loadpatents
name:-0.026226997375488
name:-0.021626949310303
name:-0.00060796737670898
Ho; Tzong-Che Patent Filings

Ho; Tzong-Che

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ho; Tzong-Che.The latest application filed is for "mems microphone package".

Company Profile
0.23.20
  • Ho; Tzong-Che - Hsinchu TW
  • HO; Tzong-Che - Hsinchu City TW
  • Ho; Tzong-Che - Tainan TW
  • HO; Tzong-Che - Tainan City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
MEMS microphone package
Grant 9,369,788 - Ho , et al. June 14, 2
2016-06-14
Mems Microphone Package
App 20160165358 - HO; Tzong-Che ;   et al.
2016-06-09
Organic packaging carrier
Grant 9,343,651 - Chen , et al. May 17, 2
2016-05-17
MEMS acoustic transducer and method for fabricating the same
Grant 9,236,275 - Yeh , et al. January 12, 2
2016-01-12
Structure and fabrication method of a sensing device
Grant 9,133,018 - Chen , et al. September 15, 2
2015-09-15
Sensing device and manufacturing method thereof
Grant 8,763,457 - Chen , et al. July 1, 2
2014-07-01
Capacitive transducer and fabrication method
Grant 8,693,711 - Ho , et al. April 8, 2
2014-04-08
Ultra thin package for electric acoustic sensor chip of micro electro mechanical system
Grant 8,508,022 - Ho , et al. August 13, 2
2013-08-13
Mems Acoustic Transducer And Method For Fabricating The Same
App 20130140655 - YEH; Chien-Nan ;   et al.
2013-06-06
Vacuum hermetic organic packaging carrier
Grant 8,421,216 - Chen , et al. April 16, 2
2013-04-16
Sensing Device And Manufacturing Method Thereof
App 20120260747 - Chen; Lung-Tai ;   et al.
2012-10-18
Organic Packaging Carrier
App 20120241938 - Chen; Lung-Tai ;   et al.
2012-09-27
LED lamp
Grant RE43,626 - Tain , et al. September 4, 2
2012-09-04
Microphone Package Structure And Method For Fabricating The Same
App 20120146163 - Ho; Tzong-Che ;   et al.
2012-06-14
Vacuum Hermetic Organic Packaging Carrier
App 20110297434 - Chen; Lung-Tai ;   et al.
2011-12-08
Vacuum hermetic organic packaging carrier and sensor device package
Grant 7,973,454 - Chen , et al. July 5, 2
2011-07-05
Self-aligned wafer or chip structure, and self-aligned stacked structure
Grant 7,969,016 - Chen , et al. June 28, 2
2011-06-28
Capacitive Transducer And Fabrication Method
App 20110150261 - HO; Tzong-Che ;   et al.
2011-06-23
Wafer level sensing package and manufacturing process thereof
Grant 7,915,065 - Chen , et al. March 29, 2
2011-03-29
Structure And Fabrication Method Of A Sensing Device
App 20110018075 - Chen; Lung-Tai ;   et al.
2011-01-27
Ultra Thin Package For Electric Acoustic Sensor Chip Of Micro Electro Mechanical System
App 20090161901 - Ho; Tzong-Che ;   et al.
2009-06-25
Wafer level sensing package and manufacturing process thereof
App 20090121299 - Chen; Lung-Tai ;   et al.
2009-05-14
Wafer Level Sensing Package And Manufacturing Process Thereof
App 20090124074 - Chen; Lung-Tai ;   et al.
2009-05-14
Self-aligned Wafer Or Chip Structure, Self-aligned Stacked Structure And Methods For Fabircating The Same
App 20080315433 - Chen; Jung-Tai ;   et al.
2008-12-25
Image stabilization driving device
App 20080284860 - Wu; Wen-I ;   et al.
2008-11-20
Urine Detection System And Method
App 20080278337 - Huang; Tsun-Che ;   et al.
2008-11-13
LED lamp
Grant 7,413,326 - Tain , et al. August 19, 2
2008-08-19
Side structure of a bare LED and backlight module thereof
Grant 7,375,384 - Tain , et al. May 20, 2
2008-05-20
Diaper
App 20080074274 - Hu; Ying-Chiang ;   et al.
2008-03-27
LED lamp
Grant 7,314,291 - Tain , et al. January 1, 2
2008-01-01
Led Lamp
App 20070297178 - Tain; Ra-Min ;   et al.
2007-12-27
Side structure of a bare LED and backlight module thereof
Grant 7,312,478 - Tain , et al. December 25, 2
2007-12-25
Side structure of a bare LED and backlight module thereof
App 20070205427 - Tain; Ra-Min ;   et al.
2007-09-06
3-D stackable semiconductor package
Grant 7,119,429 - Chang , et al. October 10, 2
2006-10-10
Side structure of a bare LED and backlight module thereof
App 20060027827 - Tain; Ra-Min ;   et al.
2006-02-09
3-D stackable semiconductor package
App 20060027908 - Chang; Shu-Ming ;   et al.
2006-02-09
LED lamp
App 20060001384 - Tain; Ra-Min ;   et al.
2006-01-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed