U.S. patent application number 14/586086 was filed with the patent office on 2016-06-09 for mems microphone package.
The applicant listed for this patent is INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE. Invention is credited to Hong-Ren CHEN, Yu-Wen FAN, Tzong-Che HO, Chao-Ta HUANG.
Application Number | 20160165358 14/586086 |
Document ID | / |
Family ID | 56095538 |
Filed Date | 2016-06-09 |
United States Patent
Application |
20160165358 |
Kind Code |
A1 |
HO; Tzong-Che ; et
al. |
June 9, 2016 |
MEMS MICROPHONE PACKAGE
Abstract
An MEMS microphone package includes a substrate, an MEMS
microphone, an IC chip and an electrically conductive cover. The
substrate includes a first hole, an upper surface, a bottom
surface, a side surface, a first electrically conductive layer and
a second electrically conductive layer. The side surface has two
sides connected to the upper surface and the bottom surface,
respectively. The first electrically conductive layer is disposed
on the upper surface. The second electrically conductive layer is
disposed on the bottom surface. The MEMS microphone is electrically
coupled to the substrate. The IC chip is electrically coupled to
the substrate. The electrically conductive cover includes a second
hole. The electrically conductive cover is bonded to the substrate
to form a chamber for accommodating the MEMS microphone and the IC
chip. The first hole and the second hole together form an acoustic
hole.
Inventors: |
HO; Tzong-Che; (Hsinchu
City, TW) ; FAN; Yu-Wen; (Hsinchu City, TW) ;
CHEN; Hong-Ren; (Hsinchu City, TW) ; HUANG;
Chao-Ta; (Hsinchu City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
Hsinchu |
|
TW |
|
|
Family ID: |
56095538 |
Appl. No.: |
14/586086 |
Filed: |
December 30, 2014 |
Current U.S.
Class: |
257/416 |
Current CPC
Class: |
H01L 2224/48227
20130101; H04R 2410/03 20130101; B81B 2201/0257 20130101; H01L
2224/48137 20130101; H04R 19/005 20130101; H04R 1/342 20130101;
B81B 7/0061 20130101; H01L 2224/48091 20130101; H01L 2924/00014
20130101; H04R 1/021 20130101; B81B 7/0064 20130101; H01L
2224/48091 20130101; H04R 2201/003 20130101; H04R 31/00 20130101;
H04R 23/00 20130101; B81B 7/007 20130101; H04R 1/04 20130101; H04R
2499/11 20130101 |
International
Class: |
H04R 23/00 20060101
H04R023/00; B81B 7/00 20060101 B81B007/00 |
Foreign Application Data
Date |
Code |
Application Number |
Dec 5, 2014 |
TW |
103142466 |
Claims
1. A microelectromechanical system (MEMS) microphone package,
comprising: a substrate, comprising: at least one first hole; an
upper surface; a bottom surface; a side surface with two sides
connected to the upper surface and the bottom surface,
respectively, and the two sides being opposite to each other; at
least one first electrically conductive layer disposed on the upper
surface; and at least one second electrically conductive layer
disposed on the bottom surface; at least one MEMS microphone
electrically coupled to the substrate; at least one IC chip
electrically coupled to the substrate; and an electrically
conductive cover comprising at least one second hole; wherein, the
electrically conductive cover is bonded to the substrate to form a
chamber for accommodating the MEMS microphone and the IC chip, the
at least one first hole and the at least one second hole together
form at least one acoustic hole, the at least one acoustic hole has
an opening on an outer surface of the MEMS microphone package, the
opening has a first boundary and a second boundary, the first
boundary of the opening is a part of a boundary of the at least one
first hole, and the second boundary of the opening is a part of a
boundary of the at least one second hole.
2. The MEMS microphone package according to claim 1, wherein the
electrically conductive cover further comprises a top portion and a
side portion, the side portion surrounds and is connected to the
top portion, and the at least one second hole is disposed on the
side portion.
3. The MEMS microphone package according to claim 1, wherein the
electrically conductive cover further comprises a top portion, a
side portion and a brim portion, the side portion surrounds and is
connected to the top portion, the brim portion surrounds and is
connected to the side portion, the at least one second hole is
disposed on the brim portion.
4. The MEMS microphone package according to claim 1, wherein the
electrically conductive cover further comprises a top portion, a
side portion and a brim portion, the side portion surrounds and is
connected to the top portion, the brim portion surrounds and is
connected to the side portion, a boundary of the at least one
second hole extends from the brim portion to the side portion.
5. The MEMS microphone package according to claim 2, wherein a
boundary of the first hole is disposed on the upper surface, and
the first hole is not in contact with the side surface and the
bottom surface to form a blind hole.
6. The MEMS microphone package according to claim 2, wherein a
boundary of the first hole is disposed on the upper surface and the
bottom surface, and the first hole is not in contact with the side
surface to form a through hole extending through the upper surface
and the bottom surface.
7. The MEMS microphone package according to claim 2, wherein a
boundary of the first hole is disposed on the upper surface and the
side surface, and the first hole is not in contact with the bottom
surface to form a peripheral blind hole.
8. The MEMS microphone package according to claim 2, wherein a
boundary of the first hole is disposed on the upper surface, the
bottom surface and the side surface to form a through hole on
edge.
9. The MEMS microphone package according to claim 8, wherein the
substrate further comprises at least one third electrically
conductive layer, the at least one third electrically conductive
layer is disposed on a surface of the first hole, and the at least
one third electrically conductive layer is connected to the at
least one first electrically conductive layer and the at least one
second electrically conductive layer.
10. The MEMS microphone package according to claim 9, wherein the
electrically conductive cover is electrically coupled to the at
least one first electrically conductive layer, the at least one
second electrically conductive layer is electrically coupled to a
fourth electrically conductive layer such that the electrically
conductive cover forms a shield for preventing electromagnetic
interference.
11. The MEMS microphone package according to claim 3, wherein a
boundary of the first hole is disposed on the upper surface, and
the first hole is not contact with the side surface and the bottom
surface to form a blind hole.
12. The MEMS microphone package according to claim 3, wherein a
boundary of the first hole is disposed on the upper surface and the
bottom surface, and the first hole is not in contact with the side
surface to form a through hole extending through the upper surface
and the bottom surface.
13. The MEMS microphone package according to claim 3, wherein a
boundary of the first hole is disposed on the upper surface and the
side surface, and the first hole is not in contact with the bottom
surface to form a peripheral blind hole.
14. The MEMS microphone package according to claim 3, wherein a
boundary of the first hole is disposed on the upper surface, the
bottom surface and the side surface to form a through hole on
edge.
15. The MEMS microphone package according to claim 14, wherein the
substrate further comprises at least one third electrically
conductive layer, the at least one third electrically conductive
layer is disposed on a surface of the first hole, the at least one
third electrically conductive layer is connected to the at least
one first electrically conductive layer and the at least one second
electrically conductive layer.
16. The MEMS microphone package according to claim 15, wherein the
electrically conductive cover is electrically coupled to the at
least one first electrically conductive layer, the at least one
second electrically conductive layer is electrically coupled to a
fourth electrically conductive layer outside the MEMS microphone
package such that the electrically conductive cover forms a shield
for preventing electromagnetic interference.
17. The MEMS microphone package according to claim 4, wherein a
boundary of the first hole is disposed on the upper surface, and
the first hole is not in contact with the side surface and the
bottom surface to form a blind hole.
18. The MEMS microphone package according to claim 4, wherein a
boundary of the first hole is disposed on the upper surface and the
bottom surface, and the first hole is not in contact with the side
surface to form a through hole extending through the upper surface
and the bottom surface.
19. The MEMS microphone package according to claim 4, wherein a
boundary of the first hole is disposed on the upper surface and the
side surface, and the first hole is not in contact with the bottom
surface to form a peripheral blind hole.
20. The MEMS microphone package according to claim 4, wherein a
boundary of the first hole is disposed on the upper surface, the
bottom surface and the side surface to form a through hole on
edge.
21. The MEMS microphone package according to claim 20, wherein the
substrate further comprises at least one third electrically
conductive layer, the at least one third electrically conductive
layer is disposed on a surface of the first hole, the at least one
third electrically conductive layer is connected to the at least
one first electrically conductive layer and the at least one second
electrically conductive layer.
22. The MEMS microphone package according to claim 21, wherein the
electrically conductive cover is electrically coupled to the at
least one first electrically conductive layer, the at least one
second electrically conductive layer is electrically coupled to a
fourth electrically conductive layer outside of the MEMS microphone
package such that the electrically conductive cover forms a shield
for preventing electromagnetic interference.
23. The MEMS microphone package according to claim 1, further
comprising at least one third electrically conductive layer
disposed on at least one surface of the at least one first hole,
the at least one third electrically conductive layer being
electrically coupled to the electrically conductive cover, and the
at least one third electrically conductive layer being electrically
coupled to an electrical ground layer such that the electrically
conductive cover and the at least one third electrically conductive
layer forms a shield for preventing electromagnetic
interference.
24. A microelectromechanical system (MEMS) microphone package,
comprising: a substrate, comprising: at least one first hole; an
upper surface; a bottom surface; a side surface with two sides
connected to the upper surface and the bottom surface,
respectively, and the two sides being opposite to each other; at
least one first electrically conductive layer disposed on the upper
surface; and at least one second electrically conductive layer
disposed on the bottom surface; at least one MEMS microphone
electrically coupled to the substrate; at least one IC chip
electrically coupled to the substrate; and an electrically
conductive cover comprising at least one second hole; wherein the
electrically conductive cover is bonded to the substrate to form a
chamber for accommodating the MEMS microphone and the IC chip, the
at least one first hole and the at least one second hole together
form at least one acoustic hole, the at least one acoustic hole has
an opening on an outer surface of the MEMS microphone package, the
opening has a first boundary and a second boundary, the first
boundary of the opening is a part of a boundary of the at least one
first hole and is disposed on the upper surface, the second
boundary of the opening is a part of a boundary of the at least one
second hole, and the part of the boundary of the at least one first
hole and the part of the boundary of the at least one second hole
is not on a same plane.
25. The MEMS microphone package according to claim 24, wherein the
first hole is not in contact with the side surface and the bottom
surface to form a blind hole.
26. The MEMS microphone package according to claim 24, wherein
another part of the boundary of the first hole is disposed on the
bottom surface, and the first hole is not in contact with the side
surface to form a through hole extending through the upper surface
and the bottom surface.
27. The MEMS microphone package according to claim 24, wherein
another part of the boundary of the first hole is disposed on the
side surface, and the first hole is not in contact with the bottom
surface to form a peripheral blind hole.
28. The MEMS microphone package according to claim 24, wherein
another part of boundary of the first hole is disposed on the
bottom surface and the side surface to form a through hole on
edge.
29. The MEMS microphone package according to claim 28, wherein the
substrate further comprises at least one third electrically
conductive layer, the at least one third electrically conductive
layer is disposed on a surface of the first hole, and the at least
one third electrically conductive layer is connected to the at
least one first electrically conductive layer and the at least one
second electrically conductive layer.
30. The MEMS microphone package according to claim 29, wherein the
electrically conductive cover is electrically coupled to the at
least one first electrically conductive layer, the at least one
second electrically conductive layer is electrically coupled to a
fourth electrically conductive layer outside the MEMS microphone
package such that the electrically conductive cover forms a shield
for preventing electromagnetic interference.
31. The MEMS microphone package according to claim 24, further
comprising at least one third electrically conductive layer
disposed on at least one surface of the at least one first hole,
the at least one third electrically conductive layer is
electrically coupled to the electrically conductive cover, and the
at least one third electrically conductive layer is electrically
coupled to an electrical ground layer such that the electrically
conductive cover and the at least one third electrically conductive
layer together form a shield for preventing electromagnetic
interference.
32. A microelectromechanical system (MEMS) microphone package,
comprising: a substrate, comprising: at least one first hole; an
upper surface; a bottom surface; a side surface with two sides
connected to the upper surface and the bottom surface,
respectively, wherein the two sides are opposite to each other; at
least one first electrically conductive layer disposed on the upper
surface; at least one second electrically conductive layer disposed
on the bottom surface; and at least one third electrically
conductive layer; at least one MEMS microphone electrically coupled
to the substrate; at least one IC chip electrically coupled to the
substrate; and an electrically conductive cover comprising at least
one second hole; wherein the electrically conductive cover is
bonded to the substrate to form a chamber for accommodating the
MEMS microphone and the IC chip, the at least one first hole and
the at least one second hole together form at least one acoustic
hole, the at least one acoustic hole has an opening on an outer
surface of the MEMS microphone package, the opening has a first
boundary and a second boundary, the first boundary of the opening
is a part of a boundary of the at least one first hole, the second
boundary of the opening is a part of a boundary of the at least one
second hole, the at least one third electrically conductive layer
is disposed on at least one surface of the first hole, the at least
one third electrically conductive layer is electrically coupled to
the electrically conductive cover, and the at least one third
electrically conductive layer is electrically coupled to an
electrical ground layer such that the electrically conductive cover
and the at least one third electrically conductive layer form a
shield for preventing electromagnetic interference.
33. The MEMS microphone package according to claim 32, wherein the
electrically conductive cover further comprises a top portion and a
side portion, the side portion surrounds and is connected to the
top portion, and the at least one second hole is disposed on the
side portion.
34. The MEMS microphone package according to claim 32, wherein the
electrically conductive cover further comprises a top portion, a
side portion and a brim portion, the side portion surrounds and is
connected to the top portion, the brim portion surrounds and is
connected to the side portion, and the at least one second hole is
disposed on the brim portion.
35. The MEMS microphone package according to claim 34, wherein a
boundary of the at least one second hole extends from the brim
portion to the side portion.
36. The MEMS microphone package according to claim 32, wherein the
electrically conductive cover is connected to the at least one
first electrically conductive layer, the at least one first
electrically conductive layer is connected to the at least one
third electrically conductive layer, the at least one third
electrically conductive layer is connected to the at least one
second electrically conductive layer, the at least one second
electrically conductive layer is connected to a fourth electrically
conductive layer outside the MEMS microphone package such that the
electrically conductive cover and the at least one third
electrically conductive layer together form a shield for preventing
electromagnetic interference.
37. The MEMS microphone package according to claim 1, wherein the
opening of the at least one acoustic hole further has a third
boundary connected to the first boundary and the second boundary,
and the third boundary of the opening is a part of a boundary of
the first electrically conductive layer.
38. The MEMS microphone package according to claim 24, wherein the
opening of the at least one acoustic hole further has a third
boundary connected to the first boundary and the second boundary,
and the third boundary of the opening is a part of a boundary of
the first electrically conductive layer.
39. The MEMS microphone package according to claim 32, wherein the
opening of the at least one acoustic hole further has a third
boundary connected to the first boundary and the second boundary,
and the third boundary of the opening is a part of a boundary of
the first electrically conductive layer.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This non-provisional application claims priority under 35
U.S.C. .sctn.119(a) on Patent Application No(s). 103142466 filed in
Taiwan, R.O.C. on Dec. 5, 2014, the entire contents of which are
hereby incorporated by reference.
TECHNICAL FIELD
[0002] The disclosure relates to an MEMS microphone package.
BACKGROUND
[0003] In recent years, handsets, e.g. smartphones, have adopted
more than one microelectromechanical system (MEMS) microphone
sensors inside for eliminating background noises during
communication, and therefore the demand of the MEMS microphone
packages are increased rapidly. So far, there are only few major
suppliers of the MEMS microphone in the global market, and these
MEMS microphone sensors are one of the most important products in
the MEMS markets in the future.
[0004] Generally speaking, the package of the MEMS microphone
comprises a substrate, an MEMS microphone, an integrated circuit
(IC) chip and a cover. Both the MEMS microphone and the IC chip are
electrically coupled to the substrate, and the cover is disposed on
the substrate. Thus, the MEMS microphone and the IC chip are
disposed within a chamber formed by the substrate and the
cover.
[0005] Since current electronic products have been developed to be
miniaturized, the thickness of the MEMS microphone package is also
reduced accordingly. Therefore, manufacturers try to develop the
MEMS microphone packages with not only better sound quality but
also smaller thickness.
SUMMARY
[0006] An aspect of the disclosure provides an MEMS microphone
package, comprising a substrate, at least one MEMS microphone, at
least one IC chip and an electrically conductive cover. The
substrate comprises at least one first hole, an upper surface, a
bottom surface, a side surface, at least one first electrically
conductive layer and at least one second electrically conductive
layer. The side surface has two sides connected to the upper
surface and the bottom surface, respectively, and the two sides are
opposite to each other. The at least one first electrically
conductive layer is disposed on the upper surface. The at least one
second electrically conductive layer is disposed on the bottom
surface. The at least one MEMS microphone is electrically coupled
to the substrate. The at least one IC chip is electrically coupled
to the substrate. The electrically conductive cover comprises at
least one second hole. The electrically conductive cover is bonded
to the substrate to form a chamber for accommodating the MEMS
microphone and the IC chip. The at least one first hole and the at
least one second hole together form at least one acoustic hole.
[0007] Another aspect of the disclosure provides an MEMS microphone
package, comprising a substrate, at least one MEMS microphone, at
least one IC chip and an electrically conductive cover. The
substrate comprises at least one first hole, an upper surface, a
bottom surface, a side surface, at least one first electrically
conductive layer and at least one second electrically conductive
layer. The side surface has two sides connected to the upper
surface and the bottom surface, respectively, and the two sides are
opposite to each other. The at least one first electrically
conductive layer is disposed on the upper surface. The at least one
second electrically conductive layer is disposed on the bottom
surface. The at least one MEMS microphone is electrically coupled
to the substrate. The at least one IC chip is electrically coupled
to the substrate. The electrically conductive cover comprises at
least one second hole. The electrically conductive cover is bonded
to the substrate to form a chamber for accommodating the MEMS
microphone and the IC chip, the at least one first hole and the at
least one second hole together form at least one acoustic hole, and
one part of a boundary of the at least one first hole is disposed
on the upper surface and is not on a same plane with one part of a
boundary of the at least one second hole.
[0008] Yet another aspect of the disclosure provides an MEMS
microphone package, comprising a substrate, at least one MEMS
microphone, at least one IC chip and an electrically conductive
cover. The substrate comprises at least one first hole, an upper
surface, a bottom surface, a side surface, at least one first
electrically conductive layer, at least one second electrically
conductive layer and at least one third electrically conductive
layer. The side surface has two sides connected to the upper
surface and the bottom surface, respectively, and the two sides are
opposite to each other. The at least one first electrically
conductive layer is disposed on the upper surface. The at least one
second electrically conductive layer is disposed on the bottom
surface. The at least one MEMS microphone electrically is coupled
to the substrate. The at least one IC chip is electrically coupled
to the substrate. The electrically conductive cover comprises at
least one second hole. The electrically conductive cover is bonded
to the substrate to form a chamber for accommodating the MEMS
microphone and the IC chip, and the at least one first hole and the
at least one second hole together form at least one acoustic hole.
The at least one third electrically conductive layer is disposed on
at least one surface of the first hole, the at least one third
electrically conductive layer is electrically coupled to the
electrically conductive cover, and the at least one third
electrically conductive layer is electrically coupled to an
electrical ground layer such that the electrically conductive cover
and the at least one third electrically conductive layer together
form a shield for preventing electromagnetic interference.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The present disclosure will become more fully understood
from the detailed description given hereinbelow and the
accompanying drawings which are given by way of illustration only
and thus are not limitative of the present disclosure and
wherein:
[0010] FIG. 1A is a schematic perspective view of an MEMS
microphone package according to a first embodiment of the
disclosure;
[0011] FIG. 1B is a top view of FIG. 1A;
[0012] FIG. 1C is a cross-sectional view of the MEMS microphone
package of FIG. 1A disposed on a printed circuit board;
[0013] FIG. 1D is a schematic perspective view of an MEMS
microphone package according to a second embodiment of the
disclosure;
[0014] FIG. 2A is a schematic perspective view of an electrically
conductive cover of FIG. 1A;
[0015] FIG. 2B is a schematic perspective view of an electrically
conductive cover according to the second embodiment of the
disclosure;
[0016] FIG. 2C is a schematic perspective view of an electrically
conductive cover according to a third embodiment of the
disclosure;
[0017] FIG. 3A is a schematic perspective view of a substrate of
FIG. 1A;
[0018] FIG. 3B is a schematic perspective view of a substrate
according to a fourth embodiment of the disclosure;
[0019] FIG. 3C is a schematic perspective view of a substrate
according to a fifth embodiment of the disclosure;
[0020] FIG. 3D is a schematic perspective view of a substrate
according to a sixth embodiment of the disclosure;
[0021] FIG. 4A is a schematic perspective view of an MEMS
microphone package according to a seventh embodiment of the
disclosure;
[0022] FIG. 4B is an exploded view of FIG. 4A;
[0023] FIG. 4C is an exploded view of an MEMS microphone package
according to an eighth embodiment of the disclosure;
[0024] FIG. 5 is a schematic perspective view of an MEMS microphone
package according to a ninth embodiment of the disclosure;
[0025] FIG. 6 is a schematic perspective view of an MEMS microphone
package according to a tenth embodiment of the disclosure; and
[0026] FIG. 7 is a schematic perspective view of an MEMS microphone
package according to an eleventh embodiment of the disclosure.
DETAILED DESCRIPTION
[0027] In the following detailed description, for purposes of
explanation, numerous specific details are set forth in order to
provide a thorough understanding of the disclosed embodiments. It
will be apparent, however, that one or more embodiments may be
practiced without these specific details. In other instances,
well-known structures and devices are schematically shown in order
to simplify the drawing.
[0028] In the following embodiments of the disclosure, boundaries
of first holes 111a, 111b, 111c, 111d of substrates 11a, 11b, 11c,
11d are formed by connecting the sidelines (i.e., segments) on
surfaces of the substrates. In other words, the ranges of the first
holes are enclosed by the sidelines of the surfaces of the
substrates (i.e., thick lines in FIG. 3A through FIG. 3D).
Similarly, boundaries of second holes 141a, 141b, 141c of
electrically conductive covers 14a, 14b, 14c are formed by
connecting the sidelines of electrically conductive covers 14a,
14b, 14c. That is, the ranges of the second holes are enclosed by
sidelines of the electrically conductive cover (i.e., thick lines
in FIG. 2A through FIG. 2C).
[0029] Please refer to FIG. 1A through FIG. 1C, FIG. 1A is a
schematic perspective view of an MEMS microphone package according
to a first embodiment of the disclosure, FIG. 1B is a top view of
FIG. 1A, and FIG. 1C is a cross-sectional view of the MEMS
microphone package of FIG. 1A disposed on a printed circuit board.
In this embodiment, the MEMS microphone package 1a comprises a
substrate 11a, an MEMS microphone 12, at least one IC chip 13 and
an electrically conductive cover 14a.
[0030] The substrate 11a comprises at least one first hole 111a and
a surface 1111a which is one of the surfaces of the first hole
111a. The MEMS microphone 12 is electrically coupled to the
substrate 11a. However, the embodiment of the disclosure is not
limited to the quantity of the MEMS microphone 12. In other
embodiments, the quantity of the MEMS microphones 12 is more than
one.
[0031] In this embodiment, the IC chip 13 is electrically coupled
to the substrate 11a. The quantity of the IC chip 13 is, but not
limited to, one. In other embodiments, for example, the quantity of
the IC chips 13 is more than one.
[0032] The electrically conductive cover 14a comprises at least one
second hole 141a. The electrically conductive cover 14a is bonded
to the substrate 11a to form a chamber 15 for accommodating the
MEMS microphone 12 and the IC chip 13. The first hole 111a and the
second hole 141a form an acoustic hole 16a together. It is shown in
FIG. 1A that one part of the boundary of the first hole 111a and
one part of the boundary of the second hole 141a are not formed on
a same plane. In details, the part of the boundary of the first
hole 111a and the part of the boundary of the second hole 141a are
disposed on different planes of different objects (i.e., on the
electrically conductive cover 14a and the surface of the substrate
11a), respectively. Also, the plane of the electrically conductive
cover 14a on which the second hole 141a is disposed is not parallel
to the surface of the substrate 11a on which the first hole 111a is
disposed. In addition, the acoustic hole 16a formed by the first
hole 111a and the second hole 141a communicates with the chamber 15
such that the MEMS microphone 12 within the chamber 15 is capable
of receiving external acoustic waves generated outside the MEMS
microphone package 1a. In addition, the quantity of the acoustic
hole 16a in this embodiment is one, and the acoustic hole 16a is
disposed on a side of the MEMS microphone package 1a. Thus, the
MEMS microphone package 1a has enhanced directional function when
receiving sound.
[0033] Please refer to FIG. 1A through FIG. 1D, which is a
schematic perspective view of an MEMS microphone package according
to an embodiment of the disclosure. In the above-mentioned first
embodiment, the quantity of the acoustic hole 16a of the MEMS
microphone package 1a is one, but the disclosure is not limited to
the quantity of the acoustic hole. Referring to FIG. 1D, in this
embodiment, the quantity of the acoustic holes 16a is two. The
acoustic holes 16a of the MEMS microphone package 1a are located at
two different sides of the MEMS microphone package 1a. Thus, the
MEMS microphone package 1a has enhanced directional function when
receiving acoustic waves along two different directions.
[0034] Furthermore, the quantity of the MEMS microphone 12 can be
adjusted with respect to that of the acoustic hole 16a. In this
embodiment, the quantity of the acoustic holes 16a is two, and the
quantity of the MEMS microphone 12 can be one or two. When the
quantity of the MEMS microphones 12 is two, the MEMS microphones 12
can be disposed in proximity to the acoustic holes 16a,
respectively. Thus, the function of sound receiving of the MEMS
microphones 12 is enhanced.
[0035] The configuration of the electrically conductive cover 14a
in FIG. 1A is described as follows with FIG. 2A, which is a
schematic perspective view of an electrically conductive cover of
FIG. 1A.
[0036] As shown in FIG. 2A, the electrically conductive cover 14a
comprises a top portion 142a, a side portion and a brim portion
144a. The side portion 143a surrounds and is connected to the top
portion 142a such that the top portion 142a and the side portion
143a forms a space 145a. The brim portion 144a surrounds and is
connected to the side portion 143a. The second hole 141a extends
from an exterior of the brim portion 144a toward the side portion
143a. In other words, a boundary of the second hole 141a is
disposed on the brim portion 144a and the side portion 143a.
[0037] It is noted that the above-mentioned configuration of the
electrically conductive cover 14a (i.e., the electrically
conductive cover 14a comprising the top portion 142a, the side
portion 143a and the brim portion 144a, and the second hole 141a
being disposed on the brim portion 144a and the side portion 143a)
shown in FIG. 2A is one of the embodiments of the disclosure.
Shapes of the electrically conductive covers 14a and locations of
the second holes 141a can be adjusted herein without departing from
the spirit and the scope of the disclosure. For example, Please
refer to FIG. 2B and FIG. 2C, FIG. 2B is a schematic perspective
view of an electrically conductive cover according to the second
embodiment of the disclosure, and FIG. 2C is a schematic
perspective view of an electrically conductive cover according to a
third embodiment of the disclosure. The differences between the
first through the third embodiments are that: the electrically
conductive cover in the first embodiment is shown in FIG. 2A; the
electrically conductive cover in the second embodiment is shown in
FIG. 2B; the electrically conductive cover in the third embodiment
is shown in FIG. 2C.
[0038] In the second embodiment, as shown in FIG. 2B, the
electrically conductive cover 14b also comprises a top portion
142b, a side portion 143b and a brim portion 144b. The second hole
141b extends from an exterior of the brim portion 144b toward a
side edge of the side portion 143b. In other words, the boundary of
the second hole 141b is only disposed on the brim portion 144b.
[0039] In the third embodiment, as shown in FIG. 2C, the
electrically conductive cover 14c does not comprise the brim
portion 144b above mentioned in FIG. 2B. That is to say, the
electrically conductive cover 14c only comprises a top portion 142c
and a side portion 143c. Moreover, the second hole 141c extends
inward from an exterior of the side portion 143c and is separated
from the top portion 142c by a constant distance. In other words,
the boundary of the second hole 141c is only disposed on the side
portion 143c.
[0040] The configuration of the substrate 11a of FIG. 1A according
to the first embodiment is described as follows with FIG. 3A. As
shown in FIG. 1A, FIG. 1C and FIG. 3A, the substrate 11a further
comprises an upper surface 112a, a bottom surface 113a, a side
surface 114a, a first electrically conductive layer 115a, a second
electrically conductive layer 116a and a third electrically
conductive layer 117a. The upper surface 112a and the bottom
surface 113a are connected to two sides of the side surface 114a
that are opposite to each other. The first hole 111a is formed
inward from the side surface 114a of the substrate 11a and extends
through the upper surface 112a and the bottom surface 113a of the
substrate 11a. In other words, side edges L1-L8 of the surface
1111a of the first hole 111a are connected to the upper surface
112a, the bottom surface 113a and the side surface 114a,
respectively (i.e., the side edges L1-L3 are connected to the upper
surface 112a, the side edges L4-L5 are connected to the side
surface 114a, the side edges L6-L8 are connected to the bottom
surface 113a). Hence, the boundary of the first hole 111a are
disposed on the upper surface 112a, the bottom surface 113a and the
side surface 114a such that the first hole 111a is formed to be a
through hole on edge (namely, a peripheral through hole). In this
embodiment, the cross-section of the first hole 111a parallel to
the upper surface 112a is, but not limited to, rectangular. In
other embodiments, for example, the cross-section of the first hole
111a parallel to the upper surface 112a is semicircle or other
shapes that extends through the side edges.
[0041] The first electrically conductive layer 115a is disposed on
the upper surface 112a. The second electrically conductive layer
116a is disposed on the bottom surface 113a. The third electrically
conductive layer 117a is disposed on a surface 1111a of the first
hole 111a. Also, two sides of the third electrically conductive
layer 117a are connected to the first electrically conductive layer
115a and the second electrically conductive layer 116a to form an
electrical interconnection.
[0042] As shown in FIG. 1A and FIG. 1C, the electrically conductive
cover 14a is electrically coupled to the first electrically
conductive layer 115a, and the second electrically conductive layer
116a is electrically coupled to one of electrically conductive pads
182 on a printed circuit board 18 outside the MEMS microphone
package 1a. The electrically conductive pad 182 is electrically
coupled to a fourth electrically conductive layer 181 inside the
printed circuit board 18. Since the electrically conductive cover
14a is electrically coupled to the fourth electrically conductive
layer 181 in the printed circuit board 18 outside the MEMS
microphone package 1a via the first electrically conductive layer
115, the second electrically conductive layer 116a and the third
electrically conductive layer 117a, the function of electrical
ground can be achieved, which allows the electrically conductive
cover 14a being capable of preventing the electromagnetic
interference.
[0043] In this embodiment, the fourth electrically conductive layer
181, which is used for electrical grounding, is separated from the
substrate 11a, i.e., a separation design. That is, in this
embodiment, the substrate 11a does not comprise the fourth
electrically conductive layer 181 therein. In other words, the
substrate 11a only comprises two electrically conducting layers
disposed on the upper surface 112a and the bottom surface 113a of
the substrate 11a, respectively, which further reduces material
cost and fabrication cost of the substrate 11a.
[0044] Moreover, as shown in FIG. 1A and FIG. 3A, since the first
hole 111a comprises the third electrically conductive layer 117a on
its surface 1111a, the first hole 111a not only is capable of
receiving sounds but also has a function of electrical via. Thus,
the quantity of the via on the substrate 11a can be reduced to one
such that the total area of the substrate 11a is further
reduced.
[0045] In addition, since the acoustic hole 16a of the MEMS
microphone package 1a in this embodiment is formed by both the
first hole 111a of the substrate 11a and the second hole 141a of
the electrically conductive cover 14a, the MEMS microphone package
1a is not only having better quality of sound receiving but also
having thinner package profile. Traditionally, when the acoustic
hole 16a is only disposed on the substrate 11a with thinner package
profile, the dimension of the acoustic hole 16a is reduced
according to the thinner substrate. The smaller dimension of the
acoustic hole 16a decreases the quality of sound receiving of the
MEMS microphone 12. Accordingly, when the thickness of the MEMS
microphone package 1a is reduced and the acoustic hole 16a is only
disposed on the substrate 11a, the quality of sound receiving of
the MEMS microphone 12 has to be sacrificed. However, in
embodiments of this disclosure, the acoustic hole 16a is formed by
both the first hole 111a of the substrate 11a and the second hole
141a of the electrically conductive cover 14a. Thus, when the
thickness of the MEMS microphone package 1a is designed to be
reduced, the dimension of the acoustic hole 16a is originally
maintained rather than being reduced according to the thinned
substrate 11a. In short, the MEMS microphone package 1a not only
maintains the quality of sound receiving but also has the thinner
profile of package.
[0046] It is noted that the first hole 111a of the substrate 11a
shown in FIG. 3A forms a through hole on edge, but it is only one
of the embodiments of the disclosure. Types of the first hole 111a
can be adjusted herein without departing from the spirit and the
scope of the disclosure. For example, referring to FIG. 3B through
FIG. 3D, FIG. 3B is a schematic perspective view of a substrate
according to a fourth embodiment of the disclosure, FIG. 3C is a
schematic perspective view of a substrate according to a fifth
embodiment of the disclosure, and FIG. 3D is a schematic
perspective view of a substrate according to a sixth embodiment of
the disclosure. The differences between the first embodiments and
the other embodiments mentioned above are described as follows.
[0047] The difference between the fourth embodiment (as shown in
FIG. 3B) and the first embodiment (as shown in FIG. 3A) is that:
the first hole 111b of the substrate 11b in the fourth embodiment
is also formed (i.e., recessed) toward the side surface 114b of the
substrate 11b, but the first hole 111b only extends through the
upper surface 112b of the substrate 11b without extending through
the bottom surface 113b of the substrate 11b. Thus, the first hole
111b forms a peripheral blind hole. In this embodiment, the
cross-section of the first hole 111b parallel to the upper surface
112a is, but not limited to, rectangular. In other embodiments, for
example, the cross-section of the first hole 111b parallel to the
upper surface 112a is semicircle or other shapes. It is noted that
the peripheral blind hole can also be formed by attaching a thin
film to the bottom of the through hole to form the peripheral blind
hole.
[0048] Moreover, in this embodiment, the first hole 111b forms a
peripheral blind hole, and this blind hole only extends through the
upper surface 112b of the substrate 11b without extending through
the bottom surface 113b of the substrate 11b. In this embodiment,
the first electrically conductive layer 115b and the second
electrically conductive layer 116b are disposed on the upper
surface 112b and the bottom surface 113b, respectively, and the
first electrically conductive layer 115b can be electrically
coupled to the second electrically conductive layer 116b via an
electrical via (not shown) on the substrate.
[0049] The difference between the fifth embodiment (as shown in
FIG. 3C) and the first embodiment (as shown in FIG. 3A) is that: in
the fifth embodiment, the first hole 111c of the substrate 11c is
not in contact with the side surface 114c and the bottom surface
113c of the substrate 11c, and the first hole 111c only extends
through the upper surface 112c of the substrate 11c. That is to
say, the boundary of the first hole 111c is only disposed on the
upper surface 112c of the substrate 11c, and therefore the first
hole 111c forms a blind hole.
[0050] It is noted that, the first hole 111c forms a blind hole
that only extends through the upper surface 112c of the substrate
11c. In this embodiment, the first electrically conductive layer
115c and the second electrically conductive layer 116c are disposed
on the upper surface 112c and the bottom surface 113c,
respectively. The first electrically conductive layer 115c and the
second electrically conductive layer 116c can be electrically
coupled to each other via an electrical via (not shown) on the
substrate.
[0051] The difference between the sixth embodiment (as shown in
FIG. 3D) and the first embodiment (as shown in FIG. 3A) is that: in
the sixth embodiment, the first hole 111d of the substrate 11d
extends through both the upper surface 112d and the bottom surface
113d of the substrate 11d, but the first hole 111d is not in
contact with the side surface 114d of the substrate 11d. That is to
say, the boundary of the first hole 111d is disposed on both the
upper surface 112d and the bottom surface 113d of the substrate
11d, and therefore the first hole 111d forms a through hole that
extends through the upper surface 112d and the bottom surface 113d
of the substrate 11d. The substrate 11d in this embodiment is
similar to the substrate 11a shown in FIG. 3A, the first
electrically conductive layer 115d, the second electrically
conductive layer 116d and the third electrically conductive layer
117d are disposed on the upper surface 112d, the bottom surface
113d and the surface of the first hole 111d, respectively. It is
noted that a thin film (not shown) can be attached to the bottom of
the first hole 111d (as shown in FIG. 3D) to form the blind hole
together.
[0052] According to the above-mentioned description, the
electrically conductive covers 14a-14c have three different kinds
of embodiments shown in FIG. 2A through FIG. 2C, and the substrates
11a-11d have four different embodiments shown in FIG. 3A through
FIG. 3D. Accordingly, the MEMS microphone package in this
disclosure can combine one kind of the electrically conductive
covers 14a-14c among FIG. 2A through FIG. 2C with one kind of the
substrate 11a-11d shown in FIG. 3A through FIG. 3D. Consequently,
the MEMS microphone package of the disclosure has at least twelve
different kinds of embodiments.
[0053] The following introduces four of the foregoing twelve
embodiments. Please refer to FIG. 4A through FIG. 7. A schematic
perspective view of an MEMS microphone package according to a
seventh embodiment of the disclosure is shown in FIG. 4A and an
exploded view of the MEMS microphone package in FIG. 4A is shown in
FIG. 4B. An exploded view of an MEMS microphone package according
to an eighth embodiment of the disclosure is shown in FIG. 4C. In
FIG. 5, a schematic perspective view of an MEMS microphone package
according to a ninth embodiment of the disclosure is shown. In FIG.
6 a schematic perspective view of an MEMS microphone package
according to a tenth embodiment of the disclosure is shown, and in
FIG. 7, a schematic perspective view of an MEMS microphone package
according to an eleventh embodiment of the disclosure is shown.
[0054] As shown in FIG. 4A and FIG. 4B, the MEMS microphone package
1b in the seventh embodiment is selected from the electrically
conductive cover 14b shown in FIG. 2B and the substrate 11c shown
in FIG. 3C. In this embodiment, the acoustic hole 16b of the MEMS
microphone package 1b is formed by the second hole 141b disposed on
the brim portion 144b and the first hole 111c which is a blind
hole.
[0055] The MEMS microphone package 1b in this embodiment comprises
a substrate 11c and an electrically conductive cover 14b. An MEMS
microphone (not shown) and at least one IC chip (not shown) are
disposed between the substrate 11c and the electrically conductive
cover 14b, which is similar to the embodiment shown in FIG. 1.
[0056] The substrate 11c comprises at least one first hole 111c.
The first hole 111c of the substrate 11c is not in contact with the
side surface 114c and the bottom surface 113c of the substrate 11c,
and the first hole 111c only extends through the upper surface 112c
of the substrate 11c. In other words, the boundary of the first
hole 111c is only disposed on the upper surface 112c of the
substrate 11c, such that the first hole 111c forms a blind
hole.
[0057] The electrically conductive cover 14b comprises a top
portion 142b, a side portion 143b, a brim portion 144b and a second
hole 141b. The second hole 141b extends inward from an exterior of
the brim portion 144b towards a side edge 147b of the side portion
143b. In other words, the boundary of the second hole 141b in this
embodiment is only disposed on the brim portion 144b. The
electrically conductive cover 14b is bonded to the substrate 11c to
form a chamber 15b for accommodating the MEMS microphone (not
shown) and the IC chip (not shown). Also, the first hole 111c and
the second hole 141b form an acoustic hole 16b. The acoustic hole
16b communicates with the chamber 15 such that the MEMS microphone
within the chamber 15b is capable of receiving acoustic waves
outside the MEMS microphone package 1b. In addition, the quantity
of the acoustic hole 16b in this embodiment is one, and the
acoustic hole 16b is located at one side of the MEMS microphone
package 1b to enhance the directional function.
[0058] As shown in FIG. 4C, the MEMS microphone package 1b in the
eighth embodiment of the disclosure is selected form the
electrically conductive cover 14b shown in FIG. 2B and the
substrate 11c shown in FIG. 3C, which is the same as the MEMS
microphone package 1b of the seventh embodiment shown in FIG. 4B.
The difference between the seventh and eighth embodiments is that
the MEMS microphone package 1b in the eighth embodiment shown in
FIG. 4C further comprises a third electrically conductive layer
117c. The third electrically conductive layer 117c is disposed on
the surface 1111c of the first hole 111c. The surface 1111c of the
first hole 111c comprises a side surface 11111c and a bottom
surface 11112c. The third electrically conductive layer 117c can be
electrically coupled to the electrically conductive cover 14b
through the first electrically conductive layer 115c, and the third
electrically conductive layer 117c is electrically coupled to an
electrical ground layer. For example, the electrical ground layer
is the fourth electrically conductive layer 181 shown in FIG. 1C or
an electrical conductive layer (not shown) inside the substrate
11c. Thus, the electrically conductive cover 14b and the third
electrically conductive layer 117c form a shield together to
prevent the electromagnetic interference. In other embodiments (not
shown), the third electrically conductive layer 117c is disposed on
all of the side surface 11111c and the bottom surface 11112c of the
first hole 111c such that the electrically conductive cover 14b and
the third electrically conductive layer 117c form a shield together
so as to prevent the MEMS microphone 12 and the IC chip 13 of the
MEMS microphone package 1b from the electromagnetic interference.
Specifically, the third electrically conductive layer 117c in this
embodiment enhances the whole protection of the MEMS microphone
package 1b against the electromagnetic interference.
[0059] As shown in FIG. 5, the MEMS microphone package 1c in the
ninth embodiment is selected from the electrically conductive cover
14a shown in FIG. 2A and the substrate 11c shown in FIG. 3C. In
this embodiment, the acoustic hole 16c of the MEMS microphone
package 1c is formed by the second hole 141a and the first hole
111c. In this embodiment, it is noted that the boundary of second
hole 141a is disposed on both the side portion 143a and the brim
portion 144a and the first hole 111c is a blind hole. In this
embodiment, one part of the boundary of the at least one first hole
111c is not coplanar with one part of the boundary of the at least
one second hole 141a. Specifically, the part of the boundary of the
at least one first hole 111c and the part of the boundary of the at
least one second hole 141a are formed on different planes of
different objects (a plane of the electrically conductive cover 14a
and a plane of the substrate 11a), respectively. Also, the plane of
the electrically conductive cover 14a on which the second hole 141a
is disposed and the plane of the substrate 11a on which the first
hole 111c is disposed are not parallel to each other.
[0060] As shown in FIG. 6, the MEMS microphone package 1d in the
tenth embodiment is selected from the electrically conductive cover
14a shown in FIG. 2A and the substrate 11b shown in FIG. 3B. In
this embodiment, the acoustic hole 16d of the MEMS microphone
package 1d is formed by the second hole 141a and the first hole
111b. In this embodiment, the boundary of second hole 141a is
disposed on both the side portion 143a and the brim portion. 144a
and the first hole 111b is a peripheral blind hole. In this
embodiment, one part of the boundary of the at least one first hole
111b is not coplanar with one part of the boundary of the at least
one second hole 141a. Specifically, the part of the boundary of the
at least one first hole 111b and the part of the boundary of the at
least one second hole 141a are formed on a plane of the
electrically conductive cover 14a and a plane of the substrate 11b,
respectively. In detail, the part of the boundary of the at least
one first hole 111b and the part of the boundary of the at least
one second hole 141a are formed on different surfaces of different
objects, respectively
[0061] As shown in FIG. 7, the MEMS microphone package 1e of the
eleventh embodiment is selected from the electrically conductive
cover 14b shown in FIG. 2B and the substrate 11b shown in FIG. 3B.
In this embodiment, the acoustic hole 16e of the MEMS microphone
package 1e is formed by the second hole 141b and the first hole
111b. In this embodiment, the boundary of the second hole 141b is
disposed only on the brim portion 144b and the first hole 111b is a
peripheral blind hole. In this embodiment, one part of the boundary
of the at least one first hole 111b is not coplanar with one part
of the boundary of the at least one second hole 141b. Specifically,
the part of the boundary of the at least one first hole 111b and
the part of the boundary of the at least one second hole 141b are
formed on a plane of the electrically conductive cover 14b and a
plane of the substrate 11b, respectively. In detail, the part of
the boundary of the at least one first hole 111b and the part of
the boundary of the at least one second hole 141b are formed on
different surfaces of different objects, respectively.
[0062] In the current technology, acoustic holes of MEMS microphone
packages are disposed on the substrate or the cover. In other
words, in the current technology, the boundaries of the acoustic
holes of the MEMS microphone package are on the same plane. When
the MEMS microphone package is assembled in a portable electronic
device (not shown), such as cellular phones or tablet computers,
the acoustic hole of the MEMS microphone package needs to face a
sound inlet disposed on a surface of a casing of the portable
electronic device so as to enhance its quality of sound receiving.
Moreover, in the current technology, when the acoustic hole of the
MEMS microphone package needs to face another sound inlet disposed
on another surface of the casing of the portable electronic device,
the position of the MEMS microphone package in the portable
electronic device needs to be changed. Thus, it is harder for the
current MEMS microphone package to face different sound inlets
disposed on different surfaces of a casing of the portable
electronic device without changing the position of the MEMS
microphone package, which means it diminishes the flexibility of
the MEMS microphone package assembly.
[0063] However, in the MEMS microphone package according to the
embodiments of the disclosure (as shown in FIG. 1A and FIG. 5
through FIG. 7), when the boundary of the first hole of the
substrate is disposed on the upper surface of the substrate (as
shown in FIG. 3A through FIG. 3D) and the boundary of the second
hole of the electrically conductive cover are disposed on the
different planes, the MEMS microphone package (as shown in FIG. 1A
and FIG. 5 through FIG. 7) has more flexibility of the MEMS
microphone package assembly. Specifically, when the MEMS microphone
package (as shown in FIG. 1A and FIG. 5 through FIG. 7) is
assembled in the portable electronic device, the MEMS microphone
package (as shown in FIG. 1A and FIG. 5 through FIG. 7) can adopt a
gasket to make one part of the acoustic holes (e.g., the first hole
on the upper surface of the substrate) of the MEMS microphone
package (as shown in FIG. 1A) faces a sound inlet on a surface of
the casing of the portable electronic device. Moreover, under the
condition that the assembly position of the MEMS microphone package
in the portable electronic device is not changed, another gasket
can be adopted to make another part of acoustic holes (e.g., the
second hole on the electrically conductive cover) of the MEMS
microphone package to face another sound inlet on another surface
of the casing of the portable electronic device. Hence, due to the
non-coplanar boundary of the acoustic holes of the MEMS microphone
package according to the embodiments of the disclosure, the
flexibility of the MEMS microphone package assembly in the portable
electronic device is increased.
[0064] To sum up, in the MEMS microphone package according to the
embodiments of the disclosure, the acoustic hole of the MEMS
microphone package is formed by both the first hole of the
substrate and the second hole of the electrically conductive cover.
That is, both the quality of directional sound receiving and the
low profile of the MEMS microphone package can be maintained
without considering the limitation of thickness of the
substrate.
* * * * *