U.S. patent application number 15/256801 was filed with the patent office on 2016-12-22 for semiconducitive catechol group encapsulant adhesion promoter for a packaged electronic device.
The applicant listed for this patent is FREESCALE SEMICONDUCTOR, INC.. Invention is credited to TRENT S. UEHLING.
Application Number | 20160372339 15/256801 |
Document ID | / |
Family ID | 51222028 |
Filed Date | 2016-12-22 |
United States Patent
Application |
20160372339 |
Kind Code |
A1 |
UEHLING; TRENT S. |
December 22, 2016 |
SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A
PACKAGED ELECTRONIC DEVICE
Abstract
A packaged electronic device includes a package substrate, an
electronic component die mounted to the package substrate, and an
encapsulant bonded to a portion of the package substrate at a
catechol group adhesion promoted interface that includes benzene
rings bonded with the package substrate and the encapsulant.
Inventors: |
UEHLING; TRENT S.; (AUSTIN,
TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
FREESCALE SEMICONDUCTOR, INC. |
AUSTIN |
TX |
US |
|
|
Family ID: |
51222028 |
Appl. No.: |
15/256801 |
Filed: |
September 6, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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13754086 |
Jan 30, 2013 |
9466544 |
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15256801 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 23/18 20130101;
H01L 2924/15311 20130101; H01L 2924/181 20130101; H01L 2224/48227
20130101; H01L 23/28 20130101; H01L 2924/00014 20130101; H01L 24/48
20130101; H01L 2924/00014 20130101; H01L 2224/73265 20130101; H01L
2924/15311 20130101; H01L 2924/181 20130101; H01L 2224/73265
20130101; H01L 2224/48091 20130101; H01L 2224/32225 20130101; H01L
23/3128 20130101; H01L 2224/48227 20130101; H01L 2924/00012
20130101; H01L 2224/73265 20130101; H01L 2224/45099 20130101; H01L
2224/32225 20130101; H01L 2924/00 20130101; H01L 2224/48227
20130101; H01L 2924/00012 20130101; H01L 2924/00014 20130101; H01L
2224/48227 20130101; H01L 2924/00 20130101; H01L 2224/32225
20130101; H01L 2224/73265 20130101; H01L 2224/32225 20130101; H01L
23/29 20130101; H01L 2224/8592 20130101; H01L 2224/48091 20130101;
H01L 21/56 20130101; H01L 24/49 20130101; H01L 2924/186
20130101 |
International
Class: |
H01L 21/56 20060101
H01L021/56; H01L 23/31 20060101 H01L023/31; H01L 23/00 20060101
H01L023/00; H01L 23/29 20060101 H01L023/29 |
Claims
1. A method comprising: attaching an electronic component to a
package substrate; encapsulating a surface of the package substrate
with an encapsulant, wherein prior to the encapsulating, an
adhesion promoter is applied to the surface, wherein the adhesion
promoter includes catechol group molecules.
2. The method of claim 1, wherein the catechol group molecules
include molecules of at least one of a group consisting of
dihydroxybenzene, dopamine, alpha-methyldopamine, norepinephrine,
dihydroxyphenylalanine, alpha-methyldopa, droxidopa, and
5-hydroxydopamine.
3. The method of claim 1, wherein as a result of the adhesion
promoter being applied to the surface, chemical bonds between
benzene rings of the catechol group molecules and the package
substrate are formed.
4. The method of claim 1, wherein the electronic component is
attached prior to the adhesion promoter being applied to the
surface.
5. The method of claim 1, wherein the electronic component is
attached after to the adhesion promoter is applied to the
surface.
6. The method of claim 1 further comprising: electrically coupling
the electronic component to the package substrate prior to the
adhesion promoter being applied to the surface.
7. The method of claim 1, wherein as a result of the encapsulating,
benzene rings of at least some of the catechol group molecules are
chemically bonded to both the package substrate and to the
encapsulant.
8. The method of claim 1 wherein as a result of the encapsulating,
benzene rings of at least some of the catechol group molecules are
chemically bonded to both the package substrate and to the
encapsulant.
9. The method of claim 1 wherein the surface is characterized as a
surface of a metal of the package substrate.
10-20. (canceled)
21. A method comprising: providing a package substrate; applying a
catechol group adhesion promoter to the package substrate;
attaching an electronic component to the package substrate; forming
a first catechol group adhesion promoted interface between the
electronic component and the package substrate; and bonding an
encapsulant to a portion of the package substrate at a second
catechol group adhesion promoted interface formed between the
package substrate and the encapsulant.
22. The method of claim 21, wherein forming the adhesion promoted
interfaces includes chemically bonding a plurality of benzene rings
to a surface of the package substrate.
23. The method of claim 22, wherein at least some of the plurality
of benzene rings are chemically bonded to the encapsulant.
24. The method of claim 21, further comprising: forming a catechol
group molecule between the encapsulant and the package
substrate.
25. The method of claim 24, wherein the catechol group molecule is
characterized as one of a group consisting of dihydroxybenzene,
dopamine, alpha-methyldopamine, norepinephrine,
dihydroxyphenylalanine, alpha-methyldopa, droxidopa, and
5-hydroxydopamine.
26. The method of claim 21, wherein the encapsulant remains bonded
to the package substrate at temperatures ranging between -80
degrees Celsius and 300 degrees Celsius.
27. The method of claim 21, wherein the second catechol group
adhesion promoted interface is located at a metal surface of the
package substrate.
28. The method of claim 21, further comprising: electrically
coupling the electronic component and the package substrate with a
plurality of wire bonds, wherein the encapsulant is located on
surfaces of the plurality of wire bonds.
29. The method of claim 21, wherein the first and second catechol
group adhesion promoted interfaces are characterized as a self
assembled monolayer interface.
30. A method comprising: providing a package substrate including a
surface; attaching an electronic device to a portion of the
surface; encapsulating the surface with an encapsulant; forming a
self assembled monolayer interface between the surface and the
encapsulant and between the portion of the surface and the
electronic device, the self assembled monolayer interface including
a plurality of molecules each including a benzene ring chemically
bonded to the surface and to the encapsulant.
31. The method of claim 30, wherein the surface is characterized as
a metal.
Description
BACKGROUND OF THE INVENTION
[0001] Field of the Invention
[0002] This invention relates in general to packaged electronic
devices, and in particular, to catechol group adhesion promoters
for packaged electronic devices.
[0003] Description of the Related Art
[0004] A packaged electronic device typically includes a
semiconductor die or other electronic component that is attached to
a package substrate and encapsulated with an encapsulant to provide
protection to the electronic component, e.g. during usage in an
electronic system.
BRIEF DESCRIPTION OF THE DRAWINGS
[0005] The present invention may be better understood, and its
numerous objects, features, and advantages made apparent to those
skilled in the art by referencing the accompanying drawings.
[0006] FIG. 1 is a partial cross-sectional side view of a packaged
electronic device according to one embodiment of the present
invention.
[0007] FIG. 2 is a partial cross-sectional side view of a packaged
electronic device according to another embodiment of the present
invention.
[0008] FIG. 3 is a flow chart for forming a packaged electronic
device according to one embodiment of the present invention.
[0009] FIG. 4 is a flow chart for forming a packaged electronic
device according to another embodiment of the present
invention.
[0010] FIG. 5 is sets forth molecular models of catechol group
molecules according to one embodiment of the present invention.
[0011] FIG. 6 is a molecular model showing a molecular structure of
an encapsulant, adhesion promoter, and substrate structure prior to
a chemical reaction according to one embodiment of the present
invention.
[0012] FIG. 7 is a molecular diagram model showing a molecular
structure of an encapsulant, adhesion promoter, and substrate
structure after a chemical reaction according to one embodiment of
the present invention.
[0013] The use of the same reference symbols in different drawings
indicates identical items unless otherwise noted. The Figures are
not necessarily drawn to scale.
DETAILED DESCRIPTION
[0014] The following sets forth a detailed description of a mode
for carrying out the invention. The description is intended to be
illustrative of the invention and should not be taken to be
limiting.
[0015] In some environments such as automotive or industrial
environments, encapsulant adhesion to a package substrate (e.g. a
lead frame) can be challenging. High shear stress, degradation of
adhesion strength due to moisture absorption and high temperatures,
and variation in lead frame finishes can contribute to compromised
adhesion between the package substrate and the encapsulant.
[0016] As described below, a catechol group adhesion promoter is
used for promoting adhesion between an encapsulant and a package
substrate in a packaged electronic device. In some examples, the
applied adhesion promoter molecules form bonds with molecules of
the encapsulant and molecules of the substrate to improve adhesion
of the encapsulant to the substrate.
[0017] FIG. 1 is a cross-sectional side view of a packaged
electronic device 101 according to one embodiment of the present
invention. Device 101 includes a package substrate 103 and a die
105 attached to substrate 103 with die adhesive 107. In the
embodiment shown, the package substrate includes a dielectric
carrier 104 with conductive structures (e.g. bond pads 119) located
thereon and conductive layers and vias (not shown) located therein.
In other embodiments, a package substrate may be a lead frame
(either a leaded or leadless) which is made of a metal material
(e.g. copper). Still in other embodiment, a package substrate may
have other structures and/or be made of other materials.
[0018] In the embodiment shown, die 105 is a segment of a
semiconductor wafer that has been processed with dielectric,
semiconductive, and conductive materials to form circuitry. In one
embodiment, die 105 includes digital circuitry such as a processor,
but may include other types of circuitry such as e.g. analog
circuitry, memory, and/or logic gates. In some embodiments, the
wafer may be made of silicon, silicon germanium, a III-V
semiconductor material, or other types of semiconductor material.
In other embodiments, other types of electronic components (e.g.
stand alone capacitors, transistors, and inductors) may be
encapsulated in a packaged electronic device. In one embodiment, a
packaged electronic device may include multiple electronic
components such as multiple die or a die and a capacitor.
[0019] Die 105 and substrate 103 are encapsulated with encapsulant
109. In one embodiment, encapsulant 109 is an epoxy mold compound
that includes e.g. bisphenol-a or phenolic resin. In other
embodiments other types of encapsulants may be used, e.g. such as
anhydride, novolac, phenolic, and unsaturated polyester.
[0020] In the embodiment shown, conductive structures (not shown)
of die 105 are coupled with wires 111 to conductive structures
(e.g. pads 119) of substrate 103. These wires are attached to
conductive structures of die 105 and substrate 103 by a wire
bonding process. In other embodiments, die 105 may be electrically
coupled to substrate 103 in other ways, e.g. with conductive
traces. Die 105 may also be attached to substrate 103 in an upside
down configuration wherein the conductive structures of the die are
attached to conductive structures of the substrate such as in a
flip chip configuration.
[0021] Device 101 includes solder balls 113 for external electrical
coupling to other devices in an electronic system. Solder balls 113
are electrically coupled to pads 119 by conductive layers and vias
(not shown) located within carrier 104. In other embodiments,
device 101 may include other types of external conductors such as
leads or pads.
[0022] In the embodiment shown, the packaged electronic device is a
ball grid array package. However in other embodiments, device 101
may be of another electronic packaging configuration type such as
e.g. a QFN configuration type, a leaded configuration type (e.g.
through hole or surface mount), a QFP configuration type, or an
SoIC configuration type.
[0023] Device 101 includes a catechol group adhesion promoted
interface 121. A catechol group adhesion promoted interface is an
interface between two structures that is formed from the
application of a catechol group adhesion promoter applied between
the two structures for forming bonds between the two structures. In
the embodiment shown, interface 121 is formed by the application of
a layer of a catechol group adhesion promoter applied between
substrate 103 and encapsulant 109 for forming chemical bonds
between encapsulant 109 and substrate 103, and also for forming
chemical bonds between substrate 103 and die adhesive 107.
Interface 121 includes molecules with benzene rings formed from a
reaction of the promoter and substrate molecules and the promoter
and encapsulant molecules.
[0024] A catechol group adhesion promoter is an adhesion promoter
that includes catechol molecules and/or catechol derivative
molecules. Catechol is also known as 1,2, dihydroxybenzene or
pyrocatechol. A catechol derivative is a substance having a
molecule that includes a benzene ring and at least two hydroxyl
groups bonded to the ring.
[0025] FIG. 5 sets forth molecular models of catechol and various
catechol derivatives. Model 501 is a model of a catechol molecule.
Models for dopamine, alpha-methyldopamine, norepinephrine,
dihydroxyphenylalanine (DOPA), alpha-methyldopa, droxidopa, and
5-hydroxydopamine molecules are also shown in FIG. 5. In the
dopamine molecule shown in FIG. 5, box 503 is drawn around the
benzene ring and two hydroxyls ("HO") bonded to the ring.
[0026] Referring back to FIG. 1, interface 121 is shown as being
located on substrate 103. Interface 121 includes one or more layers
of molecules that are bonded to molecules of the structures on
either side of the interface. In the embodiment of FIG. 1, the
adhesion promoter is applied to substrate 103 prior to the
attachment of die 105. Consequently interface 121 is shown as being
located beneath adhesive 107. The chemical makeup of interface 121
at a particular location is dependent on the materials on either
side of interface 121. For example, the chemical makeup of
interface 121 beneath adhesive 107 may be different than that
between encapsulant 109 and substrate 103. Furthermore, where
substrate 103 has multiple materials at its top surface (e.g. both
dielectric and metal), the chemical makeup of interface 121 would
be different at different locations as well. In some embodiments,
interface 121 may also include unreacted catechol group
molecules.
[0027] In the embodiment of FIG. 1, the adhesion promoter interface
is not located on the wire bonds of pads 119. This is due in some
embodiment to the pads being scrubbed prior to wirebonding which
removes the interface molecules.
[0028] In FIG. 1, interface 121 is shown as being thicker than it
actually is relative to other structures of device 101. This is
done in the figures to illustrate the location of interface 121. In
some embodiments, interface 121 may only be one molecule thick or a
few molecules thick.
[0029] In one embodiment, the adhesion promoter includes other
substances in addition to the catechol group molecules. For
example, the promoter may include a fluorinated copolymer that aids
in the adhesion reaction with some materials such as metals (e.g.
copper). The promoter may include sodium bisulfate.
[0030] In one embodiment, the substances (including the promoter)
are dissolved in an aqueous buffer solution such as an aqueous
hydrochloride for its application to the substrate. In another
embodiment, the substances (including the promoter are dissolved in
ethanol. In one embodiment, the promoter is applied to substrate
103 by immersing the substrate in the promoter solution. In one
embodiment, the solution is heated during the immersion process.
During the immersion process, the promoter reacts with the surface
of the substrate to form chemical bonds between the benzene rings
of the promoter and molecules of the substrate. The resultant
molecules may also have a free hydroxyl that will aid in subsequent
bonding to the encapsulant. Because the entire panel is immersed in
some embodiments, substrate 103 includes a layer 122 of material
that includes molecules with benzene rings on the bottom of the
substrate 103. In one embodiment, the material formed from the
reaction of the adhesion promoter with the surfaces of the
substrate is characterized as a self assembled monolayer, which is
molecular assembly formed spontaneously on a surface by
adsorption.
[0031] In the embodiment shown, substrate 103 was part of a panel
of packaged substrates when immersed. After die attachment,
wirebonding, and encapsulation, the panel is separated into
multiple packages. Thus, in the embodiment shown, no adhesion
promoter material is located on the side of device 101.
[0032] FIGS. 6 and 7 show molecular models illustrating the
molecules of the promoter, substrate, and encapsulant and their
reaction to each other.
[0033] FIG. 6 shows a model for a catechol molecule 603 in
proximity to a model for encapsulant molecule 601 and in proximity
to a model for a metal molecule 619 of a substrate. In some
embodiments, this state of the molecules may not actually exist in
that the adhesion promoter first bonds to the substrate material
during its application and then bonds to the encapsulant during the
encapsulation process. However, FIG. 6 is being shown to illustrate
the chemical processes involved in the chemical bonding.
[0034] The encapsulant molecule 601 includes nitrogen, CH,
CH.sub.2, and hydroxyls (e.g. hydroxyl 609). The "R" of molecule
601 represents any chemical molecule of the encapsulant material.
The complete structure of molecule 601 is not shown in FIG. 6 in
that CH, CH.sub.2, and hydroxyls are located above the top nitrogen
element in FIG. 6. The "M" in molecule 619 represents any metal
molecule (e.g. copper). Molecule 619 includes a hydroxyl 615.
Catechol molecule 603 includes benzene ring 605 and hydroxyls 607
and 613.
[0035] FIG. 7 shows a model of a molecule 700 of a catechol
adhesion promoted interface wherein the catechol molecule 603 has
reacted with metal molecule 619 and reacted with encapsulant
molecule 601 to form a resultant molecule 700. In forming molecule
700, metal molecule 619 is chemically bonded to benzene ring 605
with an oxygen chemical covalent bond 705 and encapsulant molecule
601 is bonded to ring 605 with an oxygen chemical covalent bond
701. During the chemical reactions, hydroxyl 615 of metal molecule
619 reacts with hydroxyl 613 of catechol molecule 603 to form
oxygen bond 705 and a water molecule. Also during the reactions,
hydroxyl 609 reacts with hydroxyl 607 to form oxygen bond 701 and a
water molecule. Resultant molecule 700 includes material from an
encapsulant molecule 601, an adhesion promoter molecule 603, and a
substrate molecule 619. Accordingly, the resultant molecules
provide for a stronger bond between the encapsulant and the
substrate. During the encapsulation process, the water molecules
are removed by out gassing.
[0036] In some embodiments, not all of the catechol group molecules
of a catechol group adhesion promoter chemically bond to both the
substrate molecules and the encapsulant molecules. For example, in
FIG. 7, benzene ring 707 is only chemically bonded to material of
the encapsulant layer and not material of the substrate. In other
embodiments, some benzene rings of an interface would only be
chemically bonded to molecules of the substrate. Still in other
embodiments, the interface would include catechol group molecules
that are unreacted with either encapsulant molecules or substrate
molecules.
[0037] In other embodiment, the molecules may be bonded together by
other types of chemical bonds other than the oxygen covalent bonds
shown in FIG. 7. For example, the benzene ring may be bonded to
either molecules of the encapsulant or molecules of the substrate
with a hydrogen or ionic bond. In other embodiments, the benzene
rings of an interface layer maybe interconnected with each other
with carbon bonds to form a honeycomb like structure. In one
embodiment, the resultant molecules of the interface form a self
assembled monolayer.
[0038] FIG. 2 is a cross sectional side view of a packaged
electronic device according to another embodiment of the present
invention. Packaged device 201 is similar to packaged device 101
except that the adhesion promoter is applied after wiring bonding
with the embodiment of FIG. 2. Otherwise, substrate 203, adhesive
207, die 205, encapsulant 209, pads 219, wires 211, and solder
balls 213 are similar to substrate 103, adhesive 107, die 105,
encapsulant 109, pads 119, wires 111, and solder balls 113 of FIG.
1.
[0039] In the embodiment of FIG. 2, because the adhesion promoter
is applied to substrate 203 after the attachment of die 205 and
after wire bonding, the adhesion promoter is applied to the
surfaces of die 205 and wires 211. Accordingly, interface 221 is
located at the surfaces of the wires and dies 205 where the
encapsulant chemically bonds with the metal of wires 211 and the
surface of die 205. Also, material 222 is formed by the application
of catechol group adhesion promoter to the bottom of substrate
203.
[0040] FIG. 3 sets forth a flow diagram 301 for making a packaged
electronic device similar to device 101. In process 303, an
adhesion promoter is applied to a substrate panel. In one
embodiment, the adhesion promoter is applied by immersing a multi
substrate panel in a liquid containing the catechol group
molecules. In one embodiment, the liquid is at a temperature in the
range of 70-120 Celsius when the panel is immersed in the liquid,
but the liquid may be at other temperatures in other embodiments.
During the immersion, the benzene rings of the catechol group
molecules react with the molecules of the substrate to chemically
bond to the material of the substrate. However, the promoter may be
applied by other methods. In some embodiment, the solution is
alkaline with a PH of 6 to 9. In other embodiments, the solution
may be slightly acidic with a PH of 3 to 6. In some embodiments
where each substrate has multiple structures made of different
materials at its surface, the substrate may be dipped in multiple
solutions of different PH levels, of different catechol group
molecules, and/or of other different substances so that the benzene
rings chemically bond effectively to the different materials of the
substrate.
[0041] In process 305, the die (or other electronic component) is
attached to the substrate. In process 307, the die is electrically
coupled to the substrate (e.g. by wirebonding). In some embodiments
such as with some flip chip configurations, processes 305 and 307
are performed at the same time where the die is electrically
coupled when attached to the substrate.
[0042] In process 309, the substrate and die are encapsulated with
an encapsulant. In one embodiment, the encapsulant is applied by a
transfer molding process. However, in other embodiments, the
encapsulant may be formed by other encapsulating processes e.g. by
a compression molding process. The encapsulation process typically
includes the application of heat to the encapsulating assembly.
During the encapsulating process, the encapsulant molecules
chemically react with the catechol adhesion promoter bonded to the
substrate surface to form chemical bonds. As a result, the
encapsulant is chemically bonded to material of the substrate with
the benzene rings of the catechol adhesion promoted interface.
[0043] After the encapsulating process, the encapsulated substrate
panel is singulated into multiple packaged devices, e.g. with a saw
or laser. In some embodiments, solder balls maybe added to the
panel before singulation.
[0044] FIG. 4 sets forth a flow diagram 401 for making a packaged
electronic device similar to device 201. The processes of FIG. 4 is
similar to the processes of FIG. 3 except that the catechol group
adhesion promoter is applied to the substrate (in process 407)
after the attachment of the die to the substrate (in process 403)
and the attachment of wire bonds (in process 405). Accordingly, the
material formed by the application of the adhesion promoter is
attached to the wire bonds and die as well as to exposed surfaces
of the substrate. Processes 409 and 411 are similar to processes
309 and 311 in the embodiment of FIG. 3.
[0045] In other embodiments, the catechol group adhesion promoter
is applied after attachment of the die to the substrate (process
403) but before wire bonding (process 405).
[0046] In one embodiment, applying a catechol group adhesion
promoter to a surface of a substrate prior to encapsulation of the
surface of the substrate acts to increase the bond strength between
the surface of the substrate and the encapsulant. The catechol
group adhesion promoter acts to form molecules each with a benzene
ring that is chemically bonded to material of the encapsulant and
to material of the substrate. This may be especially important for
substrates having an encapsulating surface that is metal (e.g.
copper, silver plated copper, nickel palladium gold, gold
palladium, or gold). Without the adhesion promoter, it may be
difficult to form chemical bonds between the encapsulant and
metal.
[0047] The chemical bonds formed by the use of the adhesion
promoter increase the bond strength between the encapsulant and
substrate. Providing increased bond strength between the
encapsulant and substrate may enable a higher reliability of the
package which is important in high temperature, high humidity
applications such as in automotive or industrial applications. In
some embodiments, the encapsulant remains bonded to the substrate
at temperatures ranging from -80 to 300 degrees Celsius.
[0048] With applying the promoter to the substrate, the ingredients
of the promoter can be tailored to the surface materials of the
substrate to increase the bond strength between the benzene rings
and the substrate. Also, by applying the adhesion promoter to the
surface of the substrate, the surface can be more consistently
coated with molecules having free hydroxyls, which provide for a
better surface for subsequent encapsulation.
[0049] In one embodiment, a method comprises attaching an
electronic component to a package substrate and encapsulating a
surface of the package substrate with an encapsulant. Prior to the
encapsulating, an adhesion promoter is applied to the surface. The
adhesion promoter includes catechol group molecules.
[0050] In another embodiment, a packaged electronic device includes
a package substrate, an electronic component attached to the
package substrate, and an encapsulant bonded to a portion of the
package substrate at a catechol group adhesion promoted interface
that includes a plurality of benzene rings bonded with the package
substrate and the encapsulant.
[0051] In another embodiment, a packaged electronic device includes
a package substrate including a surface, an encapsulant
encapsulating the surface, and a self assembled monolayer interface
between the surface and the encapsulant. The self assembled
monolayer interface including a plurality of molecules each
including a benzene ring chemically bonded to the surface and to
the encapsulant.
[0052] While particular embodiments of the present invention have
been shown and described, it will be recognized to those skilled in
the art that, based upon the teachings herein, further changes and
modifications may be made without departing from this invention and
its broader aspects, and thus, the appended claims are to encompass
within their scope all such changes and modifications as are within
the true spirit and scope of this invention.
* * * * *