U.S. patent application number 14/729030 was filed with the patent office on 2016-03-24 for retainer and wafer carrier including the same.
The applicant listed for this patent is Sang-Hyun BAE, Tae-Je CHO, Kyu-Dong JUNG, Il-Hwan KIM, Jung-Hwan KIM, Hyuek-Jae LEE. Invention is credited to Sang-Hyun BAE, Tae-Je CHO, Kyu-Dong JUNG, Il-Hwan KIM, Jung-Hwan KIM, Hyuek-Jae LEE.
Application Number | 20160082569 14/729030 |
Document ID | / |
Family ID | 55524888 |
Filed Date | 2016-03-24 |
United States Patent
Application |
20160082569 |
Kind Code |
A1 |
BAE; Sang-Hyun ; et
al. |
March 24, 2016 |
RETAINER AND WAFER CARRIER INCLUDING THE SAME
Abstract
A retainer for a wafer carrier comprising: a body including a
plurality of slots configured to receive side surfaces of wafers;
and for each of the slots, a supporting structure formed on a
sidewall of the slot and configured to make contact with the side
surfaces of a corresponding wafer, the supporting structure being
spaced apart from an upper corner of the side surface of the
corresponding wafer.
Inventors: |
BAE; Sang-Hyun; (Seoul,
KR) ; JUNG; Kyu-Dong; (Suwon-si, KR) ; KIM;
Il-Hwan; (Hwaseong-si, KR) ; KIM; Jung-Hwan;
(Bucheon-si, KR) ; LEE; Hyuek-Jae; (Hwaseong-si,
KR) ; CHO; Tae-Je; (Yongin-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
BAE; Sang-Hyun
JUNG; Kyu-Dong
KIM; Il-Hwan
KIM; Jung-Hwan
LEE; Hyuek-Jae
CHO; Tae-Je |
Seoul
Suwon-si
Hwaseong-si
Bucheon-si
Hwaseong-si
Yongin-si |
|
KR
KR
KR
KR
KR
KR |
|
|
Family ID: |
55524888 |
Appl. No.: |
14/729030 |
Filed: |
June 2, 2015 |
Current U.S.
Class: |
451/288 |
Current CPC
Class: |
B24B 37/32 20130101 |
International
Class: |
B24B 37/32 20060101
B24B037/32 |
Foreign Application Data
Date |
Code |
Application Number |
Sep 19, 2014 |
KR |
10-2014-0124723 |
Claims
1. A retainer for a wafer carrier comprising: a body including a
plurality of slots configured to receive side surfaces of wafers;
and for each of the slots, a supporting structure formed on a
sidewall of the slot and configured to make contact with the side
surfaces of a corresponding wafer, the supporting structure being
spaced apart from an upper corner of the side surface of the
corresponding wafer.
2. The retainer for a wafer carrier of claim 1, wherein for at
least one of the slots, the supporting structure is spaced apart
from a lower corner of the side surface of the corresponding
wafer.
3. The retainer for a wafer carrier of claim 1, wherein for at
least one of the slots, the supporting structure has a rounded
surface configured to make point contact with the side surface of
the corresponding wafer.
4. The retainer for a wafer carrier of claim 3, wherein for the at
least one of the slots, the supporting structure comprises an
embossing having the rounded surface.
5. The retainer for a wafer carrier of claim 1, wherein for at
least one of the slots, the supporting structure has a hollow
structure.
6. The retainer for a wafer carrier of claim 1, wherein for at
least one of the slots, the supporting structure comprises a
supporting surface configured to partially make face contact with
the side surface of the corresponding wafer.
7. The retainer for a wafer carrier of claim 6, wherein for the at
least one of the slots, the supporting surface is substantially
parallel to the side surface of the corresponding wafer.
8. The retainer for a wafer carrier of claim 1, wherein for at
least one of the slots, the body further comprises a first
receiving groove connected to the slot and configured to expose the
upper corner of the corresponding wafer and an upper end of the
supporting structure.
9. The retainer for a wafer carrier of claim 8, wherein for the at
least one of the slots, the body further comprises a second
receiving groove connected to the slot and configured to expose a
lower corner of the corresponding wafer and a lower end of the
supporting structure.
10. The retainer for a wafer carrier of claim 1, wherein for at
least one of the slots, the supporting structure comprises a
resilient material.
11. The retainer for a wafer carrier of claim 1, wherein for at
least one of the slots, the supporting structure is integrally
formed with the body.
12. The retainer for a wafer carrier of claim 1, wherein each of
the wafers comprises: a carrier wafer; and a device wafer attached
to the carrier wafer, the device wafer having a side surface
substantially coplanar with a side surface of the carrier
wafer.
13. The retainer for a wafer carrier of claim 1, wherein each of
the wafers comprises: a carrier wafer; and a device wafer attached
to the carrier wafer, the device wafer having a side surface closer
to a central portion of the carrier wafer than a side surface of
the carrier wafer.
14. A wafer carrier comprising: a case having an entrance
configured to receive wafers, a first inner surface facing the
entrance, and second and third inner surfaces extended from the
first inner surface to the entrance; a door installed at the
entrance; and retainers arranged on an inner surface of the door
and on each of the first to third inner surfaces of the case, each
retainer including a body including a plurality of slots configured
to receive side surfaces of wafers, each slot including a
supporting structure formed on a sidewall of the slot and
configured to make contact with the side surfaces of a
corresponding one of the wafers, the supporting structure
configured to be spaced apart from an upper corner of the side
surface of the corresponding wafer.
15. The wafer carrier of claim 14, wherein structures of the slots
of the retainer on the inner surface of the door are different from
structures of the slots of the retainers on the second and third
inner surfaces.
16. The wafer carrier of claim 14, wherein the retainers on the
second and third inner surfaces of the case have a rounded shape
protruding towards the corresponding second or third surface.
17. A retainer for a wafer carrier comprising: a body including a
plurality of slots; and for each of the slots, the slot comprises:
an upper surface; a lower surface; and a supporting structure
formed on a sidewall of the slot and protruding into the slot
wherein a furthest extent of the protrusion of the supporting
structure into the slot is offset from the upper surface.
18. The retainer for a wafer carrier of claim 17, wherein for at
least one of the slots, the furthest extent of the protrusion of
the supporting structure into the slot is offset from the lower
surface.
19. The retainer for a wafer carrier of claim 17, wherein for at
least one of the slots, the furthest extent of the protrusion of
the supporting structure is a surface.
20. The retainer for a wafer carrier of claim 17, wherein for at
least one of the slots, the slot further comprises a groove
disposed at a corner of the upper surface and the sidewall.
Description
CROSS-RELATED APPLICATION
[0001] This application claims priority under 35 USC .sctn.119 to
Korean Patent Application No. 2014-124723, filed on Sep. 19, 2014
in the Korean Intellectual Property Office (KIPO), the contents of
which are herein incorporated by reference in their entirety.
BACKGROUND
[0002] 1. Field
[0003] Embodiments relate to a retainer and a wafer carrier
including the same. More particularly, example embodiments relate
to a retainer arranged in a wafer carrier to support wafers, and a
wafer carrier including the retainer.
[0004] 2. Description of the Related Art
[0005] Generally, wafers may be received in a wafer carrier. The
wafer carrier may include a front open unified pod (FOUP). The FOUP
may include a retainer configured to support the wafers.
[0006] According to related arts, a side corner of the wafer may
make contact with the retainer so that the side corner of the wafer
may be damaged. Particularly, the side corner of the wafer having a
thin thickness may be more damaged.
SUMMARY
[0007] An embodiment includes a retainer for a wafer carrier
comprising: a body including a plurality of slots configured to
receive side surfaces of wafers; and for each of the slots, a
supporting structure formed on a sidewall of the slot and
configured to make contact with the side surfaces of a
corresponding wafer, the supporting structure being spaced apart
from an upper corner of the side surface of the corresponding
wafer.
[0008] An embodiment includes a wafer carrier comprising: a case
having an entrance configured to receive wafers, a first inner
surface facing the entrance, and second and third inner surfaces
extended from the first inner surface to the entrance; a door
installed at the entrance; and retainers arranged on an inner
surface of the door and on each of the first to third inner
surfaces of the case, each retainer including a body including a
plurality of slots configured to receive side surfaces of wafers,
each slot including a supporting structure formed on a sidewall of
the slot and configured to make contact with the side surfaces of a
corresponding one of the wafers, the supporting structure
configured to be spaced apart from an upper corner of the side
surface of the corresponding wafer.
[0009] An embodiment includes a retainer for a wafer carrier
comprising: a body including a plurality of slots; and for each of
the slots, the slot comprises: an upper surface; a lower surface;
and a supporting structure formed on a sidewall of the slot and
protruding into the slot wherein a furthest extent of the
protrusion of the supporting structure into the slot is offset from
the upper surface.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Embodiments will be more clearly understood from the
following detailed description taken in conjunction with the
accompanying drawings. FIGS. 1 to 16 represent non-limiting,
example embodiments as described herein.
[0011] FIG. 1 is an exploded perspective view illustrating a wafer
carrier in accordance with some embodiments;
[0012] FIG. 2 is a plan view illustrating a retainer for supporting
a wafer in the wafer carrier of FIG. 1;
[0013] FIG. 3A-3D are cross-sectional views taken along a line
III-III' in FIG. 2 according to some embodiments;
[0014] FIG. 4 is a cross-sectional view taken along a line IV-IV'
in FIG. 2;
[0015] FIG. 5 is a cross-sectional view illustrating a retainer in
accordance with some embodiments;
[0016] FIG. 6 is a cross-sectional view illustrating a retainer for
supporting a wafer in accordance with some embodiments;
[0017] FIG. 7 is a cross-sectional view illustrating a retainer for
supporting a wafer in accordance with some embodiments;
[0018] FIG. 8 is a cross-sectional view illustrating a retainer of
a wafer carrier for supporting a wafer in accordance with some
embodiments;
[0019] FIG. 9 is a cross-sectional view illustrating a retainer of
a wafer carrier for supporting a wafer in accordance with some
embodiments;
[0020] FIG. 10 is a cross-sectional view illustrating a retainer of
a wafer carrier for supporting a wafer in accordance with some
embodiments;
[0021] FIG. 11 is a plan view illustrating a retainer of a wafer
carrier for supporting a wafer in accordance with some
embodiments;
[0022] FIG. 12 is a cross-sectional view taken along a line
XII-XII' in FIG. 11;
[0023] FIG. 13 is a cross-sectional view taken along a line
XIII-XIII' in FIG. 2;
[0024] FIG. 14 is a plan view illustrating a retainer of a wafer
carrier for supporting a wafer in accordance with example
embodiments;
[0025] FIG. 15 is a cross-sectional view taken along a line XV-XV'
in FIG. 14; and
[0026] FIG. 16 is a cross-sectional view taken along a line
XVI-XVI' in FIG. 14.
DETAILED DESCRIPTION OF THE EMBODIMENTS
[0027] Embodiments will be described more fully hereinafter with
reference to the accompanying drawings, in which particular
embodiments are shown. Embodiments may, take many different forms
and should not be construed as limited to the particular
embodiments set forth herein. Rather, these embodiments are
provided so that this disclosure will be thorough and complete, and
will fully convey the scope to those skilled in the art. In the
drawings, the sizes and relative sizes of layers and regions may be
exaggerated for clarity.
[0028] It will be understood that when an element or layer is
referred to as being "on," "connected to" or "coupled to" another
element or layer, it can be directly on, connected or coupled to
the other element or layer or intervening elements or layers may be
present. In contrast, when an element is referred to as being
"directly on," "directly connected to" or "directly coupled to"
another element or layer, there are no intervening elements or
layers present. Like numerals refer to like elements throughout. As
used herein, the term "and/or" includes any and all combinations of
one or more of the associated listed items.
[0029] It will be understood that, although the terms first,
second, third etc. may be used herein to describe various elements,
components, regions, layers and/or sections, these elements,
components, regions, layers and/or sections should not be limited
by these terms.
[0030] These terms are only used to distinguish one element,
component, region, layer or section from another region, layer or
section. Thus, a first element, component, region, layer or section
discussed below could be termed a second element, component,
region, layer or section.
[0031] Spatially relative terms, such as "beneath," "below,"
"lower," "above," "upper" and the like, may be used herein for ease
of description to describe one element or feature's relationship to
another element(s) or feature(s) as illustrated in the figures. It
will be understood that the spatially relative terms are intended
to encompass different orientations of the device in use or
operation in addition to the orientation depicted in the figures.
For example, if the device in the figures is turned over, elements
described as "below" or "beneath" other elements or features would
then be oriented "above" the other elements or features. Thus, the
exemplary term "below" can encompass both an orientation of above
and below. The device may be otherwise oriented (rotated 90 degrees
or at other orientations) and the spatially relative descriptors
used herein interpreted accordingly.
[0032] The terminology used herein is for the purpose of describing
particular example embodiments only and is not intended to be
limiting of the present invention. As used herein, the singular
forms "a," "an" and "the" are intended to include the plural forms
as well, unless the context clearly indicates otherwise. It will be
further understood that the terms "comprises" and/or "comprising,"
when used in this specification, specify the presence of stated
features, integers, steps, operations, elements, and/or components,
but do not preclude the presence or addition of one or more other
features, integers, steps, operations, elements, components, and/or
groups thereof.
[0033] Embodiments are described herein with reference to
cross-sectional illustrations that are schematic illustrations of
idealized example embodiments (and intermediate structures). As
such, variations from the shapes of the illustrations as a result,
for example, of manufacturing techniques and/or tolerances, are to
be expected. Thus, example embodiments should not be construed as
limited to the particular shapes of regions illustrated herein but
are to include deviations in shapes that result, for example, from
manufacturing. For example, an implanted region illustrated as a
rectangle will, typically, have rounded or curved features and/or a
gradient of implant concentration at its edges rather than a binary
change from implanted to non-implanted region. Likewise, a buried
region formed by implantation may result in some implantation in
the region between the buried region and the surface through which
the implantation takes place. Thus, the regions illustrated in the
figures are schematic in nature and their shapes are not intended
to illustrate the actual shape of a region of a device and are not
intended to be limiting.
[0034] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art to which this
invention belongs. It will be further understood that terms, such
as those defined in commonly used dictionaries, should be
interpreted as having a meaning that is consistent with their
meaning in the context of the relevant art and will not be
interpreted in an idealized or overly formal sense unless expressly
so defined herein.
[0035] Hereinafter, example embodiments will be explained in detail
with reference to the accompanying drawings.
[0036] FIG. 1 is an exploded perspective view illustrating a wafer
carrier in accordance with some embodiments, FIG. 2 is a plan view
illustrating a retainer for supporting a wafer in the wafer carrier
of FIG. 1, FIG. 3A-3D are cross-sectional views taken along a line
III-III' in FIG. 2 according to some embodiments, FIG. 4 is a
cross-sectional view taken along a line IV-IV' in FIG. 2, FIG. 5 is
a cross-sectional view illustrating a retainer in accordance with
some embodiments, FIG. 6 is a cross-sectional view illustrating a
retainer for supporting a wafer in accordance with some
embodiments, and FIG. 7 is a cross-sectional view illustrating a
retainer for supporting a wafer in accordance with some
embodiments.
[0037] Referring to FIG. 1, a wafer carrier 100 of this embodiment
may include a case 110, first retainers 120, second retainers 130
and a door 140.
[0038] The case 110 may have an internal space where multiple
wafers W may be horizontally received. For clarity, only a single
wafer W is illustrated. The case 110 may have an entrance 112
through which the wafers W may be moved. The case 110 may have a
rectangular parallelepiped shape. Thus, the case 110 may have a
first inner surface 114 facing the entrance 112, and a second inner
surface 116 and a third inner surface 118 extended from the first
inner surface 114 to the entrance 112. The second inner surface 116
and the third inner surface 118 may have a rounded shape protruding
from a central portion of the case 110 toward an outside of the
case 110. Although a rectangular parallelepiped has been used as an
example of a shape of the case 110, in other embodiments, the case
110 may have other shapes.
[0039] The door 140 may be installed at the entrance 112 of the
case 110. When the door 140 is closed, the combination of the case
110 and the door 140 may have the rectangular parallelepiped
shape.
[0040] The first retainers 120 may be arranged on an inner surface
of the door 140 and the first inner surface 114 of the case 110. In
the view of FIG. 1, the first retainers 120 on the first inner
surface 114 are obscured by a side of the case 110 with the second
inner surface 116; however, as illustrated in FIG. 2, the first
retainers 120 on the first inner surface 114 may be opposite the
first retainers 120 on the door 140 when the door 140 is closed.
The second retainers 130 may be arranged on the second inner
surface 116 and the third inner surface 118 of the case 110. As
shown in FIG. 2, the first retainers 120 may face each other.
Further, the second retainers 130 may face each other. As a result,
four side surfaces of each of the wafers W may be supported by the
first retainers 120 and the second retainers 130.
[0041] Referring to FIG. 3A, the first retainer 120 may include a
first body 122 and a first supporting structure 124. The first body
122 may be arranged on the inner surface of the door 140 and the
first inner surface 114 of the case 110. In particular, an outer
surface of the first body 122 may be fixed to the inner surface of
the door 140 and the first inner surface 114 of the case 110. The
first body 122 may have multiple first slots 126, each configured
to receive a side surface S of a corresponding one of the wafers
W.
[0042] The first supporting structure 124 may be formed on an inner
surface of the first body 122. The first supporting structure 124
may be integrally formed with the first body 122; however, in other
embodiments, the first supporting structure 124 may be a separate
component that is assembled with the first body 122. The first body
122 and the first supporting structure 124 may include a resilient
material such as a plastic, a rubber, etc.
[0043] The first supporting structure 124 may be disposed to make
close contact with the side surface S of the wafer W to support the
wafer W. In some embodiments, the first supporting structure 124
may include first embossings arranged by substantially the same
interval in a vertical direction. The first supporting structure
124 may have a semi-circular shape protruding from the inner
surface of the first body 122 in the horizontal direction. Thus,
the first supporting structure 124 may have a rounded surface
configured to make point contact with the side surface S of the
wafer W. The resilient first supporting structure 124, when making
contact with the side surface S of the wafer W, may be slightly
compressed to softly support the side surface S of the wafer W.
[0044] In addition, because the first supporting structure 124 may
have the semi-circular shape, an upper corner UC of the side
surface S of the wafer W may be spaced apart from the first
supporting structure 124. A lower corner DC of the side surface S
of the wafer W may also be spaced apart from the first supporting
structure 124. Thus, only one point of the side surface S of the
wafer W may make point contact with the first supporting structure
124. In contrast, the upper corner UC and the lower corner DC may
not make contact with the first supporting structure 124. As a
result, contacts between the sharp upper corner UC and the sharp
lower corner DC of the wafer W and the first supporting structure
124 may be prevented so that the upper corner UC and the lower
corner DC of the wafer W may not be damaged due to such
contact.
[0045] Additionally, the misaligned wafer W may be loaded into the
internal space of the case 110. In order to prevent a contact
between the upper corner UC and the lower corner DC of the
misaligned wafer W and the first supporting structure 124, the
first supporting structure 124 may have a thickness substantially
the same as a thickness of the wafer W. However, the thickness of
the first supporting structure 124 may not be restricted within the
thickness of the wafer W. The thickness of the first supporting
structure 124 may vary within the non-contact between the upper
corner UC and the lower corner DC of the wafer W and the first
supporting structure 124.
[0046] In an embodiment, the slot 126 may be bounded by a lower
surface 126L and an upper surface 126U. The lower surface 126L may
be configured to support a back side of the wafer W. The first
supporting structure 124 may be configured to extend into the slot
126 from the first body 122. A furthest extent of the first
supporting structure 124 extending into the slot may be offset from
one or more of the lower surface 126L and the upper surface 126U.
In this embodiment, the furthest extent of the first supporting
structure 124 is offset from both the lower surface 126L and the
upper surface 126U. In particular, the upper corner UC and the
lower corner DC of the wafer W may be disposed closer to the upper
surface 126U and the lower surface 126L when a wafer W is loaded.
Because the furthest extent of the first supporting structure 124
is offset from both the lower surface 126L and the upper surface
126U, the first supporting structure 124 may contact the wafer W
only on the side surface S at a location offset from the upper
corner UC and the lower corner DC.
[0047] Referring to FIG. 3B, the first retainer 120' may include
structures similar to the first retainer 120 of FIG. 3A. In
particular, the first supporting structure 124' may be similar to
the first supporting structure 124; however, the first supporting
structure 124' may have a different shape. In this embodiment, the
first supporting structure 124' has a triangular shape.
Accordingly, the first supporting structure 124' may still make
point contact with only one point of the side surface S of the
wafer W. Although a triangular shape and a semi-circular shape have
been used as examples, any structure that may make point contact
with only one point of the side surface S of the wafer W at a point
between the upper corner UC and the lower corner DC may be
used.
[0048] Referring to FIG. 3C, the first retainer 120'' may include
structures similar to the first retainer 120 of FIG. 3A. In
particular, the first supporting structure 124'' may be similar to
the first supporting structure 124; however, the first supporting
structure 124'' may have a different shape. In this embodiment, the
first supporting structure 124'' has a trapezoid shape. In
particular, the first supporting structure 124'' a surface SS that
is configured to contact the side surface S of the wafer W.
However, the contact between the side surface S of the wafer W and
the surface SS of the first supporting structure 124'' does not
extend to the upper corner UC and the lower corner DC. Although a
trapezoid has been used as an example, any shape that makes surface
contact with the side surface S of the wafer W that does not extend
to the upper corner UC and the lower corner DC may be used.
[0049] Referring to FIG. 3D, the first retainer 120''' may include
structures similar to the first retainer 120 of FIG. 3A. In
particular, the first supporting structure 124''' may be similar to
the first supporting structure 124; however, the first supporting
structure 124''' may have a different shape. In this embodiment,
the first supporting structure 124''' has a ribbed shape. As a
result, the first supporting structure 124''' may be configured to
make point contact with the side surface S of the wafer W at
multiple locations. However, each of these point contacts may be
offset from the upper corner UC and the lower corner DC. Although a
first supporting structure 124''' configured to have up to three
point contacts has been used as an example, a structure configured
to have any number of point contacts may be used as the first
supporting structure 124''' as long as the point contact are offset
from the upper corner UC and the lower corner DC. In addition,
although multiple point contacts have been illustrated as the
result of ribs with each having a triangular shape, the shape of
the individual ribs may be similar to that of a structure
configured to create a single point contact. For example, each rib
may have a semi-circular shape.
[0050] Although a variety of shapes have been given as examples of
the first supporting structure 124, any shape that results in
contact with the side surface S of the wafer W that is offset from
the upper corner UC and the lower corner DC may be used.
Furthermore, other embodiments will be described below using a
first supporting structure 124, with modifications to a first
supporting structure 124, having a structure similar to the first
supporting structure 124, or the like. In such embodiments, the
example of the semi-circular first supporting structure 124 may be
replaced with first supporting structures 124 having different
shapes as described above.
[0051] Referring to FIG. 4, the second retainer 130 may have a
structure substantially the same as the structure of the first
retainer 120. Because the second inner surface 116 and the third
inner surface 118 of the case 110 may have the rounded shape
protruding from the central portion of the case 110 toward the
outside of the case 110, the second retainer 130 may also have a
rounded shape protruding toward the second inner surface 116 and
the third inner surface 118 of the case 110.
[0052] The second retainer 130 may include a second body 132 and a
second supporting structure 134. The second body 132 may be
arranged on the second inner surface 116 and the third inner
surface 118 of the case 110. The second body 132 may have multiple
second slots 136, each configured to receive a side surface S of a
corresponding one of the wafers W.
[0053] In some embodiments, the second supporting structure 134 may
include second embossings formed on an inner surface of the second
body 132. The second supporting structure 134 may be integrally
formed with the second body 132; however, in other embodiments, the
second supporting structure 134 may be a separate component that is
assembled with the second body 132. The second body 132 and the
second supporting structure 134 may include a resilient material
such as a plastic, a rubber, etc. The second supporting structure
134 may have a shape and functions substantially the same as the
shape and the functions of the first supporting structure 124.
Thus, any further illustrations with respect to the second
supporting structure 134 may be omitted herein for brevity.
[0054] Alternatively, referring to FIG. 5, the first supporting
structure 124 may have a hollow portion 128. Thus, the first
supporting structure 124 may have a hollow structure having a
hollow inner space. The resilient first supporting structure 124
making contact with the side surface S of the wafer W may be
compressed into the hollow portion 128 to more softly support the
side surface S of the wafer W. Similarly, the second supporting
structure 134 may also have a hollow portion.
[0055] The first retainer 120 and the second retainer 130 may be
configured to support a wafer in FIG. 6. The wafer in FIG. 6 may
include a carrier wafer CW1 and a device wafer
[0056] DW1. The device wafer DW1 may be attached to an upper
surface of the carrier wafer CW1 using an adhesive. The carrier
wafer CW1 may include a bare wafer without electronic devices. In
contrast, the device wafer DW1 may include electronic devices. The
device wafer DW1 may have a side surface DS1 substantially coplanar
with a side surface CS1 of the carrier wafer CW1.
[0057] In some embodiments, the device wafer DW1 may include
multiple plugs P. The plugs P may be formed in the device wafer DW1
in a vertical direction. The plugs P may be electrically connected
between an upper semiconductor chip and a lower semiconductor chip
of a multi-chip package. The plugs P may electrically make contact
with conductive bumps of the upper semiconductor chip. Thus, the
plugs P may have upper ends exposed through an upper surface of the
device wafer DW1. The upper surface of the device wafer DW1 may be
removed by a grinding process until the upper ends of the plugs P
may be exposed. During the grinding process, the carrier wafer CW1
may support the device wafer DW1. As a result, the device wafer DW1
may have a thickness less than a thickness of the carrier wafer
CW1. Thus, an upper corner UC1 of the thin device wafer DW1 may be
easily damaged. In order to prevent the damage of the upper corner
UC1 of the device wafer DW1 a trimming process for partially
removing the upper corner UC1 of the device wafer DW1 may be
performed.
[0058] However, in some embodiments, the first supporting structure
124 may make point contact with only the side surface CS1 of the
carrier wafer CW1. The first supporting structure 124 may be spaced
apart from the upper corner UC1 of the side surface DS1 of the
device wafer DW1. Further, the first supporting structure 124 may
be spaced apart from a lower corner DC1 of a side surface CS1 of
the carrier wafer CW1. Thus, the sharp upper corner UC1 of the
device wafer DW1 and the sharp lower corner DC1 of the carrier
wafer CW1 may not make contact with the first supporting structure
124 so that the upper corner UC1 of the device wafer DW1 and the
lower corner DC1 of the carrier wafer CW1 may not be damaged. As a
result, the trimming process for partially removing the side
surface DS1 of the device wafer DW1 may not be performed.
[0059] The first retainer 120 and the second retainer 130 may be
configured to support a wafer in FIG. 7. The wafer in FIG. 7 may
include a carrier wafer CW2 and a device wafer DW2. The carrier
wafer CW2 and the device wafer DW2 in FIG. 7 may have structures
substantially similar to the structures of the carrier wafer CW1
and the device wafer DW1 in FIG. 6, respectively, except for a side
surface DS2 of the device wafer DW2. Thus, any further
illustrations of substantially similar aspects of the carrier wafer
CW2 and the device wafer DW2 in FIG. 7 may be omitted herein for
brevity.
[0060] The side surface DS2 of the device wafer DW2 may be
positioned nearer to a central portion of the carrier wafer CW2
with respect to a side surface CS2 of the carrier wafer CW2. For
example, a trimming process may be performed on the side surface
DS2 of the device wafer DW2 so that the side surface DS2 of the
device wafer DW2 may be positioned nearer to a central portion of
the carrier wafer CW2 with respect to a side surface CS2 of the
carrier wafer CW2.
[0061] The device wafer DW2 may be attached to an upper surface of
the carrier wafer CW2 using an adhesive. The carrier wafer CW2 may
include a bare wafer without electronic devices. In contrast, the
device wafer DW2 may include electronic devices. A sharp upper
corner UC2 of the device wafer DW2 and a sharp lower corner DC2 of
the carrier wafer CW2 may not make contact with the first
supporting structure 124 so that the upper corner UC2 of the device
wafer DW2 and the lower corner DC2 of the carrier wafer CW2 may not
be damaged.
[0062] FIG. 8 is a cross-sectional view illustrating a retainer of
a wafer carrier for supporting a wafer in accordance with some
embodiments, FIG. 9 is a cross-sectional view illustrating a
retainer of a wafer carrier for supporting a wafer in accordance
with some embodiments, and FIG. 10 is a cross-sectional view
illustrating a retainer of a wafer carrier for supporting a wafer
in accordance with some embodiments.
[0063] Referring to FIG. 8, a retainer 220 of this example
embodiment may include a body 222 and a supporting structure 224.
The body 222 may have multiple slots 226, each configured to
receive side surfaces S of a corresponding wafer W.
[0064] In some embodiments, the supporting structure 224 may
include a supporting surface. The supporting structure 224 may be
configured to partially make face contact with the side surface S
of the wafer W. Thus, the supporting surface of the supporting
structure 224 may be configured to have a thickness less than a
thickness of the wafer W. The supporting surface of the supporting
structure 224 may be configured to be substantially parallel to the
side surface S of the wafer W. The supporting structure 224 may be
configured to make face contact with less than all of the side
surface S of the wafer W. In addition, the supporting structure 224
may be configured to not make contact with the upper corner UC and
the lower corner DC of the wafer W. That is the supporting surface
of the supporting structure 224 may be offset from the upper corner
UC and the lower corner DC of the wafer W.
[0065] Additionally, the body 222 may further include a first
receiving groove 227 and a second receiving groove 228. The first
receiving groove 227 may be configured to extend from the slot 226
to expose the upper corner UC of the wafer W. The second receiving
groove 228 may be configured to extend from the slot 226 to expose
the lower corner DC of the wafer W. Because the upper corner UC of
the wafer W may be exposed through the first receiving groove 227
and the lower corner DC of the wafer W may be exposed through the
second receiving groove 228, contacts between the upper corner UC
and the supporting structure 224, and between the lower corner DC
of the supporting structure 224 may be prevented. In some
embodiments, the first receiving groove 227 and the second
receiving groove 228 may have a circular shape. Alternatively, the
first receiving groove 227 and the second receiving groove 228 may
have other shapes such that the upper corner UC and the supporting
structure 224 do not contact and the lower corner DC and the
supporting structure 224 do not contact.
[0066] The retainer 220 may be configured to support a wafer in
FIG. 9. The wafer in FIG. 9 may have a structure substantially the
same as the structure of the wafer including the carrier wafer CW1
and the device wafer DW1 in FIG. 6. Thus, any further description
of similar aspects of the wafer in FIG. 9 may be omitted herein for
brevity.
[0067] The supporting structure 224 may be configured to partially
make face contact with the side surface CS1 of the carrier wafer
CW1. The supporting structure 224 may be configured to be
substantially parallel to the side surface CS1 of the carrier wafer
CW1.
[0068] The supporting structure 224 may be configured to make face
contact with less than all of the side surface CS1 of the carrier
wafer CW1. In some embodiments, the supporting structure 224 may be
configured to make face contact with both a portion of the side
surface CS1 of the carrier wafer CW1 and the side surface DS1 of
the device wafer DW1. However, the supporting structure 224 may be
configured to not make contact with all of the side surface DS1 of
the device wafer DW1. Thus, the supporting structure 224 may be
configured to not make contact with the upper corner UC1 of the
device wafer DW1 and the lower corner DC1 of the carrier wafer
CW1.
[0069] The upper corner UC1 of the device wafer DW1 may be exposed
through the first receiving groove 227. The lower corner DC1 of the
carrier wafer CW1 may be exposed through the second receiving
groove 228. Therefore, the contacts between the upper corner UC1 of
the device wafer DW1 and the supporting structure 224 and between
the lower corner DC1 of the carrier wafer CW1 and the supporting
structure 224 may be prevented.
[0070] The retainer 220 may be configured to support a wafer in
FIG. 10. The wafer in FIG. 10 may have a structure substantially
the same as the structure of the wafer including the carrier wafer
CW2 and the device wafer DW2 in FIG. 7. Thus, any further
description of similar features of the wafer in FIG. 10 may be
omitted herein for brevity.
[0071] The supporting structure 224 may partially make face contact
with the side surface CS2 of the carrier wafer CW2. The supporting
surface of the supporting structure 224 may be configured to be
substantially parallel to the side surface CS2 of the carrier wafer
CW2.
[0072] The supporting structure 224 may be configured to make face
contact with a partial of the side surface CS2 of the carrier wafer
CW2. In contrast, the supporting structure 224 may be configured to
not make contact with the side surface DS2 of the device wafer DW2.
Thus, the supporting structure 224 may be configured to not make
contact with the upper corner UC2 of the device wafer DW2 and the
lower corner DC2 of the carrier wafer CW2.
[0073] The upper corner UC2 of the device wafer DW2 may be exposed
through the first receiving groove 227. The lower corner DC2 of the
carrier wafer CW2 may be exposed through the second receiving
groove 228. Therefore, the contacts between the upper corner UC2 of
the device wafer DW2 and the supporting structure 224 and between
the lower corner DC2 of the carrier wafer CW2 and the supporting
structure 224 may be prevented.
[0074] FIG. 11 is a plan view illustrating a retainer of a wafer
carrier for supporting a wafer in accordance with some embodiments,
FIG. 12 is a cross-sectional view taken along a line XII-XII' in
FIG. 11, and FIG. 13 is a cross-sectional view taken along a line
XIII-XIII' in FIG. 2.
[0075] Referring to FIG. 11, first retainers 320 may be arranged on
the inner surface of the door 140 and the first inner surface 114
of the case. The second retainers 330 may be arranged on the second
inner surface 116 and the third inner surface 118 of the case.
Thus, four side surfaces of the wafer W may be supported by the
first retainers 320 and the second retainers 330.
[0076] Referring to FIG. 12, the first retainer 320 may have a
structure substantially the same as the structure of the first
retainer 120 in FIG. 3. The first retainer 320 may include a first
body 322 and a supporting structure 324. The first body 322 may
include a plurality of first slots 326 configured to receive side
surfaces S of the wafers W. The supporting structure 324 may have a
semi-circular shape protruded from an inner surface of the first
body 322 in the horizontal direction to make point contact with the
side surface of the wafer W, or another structure as described
above.
[0077] Referring to FIG. 13, the second retainer 330 may include a
second body 332 and a supporting structure 334. The second body 332
may include multiple second slots 336, each configured to receive
the side surfaces S a corresponding one of the wafers S.
[0078] The supporting structure 334 may be configured to partially
make face contact with the side surface S of the wafer W. The
supporting surface of the supporting structure 334 may have a
thickness less than a thickness of the wafer W. The supporting
surface of the supporting structure 334 may be configured to be
substantially parallel to the side surface S of the wafer W. The
supporting structure 334 may be configured to make face contact
with a partial of the side surface S of the wafer W. In contrast,
the supporting structure 334 may be configured to not make contact
with the upper corner UC and the lower corner DC of the wafer
W.
[0079] Additionally, the second body 332 may further include a
first receiving groove 337 and a second receiving groove 338. The
first receiving groove 337 may be configured to extend from the
second slot 336 to expose the upper corner UC of the wafer W. The
second receiving groove 338 may be configured to extend from the
second slot 336 to expose the lower corner DC of the wafer W.
Because the upper corner UC of the wafer W may be exposed through
the first receiving groove 337 and the lower corner DC of the wafer
W may be exposed through the second receiving groove 338, contacts
between the upper corner UC and the supporting structure 334, and
between the lower corner DC of the supporting structure 334 may be
prevented.
[0080] Alternatively, the first retainer 320 may include the
supporting structure 334. The second retainer 330 may include the
supporting structure 324. Further, the first retainer 320 and the
second retainer 330 may be configured to support the wafer in FIG.
6 or the wafer in FIG. 7.
[0081] FIG. 14 is a plan view illustrating a retainer of a wafer
carrier for supporting a wafer in accordance with some embodiments,
FIG. 15 is a cross-sectional view taken along a line XV-XV' in FIG.
14, and FIG. 16 is a cross-sectional view taken along a line
XVI-XVI' in FIG. 14.
[0082] Referring to FIG. 14, first retainers 420 may be arranged on
the inner surface of the door 140 and the first inner surface 114
of the case. The second retainers 430 may be arranged on the second
inner surface 116 and the third inner surface 118 of the case.
Thus, four side surfaces of the wafer W may be supported by the
first retainers 420 and the second retainers 430.
[0083] Referring to FIG. 15, the first retainer 420 may have a
structure substantially the same as the structure of the first
retainer 120 in FIG. 3. The first retainer 420 may include a first
body 422 and a supporting surface 424. The first body 422 may
include multiple first slots 426, each configured to receive side
surfaces S a corresponding one of the wafers W. The supporting
surface 424 may have a semi-circular shape protruded from an inner
surface of the first body 422 in the horizontal direction to make
point contact with the side surface of the wafer W.
[0084] Referring to FIG. 16, the second retainer 430 may include a
second body 432 including multiple second slots 436, each
configured to receive the side surfaces S a corresponding one of
the wafers S. However, the embossing, the supporting surface, or
other supporting structure may not be formed on the sidewalls of
the second slots 436.
[0085] Alternatively, the first retainer 420 and the second
retainer 430 may be configured to support the wafer in FIG. 6 or
the wafer in FIG. 7.
[0086] According to example embodiments, the supporting structure
may be spaced apart from the upper corner and the lower corner of
the side surface of the wafer so that the supporting structure may
not make contact with the corners of the side surface of the wafer.
Thus, the side surface of the wafer may not be damaged.
Particularly, because the corners of the side surface of the thin
device wafer including the plugs may not make contact with the
supporting structure, the side corners of the side surface of the
thin device wafer may not be damaged. As a result, it may not be
required to perform a trimming process for partially removing the
side surface of the device wafer in order to prevent damages of the
side surface of the thin device wafer.
[0087] Some embodiments include a retainer capable of preventing
damages of a side corner of a wafer.
[0088] Some embodiments include a wafer carrier including the
above-mentioned retainer.
[0089] Some embodiments include a retainer for a wafer carrier. The
retainer may include a body and a supporting structure. The body
may be arranged on an inner surface of a wafer carrier configured
to receive a plurality of wafers. The body may have a plurality of
slots configured to receive a side surface of each of the wafers.
The supporting structure may be formed on a sidewall of each of the
slots. The supporting structure may make contact with the side
surface of each of the wafers. The supporting structure may be
spaced apart from an upper corner of the side surface of each of
the wafers.
[0090] In some embodiments, the supporting structure may be spaced
apart from a lower corner of the side surface of each of the
wafers.
[0091] In some embodiments, the supporting structure may have a
rounded surface configured to make point contact with the side
surface of each of the wafers.
[0092] In some embodiments, the supporting structure may include at
least one embossing having the rounded surface.
[0093] In some embodiments, the embossing may have a hollow
structure.
[0094] In some embodiments, the supporting structure may have a
supporting surface configured to partially make face contact with
the side surface of each of the wafers.
[0095] In some embodiments, the supporting surface may be parallel
to the side surface of each of the wafers.
[0096] In some embodiments, the supporting surface may have a
thickness less than a thickness of the wafer.
[0097] In some embodiments, the body may have a first receiving
groove connected to the slot to expose the upper corner of the
wafer and an upper end of the supporting surface.
[0098] In some embodiments, the body may have a second receiving
groove connected to the slot to expose the lower corner of the
wafer and a lower end of the supporting surface.
[0099] In some embodiments, the supporting structure may include a
resilient material.
[0100] In some embodiments, the supporting structure may be
integrally formed with the body.
[0101] In some embodiments, the wafer may include a carrier wafer
and a device wafer. The device wafer may be attached to the carrier
wafer. The device wafer may include plugs formed in the device
wafer.
[0102] In some embodiments, the device wafer may have a side
surface substantially coplanar with a side surface of the carrier
wafer.
[0103] In some embodiments, the device wafer may have a side
surface inside the side surface of the carrier wafer toward a
central portion of the carrier wafer.
[0104] Some embodiments include a retainer for a wafer carrier. The
retainer may include a body and an embossing. The body may be
arranged on an inner surface of a wafer carrier configured to
receive carrier wafers and device wafers. Each of the device wafers
may be attached to each of the carrier wafers. Each of the device
wafers may include plugs formed in each of the device wafers. The
body may include a plurality of slots configured to receive side
surfaces of the carrier wafers and the device wafers. The embossing
may be formed on a sidewall of each of the slots. The embossing may
make point contact with the side surface of each of the carrier
wafers. The embossing may be spaced apart from an upper corner of
each of the device wafers.
[0105] In some embodiments, the device wafer may have a side
surface substantially coplanar with a side surface of the carrier
wafer.
[0106] In some embodiments, the embossing may be spaced apart from
a lower corner of the carrier wafer.
[0107] In some embodiments, the embossing may include a resilient
material.
[0108] In some embodiments, the embossing may have a hollow
structure.
[0109] Some embodiments include a wafer carrier. The wafer carrier
may include a case, a door and retainers. The case may include an
entrance through which wafers may be moved, a first inner surface
facing the entrance, second and third inner surfaces extended from
the first inner surface to the entrance. The door may be arranged
at the entrance. Each of the retainers may include a body and a
supporting structure. The body may be arranged on the first to
third inner surfaces of the case. The body may have a plurality of
slots configured to receive side surfaces of the wafers. The
supporting structure may be formed on a sidewall of each of the
slots. The supporting structure may make contact with the side
surface of each of the wafers. The supporting structure may be
spaced apart from an upper corner of the side surface of each of
the wafers.
[0110] In some embodiments, the supporting structure may be spaced
apart from a lower corner of the side surface of each of the
wafers.
[0111] In some embodiments, the supporting structure may include at
least one embossing configured to make point contact with the side
surface of the wafer.
[0112] In some embodiments, the supporting structure may have a
supporting surface configured to partially make face contact with
the side surface of the wafer.
[0113] In some embodiments, the body may have a first receiving
groove connected to the slot to expose the upper corner of the
wafer and an upper end of the supporting surface, and a second
receiving groove connected to the slot to expose the lower corner
of the wafer and a lower end of the supporting surface.
[0114] In some embodiments, the retainers on the second and third
inner surfaces may have a rounded shape protruded toward the second
third inner surface of the case.
[0115] In some embodiments, the wafer may include a carrier wafer
and a device wafer. The device wafer may be attached to the carrier
wafer. The device wafer may include plugs formed in the device
wafer. The device wafer may have a side surface substantially
coplanar with a side surface of the carrier wafer.
[0116] Some embodiments include a wafer carrier. The wafer carrier
may include a case, a door and a first retainer and a second
retainer. The case may include an entrance through which wafers may
be moved, a first inner surface facing the entrance, second and
third inner surfaces extended from the first inner surface to the
entrance. The door may be arranged at the entrance. The first
retainer may include a body and a supporting structure. The body
may be arranged on the first inner surface of the case and an inner
surface of the door. The body may have a plurality of first slots
configured to receive side surfaces of the wafers. The supporting
structure may be formed on a sidewall of each of the first slots.
The supporting structure may make contact with the side surface of
each of the wafers. The supporting structure may be spaced apart
from an upper corner of the side surface of each of the wafers. The
second retainer may be arranged on the second and third inner
surfaces of the case. The second retainer may have a plurality of
second slots configured to receive the side surfaces of the
wafers.
[0117] In some embodiments, the second retainer may have a
supporting surface formed on side walls of the second slots to
partially make face contact with the side surface of the wafer.
[0118] In some embodiments, the second retainer may have a first
receiving groove connected to the slot to expose the upper corner
of the wafer and an upper end of the supporting surface, and a
second receiving groove connected to the slot to expose the lower
corner of the wafer and a lower end of the supporting surface.
[0119] In some embodiments, the second retainer may have a rounded
shape protruded toward the second third inner surface of the
case.
[0120] In some embodiments, the wafer may include a carrier wafer
and a device wafer. The device wafer may be attached to the carrier
wafer. The device wafer may include plugs formed in the device
wafer. The device wafer may have a side surface substantially
coplanar with a side surface of the carrier wafer.
[0121] In some embodiments, the supporting structure may be spaced
apart from the upper corner and the lower corner of the side
surface of the wafer so that the supporting structure may not make
contact with the corners of the side surface of the wafer. Thus,
the side surface of the wafer may not be damaged. Particularly,
because the corners of the side surface of the thin device wafer
including the plugs may not make contact with the supporting
structure, the side corners of the side surface of the thin device
wafer may not be damaged. As a result, it may not be required to
perform a trimming process for partially removing the side surface
of the device wafer in order to prevent damages of the side surface
of the thin device wafer
[0122] The foregoing is illustrative of example embodiments and is
not to be construed as limiting thereof. Although a few example
embodiments have been described, those skilled in the art will
readily appreciate that many modifications are possible in the
example embodiments without materially departing from the novel
teachings and advantages of the present invention. Accordingly, all
such modifications are intended to be included within the scope of
the present invention as defined in the claims. In the claims,
means-plus-function clauses are intended to cover the structures
described herein as performing the recited function and not only
structural equivalents but also equivalent structures. Therefore,
it is to be understood that the foregoing is illustrative of
various example embodiments and is not to be construed as limited
to the specific example embodiments disclosed, and that
modifications to the disclosed example embodiments, as well as
other example embodiments, are intended to be included within the
scope of the appended claims.
* * * * *