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System for processing semiconductor devices
Grant 11,355,471 - Huang , et al. June 7, 2 | 2022-06-07 |
Package structure
Grant 11,282,766 - Ku , et al. March 22, 2 | 2022-03-22 |
Selective deposition of barrier layer
Grant 11,251,073 - Huang , et al. February 15, 2 | 2022-02-15 |
Memory devices and methods of manufacture thereof
Grant 11,251,314 - Kalnitsky , et al. February 15, 2 | 2022-02-15 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 11,239,138 - Cheng , et al. February 1, 2 | 2022-02-01 |
FinFET devices with a fin top hardmask
Grant 11,227,932 - Ching , et al. January 18, 2 | 2022-01-18 |
Image Sensor Grid And Method Of Manufacturing Same
App 20210351225 - CHEN; H. L. ; et al. | 2021-11-11 |
High-implant Channel Semiconductor Device And Method For Manufacturing The Same
App 20210344303 - CHEN; Chia-Chung ; et al. | 2021-11-04 |
Semiconductor Device And Method Of Manufacturing The Same
App 20210343715 - WU; Guo-Huei ; et al. | 2021-11-04 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 11,164,857 - Chen , et al. November 2, 2 | 2021-11-02 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 11,158,588 - Tsai , et al. October 26, 2 | 2021-10-26 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 11,158,587 - Tsai , et al. October 26, 2 | 2021-10-26 |
Package with embedded heat dissipation features
Grant 11,133,237 - Hung , et al. September 28, 2 | 2021-09-28 |
Semiconductor Device and Method
App 20210296112 - Fan; Sheng-Ting ; et al. | 2021-09-23 |
Semiconductor Device Including Standard Cells
App 20210257388 - GUO; Ta-Pen ; et al. | 2021-08-19 |
Packaged semiconductor devices and methods of packaging thereof
Grant 11,094,622 - Chen August 17, 2 | 2021-08-17 |
Anti-reflective coating materials
Grant 11,094,541 - Su , et al. August 17, 2 | 2021-08-17 |
Mechanism for FinFET well doping
Grant 11,075,108 - Tsai , et al. July 27, 2 | 2021-07-27 |
Image sensor grid and method of manufacturing same
Grant 11,069,740 - Chen , et al. July 20, 2 | 2021-07-20 |
Interconnect structure having a carbon-containing barrier layer
Grant 11,062,909 - Lin , et al. July 13, 2 | 2021-07-13 |
Solderless interconnection structure and method of forming same
Grant 11,043,462 - Lin , et al. June 22, 2 | 2021-06-22 |
Package-on-package (PoP) device with integrated passive device in a via
Grant 10,978,433 - Hsiao , et al. April 13, 2 | 2021-04-13 |
Complimentary metal-oxide-semiconductor (CMOS) with low contact resistivity and method of forming same
Grant 10,978,451 - Wann , et al. April 13, 2 | 2021-04-13 |
Methods of packaging semiconductor devices including placing semiconductor devices into die caves
Grant 10,964,594 - Lin , et al. March 30, 2 | 2021-03-30 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,950,514 - Yu , et al. March 16, 2 | 2021-03-16 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 10,950,577 - Hsieh , et al. March 16, 2 | 2021-03-16 |
Structure of a fin field effect transistor (FinFET)
Grant 10,937,894 - Lee , et al. March 2, 2 | 2021-03-02 |
Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof
Grant 10,872,878 - Wang , et al. December 22, 2 | 2020-12-22 |
Dam for three-dimensional integrated circuit
Grant 10,867,878 - Wang , et al. December 15, 2 | 2020-12-15 |
Semiconductor device
Grant 10,861,830 - Yeh , et al. December 8, 2 | 2020-12-08 |
Metal contact structure and method of forming the same in a semiconductor device
Grant 10,825,724 - Lin , et al. November 3, 2 | 2020-11-03 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,825,693 - Lin , et al. November 3, 2 | 2020-11-03 |
Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
Grant 10,818,583 - Chen , et al. October 27, 2 | 2020-10-27 |
Packaging devices and methods of manufacture thereof
Grant 10,811,369 - Chen , et al. October 20, 2 | 2020-10-20 |
Semiconductor package for thermal dissipation
Grant 10,811,389 - Yu , et al. October 20, 2 | 2020-10-20 |
Protrusion bump pads for bond-on-trace processing
Grant 10,804,192 - Liang , et al. October 13, 2 | 2020-10-13 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,790,252 - Lei , et al. September 29, 2 | 2020-09-29 |
Memory devices and methods of manufacture thereof
Grant 10,770,598 - Kalnitsky , et al. Sep | 2020-09-08 |
Image Sensor Grid And Method Of Manufacturing Same
App 20200279887 - Chen; H. L. ; et al. | 2020-09-03 |
Interconnect structure and method of forming same
Grant 10,755,974 - Chu , et al. A | 2020-08-25 |
Anti-reflective gap filling materials and methods
Grant 10,755,927 - Su , et al. A | 2020-08-25 |
Biosensor device and related method
Grant 10,746,693 - Huang , et al. A | 2020-08-18 |
Embedded transistor
Grant 10,748,907 - Ting , et al. A | 2020-08-18 |
Fan-out package and methods of forming thereof
Grant 10,741,511 - Shih , et al. A | 2020-08-11 |
Semiconductor devices, methods of manufacture thereof, and capacitors
Grant 10,727,294 - Chiou , et al. | 2020-07-28 |
Methods and apparatus for MOS capacitors in replacement gate process
Grant 10,720,361 - Wang , et al. | 2020-07-21 |
Semiconductor device and a method for fabricating the same
Grant 10,714,586 - Hsu , et al. | 2020-07-14 |
Embedded transistor
Grant 10,700,070 - Ting , et al. | 2020-06-30 |
Cell layout and structure
Grant 10,664,639 - Hsieh , et al. | 2020-05-26 |
Method for non-resist nanolithography
Grant 10,665,696 - Chen , et al. | 2020-05-26 |
FinFET semiconductor device with germanium diffusion over silicon fins
Grant 10,665,674 - Lee , et al. | 2020-05-26 |
Packages and packaging methods for semiconductor devices, and packaged semiconductor devices
Grant 10,658,337 - Yu , et al. | 2020-05-19 |
Interconnect Structure Having a Carbon-Containing Barrier Layer
App 20200144065 - Lin; Rueijer ; et al. | 2020-05-07 |
Power gating for three dimensional integrated circuits (3DIC)
Grant 10,643,986 - Chao , et al. | 2020-05-05 |
Packaging devices and methods of manufacture thereof
Grant 10,629,555 - Chen , et al. | 2020-04-21 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,629,508 - Yu , et al. | 2020-04-21 |
Package with embedded heat dissipation features
Grant 10,629,510 - Hung , et al. | 2020-04-21 |
Structure of a fin field effect transistor (FinFET)
Grant 10,535,757 - Lee , et al. Ja | 2020-01-14 |
Semiconductor device
Grant 10,535,638 - Yeh , et al. Ja | 2020-01-14 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 10,529,673 - Tsai , et al. J | 2020-01-07 |
Interconnect structure having a carbon-containing barrier layer
Grant 10,529,575 - Lin , et al. J | 2020-01-07 |
Method for a stacked and bonded semiconductor device
Grant 10,522,496 - Cheng , et al. Dec | 2019-12-31 |
Packaging devices and methods of manufacture thereof
Grant 10,522,480 - Chen , et al. Dec | 2019-12-31 |
Finfet with self-aligned source/drain
Grant 10,522,634 - Huang , et al. Dec | 2019-12-31 |
Package on-package (PoP) device with integrated passive device in a via
Grant 10,515,938 - Hsiao , et al. Dec | 2019-12-24 |
Semiconductor devices having Fin Field Effect Transistor (FinFET) structures and manufacturing and design methods thereof
Grant 10,515,956 - Lee , et al. Dec | 2019-12-24 |
Semiconductor devices, methods of manufacturing thereof, and image sensor devices
Grant 10,515,994 - Chuang , et al. Dec | 2019-12-24 |
Semiconductor devices having reduced noise
Grant 10,515,990 - Hung , et al. Dec | 2019-12-24 |
Memory devices and methods of manufacture thereof
Grant 10,510,902 - Kalnitsky , et al. Dec | 2019-12-17 |
Semiconductor device and method
Grant 10,510,856 - Hsieh , et al. Dec | 2019-12-17 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,510,716 - Yu , et al. Dec | 2019-12-17 |
Packaging devices and methods for semiconductor devices
Grant 10,510,687 - Hung Dec | 2019-12-17 |
Semiconductor devices employing a barrier layer
Grant 10,510,655 - Chang Chien , et al. Dec | 2019-12-17 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 10,510,719 - Yu , et al. Dec | 2019-12-17 |
Complimentary metal-oxide-semiconductor (CMOS) with low contact resistivity and method of forming same
Grant 10,510,754 - Wann , et al. Dec | 2019-12-17 |
FinFET with two fins on STI
Grant 10,510,853 - Vellianitis , et al. Dec | 2019-12-17 |
Uniform-size bonding patterns
Grant 10,510,793 - Chen , et al. Dec | 2019-12-17 |
Semiconductor device package including conformal metal cap contacting each semiconductor die
Grant 10,510,561 - Tsai , et al. Dec | 2019-12-17 |
Semiconductor device and formation thereof
Grant 10,505,017 - Duriez , et al. Dec | 2019-12-10 |
FinFET semiconductor device with germanium diffusion over silicon fins
Grant 10,504,993 - Lee , et al. Dec | 2019-12-10 |
Wafer processing method and apparatus
Grant 10,504,756 - Huang , et al. Dec | 2019-12-10 |
Redistribution layers in semiconductor packages and methods of forming same
Grant 10,475,768 - Hsieh , et al. Nov | 2019-11-12 |
Tuning tensile strain on FinFET
Grant 10,453,842 - Ching , et al. Oc | 2019-10-22 |
Interconnect Structure and Method of Forming the Same
App 20190304792 - Lin; Rueijer ; et al. | 2019-10-03 |
Robust through-silicon-via structure
Grant 10,396,014 - Lin , et al. A | 2019-08-27 |
Fan-out package and methods of forming thereof
Grant 10,366,960 - Shih , et al. July 30, 2 | 2019-07-30 |
Methods and apparatus for MOS capacitors in replacement gate process
Grant 10,354,920 - Wang , et al. July 16, 2 | 2019-07-16 |
Hybrid bonding systems and methods for semiconductor wafers
Grant 10,354,972 - Liu , et al. July 16, 2 | 2019-07-16 |
Integrated circuit having FinFETS with different fin profiles
Grant 10,340,270 - Liaw | 2019-07-02 |
Multiple nozzle slurry dispense scheme
Grant 10,335,920 - Hsieh , et al. | 2019-07-02 |
Solderless interconnection structure and method of forming same
Grant 10,319,691 - Lin , et al. | 2019-06-11 |
Method of forming an interconnect structure
Grant 10,312,098 - Lin , et al. | 2019-06-04 |
Method of manufacturing semiconductor devices having conductive plugs with varying widths
Grant 10,304,818 - Tsai , et al. | 2019-05-28 |
Complimentary metal-oxide-semiconductor (CMOS) with low contact resistivity and method of forming same
Grant 10,304,826 - Wann , et al. | 2019-05-28 |
Method for an image sensor device
Grant 10,297,632 - Chen , et al. | 2019-05-21 |
Mechanism for FinFET well doping
Grant 10,297,492 - Tsai , et al. | 2019-05-21 |
Substrateless integrated circuit packages and methods of forming same
Grant 10,290,604 - Huang , et al. | 2019-05-14 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,290,513 - Lin , et al. | 2019-05-14 |
Molding structure for wafer level package
Grant 10,283,427 - Yu , et al. | 2019-05-07 |
Semiconductor devices and FinFETs
Grant 10,269,971 - Holland | 2019-04-23 |
Semiconductor device and method
Grant 10,269,632 - Chu , et al. | 2019-04-23 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,269,673 - Yu , et al. | 2019-04-23 |
Interconnect structure and method of forming the same
Grant 10,269,700 - Chiu , et al. | 2019-04-23 |
FinFETs with source/drain cladding
Grant 10,269,964 - Ching , et al. | 2019-04-23 |
Low noise amplifier
Grant 10,270,398 - Jin | 2019-04-23 |
Packaged semiconductor devices and methods of packaging thereof
Grant 10,269,693 - Chen | 2019-04-23 |
Semiconductor liner of semiconductor device
Grant 10,269,901 - Ching , et al. | 2019-04-23 |
Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
Grant 10,269,747 - Lei , et al. | 2019-04-23 |
Method of manufacturing a semiconductor device
Grant 10,262,974 - Yeh , et al. | 2019-04-16 |
Self-aligned double patterning
Grant 10,256,096 - Huang , et al. | 2019-04-09 |
Fin structure of semiconductor device
Grant 10,186,602 - Chen , et al. Ja | 2019-01-22 |
Temporary bonding scheme
Grant 10,170,387 - Lee , et al. J | 2019-01-01 |
Uniform-size bonding patterns
Grant 10,170,512 - Chen , et al. J | 2019-01-01 |
Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same
Grant 10,163,644 - Lin , et al. Dec | 2018-12-25 |
Protrusion bump pads for bond-on-trace processing
Grant 10,163,774 - Liang , et al. Dec | 2018-12-25 |
Methods of packaging semiconductor devices including placing semiconductor devices into die caves
Grant 10,163,711 - Lin , et al. Dec | 2018-12-25 |
Semiconductor package for thermal dissipation
Grant 10,163,861 - Yu , et al. Dec | 2018-12-25 |
Method for forming self-aligned contact
Grant 10,163,703 - Wang , et al. Dec | 2018-12-25 |
Molding structure for wafer level package
Grant 10,163,804 - Yu , et al. Dec | 2018-12-25 |
Package-on-package (PoP) device with integrated passive device in a via
Grant 10,163,873 - Hsiao , et al. Dec | 2018-12-25 |
Packaging devices and methods for semiconductor devices
Grant 10,163,821 - Hung Dec | 2018-12-25 |
FinFET with two fins on STI
Grant 10,164,031 - Vellianitis , et al. Dec | 2018-12-25 |
Method and apparatus of a three dimensional integrated circuit
Grant 10,157,252 - Chang , et al. Dec | 2018-12-18 |
Semiconductor devices having reduced noise
Grant 10,157,942 - Hung , et al. Dec | 2018-12-18 |
Carrier warpage control for three dimensional integrated circuit (3DIC) stacking
Grant 10,153,179 - Lin , et al. Dec | 2018-12-11 |
Semiconductor Device And A Method For Fabricating The Same
App 20180350928 - HUANG; Yi-Jyun ; et al. | 2018-12-06 |
Integrated circuit packages and methods of forming same
Grant 10,141,201 - Yu , et al. Nov | 2018-11-27 |
Semiconductor Device And A Method For Fabricating The Same
App 20180337244 - HSU; Chia-Ming ; et al. | 2018-11-22 |
Interconnect Structure and Method of Forming the Same
App 20180337056 - Lin; Rueijer ; et al. | 2018-11-22 |
Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices
Grant 10,128,208 - Hou , et al. November 13, 2 | 2018-11-13 |
Packaging methods and packaged semiconductor devices
Grant 10,128,175 - Lin , et al. November 13, 2 | 2018-11-13 |
Wafer bonding process and structure
Grant 10,128,209 - Liu , et al. November 13, 2 | 2018-11-13 |
Method of manufacturing a semiconductor device
Grant 10,121,698 - Lee , et al. November 6, 2 | 2018-11-06 |
Photoresist and method
Grant 10,114,286 - Wu , et al. October 30, 2 | 2018-10-30 |
Packaged semiconductor devices and packaging devices and methods
Grant 10,109,573 - Lin , et al. October 23, 2 | 2018-10-23 |
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
Grant 10,109,612 - Huang , et al. October 23, 2 | 2018-10-23 |
Hybrid bonding systems and methods for semiconductor wafers
Grant 10,103,122 - Liu , et al. October 16, 2 | 2018-10-16 |
Photoresist and method
Grant 10,095,113 - Lai , et al. October 9, 2 | 2018-10-09 |
Semiconductor device and method of forming same
Grant 10,090,167 - Chiu , et al. October 2, 2 | 2018-10-02 |
FinFET with trench field plate
Grant 10,090,390 - Ng , et al. October 2, 2 | 2018-10-02 |
Packaging devices and methods
Grant 10,079,200 - Liang , et al. September 18, 2 | 2018-09-18 |
Packaging devices and methods of manufacture thereof
Grant 10,079,213 - Chen , et al. September 18, 2 | 2018-09-18 |
Self-alignment for redistribution layer
Grant 10,074,595 - Yang , et al. September 11, 2 | 2018-09-11 |
Method for forming alignment marks and structure of same
Grant 10,074,612 - Chou , et al. September 11, 2 | 2018-09-11 |
Packages and packaging methods for semiconductor devices, and packaged semiconductor devices
Grant 10,074,631 - Yu , et al. September 11, 2 | 2018-09-11 |
Method of using a wafer cassette to charge an electrostatic carrier
Grant 10,068,789 - Chiou , et al. September 4, 2 | 2018-09-04 |
Bump structure for yield improvement
Grant 10,056,347 - Chiu , et al. August 21, 2 | 2018-08-21 |
Semiconductor device and manufacturing method thereof
Grant 10,050,147 - Liang , et al. August 14, 2 | 2018-08-14 |
Apparatus and method for wafer level bonding
Grant 10,049,901 - Liu , et al. August 14, 2 | 2018-08-14 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 10,049,898 - Chen , et al. August 14, 2 | 2018-08-14 |
Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
Grant 10,049,989 - Tsai , et al. August 14, 2 | 2018-08-14 |
Semiconductor devices, FinFET devices, and manufacturing methods thereof
Grant 10,049,938 - Wang , et al. August 14, 2 | 2018-08-14 |
Memory devices and methods of manufacture thereof
Grant 10,043,919 - Kalnitsky , et al. August 7, 2 | 2018-08-07 |
Maranagoni dry with low spin speed for charging release
Grant 10,043,653 - Chen , et al. August 7, 2 | 2018-08-07 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 10,043,778 - Yu , et al. August 7, 2 | 2018-08-07 |
Alignment systems and wafer bonding systems and methods
Grant 10,037,968 - Huang , et al. July 31, 2 | 2018-07-31 |
Semiconductor devices having Fin field effect transistor (FinFET) structures and manufacturing and design methods thereof
Grant 10,037,994 - Lee , et al. July 31, 2 | 2018-07-31 |
Photoresist system and method
Grant 10,036,953 - Wu , et al. July 31, 2 | 2018-07-31 |
Packaging devices and methods of manufacture thereof
Grant 10,037,955 - Chen , et al. July 31, 2 | 2018-07-31 |
Interconnection structure with confinement layer
Grant 10,032,698 - Lo , et al. July 24, 2 | 2018-07-24 |
Packaged semiconductor devices and packaging methods thereof
Grant 10,032,662 - Liao , et al. July 24, 2 | 2018-07-24 |
Simulation scheme including self heating effect
Grant 10,019,545 - Jeng , et al. July 10, 2 | 2018-07-10 |
Protrusion bump pads for bond-on-trace processing
Grant 10,020,276 - Chen , et al. July 10, 2 | 2018-07-10 |
Protrusion bump pads for bond-on-trace processing
Grant 10,014,270 - Liang , et al. July 3, 2 | 2018-07-03 |
Structures having a tapering curved profile and methods of making same
Grant 10,008,459 - Tsai , et al. June 26, 2 | 2018-06-26 |
Semiconductor device and method
Grant 10,002,854 - Yeh , et al. June 19, 2 | 2018-06-19 |
Semiconductor device structure with conductive pillar and conductive line and method for forming the same
Grant 10,002,826 - Yang , et al. June 19, 2 | 2018-06-19 |
Process to etch semiconductor materials
Grant 10,002,922 - Colinge , et al. June 19, 2 | 2018-06-19 |
Methods for reducing contact resistance in semiconductors manufacturing process
Grant 9,997,631 - Yang , et al. June 12, 2 | 2018-06-12 |
FinFET with high mobility and strain channel
Grant 9,997,629 - Li , et al. June 12, 2 | 2018-06-12 |
Semiconductor device packages, packaging methods, and packaged semiconductor devices
Grant 9,991,247 - Chen , et al. June 5, 2 | 2018-06-05 |
Semiconductor Device And Manufacturing Method Thereof
App 20180151375 - HSU; Yu-Ling ; et al. | 2018-05-31 |
Cell having shifted boundary and boundary-shift scheme
Grant 9,984,192 - Yang , et al. May 29, 2 | 2018-05-29 |
Barrier structure for copper interconnect
Grant 9,984,975 - Lin , et al. May 29, 2 | 2018-05-29 |
Resistive random access memory (RRAM) with improved forming voltage characteristics and method for making
Grant 9,985,203 - Chen , et al. May 29, 2 | 2018-05-29 |
Cell layout and structure
Grant 9,984,191 - Hsieh , et al. May 29, 2 | 2018-05-29 |
Low dropout regulator and related method
Grant 9,977,441 - Chou , et al. May 22, 2 | 2018-05-22 |
Package with embedded heat dissipation features
Grant 9,978,660 - Hung , et al. May 22, 2 | 2018-05-22 |
Method for non-resist nanolithography
Grant 9,972,702 - Chen , et al. May 15, 2 | 2018-05-15 |
Barrier structure for copper interconnect
Grant 9,966,339 - Lin , et al. May 8, 2 | 2018-05-08 |
Bump structure and method of forming same
Grant 9,966,346 - Chen , et al. May 8, 2 | 2018-05-08 |
Method and apparatus for image sensor packaging
Grant 9,966,405 - Hsu , et al. May 8, 2 | 2018-05-08 |
Pillar design for conductive bump
Grant 9,953,948 - Hsieh , et al. April 24, 2 | 2018-04-24 |
Contact resistance control in epitaxial structures of finFET
Grant 9,953,875 - Cheng , et al. April 24, 2 | 2018-04-24 |
Through package via (TPV)
Grant 9,953,949 - Lin , et al. April 24, 2 | 2018-04-24 |
Method of forming a semiconductor device
Grant 9,953,878 - Huang , et al. April 24, 2 | 2018-04-24 |
Iii-v Semiconductor Layers, Iii-v Semiconductor Devices And Methods Of Manufacturing Thereof
App 20180108747 - VAN DAL; Mark ; et al. | 2018-04-19 |
Multi-wafer stacking by Ox-Ox bonding
Grant 9,941,249 - Tsai , et al. April 10, 2 | 2018-04-10 |
Semiconductor devices, methods of manufacture thereof, and inter-metal dielectric (IMD) structures
Grant 9,941,214 - Peng , et al. April 10, 2 | 2018-04-10 |
Devices and methods of packaging semiconductor devices
Grant 9,935,084 - Chen , et al. April 3, 2 | 2018-04-03 |
Semiconductor device packages and methods
Grant 9,935,038 - Wang , et al. April 3, 2 | 2018-04-03 |
Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices
Grant 9,917,068 - Hou , et al. March 13, 2 | 2018-03-13 |
III-V semiconductor layers, III-V semiconductor devices and methods of manufacturing thereof
Grant 9,876,088 - Van Dal , et al. January 23, 2 | 2018-01-23 |
Spin dispenser module substrate surface protection system
Grant 9,855,579 - Yang , et al. January 2, 2 | 2018-01-02 |
Method of forming a semiconductor structure
Grant 9,818,938 - Tu , et al. November 14, 2 | 2017-11-14 |
Biosensor calibration system and related method
Grant 9,797,976 - Wen , et al. October 24, 2 | 2017-10-24 |
Semiconductor device including Fin FET and manufacturing method thereof
Grant 9,680,017 - Lo , et al. June 13, 2 | 2017-06-13 |
Semiconductor device having a guard ring
Grant 9,659,879 - Yang , et al. May 23, 2 | 2017-05-23 |
Packaging devices and methods
Grant 9,653,418 - Liang , et al. May 16, 2 | 2017-05-16 |
Method for fabricating self-aligned contact in a semiconductor device
Grant 9,647,116 - Lee , et al. May 9, 2 | 2017-05-09 |
Method For Fabricating Self-aligned Contact In A Semiconductor Device
App 20170125586 - LEE; Chen-Ming ; et al. | 2017-05-04 |
Apparatus For Manufacturing A Thin Film And A Method Therefor
App 20170110312 - HSIAO; Tsai-Fu ; et al. | 2017-04-20 |
Semiconductor device and manufacturing method thereof
Grant 9,607,882 - Lin March 28, 2 | 2017-03-28 |
Semiconductor Device Including Fin Fet And Manufacturing Method Thereof
App 20170077286 - LO; Hung ; et al. | 2017-03-16 |
Semiconductor Device And Manufacturing Method Thereof
App 20170062265 - LIN; Hsiang-Wei | 2017-03-02 |
Semiconductor device including fin structures disposed over buffer structures and manufacturing method thereof
Grant 9,583,623 - Fung , et al. February 28, 2 | 2017-02-28 |
Semiconductor Device And Manufacturing Method Thereof
App 20170054023 - LI; Kun-Mu ; et al. | 2017-02-23 |
Method For Forming Semiconductor Device Structure
App 20170040451 - HUANG; Shin-Yeh ; et al. | 2017-02-09 |
Semiconductor Device Including Fin Structures Disposed Over Buffer Structures And Manufacturing Method Thereof
App 20170033220 - FUNG; Ka-Hing ; et al. | 2017-02-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20170025536 - LIANG; Chun-Sheng ; et al. | 2017-01-26 |
Finfet With Doped Isolation Insulating Layer
App 20170025535 - WU; Cheng-Ta ; et al. | 2017-01-26 |
Integrated Thermoelectric Devices In Fin Fet Technology
App 20170012194 - WANG; Jhong-Sheng ; et al. | 2017-01-12 |
Semiconductor device and fabricating method thereof
Grant 9,520,477 - Hung , et al. December 13, 2 | 2016-12-13 |
Low dropout regulator
Grant 9,513,646 - Lan December 6, 2 | 2016-12-06 |
FinFET semiconductor device having fins with stronger structural strength
Grant 9,496,259 - Chien , et al. November 15, 2 | 2016-11-15 |
Finfet Semiconductor Device Having Fins With Stronger Structural Strength
App 20160307894 - CHIEN; Chao-Hsin ; et al. | 2016-10-20 |
Semiconductor device including fin structures and manufacturing method thereof
Grant 9,472,620 - Wang , et al. October 18, 2 | 2016-10-18 |
Reduction of Edge Effects from Aspect Ratio Trapping
App 20160254152 - Cheng; Zhiyuan | 2016-09-01 |
Semiconductor Device Including Fin Structure With Two Channel Layers And Manufacturing Method Thereof
App 20160218217 - Lee; Tung Ying ; et al. | 2016-07-28 |
Squelch detector
Grant 9,319,041 - Wang , et al. April 19, 2 | 2016-04-19 |
Packaging through Pre-Formed Metal Pins
App 20150200171 - Yu; Chen-Hua ; et al. | 2015-07-16 |
FinFET with bottom SiGe layer in source/drain
Grant 8,963,258 - Yu , et al. February 24, 2 | 2015-02-24 |
Invisible Dummy Features and Method for Forming the Same
App 20140264961 - Huang; Wei-Chieh | 2014-09-18 |
Method And Apparatus For Improving Cmp Planarity
App 20140256134 - Lu; Hsin-Hsien ; et al. | 2014-09-11 |
Method and apparatus for improving CMP planarity
Grant 8,828,875 - Lu , et al. September 9, 2 | 2014-09-09 |
3D Packages and Methods for Forming the Same
App 20140225258 - Chiu; Tzu-Wei ; et al. | 2014-08-14 |
Methods and Apparatus for ESD Protection Circuits
App 20140225158 - Kuo; Hsi-Yu ; et al. | 2014-08-14 |
Tool Optimizing Tuning Systems And Associated Methods
App 20140207271 - Tsai; Po-Feng ; et al. | 2014-07-24 |
Voltage Level Shifter
App 20140184299 - CHUNG; Tao Wen ; et al. | 2014-07-03 |
Antenna Apparatus and Method
App 20140168014 - Chih; Lai Wei ; et al. | 2014-06-19 |
Methods and Apparatus for Package with Interposers
App 20140160688 - Lu; Chun-Lin ; et al. | 2014-06-12 |
Method For Determining Applicabilty Of A Processing Device, A Processing Path And A Processing Pattern
App 20140161361 - NAN; Ching-Hsi ; et al. | 2014-06-12 |
ESD Protection Apparatus
App 20140160606 - Su; Yu-Ti ; et al. | 2014-06-12 |
Method Of Forming Dielectric Films Using A Plurality Of Oxidation Gases
App 20140162425 - Chi; Liang-Chen ; et al. | 2014-06-12 |
Test Structure Placement on a Semiconductor Wafer
App 20140151699 - Wu; Chuan-Ling ; et al. | 2014-06-05 |
Package With A Fan-out Structure And Method Of Forming The Same
App 20140151890 - Mao; Yi-Chao ; et al. | 2014-06-05 |
Apparatus For Esd Protection
App 20140151809 - Lin; Wun-Jie ; et al. | 2014-06-05 |
SRAM Cell Comprising FinFETs
App 20140153322 - Liaw; Jhon-Jhy | 2014-06-05 |
Magnetoresistive Random Access Memory (mram) Differential Bit Cell And Method Of Use
App 20140146599 - ROMANOVSKYY; Sergiy | 2014-05-29 |
Vccmin For A Dual Port Synchronous Random Access Memory (dpsram) Cell Utilized As A Single Port Synchronous Random Access Memory (spsram) Cell
App 20140146631 - Wu; Ching-Wei ; et al. | 2014-05-29 |
High Voltage Drain-Extended MOSFET Having Extra Drain-OD Addition
App 20140145261 - Chen; Yi-Sheng ; et al. | 2014-05-29 |
Semiconductor Integrated Device with Channel Region
App 20140138763 - Yang; Kai-Chieh ; et al. | 2014-05-22 |
Method for Forming Package-on-Package Structure
App 20140138816 - Lu; Chun-Lin ; et al. | 2014-05-22 |
Finfet Having Uniform Doping Profile And Method Of Forming The Same
App 20140138780 - Colinge; Jean-Pierre ; et al. | 2014-05-22 |
Digital Second-Order CDR Circuits
App 20140140458 - Fu; Chin-Ming ; et al. | 2014-05-22 |
Method For Fabricating A Semiconductor Device
App 20140127893 - Huang; Yu-Lien | 2014-05-08 |
Semiconductor Device and Method of Forming the Same
App 20140124869 - Chuang; Harry-Hak-Lay ; et al. | 2014-05-08 |
Reducing Pattern Loading Effect in Epitaxy
App 20140127886 - Sung; Hsueh-Chang ; et al. | 2014-05-08 |
FinFET with Dummy Gate on Non-Recessed Shallow Trench Isolation (STI)
App 20140117454 - Liu; Chi-Wen ; et al. | 2014-05-01 |
Method For Validating Measurement Data
App 20140121799 - Liu; Yu-Lun ; et al. | 2014-05-01 |
Surface Profile For Semiconductor Region
App 20140117512 - Chen; Chao-Hsuing ; et al. | 2014-05-01 |
Apparatus and Method for Lithography Patterning
App 20140113220 - Chu; Yuan-Chih | 2014-04-24 |
POP Structures and Methods of Forming the Same
App 20140103488 - Chen; Hsu-Hsien ; et al. | 2014-04-17 |
Guard Rings On Fin Structures
App 20140097496 - Hu; Chia-Hsin ; et al. | 2014-04-10 |
Method Of Optimizing Lithography Tools Utilization
App 20140078478 - Kao; Yao-Hwan ; et al. | 2014-03-20 |
Voltage Generating Circuit
App 20140063981 - HONG; Hyun-Sung | 2014-03-06 |
Multiple Device Voltage Electrostatic Discharge Clamp
App 20140063665 - Chen; Yu-Ren ; et al. | 2014-03-06 |
D Flip-Flop with High-Swing Output
App 20140021995 - Zhan; Hao-Jie ; et al. | 2014-01-23 |
Method and apparatus for improving capacitor capacitance and compatibility
Grant 8,604,531 - Tu December 10, 2 | 2013-12-10 |
Self-aligned Patterning For Deep Implantation In A Semiconductor Structure
App 20130323917 - LI; Chen-Yan ; et al. | 2013-12-05 |
Methods and Apparatus for Via Last Through-Vias
App 20130277789 - Chen; Szu-Ying ; et al. | 2013-10-24 |
Enhanced Euv Lithography System
App 20130258304 - Chang; Ching-Hsu ; et al. | 2013-10-03 |
Method Of Fabricating A Semiconductor Device
App 20130244434 - Lu; Kuei-Liang ; et al. | 2013-09-19 |
Self-repairing Memory
App 20130212449 - O'CONNELL; Cormac Michael | 2013-08-15 |
Method to improve bump reliability for flip chip device
Grant 8,497,584 - Chen , et al. July 30, 2 | 2013-07-30 |
Wordline Driver
App 20130170313 - EARLE; Adrian ; et al. | 2013-07-04 |
Wafer Level Packaging
App 20130102101 - Cheng; Chun-Wen ; et al. | 2013-04-25 |
Multi-Junction Solar Cells
App 20130081684 - Fiorenza; James ; et al. | 2013-04-04 |
Seal Ring Structure With A Metal Pad
App 20130082346 - Lin; Jeng-Shyan ; et al. | 2013-04-04 |
Method of Manufacturing a Device with a Cavity
App 20130069178 - Verheijden; Greja Johanna Adriana Maria ; et al. | 2013-03-21 |
System and Method for 3D Integrated Circuit Stacking
App 20130062766 - Ching; Kai-Ming | 2013-03-14 |
Pillar Structure Having A Non-planar Surface For Semiconductor Devices
App 20130056869 - Kuo; Tin-Hao ; et al. | 2013-03-07 |
Reduction Of Etch Microloading For Through Silicon Vias
App 20130059443 - CHANG; Hung-Pin ; et al. | 2013-03-07 |
Dummy Fill To Reduce Shallow Trench Isolation (sti) Stress Variation On Transistor Performance
App 20130043553 - CHERN; Chan-Hong | 2013-02-21 |
Semiconductor Device with a Buried Stressor
App 20130043507 - Wu; Zhiqiang ; et al. | 2013-02-21 |
Mechanisms For Forming Ultra Shallow Junction
App 20130037863 - WU; Chii-Ming ; et al. | 2013-02-14 |
InP-Based Transistor Fabrication
App 20130040431 - Ye; Peide ; et al. | 2013-02-14 |
Integrating the Formation of I/O and Core MOS Devices with MOS Capacitors and Resistors
App 20130034946 - Chuang; Harry ; et al. | 2013-02-07 |
Tri-Gate Field-Effect Transistors Formed by Aspect Ration Trapping
App 20130034943 - Lochtefeld; Anthony J. | 2013-02-07 |
Semiconductor Diodes Fabricated by Aspect Ratio Trapping with Coalesced Films
App 20130034924 - Lochtefeld; Anthony J. | 2013-02-07 |
Method For Forming A Reduced Active Area In A Phase Change Memory Structure
App 20110059590 - Lai; Li-Shyue ; et al. | 2011-03-10 |
Method to produce 3-D optical gyroscope my MEMS technology
App 20100175479 - Wu; Ting-Hau ; et al. | 2010-07-15 |
Robust TSV structure
App 20100171203 - CHEN; Hsien-Wei ; et al. | 2010-07-08 |
Method And Apparatus For Cleaning Semiconductor Device Fabrication Equipment Using Supercritical Fluids
App 20100126531 - KU; Shao-Yen ; et al. | 2010-05-27 |
Method of yield management for semiconductor manufacture and apparatus thereof
App 20090299669 - Leu; I-Yun ; et al. | 2009-12-03 |
SRAM Device with a Power Saving Module Controlled by Word Line Signals
App 20090040858 - Kengeri; Subramani ; et al. | 2009-02-12 |
Method and system for in-situ parametric SRAM diagnosis
App 20080130385 - Chung; Shine Chien | 2008-06-05 |
Method of forming a resist structure
App 20070254244 - Chang; Ching-Yu | 2007-11-01 |
Strained silicon-on-insulator transistors with mesa isolation
App 20070190702 - Yeo; Yee-Chia ; et al. | 2007-08-16 |
High voltage tolerant input buffer operable in under-drive conditions
App 20070069770 - Chen; Kuo-Ji | 2007-03-29 |
Charge pump system with smooth voltage output
App 20070063761 - Chou; Chung-Cheng ; et al. | 2007-03-22 |
Word line driver with reduced leakage current
App 20070040581 - Chen; Yen-Huei | 2007-02-22 |
Hybrid non-volatile memory device
App 20070036004 - Chih; Yue-Der ; et al. | 2007-02-15 |
Regenerative power-on control circuit
App 20070030039 - Chen; Ker-Min | 2007-02-08 |
Device structures for reducing device mismatch due to shallow trench isolation induced oxides stresses
App 20070026628 - Chung; Shine Chien ; et al. | 2007-02-01 |
Protection layer for preventing laser damage on semiconductor devices
App 20070018279 - Lin; Jian-Hong ; et al. | 2007-01-25 |
Method for identifying a physical failure location on an integrated circuit
App 20070016879 - Kuo; Feng-Ming | 2007-01-18 |
Interconnect structure for integrated circuits
App 20070001304 - Liaw; Jhon Jhy | 2007-01-04 |
Layout structure for ESD protection circuits
App 20060284256 - Wu; Yi-Hsun ; et al. | 2006-12-21 |
Method for reducing leakage current in a semiconductor device
App 20060278959 - Huang; Tsung-Hsun ; et al. | 2006-12-14 |
ESD protection circuit using a transistor chain
App 20060278930 - Huang; Shao-Chang | 2006-12-14 |
Method for improving threshold voltage stability of a MOS device
App 20060281267 - Liaw; Jhon Jhy | 2006-12-14 |
Method and system for keeping time alignment between optical data modulation and a periodically modulated light source
App 20060280507 - Bai; Yu Sheng | 2006-12-14 |
Guard rings with local coupling capacitance
App 20060267132 - Lee; Cheng Hung | 2006-11-30 |
Tie-off circuit with ESD protection features
App 20060268474 - Huang; Shao-Chang ; et al. | 2006-11-30 |
Memory system with bit-line discharging mechanism
App 20060256635 - Lee; Cheng-Hung ; et al. | 2006-11-16 |
Method of specifying pin states for a memory chip
App 20060256602 - Wu; Jeremy ; et al. | 2006-11-16 |
Method for forming a metal layer in multiple steps
App 20060237320 - Lin; K.Y. ; et al. | 2006-10-26 |
Supply voltage independent sensing circuit for electrical fuses
App 20060232904 - Wu; Jui-Jen ; et al. | 2006-10-19 |
Method and system for magnetic shielding in semiconductor integrated circuit
App 20060229683 - Wang; Chao-Hsiung ; et al. | 2006-10-12 |
Antenna effect prevention by model extraction in a circuit design for advanced processes
App 20060225007 - Wang; Chung-Hsing ; et al. | 2006-10-05 |
ESD protection circuit with low parasitic capacitance
App 20060215337 - Wu; Yi-Hsun ; et al. | 2006-09-28 |
Method and structure for metal-insulator-metal capacitor based memory device
App 20060189072 - Tu; Kuo-Chi | 2006-08-24 |
Self-latched control circuit for memory program operation
App 20060133162 - Wang; Chien-Fan | 2006-06-22 |
Electronic customs release slip (E-CRS)
App 20060122843 - Lin; Hsiu-Chu ; et al. | 2006-06-08 |
Semiconductor structure for isolating integrated circuits of various operation voltages
App 20060113571 - Liu; Jun-Xiu ; et al. | 2006-06-01 |
Semiconductor structure and method for integrating SOI devices and bulk devices
App 20060097316 - Chen; Hao-Yu ; et al. | 2006-05-11 |
Copper interconnect structure with modulated topography and method for forming the same
App 20060099786 - Fan; Su-Chen ; et al. | 2006-05-11 |
High dynamic range image sensor cell
App 20060092301 - Yaung; Dun-Nian ; et al. | 2006-05-04 |
ESD protection circuit with adjusted trigger voltage
App 20060092592 - Huang; Shao-Chang | 2006-05-04 |
Semiconductor devices with reduced impact from alien particles
App 20060086989 - Lee; Chung-Jung ; et al. | 2006-04-27 |
Methods for enhancing die saw and packaging reliability
App 20060055002 - Yao; Chih-Hsiang ; et al. | 2006-03-16 |
Method to improve the coupling ratio of top gate to floating gate in flash
App 20060046410 - Hsieh; Chia-Ta | 2006-03-02 |
Multiple stage method and system for sensing outputs from memory cells
App 20060028889 - Liaw; Jhon Jhy | 2006-02-09 |
Method and system for merging wafer test results
App 20050278329 - Yang, Keng-Chia ; et al. | 2005-12-15 |
Whole chip ESD protection
App 20050274990 - Wu, Yi-Hsu ; et al. | 2005-12-15 |
Self-aligned metal electrode to eliminate native oxide effect for metal insulator semiconductor (MIS) capacitor
App 20050272217 - Chiang, Min-Hsiung ; et al. | 2005-12-08 |
Novel device structure having enhanced surface adhesion and failure mode analysis
App 20050272260 - Lin, Hway Chi ; et al. | 2005-12-08 |
Reference sensing circuit
App 20050259470 - Kuo, Cheng-Hsiung | 2005-11-24 |
Method of fabricating a necked finfet device
App 20050253193 - Chen, Haur-Ywh ; et al. | 2005-11-17 |
Multiple electrical fuss shared with one program device
App 20050249014 - Chung, Shine Chien | 2005-11-10 |
Capacitance process by using passivation film scheme
App 20050250280 - Lin, Chuan Chang ; et al. | 2005-11-10 |
Effective method to improve sub-micron color filter sensitivity
App 20050242271 - Weng, Fu-Tien ; et al. | 2005-11-03 |
Reliability improvement of SiOC etch with trimethylsilane gas passivation in Cu damascene interconnects
App 20050245100 - Wu, Zhen-Cheng ; et al. | 2005-11-03 |
Process for removing organic materials during formation of a metal interconnect
App 20050245082 - Perng, Baw-Ching ; et al. | 2005-11-03 |
Implementation of protection layer for bond pad protection
App 20050245050 - Tsao, Pei-Haw ; et al. | 2005-11-03 |
Novel ESD protection scheme for core devices
App 20050237682 - Wu, Yi-Hsun ; et al. | 2005-10-27 |
Use of C2F6 gas to gain vertical profile in high dosage implanted poly film
App 20050236366 - Liu, Kuo-Chin | 2005-10-27 |
Novel architecture to monitor isolation integrity between floating gate and source line
App 20050239247 - Hsieh, Chang-Jen ; et al. | 2005-10-27 |
Flash EEPROM with function bit by bit erasing
App 20050232007 - Hsieh, Chia-Ta | 2005-10-20 |
Deep submicron CMOS compatible suspending inductor
App 20050225420 - Chen, Chung-Hui | 2005-10-13 |
Novel test structure for speeding a stress-induced voiding test and method of using same
App 20050224792 - Wang, Chien-Jung | 2005-10-13 |
Method Of Forming A Recessed Buried-diffusion Device
App 20050224873 - Yu, Chiu-Hung ; et al. | 2005-10-13 |
Post ECP multi-step anneal/H2 treatment to reduce film impurity
App 20050227479 - Feng, Hsien-Ping ; et al. | 2005-10-13 |
Mechanism for synchronizing manafacturing information systems and document content management systems data
App 20050228765 - Huang, Chen-Chu ; et al. | 2005-10-13 |
Novel method to simplify twin stage scanner OVL machine matching
App 20050219484 - Chiang, S. J. ; et al. | 2005-10-06 |
Novel method to fabricate high reliable metal capacitor within copper back-end process
App 20050221575 - Huang, Chi-Feng ; et al. | 2005-10-06 |
High speed and low power sense amplifier
App 20050213406 - Wang, Chin-Huang | 2005-09-29 |
Method for reducing a short channel effect for NMOS devices in SOI circuits
App 20050215017 - Chen, Hung-Wei ; et al. | 2005-09-29 |
Thin-oxide devices for high voltage I/O drivers
App 20050212558 - Chung, Shien Chien | 2005-09-29 |
Method to design and verify an integrated circuit device with multiple power domains
App 20050216872 - Sung, Nai-Yin ; et al. | 2005-09-29 |
Two Step Trench Definition Procedure For Formation Of A Dual Damascene Opening In A Stack Of Insulator Layers
App 20050215051 - Yang, Fu-Kai ; et al. | 2005-09-29 |
Method to increase coupling ratio of source to floating gate in split-gate flash
App 20050207264 - Hsieh, Chia-Ta ; et al. | 2005-09-22 |
Calibration standard for critical dimension verification of sub-tenth micron integrated circuit technology
App 20050202675 - Lu, Yu-Hui ; et al. | 2005-09-15 |
Method of forming polysilicon gate structures with specific edge profiles for optimization of LDD offset spacing
App 20050202642 - Chen, Cheng-Ku ; et al. | 2005-09-15 |
Scheduling system and method for avoiding low equipment utilization
App 20050203655 - Tsai, Hsin-Chen | 2005-09-15 |
Placement and routing method to reduce Joule heating
App 20050204314 - Hou, Chin-Shan ; et al. | 2005-09-15 |
Internet historical screen presentation
App 20050203882 - Godley, Hector Stuart | 2005-09-15 |
High voltage device embedded non-volatile memory cell and fabrication method
App 20050194647 - Tsai, Hung-Chih ; et al. | 2005-09-08 |
Method for making improved bottom electrodes for metal-insulator-metal crown capacitors
App 20050191820 - Tu, Yeur-Luen ; et al. | 2005-09-01 |
Method of integrating the formation of a shallow junction N channel device with the formation of P channel, ESD and input/output devices
App 20050191802 - Yeh, Yu-Lung ; et al. | 2005-09-01 |
Chip probing equipment and test modeling for next generation MES (300MM)
App 20050192690 - Yang, Keng-Chia ; et al. | 2005-09-01 |
Space process to prevent the reverse tunneling in split gate flash
App 20050184331 - Tu, Kuo-Chi ; et al. | 2005-08-25 |
Seal ring design without stop layer punch through during via etch
App 20050184388 - Shih, Hsin-Ching ; et al. | 2005-08-25 |
Method for improving the electrical continuity for a silicon-germanium film across a silicon/oxide/polysilicon surface using a novel two-temperature process
App 20050186750 - Lee, Kuen-Chyr ; et al. | 2005-08-25 |
Underfilling efficiency by modifying the substrate design of flip chips
App 20050178581 - Lee, Hsin-Hui ; et al. | 2005-08-18 |
Method to form a metal silicide gate device
App 20050179098 - Chan, Bor-Wen ; et al. | 2005-08-18 |
Non-repeated and non-uniform width seal ring structure
App 20050179213 - Huang, Tai-Chun ; et al. | 2005-08-18 |
Configurable voltage generator
App 20050174162 - Cheng, Tung-Shuan ; et al. | 2005-08-11 |
Method of forming metal silicide
App 20050176227 - Wu, Chii-Ming ; et al. | 2005-08-11 |
Novel Deposition Method For Si-ge Epi Layer On Different Intermediate Substrates
App 20050176229 - Yao, Liang-Gi ; et al. | 2005-08-11 |
Smart tag holder and cover housing
App 20050167492 - Hsueh, Tsung-Chih ; et al. | 2005-08-04 |
Enhanced adhesion strength between mold resin and polyimide
App 20050167807 - Chen, Ken ; et al. | 2005-08-04 |
Integrated capacitor
App 20050168914 - Tang, Denny ; et al. | 2005-08-04 |
Method for end point detection of polysilicon chemical mechanical polishing in an anti-fuse memory device
App 20050170563 - Ang, Kern-Huat ; et al. | 2005-08-04 |
Method to improve planarity of electroplated copper
App 20050164495 - Chou, Shih-Wei ; et al. | 2005-07-28 |
Shared contact for high-density memory cell design
App 20050164493 - Liaw, Jhon-Jhy | 2005-07-28 |
Zirconium oxide and hafnium oxide etching using halogen containing chemicals
App 20050164479 - Perng, Baw-Ching ; et al. | 2005-07-28 |
Novel method of trimming technology
App 20050164478 - Chan, Bor-Wen ; et al. | 2005-07-28 |
Memory built-in self test circuit with full error mapping capability
App 20050166111 - Chien, Jinn-Yeh | 2005-07-28 |
Silicide gate transistors and method of manufacture
App 20050156238 - Wen, Cheng-Kuo ; et al. | 2005-07-21 |
Piezoelectric o-ring transducer
App 20050156487 - Tseng, Ming-Hung ; et al. | 2005-07-21 |
Center ball O-ring
App 20050155709 - Tzeng, Huan-Liang ; et al. | 2005-07-21 |
Method to make minimal spacing between floating gates in split gate flash
App 20050156224 - Hsieh, Chia-Ta ; et al. | 2005-07-21 |
Flash memory cell with a unique split programming channel and reading channel
App 20050156223 - Lu, Hsiang-Tai ; et al. | 2005-07-21 |
Noble high-k device
App 20050156255 - Yao, Liang-Gi ; et al. | 2005-07-21 |
Wet bench wafer floating detection system
App 20050158885 - Tseng, Wen-Song ; et al. | 2005-07-21 |
High temperature hydrogen annealing of a gate insulator layer to increase etching selectivity between conductive gate structure and gate insulator layer
App 20050159008 - Chang, Vincent S. ; et al. | 2005-07-21 |
Semiconductor chip singulation method
App 20050158967 - Huang, Tai-Chun ; et al. | 2005-07-21 |
Novel EBR shape of spin-on low-k material providing good film stacking
App 20050151227 - Chen, Yu-Huei ; et al. | 2005-07-14 |
Method to reduce a capacitor depletion phenomena
App 20050151180 - Chiang, Min-Hsiung | 2005-07-14 |
Novel shallow trench isolation method for reducing oxide thickness variations at different pattern densities
App 20050153519 - Lu, Chih-Cheng ; et al. | 2005-07-14 |
Method for chemical mechanical polishing of a shallow trench isolation structure
App 20050153555 - Tseng, Tung-Ching ; et al. | 2005-07-14 |
Single trench repair method with etched quartz for attenuated phase shifting mask
App 20050153214 - Lin, Cheng-Ming | 2005-07-14 |
Novel nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure
App 20050153537 - Cheng, Yi-Lung ; et al. | 2005-07-14 |
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