight
silver, and about 5.0% by weight zinc.
[0044] In a sixth specific embodiment, the composition 20 includes
about 7% to about 9% by weight tin, about 4% to about 6% by weight
antimony, about 0.5% to about 1.5% by weight copper, about 2% to
about 4% by weight nickel, about 74% to about 76% by weight indium,
about 4% to about 6% by weight silver, about 2% to about 4% by
weight zinc, and about 0.05% to about 0.2% by weight germanium,
such as about 8% by weight tin, about 4.9% by weight antimony,
about 1.0% by weight copper, about 3.0% by weight nickel, about 75%
by weight indium, about 5% by weight silver, about 3.0% by weight
zinc, and about 0.1% by weight germanium.
[0045] In some other embodiments, the composition 20 includes about
4% to about 20% by weight tin, about 0.2% to about 8% by weight
antimony, about 0.1% to about 4% by weight copper, about 0.1% to
about 3% by weight nickel, about 71% to about 86% by weight indium,
and about 1% to about 6% by weight silver. In certain embodiments,
the composition 20 includes about 10% to about 19% by weight tin.
In certain other embodiments, the composition 20 includes about 74%
to about 80% by weight indium. In these specific embodiments, the
composition 20 can include about 1% to about 7% by weight silver.
In some embodiments, the composition 20 can include about 3.5% by
weight copper. In certain other embodiments, the composition 20
includes about 0.1% to about 1% by weight nickel. In still other
embodiments, the composition 20 includes about 1% to about 2% by
weight nickel. In yet other embodiments, the composition 20
includes about 0.2% to about 2% by weight antimony. In still other
embodiments, the composition 20 includes about 2% to about 6% by
weight antimony.
[0046] In a seventh specific embodiment, the composition 20
includes about 18% to about 20% by weight tin, about 0.2% to about
1.0% by weight antimony, about 0.1% to about 1.0% by weight copper,
about 0.1% to about 1.0% by weight nickel, about 77% to about 80%
by weight indium, and about 1% to about 3% by weight silver, such
as about 18.99% by weight tin, about 0.24% by weight antimony,
about 0.18% by weight copper, about 0.30% by weight nickel, about
78.70% by weight indium, and about 1.48% by weight silver. The
melting point or temperature (liquidus) of this specific embodiment
was about 135.degree. C. and the solidus was about 124.degree.
C.
[0047] In an eighth specific embodiment, the composition 20
includes about 13% to about 16% by weight tin, about 1.0% to about
3.0% by weight antimony, about 3.0% to about 4.0% by weight copper,
about 0.2% to about 1.5% by weight nickel, about 74% to about 76%
by weight indium, and about 3% to about 5% by weight silver, such
as about 14.77% by weight tin, about 1.93% by weight antimony,
about 3.50% by weight copper, about 0.60% by weight nickel, about
74.91% by weight indium, and about 3.87% by weight silver. The
melting point or temperature (liquidus) of this specific embodiment
was about 135.degree. C. and the solidus was about 123.degree.
C.
[0048] In a ninth specific embodiment, the composition 20 includes
about 11% to about 14% by weight tin, about 2.0% to about 4% by
weight antimony, about 0.5% to about 2% by weight copper, about
1.0% to about 3% by weight nickel, about 76% to about 79% by weight
indium, and about 2% to about 5% by weight silver, such as about
12.68% by weight tin, about 2.91% by weight antimony, about 1.22%
by weight copper, about 1.87% by weight nickel, about 77.30% by
weight indium, and about 3.54% by weight silver. The melting point
or temperature (liquidus) of this specific embodiment was about
138.degree. C. and the solidus was about 127.degree. C.
[0049] In a tenth specific embodiment, the composition 20 includes
about 6% to about 9% by weight tin, about 3.0% to about 5% by
weight antimony, about 0.5% to about 1.5% by weight copper, about
1.0% to about 3% by weight nickel, about 76% to about 79% by weight
indium, about 4% to about 6% by weight silver, and about 2% to
about 4% by weight zinc, such as about 7.66% by weight tin, about
3.75% by weight antimony, about 0.92% by weight copper, about 1.88%
by weight nickel, about 77.30% by weight indium, about 5.21% by
weight silver, and about 3.17% by weight zinc. The melting point or
temperature (liquidus) of this specific embodiment was about
143.4.degree. C. and the solidus was about 129.degree. C.
[0050] In an eleventh specific embodiment, the composition 20
includes about 7% to about 9% by weight tin, about 4% to about 6%
by weight antimony, about 0.2% to about 1.0% by weight copper,
about 0.2% to about 1.5% by weight nickel, about 73% to about 76%
by weight indium, about 4% to about 6% by weight silver, and about
4% to about 6% by weight zinc, such as about 8.45% by weight tin,
about 5.42% by weight antimony, about 0.40% by weight copper, about
0.54% by weight nickel, about 74.21% by weight indium, about 5.54%
by weight silver, and about 4.86% by weight zinc. The melting point
or temperature (liquidus) of this specific embodiment was about
139.4.degree. C. and the solidus was about 127.degree. C.
[0051] In a twelfth specific embodiment, the composition 20
includes about 4% to about 6% by weight tin, about 1.0% to about
2.0% by weight antimony, about 0.1% to about 2% by weight copper,
about 0.1% to about 1.0% by weight nickel, about 84% to about 86%
by weight indium, about 1% to about 2% by weight silver, about 0.2%
to about 1% by weight zinc, and less than about 0.001% to about
0.15% by weight germanium, such as about 5.31% by weight tin, about
1.52% by weight antimony, about 1.07% by weight copper, about 0.15%
by weight nickel, about 85.56% by weight indium, about 1.45% by
weight silver, about 0.46% by weight zinc, and less than about
0.001% by weight germanium. The melting point or temperature
(liquidus) of this specific embodiment was about 140.degree. C. and
the solidus was about 132.4.degree. C.
[0052] In a thirteenth specific embodiment, the composition 20
includes about 18% to about 20% by weight tin, about 0.2% to about
2% by weight antimony, about 0.1% to about 4.0% by weight copper,
about 0.1% to about 3.0% by weight nickel, about 72% to about 75%
by weight indium, and about 1% to about 4% by weight silver, such
as about 19.49% by weight tin, about 1.03% by weight antimony,
about 2.84% by weight copper, about 1.26% by weight nickel, about
73.62% by weight indium, and about 2.79% by weight silver. The
melting point or temperature (liquidus) of this specific embodiment
was about 134.71.degree. C. and the solidus was about
123.74.degree. C.
[0053] In a fourteenth specific embodiment, the composition 20
includes about 16% to about 19% by weight tin, about 3.0% to about
6.0% by weight antimony, about 2.0% to about 4.0% by weight copper,
about 0.5% to about 3.0% by weight nickel, about 70% to about 73%
by weight indium, and about 1% to about 4% by weight silver, such
as about 18.23% by weight tin, about 4.57% by weight antimony,
about 2.7% by weight copper, about 1.49% by weight nickel, about
71.05% by weight indium, and about 2.60% by weight silver. The
melting point or temperature (liquidus) of this specific embodiment
was about 135.52.degree. C. and the solidus was about
122.98.degree. C.
[0054] In a fifteenth specific embodiment, the composition 20
includes about 15% to about 18% by weight tin, about 1.0% to about
4% by weight antimony, about 1.5% to about 3.5% by weight copper,
about 1.0% to about 4% by weight nickel, about 71% to about 75% by
weight indium, and about 2% to about 5% by weight silver, such as
about 16.95% by weight tin, about 2.69% by weight antimony, about
2.4% by weight copper, about 2.82% by weight nickel, about 72.84%
by weight indium, and about 3.31% by weight silver. The melting
point or temperature (liquidus) of this specific embodiment was
about 139.01.degree. C. and the solidus was about 125.39.degree.
C.
[0055] In a sixteenth specific embodiment, the composition 20
includes about 7% to about 11% by weight tin, about 3.0% to about
5% by weight antimony, about 1.5% to about 3.5% by weight copper,
about 0.5% to about 3% by weight nickel, about 79% to about 82% by
weight indium, about 1.0% to about 4% by weight silver, and about
0.01% to about 1% by weight zinc, such as about 9.02% by weight
tin, about 4.12% by weight antimony, about 2.21% by weight copper,
about 1.09% by weight nickel, about 80.12% by weight indium, about
2.80% by weight silver, and about 0.05% by weight zinc. The melting
point or temperature (liquidus) of this specific embodiment was
about 142.11.degree. C. and the solidus was about 130.91.degree.
C.
[0056] In a seventeenth specific embodiment, the composition 20
includes about 9% to about 12% by weight tin, about 4% to about 6%
by weight antimony, about 1.5% to about 3.5% by weight copper,
about 0.5% to about 3.0% by weight nickel, about 75% to about 78%
by weight indium, about 1% to about 3% by weight silver, and about
0.01% to about 1% by weight zinc, such as about 10.69% by weight
tin, about 5.32% by weight antimony, about 2.58% by weight copper,
about 1.55% by weight nickel, about 76.03% by weight indium, about
2.11% by weight silver, and about 0.05% by weight zinc. The melting
point or temperature (liquidus) of this specific embodiment was
about 140.37.degree. C. and the solidus was about 126.93.degree.
C.
[0057] In an eighteenth specific embodiment, the composition 20
includes about 8% to about 10% by weight tin, about 2.0% to about
5.0% by weight antimony, about 2% to about 4% by weight copper,
about 0.5% to about 3.0% by weight nickel, about 79% to about 82%
by weight indium, about 2% to about 4% by weight silver, about
0.01% to about 1% by weight zinc, and less than about 0.001% to
about 0.15% by weight germanium, such as about 9.03% by weight tin,
about 3.43% by weight antimony, about 3% by weight copper, about
0.95% by weight nickel, about 80.57% by weight indium, about 3.32%
by weight silver, about 0.1% by weight zinc, and less than about
0.001% Germanium. The melting point or temperature (liquidus) of
this specific embodiment was about 141.67.degree. C. and the
solidus was about 130.30.degree. C.
[0058] In a nineteenth specific embodiment, the composition 20
includes about 10% to about 14% by weight tin, about 0.5% to about
1.5% by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 73% to about 77%
by weight indium, about 5% to about 9% by weight silver, and about
2% to about 4% by weight zinc, such as about 12% by weight tin,
about 1% by weight antimony, about 1% by weight copper, about 1% by
weight nickel, about 75% by weight indium, about 7% by weight
silver, and about 3% by weight zinc.
[0059] In a twentieth specific embodiment, the composition 20
includes about 6% to about 10% by weight tin, about 3% to about 7%
by weight antimony, about 0.5% to about 1.5% by weight copper,
about 2% to about 4% by weight nickel, about 73% to about 77% by
weight indium, about 3% to about 7% by weight silver, and about 2%
to about 4% by weight zinc, such as about 8% by weight tin, about
5% by weight antimony, about 1% by weight copper, about 3% by
weight nickel, about 75% by weight indium, about 5% by weight
silver, and about 3% by weight zinc.
[0060] In a twenty-first specific embodiment, the composition 20
includes about 12% to about 16% by weight tin, about 0.5% to about
1.5% by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 0.5% to about 1.5%
by weight zinc, about 73% to about 77% by weight indium, and about
5% to about 9% by weight silver, such as about 14% by weight tin,
about 1% by weight antimony, about 1% by weight copper, about 1% by
weight nickel, about 1% by weight zinc, about 75% by weight indium,
and about 7% by weight silver.
[0061] In a twenty-second specific embodiment, the composition 20
includes about 20% to about 24% by weight tin, about 0.5% to about
1.5% by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 66% to about 70%
by weight indium, and about 5% to about 9% by weight silver, such
as about 22% by weight tin, about 1% by weight antimony, about 1%
by weight copper, about 1% by weight nickel, about 68% by weight
indium, and about 7% by weight silver.
[0062] In a twenty-third specific embodiment, the composition 20
includes about 18% to about 22% by weight tin, about 0.5% to about
1.5% by weight antimony, about 2% to about 4% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 66% to about 70%
by weight indium, and about 5% to about 9% by weight silver, such
as about 20% by weight tin, about 1% by weight antimony, about 3%
by weight copper, about 1% by weight nickel, about 68% by weight
indium, and about 7% by weight silver.
[0063] In a twenty-fourth specific embodiment, the composition 20
includes about 12% to about 16% by weight tin, about 1% to about 3%
by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 73% to about 77%
by weight indium, and about 5% to about 9% by weight silver, such
as about 14% by weight tin, about 2% by weight antimony, about 1%
by weight copper, about 1% by weight nickel, about 75% by weight
indium, and about 7% by weight silver.
[0064] In a twenty-fifth specific embodiment, the composition 20
includes about 11% to about 15% by weight tin, about 2% to about 4%
by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 73% to about 77%
by weight indium, and about 5% to about 9% by weight silver, such
as about 13% by weight tin, about 3% by weight antimony, about 1%
by weight copper, about 1% by weight nickel, about 75% by weight
indium, and about 7% by weight silver.
[0065] In a twenty-sixth specific embodiment, the composition 20
includes about 14% to about 18% by weight tin, about 2% to about 4%
by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 70% to about 74%
by weight indium, and about 5% to about 9% by weight silver, such
as about 16% by weight tin, about 3% by weight antimony, about 1%
by weight copper, about 1% by weight nickel, about 72% by weight
indium, and about 7% by weight silver.
[0066] In a twenty-seventh specific embodiment, the composition 20
includes about 18% to about 22% by weight tin, about 2% to about 4%
by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 66% to about 70%
by weight indium, and about 5% to about 9% by weight silver, such
as about 20% by weight tin, about 3% by weight antimony, about 1%
by weight copper, about 1% by weight nickel, about 68% by weight
indium, and about 7% by weight silver.
[0067] In a twenty-eighth specific embodiment, the composition 20
includes about 13% to about 17% by weight tin, about 0.5% to about
1.5% by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 73% to about 77%
by weight indium, and about 5% to about 9% by weight silver, such
as about 15% by weight tin, about 1% by weight antimony, about 1%
by weight copper, about 1% by weight nickel, about 75% by weight
indium, and about 7% by weight silver.
[0068] In a twenty-ninth specific embodiment, the composition 20
includes about 13% to about 17% by weight tin, about 0.5% to about
1.5% by weight antimony, about 0.5% to about 1.5% by weight copper,
about 0.5% to about 1.5% by weight nickel, about 0.5% to about 1.5%
by weight zinc, about 73% to about 77% by weight indium, and about
5% to about 8.5% by weight silver, such as about 14.05% by weight
tin, about 0.98% by weight antimony, about 0.87% by weight copper,
about 0.70% by weight nickel, about 0.63% by weight zinc, about
74.74% by weight indium, and about 7.98% by weight silver. The
melting point or temperature (liquidus) of this solder composition
was about 133.18.degree. C. and the solidus was about
123.94.degree. C.
[0069] In a thirtieth specific embodiment, the composition 20
includes about 12% to about 16% by weight tin, about 0.5% to about
1.5% by weight antimony, about 0.5% to about 1.5% by weight copper,
about 2% to about 4% by weight nickel, about 0.5% to about 1.5% by
weight zinc, about 73% to about 77% by weight indium, and about 3%
to about 7% by weight silver, such as about 14.14% by weight tin,
about 0.76% by weight antimony, about 0.64% by weight copper, about
2.24% by weight nickel, about 0.75% by weight zinc, about 76.07% by
weight indium, and about 5.81% by weight silver. The melting point
or temperature (liquidus) of this solder composition was about
137.58.degree. C. and the solidus was about 125.92.degree. C.
[0070] In a thirty-first specific embodiment, the composition 20
includes about 11% to about 15% by weight tin, about 1% to about 3%
by weight antimony, about 0.5% to about 1.5% by weight copper,
about 3% to about 5% by weight nickel, about 0.3% to about 1.5% by
weight zinc, about 72% to about 76% by weight indium, and about 4%
to about 6% by weight silver, such as about 13.43% by weight tin,
about 1.31% by weight antimony, about 0.94% by weight copper, about
2.65% by weight nickel, about 0.49% by weight zinc, about 72.97% by
weight indium, and about 7.54% by weight silver. The melting point
or temperature (liquidus) of this solder composition was about
140.64.degree. C. and the solidus was about 129.24.degree. C.
[0071] In a thirty-second specific embodiment, the composition 20
consists essentially of about 13% to about 17% by weight tin, about
0.5% to about 1.5% by weight antimony, about 0.5% to about 1.5% by
weight copper, about 0.5% to about 1.5% by weight nickel, about
0.5% to about 1.5% by weight zinc, about 73% to about 77% by weight
indium, and about 5% to about 8.5% by weight silver, such as about
14.05% by weight tin, about 0.98% by weight antimony, about 0.87%
by weight copper, about 0.70% by weight nickel, about 0.63% by
weight zinc, about 74.74% by weight indium, and about 7.98% by
weight silver. The melting point or temperature (liquidus) of this
solder composition was about 133.18.degree. C. and the solidus was
about 123.94.degree. C. The resistivity of this solder composition
was about 16.24.times.10.sup.-6 a-cm.
[0072] As used in the instant application, in some embodiments,
solder compositions consisting essentially of the listed materials
are limited to the specified materials and those that do not
materially affect the basic and novel characteristics of the solder
compositions and electrical connectors including the solder
compositions. The basic and novel characteristics of the solder
compositions include the thermal (e.g., liquidus and solidus
temperatures) and mechanical (e.g., performance tests described
below) properties described herein.
[0073] In a thirty-third specific embodiment, the composition 20
consists essentially of about 12% to about 16% by weight tin, about
0.5% to about 1.5% by weight antimony, about 0.5% to about 1.5% by
weight copper, about 2% to about 4% by weight nickel, about 0.5% to
about 1.5% by weight zinc, about 73% to about 77% by weight indium,
and about 3% to about 7% by weight silver, such as about 14.14% by
weight tin, about 0.76% by weight antimony, about 0.64% by weight
copper, about 2.24% by weight nickel, about 0.75% by weight zinc,
about 76.07% by weight indium, and about 5.81% by weight silver.
The melting point or temperature (liquidus) of this solder
composition was about 137.58.degree. C. and the solidus was about
125.92.degree. C.
[0074] In a thirty-fourth specific embodiment, the composition 20
consists essentially of about 11% to about 15% by weight tin, about
1% to about 3% by weight antimony, about 0.5% to about 1.5% by
weight copper, about 3% to about 5% by weight nickel, about 0.3% to
about 1.5% by weight zinc, about 72% to about 76% by weight indium,
and about 4% to about 8% by weight silver, such as about 13.43% by
weight tin, about 1.31% by weight antimony, about 0.94% by weight
copper, about 2.65% by weight nickel, about 0.49% by weight zinc,
about 72.97% by weight indium, and about 7.54% by weight silver.
The melting point or temperature (liquidus) of this solder
composition was about 140.64.degree. C. and the solidus was about
129.24.degree. C.
[0075] Other compositions can include about 8% by weight tin, about
10% by weight antimony, about 1% by weight copper, about 1% by
weight nickel, about 75% by weight indium, and about 5% by weight
silver, or about 11% by weight tin, about 10% by weight antimony,
about 1% by weight copper, about 1% by weight nickel, about 72% by
weight indium, and about 5% by weight silver, or about 14% by
weight tin, about 1% by weight antimony, about 1% by weight copper,
about 1% by weight nickel, about 1% by weight germanium, about 75%
by weight indium, and about 7% by weight silver, or about 21% by
weight tin, about 1% by weight antimony, about 1% by weight copper,
about 68% by weight indium, and about 9% by weight silver, or about
22% by weight tin, about 1% by weight antimony, about 5% by weight
copper, about 1% by weight nickel, about 68% by weight indium, and
about 7% by weight silver, or about 16% by weight tin, about 1% by
weight antimony, about 5% by weight copper, about 1% by weight
nickel, about 68% by weight indium, and about 9% by weight silver,
or about 17% by weight tin, about 1% by weight antimony, about 5%
by weight copper, about 68% by weight indium, and about 9% by
weight silver, or about 16% by weight tin, about 3% by weight
antimony, about 1% by weight copper, about 75% by weight indium,
and about 5% by weight silver.
[0076] The invention is also directed to an electrical connection
on a glass component, as shown in FIGS. 1 and 2, that includes a
glass component, an electrical contact surface containing silver on
the glass component, and an electrical connector soldered to the
electrical contact surface on the glass component with a layer of a
solder composition having a mixture of elements comprising about 4%
to about 25% by weight tin, about 0.1% to about 8% by weight
antimony, about 0.03% to about 4% by weight copper, about 0.03% to
about 4% by weight nickel, about 66% to about 90% by weight indium,
and about 0.5% to about 9% by weight silver. In other embodiments,
an electrical connection on a glass component includes a glass
component, an electrical contact surface containing silver on the
glass component, and an electrical connector soldered to the
electrical contact surface on the glass component with a layer of a
solder composition consisting essentially of about 4% to about 25%
by weight tin, about 0.1% to about 8% by weight antimony, about
0.03% to about 4% by weight copper, about 0.03% to about 4% by
weight nickel, about 66% to about 90% by weight indium, and about
0.5% to about 9% by weight silver.
[0077] A method 100, shown in FIG. 3A, of forming the solder
composition 20 includes mixing indium, nickel, copper, silver,
antimony, and tin together to form an alloy that includes about 66%
to about 90% by weight indium, about 0.5% to about 9% by weight
silver, about 0.03% to about 3% be weight nickel, about 0.03% to
about 4% by weight copper, about 0.1% to about 8% by weight
antimony, and about 4% to about 25% by weight tin. The method 100
includes melting indium and tin at step 110 and adding antimony at
step 120. The method 100 can optionally include mixing, at step
130, about 0.3% to about 5% by weight zinc, and optionally mixing,
at step 140, about 0.01% to about 0.3% by weight germanium. In some
embodiments, the indium and tin are mixed together in a first
molten mixture at step 110, and at least nickel, copper and silver
are mixed together in solution at step 115 in a second mixture,
which is then cooled at step 125, optionally crushed at step 135,
and then added at step 150 to the first molten mixture. A flowchart
of the method of forming the solder composition 20 is shown in FIG.
3A. The method can be conducted in an ambient air atmosphere,
without the need for an inert gas environment or vacuum.
[0078] In some embodiments, indium is mixed in a proportion of
about 70% to about 80% by weight, silver is mixed in a proportion
of about 4% to about 8% by weight, nickel is mixed in a proportion
of about 0.1% to about 4% by weight, copper is mixed in a
proportion of about 0.1% to about 1.5% by weight, antimony is mixed
in a proportion of about 0.2% to about 8% by weight, and tin is
mixed in a proportion of about 7% to about 19% by weight. The
resulting alloy has indium, silver, nickel, copper, antimony, tin,
and, optionally, zinc and germanium in proportions described above
for solder composition 20.
[0079] In other embodiments, method 100 of forming the solder
composition 20 includes mixing indium, nickel, copper, zinc,
silver, antimony, and tin together to form an alloy that includes
about 72% to about 77% by weight indium, about 4% to about 8.5% by
weight silver, about 0.5% to about 5% by weight nickel, about 0.5%
to about 1.5% by weight copper, about 0.3% to about 1.5% by weight
zinc, about 0.5% to about 3% by weight antimony, and about 11% to
about 17% by weight tin. In these specific embodiments, the
composition 20 can include about 74% to about 75% by weight indium,
about 5% to about 6% by weight silver, about 1% to about 4% by
weight nickel, about 0.5% to about 1.5% by weight copper, about
0.5% to about 1.5% by weight zinc, about 0.5% to about 2.5% by
weight antimony, and about 13% to about 15% by weight tin. Examples
of these specific embodiments can include about 75% by weight
indium, about 6% by weight silver, about 1% by weight nickel, about
0.5% to about 1.5% by weight copper, about 0.5% to about 1.5% by
weight zinc, about 0.5% to about 1.5% by weight antimony, and about
15% by weight tin, such as about 75% by weight indium, about 6% by
weight silver, about 1% by weight nickel, about 1% by weight
copper, about 1% by weight zinc, about 1% by weight antimony, and
about 15% by weight tin. Other examples of these specific
embodiments can include about 75% by weight indium, about 5% by
weight silver, about 3% by weight nickel, about 0.5% to about 1.5%
by weight copper, about 0.5% to about 1.5% by weight zinc, about
0.5% to about 1.5% by weight antimony, and about 14% by weight tin,
such as about 75% by weight indium, about 5% by weight silver,
about 3% by weight nickel, about 1% by weight copper, about 1% by
weight zinc, about 1% by weight antimony, and about 14% by weight
tin. Still other examples of these specific embodiments can include
about 74% by weight indium, about 5% by weight silver, about 4% by
weight nickel, about 0.5% to about 1.5% by weight copper, about
0.5% to about 1.5% by weight zinc, about 1.5% to about 2.5% by
weight antimony, and about 13% by weight tin, such as about 74% by
weight indium, about 5% by weight silver, about 4% by weight
nickel, about 1% by weight copper, about 1% by weight zinc, about
2% by weight antimony, and about 13% by weight tin.
[0080] Another method 200, shown in FIG. 3B, of forming the solder
composition 20 described above includes, at step 210, heating the
desired amount of tin (Sn) in a high temperature furnace pot, such
as an induction heated solder pot (e.g., S. M. Manfredy, Model
N.481), until the tin is completely melted. The induction heated
solder pot is a convenient furnace for heating relatively small
batches of solder to a high temperature, but it requires that
subsequent additions of ingredients and stirring of the molten
mixture in the pot be performed while the current (heating) is
turned off, for safety reasons. At step 220, the pot is turned off
and the desired amount of nickel (Ni) is added in the form of
flakes, preferably 3/16'' squares about 0.010'' in thickness. All
other metals described below can be added in ingot form. It was
observed that, with stirring, nickel flakes adhered to the molten
mixture and melted into solution more readily than nickel powder,
and melting the nickel into solution is relatively difficult in
part because nickel is the highest melting (m.p. 1455.degree. C.)
of the metals in this solder composition. After stirring the nickel
into solution at step 230, the pot is turned on to high heat, for
about 10 minutes, until the temperature of the melt reaches about
1500.degree. F. Then, at step 240, the pot is turned off again and
the desired amount of copper (Cu), silver (Ag), indium (In),
antimony (Sb), and, optionally germanium (Ge) are added and
stirred, at step 250, until they are melted into the metal
solution. Then, at step 255 the pot is turned on to high heat until
the temperature of the melt reaches about 1400.degree. F. At step
260, the pot is turned off, and the desired (optional) amount of
zinc (Zn) is added and stirred until melted into the metal
solution. The pot is then turned on to low heat for a few minutes
to equilibrate the metal solution, after which the alloy is ready
to pour into ingots. It was observed that zinc needs to be added as
the last ingredient, because it is relatively low melting (m.p.
419.5.degree. C.) and excessive exposure of the zinc-containing
metal solution to high temperature can cause the zinc to vaporize
out of the metal solution.
[0081] Roles of Elements in the Solder Composition
[0082] The solder composition of the invention is a non-lead alloy
that delivers the higher service temperature, as well as the
mechanical properties in both strength and ductility, and physical
properties in wetting and stability as needed for the subject
applications, while offering the desired manufacturability. The
desired manufacturability includes enabling a low enough process
temperature so that manufacturing-prone defects or failures and the
silver leaching (scavenging) phenomenon that often occurs in
soldering silver-containing metalized electrical contact surfaces
can be alleviated or eliminated. This is accomplished by an
indium-based material that is metallurgically alloyed or
precipitated or dispersed with antimony, copper, nickel, silver,
tin, and, optionally, germanium and zinc.
[0083] Nickel and copper, in combination with the other elements,
contribute to the overall performance, including the desired
increase in processing temperature, and also contribute to the
mechanical properties under the designated process conditions.
Nickel and copper can be effective when added even in small
amounts, such as 0.03% by weight. These amounts are larger than the
generally accepted impurity level for nickel (0.01%), and larger
than the generally accepted impurity level for copper in an
application that does not include soldering to a printed circuit
board with copper circuits. Antimony, in combination with the other
elements, contributes to achieving the desired temperature range.
Antimony can be effective when added even in small amounts, such as
0.1% by weight. Zinc, in combination with the other elements,
contributes to increasing the strength of the alloy without
substantially reducing the processing temperature. Zinc can be
effective when added even in small amounts, such as 0.3% by weight,
which is larger than the generally accepted impurity level for zinc
(0.003%). Germanium, in combination with the other elements, can
contribute to the processability of the solder composition due to
its anti-oxidizing properties, even though germanium may not be in
some instances readily detectable in the composition. Germanium can
be effective when added even in small amounts, such as 0.01% by
weight or less.
Exemplification
[0084] Specific examples of weight % results of solder composition
20 were obtained by inductively coupled plasma atomic emission
spectroscopy (ICP-AEC). The solidus and liquidus temperature
results were obtained by differential scanning calorimetry
(DSC).
Solder Performance Tests and Results
I. Temperature Cycling Test
[0085] This test was performed according to DIN EN ISO 16750-4-H
section 5.3.1.2. The test samples were 11 glass windshields (4
large, 4 medium, and 3 small) with power connectors soldered with a
specific embodiment of the solder composition of the present
invention. Schematic illustrations of bridge terminal power
connectors 18a and 18b, each having a raised elongate bridge
portion extending between two spaced apart solder pads 19 on
opposite ends, are shown in FIGS. 4A and 4B, respectively. The
power connectors 18a and 18b are referred to hereinafter as power
connectors 18. The area of each solder pad 19 was about 64
mm.sup.2, and, as shown in FIG. 5, the solder composition 20 had a
thickness of about 0.5 mm. The power connectors 18 were soldered
onto the windshield 10 by rolling the solder ingot into a solder
ribbon, reflowing the solder ribbon onto a base copper material in
a continuous stripe, skiving the solder stripe to a uniform
dimension, stamping and forming the terminal using standard
tooling, applying flux to the solder surface, and soldering the
power connector 18 to the target area of the electrical contact
strip 16 on the windshield 10 using a resistance soldering device,
with an energy input in a range of between about 750 watt-seconds
and about 1050 watt-seconds, such as about 900 watt-seconds,
followed by cooling while the power connector 18 was held in place
on the windshield 10 for a time period in a range of between about
8 seconds and about 12 seconds, such as about 10 seconds. The
solder composition 20 consisted essentially of about 14.05% by
weight tin, about 0.98% by weight antimony, about 0.87% by weight
copper, about 0.70% by weight nickel, about 0.63% by weight zinc,
about 74.74% by weight indium, and about 7.98% by weight silver.
The melting point or temperature (liquidus) of this solder
composition was about 133.18.degree. C. and the solidus was about
123.94.degree. C. A schematic illustration of the completed
assembly including power connectors 18 connected to electrical
contact strips 16 and to power lines 22 on windshield 10 is shown
in FIG. 6.
[0086] In this test, illustrated in FIG. 7, the temperature of a
climate controlled chamber (e.g., Russells, Holland Mich., Model
RDV-42-25-25/11900955 at a relatively dry humidity, but not
controlled) was cycled during a total time of 8 hours from ambient
(about 20.degree. C.) to -40.degree. C. and held at -40.degree. C.
for 90 minutes, followed by a ramp up to 105.degree. C. for 120
minutes, before returning to ambient temperature, with electrical
current loading of 14 V applied through power line 22 starting from
the end of the -40.degree. C. step and ending at the end of the
105.degree. C. step, as indicated by the respective arrows shown in
FIG. 7. After 20 cycles, each power connector 18 was pulled for 3
seconds in pull test 300 (at ambient temperature), as shown in FIG.
8, in a direction generally normal to the solder layer 20 and
windshield surface 10, to a force of 50 N on a digital force gauge
310 (Mark-10 Long Island, N.Y., Model BG100) connected by a hook
320 to power connector 18 approximately at the midpoint in between
solder pads 19, and manually operated by handles 330. No failures
(i.e., connector disconnects) occurred during this test.
II. Heat Soak Test
[0087] This test was performed according to DIN EN ISO 16750-4-K
section 5.1.2.2 on nine windshield samples that included 5 power
connectors soldered with the same solder composition used in Test
I. Two windshield samples used a solder composition that consisted
essentially of about 14.14% by weight tin, about 0.76% by weight
antimony, about 0.64% by weight copper, about 2.24% by weight
nickel, about 0.75% by weight zinc, about 76.07% by weight indium,
and about 5.81% by weight silver. The melting point or temperature
(liquidus) of this solder composition was about 137.58.degree. C.
and the solidus was about 125.92.degree. C. Two other windshield
samples used a solder composition that consisted essentially of
about 13.43% by weight tin, about 1.31% by weight antimony, about
0.94% by weight copper, about 2.65% by weight nickel, about 0.49%
by weight zinc, about 72.97% by weight indium, and about 7.54% by
weight silver. The melting point or temperature (liquidus) of this
solder composition was about 140.64.degree. C. and the solidus was
about 129.24.degree. C.
[0088] In this test 400, illustrated in FIG. 9, the temperature of
a climate controlled chamber (A&W Blake Hot Chamber) was held
at 105.degree. C. for 96 hours, with electrical current loading of
14 V applied through power line 22 and mechanical loading of 6 N in
a direction generally normal to the solder layer 20 and windshield
surface 10 (applied by connecting weight 410 to power connector 18
by hook 420 located approximately at the midpoint in between solder
pads 19) directed vertically down as acceleration of gravity during
the entire 96 hours. The temperature of the power connectors
(measured by thermocouple 430) increased to a maximum of about
120.degree. C. during the test due to the applied electrical load.
After the 96 hours test, each power connector was pulled (at
ambient temperature) as shown in FIG. 8 and described above, to a
force of 50 N on a digital force gauge for 3 seconds (Mark-10 Long
Island, N.Y., Model BG50). No failures (i.e., connector
disconnects, or microcracks) occurred during this test.
III. High Temperature Storage Test
[0089] This test was performed on the same test samples as were
used above for Test I. In this test, the temperature of a climate
controlled chamber (at a relatively dry humidity, but not
controlled) was maintained at a constant 120.degree. C. for 24
hours with no electrical or mechanical loading of the power
connectors. After the end of the 24 hours, each power connector was
pulled (at ambient temperature) as shown in FIG. 8 and described
above, to a force of 50 N on a digital force gauge for 3 seconds
(Mark-10 Long Island, N.Y., Model BG100). No failures (i.e.,
connector disconnects) occurred during this test.
IV. Long Term Test with Electrical Load
[0090] This test was performed on the same test samples as were
used above for Tests I and III. In this test, the temperature of a
climate controlled chamber (humidity relatively dry but not
controlled) was maintained at a constant 105.degree. C. for 500
hours with electrical current loading of 14 V during the entire 500
hours. After the end of the 500 hours, each power connector was
pulled (at ambient temperature) as shown in FIG. 8 and described
above, to a force of 50 N on a digital force gauge for 3 seconds
(Mark-10 Long Island, N.Y., Model BG100). No failures (i.e.,
connector disconnects) occurred during this test.
V. Heat Shock Test
[0091] This test was performed according to DIN EN ISO 16750-4-H
section 5.4.2. The test samples were five 12''.times.12'' tempered
glass plates with 30 power connectors each. The plates were 4 mm
thick, tinted, printed with enamel, and overprinted with six silver
strips 1'' wide. The power connectors were soldered to the silver
strips. The power connectors on two plates were soldered with a
solder composition consisting essentially of about 14.05% by weight
tin, about 0.98% by weight antimony, about 0.87% by weight copper,
about 0.70% by weight nickel, about 0.63% by weight zinc, about
74.74% by weight indium, and about 7.98% by weight silver. The
melting point or temperature (liquidus) of this solder composition
was about 133.18.degree. C. and the solidus was about
123.94.degree. C. The power connectors on one other plate were
soldered with a solder composition consisting essentially of about
14.14% by weight tin, about 0.76% by weight antimony, about 0.64%
by weight copper, about 2.24% by weight nickel, about 0.75% by
weight zinc, about 76.07% by weight indium, and about 5.81% by
weight silver. The melting point or temperature (liquidus) of this
solder composition was about 137.58.degree. C. and the solidus was
about 125.92.degree. C. The power connectors on one additional
plate were soldered with a solder composition consisting
essentially of about 13.43% by weight tin, about 1.31% by weight
antimony, about 0.94% by weight copper, about 2.65% by weight
nickel, about 0.49% by weight zinc, about 72.97% by weight indium,
and about 7.54% by weight silver. The melting point or temperature
(liquidus) of this solder composition was about 140.64.degree. C.
and the solidus was about 129.24.degree. C.
[0092] In this test, a cycle consisted of heating the samples in a
climate controlled chamber to 105.degree. C. for one hour with no
electrical or mechanical loading, followed by submerging the
samples completely in cold water (about 23.degree. C. or lower,
from refrigerator). The samples were dried with compressed air
after each cycle. After 5 cycles and then after 10 cycles, each
power connector was pulled (at ambient temperature) as shown in
FIG. 8 and described above, to a force of 50 N on a digital force
gauge for 3 seconds (Mark-10 Long Island, N.Y., Model BG100). No
failures (i.e., connector disconnects) occurred during this
test.
VI. High Humidity Test: Constant Climate
[0093] In this test, performed according to DIN EN ISO 6270-2-CH,
eight windshield samples were exposed in an environmental chamber
to a constant temperature of 80.degree. C. and a humidity of
>96% RH (steam generated) for a total of 504 hours, with
electrical current loading on the power connectors of 14 V (drawing
about 22 A) for 15 minutes starting at 10 hours after reaching the
specified temperature and humidity, and for 15 minutes every 24
hours thereafter until the end of the 504 hours. The temperature of
the power connectors (measured by thermocouples) increased to a
maximum of about 95.degree. C. during the test due to the applied
electrical load. After the end of the 504 hours, each power
connector was pulled (at ambient temperature) as shown in FIG. 8
and described above, to a force of 50 N on a digital force gauge
for 3 seconds (Mark-10 Long Island, N.Y., Model BG100). If the
silver layer (electrical contact surface 16) separated from the
glass 10, either during the 504 hours or during the pull test, then
pull-tests and electrical tests could not be performed, and the
solder contact was assessed as good. However, one windshield sample
of each of the three solder compositions described above in Test V
completed the high humidity/constant climate test with no failures
(i.e., connector disconnects).
VII. Resistance to Screen Washer Fluids
[0094] The test sample was a 12''.times.12'' glass plate with 30
power connectors each (as described above), soldered with a solder
composition that consisted essentially of about 14.05% by weight
tin, about 0.98% by weight antimony, about 0.87% by weight copper,
about 0.70% by weight nickel, about 0.63% by weight zinc, about
74.74% by weight indium, and about 7.98% by weight silver. The
melting point or temperature (liquidus) of this solder composition
was about 133.18.degree. C. and the solidus was about
123.94.degree. C.
[0095] In this test, the test sample was submerged for 24 hours in
a simulated windshield washer solution made from 11 and 1/8 cups
water, 3 and 1/6 cups of ethanol, 1.6 cups of isopropanol, 1 and
1/4 tablespoons of ethylene glycol, and a quarter tablespoon of
sodium lauryl sulphate. After the end of the 24 hours, each power
connector was pulled (at ambient temperature) as shown in FIG. 8
and described above, except that the force gauge 310 was an Instron
force gauge operated at a rate of 100 mm/min to a force of 50 N on
a force gauge for 2 seconds (Instron, Norwood, Mass. Model 5544).
No failures (i.e., connector disconnects) occurred during this
test.
VII. Salt Spray Test
[0096] This test was performed according to DIN EN ISO 9227 section
8. The test sample was a 12''.times.12'' glass plate with 30 power
connectors each (as described above), soldered with a solder
composition that consisted essentially of about 14.05% by weight
tin, about 0.98% by weight antimony, about 0.87% by weight copper,
about 0.70% by weight nickel, about 0.63% by weight zinc, about
74.74% by weight indium, and about 7.98% by weight silver. The
melting point or temperature (liquidus) of this solder composition
was about 133.18.degree. C. and the solidus was about
123.94.degree. C.
[0097] In this test, the test sample was exposed to a salt spray
fog in a test chamber (Harshaw Model 22) for 96 hours. The salt
concentration was at 5% and the pH was between 6.5 and 7.2. The
salt fog temperature was set at +35.degree. C..+-.2.degree. C., and
the tower temperature was set at +48.degree. C., with the air
pressure being between 16 and 18 psi. After the end of the 96
hours, each power connector was pulled (at ambient temperature) as
shown in FIG. 8 and described above, except that the force gauge
310 was an Instron force gauge operated at a rate of 100 mm/min to
a force of 50 N for 2 seconds (Instron, Norwood, Mass. Model 5544).
No failures (i.e., connector disconnects) occurred during this
test.
[0098] The teachings of all patents, published applications and
references cited herein are incorporated by reference in their
entirety.
[0099] While this invention has been particularly shown and
described with references to example embodiments thereof, it will
be understood by those skilled in the art that various changes in
form and details may be made therein without departing from the
scope of the invention encompassed by the appended claims.
* * * * *