U.S. patent application number 15/158396 was filed with the patent office on 2016-09-08 for silicon etch process with tunable selectivity to sio2 and other materials.
This patent application is currently assigned to Applied Materials, Inc.. The applicant listed for this patent is Applied Materials, Inc.. Invention is credited to Seung Park, Anchuan Wang.
Application Number | 20160260588 15/158396 |
Document ID | / |
Family ID | 55526415 |
Filed Date | 2016-09-08 |
United States Patent
Application |
20160260588 |
Kind Code |
A1 |
Park; Seung ; et
al. |
September 8, 2016 |
SILICON ETCH PROCESS WITH TUNABLE SELECTIVITY TO SiO2 AND OTHER
MATERIALS
Abstract
A tunable plasma etch process includes generating a plasma in a
controlled flow of a source gas including NH.sub.3 and NF.sub.3 to
form a stream of plasma products, controlling a flow of
un-activated NH.sub.3 that is added to the stream of plasma
products to form an etch gas stream; and controlling pressure of
the etch gas stream by adjusting at least one of the controlled
flow of the source gas and the flow of un-activated NH.sub.3 until
the pressure is within a tolerance of a desired pressure. An etch
rate of at least one of polysilicon and silicon dioxide by the etch
gas stream is adjustable by varying a ratio of the controlled flow
of the source gas to the flow of un-activated NH.sub.3.
Inventors: |
Park; Seung; (San Jose,
CA) ; Wang; Anchuan; (San Jose, CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Applied Materials, Inc. |
Santa Clara |
CA |
US |
|
|
Assignee: |
Applied Materials, Inc.
Santa Clara
CA
|
Family ID: |
55526415 |
Appl. No.: |
15/158396 |
Filed: |
May 18, 2016 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14566291 |
Dec 10, 2014 |
9368364 |
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15158396 |
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62054860 |
Sep 24, 2014 |
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Current U.S.
Class: |
1/1 |
Current CPC
Class: |
H01L 21/32137 20130101;
H01J 37/32449 20130101; H01J 2237/334 20130101; H01L 21/3065
20130101 |
International
Class: |
H01J 37/32 20060101
H01J037/32; H01L 21/3065 20060101 H01L021/3065 |
Claims
1. A plasma etch processing system that etches silicon and silicon
dioxide with tunable selectivity, comprising: a first NH.sub.3 flow
controller that controls an NH.sub.3 plasma source gas stream; an
NF.sub.3 flow controller that controls an NF.sub.3 plasma source as
stream; a remote plasma source configured to apply RF energy to the
NH.sub.3 plasma source gas stream and the NF.sub.3 plasma source
gas stream, to generate a plasma product stream therefrom; a second
NH.sub.3 flow controller configured to control an un-activated
NH.sub.3 gas stream; apparatus for adding the un-activated NH.sub.3
gas stream to the plasma product stream to form an etch gas stream;
and a process chamber configured to expose a workpiece to the etch
gas stream; wherein etch rates of at least one of polysilicon and
silicon dioxide on the workpiece, by the etch gas stream, are
adjustable at least by varying a ratio of the plasma source gas
stream to the un-activated NH.sub.3 gas stream.
2. The plasma etch processing system of claim 1, further
comprising: a controller for adjusting at least the first and
second NH.sub.3 flow controllers and the NF.sub.3 flow
controller.
3. The plasma etch processing system of claim 2, further
comprising: a pressure sensor for measuring pressure of the etch
gas stream, wherein the controller monitors the pressure of the
etch gas stream, and adjusts at least one of the first and second
NH.sub.3 flow controllers and the NF.sub.3 flow controller, to
control the pressure within a range of about 0.5 Torr to 10
Torr.
4. The plasma etch processing system of claim 2, further comprising
a temperature sensor, wherein the controller controls a temperature
of the workpiece within a range of 100 C to 125 C.
5. The plasma etch processing system of claim 2, further comprising
a vacuum pump for evacuating at least one of the remote plasma
source and the process chamber, wherein the controller controls the
vacuum pump.
6. The plasma etch processing system of claim 2, further comprising
a temperature sensor, wherein the controller controls a temperature
of the workpiece within a range of 100 C to 125 C.
7. A plasma etch processing system, comprising: a process chamber
configured to expose a workpiece to an etch gas stream; a plasma
source that generates a plasma product stream from a source gas
stream that includes NH.sub.3 and NF.sub.3; means for controlling a
first NH.sub.3 flow of the source gas stream; means for controlling
an NF.sub.3 flow of the source gas stream; means for controlling a
second NH.sub.3 flow of an un-activated NH.sub.3 gas stream; and a
diffuser plate disposed between the plasma source and the process
chamber that allows the plasma product stream to flow through the
diffuser plate toward the process chamber, and adds the
un-activated NH.sub.3 gas stream only on a process chamber side of
the diffuser plate, to form an etch gas stream; and a controller
for controlling at least: the plasma source, the means for
controlling the first NH.sub.3 flow of the source gas stream, the
means for controlling the NF.sub.3 flow of the source gas stream,
the means for controlling the second NH.sub.3 flow of the
un-activated NH.sub.3 gas stream, and a pressure within the process
chamber; such that the controller adjusts etch rates of at least
one of polysilicon and silicon dioxide by the etch gas stream on
the workpiece by varying at least one of the pressure and a ratio
of the un-activated NH.sub.3 gas stream to the source gas
stream.
8. The plasma etch processing system of claim 2, wherein: the
controller is operable to provide a 10:1 ratio of the plasma source
gas stream to the un-activated NH.sub.3 gas stream; and at the 10:1
ratio, the system provides a 20:1 selectivity of an etch rate of
the polysilicon over an etch rate of the silicon dioxide.
9. The plasma etch processing system of claim 8, wherein: the
controller is operable to adjust the ratio of the plasma source gas
stream to the un-activated NH3 gas stream from 10:1 to 5:1, and at
the 5:1 ratio, the system reduces the selectivity of the etch rate
of the polysilicon over the etch rate of the silicon dioxide from
20:1 to 2:1.
10. The plasma etch processing system of claim 9, wherein the
controller is operable to adjust the ratio of the plasma source gas
stream to the un-activated NH.sub.3 gas stream from 10:1 in a first
etch sequence, to 5:1 in a second etch sequence.
11. The plasma etch processing system of claim 9, wherein the
controller is operable to adjust the ratio of the plasma source gas
stream to the un-activated NH.sub.3 gas stream from 10:1 at a first
time within a etch sequence, to 5:1 at a second time within the
etch sequence.
12. The plasma etch processing system of claim 9, wherein adjusting
the ratio of the plasma source gas stream to the un-activated
NH.sub.3 gas stream from 10:1 to 5:1 reduces a concentration of at
least one of F and H radicals in the etch gas stream.
13. The plasma etch processing system of claim 3, wherein: the
controller is operable to provide a 5:1 ratio of the plasma source
gas stream to the un-activated NH3 gas stream; the controller is
operable to control the pressure at about 6 Torr, and the system
provides a 3:1 selectivity of an etch rate of the silicon dioxide
over an etch rate of the polysilicon.
14. The plasma etch processing system of claim 7, wherein the means
for controlling the first NH.sub.3 flow, the means for controlling
the NF.sub.3 flow and the means for controlling the second NH.sub.3
flow comprise mass flow controllers for each of the first NH.sub.3
flow, the NF.sub.3 flow and the second NH.sub.3 flow.
15. The plasma etch processing system of claim 7, further
comprising means for controlling a flow of one of He, Ar and oxygen
that forms part of the etch gas stream.
16. The plasma etch processing system of claim 7, wherein the
controller is operable to adjust a ratio of the second NH.sub.3
flow of the un-activated NH.sub.3 gas stream to a flow of the
source gas stream, from a first time to a second time within an
etch sequence.
17. The plasma etch processing system of claim 7, wherein: the
first time precedes the second time; at the first time, the
controller controls the second NH.sub.3 flow of the un-activated
NH.sub.3 gas stream such that the un-activated NH.sub.3 gas stream
produces an initial nonzero oxide etch rate at the first time; and
at the second time, the controller reduces the second NH.sub.3 flow
of the un-activated NH.sub.3 gas stream to reduce the oxide etch
rate, as compared to the initial nonzero oxide etch rate at the
first time.
18. The plasma etch processing system of claim 7, wherein the
plasma source ignites a capacitively coupled plasma from the source
gas stream to generate the plasma product stream.
19. A plasma etch processing system that etches silicon and silicon
dioxide with adjustable selectivity, comprising: a first flow
controller that controls a first source gas stream of a
hydrogen-containing source gas; a second flow controller that
controls a second source gas stream of a fluorine-containing source
gas; a remote plasma source configured to apply RF energy to the
first and second source gas streams, to generate a plasma product
stream therefrom; a third flow controller that controls an
un-activated gas stream; apparatus for adding the un-activated gas
stream to the plasma product stream to form an etch gas stream; and
a process chamber configured to expose a workpiece to the etch gas
stream; wherein etch rates of at least one of silicon and silicon
dioxide on the workpiece, by the etch gas stream, are adjustable at
least by varying a ratio of the plasma source gas stream to the
un-activated gas stream.
20. The plasma etch processing system of claim 19, wherein the
un-activated gas stream comprises NH.sub.3.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of U.S. patent application
Ser. No. 14/566,291, filed Dec. 10, 2014 and entitled "Silicon Etch
Process With Tunable Selectivity to SiO.sub.2 and Other Materials,"
which claims the benefit of priority to U.S. Provisional Patent
Application No. 62/054,860, filed 24 Sep. 2014 and entitled
"Silicon Etch Process With Tunable Selectivity to SiO.sub.2 and
Other Materials." Both of the above-identified applications are
incorporated herein by reference in their entireties for all
purposes.
TECHNICAL FIELD
[0002] The present disclosure applies broadly to the field of
plasma processing equipment. More specifically, systems and methods
for managing selectivity of plasma etches are disclosed.
BACKGROUND
[0003] Semiconductor processing often utilizes plasma processing to
etch, clean or deposit material on semiconductor wafers. Plasma
etching often targets a particular material, but may also affect
other materials that are present on the same wafer, or other
workpiece. Selectivity of a plasma etch is often defined as a ratio
of an etch rate of a target material to the etch rate of the same
etch to another material. It is often advantageous for selectivity
to be very high, such that the target material can be etched with
little effect on other materials.
SUMMARY
[0004] In an embodiment, a tunable plasma etch process includes
generating a plasma in a controlled flow of a source gas including
NH.sub.3 and NF.sub.3 to form a stream of plasma products,
controlling a flow of un-activated NH.sub.3 that is added to the
stream of plasma products to form an etch gas stream; and
controlling pressure of the etch gas stream by adjusting at least
one of the controlled flow of the source gas and the flow of
un-activated NH.sub.3 until the pressure is within a tolerance of a
desired pressure. An etch rate of at least one of polysilicon and
silicon dioxide by the etch gas stream is adjustable by varying a
ratio of the controlled flow of the source gas to the flow of
un-activated NH.sub.3.
[0005] In an embodiment, a plasma etch processing system that
etches silicon and silicon dioxide with tunable selectivity
includes a first NH.sub.3 flow controller, an NF.sub.3 flow
controller, and a remote plasma source configured to apply RF
energy to a plasma source gas stream controlled by the first
NH.sub.3 flow controller and the NF.sub.3 flow controller, to
generate a plasma product stream from the plasma source gas stream.
The processing system further includes a second NH.sub.3 flow
controller configured to control an un-activated NH.sub.3 gas
stream, apparatus for adding the un-activated NH.sub.3 gas stream
to the plasma product stream to form an etch gas stream, and a
process chamber configured to expose a workpiece to the etch gas
stream. Etch rates of at least one of polysilicon and silicon
dioxide by the etch gas stream on the workpiece are adjustable at
least by varying a ratio of the plasma source gas stream to the
un-activated NH.sub.3 gas stream.
[0006] In an embodiment, a plasma etch processing system includes a
process chamber configured to expose a workpiece to an etch gas
stream, and a plasma source that generates a plasma product stream
from a source gas stream that includes NH.sub.3 and NF.sub.3. The
system also includes means for controlling a first NH.sub.3 flow
and an NF.sub.3 flow of the source gas stream, and means for
controlling a second NH.sub.3 flow of an un-activated NH.sub.3 gas
stream. The system also includes a diffuser plate disposed between
the plasma source and the process chamber that allows the plasma
product stream to flow through the diffuser plate toward the
process chamber, and adds the un-activated NH.sub.3 gas stream only
on a process chamber side of the diffuser plate, to form an etch
gas stream. The system also includes a controller for controlling
the plasma source, the means for controlling the first NH.sub.3
flow and the NF.sub.3 flow of the source gas stream, and the means
for controlling the second NH.sub.3 flow of the un-activated
NH.sub.3 gas stream, such that the controller adjusts etch rates of
at least one of polysilicon and silicon dioxide by the etch gas
stream on the workpiece by varying a ratio of the un-activated
NH.sub.3 gas stream to the source gas stream.
BRIEF DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 schematically illustrates major elements of a plasma
processing system, according to an embodiment.
[0008] FIG. 2 schematically illustrates major elements of a plasma
processing system, in a cross-sectional view, according to an
embodiment.
[0009] FIG. 3 is a flowchart of a tunable plasma etch process,
according to an embodiment.
[0010] FIG. 4 shows a graph that illustrates test etch rate results
of a Si etch having tunable selectivity to SiO.sub.2, according to
an embodiment.
[0011] FIG. 5 illustrates an SiO.sub.2 region on a wafer section,
forming trenches that are lined with TiN, according to an
embodiment.
[0012] FIG. 6 illustrates the SiO.sub.2 region of FIG. 5 as
including a significant fraction of Si, according to an
embodiment.
[0013] FIG. 7 illustrates the result of etching the wafer section
of FIG. 5 with a Si etch having tunable selectivity to SiO.sub.2 to
form a modified wafer section, according to an embodiment.
[0014] FIGS. 8A, 8B and 8C schematically illustrate a process
sequence in which trace amounts of SiO.sub.2 are not successfully
removed by prior art processing.
[0015] FIGS. 9A, 9B, 9C and 9D schematically show how the structure
shown in FIGS. 8A, 8B and 8C can be more successfully processed
with a Si etch with tunable selectivity to oxide, according to
embodiments herein.
DETAILED DESCRIPTION
[0016] FIG. 1 schematically illustrates major elements of a plasma
processing system 100, according to an embodiment. System 100 is
depicted as a single wafer, semiconductor wafer plasma processing
system, but it will be apparent to one skilled in the art that the
techniques and principles herein are applicable to plasma
generation systems of any type (e.g., systems that do not
necessarily process wafers or semiconductors). It should also be
understood that FIG. 1 is a simplified diagram illustrating only
selected, major elements of system 100; an actual processing system
will accordingly look different and likely contain additional
elements as compared with system 100.
[0017] Processing system 100 includes a housing 110 for at least a
wafer interface 115, a user interface 120, a plasma processing unit
130, a controller 140, one or more flow controller(s) 156 and one
or more power supplies 150. Processing system 100 is supported by
various utilities that may include gas(es) 155, electrical power
170, vacuum 160 and optionally others; within system 100,
controller 140 may control use of any or all of such utilities.
Internal plumbing and electrical connections within processing
system 100 are not shown, for clarity of illustration.
[0018] Processing system 100 is illustrated as a so-called
indirect, or remote, plasma processing system that generates a
plasma in a first location and directs the plasma and/or plasma
products (e.g., ions, molecular fragments, free radicals, energized
species and the like) to a second location where processing occurs.
Thus, in FIG. 1, plasma processing unit 130 includes a remote
plasma source 132 that supplies plasma and/or plasma products for a
process chamber 134. Process chamber 134 includes one or more wafer
pedestals 135, to which wafer interface 115 delivers and retrieves
workpieces 50 (e.g., a semiconductor wafer, but could be a
different type of workpiece) for processing. Wafer pedestal 135 is
heated and/or cooled by a wafer heating/cooling apparatus 117 which
could include, in embodiments, resistive heaters, other types of
heaters, or cooling fluids. In operation, gas(es) 155 are
introduced into plasma source 132 and a radio frequency generator
(RF Gen) 165 supplies power to ignite a plasma within plasma source
132. Plasma and/or plasma products pass from plasma source 132
through at least a diffuser plate 137 to process chamber 134, where
workpiece 50 is processed. An actual plasma system may provide many
other optional features or subsystems through which plasma and/or
plasma products flow and/or mix between plasma source 132 and
process chamber 134, and may include sensors 118 that measure
parameters such as pressures, temperatures, optical emissions and
the like at wafer pedestal 135, within process chamber 134 as
shown, and possibly at other locations within processing system
100.
[0019] The elements illustrated as part of system 100 are listed by
way of example and are not exhaustive. Many other possible
elements, such as: pressure and/or flow controllers; gas or plasma
manifolds or distribution apparatus; ion suppression plates;
electrodes, magnetic cores and/or other electromagnetic apparatus;
mechanical, pressure, temperature, chemical, optical and/or
electronic sensors; wafer or other workpiece handling mechanisms;
viewing and/or other access ports; and the like may also be
included, but are not shown for clarity of illustration. In
particular, flow controllers may be, or include, mass flow
controllers, valves, needle valves, and pressure regulators.
Various control schemes affecting conditions in process chamber 105
are possible. For example, a pressure may be maintained by
monitoring the pressure in process chamber 134 and adjusting all
gas flows upwards or downwards until the measured pressure is
within some tolerance of a desired pressure. In embodiments herein,
the pressure may be controllable within a range of about 0.5 Torr
to 10 Torr; in certain embodiments, controlling pressure around 2
Torr or 6 Torr may be advantageous. Temperatures can be controlled
by adding heaters and temperature sensors to process chamber 134
and/or wafer pedestal 135. Optical sensors may detect emission
peaks of plasmas as-generated and/or as they interact with
workpieces.
[0020] Internal connections and cooperation of the elements
illustrated within system 100 are also not shown for clarity of
illustration. In addition to RF generator 165 and gases 155, other
representative utilities such as vacuum 160 and/or general purpose
electrical power 170 may connect with system 100. Like the elements
illustrated in system 100, the utilities illustrated as connected
with system 100 are intended as illustrative rather than
exhaustive; other types of utilities such as heating or cooling
fluids, pressurized air, network capabilities, waste disposal
systems and the like may also be connected with system 100, but are
not shown for clarity of illustration. Similarly, while the above
description mentions that plasma is ignited within remote plasma
source 132, the principles discussed below are equally applicable
to so-called "direct" plasma systems that create a plasma in a the
actual location of workpiece processing.
[0021] Although an indirect plasma processing system is illustrated
in FIG. 1 and elsewhere in this disclosure, it should be clear to
one skilled in the art that the techniques, apparatus and methods
disclosed herein may also be applicable to direct plasma processing
systems--e.g., where a plasma is ignited at the location of the
workpiece(s). Similarly, in embodiments, the components of
processing system 100 may be reorganized, redistributed and/or
duplicated, for example: (1) to provide a single processing system
with multiple process chambers; (2) to provide multiple remote
plasma sources for a single process chamber; (3) to provide
multiple workpiece fixtures (e.g., wafer pedestals 135) within a
single process chamber; (4) to utilize a single remote plasma
source to supply plasma products to multiple process chambers;
and/or (5) to provide plasma and gas sources in serial/parallel
combinations such that various source gases may be activated (e.g.,
exist at least temporarily as part of a plasma) zero, one, two or
more times, and mixed with other source gases before or after they
enter a process chamber, and the like. Gases that have not been
part of a plasma are sometimes referred to as "un-activated" gases
herein.
[0022] FIG. 2 schematically illustrates major elements of a plasma
processing system 200, in a cross-sectional view, according to an
embodiment. Plasma processing system 200 is an example of plasma
processing unit 130, FIG. 1. Plasma processing system 200 includes
a process chamber 205 and a plasma source 210. As illustrated in
FIG. 2, plasma source 210 introduces gases 155(1) directly, and/or
gases 155(2) that become plasma products in a further remote plasma
source 202, as plasma input gas 212, through an RF electrode 215.
RF electrode 215 includes (e.g., is electrically tied to) a first
gas diffuser 220 and a face plate 225 that serve to redirect flow
of the source gases so that gas flow is uniform across plasma
source 210, as indicated by small arrows 226. After flowing through
face plate 225, an insulator 230 electrically insulates RF
electrode 215 from a diffuser 235 that is held at electrical ground
(e.g., diffuser 235 serves as a second electrode counterfacing face
plate 225 of RF electrode 215). Surfaces of RF electrode 215,
diffuser 235 and insulator 230 define a plasma generation cavity
where a capacitively coupled plasma 245 is created when the source
gases are present and RF energy is provided through RF electrode
215. RF electrode 215 and diffuser 235 may be formed of any
conductor, and in embodiments are formed of aluminum (or an
aluminum alloy, such as the known "6061" alloy type). Surfaces of
face plate 225 and diffuser 235 that face the plasma cavity or are
otherwise exposed to reactive gases may be coated with yttria
(Y.sub.2O.sub.3) or alumina (Al.sub.2O.sub.3) for resistance to the
reactive gases and plasma products generated in the plasma cavity.
Insulator 230 may be any insulator, and in embodiments is formed of
ceramic.
[0023] Plasma products generated in plasma 245 pass through
diffuser 235 that again helps to promote the uniform distribution
of plasma products, and may assist in electron temperature control.
Upon passing through diffuser 235, the plasma products pass through
a further diffuser 260 that promotes uniformity as indicated by
small arrows 227, and enter process chamber 205 where they interact
with workpiece 50, such as a semiconductor wafer, atop wafer
pedestal 135. Diffuser 260 includes further gas channels 250 that
may be used to add one or more additional, un-activated gases
155(3) to the plasma products as they enter process chamber 205, as
indicated by very small arrows 229. Diffuser 260 provides
un-activated gases 155(3) only on a downstream, or process chamber
side, as shown.
[0024] Embodiments herein may be rearranged and may form a variety
of shapes. For example, RF electrode 215 and diffuser 235 are
substantially radially symmetric in the embodiment illustrated in
FIG. 2, and insulator 230 is a ring disposed against peripheral
areas of face plate 225 and diffuser 235, for an application that
processes a circular semiconductor wafer as workpiece 50. However,
such features may be of any shape that is consistent with use as a
plasma source. Moreover, the exact number and placement of features
for introducing and distributing gases and/or plasma products, such
as diffusers, face plates and the like, may also vary. For example,
it would be possible to substitute an arrangement for generating an
inductively coupled plasma, for the capacitively coupled plasma
arrangement illustrated. Also, in a similar manner to diffuser 260
including gas channels 250 to add un-activated gas 155(3) to plasma
products from plasma 245 as they enter process chamber 205, other
components of plasma processing system 200 may be configured to add
or mix gases 155 with other gases and/or plasma products as they
make their way through the system to process chamber 205.
[0025] In semiconductor processing, plasma etch processes for
etching polycrystalline silicon (hereinafter sometimes referred to
as "polysilicon" or "poly") are often advantageously selective to
silicon over silicon dioxide (hereinafter sometimes referred to as
"oxide"). One process scenario in which a plasma etch is highly
selective to poly over oxide is as follows. Polysilicon is often
utilized as a "gate" electrode in so-called "MOS" transistors (MOS
standing for Metal-Oxide-Semiconductor, although poly, instead of
metal, is usually used for the gate electrode material). To form
planar MOS transistors, a "source" and "drain" are formed in a
silicon wafer, with the gate defining separation of, and
influencing electrical conduction between, the source and drain. A
poly layer may be deposited over a dielectric layer, typically
SiO.sub.2. The SiO.sub.2 layer is typically very thin, to maximize
field strength in this layer in the final transistor when a voltage
is applied. The poly layer is typically thicker than the SiO.sub.2
layer, and poly depositions are often conformal such that minor
crevices on the wafer surface fill with poly. When the poly layer
is patterned, the poly in these crevices must be removed to prevent
adjacent transistor gates from shorting to one another. The
SiO.sub.2 layer may need to protect other parts of the wafer during
the fabrication process, especially as portions of the poly layer
are etched away to form the transistor gates. Therefore, a poly
etch with low selectivity to oxide (e.g., a poly etch that etches
oxide, as well) might etch through the SiO.sub.2 layer and damage
the underlying silicon wafer areas that are intended to form the
source and drain of the transistor.
[0026] There are, however, device geometries and processes that
benefit from a less selective poly etch. For example, recent
technologies have moved away from the original, planar MOS process
in which gates always overlie thin dielectric layers on a generally
flat silicon wafer surface, and/or form capacitors with conductors
across a thin dielectric layer. Certain processes etch trenches
into silicon surfaces, then grow or deposit oxides on the trench
surfaces to form trench devices, including trench capacitors having
much larger capacitance per unit area than would be possible on the
flat wafer surface. These and/or other processes generate silicon
fins by, for example, generating vertical steps on a wafer,
depositing poly conformally, and anisotropically etching back the
poly in a vertical direction, clearing the poly from horizontal
surfaces but leaving the fins behind as residual features against
the vertical steps. Many other arrangements are in use or under
study to reduce wafer area needed for fabrication of complex
devices, to improve device performance, density and/or yield of
working circuits per wafer. In such cases, a plasma etch having a
selectivity that could be adjustable, or "tunable" from highly
selective to poly over oxide, to less selective, or even to being
selective to oxide over poly, is advantageous.
[0027] Plasma etch embodiments herein have tunable selectivity, for
example selectivity to Si over oxide. These embodiments typically
utilize NF.sub.3 and NH.sub.3 gases as plasma source gases, and/or
as gases that are mixed with plasma products before reaching the
workpiece. Certain other gases such as He or Ar may additionally be
used as carrier gases but generally do not take part in reactions;
also, small percentages (less than about 10% of total gas flow) of
oxygen may be added to help with plasma ignition and to boost
reaction rates in the plasma. Generally speaking, in the plasma
environment NF.sub.3 and NH.sub.3 dissociate, and/or some of the
generated products thereof can combine, to form plasma products
such as free H and F radicals, HF, N.sub.2, NH.sub.4F and/or
NH.sub.4F.HF. Of these plasma products, plasma activation favors
formation of free H and F radicals, HF and N.sub.2, while addition
of un-activated NH.sub.3 favors formation of NH.sub.4F and/or
NH.sub.4F.HF. When Si (e.g., polysilicon) is present, F and Si can
react to form SiF.sub.4, while H and Si can react to form
SiH.sub.4. When SiO.sub.2 is present, NH.sub.4F or NH.sub.4F.HF can
react with SiO.sub.2 to form (NH.sub.4).sub.2SiF.sub.6 and
H.sub.2O; importantly, (NH.sub.4).sub.2SiF.sub.6 generally forms
and remains as a solid, but heat can cause it to dissociate to form
SiF.sub.4, NH.sub.3 and HF. Also when SiO.sub.2 is present,
NH.sub.4F and NH.sub.4F.HF can react with SiO.sub.2 to form
SiH.sub.4F, H.sub.2O and NH.sub.3. Certain of these source gases
may participate in reactions even when provided in un-activated
form, for example, when provided as un-activated gas flow 155(3),
in addition to plasma products from plasma 245, FIG. 2.
[0028] Etches described herein are also tunable with respect to
selectivity of poly over silicon nitride. (The classic formulation
of silicon nitride is Si.sub.3N.sub.4, but stoichiometry of silicon
nitride can vary depending on the conditions in which it is
generated. In this disclosure, Si.sub.3N.sub.4 and other
stoichiometric variations of silicon nitride are referred to herein
simply as SiN.) When SiN is present, NF.sub.3 and SiN can react to
form NF and SiF.sub.4, while NF.sub.3, NH.sub.3 and SiN can react
to form SiH.sub.4.HF and NH.sub.4F.HF.
[0029] It has been discovered that in embodiments, certain ones of
the input gases (e.g., NF.sub.3 and NH.sub.3) have different
effects on the etching, as does the proportion of input gases that
are activated by forming plasma therefrom, to un-activated gases
(e.g., the proportion of input gas 212 to gas 155(3), see FIG. 2),
so as to provide etches with tunable selectivity. Temperature and
pressure have also been discovered to have effects. These effects
can be utilized to tune an etch that fundamentally uses the same
types of input gases to have different selectivities, as discussed
below. As noted above, it is possible to adjust ratios of plasma
products to un-activated gas (e.g., by adjusting ratios of input
gas 212, which forms plasma 245, to gas 155(3), see FIG. 2) to
further vary these effects. Furthermore, in embodiments, the etches
disclosed can be performed in such a way as to maintain very high
selectivity to other materials that may be present on a wafer and
should be left undisturbed, such as TiN or W. Still furthermore,
the etches disclosed can, in embodiments, have differing etch rates
such that an etch recipe can be tuned for high etch rate during one
part of an etch sequence, and a different etch rate during another
part of the etch sequence.
[0030] In an embodiment, a first variation of a plasma etch process
(or "recipe") has an initial ratio of NH.sub.3 to NF.sub.3 as a
plasma source gas (e.g., input gas 212) that forms plasma products
in plasma 245, and adds further NH.sub.3 as an un-activated gas
(e.g., gas 155(3)) resulting in a ratio of input gas 212 to gas
155(3) of about 10:1. The first recipe is performed at a pressure
of 2 Torr at the wafer (e.g., workpiece 50 in process chamber 205).
The pressure of 2 Torr may be maintained, for example, by
monitoring the pressure in process chamber 205 and adjusting all
gas flows upwards or downwards until the measured pressure is
within some tolerance of 2 Torr. The first recipe has a poly over
oxide selectivity of about 20:1. In the first recipe, the dominant
plasma reactions include NF.sub.3 and NH.sub.3 providing
substantial amounts of free F and H radicals, which react
aggressively with Si but less aggressively with SiO.sub.2.
[0031] A second variation of the etch recipe flows the same ratio
of NH.sub.3 to NF.sub.3 as input gas 212, but at a lower volume,
and/or adds more NH.sub.3 as un-activated gas 155(3), as compared
to the first recipe. The gas flows of the second etch recipe result
in a ratio of input gas 212 to gas 155(3) of about 4:1 or 5:1. The
second etch recipe is also performed at a pressure of 2 Torr. The
resulting poly over oxide etch rate selectivity is about 2:1. The
reduced etch rate selectivity is due to the adjusted gas flows
favoring production of NH.sub.4F and NH.sub.4F.HF, which
substantially etch SiO.sub.2, over production of F and H radicals,
which preferentially etch Si.
[0032] A third variation of the etch recipe flows the same ratio of
NH.sub.3 to NF.sub.3 as input gas 212, and NH.sub.3 as un-activated
gas 155(3), as compared to the second recipe, but is performed at a
pressure of 6 Torr. The increased pressure reduces the mean free
path of available F and H radicals, which again favors the etching
of SiO.sub.2 over the etching of Si. The third etch recipe actually
etches oxide faster than poly, with a resulting etch rate
selectivity of oxide over poly of about 3:1.
[0033] The etch recipes noted above may proceed faster at
relatively high wafer temperatures, such as greater than 100 C. The
etch recipes noted above can also be highly selective to materials
such as TiN and W that are commonly utilized in semiconductor
processing at the so-called "frontend" of the process (e.g., layers
where transistors and gates are formed and interconnected). That
is, the etch rates of TiN and W can be negligibly low. Achieving
high selectivity to TiN requires that temperature of a wafer being
etched be maintained at less than about 125 C, at which temperature
fluorine radicals begin to attack TiN.
[0034] Because the etches described above continuously vary the
ratio of NH.sub.3 and NF.sub.3 plasma products (e.g., free F and H
radicals) to un-activated NH.sub.3 that is added, and the pressure
at the workpiece (e.g., in process chamber 205), it is believed
that the selectivity of poly to oxide etch rates can be
continuously adjusted at least between the extremes noted above;
that is, at least from 20:1 poly over oxide to 3:1 oxide over poly.
This generates new possibilities for etch recipes, for example, the
ability to tailor a plasma etch to provide a selectivity that
accommodates process requirements for certain device geometries, or
to change the etch selectivity to accommodate changes in device
geometry. It may also simplify the deployment of plasma equipment
for multiple, similar etch steps in semiconductor process flows,
since the input chemistry utilizes the same gases in different
ratios to produce different results. Because the types of input
gases do not change, process aspects such as conditioning of
chamber surfaces is expected not to change significantly, such that
a single piece of processing equipment could be shifted rapidly
from one process to another with little or no re-conditioning of
the surfaces.
[0035] FIG. 3 is a flowchart of a tunable plasma etch process 300.
Plasma etch process 300 may be implemented, for example, by plasma
processing system 100, FIG. 1, and/or other plasma processing
systems that utilize plasma processing system 200, FIG. 2. In step
302, a plasma is generated in a controlled flow of a source gas
that includes NH.sub.3 and NF.sub.3. An example of step 302 is
flowing a mixture of NH.sub.3 and NF.sub.3 as input gas 212, FIG.
2, and generating plasma 245 therefrom. Plasma 245 will include
plasma products such as H and F free radicals, HF and N2, as shown
in reaction (1) above. In step 306, a controlled flow of
un-activated NH.sub.3 is added to the stream of plasma products, to
form an etch gas stream. An example of step 306 is flowing NH.sub.3
as un-activated gas 155(3), FIG. 2. Step 310 controls pressure of
the etch gas stream by adjusting the source gas and un-activated
NH.sub.3 flows until the etch gas pressure is within a tolerance of
a desired pressure. An example of step 310 is controlling pressure
of the etch gas stream in process chamber 205, FIG. 2, and
adjusting flows of input gas 212 and un-activated gas 155(3) until
the pressure in process chamber 205 is within a tolerance of the
desired pressure. Step 312 adjusts a ratio of source gas to
un-activated NH.sub.3 to vary etch rates of polysilicon and/or
silicon dioxide to achieve the desired selectivity. Step 312 is
done in concert with step 310; that is, an adjustment to one of the
source gas and un-activated NH.sub.3 will typically be performed
with an adjustment to the other, so that the etch gas pressure and
flow ratio are maintained simultaneously.
[0036] FIG. 4 shows a graph 330 that illustrates test etch rate
results of a Si etch having tunable selectivity to SiO.sub.2. In
the etch illustrated, NF.sub.3 and NH.sub.3 may be supplied either
as source gases 155(2) in the apparatus illustrated in FIG. 2, and
activated in remote plasma source 202, or may be supplied as source
gases 155(1) and activated in plasma 245. In the test data
illustrated, TiN etch rate was measured but remained at zero across
all tested process conditions. When the un-activated NH.sub.3 flow
rate was zero, Si had a low etch rate while SiO.sub.2 (labeled as
"Oxide" in graph 330) had an etch rate of almost zero. Therefore
with an un-activated NH.sub.3 flow rate of zero, the etch
conditions were extremely selective to Si over oxide. As the
un-activated NH.sub.3 flow rate increased, both Si and oxide etch
rates increased, therefore the corresponding etch conditions were
less selective to Si over oxide. At the highest un-activated
NH.sub.3 flow rate tested, the oxide etch rate increased enough
that the Si over oxide selectivity was only about 2:1.
[0037] FIGS. 5, 6 and 7 illustrate a process application that
advantageously utilizes a Si etch with tunable selectivity to
oxide, as described herein.
[0038] FIG. 5 illustrates an SiO.sub.2 region 350 on a wafer
section 340, forming trenches 380, 385 that are lined with TiN 360.
Atop TiN layer 360 is a poly layer 370. A region labeled as A in
FIG. 5 is illustrated in greater detail in FIG. 6.
[0039] FIG. 6 illustrates that poly layer 370 sits atop a region of
SiO.sub.2 375 that includes a significant fraction of Si. It is
important in this process that SiO.sub.2 375 not be etched
significantly, so when SiO.sub.2 375 is exposed, an etch that is
highly selective to poly over oxide should be employed, to minimize
attack on SiO.sub.2 375. Thus, the following discussion begins with
generating a plasma in a controlled flow of source gas that
includes NH.sub.3 and NF.sub.3, to form a stream of plasma
products, and adding a controlled flow of un-activated NH.sub.3 to
form an etch gas stream that interacts with poly layer 370 and
SiO.sub.2 375. Referring to FIG. 4, this suggests processing with
an un-activated NH.sub.3 flow rate of zero, or nearly zero, to
maximize selectivity of the etch to poly over oxide. However, low
flows of NH.sub.3 are also associated with somewhat lower Si etch
rate, which will make the etch process take longer if the low or
zero flow rate of un-activated NH.sub.3 is used continually. A
compromise that provides high etch throughput and high selectivity
when SiO.sub.2 375 is exposed, is provided by utilizing the etch
with tunable selectivity as described herein. Since the poly etch
rate is at least approximately known from graph 330, and the
thickness of poly layer 370 is known, the etch can start out with a
relatively high un-activated NH.sub.3 flow rate. For example, a
flow rate of 150 to 250, in the arbitrary units illustrated in FIG.
4, can be used. This provides a high poly etch rate, and this etch
rate is maintained for a time calculated as corresponding to
etching partially, but not completely, through the region of poly
370 labeled as 390 in FIG. 6. Then, either in a separate etch step
or without interrupting the etch, the un-activated NH.sub.3 flow
rate is brought down to zero, or near zero, while etching the
region of poly 370 labeled as 395. This causes the poly etch rate
to drop, but the corresponding oxide etch rate also drops to near
zero, as illustrated in FIG. 4, so the etch can completely clear
poly 370 without significant attack on Si rich SiO.sub.2 375. All
of the process conditions are also highly selective to TiN such
that a reasonable overetch can be used to clear poly in
topologically difficult locations such as sidewalls of trenches 380
and 385 while leaving TiN 360 intact. FIG. 7 illustrates the result
of etching wafer section 340 to form wafer section 340'.
[0040] FIGS. 8A, 8B and 8C schematically illustrate a process
sequence in which trace amounts of SiO.sub.2 are not successfully
removed by prior art processing. FIG. 8A shows a wafer section 400
that includes a portion of a silicon substrate 410 and overlying
structures. A spacer structure 450 is part of a fin-FET process.
Certain recesses within spacer structure 450 contain inter-layer
dielectric oxides 430 that are generally to be retained in the etch
sequence to be described. Other recesses contain polysilicon 420
that is to be removed; however the polysilicon is partially
oxidized along grain boundaries thereof, shown as oxide traces 425,
near the surface. Depth of oxide traces 425 is known with
reasonable accuracy. Below the poly, adjacent to silicon substrate
410 in the same recesses of spacer structure 450 are thin layers of
high dielectric constant oxide ("high-K oxide" hereinafter) 440
that are not to be etched at all.
[0041] FIG. 8B schematically illustrates partial etching of wafer
section 400 with a highly selective poly etch to form a partially
processed wafer section 401. The poly etch used is highly selective
so as not to etch high-K oxide 440, but because of this
selectivity, oxide traces 425 are also not etched. Wafer section
401 shows how wafer section 401 will look as poly 420 is about one
third etched away.
[0042] FIG. 8C schematically illustrates further etching of wafer
section 400 with a highly selective poly etch to form a partially
processed wafer section 402. Some oxide traces 425 remain in their
original locations, while others, having lost all mechanical
connection with spacer structure 450, migrate about the recesses to
other locations, as shown. At least some of oxide traces 425 cause
electrical defects in the finished semiconductor product, as they
interfere with the structures that should be present at their
locations, and/or cause photolithographic defects in further
processing.
[0043] FIGS. 9A, 9B, 9C and 9D schematically show how the structure
shown as wafer section 400 can be more successfully processed with
a Si etch with tunable selectivity to oxide, according to
embodiments herein. Thus, the following discussion begins with
generating a plasma in a controlled flow of source gas that
includes NH.sub.3 and NF.sub.3, to form a stream of plasma
products, and adding a controlled flow of un-activated NH.sub.3 to
form an etch gas stream that interacts with the features of wafer
section 400. FIG. 9A shows wafer section 400 (identical to that
shown in FIG. 8A). FIG. 9B illustrates partial etching of wafer
section 400 with the etch gas stream, to form a partially processed
wafer section 403. The etch gas stream used to form wafer section
403 includes enough NH.sub.3 to provide a nonzero oxide etch rate,
that is, to make the etch only partially selective to poly over
oxide. As shown in FIG. 9B, oxide traces 425 are etched along with
poly 420 in this part of the etch process. Once the etch penetrates
past oxide traces 425 (for example, after a time at which a
measured or calculated etch rate ensures etching to or beyond the
known maximum depth of oxide traces 425) NH.sub.3 flow can be
reduced to zero or near zero, to increase selectivity of poly over
oxide. FIG. 9C illustrates partial etching of wafer section 400
with the etch, to form a partially processed wafer section 403. The
etch proceeds in this manner until poly 420 is completely removed,
as shown in wafer section 405, FIG. 9D. The high selectivity of the
Si etch having tunable selectivity to oxide ensures that high-K
oxide 440 is not damaged as poly 420 is removed.
[0044] Having described several embodiments, it will be recognized
by those of skill in the art that various modifications,
alternative constructions, and equivalents may be used without
departing from the spirit of the invention. Additionally, a number
of well-known processes and elements have not been described in
order to avoid unnecessarily obscuring the present invention.
Accordingly, the above description should not be taken as limiting
the scope of the invention.
[0045] Where a range of values is provided, it is understood that
each intervening value, to the tenth of the unit of the lower limit
unless the context clearly dictates otherwise, between the upper
and lower limits of that range is also specifically disclosed. Each
smaller range between any stated value or intervening value in a
stated range and any other stated or intervening value in that
stated range is encompassed. The upper and lower limits of these
smaller ranges may independently be included or excluded in the
range, and each range where either, neither or both limits are
included in the smaller ranges is also encompassed within the
invention, subject to any specifically excluded limit in the stated
range. Where the stated range includes one or both of the limits,
ranges excluding either or both of those included limits are also
included.
[0046] As used herein and in the appended claims, the singular
forms "a", "an", and "the" include plural referents unless the
context clearly dictates otherwise. Thus, for example, reference to
"a process" includes a plurality of such processes and reference to
"the electrode" includes reference to one or more electrodes and
equivalents thereof known to those skilled in the art, and so
forth. Also, the words "comprise," "comprising," "include,"
"including," and "includes" when used in this specification and in
the following claims are intended to specify the presence of stated
features, integers, components, or steps, but they do not preclude
the presence or addition of one or more other features, integers,
components, steps, acts, or groups.
* * * * *