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Patent applications and USPTO patent grants for Celsia Technologies Taiwan, Inc..The latest application filed is for "structure of heat pipe with adjustable working temperature range".
Patent | Date |
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Structure Of Heat Pipe With Adjustable Working Temperature Range App 20210333053 - Meyer, IV; George A. ;   et al. | 2021-10-28 |
Manufacturing method and structure of heat pipe with adjustable working temperature range Grant 11,092,386 - Meyer, IV , et al. August 17, 2 | 2021-08-17 |
Heat pipe with non-condensable gas Grant 10,982,906 - Meyer, IV , et al. April 20, 2 | 2021-04-20 |
Manufacturing Method And Structure Of Heat Pipe With Adjustable Working Temperature Range App 20210055060 - Meyer, IV; George A. ;   et al. | 2021-02-25 |
Heat Pipe With Non-condensable Gas App 20200132390 - Meyer IV; George A. ;   et al. | 2020-04-30 |
Heat pipe with non-condensable gas Grant 10,571,201 - Meyer, IV , et al. Feb | 2020-02-25 |
Heat Pipe With Non-condensable Gas App 20190170447 - Meyer IV; George A. ;   et al. | 2019-06-06 |
Manufacturing Method Of Phase-changing Heat Dissipater App 20180164041 - Meyer, IV; George Anthony ;   et al. | 2018-06-14 |
Heat sink of a metallic shielding structure Grant 9,646,935 - Meyer, IV , et al. May 9, 2 | 2017-05-09 |
Heat Sink Of A Metallic Shielding Structure App 20170110411 - Meyer IV; George A. ;   et al. | 2017-04-20 |
Vapor Chamber Structure App 20170020026 - Meyer, IV; George A. ;   et al. | 2017-01-19 |
Phase-changing Heat Dissipater And Manufacturing Method Thereof App 20160305715 - Meyer, IV; George Anthony ;   et al. | 2016-10-20 |
Heat-dissipating module having loop-type vapor chamber Grant 8,792,238 - Meyer, IV , et al. July 29, 2 | 2014-07-29 |
Heat-dissipating Module Having Loop-type Vapor Chamber App 20130199757 - Meyer, IV; George Anthony. ;   et al. | 2013-08-08 |
Heat Pipe And Composition Of Capillary Wick Thereof App 20130168052 - Meyer, IV; George Anthony ;   et al. | 2013-07-04 |
Clamp-type heat sink for memory Grant 8,134,834 - Meyer, IV , et al. March 13, 2 | 2012-03-13 |
Heat-conducting Module And Heat-dissipating Device Having The Same App 20110297355 - Meyer, IV; George Anthony ;   et al. | 2011-12-08 |
Heat sink for memory and memory device having heat sink Grant 8,059,406 - Meyer, IV , et al. November 15, 2 | 2011-11-15 |
Compact Vapor Chamber And Heat-dissipating Module Having The Same App 20110232877 - Meyer, IV; George Anthony ;   et al. | 2011-09-29 |
Solar power system with tower type heat dissipating structure Grant 8,011,361 - Meyer, IV , et al. September 6, 2 | 2011-09-06 |
Image Sensor Package And Method For Manufacturing The Same App 20110096219 - Lee; Pen-Jung ;   et al. | 2011-04-28 |
Planar Heat Pipe App 20110067844 - Meyer, IV; George Anthony ;   et al. | 2011-03-24 |
Thermally conductive structure of LED and manufacturing method thereof Grant 7,875,900 - Meyer, IV , et al. January 25, 2 | 2011-01-25 |
Heat dissipation device Grant 7,684,187 - Meyer, IV , et al. March 23, 2 | 2010-03-23 |
Heat sink Grant D601,515 - Meyer, IV , et al. October 6, 2 | 2009-10-06 |
Cooling device Grant 7,599,185 - Meyer, IV , et al. October 6, 2 | 2009-10-06 |
Heat dissipation module for LED lamp Grant D597,247 - Meyer, IV , et al. July 28, 2 | 2009-07-28 |
Heat dissipation module for LED lamp Grant D597,246 - Meyer, IV , et al. July 28, 2 | 2009-07-28 |
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