U.S. patent application number 14/824559 was filed with the patent office on 2016-06-02 for tapering couplers for connecting fluid flow components.
The applicant listed for this patent is INTERNATIONAL BUSINESS MACHINES CORPORATION. Invention is credited to Amilcar R. ARVELO, Michael J. ELLSWORTH, Jr., Eric J. McKEEVER.
Application Number | 20160153595 14/824559 |
Document ID | / |
Family ID | 56078931 |
Filed Date | 2016-06-02 |
United States Patent
Application |
20160153595 |
Kind Code |
A1 |
ARVELO; Amilcar R. ; et
al. |
June 2, 2016 |
TAPERING COUPLERS FOR CONNECTING FLUID FLOW COMPONENTS
Abstract
Tapering couplers and coupling methods for connecting fluid flow
components are provided. In one embodiment, the tapering coupler
includes a housing with a first opening and a second opening in
fluid communication through the housing. The first opening is sized
for a first fluid flow component to couple to the housing, and the
second opening for a second fluid flow component. The first and
second fluid flow components include first and second
fluid-carrying channels of different diameter, with the first
fluid-carrying channel having a first channel diameter that is
larger than the second channel diameter of the second
fluid-carrying channel. A tapering element is associated with the
housing and extends into the first fluid-carrying channel. The
tapering element includes a tapering fluid-carrying channel which
tapers in a direction back towards the housing, for instance, from
about the first channel diameter to about the second channel
diameter.
Inventors: |
ARVELO; Amilcar R.;
(Poughkeepsie, NY) ; ELLSWORTH, Jr.; Michael J.;
(Poughkeepsie, NY) ; McKEEVER; Eric J.;
(Poughkeepsie, NY) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
Armonk |
NY |
US |
|
|
Family ID: |
56078931 |
Appl. No.: |
14/824559 |
Filed: |
August 12, 2015 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
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14482147 |
Sep 10, 2014 |
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14824559 |
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Current U.S.
Class: |
285/332 |
Current CPC
Class: |
F16L 21/002 20130101;
H05K 7/20272 20130101; F15D 1/00 20130101; H05K 7/20772 20130101;
F16L 55/027 20130101; F16L 25/14 20130101 |
International
Class: |
F16L 25/14 20060101
F16L025/14; F16L 21/00 20060101 F16L021/00 |
Goverment Interests
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT
[0001] This invention was made with Government support under
Contract No. H98230-13-D-0122 awarded by the United States
Department of Defense. Accordingly, the U.S. Government has certain
rights to this invention.
Claims
1. A method comprising: providing a tapering coupler configured to
couple a first fluid flow component and a second fluid flow
component, the providing of the tapering coupler comprising:
providing a housing with a first opening and a second opening in
fluid communication through the housing, the first opening being
sized for the first fluid flow component to couple to the housing,
and the second opening being sized for the second fluid flow
component to couple to the housing, the first fluid flow component
and the second fluid flow component comprising a first
fluid-carrying channel and a second fluid-carrying channel,
respectively, the first fluid-carrying channel having a first
channel diameter and the second fluid-carrying channel having a
second channel diameter, wherein the first channel diameter is
larger than the second channel diameter; and providing a tapering
element associated with the housing and configured to extend into
the first fluid-carrying channel of the first fluid flow component
when the first fluid flow component is coupled to the housing, with
the first fluid-carrying channel of the first fluid flow component
and the first opening of the housing in fluid communication, the
tapering element comprising a tapering fluid-carrying channel which
tapers in a direction back towards the housing from about the first
channel diameter to about the second channel diameter.
2. The method of claim 1, wherein the tapering fluid-carrying
channel of the tapering element uniformly tapers from about the
first channel diameter to the second channel diameter at a taper
angle .theta..
3. The method of claim 2, wherein the taper angle .theta. is in a
range of a 1-10 degrees.
4. The method of claim 3, wherein the taper angle .theta. is about
5 degrees.
5. The method of claim 2, wherein the tapering fluid-carrying
channel of the tapering element tapers, at least in part, within
the first fluid-carrying channel of the first fluid flow component
when the first fluid flow component is operatively coupled to the
housing, with the first fluid-carrying channel of the first fluid
flow component and the first opening of the housing in fluid
communication.
6. The method of claim 1, wherein the tapering element is formed
integral with the housing, such that the tapering element is part
of the housing, and wherein the first opening is within the
tapering element.
7. The method of claim 6, wherein the housing further comprises a
recess surrounding the tapering element, the recess being
configured to receive an end of the first fluid flow component, to
facilitate coupling the first fluid flow component to the housing
with the tapering element residing, at least in part, within the
first fluid-carrying channel of the first fluid flow component.
8. The method of claim 7, wherein the tapering element extends from
a first side of the housing, and wherein the second opening is
disposed at a second side of the housing, the first side and the
second side of the housing being opposite sides of the housing.
9. The method of claim 1, wherein the tapering element is a
tapering insert element distinct from, and secured to, the
housing.
10. The method of claim 9, wherein the second opening is configured
to receive an end of the second fluid flow component therein, the
end of the second fluid flow component contacting the tapering
insert element within the housing and facilitating securing the
tapering insert element in place within the housing.
11. The method of claim 1, wherein the first fluid flow component
comprises a fluid conduit, and the second fluid flow component
comprises a fitting configured to couple the fluid conduit to a
fluid manifold.
12. The method of claim 1, wherein the tapering fluid-carrying
channel of the tapering element tapers, at least in part, within
the first fluid-carrying channel of the first fluid flow component
when the first fluid flow component is operatively coupled to the
housing, with the first fluid-carrying channel of the first fluid
flow component and the first opening of the housing in fluid
communication.
13. The method of claim 1, wherein the tapering fluid-carrying
channel of the tapering element includes a taper angle .theta.
which is in a range of 1-10.degree., and wherein the tapering
fluid-carrying channel of the tapering element tapers, at least in
part, within the first fluid-carrying channel of the first fluid
flow component when the first fluid flow compartment is
operationally coupled to the housing, with the first fluid-carrying
channel of the first fluid flow component and the first opening of
the housing in fluid communication.
Description
BACKGROUND
[0002] Connectors for hollow, fluid-carrying conduits or tubes have
been realized in a great variety of types and shapes. These
connectors include threaded fittings, push-fit connectors, flange
and/or hinge-based fittings, as well as barb fittings.
[0003] In certain applications, connectors are desired for coupling
conduits to other structures, such as other conduits, or to a
fitting, manifold, etc. In one embodiment, it may be desirable to
connect a conduit to a manifold of, for instance, a liquid-cooled
assembly configured to facilitate providing cooling to at least one
electronic component of an electronics rack, that is, to facilitate
removal of heat generated by the electronic component(s).
[0004] Additionally, in certain applications, connectors are
desired for coupling differently-sized fluid flow components.
Conventional techniques for configuring connectors to couple and
transition between fluid flow components with different internal
flow diameters typically require additional space in order to
facilitate the transition. This can be a disadvantage where space
is limited, such as is the case of a fluid-cooled assembly for an
electronics rack.
BRIEF SUMMARY
[0005] The shortcomings of the prior art are overcome and
additional advantages are provided through, in one aspect, the
provision of a method which includes: providing a tapering coupler
configured to couple a first fluid flow component and a second
fluid flow component. The providing the tapering coupler includes:
providing a housing with a first opening and a second opening in
fluid communication through the housing, the first opening being
sized for the first fluid flow component to couple to the housing,
and the second fluid opening being sized for the second fluid flow
component to couple to the housing, the first fluid flow component
and the second fluid flow component comprising a first
fluid-carrying channel and a second fluid-carrying channel,
respectively, the first fluid-carrying channel having a first
channel diameter and the second fluid-carrying channel having a
second channel diameter, wherein the first channel diameter is
larger than the second channel diameter; and providing a tapering
element associated with the housing and configured to extend into
the first fluid-carrying channel of the first fluid flow component
when the first fluid flow component is coupled to the housing, with
the first fluid-carrying channel of the first fluid flow component
and the first opening of the housing in fluid communication, the
tapering element comprising a tapering fluid-carrying channel which
tapers in a direction back towards the housing, from about the
first channel diameter to about the second channel diameter.
[0006] Additional features and advantages are realized through the
techniques of the present invention. Other embodiments and aspects
of the invention are described in detail herein and are considered
a part of the claimed invention.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0007] One or more aspects of the present invention are
particularly pointed out and distinctly claimed as examples in the
claims at the conclusion of the specification. The foregoing and
other objects, features, and advantages of the invention are
apparent from the following detailed description taken in
conjunction with the accompanying drawings in which:
[0008] FIG. 1 depicts one embodiment of a conventional raised floor
layout of an air-cooled data center;
[0009] FIG. 2 is a front elevational view of one embodiment of an
at least partially coolant-cooled electronics rack comprising
multiple electronic subsystems and a cooling apparatus to use one
or more tapering couplers, in accordance with one or more aspects
of the present invention;
[0010] FIG. 3 is a schematic of one embodiment of an electronics
rack, wherein an electronic module (or component) is coolant-cooled
by system coolant (provided by one or more coolant conditioning
units disposed within the electronics rack) passing through a
coolant-cooled structure coupled to the electronic module, and
within which one or more tapering couplers may be employed, in
accordance with one or more aspects of the present invention;
[0011] FIG. 4 is a schematic of one embodiment of a coolant
conditioning unit disposed within a coolant-cooled electronics rack
such as depicted in FIGS. 2 & 3, in accordance with one or more
aspects of the present invention;
[0012] FIG. 5 is a plan view of one embodiment of an electronic
subsystem layout illustrating a hybrid cooling system for cooling
components of the electronic subsystem, and which may employ one or
more tapering couplers, in accordance with one or more aspects of
the present invention;
[0013] FIG. 6 depicts one detailed embodiment of a
partially-assembled electronic subsystem layout, wherein the
electronic subsystem includes, by way of example, eight
heat-generating electronic components to be actively cooled, each
having a respective coolant-cooled structure of a coolant-based
cooling system coupled thereto and within which one or more
tapering couplers may be employed, in accordance with one or more
aspects of the present invention;
[0014] FIG. 7A depicts one embodiment of an apparatus comprising a
fluid conduit, fitting and tapering coupler, to be modified in
accordance with one or more aspects of the present invention;
[0015] FIG. 7B is an exploded depiction of the apparatus of FIG.
7A;
[0016] FIG. 7C is a cross-sectional elevational view of the
apparatus of FIG. 7A, taken along line 7C-7C thereof;
[0017] FIG. 8A is a schematic of a fluid conduit transitioning from
a first fluid flow diameter to a second fluid flow diameter;
[0018] FIG. 8B is a graph of loss coefficient versus angle of taper
when transitioning between differently-sized fluid flow diameters,
with both contracting and expanding loss coefficients plotted;
[0019] FIG. 9A depicts one embodiment of an apparatus comprising a
fluid conduit, a fitting, and a tapering coupler, in accordance
with one or more aspects of the present invention;
[0020] FIG. 9B is an exploded depiction of the apparatus of FIG.
9A, in accordance with one or more aspects of the present
invention;
[0021] FIG. 9C is a cross-sectional elevational view of the
apparatus of FIG. 9A, taken along line 9C-9C thereof, in accordance
with one or more aspects of the present invention;
[0022] FIG. 10A depicts another embodiment of an apparatus
comprising a fluid conduit, a fitting, and a tapering coupler, in
accordance with one or more aspects of the present invention;
[0023] FIG. 10B is an exploded depiction of the apparatus of FIG.
10A, in accordance with one or more aspects of the present
invention; and
[0024] FIG. 10C is a cross-sectional elevational view of the
apparatus of FIG. 10A, taken along line 10C-10C thereof, in
accordance with one or more aspects of the present invention.
DETAILED DESCRIPTION
[0025] Disclosed hereinbelow are various tapering couplers for
coupling fluid flow components with different internal fluid flow
diameters. For instance, the tapering couplers may facilitate
coupling of a fluid conduit (or tube) to a connector fitting for a
liquid manifold or liquid-manifold assembly. The tapering couplers
disclosed may be provided for a variety of fluid assemblies. By way
of example only, various cooling assemblies with fluid manifolds
are described hereinbelow with reference to FIGS. 2-6, where the
fluid manifold may be integrated as part of a coolant-cooled
electronic module node, or rack, or be detachably coupled to a
coolant-cooled electronic module, node or rack, to facilitate flow
of coolant through the assembly to remove heat generated within the
module, node or rack. Those skilled in the art will understand,
however, that the tapering couplers disclosed may be used with
various types of liquid flow assemblies, for instance, where any
two fluid flow components with different internal liquid flow
diameters are to be joined. Advantageously, the tapering couplers
described hereinbelow with reference to FIGS. 7A-10C reduce or even
minimize pressure drop between fluid flow components of a
fluid-carrying assembly having different cross-sectional flow
diameters, eliminating recirculation effects resulting from the
coupling. Additionally, the tapering couplers presented minimize
space required by providing transition between the fluid flow
components (at least in part) within the fluid flow component with
the larger internal flow diameter, and provide transition between
different-diameter flow components without limiting conduit
diameter for transitioning from a larger to smaller conduit. Note
that, as used herein, "tapering coupler" refers to any coupling,
adapter connector, etc., configured to join two or more fluid flow
components, and which includes a tapering fluid-carrying
channel.
[0026] Further, as used herein, the terms "electronics rack", and
"rack-mounted electronic equipment" are used interchangeably, and
unless otherwise specified include any housing, frame, rack,
compartment, blade server system, etc., having one or more
heat-generating components of a computer system or electronics
system, and may be, for example, a stand-alone computer processor
having high, mid or low end processing capability. In one
embodiment, an electronics rack may comprise one or more electronic
subsystems. "Electronic subsystem" refers to any sub-housing,
blade, book, drawer, node, compartment, etc., of (for example) an
electronics rack having one or more heat-generating electronic
components disposed therein or thereon. An electronic subsystem of
an electronics rack may be movable or fixed relative to the
electronics rack, with the rack-mounted electronics drawers of a
multi-drawer rack unit and blades of a blade center system being
two examples of subsystems of an electronics rack to be cooled. In
one specific example, "electronic subsystem" refers to an
electronic system which comprises multiple different types of
electronic components, and may be, in one example, a server node of
a multi-server rack.
[0027] "Electronic component" refers to any heat-generating
electronic component of, for example, a computer system or other
electronics unit requiring cooling. By way of example, an
electronic component may comprise one or more integrated circuit
dies and/or other electronic devices to be cooled, including one or
more processor dies, memory dies and memory support dies. As a
further example, an electronic component may comprise one or more
bare dies or one or more packaged dies disposed on a common
carrier. As used herein, "primary heat-generating component" refers
to a primary heat-generating electronic component within an
electronic subsystem, while "secondary heat-generating component"
refers to an electronic component of the electronic subsystem
generating less heat than the primary heat-generating component to
be cooled. Further, unless otherwise specified herein, the terms
"coolant-cooled structure" or "coolant-cooled cold plate" refer to
a thermally conductive structure having one or more channels or
passageways formed therein or thereon for flowing of coolant
therethrough. In addition, "metallurgically bonded" refers
generally herein to two components being welded, brazed or soldered
together by any means.
[0028] As used herein, a "liquid-to-liquid heat exchanger" may
comprise, for example, two or more coolant flow paths, formed of
thermally conductive tubing (such as copper or other tubing) in
thermal or mechanical contact with each other. Size, configuration
and construction of the liquid-to-liquid heat exchanger can vary
without departing from the scope of the invention disclosed herein.
Further, "data center" refers to a computer installation containing
one or more electronics racks to be cooled. As a specific example,
a data center may include one or more rows of rack-mounted
computing units, such as server units.
[0029] One example of a coolant (for example, the facility or
system coolants discussed below) is water. However, the concepts
disclosed herein are readily adapted to use with other types of
coolant. For example, one or more of the coolants may comprise a
glycol mixture, a brine, a fluorocarbon liquid, a liquid metal, or
other similar coolant, or refrigerant, while still maintaining the
advantages and unique features of the present invention.
[0030] Reference is made below to the drawings, which are not drawn
to scale to facilitate understanding of the invention, wherein the
same reference numbers used throughout different figures designate
the same or similar components.
[0031] FIG. 1 depicts a raised floor layout of an air cooled data
center 100 typical in the prior art, wherein multiple electronics
racks 110 are disposed in one or more rows. A data center such as
depicted in FIG. 1 may house several hundred, or even several
thousand microprocessors. In the arrangement illustrated, cool air
enters the data center via perforated floor tiles 160 from a cool
air plenum 145 defined between the raised floor 140 and a base or
sub-floor 165 of the room. Cool air is taken in through louvered
covers at air inlet sides 120 of the electronics racks and expelled
through the back (i.e., air outlet sides 130) of the electronics
racks. Each electronics rack 110 may have one or more air moving
devices (e.g., fans or blowers) to provide forced inlet-to-outlet
airflow to cool the electronic devices within the subsystem(s) of
the rack. The supply air plenum 145 provides conditioned and cooled
air to the air-inlet sides of the electronics racks via perforated
floor tiles 160 disposed in a "cold" aisle of the data center. The
conditioned and cooled air is supplied to plenum 145 by one or more
air-conditioning units 150, also disposed within the data center
100. Room air may be taken into one or more air-conditioning units
150 near the upper portions thereof. This room air may comprise, in
part, exhausted air from the "hot" aisles of the computer
installation defined, for example, by opposing air outlet sides 130
of electronics racks 110.
[0032] Due to the ever-increasing airflow requirements through
electronics racks, and the limits of air distribution within the
typical data center installation, coolant-assisted cooling is being
combined with the conventional air-cooling. FIGS. 2-6 illustrate
one embodiment of a data center implementation employing a
coolant-assisted cooling system with one or more cold plates
coupled to high heat-generating electronic components disposed
within the electronics racks.
[0033] FIG. 2 depicts one embodiment of a partially coolant-cooled
electronics rack 200. As illustrated, coolant-cooled electronics
rack 200 comprises a plurality of electronic subsystems 210, which
may be processor or server nodes. A bulk power regulator 220 is
shown disposed at an upper portion of liquid-cooled electronics
rack 200, and two coolant conditioning units (CCUs) 230 are
disposed in a lower portion of the liquid-cooled electronics rack.
In certain embodiments described hereinbelow, the coolant is
assumed to be water or an aqueous-based solution (by way of example
only).
[0034] In addition to CCUs 230, the cooling system includes a
system water supply manifold 231, a system water return manifold
232, and manifold-to-node fluid connect hoses 233 coupling system
water supply manifold 231 to electronic subsystems 210, and
node-to-manifold fluid connect hoses 234 coupling the individual
electronic subsystems 210 to system water return manifold 232. Each
CCU 230 is in fluid communication with system water supply manifold
231 via a respective system water supply hose 235, and each CCU 230
is in fluid communication with system water return manifold 232 via
a respective system water return hose 236.
[0035] As illustrated, a portion of the heat load of the electronic
subsystems is transferred from the system water to cooler facility
water supplied by facility water supply line 240 and facility water
return line 241 disposed, in the illustrated embodiment, in the
space between a raised floor 201 and a base floor 202.
[0036] FIG. 3 schematically illustrates operation of the cooling
system of FIG. 2, wherein a liquid-cooled cold plate 300 is shown
coupled to an electronic module 301 of an electronic subsystem 210
within the liquid-cooled electronics rack 200. Heat is removed from
electronic module 301 via the system coolant circulated via pump
320 through cold plate 300 within the system coolant loop defined
by liquid-to-liquid heat exchanger 321 of coolant conditioning unit
230, lines 322, 323 and cold plate 300. The system coolant loop and
coolant conditioning unit are designed to provide coolant of a
controlled temperature and pressure, as well as controlled
chemistry and cleanliness to the electronic module(s). Furthermore,
the system coolant is physically separate from the less controlled
facility coolant in lines 240, 241, to which heat is ultimately
transferred.
[0037] FIG. 4 depicts a more detailed embodiment of a coolant
conditioning unit 230. As shown in FIG. 4, coolant conditioning
unit 230 includes a first coolant loop wherein chilled, facility
coolant is supplied 410 and passes through a control valve 420
driven by a motor 425. Valve 420 determines an amount of facility
coolant to be passed through heat exchanger 321, with a portion of
the facility coolant possibly being returned directly via a bypass
orifice 435. The coolant conditioning unit further includes a
second coolant loop with a reservoir tank 440 from which system
coolant is pumped, either by pump 450 or pump 451, into the heat
exchanger 321 for conditioning and output thereof, as cooled system
coolant to the electronics rack to be cooled. The cooled system
coolant is supplied to the system water supply manifold and
returned from the system water return manifold of the liquid-cooled
electronics rack via the system water supply hose 235 and system
water return hose 236, respectively.
[0038] FIG. 5 depicts one embodiment of an electronic subsystem 513
component layout wherein one or more air moving devices 511 provide
forced air flow 515 to cool multiple components 512 within
electronic subsystem 513. Cool air is taken in through a front 531
and exhausted out a back 533 of the drawer. The multiple components
to be cooled include multiple processor modules to which
liquid-cooled cold plates 520 (of a liquid-based cooling system)
are coupled, as well as multiple arrays of memory modules 530
(e.g., dual in-line memory modules (DIMMs)) and multiple rows of
memory support modules 532 (e.g., DIMM control modules) to which
air-cooled heat sinks are coupled. In the embodiment illustrated,
memory modules 530 and the memory support modules 532 are partially
arrayed near front 531 of electronic subsystem 513, and partially
arrayed near back 533 of electronic subsystem 513. Also, in the
embodiment of FIG. 5, memory modules 530 and the memory support
modules 532 are cooled by air flow 515 across the electronic
subsystem.
[0039] The illustrated coolant-based cooling system further
includes multiple coolant-carrying tubes connected to and in fluid
communication with coolant-cooled cold plates 520. The
coolant-carrying tubes comprise sets of coolant-carrying tubes,
with each set including (for example) a coolant supply tube 540, a
bridge tube 541 and a coolant return tube 542. In this example,
each set of tubes provides coolant to a series-connected pair of
cold plates 520 (coupled to a pair of processor modules). Coolant
flows into a first cold plate of each pair via the coolant supply
tube 540 and from the first cold plate to a second cold plate of
the pair via bridge tube or line 541, which may or may not be
thermally conductive. From the second cold plate of the pair,
coolant is returned through the respective coolant return tube
542.
[0040] FIG. 6 depicts in greater detail an alternate electronics
drawer layout comprising eight processor modules, each having a
respective coolant-cooled cold plate of a coolant-based cooling
system coupled thereto. The coolant-based cooling system is shown
to further include associated coolant-carrying tubes for
facilitating passage of liquid coolant through the coolant-cooled
cold plates and a header subassembly to facilitate distribution of
coolant to and return of coolant from the coolant-cooled cold
plates. By way of specific example, the coolant passing through the
coolant-based cooling subsystem is chilled water.
[0041] As noted, various coolants significantly outperform air in
the task of removing heat from heat-generating electronic
components of an electronic system, and thereby more effectively
maintain the components at a desirable temperature for enhanced
reliability and peak performance. As coolant-based cooling systems
are designed and deployed, it is advantageous to architect systems
which maximize reliability and minimize the potential for leaks
while meeting all other mechanical, electrical and chemical
requirements of a given electronic system implementation. These
more robust cooling systems have unique problems in their assembly
and implementation. For example, one assembly solution is to
utilize multiple fittings within the electronic system, and use
flexible plastic or rubber tubing to connect headers, cold plates,
pumps and other components. In another approach, a robust
coolant-assisted cooling system may be provided, specially
preconfigured and prefabricated as a monolithic structure for
positioning within a particular electronics drawer.
[0042] FIG. 6 is an isometric view of one embodiment of an
electronics drawer and monolithic cooling system. The depicted
planar server assembly includes a multi-layer printed circuit board
to which memory DIMM sockets and various electronic components to
be cooled are attached both physically and electrically. In the
cooling system depicted, a supply header is provided to distribute
coolant from a single inlet to multiple parallel coolant flow paths
and a return header collects exhausted coolant from the multiple
parallel coolant flow paths into a single outlet. Each parallel
coolant flow path includes one or more cold plates in series flow
arrangement to cool one or more electronic components to which the
cold plates are mechanically and thermally coupled. The number of
parallel paths and the number of series-connected coolant-cooled
cold plates depends, for example on the desired device temperature,
available coolant temperature and coolant flow rate, and the total
heat load being dissipated from each electronic component.
[0043] More particularly, FIG. 6 depicts a partially assembled
electronic system 613 and an assembled coolant-based cooling system
615 coupled to primary heat-generating components (e.g., including
processor dies) to be cooled. In this embodiment, the electronics
system is configured for (or as) an electronics drawer of an
electronics rack, and includes, by way of example, a support
substrate or planar board 605, a plurality of memory module sockets
610 (with the memory modules (e.g., dual in-line memory modules)
not shown), multiple rows of memory support modules 632 (each
having coupled thereto an air-cooled heat sink 634), and multiple
processor modules (not shown) disposed below the coolant-cooled
cold plates 620 of the coolant-based cooling system 615.
[0044] In addition to coolant-cooled cold plates 620, coolant-based
cooling system 615 includes multiple coolant-carrying tubes,
including coolant supply tubes 640 and coolant return tubes 642 in
fluid communication with respective coolant-cooled cold plates 620.
The coolant-carrying tubes 640, 642 are also connected to a header
(or manifold) subassembly 650 which facilitates distribution of
coolant to the coolant supply tubes and return of coolant from the
coolant return tubes 642. In this embodiment, the air-cooled heat
sinks 634 coupled to memory support modules 632 closer to front 631
of electronics drawer 613 are shorter in height than the air-cooled
heat sinks 634' coupled to memory support modules 632 near back 633
of electronics drawer 613. This size difference is to accommodate
the coolant-carrying tubes 640, 642 since, in this embodiment, the
header subassembly 650 is at the front 631 of the electronics
drawer and the multiple liquid-cooled cold plates 620 are in the
middle of the drawer.
[0045] Coolant-based cooling system 615 comprises a pre-configured
monolithic structure which includes multiple (pre-assembled)
coolant-cooled cold plates 620 configured and disposed in spaced
relation to engage respective heat-generating electronic
components. Each coolant-cooled cold plate 620 includes, in this
embodiment, a coolant inlet and a coolant outlet, as well as an
attachment subassembly (i.e., a cold plate/load arm assembly). Each
attachment subassembly is employed to couple its respective
coolant-cooled cold plate 620 to the associated electronic
component to form the cold plate and electronic component
assemblies. Alignment openings (i.e., thru-holes) are provided on
the sides of the cold plate to receive alignment pins or
positioning dowels during the assembly process. Additionally,
connectors (or guide pins) are included within attachment the
subassembly, which facilitate use of the attachment assembly.
[0046] As shown in FIG. 6, header subassembly 650 includes two
manifolds, i.e., a coolant supply header 652 and a coolant return
header 654, which in one embodiment, are coupled together via
supporting brackets. In the monolithic cooling structure of FIG. 6,
the coolant supply header 652 is metallurgically bonded in fluid
communication to each coolant supply tube 640, while the coolant
return header 654 is metallurgically bonded in fluid communication
to each coolant return tube 642. A single coolant inlet 651 and a
single coolant outlet 653 extend from the header subassembly for
coupling to the electronics rack's coolant supply and return
manifolds (not shown).
[0047] FIG. 6 also depicts one embodiment of the pre-configured,
coolant-carrying tubes. In addition to coolant supply tubes 640 and
coolant return tubes 642, bridge tubes or lines 641 are provided
for coupling, for example, a coolant outlet of one coolant-cooled
cold plate to the coolant inlet of another coolant-cooled cold
plate to connect in series fluid flow the cold plates, with the
pair of cold plates receiving and returning coolant via a
respective set of coolant supply and return tubes. In one
embodiment, the coolant supply tubes 640, bridge tubes 641 and
coolant return tubes 642 are each pre-configured, semi-rigid tubes
formed of a thermally conductive material, such as copper or
aluminum, and the tubes are respectively brazed, soldered or welded
in a fluid-tight manner to the header subassembly and/or the
liquid-cooled cold plates. The tubes are pre-configured for a
particular electronics system to facilitate installation of the
monolithic structure in engaging relation with the electronics
system.
[0048] The above-described cooling approach of FIGS. 2-6 is an
effective solution for circulating liquid coolant through
coolant-cooled cold plates attached to heat-generating circuit
modules (or components). An example of the efficacy of this
approach is the IBM Power 575.TM. system offered by International
Business Machines Corporation, Armonk, N.Y. In the embodiment of
FIGS. 2-6, one or more coolant conditioning units containing a pump
and, for example, a water-to-water heat exchanger, may be disposed
within each electronics rack. As explained above, heat load carried
by the system coolant circulating through the coolant-cooled
components in the coolant-cooled electronics rack is rejected to
facility chilled water passing through the second coolant path
through the active water-to-water heat exchangers within the
coolant conditioning units disposed within the rack units.
[0049] The efficient extraction of heat from electronic modules,
nodes and/or racks, becomes more important as heat generated within
the modules, nodes or racks increases. Lacking an efficient heat
transfer mechanism, the speed, reliability and power capabilities
of the electronic circuit modules, nodes and rack, will be limited.
As the density of circuitry within a given space is increased, the
need for improved heat extraction becomes more important. As
explained above in connection with FIGS. 2-6, liquid-cooling
assemblies may be employed as effective cooling solutions for
removing heat generated by electronic modules, nodes or racks.
Liquid-cooling of higher-power-dissipating components is
particularly advantageous. However, significant constraints exist
on available space for fluid-cooling equipment. For instance, there
is little or no room to increase pump size or heat exchanger size
within a current electronic subsystem or rack.
[0050] Disclosed herein are apparatuses and methods, for
space-constrained systems, to reduce overall cooling system flow
impedance for improved system flow, and thus, improved thermal
performance, resulting in a more efficient heat transfer for
cooling an electronic structure, such as an electronic module, node
or rack. As one specific example, pressure drop where a coolant
flow conduit connects to a coolant manifold may be about 20% of the
total pressure drop through a coolant-carrying assembly, such as
the coolant pressure drop through a cooled electronic subsystem or
node described above.
[0051] More particularly, the apparatuses and methods of
fabrication disclosed herein include tapering couplers that
facilitate reducing or minimizing loss of energy in a fluid when
transitioning from one channel flow diameter to another channel
flow diameter, where the channel flow diameters are differently
sized. For instance, pressure drop may occur where a fluid flow
transitions from a first fluid flow component with a small
cross-sectional flow area to a second fluid flow component with a
larger cross-sectional flow area. The same issue arises when fluid
flow transitions from a larger cross-sectional flow area to a
smaller cross-sectional flow area. Note that as used herein, "fluid
flow component" or "flow component" refers generally to any
conduit, fitting, manifold, housing, structure, etc., having a
fluid-carrying channel, with the conduit-to-fitting couplers
described below with reference to FIGS. 7A-10C being one example
only of the use of the tapering couplers described herein.
[0052] FIGS. 7A-7C depict one embodiment of a connector apparatus,
such as for a cooling assembly described above in connection with
FIGS. 2-6. Connector apparatus 700 includes a coupler 710, a first
fluid flow component 720, comprising a fluid conduit with a first
fluid-carrying channel 722 having a first internal flow diameter
d.sub.1, and a second fluid flow component 730, such as a quick
connect fitting, with a second fluid-carrying channel 732 having a
second internal flow diameter d.sub.2. In this example, first
internal flow diameter d.sub.1 is larger than second internal flow
diameter d.sub.2, as illustrated in FIG. 7C. In the illustrated
example, coupler 710 includes a first opening 711 at a first side
of the coupling, and a second opening 712 at a second side of the
coupling. The openings 711, 712 are sized and configured, in this
example, to respectively receive an end portion of the first fluid
flow component 720 and second fluid flow component 730, as
shown.
[0053] By way of specific example, the first fluid flow component
720 may be a metal conduit or tube, and coupler 710 may include a
metal housing, with the metal conduit being secured to the coupler
by welding after inserting the end of the metal conduit within
opening 711 of coupler 710. Fluid flow component 730 may, in one
example, be threadably secured to coupler 710 by providing
appropriately sized and configured threads within opening 712 of
coupler 710, and on the end of component 730 engaging the
coupler.
[0054] In the embodiments of FIGS. 7A-7C, the coupler provides a
fluid-tight connection between the different fluid flow components
720, 730, but no tapered transitioning between their different
internal flow diameters d.sub.1, d.sub.2. As a solution, a gradual
transition fitting could be provided at the first side or the
second side of the coupler, which would transition from, for
instance, the larger fluid flow diameter d.sub.1 to the smaller
fluid flow diameter d.sub.2. The difficulty with this approach is
that the additional transitional fitting requires further space in
the system within which the coupling is being used, which can be a
problem when implemented in a coolant-cooled assembly for an
electronic module, node or rack, such as described above. An
alternative approach would be to employ a tube expander region,
produced using a tube expander tool, starting with a
smaller-diameter tube, and forcing the cross-section of the tube to
increase step-wise. The difficulty with this approach again is that
additional space is required for the expander region in order to
accomplish the transition between the different fluid flow
diameters. Further, there are limits to the amount an expander tool
can step-wise change a flow diameter, such that a significant
length of tube may be required in order to effect a desired
transition.
[0055] FIG. 8A illustrates a gradual transition between a first
fluid flow region 800 and a second fluid flow region 810 having
different internal fluid flow diameters, where the transition angle
is labeled .theta..
[0056] FIG. 8B plots the loss coefficient due to pressure drop at a
coupling or region, such as illustrated in FIG. 8A, transitioning
between different fluid flow diameters versus the angle of
transition (.theta.) in degrees. Both a gradual contraction case
and a gradual expansion case are plotted. In particular, in
addition to the frictional pressure loss associated with conduit
fluid flow, there are losses due to the sudden or gradual expansion
or contraction of flow from one characteristic flow diameter to
another. This loss can be characterized in terms of a loss
coefficient, K, and is related to pressure loss (drop) by:
K = .DELTA. P ( .rho. V 2 / 2 ) ##EQU00001##
Where .DELTA.P is the pressure loss (drop), .rho. is the fluid
density, and V is the mean fluid velocity entering the
transition.
[0057] If the expansion or contraction is gradual, as in a gradual
conical expansion or contraction (i.e., a diffuser), the pressure
loss can be significantly reduced. Relative to a sudden expansion
or contraction (.theta.=90.degree.), a diffuser with a gradual
expansion or contraction defined by an angle .theta.=5.degree., the
pressure loss can be reduced by 75% in the expansion case, and by
86% in the contraction case, as shown in FIG. 8B. As illustrated, a
taper angle in the range of 1-10.degree., and more particularly, in
the range of 3-7.degree., most advantageously reduces pressure drop
through a coupler connecting fluid flow components with different
characteristic flow diameters. About a 5.degree. taper angle
produces optimum reduction or minimization in the pressure drop
through the coupling. In certain implementations, the apparatuses
and methods, and in particular, tapering couplers, described herein
include tapering insert elements which embody such an optimized
taper angle.
[0058] Generally stated, disclosed herein are apparatuses and
methods which include or provide a tapering coupler that comprises
a housing and a tapering element associated with the housing. The
housing includes a first opening and a second opening in fluid
communication through the housing, with the first opening being
sized for a first fluid flow component to couple to the housing,
and the second opening being sized for a second fluid flow
component to couple to the housing. The first fluid flow component
and second fluid flow component include a first fluid-carrying
channel and a second fluid-carrying channel, respectively, with the
first fluid-carrying channel having a first channel diameter and
the second fluid-carrying channel having a second channel diameter.
The first channel diameter is larger than the second channel
diameter. Note that as used herein, the "channel diameter",
"internal flow diameter", "flow diameter", or "cross-sectional flow
area" are used interchangeably, and refer to the characteristic
diameter of a fluid flow channel through a fluid flow component.
The tapering element associated with the housing is configured to
extend into the first fluid-carrying channel of the first fluid
flow component when the first fluid flow component is coupled to
the housing, with the first fluid-carrying channel of the first
fluid flow component and the first opening of the housing in fluid
communication. The tapering element includes a tapering
fluid-carrying channel which tapers in a direction towards the
housing from about the first channel diameter to about the second
channel diameter. In one implementation, the tapering element
extends outwards from the housing, and the tapering fluid-carrying
channel of the tapering element tapers uniformly from about the
first channel diameter to the second channel diameter at a taper
angle .theta.. In certain implementations, taper angle .theta. is
within a 1-10.degree. taper range, and more particularly, in a
range of 3-7.degree.. For instance, taper angle .theta. may be
about a 5.degree. taper angle.
[0059] Note that approximating language, as used herein throughout
the specification and claims, is applied to modify any quantitative
representation that could permissibly vary without resulting in
change in the basic function to which it is related. A value
modified by a term such as "about", is not limited to a precise
value specified. For instance, tapering of the tapering
fluid-carrying channel progresses from slightly smaller than the
first channel diameter is due to the thickness of the material at
the end of the tapering element farthest from the housing. For
instance, the tapering may proceed from the first channel diameter,
less a few millimeters' thickness of the tapering element, down to
the second channel diameter.
[0060] In certain implementations, the tapering element is formed
integral with the housing to be a part of the housing, and the
first opening in the housing is disposed in the tapering element.
In one embodiment, the housing further includes a recess
surrounding the tapering insert element. The recess is configured
to receive an end of the first fluid flow component, to facilitate
coupling of the first fluid flow component to the housing, with the
tapering element extending into the first fluid-carrying channel of
the first fluid flow component. By way of example, the tapering
element may extend from a first side of the housing, and the second
opening may be disposed in a second side of the housing, where the
first and second sides of the housing are opposite sides of the
housing.
[0061] In other implementations, the tapering element may be a
tapering insert element distinct from the housing, but secured to
the housing. For instance, the tapering insert element may be
separately fabricated (for instance, of a plastic or metal) and
inserted into the housing so as to be secured within the housing.
By way of example, the tapering insert element may be inserted into
the housing through the second opening so as to project out through
the first opening in the housing. By way of example, a shoulder may
be provided within the housing, sized and configured to be engaged
by a circumferential ring or shoulder about the tapering insert
element with insertion of the tapering insert element into the
housing, through the second opening. In such a case, the tapering
insert element may be secured within the housing by threadably
inserting an end of the second fluid flow component into the second
opening of the housing, thereby securing the tapering insert
element within the housing.
[0062] In certain embodiments, the tapering element is configured
such that the tapering fluid-carrying channel of the tapering
element resides within, at least in part, the first fluid flow
component when the first fluid flow component and the housing are
coupled with the first fluid-carrying channel of the first fluid
flow component and the first opening of the housing in fluid
communication. For instance, at least a portion of the tapering
fluid-carrying channel may reside within the first fluid flow
component. In certain implementations, a portion of the tapering
fluid-carrying channel may reside within the housing, depending
upon the length required in order to achieve the gradual transition
or taper desired. Fluid-carrying assemblies and methods of
fabrication are also described below.
[0063] FIGS. 9A-9C depict one embodiment of a connector apparatus,
in accordance with one or more aspects of the present
invention.
[0064] In one implementation, the connector apparatus may be
employed for a cooling assembly, such as described above in
connection with FIGS. 2-6. Connector apparatus 900 includes a
tapering coupler 910, as well as first fluid component 720 and
second fluid flow component 730, described above in connection with
FIGS. 7A-7C. By way of example only, first fluid flow component 720
is illustrated to comprise a fluid conduit with a first
fluid-carrying channel 722 having a first internal flow diameter
d.sub.1, and second fluid flow component 730 is illustrated as a
quick connect fitting, with a second fluid-carrying channel 732
having a second internal flow diameter d.sub.2. In the example
depicted, first internal flow diameter d.sub.1 is larger than
second internal flow diameter d.sub.2, as illustrated in FIG.
9C.
[0065] As shown in FIGS. 9B & 9C, housing 910 includes a first
opening 911 and a second opening 912 (FIG. 9C) sized and configured
for first fluid flow component 720 and second fluid flow component
730, respectively. In the embodiment of FIGS. 9A-9C, first opening
911 resides within a tapering element 915, which as indicated in
FIG. 9C, is formed integral with housing 910, to be part of housing
910, and to project from one side thereof. By way of example only,
first opening 911 and second opening 912 are provided on opposite
sides of housing 910, and are in fluid communication through the
housing, as illustrated in FIG. 9C.
[0066] In one embodiment, a circumferential recess 913 may be
provided in housing 910 about a tapering element 915 to accommodate
an end of first fluid flow component 720, for instance, to
facilitate coupling and securing of the fluid flow component to
housing 910, for instance, by welding or brazing. In one
implementation, second opening 912 may include threads (not shown)
sized and configured to facilitate threaded insertion of second
fluid flow component 730 therein. One or more O-rings or gaskets
914 may be provided in association with second fluid flow component
730, and/or first fluid flow component 720 and/or housing 910, to
facilitate fluid-tight coupling of the components and housing. Use
of O-rings or gaskets may depend, in part, on the type of component
the first and second fluid flow components 720, 730 represent, and
how they are secured to housing 910. As noted, and by way of
example only, first fluid flow component 720 is depicted as a fluid
conduit, and second fluid flow component 730 is depicted as a
fitting, such as a quick connect fitting, to facilitate coupling of
the fluid conduit to, for instance, a part of a liquid manifold of
a fluid-carrying assembly, such as illustrated in FIGS. 2-6.
[0067] As illustrated in FIG. 9C, tapering element 915 includes a
tapering fluid-carrying channel 917 which tapers in a direction
back towards housing 910 from about the first channel diameter
d.sub.1, to about the second channel diameter d.sub.2. In certain
implementations, the tapering fluid-carrying channel 917 of the
tapering element 915 uniformly tapers from about the first channel
diameter d.sub.1 to about the second channel diameter at a taper
angle .theta., which is in a range of 1-10.degree., such as in a
range of about 3-7.degree., or more particularly, is approximately
a 5.degree. taper angle. By extending into the first fluid-carrying
channel 722 of first fluid flow component 720, at least a portion
of the tapering of the tapering fluid-carrying channel 917 occurs
within the first fluid flow component 720, as illustrated. Further,
by providing a circumferential recess or channel 913 in housing
910, most, if not all, of the tapering element 915 may reside
within first fluid flow component 720, as illustrated in FIG. 9C.
Note that in this embodiment, tapering element 915 is formed
integral with housing 910, for instance, may be casted or machined
as a monolithic structure from a metal or metal alloy. Depending on
the size of housing 910, and the difference between the channel
diameters to transition between, a majority of the tapering
fluid-carrying channel 917 of tapering element 915 may project out
from housing 910.
[0068] FIGS. 10A-10C depict an alternate embodiment of a connector
apparatus, generally 1000, in accordance with one or more aspects
of the present invention.
[0069] Connector apparatus 1000 includes first fluid flow component
720 and second fluid flow component 730, which, as noted above in
connection with FIGS. 7A-7C & 9A-9C, are illustrated by way of
example as a fluid conduit, and a connector fitting, respectively.
As noted, however, the first and second fluid flow components could
comprise any fluid flow components to be coupled or joined using a
tapering coupler 1010, such as described herein.
[0070] As illustrated in FIG. 10B, in this embodiment, the tapering
coupler includes housing 1010, and a separate tapering insert
element 1015, which is configured to be secured within housing 1010
so as to project from a first opening 1011 in housing 1010 at a
first side of the housing. As illustrated in FIGS. 10B & 10C,
tapering insert element 1015 may be provided with a circumferential
ring or shoulder 1016, sized to allow tapering insert element 1015
to pass into housing 1010 through a second opening 1012 therein at
the second side of housing 1010. Circumferential ring or shoulder
1016 is sized and positioned to engage an edge or stop 1014, formed
within housing 1010, in the interconnecting opening of housing
1010, between first opening 1011 and second opening 1012 thereof.
An end 731 of second flow component 730 is configured (in one
embodiment) to threadably insert into second opening 1012 of
housing 1010 and engage tapering insert element 1015 in order to
secure the tapering insert element 1015 within housing 1010.
[0071] As in the embodiment of FIGS. 9A-9C, tapering insert element
1015 projects into first fluid-carrying channel 722 of first fluid
flow component 720 when first fluid flow component 720 is
operatively coupled to housing 1010. To facilitate this coupling,
first opening 1011 in housing 1010 may be sized and configured to
accommodate first fluid flow component 720 therein, as illustrated
in FIG. 10C. By way of example, first fluid flow component 720 may
be secured to housing 1010 via, for instance, solder, in the case
where first fluid flow component 720 and housing 1010 are formed of
a metal or metal alloy.
[0072] As illustrated, tapering insert element 1015 includes a
tapering fluid-carrying channel 1017, which tapers in a direction
back towards the housing, from about the first channel diameter
d.sub.1 of first fluid-carrying channel 722 to about the second
channel diameter d.sub.2 of second fluid-carrying channel 732. As
noted above, the taper angle may be uniform through the tapering
insert element, and be, for instance, in a range of 1-10.degree.,
or more particularly, in a range of 3-7.degree.. Depending on the
implementation, and the difference between the first and second
channel diameters, a majority of the tapering insert element 1015
may reside within the first fluid flow component 720, having the
larger channel diameter, when the connector apparatus is
operatively employed as depicted in FIGS. 10A-10C.
[0073] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a," "an," and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprise" (and any form of comprise, such as
"comprises" and "comprising"), "have" (and any form of have, such
as "has" and "having"), "include" (and any form of include, such as
"includes" and "including"), and "contain" (and any form of
contain, such as "contains" and "containing") are open-ended
linking verbs. As a result, a method or device that "comprises,"
"has," "includes," or "contains" one or more steps or elements
possesses those one or more steps or elements, but is not limited
to possessing only those one or more steps or elements. Likewise, a
step of a method or an element of a device that "comprises," "has,"
"includes," or "contains" one or more features possesses those one
or more features, but is not limited to possessing only those one
or more features. Furthermore, a device or structure that is
configured in a certain way is configured in at least that way, but
may also be configured in ways that are not listed.
[0074] The corresponding structures, materials, acts, and
equivalents of all means or step plus function elements in the
claims below, if any, are intended to include any structure,
material, or act for performing the function in combination with
other claimed elements as specifically claimed. The description of
the present invention has been presented for purposes of
illustration and description, but is not intended to be exhaustive
or limited to the invention in the form disclosed. Many
modifications and variations will be apparent to those of ordinary
skill in the art without departing from the scope and spirit of the
invention. The embodiment was chosen and described in order to best
explain the principles of one or more aspects of the invention and
the practical application, and to enable others of ordinary skill
in the art to understand one or more aspects of the invention for
various embodiments with various modifications as are suited to the
particular use contemplated.
* * * * *