U.S. patent application number 14/925857 was filed with the patent office on 2017-05-04 for method for fabricating self-aligned contact in a semiconductor device.
The applicant listed for this patent is TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. Invention is credited to Hugo CHAO, Chen-Ming LEE, Mei-Yun WANG, Fu-Kai YANG.
Application Number | 20170125586 14/925857 |
Document ID | / |
Family ID | 58546127 |
Filed Date | 2017-05-04 |
United States Patent
Application |
20170125586 |
Kind Code |
A1 |
LEE; Chen-Ming ; et
al. |
May 4, 2017 |
METHOD FOR FABRICATING SELF-ALIGNED CONTACT IN A SEMICONDUCTOR
DEVICE
Abstract
A semiconductor device includes a gate structure disposed over a
substrate, and sidewall spacers disposed on both side walls of the
gate structure. The sidewall spacers includes at least four spacer
layers including first to fourth spacer layers stacked in this
order from the gate structure.
Inventors: |
LEE; Chen-Ming; (Yangmei
City, TW) ; YANG; Fu-Kai; (Hsinchu City, TW) ;
WANG; Mei-Yun; (Chu-Pei City, TW) ; CHAO; Hugo;
(Hsinchu, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY |
Hsinchu |
|
TW |
|
|
Family ID: |
58546127 |
Appl. No.: |
14/925857 |
Filed: |
October 28, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 29/785 20130101;
H01L 29/42364 20130101; H01L 29/4983 20130101; H01L 29/66795
20130101; H01L 21/2652 20130101; H01L 29/6653 20130101; H01L 29/665
20130101; H01L 29/7848 20130101; H01L 27/092 20130101; H01L
21/823814 20130101; H01L 21/823871 20130101; H01L 21/76897
20130101; H01L 29/41791 20130101; H01L 21/823821 20130101; H01L
29/6656 20130101; H01L 23/535 20130101; H01L 29/66636 20130101;
H01L 27/0924 20130101; H01L 29/7845 20130101; H01L 29/66545
20130101; H01L 29/6659 20130101; H01L 29/41775 20130101; H01L
21/823864 20130101 |
International
Class: |
H01L 29/78 20060101
H01L029/78; H01L 29/423 20060101 H01L029/423; H01L 21/265 20060101
H01L021/265; H01L 29/66 20060101 H01L029/66; H01L 21/8238 20060101
H01L021/8238; H01L 27/092 20060101 H01L027/092; H01L 23/535
20060101 H01L023/535 |
Claims
1. A semiconductor device comprising: a gate structure disposed
over a substrate; a source/drain region; and sidewall spacers
disposed on both side walls of the gate structure, wherein: the
sidewall spacers includes at least four spacer layers including
first to fourth spacer layers stacked in this order from the gate
structure, the second space layer includes a lateral portion
laterally extending over the source/drain region and partially
covering the source/drain region, and the lateral portion separates
the third and fourth spacer layers from the source/drain
region.
2. The semiconductor device of claim 1, wherein: the first, third
and fourth spacer layers are made of a silicon-nitride based
material, and the second spacer layer is made of a silicon-oxide
based material.
3. The semiconductor device of claim 2, wherein the silicon-nitride
based material includes SiN, SiCN, SiON or SiOCN, and the
silicon-oxide based material includes silicon oxide.
4. The semiconductor device of claim 2, wherein the first spacer
layer is made of SiCN.
5. The semiconductor device of claim 2, wherein the fourth spacer
layer is made of SiN.
6. The semiconductor device of claim 2, wherein the third spacer
layer is made of SiCN or SiN.
7. The semiconductor device of claim 2, wherein the third spacer
layer is made of a different material than the fourth spacer
layer.
8. The semiconductor device of claim 1, further comprising: a
contact plug in contact with a part of the source/drain region,
wherein the fourth spacer layer is in contact with the contact
plug.
9. The semiconductor device of claim 8, wherein bottoms of the
third and fourth spacer layers are located above the source/drain
regions.
10. The semiconductor device of claim 1, wherein the gate structure
comprises: a gate dielectric layer; a gate electrode layer disposed
over the gate dielectric layer; and a cap layer made of an
insulating material disposed over the gate electrode, wherein a
height of the sidewall spacers is substantially the same as a
height of the cap layer.
11. A method of manufacturing a semiconductor device, the method
comprising: forming a gate structure over a substrate; forming a
first sidewall spacer layer on a sidewall of the gate structure;
forming an oxide layer, as a second sidewall spacer layer, on the
first sidewall spacer layer; forming a third sidewall spacer layer
on the second sidewall spacer layer; and forming a contact etching
stop layer on the third sidewall spacer layer and the substrate,
wherein: the forming the first sidewall spacer layer includes
forming a lower layer and forming an upper layer over the lower
layer, and between the forming the lower layer and the forming the
upper layer over the lower layer, ion implantation is performed
through the lower layer.
12. The method of claim 11, wherein: the first, third and fourth
spacer layers are made of SiN, SiCN, SiON or SiOCN.
13. The method of claim 11, further comprising, after forming the
fourth sidewall spacer layer: forming an interlayer dielectric
layer over the gate structure with the first to fourth spacer
layers; forming a contact hole in the interlayer dielectric layer
by using the contact etch stop layer as an etching stop layer;
removing the contact etch stop layer in the contact hole; and
filling the contact hole with a conductive material.
14. The method of claim 11, wherein the oxide layer is formed by
oxidizing the first sidewall spacer layer.
15. The method of claim 11, wherein: the gate structure is a dummy
gate structure, and the method further comprises, after forming the
fourth sidewall spacer layer: forming an interlayer dielectric
layer over the dummy gate structure with the first to fourth spacer
layers; removing the dummy gate structures to form a gate opening;
and forming a metal gate structure including a metal gate electrode
layer disposed over a high-k gate dielectric layer in the
opening.
16. The method of claim 15, further comprising, after forming the
metal gate structure: recessing the metal gate electrode layer; and
forming a cap layer over the recessed gate electrode layer
17. The method of claim 11, further comprising forming a
source/drain region including a strain material having a different
lattice constant from a channel region, wherein bottom of the third
spacer layer is located above the source/drain region.
18. (canceled)
19. A method of manufacturing a semiconductor device, the method
comprising: forming a first dummy gate structure for an n-channel
transistor with a mask layer disposed thereon over a substrate;
forming a first insulating layer over the first dummy gate
structure; implanting first ions through the first insulating layer
for the n-channel transistor; forming a second insulating layer
over the first insulating layer; forming a third insulating layer
over the second insulating layer; etching the first to third
insulating layers thereby forming a first n-sidewall spacer layer
on a side wall of the first dummy gate structure; forming a first
source/drain structure in the substrate on a side portion of the
first n-sidewall spacer; after forming the first source/drain
structure, removing the third insulating layer from the first
n-sidewall spacer layer; forming an oxide layer, as a second
sidewall spacer layer, on the first n-sidewall spacer layer;
forming a third n-sidewall spacer layer on the second sidewall
spacer layer; and forming a contact etching stop layer on the
n-third sidewall spacer layer and the substrate.
20. The method of claim 19, further comprising: forming a second
dummy gate structure for a p-channel transistor with a mask layer
disposed thereon over the substrate; forming the first insulating
layer over the second dummy gate structure; implanting second ions
through the first insulating layers for the for the p-channel
transistor; forming the second insulating layer over the first
insulating layer; forming the third insulating layer over the
second insulating layer; after forming the third insulating layer,
removing the third insulating layer; forming a fourth insulating
layer over the second insulating layer after removing the third
insulating layer; etching the first, second and fourth insulating
layer thereby forming a first p-sidewall spacer layer on a side
wall of the second dummy gate structure; forming a second
source/drain structure in the substrate on a side portion of the
first p-sidewall spacer; after forming the second source/drain
structure, removing the fourth insulating layer from the first
p-sidewall spacer layer; forming an oxide layer on the first
p-sidewall spacer layer; forming a third p-sidewall spacer layer on
the oxide layer; and forming a contact etching stop layer on the
third p-sidewall spacer layer and the substrate.
21. The method of claim 11, further comprising forming a
source/drain region, wherein: the oxide layer is formed such that
the oxide layer has a lateral portion laterally extending over the
source/drain region and covering the source/drain region, and the
lateral portion separates the third spacer layer and the contact
etching stop layer from the source/drain region.
Description
TECHNICAL FIELD
[0001] The disclosure relates to a method for manufacturing a
semiconductor device, and more particularly to a structure and a
manufacturing method for self-aligned source/drain (S/D)
contacts.
BACKGROUND
[0002] With a decrease of dimensions of semiconductor device, a
self-aligned contact (SAC) has been widely utilized for
fabricating, e.g., a source/drain contact arranged closer to gate
structures in a field effect transistor (FET). Typically, a SAC is
fabricated by patterning an interlayer dielectric (ILD) layer,
under which a contact etch-stop layer (CESL) is formed over the
gate structure having sidewall spacers. The initial etching of the
ILD layer stops at the CESL, and then the CESL is etched to form
the SAC. As the device density increases (i.e., the dimensions of
semiconductor device decreases), the thickness of the sidewall
spacer becomes thinner, which may cause a short circuit between the
S/D contact and the gate electrodes. Accordingly, it has been
required to provide SAC structures and manufacturing process with
improved electrical isolation between the S/D contacts and gate
electrodes.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] The present disclosure is best understood from the following
detailed description when read with the accompanying figures. It is
emphasized that, in accordance with the standard practice in the
industry, various features are not drawn to scale and are used for
illustration purposes only. In fact, the dimensions of the various
features may be arbitrarily increased or reduced for clarity of
discussion.
[0004] FIG. 1A shows an exemplary perspective view of a Fin FET
after the dummy gate structure is formed, and FIG. 1B shows an
exemplary perspective view of a planar type FET after the dummy
gate structure is formed according to one embodiment of the present
disclosure.
[0005] FIGS. 2A-11B show exemplary cross sectional views
illustrating a sequential fabrication process of a semiconductor
device according to one embodiment of the present disclosure.
[0006] FIGS. 12A and 12B show enlarged cross sectional views of the
S/D contact hole portions according to one embodiment of the
present disclosure
DETAILED DESCRIPTION
[0007] It is to be understood that the following disclosure
provides many different embodiments, or examples, for implementing
different features of the invention. Specific embodiments or
examples of components and arrangements are described below to
simplify the present disclosure. These are, of course, merely
examples and are not intended to be limiting. For example,
dimensions of elements are not limited to the disclosed range or
values, but may depend upon process conditions and/or desired
properties of the device. Moreover, the formation of a first
feature over or on a second feature in the description that follows
may include embodiments in which the first and second features are
formed in direct contact, and may also include embodiments in which
additional features may be formed interposing the first and second
features, such that the first and second features may not be in
direct contact. Various features may be arbitrarily drawn in
different scales for simplicity and clarity.
[0008] Further, spatially relative terms, such as "beneath,"
"below," "lower," "above," "upper" and the like, may be used herein
for ease of description to describe one element or feature's
relationship to another element(s) or feature(s) as illustrated in
the figures. The spatially relative terms are intended to encompass
different orientations of the device in use or operation in
addition to the orientation depicted in the figures. The apparatus
may be otherwise oriented (rotated 90 degrees or at other
orientations) and the spatially relative descriptors used herein
may likewise be interpreted accordingly. In addition, the term
"made of" may mean either "comprising" or "consisting of."
[0009] FIG. 1A shows an exemplary structure after a gate structure
GATE is formed over a fin structure. One process of implementing
the gate structure is termed a "gate last" or "replacement gate"
methodology. In such a process, a dummy gate structure using
polysilicon is initially formed, various processes associated with
the semiconductor device are performed, and the dummy gate is
subsequently removed and replaced with a metal gate. In this
embodiment, the Fin FET device includes an n-type Fin FET 11 and a
p-type Fin FET 12.
[0010] First, a fin structure FIN is fabricated over a substrate
SUB. The fin structure FIN is formed over a substrate SUB and
protrudes from an isolation insulating layer STI. To fabricate a
fin structure FIN according to one embodiment, a mask layer is
formed over a substrate. The mask layer is formed by, for example,
a thermal oxidation process and/or a chemical vapor deposition
(CVD) process. The substrate is, for example, a p-type silicon
substrate with an impurity concentration in a range from about
1.times.10.sup.15 cm.sup.-3 to about 1.times.10.sup.18 cm.sup.-3.
In other embodiments, the substrate is an n-type silicon substrate
with an impurity concentration in a range from about
1.times.10.sup.15 cm.sup.-3 to about 1.times.10.sup.18 cm.sup.-3.
The mask layer includes, for example, a pad oxide (e.g., silicon
dioxide) layer and a silicon nitride mask layer in some
embodiments.
[0011] Alternatively, the substrate may comprise another elementary
semiconductor, such as germanium; a compound semiconductor
including IV-IV compound semiconductors such as SiC and SiGe, III-V
compound semiconductors such as GaAs, GaP, GaN, InP, InAs, InSb,
GaAsP, AlGaN, AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP; or
combinations thereof. In one embodiment, the substrate is a silicon
layer of an SOI (silicon-on insulator) substrate. When an SOI
substrate is used, the fin structure may protrude from the silicon
layer of the SOI substrate or may protrude from the insulator layer
of the SOI substrate. In the latter case, the silicon layer of the
SOI substrate is used to form the fin structure. The substrate may
include various regions that have been suitably doped with
impurities (e.g., p-type or n-type conductivity).
[0012] The pad oxide layer may be formed by using thermal oxidation
or a CVD process. The silicon nitride mask layer may be formed by a
physical vapor deposition (PVD), such as a sputtering method, CVD,
plasma-enhanced chemical vapor deposition (PECVD), atmospheric
pressure chemical vapor deposition (APCVD), low-pressure CVD
(LPCVD), high density plasma CVD (HDPCVD), atomic layer deposition
(ALD), and/or other processes.
[0013] The thickness of the pad oxide layer is in a range from
about 2 nm to about 15 nm and the thickness of the silicon nitride
mask layer is in a range from about 2 nm to about 50 nm in some
embodiments. A mask pattern is further formed over the mask layer.
The mask pattern is, for example, a resist pattern formed by
lithography operations. By using the mask pattern as an etching
mask, a hard mask pattern of the pad oxide layer and the silicon
nitride mask layer is formed. The width of the hard mask pattern is
in a range from about 4 nm to about 40 nm in some embodiments. In
certain embodiments, the width of the hard mask patterns is in a
range from about 4 nm to about 12 nm.
[0014] By using the hard mask pattern as an etching mask, the
substrate is patterned into a fin structure FIN by trench etching
using a dry etching method and/or a wet etching method. A height of
the fin structure (the Z direction) is in a range from about 20 nm
to about 100 nm. In certain embodiments, the height is in a range
from about 30 nm to about 60 nm. When the heights of the fin
structures are not uniform, the height from the substrate may be
measured from the plane that corresponds to the average heights of
the fin structures. The width of the fin structure 20 is in a range
from about 5 nm to about 40 nm in some embodiments, and is in a
range from about 7 nm to about 15 nm in certain embodiments.
[0015] As shown in FIG. 1A, one fin structure FIN extending in the
Y direction is disposed over the substrate SUB, in this embodiment,
one fin structure is disposed for an n-type FET and one fin
structure is disposed for a p-type FET. However, the number of fin
structures is not limited to one. There may be two, three, four or
five or more fin structures arranged in the X direction. In
addition, one or more dummy fin structures may be disposed adjacent
to both sides of the fin structure to improve pattern fidelity in
the patterning processes. When multiple fin structures are
disposed, the space between the fin structures is in a range from
about 8 nm to about 80 nm in some embodiments, and is in a range
from about 7 nm to about 15 nm in other embodiments. One skilled in
the art will realize, however, that the dimensions and values
recited throughout the descriptions are merely examples, and may be
changed to suit different scales of integrated circuits.
[0016] After forming the fin structure FIN, an isolation insulating
layer STI is formed over the fin structure. The isolation
insulating layer STI includes one or more layers of insulating
materials such as silicon oxide, silicon oxynitride or silicon
nitride, formed by LPCVD (low pressure chemical vapor deposition),
plasma-CVD or flowable CVD. In the flowable CVD, flowable
dielectric materials instead of silicon oxide are deposited.
Flowable dielectric materials, as their name suggest, can "flow"
during deposition to fill gaps or spaces with a high aspect ratio.
Usually, various chemistries are added to silicon-containing
precursors to allow the deposited film to flow. In some
embodiments, nitrogen hydride bonds are added. Examples of flowable
dielectric precursors, particularly flowable silicon oxide
precursors, include a silicate, a siloxane, a methyl silsesquioxane
(MSQ), a hydrogen silsesquioxane (HSQ), an MSQ/HSQ, a
perhydrosilazane (TCPS), a perhydro-polysilazane (PSZ), a
tetraethyl orthosilicate (TEOS), or a silyl-amine, such as
trisilylamine (TSA). These flowable silicon oxide materials are
formed in a multiple-operation process. After the flowable film is
deposited, it is cured and then annealed to remove un-desired
element(s) to form silicon oxide. When the un-desired element(s) is
removed, the flowable film densifies and shrinks. In some
embodiments, multiple anneal processes are conducted. The flowable
film is cured and annealed more than once. The flowable film may be
doped with boron and/or phosphorous. The isolation insulating layer
may be formed by one or more layers of SOG, SiO, SiON, SiOCN and/or
fluoride-doped silicate glass (FSG).
[0017] After forming the isolation insulating layer over the fin
structure, a planarization operation is performed so as to remove
part of the isolation insulating layer and the mask layer (the pad
oxide layer and the silicon nitride mask layer). The planarization
operation may include a chemical mechanical polishing (CMP) and/or
an etch-back process. Then, the isolation insulating layer is
further removed (recessed) so that the upper layer of the fin
structure is exposed.
[0018] A dummy gate structure GATE is formed over the exposed fin
structure FIN. A dielectric layer and a poly silicon layer are
formed over the isolation insulating layer and the exposed fin
structure, and then patterning operations are performed so as to
obtain a dummy gate structure GATE including a dummy gate electrode
layer made of poly silicon and a dummy gate dielectric layer. The
patterning of the poly silicon layer is performed by using a hard
mask including a silicon nitride layer formed over a silicon oxide
layer in some embodiments. In other embodiments, the hard mask
includes a silicon oxide layer formed over a silicon nitride layer.
The dummy gate dielectric layer is silicon oxide formed by CVD,
PVD, ALD, e-beam evaporation, or other suitable process. In some
embodiments, the gate dielectric layer includes one or more layers
of silicon oxide, silicon nitride, silicon oxy-nitride, or high-k
dielectrics. In some embodiments, a thickness of the gate
dielectric layer is in a range from about 5 nm to about 20 nm, and
in a range from about 5 nm to about 10 nm in other embodiments.
[0019] In some present embodiments, the width of the dummy gate
electrode layer GATE is in the range of about 5 nm to about 40 nm.
In some embodiments, a thickness of the gate electrode layer is in
a range from about 5 nm to about 200 nm, and is in a range from
about 5 nm to 100 nm in other embodiments.
[0020] If a planar type FET as shown in FIG. 1B is used instead of
the Fin FETs, a dummy dielectric layer and a dummy poly silicon
layer are formed over the substrate SUB, and then patterning
operations using hard mask layer are performed so as to obtain the
dummy gate structure GATE.
[0021] FIGS. 2A-11B show exemplary cross sectional views
illustrating a sequential fabrication process of a semiconductor
device according to one embodiment of the present disclosure. It is
understood that additional operations may be provided before,
during, and after processes shown by FIGS. 2A-11B, and some of the
operations described below can be replaced or eliminated in
additional embodiments of the method. The order of the
operations/processes may be interchangeable. Although FIGS. 2A-11B
show a sequential fabrication process of a Fin FET as shown in FIG.
1A, the fabrication process may be applied to a planar type FET
shown in FIG. 1B. In such a case, the "fin structure" in the below
description may be read as "substrate."
[0022] After the gate structure GATE is formed, a first insulating
layer 10 is formed over the dummy gate structure and the fin
structure. FIG. 2A shows exemplary cross sectional views for an
n-channel region for an n-type FET 11 and a p-channel region for a
p-type FET 12, along line A-A' of FIG. 1A.
[0023] As shown in FIG. 2A, the dummy gate for the n-type FET 11
includes a dummy gate dielectric layer 20A, a dummy gate electrode
30A and a hard mask including a first mask layer 40A and a second
mask layer 50A. Similarly, the dummy gate for the p-type FET 12
includes a dummy gate dielectric layer 20B, a dummy gate electrode
30B and a hard mask including a first mask layer 40B and a second
mask layer 50B. In some embodiments, the dummy gate dielectric
layers 20A, 20B include one or more layers of dielectric material
such as silicon oxide, silicon nitride, silicon oxynitride. In this
embodiment, the dummy gate dielectric layers 20A, 20B are made of
silicon oxide. The dummy gate electrode layers 30A, 30B are made of
a suitable material such as polysilicon and amorphous silicon. In
this embodiment, the dummy gate electrode layers 30A, 30B are made
of polysilicon. The first hard mask layers 40A, 40B are made of,
for example, silicon nitride and the second hard mask layers 50A,
50B are made of, for example, silicon oxide, in some
embodiments.
[0024] The thickness of the dummy gate electrode 30A, 30B above the
fin structure (channel region) is in a range from about 100 nm to
about 150 nm. The thickness of the mask layers (the sum of the
first and second mask layers) is in a range from about 50 nm to
about 100 nm.
[0025] The first insulating layer 10 includes one or more layers of
dielectric materials such as silicon oxide, silicon nitride (SiN),
silicon oxynitride (SiON), silicon carbo-nitride (SiCN) and SiOCN.
In some embodiments, the first insulating layer 10 is made of a
silicon-nitride based compound. In this embodiment, SiCN is used.
The thickness of the first insulating layer 10 is in a range from
about 3 nm to about 5 nm. The first insulating layer may be made of
CVD or ALD.
[0026] In one embodiment, the ALD method includes a step of
introducing a precursor material for a silicon source, including,
but not limited to, disilane (DIS), dichlorosilane (DCS),
hexa-chloride-disilane (HCD) or silane. Then, a carbon source gas
including hydrocarbon (CA) gas, such as, but not limited to,
ethylene (C.sub.2H.sub.4) and a nitrogen source gas such as, but
not limited to, ammonia (NH.sub.3) are introduced, thereby forming
a single layer of SiCN. By repeating the above operations, a SiCN
layer with a desirable thickness can be obtained.
[0027] Next, as shown in FIG. 2B, the p-channel region is covered
by a photoresist layer 70B and ion implantation NLDD for a
lightly-doped drain (LDD) is performed on the n-channel layer. A
dopant for NLDD is phosphorous and/or arsenic and a dose amount is
in a range from about 1.times.10.sup.14 cm.sup.-2 to about
1.times.10.sup.15 cm.sup.-2. The ion implantation is performed by
tilting the substrate with respect to the ion beam direction and
may be repeatedly performed by rotating the substrate by 90, 180
and 270 degrees. After the ion implantation, the photo resist layer
70B is removed by, for example, a plasma ashing process.
[0028] After removing the photoresist layer 70B, a post-annealing
procedure is performed to re-crystalize the amorphization regions
caused by the ion implantation and to activate the implanted
impurities. The annealing operation may be a rapid thermal
annealing (RTA) process at a temperature in a range from about
900.degree. C. to about 1400.degree. C. for about 1 millisecond to
about 5 seconds. The annealing operation include a pre-heat step at
a temperature from about 200.degree. C. to about 700.degree. C. for
about 50 to about 300 seconds. In the present embodiment, the
pre-heat step is performed at a temperature of about
500-600.degree. C. for about 180 seconds. Also, in some
embodiments, the RTA process is performed at a temperature greater
than about 1000.degree. C. and for more than 1.5 seconds. In some
embodiments, the annealing operation is a millisecond thermal
annealing (MSA) process, utilizing a temperature up to
1,400.degree. C. for a few milliseconds or less, for example for
about 0.8 milliseconds to about 100 milliseconds. The annealing
operation may be performed after the LDD implantation for the
p-channel region is completed.
[0029] As shown in FIG. 2C, the n-channel region is covered by a
photoresist layer 70A and ion implantation PLDD for an LDD is
performed on the p-channel layer. A dopant for PLDD is boron
(BF.sup.2+), and a dose amount is in a range from about
1.times.10.sup.14 cm.sup.-2 to about 3.times.10.sup.15 cm.sup.-2.
The ion implantation is performed by tilting the substrate with
respect to the ion beam direction and may be repeatedly performed
by rotating the substrate by 90, 180 and 270 degrees. After the ion
implantation, the photo resist layer 70A is removed by, for
example, a plasma ashing process, and then annealing operation may
be performed. The order of the NLDD ion implantation and PLDD ion
implantation is interchangeable.
[0030] After the LDD implantation, a second insulating layer 80 is
formed over the first insulating layer 10 and a third insulating
layer 90 is formed over the second insulating layer 80, as shown in
FIG. 3A. The third insulating layer 90 protects the p-channel
region from the subsequent fabrication processes performed on the
n-channel region. The second and third insulating layers is formed
by dielectric materials such as silicon oxide, silicon nitride
(SiN), silicon oxynitride (SiON), silicon carbo-nitride (SiCN) and
SiOCN. In some embodiments, the second insulating layer 80 is made
of SiCN and the third insulating layer 90 is made of SiN. The
thickness of the second insulating layer 80 is in a range from
about 3 nm to about 5 nm, and the thickness of the third insulating
layer 90 is in a range from about 3 nm to about 10 nm, in some
embodiments. The second and third insulating layers may be formed
by CVD or ALD.
[0031] Then, as shown in FIG. 3B, the p-channel region is covered
by a photoresist layer 75B, and anisotropic etching is performed on
the stacked insulating layers in the n-channel region, so that
sidewall spacers are formed on both side surfaces of the dummy gate
structures. The sidewall spacers in the n-channel region at this
stage are constituted of the first insulating layer 10A, the second
insulating layer 80A and the third insulating layer 90A.
[0032] After the sidewall spacers for the n-channel region are
formed, the fin structure NFIN in the n-channel region is recessed
down below the upper surface of the isolation insulating layer STI,
as shown in FIG. 3B so as to form recessed portions 100. Then, as
shown in FIG. 3C, the photoresist layer 75B is removed.
[0033] As shown in FIG. 4A, a strain material for the source/drain
is epitaxially formed in the recessed portions 100. By using a
strain material 110 which has a lattice constant different from
that of the channel region of the fin structure, appropriate stress
is applied to the channel region so as to increase carrier mobility
in the channel region. For the n-type FET, when the channel region
is made of Si, a silicon compound including P (SiP) and/or C (SiC)
is used. In this embodiment, SiP is epitaxially formed in the
recessed portions 110.
[0034] After the strain material 110 is formed, the third
insulating layer 90A in the sidewall spacers of the n-channel
region and 90 in the p-channel region are removed, by using
appropriate etching operations, as shown in FIG. 4B. When the third
insulating layer is made of SiN, wet etching using H.sub.3PO.sub.4
is used.
[0035] The, as shown in FIG. 4C, a fourth insulating layer 120 is
formed over the n-channel region and the p-channel region. The
fourth insulating layer 120 protects the n-channel region from the
subsequent fabrication processes performed on the p-channel region.
The fourth insulating layer is formed by dielectric materials such
as silicon oxide, silicon nitride (SiN), silicon oxynitride (SiON),
silicon carbo-nitride (SiCN) and SiOCN. In some embodiments, the
fourth insulating layer 120 is made of SiN. The thickness of the
fourth insulating layer 120 is in a range from about 3 nm to about
10 nm, in some embodiments. The fourth insulating layer may be
formed by CVD or ALD.
[0036] As shown in FIG. 5A, after the n-channel region is covered
by a photoresist layer 75A, anisotropic etching is performed on the
stacked insulating layers in the p-channel region, so that sidewall
spacers of the fourth insulating layer are formed on both sides of
the dummy gate structures of the p-channel region. The sidewall
spacers in the p-channel region at this stage are constituted of
the first insulating layer 10B, the second insulating layer 80B and
the fourth insulating layer 120B.
[0037] After the sidewall spacers for the p-channel region are
formed, the fin structure PFIN in the p-channel region is recessed
down below the upper surface of the isolation insulating layer STI,
as shown in FIG. 5B, so as to form recessed portions 105. Then, as
shown in FIG. 5C, the photoresist layer 75A is removed.
[0038] As shown in FIG. 5C, a strain material for the source/drain
is epitaxially formed in the recessed portions 105. By using a
strain material 130 which has a lattice constant different from
that of the channel region of the fin structure, appropriate stress
is applied to the channel region so as to increase carrier mobility
in the channel region. For the p-type FET, when the channel region
is made of Si, a silicon compound including germanium (SiGe) or Ge
is used. In this embodiment, SiGe is epitaxially formed in the
recessed portions 105.
[0039] After the strain material 130 is formed, the fourth
insulating layer 120B in the sidewall spacers of the p-channel
region and 120 in the n-channel region are removed, by using
appropriate etching operations, as shown in FIG. 6A. When the
fourth insulating layer is made of SiN, wet etching using
H.sub.3PO.sub.4 is used. As this stage, the width W1 of the
sidewall spacers at the height of the upper surface of the dummy
gate electrode (30A or 30B) is in a range from about 5 nm to about
10 nm.
[0040] Then, as shown in FIG. 6B, an organic material layer 140 is
formed over the resultant structure shown in FIG. 6A. The organic
layer 140 includes photoresist or antireflective coating material.
The organic layer 140 is formed so that the dummy gate structures
are fully embedded in the organic layer 140.
[0041] The thickness of the formed organic layer 140 is reduced, as
shown in FIG. 6C, by using, for example, an etch-back operation. By
adjusting the etching time, the organic layer 140 having a
desirable thickness can be obtained. In one embodiment, the
thickness of the organic layer 140 is reduced to the level
substantially the same as the height of the upper surface of the
dummy gate electrode layers 30A and 30B.
[0042] Next, the first mask layers 40A, 40B and the second mask
layers 50A, 50B are removed, by using an etch-back process. The
organic material layer 140 is then removed by, for example, an
ashing operation using O.sub.2 plasma.
[0043] By the operations to remove the mask layers and the organic
material layer, the upper portions of the sidewall spacers 10A, 80A
of the n-channel region and the sidewalls 10B, 80B of the p-channel
region are also removed. The resultant structure is shown in FIG.
7A. In FIG. 7A and thereafter, the sidewall structure of 10A, 80A
and 10B, 80B are illustrated by one layer of sidewall spacers 81A
and 81B, respectively, for simplification.
[0044] During the operation of removing the mask layers, the
surfaces of the sidewalls 81A and 81B and the upper surface of the
dummy gate electrodes 30A and 30B are oxidized forming oxide layers
11A and 11B (on the sidewalls), 31A and 31B (on the dummy gate
electrodes) and 111 and 131 (on the strain materials in the S/D),
as shown in FIG. 7A. The oxidized layers 11A and 11B is made of
silicon dioxide or silicon dioxide containing carbon and/or
nitrogen (collectively, silicon-oxide based material).
[0045] Then, as shown in FIG. 7B, sidewall spacers 95A and 95B are
formed by depositing a fifth insulating layer and anisotropically
etching the deposited fifth insulating layer.
[0046] The fifth insulating layer is formed by an ALD method at
temperature ranging from about 450 to about 550.degree. C. In the
etching operation, transform coupled plasma (TCP) with process
gases including CH.sub.4, CHF.sub.3, O.sub.2, HBr, He, Cl.sub.2,
NF.sub.3, and/or N.sub.2 is used with changing power and/or bias
conditions to obtain the desirable sidewall spacer structure. The
etching is followed by a wet clean operation to remove the polymer
residue formed during the etching operation.
[0047] In some embodiments, the fifth insulating layer is made of
SiCN, SiOCN or SiN. The thickness of the fifth insulating layer as
deposited is in a range from about 2 nm to about 4 nm. The width W2
of the sidewall spacers 95A and 95B is at the height of the upper
surface of the dummy gate electrode (30A or 30B) is in a range from
about 8 nm to about 14 nm, in some embodiments.
[0048] In some embodiments, the interface L1A (L1B) between the
sidewall 95A (95B) and the oxide layer 11A (11B) is located at the
interface between the strain material layer 110 (130) and the fin
structure NFIN (PFIN) at the surface thereof, as shown in FIG. 7B.
In other words, the thickness of the sidewalls 81A (81B) and the
thickness of the oxide layer 11A (11B) are adjusted so as to adjust
the location of the interface L1A (L1B). Accordingly, as shown in
FIG. 7B, the lateral bottom end of the sidewall 95A (95B) is
located above the strain material layer 110 (130) of the S/D. By
using the sidewalls 95A and 95B, electrical isolation between the
later formed S/D contacts and gate electrodes can be improved.
[0049] After the sidewalls 95A and 95B are formed, as shown in FIG.
7C, a contact-etch stop layer (CESL) 145 is formed over the
resultant structure of FIG. 7B. The CESL 145 includes one or more
layers of a silicon-nitride based compound such as SiN, SiON, SiCN
or SiOCN. In this embodiment, SiN is used as the CESL 145. The
thickness of the CESL 145 is in a range from about 3 nm to about 5
nm. The CESL 145 may be made of CVD or ALD.
[0050] After the CESL 145 is formed, an interlayer dielectric (ILD)
layer 150 is formed over the resultant structure of FIG. 7C. As
shown in FIG. 8A, the ILD layer 150 is formed such that the dummy
gate structures with the sidewall spacers are fully embedded in the
ILD layer 150.
[0051] The ILD layer 150 may be formed by CVD, HDPCVD, flowable
CVD, spin-on deposition, PVD or sputtering, or other suitable
methods. The ILD layer 150 includes silicon oxide, silicon
oxynitride, a low-k material, and/or other suitable dielectric. The
ILD layer 150 is conformably deposited and then planarized by a CMP
process, as shown in FIG. 8B. The dummy gate structures serves as a
planarization stopper for the CMP process. In other words, the CMP
process is stopped at the exposure of the top surface of the dummy
gate structures, as shown in FIG. 8B.
[0052] As shown in FIG. 8C, the dummy gate electrodes 30A, 30B and
the dummy gate dielectric layers 20A, 20B are removed, thereby
providing openings 155A and 155B between the spacer elements 81A in
the n-channel region and the spacer elements 81B in the p-channel
region, respectively. The dummy gate electrodes 30A and 30B are
removed by an etching solution such as, for example, aqueous
ammonia, and/or other suitable etchant. In an alternative
embodiment, the dummy gate electrodes 30A and 30B are be removed by
a suitable dry etching process. Exemplary etchants include chlorine
based etchants. In some embodiments, the dummy gate dielectric
layers 20A and 20B are removed using an etching process (wet etch,
dry etch, plasma etch, etc.). The removal of the dummy gate
dielectric layers 20A and 20B expose a top surface of the channel
layers in the fin structures.
[0053] As shown in FIG. 9A, metal gate structures are formed in the
openings 155A, 155B provided by the removal of the dummy gate
structures. The gate structure for the n-type FET includes a gate
dielectric layer 161A and a metal gate layer 170A, and the gate
structure for the p-type FET includes a gate dielectric layer 161B
and a metal gate layer 170B.
[0054] In some embodiments, the gate dielectric layers 161A and
161B includes one or more layers of metal oxides such as a high-k
metal oxide. Examples of metal oxides used for high-k dielectrics
include oxides of Li, Be, Mg, Ca, Sr, Sc, Y, Zr, Hf, Al, La, Ce,
Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and/or mixtures
thereof. In this embodiment, hafnium oxide (HfO.sub.2) is used. The
gate dielectric layers 161A and 161B may be formed by ALD, CVD,
PVD, and/or other suitable methods.
[0055] The metal gate layers 170A and 170B includes one or more
layers of Al, Cu, W, Ti, Ta, TiN, TiAl, TiAlC, TiAlN, TaN, NiSi,
CoSi, other conductive materials with a work function compatible
with the substrate material, or combinations thereof. The metal
gate layers 170A and 170B may be formed by CVD, PVD, plating,
and/or other suitable processes. One or more CMP processes can be
performed during the formation of the gate structures. A damascene
process can be employed to fabricate the gate structures.
[0056] In some embodiments, one or more work function adjustment
layers (not shown) are interposed between the gate dielectric layer
161A, 161B and the metal gate layer 170A, 170B. The work function
adjustment layers are made of a conductive material such as a
single layer of TiN, TaN, TaAlC, TiC, TaC, Co, Al, TiAl, HfTi,
TiSi, TaSi or TiAlC, or a multilayer of two or more of these
materials. For the n-channel FET, one or more of TaN, TaAlC, TiN,
TiC, Co, TiAl, HfTi, TiSi and TaSi is used as the work function
adjustment layer, and for the p-channel FET, one or more of TiAlC,
Al, TiAl, TaN, TaAlC, TiN, TiC and Co is used as the work function
adjustment layer.
[0057] Next, the metal gate layers 170A and 170B are etched back to
a certain depth to partially remove the metal gate layers, in order
to form buried gate electrode 171A and 171B, as shown in FIG. 9B. A
sixth insulating layer 180 is deposited to fill the recessed
portions provided by the partial removal of the metal gate layers
170A and 170B. The sixth insulating layer may include one or more
layers of a silicon-nitride based compound such as SiN, SiON, SiCN
or SiOCN. In this embodiment, SiN is used as the sixth insulating
layer 180. The sixth insulating layer 180 may be formed by a PVD,
CVD, PECVD, APCVD, LPCVD, HDPCVD, ALD, and/or other processes. By
applying a planarization operation such as a CMP process, the sixth
insulating layer 180 formed on the ILD layer 150 is removed so that
cap layers 181A and 181B are left on the buried metal gate
electrodes 171A and 171B, as shown in FIG. 9C.
[0058] Then, by using a lithography operation, a resist layer is
patterned to form contact hole patterns above the S/D regions of
the n-channel FET and p-channel FET. By using the patterned resist
mask, the ILD layer 150 is etched to form S/D contact holes 157A
and 157B, as shown in FIGS. 10A and 10B. In one embodiment, the
etching is preferably carried out in a HDP using an etching gas
such as C.sub.4F.sub.8 and CH.sub.3F to obtain high selectivity to
the SiN layers. As shown in FIG. 10A, the etching of the ILD layer
150 made of silicon oxide or oxide based insulating material stops
at the CESL 145A, 145B made of SiN or nitride based insulating
material. Accordingly, even if the contact hole resist patterns are
laterally shifted toward the gate electrode due to mis-alignment in
the lithography operation, the etching of the ILD layer does not
remove the CESL on the sidewalls of the gate structure and the
contact holes would not touch the gate electrodes. Thus, the
contact holes are formed by being self-aligned to the S/D regions
(i.e., SAC being formed). Further, since the additional sidewall
layer 95A and 95B are formed, electrical isolation between the
later formed S/D contacts and the gate electrodes can further be
improved.
[0059] After the etching stops at the CESL, an additional etching
operation is performed to remove the CESL in the bottom of the
contact holes 157A and 157B as shown in FIG. 10B. In some
embodiments, the oxide layers 111 and 131 formed on the strain
material of the S/D regions may also be removed during or after the
CESL etching.
[0060] After the surface of the strain materials 110 and 130 of the
S/D regions of the n-type FET and p-type FET, respectively, are
exposed, metalized layers 115 for the S/D regions of the n-type FET
and 135 for the S/D regions of the p-type FET are formed, as shown
in FIG. 10C. The metallized layers include one or more silicide
layers such as TiSi, TaSi, WSi, NiSi, CoSi, or other suitable
transition metal silicide. The silicide layers 115 for the n-type
FET may be the same as or different from the silicide layers 135
for the p-type FET.
[0061] FIGS. 11A and 11B show an S/D contact formation process. The
adhesion layers 200A and 200B made of, for example, Ti or Ti--W,
may be formed by CVD, PVD, plating, and/or other suitable processes
on the side faces of the contact holes 157A and 157B. Then, the
barrier layers 210A and 210B made of, for example, TiN, are
deposited through a sputtering or evaporation process over the
adhesion layers 200A, 200B. The adhesion layer 200A and/or barrier
layer 210A for the n-type FET may be the same as or different from
the adhesion layer 200B and/or the barrier layer 210B for the
p-type FET, respectively.
[0062] Next, a tungsten (W) layer 190 is deposited by CVD as shown
in FIG. 11A. By performing a CMP operation to remove the W layer
190 deposited on the ILD layer 150, the S/D contact having W-plug
structures 190A and 190B, as shown in FIG. 11B, can be
obtained.
[0063] FIGS. 12A and 12B show the enlarged cross sectional view of
the S/D contact hole portions. FIGS. 12A and 12B correspond to, for
example, the n-channel regions of FIGS. 9C and 11B, respectively.
However, in FIGS. 12A and 12B, unlike FIGS. 9C and 11B, two gate
structures, i.e., first and second gate structures for two
n-channel FETs are arranged. The first gate structures includes the
high-k gate dielectric layer 161A, the metal gate electrode layer
171A, the cap layer 181A and sidewall spacers including 81A, 11A
and 95A and the CESL 145A, while the second gate structures
includes the high-k gate dielectric layer 161A', the metal gate
electrode layer 171A', the cap layer 181A' and sidewall spacers
including 81A', 11A' and 95A' and CESL 145A. The first and second
gate structures are fabricated simultaneously, and the materials
and configurations are substantially the same with each other.
Further, as shown in FIG. 12A, the strain layer 110 for the S/D
region is disposed between the first and second gate
structures.
[0064] As shown in FIG. 12A, at the stage after the formation of
the cap layer 181A as shown in FIG. 9C, the sidewall spacer 81A has
the thickness Wa at the height of the upper surface of the metal
gate electrode layer 171A in a range from about 6 nm to about 10
nm. The sidewall spacer 95A has the thickness Wb at the height of
the upper surface of the metal gate electrode layer 171A in a range
from about 2 nm to about 4 nm. The CESL 145A has the thickness We
at the height of the upper surface of the metal gate electrode
layer 171A in a range from about 3 nm to about 5 nm. The oxide
layer 11A has the thickness at the height of the upper surface of
the metal gate electrode layer 171A in a range from about 0.5 nm to
about 1 nm.
[0065] As shown in FIG. 12B, at the stage after the formation of
the W plug is formed as shown in FIG. 11B, the sidewall spacers
including 81A, 11A, 95A and 145A has the thickness We at the height
of the upper surface of the metal gate electrode layer 171A in a
range from about 8 nm to about 16 nm. As shown in FIG. 12B, the
sidewall spacer layer includes at least four layers, 81A, 11A, 95A
and 145A. Since the sidewall spacer layer 81A may have two or more
layers (e.g., 10A and 80A), the number of the sidewall spacer
layers may be five or more. If the spacer layers 95A and 145A are
made of the same material, and it is not possible to clearly
distinguish these two layers, the sidewall spacer can have three
layers including layer 81A made of a silicon-nitride based
material, layer 11A made of a silicon-oxide based material, and a
silicon-nitride based material, layer (95A and 145A).
[0066] Among the sidewall spacer layers, the bottoms of the spacer
layer 95A and the CESL 145A are located above the strain layer 110
of the S/D region. Further, a height of the sidewall spacers is the
same as a height of the cap layer 181A or a few nanometers lower
than the height of the cap layer 181A, i.e., the height of the
sidewall spacers is substantially the same as the height of the cap
layer 181A.
[0067] Since the layer 95A is disposed between the oxide layer 11A
and the CESL 145A, the total thickness of the sidewall spacer can
be increased and electrical isolation between the S/D contact (W
plug) and the gate electrode can be improved.
[0068] It is understood that the device shown in FIG. 11B undergoes
further CMOS processes to form various features such as
interconnect metal layers, dielectric layers, passivation layers,
etc.
[0069] The various embodiments or examples described herein offer
several advantages over the existing art. For example, by
introducing an additional sidewall spacer (e.g., 95A, 95B), it is
possible to improve the immunity against the etching solution
(e.g., dilute-HF and/or aqueous ammonia) for the spacer dielectric
region, for example due to surface tension and capillary effects.
It is also possible to improve electrical isolation between the
gate electrode and the S/D contact (W plug), and device life time
under hot carrier degradation can also be improved.
[0070] It will be understood that not all advantages have been
necessarily discussed herein, no particular advantage is required
for all embodiments or examples, and other embodiments or examples
may offer different advantages.
[0071] According to one aspect of the present disclosure, a
semiconductor device includes a gate structure disposed over a
substrate, and sidewall spacers disposed on both side walls of the
gate structure. The sidewall spacers includes at least four spacer
layers including first to fourth spacer layers stacked in this
order from the gate structure.
[0072] In accordance with another aspect of the present disclosure,
in a method of manufacturing a semiconductor device, a gate
structure is formed over a substrate. A first sidewall spacer layer
is formed on a sidewall of the gate structure. An oxide layer, as a
second sidewall spacer layer, is formed on the first sidewall
spacer layer. A third sidewall spacer layer is formed on the second
sidewall spacer layer. A contact etching stop layer is formed on
the third sidewall spacer layer and the substrate.
[0073] According to yet another aspect of the present disclosure,
in a method of manufacturing a semiconductor device, a first dummy
gate structure for an n-channel transistor with a mask layer
disposed thereon is formed over a substrate. A first insulating
layer is formed over the first dummy gate structure. First ions are
implanted through the first insulating layer for the n-channel
transistor. A second insulating layer is formed over the first
insulating layer. A third insulating layer is formed over the
second insulating layer. The first to third insulating layers are
etched, thereby forming a first n-sidewall spacer layer on a side
wall of the first dummy gate structure. A first source/drain
structure is formed in the substrate on a side portion of the first
n-sidewall spacer. After forming the first source/drain structure,
the third insulating layer is removed from the first n-sidewall
spacer layer. An oxide layer, as a second sidewall spacer layer, is
formed on the first n-sidewall spacer layer. A third n-sidewall
spacer layer is formed on the second sidewall spacer layer. A
contact etching stop layer is formed on the n-third sidewall spacer
layer and the substrate.
[0074] The foregoing outlines features of several embodiments or
examples so that those skilled in the art may better understand the
aspects of the present disclosure. Those skilled in the art should
appreciate that they may readily use the present disclosure as a
basis for designing or modifying other processes and structures for
carrying out the same purposes and/or achieving the same advantages
of the embodiments or examples introduced herein. Those skilled in
the art should also realize that such equivalent constructions do
not depart from the spirit and scope of the present disclosure, and
that they may make various changes, substitutions, and alterations
herein without departing from the spirit and scope of the present
disclosure.
* * * * *