loadpatents
Patent applications and USPTO patent grants for Ho; Tzong-Che.The latest application filed is for "mems microphone package".
Patent | Date |
---|---|
MEMS microphone package Grant 9,369,788 - Ho , et al. June 14, 2 | 2016-06-14 |
Mems Microphone Package App 20160165358 - HO; Tzong-Che ;   et al. | 2016-06-09 |
Organic packaging carrier Grant 9,343,651 - Chen , et al. May 17, 2 | 2016-05-17 |
MEMS acoustic transducer and method for fabricating the same Grant 9,236,275 - Yeh , et al. January 12, 2 | 2016-01-12 |
Structure and fabrication method of a sensing device Grant 9,133,018 - Chen , et al. September 15, 2 | 2015-09-15 |
Sensing device and manufacturing method thereof Grant 8,763,457 - Chen , et al. July 1, 2 | 2014-07-01 |
Capacitive transducer and fabrication method Grant 8,693,711 - Ho , et al. April 8, 2 | 2014-04-08 |
Ultra thin package for electric acoustic sensor chip of micro electro mechanical system Grant 8,508,022 - Ho , et al. August 13, 2 | 2013-08-13 |
Mems Acoustic Transducer And Method For Fabricating The Same App 20130140655 - YEH; Chien-Nan ;   et al. | 2013-06-06 |
Vacuum hermetic organic packaging carrier Grant 8,421,216 - Chen , et al. April 16, 2 | 2013-04-16 |
Sensing Device And Manufacturing Method Thereof App 20120260747 - Chen; Lung-Tai ;   et al. | 2012-10-18 |
Organic Packaging Carrier App 20120241938 - Chen; Lung-Tai ;   et al. | 2012-09-27 |
LED lamp Grant RE43,626 - Tain , et al. September 4, 2 | 2012-09-04 |
Microphone Package Structure And Method For Fabricating The Same App 20120146163 - Ho; Tzong-Che ;   et al. | 2012-06-14 |
Vacuum Hermetic Organic Packaging Carrier App 20110297434 - Chen; Lung-Tai ;   et al. | 2011-12-08 |
Vacuum hermetic organic packaging carrier and sensor device package Grant 7,973,454 - Chen , et al. July 5, 2 | 2011-07-05 |
Self-aligned wafer or chip structure, and self-aligned stacked structure Grant 7,969,016 - Chen , et al. June 28, 2 | 2011-06-28 |
Capacitive Transducer And Fabrication Method App 20110150261 - HO; Tzong-Che ;   et al. | 2011-06-23 |
Wafer level sensing package and manufacturing process thereof Grant 7,915,065 - Chen , et al. March 29, 2 | 2011-03-29 |
Structure And Fabrication Method Of A Sensing Device App 20110018075 - Chen; Lung-Tai ;   et al. | 2011-01-27 |
Ultra Thin Package For Electric Acoustic Sensor Chip Of Micro Electro Mechanical System App 20090161901 - Ho; Tzong-Che ;   et al. | 2009-06-25 |
Wafer level sensing package and manufacturing process thereof App 20090121299 - Chen; Lung-Tai ;   et al. | 2009-05-14 |
Wafer Level Sensing Package And Manufacturing Process Thereof App 20090124074 - Chen; Lung-Tai ;   et al. | 2009-05-14 |
Self-aligned Wafer Or Chip Structure, Self-aligned Stacked Structure And Methods For Fabircating The Same App 20080315433 - Chen; Jung-Tai ;   et al. | 2008-12-25 |
Image stabilization driving device App 20080284860 - Wu; Wen-I ;   et al. | 2008-11-20 |
Urine Detection System And Method App 20080278337 - Huang; Tsun-Che ;   et al. | 2008-11-13 |
LED lamp Grant 7,413,326 - Tain , et al. August 19, 2 | 2008-08-19 |
Side structure of a bare LED and backlight module thereof Grant 7,375,384 - Tain , et al. May 20, 2 | 2008-05-20 |
Diaper App 20080074274 - Hu; Ying-Chiang ;   et al. | 2008-03-27 |
LED lamp Grant 7,314,291 - Tain , et al. January 1, 2 | 2008-01-01 |
Led Lamp App 20070297178 - Tain; Ra-Min ;   et al. | 2007-12-27 |
Side structure of a bare LED and backlight module thereof Grant 7,312,478 - Tain , et al. December 25, 2 | 2007-12-25 |
Side structure of a bare LED and backlight module thereof App 20070205427 - Tain; Ra-Min ;   et al. | 2007-09-06 |
3-D stackable semiconductor package Grant 7,119,429 - Chang , et al. October 10, 2 | 2006-10-10 |
Side structure of a bare LED and backlight module thereof App 20060027827 - Tain; Ra-Min ;   et al. | 2006-02-09 |
3-D stackable semiconductor package App 20060027908 - Chang; Shu-Ming ;   et al. | 2006-02-09 |
LED lamp App 20060001384 - Tain; Ra-Min ;   et al. | 2006-01-05 |
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