Hwang; Jennie S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hwang; Jennie S..The latest application filed is for "method of forming a lead-free solder composition".
- Hwang; Jennie S. - Moreland Hills OH
- Hwang; Jennie S. - Pepper Pike OH
| Patent | Date |
|---|---|
| Method of forming a lead-free solder composition Grant 10,105,794 - Hwang , et al. October 23, 2 | 2018-10-23 |
| Method Of Forming A Lead-free Solder Composition App 20180207753 - Hwang; Jennie S. ; et al. | 2018-07-26 |
| Lead-free solder composition Grant 9,975,207 - Hwang , et al. May 22, 2 | 2018-05-22 |
| Lead-free Solder Composition App 20170190004 - Hwang; Jennie S. ; et al. | 2017-07-06 |
| Lead-free Solder Composition App 20140271343 - Hwang; Jennie S. ; et al. | 2014-09-18 |
| Lead-free solder composition Grant 8,771,592 - Hwang , et al. July 8, 2 | 2014-07-08 |
| Lead-free Solder Composition App 20120222893 - Hwang; Jennie S. ; et al. | 2012-09-06 |
| High temperature lead-free solder compositions App 20040241039 - Hwang, Jennie S. | 2004-12-02 |
| Lead-free solder compositions App 20020155024 - Hwang, Jennie S. | 2002-10-24 |
| Lead-free solders Grant 6,176,947 - Hwang , et al. January 23, 2 | 2001-01-23 |
| High strength lead-free solder materials Grant 5,985,212 - Hwang , et al. November 16, 1 | 1999-11-16 |
| Composite solders Grant 5,520,752 - Lucey, Jr. , et al. May 28, 1 | 1996-05-28 |
| Fusible powdered metal paste Grant RE32,309 - Hwang December 16, 1 | 1986-12-16 |
| Fusible powdered metal paste Grant 4,619,715 - Hwang October 28, 1 | 1986-10-28 |
| Fusible powdered metal paste Grant 4,557,767 - Hwang December 10, 1 | 1985-12-10 |
| Nonaqueous powdered metal paste composition Grant 4,541,876 - Hwang September 17, 1 | 1985-09-17 |
| Solder paste and vehicle therefor Grant 4,460,414 - Hwang July 17, 1 | 1984-07-17 |
| SEC | 0001186245 | HWANG JENNIE S of OHIO |
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