U.S. patent application number 14/662262 was filed with the patent office on 2015-07-09 for process for producing a member having a pattern, a pattern transfer apparatus, and a mold.
The applicant listed for this patent is CANON KABUSHIKI KAISHA. Invention is credited to Masao Majima, Junichi Seki, Nobuhito Suehira.
Application Number | 20150192855 14/662262 |
Document ID | / |
Family ID | 37492859 |
Filed Date | 2015-07-09 |
United States Patent
Application |
20150192855 |
Kind Code |
A1 |
Seki; Junichi ; et
al. |
July 9, 2015 |
PROCESS FOR PRODUCING A MEMBER HAVING A PATTERN, A PATTERN TRANSFER
APPARATUS, AND A MOLD
Abstract
A patterning process includes preparing a first mold having a
first uneven pattern at a patterning surface thereof and a second
mold as a peripheral shot mold having a second uneven pattern at a
patterning surface thereof. A wafer includes a peripheral area
along an entire peripheral edge and a non-peripheral area
positioned inside the peripheral area and spaced from the edge. The
first mold is used to imprint a non-peripheral pattern group
completely within the non-peripheral area. The non-peripheral
pattern group includes a plurality of non-peripheral pattern units
each corresponding to an individual imprint of the first mold. The
second mold is used to imprint a peripheral pattern positioned
completely within the peripheral area. The peripheral pattern
includes a shape having straight line segments corresponding to and
outlining corners of a plurality of the non-peripheral pattern
units and having a curved line corresponding to the peripheral edge
of the wafer.
Inventors: |
Seki; Junichi;
(Yokohama-shi, JP) ; Majima; Masao; (Isehara-shi,
JP) ; Suehira; Nobuhito; (Kawasaki-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
CANON KABUSHIKI KAISHA |
Tokyo |
|
JP |
|
|
Family ID: |
37492859 |
Appl. No.: |
14/662262 |
Filed: |
March 19, 2015 |
Related U.S. Patent Documents
|
|
|
|
|
|
Application
Number |
Filing Date |
Patent Number |
|
|
11410892 |
Apr 26, 2006 |
8999218 |
|
|
14662262 |
|
|
|
|
Current U.S.
Class: |
355/77 |
Current CPC
Class: |
B82Y 40/00 20130101;
B82Y 10/00 20130101; B29C 59/022 20130101; B29C 2043/144 20130101;
B29C 43/14 20130101; G03F 7/70 20130101; G03F 7/0002 20130101; B29C
2043/025 20130101; B29C 43/021 20130101 |
International
Class: |
G03F 7/20 20060101
G03F007/20 |
Foreign Application Data
Date |
Code |
Application Number |
Jun 6, 2005 |
JP |
2005-166038 |
Claims
1. A patterning process comprising the steps of: preparing a first
mold having a first uneven pattern at a patterning surface thereof;
preparing a second mold as a peripheral shot mold having a second
uneven pattern at a patterning surface thereof; providing a wafer
comprising a peripheral area along an entire peripheral edge
thereof and having a non-peripheral area positioned inside the
peripheral area and spaced from the peripheral edge; using the
first mold to imprint a non-peripheral pattern group positioned
completely within the non-peripheral area, the non-peripheral
pattern group comprising a plurality of non-peripheral pattern
units each corresponding to an individual imprint of the first
mold; and using the second mold to imprint a peripheral pattern
positioned completely within the peripheral area, the peripheral
pattern comprising a shape having straight line segments
corresponding to and outlining corners of a plurality of the
non-peripheral pattern units and having a curved line corresponding
to the peripheral edge of the wafer, wherein the peripheral area is
not large enough to imprint an entire non-peripheral pattern
unit.
2. A process according to claim 1, wherein at least some of the
non-peripheral pattern units are imprinted adjacent to one
another.
3. A process according to claim 2, wherein the peripheral pattern
is spaced from the non-peripheral pattern group by a distance that
is identical to a spacing between adjacent non-peripheral pattern
units.
4. A process according to claim 1, wherein the peripheral pattern
includes a plurality of peripheral pattern units, and at least some
of the peripheral pattern units are imprinted adjacent to one
another.
5. A process according to claim 1, wherein the peripheral pattern
includes a plurality of peripheral pattern units, and the process
further comprises rotating the wafer about a center thereof between
imprints of each peripheral pattern unit.
6. A process according to claim 1, wherein the peripheral pattern
is imprinted after the non-peripheral pattern group is
imprinted.
7. A process according to claim 1, wherein the non-peripheral
pattern group is imprinted after the peripheral pattern is
imprinted.
8. A process according to claim 1, wherein the wafer has a flat,
plate-like shape.
9. A process according to claim 1, wherein the wafer has a circular
shape.
10. A method according to claim 1, wherein each non-peripheral
pattern unit is rectangular.
Description
[0001] This application is a divisional application of copending
U.S. patent application Ser. No. 11/410,892, filed Apr. 26, 2006,
which was published as U.S. Patent Application Publication No.
2006/0282535 on Dec. 7, 2006. This application also claims priority
from Japanese Patent Application No. 2005-166038, filed Jun. 6,
2005, which is hereby incorporated by reference.
FIELD OF THE INVENTION AND RELATED ART
[0002] The present invention relates to a process of producing a
member having a pattern, a pattern transfer apparatus, and a
mold.
[0003] In recent years, as described in Stephan Y Chou, et al.,
Appl. Phys. Lett., Vol. 67, Issue 21, pages 3114-3116 (1995),
nanofabrication technology for transferring a minute structure on a
mold onto a member to be processed, such as resin, metal, etc.,
under pressure, has been developed and has received attention.
[0004] This technology is called nanoprinting or nanoembossing, and
has a resolution on the order of several nanometers, so that it has
received attention as a next-generation semiconductor fabrication
technology in place of using a light exposure device, such as a
stepper, a scanner, etc. Further, a steric (three-dimensional)
structure can be integrally processed at a wafer level, so that the
nanofabrication technology is expected to be applied to a wide
range of fields including an optical device, such as a photonic
crystal, and a biochip, such as:-TAS.
[0005] Further, Design and Performance of a Step and Repeat
Imprinting Machine, SPIE Microlithography Conference, February
2003, has proposed such a processing method that a minute structure
is formed at a surface of a quartz substrate smaller than a work,
to prepare a mold, which is irradiated with UV light, while being
pressed against a substrate, onto which a UV curable resin is
applied, so that the UV curable resin is solidified and the minute
structure and the mold is transferred onto the UV resin substrate.
The same operation is repeated by moving the work reactive to the
mold by means of a stage, whereby the work is processed into a
member as the light exposure device, such as the stepper or the
scanner. Such a repetition of the operation is generally referred
to as a "step-and-repeat method".
[0006] However, in a case when pattern formation is performed
through a step-and-repeat method by using a mold having a pattern
area smaller in size than a work (e.g., a silicon substrate), there
is a possibility that the following problem arises.
[0007] More specifically, generally, in a processing method using a
light exposure apparatus, it is possible to form a pattern by
effecting exposure to light also at an edge (end) portion 306 of a
work (wafer), as shown in FIG. 4A. This is realized by irradiating
the work, even at a peripheral portion thereof, with light
according to a reticle pattern identical to that in the
neighborhood of a center.
[0008] However, in the processing method in the Design and
Performance article described above, when a peripheral area 302
(FIG. 4B) of the work is processed with a mold identical to a mold
used for processing an inner area of the work, there is a
possibility of occurrences of breakage and processing failure of
the mold, due to a stress concentration.
[0009] This is because a pressure is exerted between the mold and
the work in an imprint method, so that there is a possibility that
breakage of the mold and processing failure occur due to an uneven
load caused by a stress concentration at the edge portion of the
work. Accordingly, in a conventional nanoimprint method, as shown
in FIG. 4B, the step-and-repeat method is performed so as not to
form a pattern in the peripheral area 302 as the peripheral portion
of the work. Further, in a case when a pattern is forcedly formed
in the peripheral area 302 by using the mold for forming the
pattern at a non-peripheral portion (e.g., a portion in the
neighborhood of a central portion of the wafer), there is a
possibility of the mold breaking The mold, having an uneven pattern
surface for forming a pattern group by the step-and-repeat method,
is generally very expensive, depending on a line width and a pitch
of the uneven pattern formed. For this reason, it is desired that a
mold less liable to be broken is used.
[0010] Incidentally, pattern formation at the edge portion of the
work (wafer) or in the neighborhood thereof is called a peripheral
shot or an edge shot in the field of photolithography. The pattern
formed in the peripheral area of the wafer has a function of
improving uniformity in a process, such as dry etching or ion
implantation, affected by roughness or the size of a peripheral
pattern. Further, also in other processes, the pattern functions as
a test pattern, so that it is preferable that the pattern formation
in the peripheral area of the work is also performed in the
nanoimprint method.
SUMMARY OF THE INVENTION
[0011] In view of the above-described circumstances, the present
invention has been accomplished by separately preparing a mold for
effecting imprinting in a peripheral area of a work in addition to
a mold for forming a pattern in a non-peripheral area of the
work.
[0012] An object of the present invention is to provide a novel
production process, for a member having a pattern, having solved
the above-described problem.
[0013] Another object of the present invention is to provide a
pattern transfer apparatus and a mold, which are capable of being
used in the production process.
[0014] Incidentally, in the present invention, a pattern is not
necessarily required to be formed in an entire peripheral area of a
work (or workplace).
[0015] According to an aspect of the present invention, a process
for producing a member having a pattern comprises:
[0016] preparing a first mold having a first pattern at a surface
thereof;
[0017] preparing a second mold having a second pattern including an
outer peripheral portion having a shape corresponding to a shape of
an outer peripheral portion of the first pattern;
[0018] transferring the second pattern to a peripheral area, of a
member to be subjected to pattern transfer, which is an area not
large enough to transfer an entire first pattern of the first mold;
and
[0019] transferring the first pattern to an inside of the
peripheral area.
[0020] The first pattern and the second pattern may be disposed
adjacent to each other at a spacing identical to a spacing between
adjacent portions of the first pattern formed inside the peripheral
area.
[0021] In a case when the first pattern has an outer peripheral
portion constituted by straight line segments, the second pattern
may preferably have an outer peripheral portion constituted by
straight line segments corresponding to those of the outer
peripheral portion f the first pattern and a curved line
corresponding to that of a peripheral edge portion of the
member.
[0022] According to another aspect of the present invention, a
process of producing a member having a pattern by transferring a
pattern shape of a mold onto a member to be processed under
pressure comprises:
[0023] forming a second pattern in a peripheral area of the member
to be processed; and
[0024] transferring a first pattern plural times in an area located
inside the peripheral area of the member to be processed by using a
mold having the first pattern. The second pattern formation may be
performed by pattern transfer with the mold or by other methods,
such as etching.
[0025] According to another aspect of the present invention, a
process of producing a member having a pattern comprises:
[0026] forming a second pattern corresponding to an outer
peripheral shape of a pattern group in a peripheral area of a
member before or after a first pattern of a mold is transferred
plural times onto the member to form the pattern group. The member
may, e.g., be a flat plate-like member.
[0027] According to another aspect of the present invention, a
pattern transfer apparatus, for transferring a pattern of a mold
onto a member, comprises:
[0028] a first mold having a portion for holding a first mold for
forming a pattern inside a peripheral area of the member; and
[0029] a second mold holding portion for holding a second mold for
forming a pattern in the peripheral area.
[0030] According to another aspect of the present invention, a mold
is provided with a pattern having an outer periphery comprising a
first outer peripheral portion constituted by a curved line segment
and a second outer peripheral portion constituted by a straight
line segment.
[0031] According to another aspect of the present invention, a mold
is provided with a pattern corresponding to an outer peripheral
shape of a pattern group constituted by a plurality of pattern
surfaces each having a rectangular outer peripheral portion.
[0032] According to an aspect of the present invention, a process
of producing a member having a pattern comprises:
[0033] preparing a first mold having a first pattern, comprising a
plurality of pattern units, at a surface thereof;
[0034] preparing a second mold having a second pattern including an
outer peripheral portion having a shape corresponding to a shape of
an outer peripheral portion of the plurality of pattern units of
the first pattern;
[0035] transferring the second pattern to a peripheral area, of a
member to be subjected to pattern transfer, which is an area not
large enough to transfer an entire pattern unit of the first
pattern of the first mold; and
[0036] transferring the first pattern to an inside of the
peripheral area.
[0037] Further, in an order to solve the above-described problem,
the present invention provides a process for producing a member
provided with an unevenness, a pressure processing apparatus, and a
mold, which are constituted as described below.
[0038] The process for producing a member provided with an
unevenness according to the present invention is a production
process for transferring a pattern shape of a mold onto a member to
be processed (work or wafer) by pressure application and includes a
step of pressing an outer peripheral area of the work (member to be
processed) and a step of pressing an area located inside the outer
peripheral area of the work. In this peripheral pattern, it is
possible to adopt a constitution such that an entire area of the
work is processed by the respective steps.
[0039] Further, the pressure processing apparatus of the present
invention is an apparatus for transferring a pattern shape of a
mold onto the work by pressure application, and is characterized in
that an outer peripheral area pressing means is provided for
pressing an outer peripheral area of the work and an inner area
pressing means is provided for pressing an area located inside the
outer peripheral area of the work.
[0040] Further, the mold of the present invention is characterized
in that it has a shape depending on an outer peripheral shape of an
uneven peripheral area formed on the work.
[0041] The mold, on which an uneven pattern is formed, is also
characterized in that it has a first surface and a second surface,
which are perpendicular to a pattern formed surface of the uneven
pattern and are disposed opposite to each other, and at least one
of the first surface and the second surface has a bent shape.
[0042] The first surface may be a curved surface and the second
surface may be a non-curved surface.
[0043] Further, the mold having thereon the uneven pattern may be
provided with a light-blocking film outside an area in which the
uneven pattern is formed.
[0044] According to the present invention, it is possible to
appropriately form the uneven pattern in not only the inner area of
the work, but also, the outer peripheral area of the work.
[0045] These and other objects, features and advantages of the
present invention will become more apparent upon a consideration of
the following description of the preferred embodiments of the
present invention taken in conjunction with the accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0046] FIG. 1 is a schematic view for illustrating a constitution
of a pattern transfer apparatus according to the present
invention.
[0047] FIGS. 2A to 2D are schematic views for illustrating a
constitution of a mold according to the present invention.
[0048] FIG. 3 is a schematic view for illustrating a work after
being processed in the present invention.
[0049] FIGS. 4A and 4B are schematic views for illustrating a
conventional processing method.
[0050] FIG. 5 is a schematic view for illustrating another
constitution of a pattern transfer apparatus according to the
present invention.
[0051] FIGS. 6A to 6C are schematic views for illustrating another
constitution of a mold according to the present invention.
[0052] FIG. 7 is a schematic view for illustrating a processing
process in the present invention.
[0053] FIG. 8 is a schematic view for illustrating another work
after being processed in the present invention.
[0054] FIGS. 9, 10A to 10C, and 11 are schematic views for
illustrating patterns of molds in the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Embodiments of a Mold
[0055] The mold according to the present invention includes a first
outer peripheral portion 6000 in a curved shape and a second outer
peripheral portion 6100 in a linear shape, as shown in FIG. 6A.
[0056] Herein, the curved shape means, e.g., an outer peripheral
shape of a wafer (work), i.e., an arcuate shape.
[0057] Incidentally, the mold shown in FIGS. 6A to 6C is not a mold
corresponding to an entire outer periphery of a wafer, but may also
be a mold corresponding to the entire outer periphery of the
wafer.
[0058] In the present invention, it is important that a mold for
forming a pattern in a peripheral area is used separately from a
mold for forming a pattern in the neighborhood of a central portion
of a member to be processed or a work, such as a wafer or a resin
on the wafer.
[0059] Accordingly, the mold of the present invention also embraces
a mold having an outer peripheral pattern corresponding to pattern
group (e.g., a pattern group comprising a rectangular pattern shown
in FIG. 8) constituted by a plurality of pattern surfaces each
having a rectangular outer peripheral portion.
[0060] Further, the mold may also have an elongated rectangular
shape, as shown in FIG. 9. In FIG. 9, a peripheral pattern 901 is
formed so that an inside shape thereof corresponds to the outer
peripheral shape of the above-described pattern group. In other
words, the outer peripheral shape and the peripheral pattern 901
are fitted with each other.
[0061] Further, as shown in FIGS. 10A to 10B, a peripheral area may
have a shape corresponding to an outer peripheral shape of a wafer
and an outer shape of the mold may also have other shapes, such as
a rectangle, and so on. In FIGS. 10A to 10C, a peripheral pattern
1201 is formed.
[0062] In this case, an outer area 1220, as shown in FIGS. 10B and
10C showing a cross section of the mold having the peripheral
pattern 1201, may be a recessed area (FIG. 10B) or a leveled area
(FIG. 10C).
[0063] Further, in a case when breakage of a mold at a wafer outer
peripheral portion is not problematic, as shown in FIG. 11, the
mold may also have a peripheral area larger in size than an outer
peripheral shape 1250 (indicated by a dotted line for convenience
of explanation) of the wafer. This case is, e.g., one such that a
mold for pattern formation in the peripheral area is more
inexpensive than the above-described mold for forming the pattern
group.
Embodiments of a Production Process
[0064] The process of producing a member having a pattern according
to an embodiment of the present invention is realized in the
following manner.
[0065] First of all, a first mold having a first pattern and a
second mold having a second pattern, including an outer peripheral
portion having a shape corresponding to a shape of an outer
peripheral portion of the first pattern, are prepared. Then, in a
peripheral area, of a member to be processed, including an area not
large enough to transfer an entire first pattern of the first mold
(e.g., an area 399 shown in FIG. 3 or FIG. 4B), the second pattern
(a peripheral pattern 201) is transferred. Further, inside the
peripheral area, the first pattern (e.g., a pattern 301 shown in
FIG. 3) is transferred. The first pattern may be a pattern group
comprising a plurality of pattern units (e.g., each indicated by
reference numeral 301 shown in FIG. 3). In this manner, the process
for producing the member having a pattern is realized.
[0066] Incidentally, the order of formation of the first pattern
and the second pattern can be appropriately selected. Further, in
this embodiment, the peripheral area does not mean only the area
not large enough to transfer an entire first pattern of the first
mold, but means an area including such an area.
[0067] Particularly, the above-described first pattern and a second
pattern may preferably be provided adjacent to each other at a
spacing identical to a spacing between adjacent portions of the
first pattern. Further, in a case when an outer peripheral portion
of the first pattern is constituted by straight line segments
(e.g., a rectangle), an outer peripheral portion of the second
pattern may preferably be constituted by a combination of a
straight line corresponding to the outer peripheral portion of the
first pattern and a curved line corresponding to a peripheral edge
portion of the above-described member.
[0068] Further, it is also possible to realize a process of
producing a member having an unevenness according to this
embodiment through the following steps. More specifically, the
production process includes a first step of preparing a first mold,
which is provided with a first uneven pattern at a surface thereof
and an outer peripheral portion, constituted by straight line
segments, of the first uneven pattern surface, a second step of
preparing a second mold, which is provided with a second uneven
pattern, at a surface thereof, having an outer peripheral portion
including a first outer peripheral portion constituted by a curved
line and a second outer peripheral portion constituted by straight
line segments corresponding to the outer peripheral portion of the
first uneven portion surface, and a third step of transferring the
first uneven portion and the second uneven portion onto a member to
be processed. The first step and the second step may be performed
in any order or substantially at the same time.
[0069] The above-described member to be processed is a wafer, such
as a silicon wafer used in a semiconductor production process or a
resin-surfaced wafer. In addition to these wafers, as the wafer, it
is also possible to use a glass plate, a metal plate, quartz,
etc.
[0070] The uneven pattern of the mold can be transferred onto the
wafer itself or the resin on the wafer. Examples of the resin may
include a thermosetting resin, a photocurable resin, such as an
ultraviolet curable resin, and a thermoplastic resin.
[0071] Herein, as described above, the member to be processed is
also referred to as a "work" in some cases.
[0072] The first mold is, e.g., a mold having an outer peripheral
portion constituted by segments of a rectangle (such as a
quadrangle, a rectangle, or a square) in a peripheral area of a
pattern-formed surface. As the second mold, it is possible to
employ the mold described in the Embodiments of a mold.
[0073] In the above-described third step, in an outer peripheral
area 302, shown in FIG. 4B, a pattern is transferred with the
above-described second mold. Thereafter, in an area inside the
outer peripheral area, a pattern can be transferred with the
above-described first mold. In this case, the pattern formation is
first performed in the outer peripheral area, so that it is
possible to decrease a possibility that the entire member is a
defective item, e.g., due to an imprint error in the peripheral
area in a step subsequent to large-area pattern formation in the
inner (inside) area by a plurality of nano-imprint operations.
[0074] In the inner area, e.g., pattern transfer with the first
mold is performed plural times to realize a pattern 301.
[0075] It is also possible to transfer the pattern in the outer
peripheral area after transferring the pattern in the inner area.
In this case, it is possible to obviate an adverse affect in the
inner area when contamination, or the like, is caused to occur
during the imprint at the wafer peripheral portion and adversely
affects the imprint in the inner area. Incidentally, also in the
case of transferring the pattern in the outer peripheral area, it
is possible to perform a plurality of transfer operations after the
peripheral area is appropriately divided into plural areas. During
the plural times of transfer, it is possible to effect pattern
formation with a single mold for the outer peripheral area by
rotating the above-described member.
[0076] Incidentally, the pattern referred to herein is, e.g., an
uneven pattern comprising projections and recesses.
[0077] In another embodiment, the production process of a member
having a pattern according to the present invention can be realized
through the following steps. More specifically, the production
process includes a step of forming a second pattern in a peripheral
area of a member to be processed and a step of transferring a first
pattern plural times with a mold having the first pattern in an
area located inside the peripheral area of the member to be
processed. Here, the second pattern forming step may preferably be
a step of forming the pattern after the peripheral area of the
member to be processed is divided into a plurality of areas. In
this case, the production process may also further include a step
of rotating the member to be processed.
[0078] In another embodiment, the production process of a member
having a pattern according to the present invention can be realized
in such a manner that a second pattern corresponding to an outer
peripheral shape of a pattern group before or after the pattern
group is formed by transferring a first pattern of a mold plural
times onto a flat plate (sheet-like) member. In this case, onto the
flat plate-like member (e.g., a wafer provided with a surface resin
layer as a pattern forming layer), the first pattern is transferred
plural times, so that the first pattern does not overlap with each
other. Then, the second pattern corresponding to the outer
peripheral shape of the pattern group is transferred in the
peripheral area of the member. The second pattern is not
necessarily required to be transferred onto the entire surface of
the peripheral area, but it is important that the second pattern is
formed, so as to be disposed adjacent to the above-described
pattern group.
[0079] Incidentally, the formation of the second pattern in the
peripheral area is suitably performed by imprinting with a mold,
but can also be performed by photolithography using an exposure
apparatus.
[0080] The second pattern may preferably be provided adjacent to
the pattern group at a spacing therebetween identical to a spacing
between adjacent portions for the first pattern constituting the
pattern group. Further, after the pattern group is formed, the
second pattern may be formed. It is also possible to form the
pattern group after the second pattern is formed. Further, the
second pattern may also be formed during the formation of the
pattern group.
[0081] Herein, the term "corresponding to the outer peripheral
shape of the pattern group" means that a pattern shape extends
along at least a part of the outer peripheral shape of the pattern
group. Further, the first pattern and the second pattern described
above are formed with molds different from each other. The
above-described production process may preferably be performed so
that a pattern surface shape of the first pattern (a shape in a
case when the shape is regarded as a surface shape without
considering minute unevenness) and the pattern surface shape of the
second pattern are different from each other. However, it is also
possible to perform the production process so that these pattern
surface shapes are substantially identical to each other. In this
case, the outer peripheral pattern formed on the wafer is a dummy
pattern.
Embodiments of a Pattern Transfer Apparatus
[0082] The pattern transfer apparatus according to an embodiment of
the present invention is constituted as described below.
[0083] For example, as shown in FIG. 1, the pattern transfer
apparatus includes a first mold holding portion 155 for holding a
first mold 105 for forming a pattern inside a peripheral area of a
flat plate-like member and a second mold holding portion 158 for
holding a second mold 108 for forming a pattern in the peripheral
area.
[0084] Here, a mechanism for supporting a member to be processed
(work) is ensured by a first support portion (500 shown in FIG. 5)
provided at a position opposite to the first mold holding portion
and a second support portion (520 shown in FIG. 5) provided at a
position opposite to the second mold holding portion. Particularly,
it is preferable that the first support portion is configured to
have a mechanism for moving the flat plate-like member in an
in-plane direction and the second support portion is configured to
have a mechanism for moving the flat plate-like member in the
in-plane direction.
[0085] Incidentally, on a side where the second mold holding
portion is provided, it is preferable that a light-blocking means
for preventing light irradiation with respect to a central area of
the flat plate-like member is provided. Further, the peripheral
area means an area, e.g., in which an entire surface of a pattern
of the first mold cannot be transferred.
[0086] In this embodiment, separately from the first mold (for
ordinary pressure application processing), a peripheral shot mold
for processing an outer peripheral area of the work is used. As a
result, it is possible to process the entire area of the work,
including the outer peripheral area, so that uniformity in other
processes is improved, and it is also possible to form a test
pattern, etc.
[0087] In this embodiment, the process of producing a member having
an unevenness includes a step of processing the outer peripheral
area of the work and a step of processing an area inside the outer
peripheral area of the work, wherein these steps are performed by
using different molds. Further, the mold used in the step of
processing the outer peripheral area of the work may be configured
to have a shape corresponding to an outer shape of the inner area
of the work or a pattern corresponding to a pattern of the inner
area of the work. In the production process, the step of processing
the outer peripheral area of the work can be configured to include
a process of dividing the outer peripheral area into a plurality of
areas to be processed, thus reducing a production cost of the mold.
In this case, the process for processing the outer peripheral area
by the division can be constituted as a process wherein a plurality
of divided molds is used, and a pattern shape formed on the divided
molds is transferred onto the work while rotating the work to
process the outer peripheral area of the work.
[0088] Further, the pressure processing apparatus in this
embodiment may be configured to use a mold provided to the
above-described outer peripheral area pressing means and a mold
different from the mold provided in the area located inside the
work. The mold provided to the outer peripheral area pressing means
can be configured to have a shape corresponding to the outer shape
of the area located inside the work or a pattern corresponding to
the pattern of the area located inside the work. The mold provided
to the outer peripheral area pressing means can be configured to
have a shape divided into plural portions with respect to a pattern
forming surface in the outer peripheral area, thus reducing a
production cost thereof. In this embodiment, the production process
of the member having an unevenness and the pressure processing
apparatus described above may include not only the case of pressing
the mold against the work (the member to be processed), but also,
the case of pressing the work against the mold.
[0089] The present invention will now be described more
specifically based on Embodiments. Herein, the term "in-plane
direction" means an in-plane direction of a processing surface or
an in-plane direction of a surface to be processed.
Embodiment 1
[0090] In Embodiment 1, a pressure processing apparatus according
to the present invention is used.
[0091] FIG. 1 shows a constitution of the pressure processing
apparatus. Referring to FIG. 1, the apparatus includes a housing
101 for covering the entire apparatus as desired, an x-y moving
mechanism 102, a work 103 (also referred to as a flat plate-like
member or a member to be processed), a pressing mechanism 104, a
mold 105, a UV light source 106, a peripheral shot pressing
mechanism 107, a peripheral shot mold 108, a light-blocking plate
109, a peripheral shot UV light source 110, an exposure control
circuit 111, a pressing control circuit 112, a position control
circuit 113, and a process control circuit 114.
[0092] First, an apparatus constitution in this embodiment will be
described.
[0093] As shown in FIG. 1, the mold 105 and the peripheral shot
mold 108 are disposed at pattern positions so that they are to be
opposite to the work, prepared by coating a Si wafer with a
photocurable resin, during an associated operation. The mold 105 is
connected to the pressing mechanism 104 via a support portion 155,
and the peripheral shot mold 108 is connected to the peripheral
shot pressing mechanism 107 via a support portion 158. The work 103
is mounted on the x-y moving mechanism 102 via a jig. Further, the
pressing mechanism 104, the peripheral shot pressing mechanism 107,
and the x-y moving mechanism 102 are connected via the housing 101.
On the housing 101, the UV light source 106 and the peripheral shot
UV light source 110 are mounted at positions opposite to rear
surfaces of the mold 106 and the peripheral shot mold 108,
respectively. The light-blocking plate 109 is disposed between the
peripheral shot mold 108 and the peripheral shot UV light source
110 and blocks an area to be processed with the mold 105 from
irradiation of UV light from the peripheral shot UV light
source.
[0094] The process control circuit 114 provides instructions to the
exposure control circuit 111, the pressing control circuit 112, and
the position control circuit 113 to perform the process and
receives output data from these control circuits. The exposure
control circuit 111 effects exposure by controlling the UV light
source 106 and the peripheral shot UV light source 110. The
pressing control circuit presses the mold 105, the peripheral shot
mold 108, and the work 103, by controlling the pressing mechanism
104 and the peripheral shot pressing mechanism 107. The position
control circuit 113 controls a position of the work 103 in an
in-plane direction (x-y direction) by controlling the x-y moving
mechanism 102. In the present invention, however, mechanical
arrangement of the respective axes may appropriately be changed as
a matter of design choice.
[0095] Next, the molds in this embodiment will be described.
[0096] FIG. 2A is a schematic view of the peripheral shot mold 108,
shown in FIG. 1, when the peripheral shot mold 108 is viewed in the
z direction in FIG. 1, wherein a peripheral pattern 201 is formed
as an uneven pattern at a hatched portion. A shape of the
peripheral pattern 201 may be appropriately determined depending on
a processing method, costs, etc. Examples thereof may include a
line-and-space shape and a dot shape. However, from the viewpoint
of uniformity in other processes, such as dry etching and ion
implantation, it is desirable that a process rule is approximately
not more than three times that of the mold 105. Further, with
respect to an areal ratio and a depth of unevenness, it is
desirable that they are approximately equal to those in the case of
the mold 105. Further, in the peripheral area, it is also possible
to form a test pattern for monitoring other processes and device
characteristics. An outer shape of the peripheral pattern 201 is a
circular shape corresponding to that of the work 103. This shape is
suitable for such a case that a base material for the peripheral
shot mold 108 has the same specification as that of the outer shape
of the work 103, and is available. However, the outer shape of the
peripheral pattern 201 may also be another shape, such as a stripe
shape with a certain width from the inner portion. Further, as
shown in FIG. 9, the peripheral shot mold 108 may also have the
peripheral pattern 201 having a circular outer shape corresponding
to the outer shape of the work 103 and an entire outer shape
thereof may be a rectangle, or the like. Further, in a case when
breakage of the peripheral pattern 201 at a peripheral edge portion
of the work 103 is not a problem, it is also possible to use a mold
having a larger forming area of the peripheral pattern 1201 than
the outer shape of the work 1250, as shown in FIG. 11.
Particularly, in a case when the peripheral shot mold 108 is forced
to be cut from a base material, the outer shape constituted by
straight line segments reduces the processing cost.
[0097] The inner shape of the peripheral pattern 201 is prepared in
accordance with the outer shape of the area to be processed with
the mold 105. More specifically, the size of the inner shape of the
peripheral pattern 201 is designed to be somewhat larger than the
mold 105, in order to obviate overlapping with the above-described
area and is determined appropriately depending on a line width of a
scribe line (for cutting a chip), an accuracy of the x-y moving
mechanism 102, and accuracy of mounting of the work 103, etc. The
peripheral shot mold 108 may also be prepared by reutilizing the
mold 105 after replacing the mold 105 with another mold 105 having
a different pattern, when an outer shape of a pattern forming area
has a target shape (in this case, an outer shape of the area to be
processed with the mold 105).
[0098] FIGS. 2B, 2C, and 2D are schematic sectional views of line
A-A' shown in FIG. 2A. In these figures, hatched lines indicate cut
surfaces.
[0099] An area inside the peripheral pattern 201 may be formed in a
full thickness (height) of the mold, as shown in FIG. 2B, or may be
recessed from the pattern forming surface of the peripheral pattern
201, as shown in FIG. 2C. Further, as shown in FIG. 2D, in the
inner (inside) area, a light-blocking film 202 formed of a
light-blocking material, such as a metal (e.g., Cr, Ta, Au, Ni, Al,
W, Ti, alloys of these metals, or a nonmetal compound), carbon
black, or a coolant by vapor deposition or coating is formed to be
used instead of the light-blocking plate 109, thus omitting the use
of the light-blocking plate 109. In this case, a spacing between
the light-blocking member and the processing surface can be
decreased, so that it is easy to improve a shape accuracy of the
light-blocking area.
[0100] The mold 105 is an ordinary mold for pressing processing
formed of a transparent member provided with a desired target shape
at a surface thereof. Examples of materials for both of the molds
105 and 108 may include light-transmission materials, such as
quartz glass or sapphire, which are appropriately selectable.
[0101] Further, FIGS. 10B and 10C are schematic sectional views of
line A-A' shown in FIG. 10A, wherein hatched lines indicate cut
surfaces. An area outside a peripheral pattern 1201 may be recessed
from the pattern forming surface, as shown in FIG. 10B, or may be
leveled with the pattern forming surface, as shown in FIG. 10C.
Particularly, in the latter case (FIG. 10C), a mold preparing step
can be simplified to reduce the processing cost when a sufficient
processing depth at a peripheral edge portion of the work 103 can
be ensured, or when only a processing depth in the neighborhood of
the pattern 301 described above is necessary in order to ensure
uniformity of the process, as described above.
[0102] Next, the pressing processing process in this embodiment
will be described.
[0103] First, the work 103 is mounted on the x-y moving mechanism
102 and is positioned by being moved immediately under the
peripheral shot mold 108.
[0104] Then, the peripheral shot mold 108 is pressed against the
work 103 and the work 103 is irradiated with UV light to cure a
photocurable resin at a portion of the work 103 contacting the
peripheral pattern 201 of the mold 108. Thereafter, the peripheral
shot mold 108 is released from the work 103 to transfer the
peripheral pattern 201 onto the work 103.
[0105] Next, the work 103 is moved below the mold 105 and the mold
105 is pressed against the work 103 inside the area in which the
peripheral pattern 201 is formed, followed by UV light irradiation
of the work 103 to cure the photocurable resin of the work 103.
Thereafter, the mold 105 is released from the work 103 to transfer
the pattern 301 onto the work 103. This operation is repeated to
effect pattern formation in the area.
[0106] Through the above-described steps, the work 103, having the
pattern 301-formed area for the target shape, and the peripheral
pattern 201, surrounding the area, is completed.
[0107] Incidentally, in this embodiment, the pattern 301 is formed
after the peripheral pattern 201 is formed, but may also be formed
before the peripheral pattern 201 is formed. Further, the
constitution can also be simplified by omitting the use of the
light-blocking plate 109 or the light-blocking film 202 in the case
when excessive UV light exposure after the formation of the pattern
301 is permitted or the case when a resin is coated every time of
pattern formation, irrespective of the order of pattern formation,
depending on a characteristic of the resin or a specification of
shape after the processing. Further, in this embodiment, as the
processing method, a method is utilized wherein the photocurable
resin is cured by UV light, but it is also possible to employ other
shape transfer methods, such as a thermosetting method using a
thermosetting resin, a method wherein a thermoplastic resin is
softened under heating, a method wherein a pressure is applied to a
high-viscosity resin at normal temperature, and a method wherein an
ink layer, a resin layer, or a metal layer formed on a mold is
transferred onto the work.
[0108] In this embodiment, the pressing processing apparatus
includes an integral mechanism for forming the pattern 301 and the
peripheral pattern 201, but may also be configured to be separate
apparatuses for forming these patterns, respectively, although cost
and time for conveyance of the work are increased.
Embodiment 2
[0109] In Embodiment 2, a pressing processing apparatus, different
in constitution from that of Example 1, according to the present
invention, is used.
[0110] FIG. 5 shows the constitution of the pressing processing
apparatus of this embodiment. In FIG. 5, the same members or means
as those in Embodiment 1 are indicated by the same reference
numerals, thus omitting explanation for a common constitution.
[0111] The constitution of this embodiment is basically different
from that of Embodiment 1 in that a rotation mechanism 501 for
rotating the work 103 is disposed immediately below the peripheral
shot mold. The different point is that a conveyance mechanism 502
for conveying the work 103 is disposed between the x-y moving
mechanism 102 and the rotation mechanism 501, and is controlled by
a conveyance mechanism 503. The process control circuit 114 also
provides instructions to the conveyance control circuit 503 and the
rotation control circuit 504 to effect the processing, and receives
output data from these control circuits.
[0112] Molds used in this embodiment will now be described.
[0113] In this embodiment, as the peripheral shot mold 108, a
peripheral shot mold 108 is prepared by dividing and cutting the
peripheral shot mold 108 described in Embodiment 1. FIGS. 6A, 6B
and 6C show a (cut) shape of the peripheral shot mold 108 in this
embodiment when the peripheral shot mole 108 is viewed in the z
direction shown in FIG. 5. The shapes of the peripheral shot mold
108 shown in FIGS. 6A, 6B and 6C are those corresponding to shapes
of portions prepared by dividing the peripheral shot molds 108,
shown in FIGS. 2B, 2C and 2D, into four portions and cutting the
four portions into 1/4 size portions, respectively, under a
rotation symmetry condition about a normal axis with respect to a
forming surface of the peripheral pattern 201.
[0114] Next, the pressing processing process in this embodiment
will be described with reference to FIG. 7.
[0115] Referring to FIG. 7, the work 103 is mounted on the rotation
mechanism. Then, the peripheral shot mold 108 is pressed against
the work 103, and the work 103 is irradiated with UV light to cure
a photocurable resin of the work 103 at a portion contacting the
peripheral pattern 201. Thereafter, the peripheral shot mold 108 is
released from the work 103 to transfer the peripheral pattern 201
onto the work 103. Next, the work 103 is rotated about a center
thereof at an angle of B/2 radians around the z axis shown in FIG.
5 to similarly transfer the peripheral pattern 201 onto the work
103. This operation is further repeated two times to complete
formation of the peripheral pattern 201 in a peripheral pattern
forming area constituted by four (divided) areas.
[0116] In this embodiment, the work is rotated, but this rotation
is relative rotation, so that FIG. 7 shows a state in which the
work 103 is fixed, for convenience of explanation. It is needless
to say that a similar effect can be achieved by rotating the
peripheral shot mold 103 while changing the positional arrangement
of the rotation mechanism 501.
[0117] Next, the work 103 is conveyed and mounted on the x-y moving
mechanism 102 by means of the conveyance mechanism 502, and then,
repetitive formation of the pattern 301 is performed similarly as
in Embodiment 1. As a result, the work 103 constituted by the
pattern 301-formed area having a target shape and the peripheral
pattern 201-formed area consisting of four (divided) areas is
completed.
[0118] Incidentally, the manner of division of the peripheral shot
mold in the present invention is not limited to that in this
embodiment, but may also be a 1/2 division manner or the 1/4
division manner. It is also possible to divide the peripheral shot
mold 108 into five or more portions or asymmetrical portions. In
these cases, the processing is effected by using the plurality of
portions of the peripheral shot mold 108 at the same time or at
separately plural times. Further, depending on the shape before the
division and the manner of division, the x-y moving mechanism 102
is used in place of the conveyance mechanism 501.
[0119] Further, similarly as in Embodiment 1, the mechanical
arrangement of the respective axes is not restricted to that in
this embodiment, but may appropriately be changed as a matter of
design choice.
[0120] Further, in this embodiment, the apparatus constitution is
also divisible as separate apparatuses.
[0121] The constitution of this embodiment is increased in the
number of pattern forming steps for the peripheral pattern 201 when
compared with that of Embodiment 1, thus resulting in a decreased
throughput. However, the peripheral shot mold 108 can be reduced in
size, so that it is possible to reduce the cost of the molds.
[0122] While the invention has been described with reference to the
structure disclosed herein, it is not confined to the details set
forth, and this application is intended to cover such modifications
or changes as may come within the purpose of the improvements or
the scope of the following claims.
* * * * *