LEE; Hyuek Jae
Patent Applications and Registrations
Patent applications and USPTO patent grants for LEE; Hyuek Jae.The latest application filed is for "semiconductor package".
- LEE; Hyuek Jae - Hwaseong-si KR
- Lee; Hyuek-Jae - Suwon-si N/A KR
- LEE; Hyuek-Jae - Gyeonggi-do KR
- Lee; Hyuek Jae - Daejeon KR
- Lee, Hyuek Jae - Daejeon-city KR
| Patent | Date |
|---|---|
| Semiconductor Package App 20220068829 - PARK; Sang Cheon ; et al. | 2022-03-03 |
| Method Of Manufacturing A Semiconductor Package App 20220028837 - HWANG; Ji Hwan ; et al. | 2022-01-27 |
| Semiconductor Package Including Test Pad App 20210335680 - LEE; Hyuek Jae ; et al. | 2021-10-28 |
| Semiconductor package Grant 11,145,626 - Hwang , et al. October 12, 2 | 2021-10-12 |
| Semiconductor Package App 20210296228 - Lee; Hyuek Jae ; et al. | 2021-09-23 |
| Semiconductor package including test pad Grant 11,088,038 - Lee , et al. August 10, 2 | 2021-08-10 |
| Semiconductor package Grant 11,056,432 - Lee , et al. July 6, 2 | 2021-07-06 |
| Interposer, semiconductor package, and method of fabricating interposer Grant 11,018,026 - Kang , et al. May 25, 2 | 2021-05-25 |
| Die stack structure, semiconductor package having the same and method of manufacturing the same Grant 10,886,255 - Hong , et al. January 5, 2 | 2021-01-05 |
| Interposer, Semiconductor Package, And Method Of Fabricating Interposer App 20200144076 - KANG; UN-BYOUNG ; et al. | 2020-05-07 |
| Semiconductor Package App 20200135699 - HWANG; Ji Hwan ; et al. | 2020-04-30 |
| Die Stack Structure, Semiconductor Package Having The Same And Method Of Manufacturing The Same App 20200135698 - HONG; Ji-Seok ; et al. | 2020-04-30 |
| Semiconductor Package Including Test Pad App 20200135594 - LEE; Hyuek Jae ; et al. | 2020-04-30 |
| Semiconductor Package App 20200135636 - LEE; Hyuek Jae ; et al. | 2020-04-30 |
| Method of fabricating an interposer Grant 10,535,534 - Kang , et al. Ja | 2020-01-14 |
| Interposer, Semiconductor Package, And Method Of Fabricating Interposer App 20170330767 - Kang; Un-Byoung ; et al. | 2017-11-16 |
| Retainer And Wafer Carrier Including The Same App 20160082569 - BAE; Sang-Hyun ; et al. | 2016-03-24 |
| Semiconductor Package And Method Of Fabricating The Same App 20140252626 - KANG; Un-Byoung ; et al. | 2014-09-11 |
| Method of forming semiconductor device Grant 8,563,349 - Myung , et al. October 22, 2 | 2013-10-22 |
| Methods of packaging semiconductor devices including bridge patterns Grant 8,304,288 - Lee , et al. November 6, 2 | 2012-11-06 |
| Method Of Forming Semiconductor Device App 20120156823 - MYUNG; Jong-Yun ; et al. | 2012-06-21 |
| Methods of Packaging Semiconductor Devices Including Bridge Patterns App 20110306167 - Lee; Hyuek-Jae ; et al. | 2011-12-15 |
| Image sensor having through via Grant 7,884,392 - Lee , et al. February 8, 2 | 2011-02-08 |
| Camera module, method of manufacturing the same, and electronic system having the same App 20090256931 - Lee; Chung-Sun ; et al. | 2009-10-15 |
| Image Sensor Having Through Via App 20090200632 - LEE; Hyuek-Jae ; et al. | 2009-08-13 |
| Optical wavelength conversion apparatus and method using injection locking of fabry-perot laser diode Grant 7,034,989 - Yoo , et al. April 25, 2 | 2006-04-25 |
| Device for recovering burst-mode optical clock Grant 6,934,348 - Lee , et al. August 23, 2 | 2005-08-23 |
| Method of manufacturing printed circuit board and multi-layered PCB Grant 6,902,660 - Lee , et al. June 7, 2 | 2005-06-07 |
| Optical wavelength conversion apparatus and method using injection locking of fabry-perot laser diode App 20050100267 - Yoo, Hark ; et al. | 2005-05-12 |
| Method of manufacturing printed circuit board and multi-layered PCB App 20040035711 - Lee, Hyuek Jae ; et al. | 2004-02-26 |
| Device for recovering burst-mode optical clock App 20020090044 - Lee, Hyuek-Jae ; et al. | 2002-07-11 |
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