U.S. patent application number 14/885194 was filed with the patent office on 2017-04-20 for heat sink of a metallic shielding structure.
The applicant listed for this patent is Celsia Technologies Taiwan, Inc.. Invention is credited to Chieh-Ping CHEN, Ming-Kuei HSIEH, George A. Meyer IV, Hsin-Hua WEN.
Application Number | 20170110411 14/885194 |
Document ID | / |
Family ID | 58523131 |
Filed Date | 2017-04-20 |
United States Patent
Application |
20170110411 |
Kind Code |
A1 |
Meyer IV; George A. ; et
al. |
April 20, 2017 |
HEAT SINK OF A METALLIC SHIELDING STRUCTURE
Abstract
A heat sink of a metallic shielding structure is provided in
this disclosure, which includes a heating module and a cooling
module. The heating module includes a heat generating component, a
substrate, and a shield housing. The heat generating component is
electrically connected to one side surface of the substrate and
forms an opening corresponding the substrate. The cooling module
includes a body and a working fluid is disposed in the body.
Inventors: |
Meyer IV; George A.; (Morgan
Hill, CA) ; WEN; Hsin-Hua; (Taoyuan County, TW)
; HSIEH; Ming-Kuei; (Taoyuan County, TW) ; CHEN;
Chieh-Ping; (Taoyuan County, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Celsia Technologies Taiwan, Inc. |
Taoyuan County |
|
TW |
|
|
Family ID: |
58523131 |
Appl. No.: |
14/885194 |
Filed: |
October 16, 2015 |
Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H05K 7/2029 20130101;
H01L 2224/32245 20130101; H01L 23/3675 20130101; H01L 2224/73253
20130101; H01L 23/40 20130101; H01L 23/473 20130101; H01L
2224/16227 20130101; H01L 2924/3025 20130101; H01L 2924/1432
20130101; H01L 2924/16251 20130101; H05K 1/0204 20130101; H01L
23/552 20130101; H01L 23/3736 20130101; H01L 23/427 20130101; H05K
9/0032 20130101 |
International
Class: |
H01L 23/552 20060101
H01L023/552; H01L 23/40 20060101 H01L023/40; H05K 1/02 20060101
H05K001/02; H01L 23/373 20060101 H01L023/373; H05K 7/20 20060101
H05K007/20; H01L 23/473 20060101 H01L023/473; H01L 23/367 20060101
H01L023/367 |
Claims
1. A heat sink of a metallic shielding structure, comprising: a
heating module, the heating module including a heat generating
component, a substrate, and a shield housing, the heat generating
component being electrically connected to one side surface of the
substrate and forming an opening corresponding to the substrate ; a
cooling module, the cooling module including a body and a working
fluid being disposed in the body, wherein when the heat generating
component generates heat to form a warmer temperature area, the
working fluid in the body is heated to be vaporized and diffused to
at least one distal end to form a low temperature area; when the
vaporized working fluid flows to the low temperature area, the
working fluid is condensed into a liquid state and flows back to
the warmer temperature area.
2. The heat sink of claim 1, wherein the heat generating component
further includes a heater and a metallic housing, the heater is
electrically connected to the substrate, one side surface of the
metallic housing is attached to the heater and the other side
surface of the metallic housing is disposed on the opening to
parallel to the shield housing.
3. The heat sink of claim 2, wherein the cooling module is attached
to both surfaces of the metallic housing and the shield housing to
seal the opening by a soldering method.
4. The heat sink of claim 2, wherein the heater is a central
processing unit, and the substrate is a circuit board.
5. The heat sink of claim 2, wherein the cooling module further has
a protruding portion disposed on one side surface of the body, the
protruding portion is disposed corresponding to the opening and
protrudes into the opening to contact the metallic housing.
6. The heat sink of claim 5, wherein a width of the protruding
portion matches a size of the opening.
7. The heat sink of claim 1, wherein the heating module further
includes a mother board and a socket connector electrically
connected to the mother board, the substrate is disposed on the
socket connector, and the shield housing covers the socket
connector and is disposed on the mother board.
8. The heat sink of claim 1, further comprising a capillary
structure surroundingly disposed on an inner surface of the
body.
9. The heat sink of claim 8, wherein the capillary structure is a
woven metal mesh.
10. The heat sink of claim 8, further comprising a support
structure supporting the capillary structure and two opposite side
plates of the body, and the capillary structure, and the support
structure and the capillary structure are sequentially disposed
between the two opposite side plates of the body.
11. The heat sink of claim 10, wherein the support structure
includes two lateral plates and a plurality of wave-shaped plates
connected to the lateral plates, each of the wave-shaped plates
consists of a plurality of wave-peak sections and a plurality of
wave-trough sections, any two adjacent wave-peak sections are
disposed in staggered relation to each other, and any two
wave-trough sections are disposed in staggered relation to each
other.
Description
TECHNICAL FIELD
[0001] The present invention relates to a heat sink and, in
particular, to a heat sink of a metallic shielding structure, which
prevents electromagnetic interference (EMI) and also provides heat
dissipation.
BACKGROUND
[0002] With the rapid development of electronic technology,
electronic products have become light, slim, small-sized and their
functions have become diverse. When electronic equipment is working
or operated, electronic components generate electromagnetic fields,
and the electromagnetic field interferes with the normal operation
of the electronic equipment, and the electromagnetic wave radiates
out to impair health, which is a so called electromagnetic
interference (EMI) phenomenon. The methods to prevent EMI include
applying a conductive paint, performing a vacuum sputtering
process, or adding a suitable metallic EMI shielding structure, and
the latest has a low cost and meets the present requirements of
environmental protection, so is most frequently used.
[0003] Conventional EMI shielding structure simply has the function
of shielding the electromagnetic waves. In fact, the
electromagnetic components generate a huge amount of heat during
operation or use. The heat accumulated in a housing is unable to
dissipate out, and the heat conductivity rate of the metallic EMI
shielding structure is too slow, so the heat generated by the
electronic components cannot efficiently dissipate out via the
housing. Consequently, the heat in the electronic components
continues to increase, thereby reducing the lifespan of the
electronic components covered by the housing or compromising the
product performance.
[0004] Accordingly, the aim of this disclosure is to achieve the
best EMI shielding and also provides excellent heat dissipation
efficiency.
SUMMARY
[0005] It is an object of the present invention to provide a heat
sink of a metallic shielding structure which prevents
electromagnetic interference (EMI) and provides heat
dissipation.
[0006] Accordingly, the present invention provides a heat sink of a
metallic shielding structure, which provides a heating module and a
cooling module. The heating module includes a heat generating
component, a substrate, and a shield housing. The heat generating
component is electrically connected to one side surface of the
substrate and forms an opening corresponding the substrate. The
cooling module includes a body and a working fluid is disposed in
the body. When the heat generating component generates heat to form
a warmer temperature area, the working fluid in the body is heated
to be vaporized and diffused to at least one distal ends to form a
low temperature area. When the vaporized working fluid flows to the
low temperature area, the working fluid is condensed into a liquid
state and flows back to the warmer temperature area.
[0007] It is preferable that the heating module further includes a
mother board and a socket connector electrically connected to the
mother board, the substrate is disposed on the socket connector,
and the shield housing covers the socket connector and is disposed
on the mother board.
[0008] It is preferable that the heat sink further comprises a
capillary structure surroundingly disposed on an inner surface of
the body.
[0009] It is preferable that the heat sink comprises a support
structure supporting the capillary structure and two opposite side
plates of the body, and the capillary structure, and the support
structure and the capillary structure are sequentially disposed
between the two opposite side plates of the body.
[0010] It is preferable that the support structure has two lateral
plates and a plurality of wave-shaped plates connected to the
lateral plates. Each of the wave-shaped plates consists of a
plurality of wave-peak sections and a plurality of wave-trough
sections, any two adjacent wave-peak sections are disposed in
staggered relation to each other, and any two wave-trough sections
are disposed in staggered relation to each other.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The disclosure will become more fully understood from the
detailed description and the drawings given herein below for
illustration only, and thus does not limit the disclosure,
wherein:
[0012] FIG. 1 is a perspective view of the present invention,
illustrating a heat sink of a metallic shielding structure;
[0013] FIG. 2 is a cross-sectional view of the present invention,
illustrating the heat sink of the metallic shielding structure;
and
[0014] FIG. 3 is a cross-sectional view of the present invention,
illustrating the assembled heat sink of the metallic shielding
structure.
[0015] FIG. 4 is another cross-sectional view of the present
invention, illustrating the assembled heat sink of the metallic
shielding structure.
DETAILED DESCRIPTION
[0016] Detailed descriptions and technical contents of the present
invention are illustrated below in conjunction with the accompany
drawings. However, it is to be understood that the descriptions and
the accompany drawings disclosed herein are merely illustrative and
exemplary and not intended to limit the scope of the present
invention.
[0017] Referring to FIGS. 1 to 3, the present invention provides a
heat sink 100 of a metallic shielding structure, which includes a
heating module 110 and a cooling module 200. The heating module 110
includes a heater 120, a substrate 130, a metallic housing 140, and
a shield housing 180. In the figures, the heater 120 includes but
is not limited to a central processing unit (CPU) or other suitable
chip sets. The heater 120 is electrically connected to one side
surface of the substrate 130. The metallic housing 140 is disposed
on the substrate 130 and is attached to the heater 120. The shield
housing 180 covers the metallic housing 140 and forms an opening
150 corresponding thereto.
[0018] In the present embodiment, the heating module 110 further
includes a mother board 160 and a socket connector 170 electrically
connected to the mother board 160. The substrate 130 is disposed on
the socket connector 170, and the shield housing 180 covers the
socket connector 170 and is disposed on the mother board 160. In
detail, the substrate 130 is preferably a flip chip substrate. One
side surface of the substrate 130 includes a plurality of contact
members (not illustrated) in a needle shape, and each of the
contact members is directly inserted into the socket connector 170
for making connection. Therefore, a high-density integrated circuit
design can be achieved to reduce the size of the heater 120, lower
a production cost, and obtain a good electrical property and good
heat-dissipation effect. However, in a different embodiment, the
substrate 130 can also be an ordinary mother board, a circuit
board, or etc. onto which the heater 120 is directly welded.
[0019] In response to the increasing demand for avoidance of high
frequency interference and miniaturization in a tablet PC, a
microprocessor for a high-class notebook, and an electronic chip
for a desktop computer, electromagnetic interference (EMI)
shielding is carried out by utilizing the shield housing 180 or
applying coatings (e.g. applying coatings using a conductive paint
or applying sprayed coatings using a zinc wire) thereon. In the
present embodiment, EMI is still emitted through the opening of the
shield housing 180 or other holes. Therefore, by putting the
cooling module 200 in contact with the heating module 110, the
protruding portion 220 completely seal the opening 150 of the
shield housing 180, thereby reducing EMI. The shield housing 180
can be formed of a metallic can, a thin metal plate, metal foil, a
conductive web, or a metal tape, or can even use the foregoing
conductive paint, and other suitable materials.
[0020] Referring to FIGS. 2 and 3, the cooling module 200 includes
a body 210 and a protruding portion 220 disposed on one side
surface of the body 210. The protruding portion 220 is disposed
corresponding to the opening 150, a working fluid 230 is disposed
in the body 210, and the protruding portion 220 protrudes into the
opening 150 to contact a surface of the metallic housing 140. As
shown in the figures, a width of the protruding portion 220 matches
a size of the opening 150, so that the protruding portion 220 can
pass through the opening 150 to contact against the surface of the
metallic housing 140.
[0021] When the heater 120 generates heat to form a warmer
temperature area H, the working fluid 230 in the protruding portion
220 is heated to be vaporized and diffused to two distal ends of
the body 210 to form a low temperature area L. When the working
fluid 230 is transformed from a liquid state to a vapor state, the
working fluid 230 takes away a huge amount of heat. When the
vaporized working fluid 230 flows to the low temperature area L,
the working fluid 230 is condensed into the liquid state and flows
back to the warmer temperature area H, thereby completing a heat
transfer cycle.
[0022] In the present embodiment, the heat sink 100 further
comprises a capillary structure 240 circularly disposed on an inner
surface of the body 210. When the working fluid 230 is water,
alcohol, or a combination thereof, the capillary structure 240 can
quickly direct the working fluid 230, vaporized by heat, to the two
distal ends (i.e. the low temperature area) of the body 210,
thereby accelerating heat dissipation. The capillary structure 240
includes but is not limited to a woven metal net.
[0023] Furthermore, in the embodiment shown in FIGS. 2 and 3, the
heat sink 100 further includes a support structure 250 supporting
the capillary structure 240 and two opposite side plates of the
body 210. As shown in the figures, the capillary structure 240, and
the support structure 250 and the capillary structure 240 are
sequentially disposed between the two opposite side plates of the
body 210. The support structure 250 includes two lateral plates 260
and a plurality of wave-shaped plates 270 connected to the lateral
plates 260. Each of the wave-shaped plates 270 consists of a
plurality of wave-peak sections 272 and a plurality of wave-trough
sections 274, any two adjacent wave-peak sections 272 are disposed
in staggered relation to each other, and any two wave-trough
sections 274 are disposed in staggered relation to each other.
Particularly, each of the wave-shaped plates 270 has a larger size
in the protruding portion 220 than at two sides of the protruding
portion 220 so as to support the two opposite side plates of the
body 210 and the capillary structure 240 at the inner surface of
the two opposite side plates (not labelled).
[0024] It should be noted that the support structure 250 is
preferably a plate which includes, for example, wave-shaped plates
270 made by pressing to form connected bends, and a plurality of
passages (not illustrated) are formed between the body 210 and the
capillary structure 240. Finally, the body 210 is sealed and
connected by welding, and after injecting the required working
fluid 230 into the body 210, a vacuum is created inside the body
210 by suction so as to form a vapor chamber.
[0025] Furthermore, the support structure 250 not only can support
the capillary structure 240 but also can maintain a distance
between the two opposite side plates of the body 210, so that the
creation of vacuum or a larger side surface of the body do not
cause deformation of the body 210, and a size of the body 210 can
be maintained. When the body 210 is the aforesaid vapor chamber,
the protruding portion 220 in the warmer temperature area is in
contact against the metallic housing 140 to conduct away the heat
generated by the heater 120. The working fluid 230 in the capillary
structure 240 of the protruding portion 220 is vaporized by the
heat, and is quickly directed to the capillary structure 240 at two
ends of the body 210 via each of the passages (not illustrated) so
as to transfer the heat to the low temperature area. When the
working fluid 230 (water vapor herein) contacts the inner surface
of the body 210 at a lower temperature, the water vapor is
condensed into the liquid state to release heat, so as to complete
a heat transfer cycle.
[0026] FIG. 4 shows another preferable embodiment of the present
invention. In this embodiment, the body 210 does not have the
protruding portion 220, the metallic housing 140 is protrudingly
disposed in the opening 150 to contact one side surface of body
210. In other words, an upper surface of the metallic housing 140
is flush with an upper surface of the shield housing 180 in a
manner such that the body 210 is in contact with the upper surface
of the metallic housing 140 and the upper surface of the shield
housing 180. In detail, as shown in FIG. 4, the heating module 110
includes a heat generating component 190, a substrate 130, and a
shield housing 180. The heat generating component 190 is
electrically connected to one side surface of the substrate 130 and
forms an opening 150 corresponding to the substrate 130. The
cooling module 200 includes a body 210, and a working fluid 230 is
disposed in the body 210.
[0027] In the present embodiment, the heat generating component 190
further includes a heater 120 and a metallic housing 140. The
heater 120 is electrically connected to the substrate 130, an inner
surface of the metallic housing 140 is attached to a surface of the
heater 120 and the upper surface of the metallic housing 140 is
disposed in the opening 150 and is flush with the shield housing
180. Thus, the heating module 110 is attached to both surfaces of
the metallic housing 140 and the shield housing 18, and then the
opening 150 is sealed by soldering or other suitable methods. The
other components in the present embodiment and their structures are
described in the above-mentioned embodiment, so the description
thereof is omitted herein.
[0028] By utilizing the shield housing 180 to shield the metallic
housing 140 and the heater 120 attached thereto, the heat sink 100
of the present invention achieves EMI shielding. Furthermore, by
utilizing the protruding portion 220 of the cooling module 200 in
contact against the heater 120 of the metallic housing 180, the
heat sink 100 of the present invention can quickly and efficiently
dissipate the heat generated by the heater 120.
[0029] It is to be understood that the above descriptions are
merely the preferable embodiment of the present invention and are
not intended to limit the scope of the present invention.
Equivalent changes and modifications made in the spirit of the
present invention are regarded as falling within the scope of the
present invention.
* * * * *