Arvelo; Amilcar R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Arvelo; Amilcar R..The latest application filed is for "customized module lid".

Company Profile

5.28.27

Arvelo; Amilcar R. - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Customized module lid Grant 11,270,919 - Arvelo , et al. March 8, 2	2022-03-08
Coupling assemblies for connecting fluid-carrying components Grant 10,897,835 - Arvelo , et al. January 19, 2	2021-01-19
Coupling assemblies for connecting fluid-carrying components Grant 10,897,834 - Arvelo , et al. January 19, 2	2021-01-19
Tapering couplers for connecting fluid flow components Grant 10,422,451 - Arvelo , et al. Sept	2019-09-24
Tapering couplers for connecting fluid flow components Grant 10,385,996 - Arvelo , et al. A	2019-08-20
Customized Module Lid App 20190109058 - Arvelo; Amilcar R. ; et al.	2019-04-11
Customized module lid Grant 10,163,742 - Arvelo , et al. Dec	2018-12-25
Coupling Assemblies For Connecting Fluid-carrying Components App 20180368285 - ARVELO; Amilcar R. ; et al.	2018-12-20
Coupling Assemblies For Connecting Fluid-carrying Components App 20180368286 - ARVELO; Amilcar R. ; et al.	2018-12-20
Coupling assemblies for connecting fluid-carrying components Grant 10,111,364 - Arvelo , et al. October 23, 2	2018-10-23
Coupling assemblies for connecting fluid-carrying components Grant 10,104,810 - Arvelo , et al. October 16, 2	2018-10-16
Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) Grant 10,024,606 - Arvelo , et al. July 17, 2	2018-07-17
Compute intensive module packaging Grant 9,818,667 - Arvelo , et al. November 14, 2	2017-11-14
Multi-component electronic module with integral coolant-cooling Grant 9,661,784 - Arvelo , et al. May 23, 2	2017-05-23
Selective clamping of electronics card to coolant-cooled structure Grant 9,591,787 - Arvelo , et al. March 7, 2	2017-03-07
Tapering Couplers For Connecting Fluid Flow Components App 20160363243 - ARVELO; Amilcar R. ; et al.	2016-12-15
Coupling Assemblies For Connecting Fluid-carrying Components App 20160341342 - ARVELO; Amilcar R. ; et al.	2016-11-24
Coupling Assemblies For Connecting Fluid-carrying Components App 20160345466 - ARVELO; Amilcar R. ; et al.	2016-11-24
Customized module lid Grant 9,496,194 - Arvelo , et al. November 15, 2	2016-11-15
Thermal transfer structure(s) and attachment mechanism(s) facilitating cooling of electronics card(s) Grant 9,497,888 - Arvelo , et al. November 15, 2	2016-11-15
Compute intensive module packaging Grant 9,490,188 - Arvelo , et al. November 8, 2	2016-11-08
Fabricating separable and integrated heat sinks facilitating cooling multi-component electronic assembly Grant 9,456,527 - Arvelo , et al. September 27, 2	2016-09-27
Pluggable module for heat removal device Grant 9,453,972 - Arvelo , et al. September 27, 2	2016-09-27
Customized Module Lid App 20160172259 - Arvelo; Amilcar R. ; et al.	2016-06-16
Tapering Couplers For Connecting Fluid Flow Components App 20160153595 - ARVELO; Amilcar R. ; et al.	2016-06-02
Customized Module Lid App 20160157359 - Arvelo; Amilcar R. ; et al.	2016-06-02
Thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s) Grant 9,341,418 - Arvelo , et al. May 17, 2	2016-05-17
Methods of fabricating a coolant-cooled electronic assembly Grant 9,298,231 - Arvelo , et al. March 29, 2	2016-03-29
Compute Intensive Module Packaging App 20160079140 - Arvelo; Amilcar R. ; et al.	2016-03-17
Compute Intensive Module Packaging App 20160081197 - Arvelo; Amilcar R. ; et al.	2016-03-17
Multi-component Electronic Module With Integral Coolant-cooling App 20160050790 - ARVELO; Amilcar R. ; et al.	2016-02-18
Multi-component electronic module with integral coolant-cooling Grant 9,265,176 - Arvelo , et al. February 16, 2	2016-02-16
Fabricating multi-component electronic module with integral coolant-cooling Grant 9,265,177 - Arvelo , et al. February 16, 2	2016-02-16
Thermal transfer and coolant-cooled structures facilitating cooling of electronics card(s) Grant 9,265,178 - Arvelo , et al. February 16, 2	2016-02-16
Selective clamping of electronics card to coolant-cooled structure Grant 9,258,925 - Arvelo , et al. February 9, 2	2016-02-09
Fabricating thermal transfer and coolant-cooled structures for cooling electronics card(s) Grant 9,253,923 - Arvelo , et al. February 2, 2	2016-02-02
Selective Clamping Of Electronics Card To Coolant-cooled Structure App 20150359140 - ARVELO; Amilcar R. ; et al.	2015-12-10
Separable and integrated heat sinks facilitating cooling multi-compnent electronic assembly Grant 9,210,831 - Arvelo , et al. December 8, 2	2015-12-08
Selective clamping of electronics card to coolant-cooled structure Grant 9,144,178 - Arvelo , et al. September 22, 2	2015-09-22
Fabricating Separable And Integrated Heat Sinks Facilitating Cooling Multi-component Electronic Assembly App 20150075755 - ARVELO; Amilcar R. ; et al.	2015-03-19
Selective Clamping Of Electronics Card To Coolant-cooled Structure App 20150052753 - ARVELO; Amilcar R. ; et al.	2015-02-26
Fabricating Thermal Transfer Structure With In-plane Tube Lengths And Out-of-plane Tube Bend(s) App 20150053388 - ARVELO; Amilcar R. ; et al.	2015-02-26
Fabricating Thermal Transfer And Coolant-cooled Structures For Cooling Electronics Card(s) App 20150052754 - ARVELO; Amilcar R. ; et al.	2015-02-26
Fabricating Multi-component Electronic Module With Integral Coolant-cooling App 20150055299 - ARVELO; Amilcar R. ; et al.	2015-02-26
Fabricating Thermal Transfer Structure(s) And Attachment Mechanism(s) For Cooling Electronics Card(s) App 20150047809 - ARVELO; Amilcar R. ; et al.	2015-02-19
Separable And Integrated Heat Sinks Facilitating Cooling Multi-compnent Electronic Assembly App 20140307389 - ARVELO; Amilcar R. ; et al.	2014-10-16
Multi-component Electronic Module With Integral Coolant-cooling App 20140254098 - ARVELO; Amilcar R. ; et al.	2014-09-11
Thermal Transfer Structure With In-plane Tube Lengths And Out-of-plane Tube Bend(s) App 20140246174 - ARVELO; Amilcar R. ; et al.	2014-09-04
Selective Clamping Of Electronics Card To Coolant-cooled Structure App 20140247555 - ARVELO; Amilcar R. ; et al.	2014-09-04
Thermal Transfer Structure(s) And Attachment Mechanism(s) Facilitating Cooling Of Electronics Card(s) App 20140238640 - ARVELO; Amilcar R. ; et al.	2014-08-28
Thermal Transfer And Coolant-cooled Structures Facilitating Cooling Of Electronics Card(s) App 20140240930 - ARVELO; Amilcar R. ; et al.	2014-08-28
Segmentation of a die stack for 3D packaging thermal management Grant 7,928,562 - Arvelo , et al. April 19, 2	2011-04-19
Segmentation Of A Die Stack For 3d Packaging Thermal Management App 20100019377 - Arvelo; Amilcar R. ; et al.	2010-01-28
Method and structure for cooling a dual chip module with one high power chip Grant 7,031,162 - Arvelo , et al. April 18, 2	2006-04-18
Method and structure for cooling a dual chip module with one high power chip App 20050068739 - Arvelo, Amilcar R. ; et al.	2005-03-31