U.S. patent application number 14/567507 was filed with the patent office on 2015-07-02 for high-k / metal gate cmos transistors with tin gates.
The applicant listed for this patent is Texas Instruments Incorporated. Invention is credited to Brian K. Kirkpatrick, Hiroaki Niimi.
Application Number | 20150187653 14/567507 |
Document ID | / |
Family ID | 53441843 |
Filed Date | 2015-07-02 |
United States Patent
Application |
20150187653 |
Kind Code |
A1 |
Niimi; Hiroaki ; et
al. |
July 2, 2015 |
HIGH-K / METAL GATE CMOS TRANSISTORS WITH TiN GATES
Abstract
An integrated circuit with a thick TiN metal gate with a work
function greater than 4.85 eV and with a thin TiN metal gate with a
work function less than 4.25 eV. An integrated circuit with a
replacement gate PMOS TiN metal gate transistor with a workfunction
greater than 4.85 eV and with a replacement gate NMOS TiN metal
gate transistor with a workfunction less than 4.25 eV. An
integrated circuit with a gate first PMOS TiN metal gate transistor
with a workfunction greater than 4.85 eV and with a gate first NMOS
TiN metal gate transistor with a workfunction less than 4.25
eV.
Inventors: |
Niimi; Hiroaki; (Cohoes,
NY) ; Kirkpatrick; Brian K.; (Allen, TX) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Texas Instruments Incorporated |
Dallas |
TX |
US |
|
|
Family ID: |
53441843 |
Appl. No.: |
14/567507 |
Filed: |
December 11, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61922498 |
Dec 31, 2013 |
|
|
|
Current U.S.
Class: |
438/592 |
Current CPC
Class: |
H01L 21/32131 20130101;
H01L 21/324 20130101; H01L 21/823857 20130101; H01L 29/4966
20130101; H01L 21/28088 20130101; H01L 29/517 20130101; H01L
21/82385 20130101; H01L 21/28008 20130101; H01L 21/32134 20130101;
H01L 21/823842 20130101; H01L 29/66545 20130101; H01L 21/477
20130101; H01L 21/32133 20130101 |
International
Class: |
H01L 21/8238 20060101
H01L021/8238; H01L 21/28 20060101 H01L021/28 |
Claims
1. A process of forming an integrated circuit, comprising the steps
of: forming a thick TiN layer in both a PMOS transistor area and an
NMOS transistor area; annealing the thick TiN layer in oxygen to
raise a work function to greater than 4.85 eV; after annealing,
removing the thick TiN layer in the NMOS transistor area; and after
removing the thick TiN layer, forming a thin TiN layer in both the
PMOS transistor area and in the NMOS transistor area, the thin TiN
layer being thinner than the thick TiN layer and having a reduced
oxygen concentration to result in a work function of less than 4.25
eV in the NMOS transistor area.
2. The process of claim 1, wherein the thick TiN metal gate
material has a thickness greater than 8 nm and where the thin TiN
metal has a thickness between 1 to 3 nm.
3. The process of claim 1, wherein the thick TiN metal gate
material has a thickness of 10 nm and where the thin TiN metal has
a thickness of 2 nm.
4. The process of claim 1, wherein the PMOS transistor is a gate
first metal gate PMOS transistor and where the NMOS transistor is a
gate first metal gate transistor further comprising the steps of:
depositing doped polysilicon on the thin TiN layer; forming a
transistor gate pattern on the doped polysilicon with a PMOS
transistor gate pattern and with an NMOS transistor gate pattern;
etching the doped polysilicon and the thin TiN layer and the thick
TiN layer to form a gate of the PMOS transistor; and etching the
polysilicon and the thin TiN layer to form a gate of the NMOS
transistor.
5. The process of claim 1, wherein the PMOS transistor is a
replacement metal gate PMOS transistor and where the NMOS
transistor is a replacement metal NMOS transistor further
comprising the steps of: prior to the step of forming the thick TiN
layer; removing a polysilicon gate from an NMOS replacement gate
transistor to form an NMOS replacement gate transistor trench in
the NMOS transistor area; and removing a polysilicon gate from a
PMOS replacement gate transistor to form a PMOS replacement gate
transistor trench in the PMOS transistor area.
6. The process of claim 1, wherein the PMOS transistor is a high-k
last, gate first metal gate PMOS transistor and where the NMOS
transistor is a high-k last, gate first metal gate transistor
further comprising the steps of: prior to the step of forming the
thick TiN layer, depositing a first high-k dielectric in both the
PMOS transistor area and in the NMOS transistor area; prior to the
step of forming the thin TiN layer removing the first high-k
dielectric from the NMOS transistor area and depositing a second
high-k dielectric in the NMOS transistor area and in the PMOS
transistor area; after the step of forming the thin TiN layer,
removing the thin TiN layer from the PMOS transistor area and
removing the second high-k dielectric from the PMOS transistor
area; depositing doped polysilicon in the PMOS transistor area and
in the NMOS transistor area; forming a transistor gate pattern on
the doped polysilicon with a PMOS transistor gate pattern and with
an NMOS transistor gate pattern; etching the polysilicon and the
thick TiN layer to form a gate of the PMOS transistor; and etching
the polysilicon and the thin TiN layer to form a gate of the NMOS
transistor.
7. The process of claim 6, wherein the first and second high-k
dielectrics are 1.2 nm HfO.sub.x, where the thick TiN has a
thickness of 10 nm thick and where the thin TiN has a thickness of
2 nm.
8. The process of claim 1, wherein the PMOS transistor is a high-k
last replacement metal gate PMOS transistor and where the NMOS
transistor is a high-k last replacement metal NMOS transistor
further comprising the steps of: prior to the step of forming the
thick TiN layer; removing a polysilicon gate from an NMOS
replacement gate transistor to form an NMOS replacement gate
transistor trench in the NMOS transistor area; removing a
polysilicon gate from a PMOS replacement gate transistor to form a
PMOS replacement gate transistor trench in the PMOS transistor
area; depositing a first high-k dielectric in the PMOS replacement
gate transistor trench and in the NMOS transistor area; prior to
the step of forming the thin TiN layer removing the first high-k
dielectric from the NMOS transistor area and depositing a second
high-k dielectric on the PMOS transistor area and in the NMOS
replacement gate transistor trench; after the step of forming the
thin TiN layer; removing the thin TiN layer from the PMOS
transistor area; and removing the second high-k dielectric from the
PMOS transistor area.
9. The process of claim 8, wherein the first and second high-k
dielectrics are 1.2 nm HfO.sub.x, where the thick TiN has a
thickness of 10 nm and where the thin TiN has a thickness of 2
nm.
10. A process of forming an integrated circuit with replacement
metal gate CMOS transistors, comprising the steps: providing a
partially processed integrated circuit with a PMOS transistor with
a first polysilicon gate on a first gate dielectric and an NMOS
transistor with a second polysilicon gate on a second gate
dielectric and with premetal dielectric that overlies the NMOS and
PMOS transistors and wherein the premetal dielectric is planarized
exposing the top surface of the first and second polysilicon gates;
etching to remove the first and second polysilicon gates from first
and second gate dielectric to form a PMOS and an NMOS replacement
gate transistor trench; depositing a first high-k dielectric in the
PMOS replacement gate transistor trench; depositing at least 8 nm
of PMOS TiN metal gate material on the first high-k dielectric in
the PMOS replacement gate transistor trench and on a second high-k
dielectric in the NMOS replacement gate trench; annealing the PMOS
metal gate material in oxygen to raise the work function to greater
than 4.85 eV forming an NMOS metal gate pattern with an opening
over the NMOS replacement gate transistor trench; etching the PMOS
metal gate material from the NMOS replacement gate transistor
trench to remove it from an underlying dielectric; removing the
NMOS metal gate pattern; depositing second high-k dielectic in the
NMOS replacement gate transistor trench; depositing between about 1
nm and 3 nm NMOS TiN metal gate material with a reduced oxygen
concentration and a work function of less than about 4.25 eV on the
second high-k dielectric; depositing a filler metal over the NMOS
TiN metal gate material to overfill the PMOS replacement gate
transistor trench and to overfill the NMOS replacement gate
transistor trench; and polishing to remove the overfill, and
portions of the PMOS TiN metal gate material and the NMOS TiN metal
gate material from the surface of the premetal dielectric.
11. The process of claim 10, wherein the process is a high-k last
process and where the underlying dielectric is the second gate
dielectric and further comprising: prior the step of depositing the
first high-k dielectric forming a first PMOS transistor photo
resist pattern with an opening over the PMOS replacement gate
transistor trench; etching the first gate dielectric from the PMOS
replacement gate transistor trench; and after the etching the first
gate dielectric step, stripping the first PMOS transistor photo
resist pattern; prior to the step of depositing second high-k
dielectric etching the second gate dielectric from the NMOS
replacement gate transistor trench; prior to the step of depositing
the filler metal; forming a second PMOS transistor photo resist
pattern on the integrated circuit with an opening over the PMOS
replacement gate transistor trench; etching the NMOS TiN metal gate
material; etching the NMOS high-k dielectric; and removing the
second PMOS transistor photo resist pattern prior the step of
depositing the filler metal.
12. The process of claim 10, wherein the process is a high-k first
process and where the underlying dielectric is the second high-k
dielectric and further comprising: prior to the step of depositing
a first high-k dielectric, etching the first gate dielectric and
the second gate dielectric; and where the step of depositing the
first high-k dielectric, deposits the first high-k dielectric into
the PMOS replacement gate transistor trench and deposits the second
high-k dielectric into the NMOS replacement gate transistor trench
and where the first high-k dielectric and the second high-k
dielectric are the same high-k dielectric.
13. The process of claim 10, wherein the etching the PMOS TiN metal
gate material step is a wet etch in dilute SC1 plus NH.sub.4OH and
H.sub.2O.sub.2.
14. The process of claim 10, wherein the first and second high-k
dielectrics are 1.2 nm HfO.sub.x, where the PMOS TiN metal gate
material is 10 nm thick and where the NMOS TiN metal gate material
is 2 nm thick.
15. A process of forming an integrated circuit with metal gate
first CMOS transistors, comprising the steps: providing a partially
processed integrated circuit with shallow trench isolation
separating a first region with a first sacrificial dielectric where
a PMOS metal gate transistor is to be formed from a second region
with a second sacrificial dielectric where an NMOS metal gate
transistor is to be formed; depositing a first high-k dielectric
where the PMOS metal gate transistor is to be formed; depositing at
least 8 nm of PMOS TiN metal gate material on the first high-k
dielectric; annealing the PMOS metal gate material in oxygen to
raise the work function to greater than 4.85 eV forming an NMOS
metal gate pattern on the PMOS metal gate material with an opening
where the NMOS metal gate transistor is to be formed; etching the
PMOS TiN metal gate material to remove it from an underlying
dielectric; depositing second high-k dielectric where the NMOS
metal gate transistor is to be formed; depositing between 1 nm and
3 nm NMOS TiN metal gate material with a reduced oxygen
concentration and with a work function of less than 4.25 eV;
depositing polysilicon over the NMOS TiN metal gate material;
forming a transistor gate pattern on the polysilicon with resist
geometries where gates of the NMOS and PMOS transistor gates are to
be formed; and etching the polysilicon and the PMOS TiN metal gate
material to form the PMOS transistor gate; and etching the
polysilicon and the NMOS TiN metal gate material to form the NMOS
transistor gate.
16. The process of claim 15, wherein the process is a high-k last
process and wherein the underlying dielectric is the second
sacrificial dielectric and further comprising: prior to the step of
depositing the first high-k dielectric; forming a first PMOS
transistor photo resist pattern on the integrated circuit with an
opening over the PMOS replacement gate transistor trench; etching
the first sacrificial dielectric; and stripping the first PMOS
transistor photo resist pattern; prior to the step of depositing
the second high-k dielectric etching and removing the second
sacrificial dielectric; and prior to the step of depositing the
polysilicon; forming a second PMOS transistor photo resist pattern
on the integrated circuit with an opening where the PMOS transistor
is to be formed; etching the NMOS TiN metal gate material; etching
the NMOS high-k dielectric; and removing the second PMOS transistor
photo resist pattern.
17. The process of claim 15, wherein the process is a high-k first
process and wherein the underlying dielectric is the second high-k
dielectric and further comprising: prior to the step of depositing
the first high-k dielectric etching the first sacrificial
dielectric and etching the second sacrificial oxide; and where the
step of depositing the first high-k dielectric, deposits the first
high-k dielectric where the PMOS metal gate transistor is to be
formed and deposits the second high-k dielectric where NMOS metalt
gate transistor is to be formed and where the first high-k
dielectric and the second high-k dielectric are the same high-k
dielectric.
18. The process of claim 15, wherein the etching the PMOS TiN metal
gate material step is a wet etch in dilute SC1 plus NH.sub.4OH and
H.sub.2O.sub.2.
19. The process of claim 8, wherein the first and second high-k
dielectrics are 1.2 nm HfO.sub.x, where the PMOS TiN metal gate
material is 10 nm thick and where the NMOS TiN metal gate material
is 2 nm thick.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of priority under U.S.C.
.sctn.119(e) of U.S. Provisional Application 61/922,498 (Texas
Instruments docket number TI-70559, filed Dec. 31, 2013.)
FIELD OF INVENTION
[0002] This invention relates to the field of integrated circuits.
More particularly, this invention relates to integrated circuits
with high dielectric constant gate dielectric and metal gate
transistors.
BACKGROUND
[0003] Until recently, integrated circuits utilized primarily
transistors with polysilicon gates and silicon dioxide or nitrided
silicon dioxide gate dielectrics.
[0004] Complementary Metal-Oxide-Semiconductor (CMOS) transistors
with high dielectric constant (hi-k) dielectrics and metal gates
were introduced as technologies scaled to 28 nm and below to combat
short channel effects and to improve performance of the highly
scaled transistors. The hi-k dielectrics provide improved
capacitive control of the transistor channel by avoiding an
apparent increase in gate dielectric thickness due to depletion of
carriers in the polysilicon grains near the gate dielectric
interface.
[0005] A significant challenge with hi-k/metal gate transistors is
achieving the optimum workfunction for the best transistor
performance. The workfunction of the gate for p-channel
metal-oxide-semiconductor (PMOS) transistors is preferably greater
than about 4.8 eV and the workfunction for n-channel
metal-oxide-semiconductor (NMOS) transistors is preferably less
than about 4.3 eV.
[0006] Processing in conventional hi-k/metal gate manufacturing may
be very complicated and expensive to achieve a different work
function on NMOS and PMOS transistors. For example, NMOS
transistors may have a different gate metal and or may have a
different hi-k gate dielectric than PMOS transistors.
[0007] There are primarily four different process flows for forming
hi-k/metal gate transistors: hi-k last replacement gate; hi-k first
replacement gate; hi-k last gate first; and hi-k first gate last.
In replacement gate transistor flows, conventional polysilicon gate
transistors are formed first and then the polysilicon gate is
removed and replaced with a metal gate. In gate first process
flows, the metal gate transistors are formed similar to
conventional polysilicon gate transistors but with a metal gate. In
hi-k last process flows, a silicon dioxide dielectric is first
formed and later removed and replaced with a hi-k dielectric prior
to depositing the metal gate. In hi-k first process flows, the hi-k
dielectric is deposited first and gate material is stripped off the
hi-k dielectric and replaced with metal gate. The hi-k last process
flows are more complicated than hi-k first process flows. They
require more masking steps but avoid exposing the hi-k dielectric
to chemicals that may degrade the hi-k dielectric. Replacement gate
process flows are more complicated than gate first process flows
but allow more flexibility in setting the work functions of the
transistors.
SUMMARY
[0008] The following presents a simplified summary in order to
provide a basic understanding of one or more aspects of the
invention. This summary is not an extensive overview of the
invention, and is neither intended to identify key or critical
elements of the invention, nor to delineate the scope thereof.
Rather, the primary purpose of the summary is to present some
concepts of the invention in a simplified form as a prelude to a
more detailed description that is presented later.
[0009] An integrated circuit is formed with a thick TiN metal gate
with a workfunction greater than 4.85 eV and with a thin TiN metal
gate with a work function less than 4.25 eV. An integrated circuit
is formed with a replacement gate PMOS TiN metal gate transistor
with a workfunction greater than 4.85 eV and with a replacement
gate NMOS TiN metal gate transistor with a workfunction less than
4.25 eV. An integrated circuit is formed with a gate first PMOS TiN
metal gate transistor with a workfunction greater than 4.85 eV and
with a gate first NMOS TiN metal gate transistor with a
workfunction less than 4.25 eV.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] FIGS. 1A-1L are illustrations of steps in the fabrication of
integrated circuit with high-k last, replacement metal gate CMOS
transistors formed according to principles of the invention.
[0011] FIGS. 2A-2J are illustrations of steps in the fabrication of
integrated circuits with high-k first, replacement metal gate CMOS
transistors formed according to principles of the invention.
[0012] FIGS. 3A-3H are illustrations of steps in the fabrication of
integrated circuits with high-k last, metal gate first CMOS
transistors formed according to principles of the invention.
[0013] FIGS. 4A-4F are illustrations of steps in the fabrication of
integrated circuits with high-k first, metal gate first CMOS
transistors formed according to principles of the invention.
DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS
[0014] The present invention is described with reference to the
attached figures. The figures are not drawn to scale and they are
provided merely to illustrate the invention. Several aspects of the
invention are described below with reference to example
applications for illustration. It should be understood that
numerous specific details, relationships, and methods are set forth
to provide an understanding of the invention. One skilled in the
relevant art, however, will readily recognize that the invention
can be practiced without one or more of the specific details or
with other methods. In other instances, well-known structures or
operations are not shown in detail to avoid obscuring the
invention. The present invention is not limited by the illustrated
ordering of acts or events, as some acts may occur in different
orders and/or concurrently with other acts or events. Furthermore,
not all illustrated acts or events are required to implement a
methodology in accordance with the present invention.
[0015] High-k last, metal gate CMOS transistors formed according to
a 3 pattern embodiment replacement gate process are shown in FIG.
1L. PMOS transistor 170 has high-k dielectric 144 and PMOS TiN gate
146. The thickness and oxygen content of the PMOS TiN metal gate
146 is optimized to give a workfunction greater than about 4.85 eV.
NMOS transistor 172 has high-k dielectric, 154, and NMOS TiN gate
156. The thickness and oxygen content of the NMOS TiN metal gate is
optimized to give a workfunction less than about 4.25 eV. Fill
metal, 160 and 166, such as tungsten or aluminum is deposited on
the NMOS and PMOS TiN gates within the replacement gate trenches to
fill the trenches. The overfill is then removed using chemical
mechanical polish (CMP) planarization.
[0016] The major steps in the formation of an embodiment 3 pattern
high-k last, replacement metal gate transistors are illustrated in
FIG. 1A through 1L. Three photo resist patterning steps are used in
this three pattern high-k last, replacement metal gate process
flow.
[0017] The partially processed integrated circuit in FIG. 1A is
formed on a p-type substrate 100. Shallow trench isolation (STI)
dielectric geometries 102 electrically isolate transistors and
other devices on the integrated circuit. A sacrificial silicon
dioxide film 106 with a thickness in the range of approximately 10
nm to 40 nm is grown on the integrated circuit substrate 100. An
nwell 104 is formed in the region where the PMOS transistor 170 is
to be formed. An NMOS transistor 172 is formed in the p-type
substrate region of the integrated circuit substrate 100.
[0018] Referring now to FIG. 1B polysilicon gate material 110 is
deposited on the sacrificial silicon dioxide film 106. A transistor
gate photo resist pattern 112 is formed on the polysilicon gate
material 110.
[0019] The cross section in FIG. 1C is shown after the gates 120
and 122 are etched, gate extension diffusions, 126 and 130, are
formed, dielectric sidewalls 124 are formed, and the deep source
and drain diffusions 128 and 132 are formed. Other processing steps
such as silicide formation on the source and drains and stress
enhancement of the transistors are omitted for clarity. Pre-metal
dielectric (PMD) 134 which may be comprised of several dielectric
layers such as stress dielectric, gap fill dielectric, and other
deposited dielectrics is then deposited to a thickness that is at
least the height of the transistor gates 120 and 122.
[0020] As shown in FIG. 1D, in a high-k last, replacement gate
metal gate process, the PMD dielectric 134 is planarized to expose
the tops of the polysilicon transistor gates 120 and 122.
[0021] In FIG. 1E the polysilicon replacement gates 120 and 122 are
removed by a polysilicon wet etch. A first PMOS replacement gate
pattern 140 is formed to protect the silicon dioxide dielectric 106
in the bottom of the NMOS 172 replacement gate transistor trench
and to expose the silicon dielectric 106 in the bottom of the PMOS
170 replacement gate transistor trench.
[0022] Referring now to FIG. 1F, the silicon dioxide dielectric 106
is removed from the PMOS 170 transistor trench and the first PMOS
replacement gate pattern 140 is removed. High-k gate dielectric 144
such as HfO.sub.x, HfSiO.sub.x, or HfSiON is deposited into the
PMOS replacement gate transistor trench 170, and a PMOS TiN metal
gate film 146 is deposited on the high-k gate dielectric 144. The
high-k gate dielectric 144 film is deposited using atomic layer
deposition (ALD) with a thickness that is typically between about 1
and 4 nm. The PMOS TiN metal gate film 146 is deposited with a
thickness greater than about 8 nm. A TaN film 148 which is used as
an etch stop for the high-k dielectric etch is deposited on the TiN
146 with a thickness of about 2 nm or more. In an example
embodiment integrated circuit, the high-k dielectric is 1.2 nm
HfO.sub.x, the PMOS TiN film 146 is 10 nm, and the TaN film 148 is
2 nm.
[0023] The PMOS TiN metal gate 146 then annealed in oxygen as
described in U.S. Pat. No. 8,643,113 hereby incorporated for
reference to provide a workfunction above 4.85 eV.
[0024] An NMOS 172 replacement gate transistor photo resist pattern
150 is formed to protect the PMOS TiN gate over the PMOS transistor
170 and to enable the TaN 148 and TiN 146 to be removed from the
NMOS area 172.
[0025] As shown in FIG. 1G the TaN film 148, the PMOS TiN gate
material 146, and the high-k gate dielectric 144 are removed from
the NMOS 172 replacement gate transistor trench. The silicon
dioxide dielectric 106 film is also removed.
[0026] NMOS high-k dielectric 154 such as HfO.sub.x, HfSiO.sub.x,
or HfSiON is then deposited into the NMOS replacement gate
transistor trench as shown in FIG. 1H. Typically the high-k
dielectric is deposited to a thickness between about 1 nm and 4 nm.
NMOS TiN metal gate material 156 with a thickness in the range of
about 1 nm to 3 nm is deposited on the high-k dielectric 154. In an
example embodiment the high-k dielecric is HfO.sub.2 about 1.2 nm
thick and is deposited using atomic layer deposition (ALD). As
described in U.S. Pat. No. 8,643,113 hereby incorporated by
reference, the oxygen content in the NMOS TiN metal gate material
156 is less than about 1.times.10.sup.13 atoms/cm.sup.3 within one
nanometer of the top surface of the high-k gate dielectric 154 to
provide a workfunction less than about 4.25 eV. In an example
embodiment, 2 nm of the NMOS TiN metal gate material 156 is
deposited using ALD.
[0027] In FIG. 1I a CVD-W (chemical vapor deposition-tungsten) film
160 is deposited on the NMOS TiN gate material 156 and a second
PMOS replacement gate transistor pattern 162 is formed on the CVD-W
film 160 to protect it over the NMOS replacement gate transistor
172 and to enable the CVD-W film 160, the NMOS TiN gate material
156 and the NMOS high-k dielectric 154 to be etched from the PMOS
170 replacement gate transistor region.
[0028] FIG. 1J shows the integrated circuit after the CVD-W film
160, the thin NMOS TiN gate material 156, and the NMOS high-k gate
dielectric 154 are etched from the PMOS 170 replacement gate
transistor region. The TaN film 148 serves and an etch stop for the
high-k dielectric 154 etch. After the NMOS transistor 172 high-k
gate dielectric 154 is removed from the PMOS 170 replacement gate
transistor region, the TaN etch stop film 148 may be removed by
etching. The NMOS 172 transistor high-k gate dielectric 154 is
removed to prevent a capacitor from forming between the NMOS
transistor 172 TiN metal gate material 156 and the PMOS transistor
170 TiN metal gate material 146.
[0029] As shown in FIG. 1K additional CVD-W 166 is deposited to
completely fill the PMOS 170 and NMOS 172 replacement gate
transistor trenches. Aluminum metal alternatively may be used.
[0030] The CVD-W overfill and the metal gate material is then
removed from the surface of the PMD dielectric 134 between the
replacement gate transistor trenches 170 and 172 using CMP shown in
FIG. 1L. The replacement gate PMOS 170 transistor has a thick
oxygenated TiN metal gate with a workfunction above about 4.85 eV.
The replacement gate NMOS 172 transistor has a thin deoxygenated
NMOS TiN metal gate with a workfunction less than about 4.25
eV.
[0031] Additional PMD dielectric may be deposited on the integrated
circuit and contacts may be formed to the transistor gates and to
deep source and drain diffusions to electrically connect them to a
first layer of interconnect. Additional layers of dielectric and
more levels of interconnect may be formed to complete the
integrated circuit.
[0032] The advantages of the embodiment 3 pattern high-k last
replacement metal gate process is that the PMOS and NMOS high-k
dielectrics are deposited immediately before the PMOS and NMOS TiN
metal gates are deposited. There is no degradation of the high-k
dielectric due to layers being chemically stripped off prior to the
TiN metal gate deposition. In addition the high-k dielectric for
NMOS is deposited using a different process step than the high-k
dielectric for the PMOS so if desired different high-k dielectrics
may be used on the NMOS and PMOS transistors.
[0033] High-k first, metalt gate CMOS transistors formed according
to a 1 pattern embodiment replacement gate process are shown in
FIG. 2J. PMOS transistor 174 has high-k dielectric 144 and PMOS TiN
gate 146. The thickness and oxygen content of the PMOS TiN metal
gate 146 is optimized to give a workfunction greater than about
4.85 eV. NMOS transistor 176 has high-k dielectric 108, and NMOS
TiN gate 156. The thickness and oxygen content of the NMOS TiN
metal gate is optimized to give a workfunction less than about 4.25
eV. Metal 166 such as tungsten or aluminum is deposited on the NMOS
and PMOS TiN gates within the replacement gate trenches and
planarized.
[0034] The major steps in an embodiment 1 pattern high-k first,
replacement metal gate CMOS process flow using an embodiment one
photo resist pattern process are illustrated in FIG. 2A through 2J.
This embodiment process has the advantage of being less expensive
to implement than the previously described three photo resist
pattern embodiment process.
[0035] The partially processed integrated circuit in FIG. 2A is
formed on a p-type substrate 100. Shallow trench isolation (STI)
dielectric geometries 102 electrically isolate transistors and
other devices on the integrated circuit. An nwell 104 is formed in
the region where the PMOS transistor 174 is to be formed. An NMOS
transistor 176 is formed in the p-type region of the integrated
circuit substrate 100.
[0036] A high-k dielectric film 108 is deposited on the integrated
circuit substrate. The high-k dielectric is typically a material
such as HfO.sub.x, HfSiO.sub.x, or HfSiON between about 1 and 4 nm
thick. In an example embodiment 1 pattern high-k first metal
replacement gate process, the high-k dielectric is HfO.sub.x
deposited with a thickness of approximately 1.2 nm using ALD.
[0037] Referring now to FIG. 2B polysilicon gate material 110 is
deposited on the high-k dielectric film 108. A transistor gate
pattern 112 is formed on the polysilicon gate material 110.
[0038] The cross section in FIG. 2C is shown after the gates 120
and 122 are etched, gate extension diffusions, 126 and 130, are
formed, dielectric sidewalls 124 are formed, and the deep source
and drain diffusions 128 and 132 are formed. Process steps such as
silicide formation on the source and drains and stress enhancement
of the transistor channels are omitted for clarity. Pre metal
dielectric (PMD) 134 which may be comprised of several dielectric
layers such as stress dielectric, gap fill dielectric, and other
deposited dielectrics is then deposited to a thickness that is at
least the height of the transistor gates 120 and 122.
[0039] As shown FIG. 2D, the PMD dielectric is planarized to expose
the tops of the polysilicon replacement gates 120 and 122 over the
transistors.
[0040] As shown in FIG. 2E the polysilicon replacement gates, 120
and 122, are then removed exposing the high-k dielectric 108 in the
bottom of the replacement gate transistor trenches 174 and 176.
[0041] Referring now to FIG. 2F, a PMOS TiN metal gate film 146 is
deposited on the high-k gate dielectric 108. The PMOS TiN metal
gate film 146 is deposited with a thickness greater than about 8
nm. In an example embodiment integrated circuit, the PMOS TiN metal
gate film is about 10 nm.
[0042] The PMOS TiN metal gate then annealed in oxygen as described
in U.S. Pat. No. 8,643,113 hereby incorporated for reference to
provide a workfunction above 4.85 eV.
[0043] An NMOS replacement gate 174 photo resist pattern 150 is
formed to protect the PMOS TiN gate 146 over the PMOS transistor
174 and to enable removal of the PMOS TiN gate 146 from the NMOS
replacement gate transistor area 176.
[0044] As shown in FIG. 2G the PMOS TiN metal gate material 146 is
removed from the NMOS 176 replacement gate transistor area. A
highly selective etch is used to remove the PMOS TiN metal gate
material 146 from the high-k gate dielectric 108 in the NMOS
transistor 176 region so as not to damage the high-k gate
dielectric 108. In an example embodiment a wet etch comprised of
dilute SC1 plus NH.sub.4OH and H.sub.2O.sub.2 is used to remove the
TiN 146 from the high-k dielectric 108.
[0045] In FIG. 2H, thin NMOS TiN metal gate material 156 is
deposited on the high-k dielectric 108 in the NMOS 176 replacement
gate transistor trench. As described in U.S. Pat. No. 8,643,113
hereby incorporated by reference, the oxygen content in the NMOS
TiN metal gate material 156 is less than about 1.times.10.sup.13
atoms/cm.sup.3 within one nanometer of the top surface of the
high-k gate dielectric 108 to provide a workfunction less than
about 4.25 eV. In an example embodiment, 2 nm of the NMOS TiN metal
gate material 156 is deposited using ALD.
[0046] As shown in FIG. 21 CVD-W 166 is deposited to completely
fill the PMOS 174 and NMOS 176 replacement gate transistor
trenches. Aluminum metal alternatively may be used.
[0047] The surface of the integrated circuit is then planarized
using CMP as shown in FIG. 2J to remove CVD-W 166 overfill and
metal gate material 146 and 156 from the surface of the PMD 134
between the NMOS 176 and PMOS 174 replacement gates. The high-k
first replacement gate PMOS 174 transistor has a thick oxygenated
TiN metal gate 146 with a workfunction greater than about 4.85 eV.
The high-k first replacement gate NMOS 176 transistor has a thin
deoxygenated NMOS TiN metal gate 156 with a workfunction less than
about 4.25 eV.
[0048] Additional PMD dielectric may be deposited on the integrated
circuit and contacts may be formed to the deep source and drain
diffusions and to the transistor gates to electrically connect them
to a first layer of interconnect. Additional layers of dielectric
and more levels of interconnect may be formed to complete the
integrated circuit.
[0049] High-k last, metal gate first CMOS transistors formed
according to a three pattern embodiment process are shown in FIG.
3H. PMOS transistor 180 has high-k dielectric 144 and TiN gate 146.
The thickness and oxygen content of the PMOS TiN metal gate 146 are
optimized to give a workfunction greater than about 4.85 eV. NMOS
transistor 182 has high-k dielectric 154, and TiN gate 156. The
thickness and oxygen content of the TiN NMOS metal gate 156 is
optimized to give a workfunction less than about 4.25 eV. Doped
polysilicon deposited on the PMOS and NMOS TiN metal gates 146 and
156 and then patterned and etched to form the gates, 120 and 122,
of the embodiment high-k last, gate first NMOS and PMOS metal gate
transistors 180, and 182.
[0050] The major steps in the embodiment three pattern process that
forms the, high-k last, metal gate first transistors are
illustrated in FIG. 3A through 3H.
[0051] The partially processed integrated circuit in FIG. 3A is
formed on a p-type substrate 100. Shallow trench isolation (STI)
dielectric geometries 102 electrically isolate transistors and
other devices on the integrated circuit. A sacrificial silicon
dioxide film 106 in the range of approximately 10 nm to 40 nm is
grown on the integrated circuit substrate 100. An nwell 104 is
formed in the region where the PMOS transistor 180 is to be formed
by counter doping the p-type substrate 100 in the usual manner. An
NMOS transistor 182 will be formed in the p-type substrate 100.
[0052] As shown in FIG. 3B a first PMOS transistor photo resist
pattern 140 is formed on the sacrificial silicon dioxide layer 106
to protect it in the NMOS transistor area 182 and to allow it to be
removed from the PMOS transistor area 180.
[0053] Referring now to FIG. 3C, the sacrificial silicon dioxide
dielectric 106 is removed from the PMOS 180 transistor area and the
first PMOS transistor photo resist pattern 140 is removed. PMOS
high-k gate dielectric 144 is then deposited and a PMOS TiN metal
gate film 146 is deposited on the PMOS high-k gate dielectric 144.
In an example embodiment integrated circuit the high-k gate
dielectric 144 film is HfO.sub.2 deposited using atomic layer
deposition (ALD) with a thickness of about 1.2 nm. The TiN metal
gate film 146 is deposited with a thickness greater than about 8
nm. A TaN film 148 which is used as an etch stop for a high-k
dielectric etch is deposited on the TiN 146 to a thickness of about
2 nm or more. In an example embodiment integrated circuit, the PMOS
TiN film is 10 nm and the TaN film is 2 nm.
[0054] The PMOS TiN metal gate material 146 is then annealed in
oxygen as described in U.S. Pat. No. 8,643,113 hereby incorporated
for reference to provide a workfunction above 4.85 eV.
[0055] NMOS transistor photo resist pattern 150 is formed on the
PMOS TiN metal gate 146 to enable the PMOS TiN metal gate material
146 to be removed from the NMOS metal gate transistor 182 area and
to protect it from being removed from the PMOS metal gate
transistor area 180.
[0056] FIG. 3D shows the integrated circuit after the TaN etch stop
material 148 is etched, the PMOS TiN metal gate material 146 is
etched, the PMOS high-k gate dielectric 144 is etched, and the
sacrificial silicon dioxide film 106 is etched from the NMOS metal
gate transistor 182 area.
[0057] NMOS high-k dielectric 154 is then deposited onto the
integrated circuit as shown in FIG. 3E. Thin NMOS TiN metal gate
material 156 is deposited on the NMOS high-k dielectric 154. In an
example embodiment the NMOS high-k dielectric 154 is HfO.sub.2
about 1.2 nm thick and is deposited using atomic layer deposition
(ALD). The thin NMOS TiN metal gate material 156 is also deposited
using ALD to a thickness of about 2 nm. As described in U.S. Pat.
No. 8,643,113 hereby incorporated by reference, the thin NMOS TiN
metal gate material 156 is deposited with an oxygen content of less
than about 1.times.10.sup.13 atoms/cm.sup.3 within one nanometer of
the top surface of the high-k gate dielectric 154 to provide a
workfunction less than about 4.25 eV.
[0058] A second PMOS transistor photoresist pattern 162 is formed
on the thin NMOS TiN metal gate 156 to enable the thin NMOS TiN
metal gate 156 material and the NMOS high-k gate dielectric
material 154 to be etched off the PMOS TiN metal gate 146 in the
PMOS transistor 180 region. Photo resist 162 protects the NMOS TiN
metal gate 156 from being removed from the NMOS transistor 182
region.
[0059] FIG. 3F shows the integrated circuit after the thin TiN gate
film 156, and the NMOS transistor 182 high-k gate dielectric 154
are etched from the PMOS transistor area 180. The TaN film 148
serves and an etch stop for the high-k dielectric 154 etch. After
the NMOS transistor 182 high-k gate dielectric 154 is removed the
TaN etch stop film 148 may be removed by etching. The NMOS 182
transistor high-k gate dielectric 154 is removed to prevent
capacitor formation between the NMOS 182 transistor TiN metal gate
film 156 and the PMOS 180 transistor TiN metal gate film 146.
[0060] As shown in FIG. 3G polysilicon gate material 110 is
deposited on the PMOS 180 and NMOS 182 TiN metal gates. A
transistor gate photo resist pattern 112 is formed on the
polysilicon gate material 110.
[0061] The cross section in FIG. 3H is shown after the gates 120
and 122 are etched. Polysilicon 110 plus thick PMOS TiN gate
material 146 is etched to form the gate 120 of the PMOS transistor
180. Polysilicon 110 plus thin NMOS TiN gate material 156 is etched
to form the gate 122 of the NMOS transistor 182.
[0062] Gate extension diffusions, 126 and 130, are formed,
dielectric sidewalls 124 are formed, and the deep source and drain
diffusions 128 and 132 are formed after gate etch. Processing steps
such as source and drain and gate silicidation and transistor
channel stress enhancement are omitted for sake of clarity. Pre
metal dielectric (PMD) 134 which may be comprised of several
dielectric layers such as stress dielectric, gap fill dielectric,
and other deposited dielectrics is then deposited over the NMOS 182
and PMOS 180 transistors.
[0063] The PMD dielectric 134 may be planarized using CMP and
contacts may be formed to the deep source and drain diffusions,
128, 132, and to the transistor gates, 120 and 122, to electrically
connect them to a first layer of interconnect. Additional layers of
dielectric and additional levels of interconnect may be formed to
complete the integrated circuit.
[0064] The advantages of the embodiment 3 pattern high-k last,
metal gate first process is that the PMOS and NMOS high-k
dielectrics are deposited immediately before the PMOS and NMOS TiN
metal gates are deposited. There is no degradation of the high-k
dielectric due to layers being chemically stripped off the surface
prior to the TiN metal gate deposition. In addition the high-k
dielectric for NMOS is deposited using a different process step
than the high-k dielectric for the PMOS so if desired different
high-k dielectrics may be used on the NMOS and PMOS
transistors.
[0065] High-k first, gate first CMOS transistors formed according
to a one pattern embodiment process are shown in FIG. 4F. PMOS
transistor 184 has high-k dielectric 108 and PMOS TiN metal gate
146. The thickness and oxygen content of the PMOS TiN metal gate
material 146 is optimized to give a workfunction greater than about
4.85 eV. NMOS transistor 186 has high-k dielectric,108, and NMOS
TiN metal gate 156. The thickness and oxygen content of the TiN
NMOS metal gate material 156 is optimized to give a workfunction
less than about 4.25 eV. Doped polysilicon is deposited on the TiN
metal gates and then patterned and etched to form the gates 120 and
122 of the embodiment high-k first, metal gate first PMOS and NMOS
transistors, 184 and 186.
[0066] The major steps for an embodiment one pattern high-k first,
metal gate first process are illustrated in FIG. 4A through 4H.
This embodiment high-k first, metal gate first one pattern process
is more cost effective than the embodiment high-k last, metal gate
first three pattern process.
[0067] The partially processed integrated circuit in FIG. 4A is
formed on a p-type substrate 100. Shallow trench isolation (STI)
dielectric geometries 102 electrically isolate transistors and
other devices on the integrated circuit. An nwell 104 is formed in
the region where the PMOS transistor 184 is to be formed by counter
doping the p-type substrate 100 in the usual manner. An NMOS
transistor 186 will be formed in the p-type substrate 100.
[0068] A high-k dielectric film 108 with a thickness typically in
the range of approximately 1 nm to 4 nm is deposited on the
integrated circuit substrate 100. In an example embodiment high-k
first metal gate first process the high-k dielectric is a HfO.sub.2
dielectric film deposited with a thickness of approximately 1.2 nm
using ALD.
[0069] Referring now to FIG. 4B thick PMOS TiN metal gate material
146 is deposited on the high-k dielectric film 108. The PMOS TiN
metal gate material 146 is deposited with a thickness greater than
about 8 nm. In an example embodiment integrated circuit, the PMOS
TiN metal gate material is deposited using ALD to a thickness of
about 10 nm.
[0070] The PMOS TiN metal gate then annealed in oxygen as described
in U.S. Pat. No. 8,643,113 hereby incorporated for reference to
provide a workfunction above 4.85 eV.
[0071] An NMOS transistor 186 photo resist pattern 150 is formed to
protect the PMOS TiN metal gate material 146 over the PMOS
transistor area 184 and to enable it to be removed from the NMOS
area 186.
[0072] As shown in FIG. 4C the PMOS TiN metal gate material 146 is
removed from the NMOS 184 transistor area. A highly selective etch
is used to remove the PMOS TiN metal gate material 146 from the
high-k gate dielectric 108 in the NMOS transistor 186 region so as
not to damage the high-k gate dielectric 108. In an example
embodiment a wet etchant comprised of diluted SC1, NH.sub.4OH, and
H.sub.2O.sub.2 is used to etch the PMOS TiN metal gate material
146.
[0073] Thin NMOS TiN metal gate material 156 is deposited on the
high-k dielectric 108 in the NMOS 186 transistor area. The thin
NMOS TiN metal gate material 156 may be deposited with a thickness
in the range of about 1 nm to 3 nm. In an example embodiment about
2 nm of the NMOS TiN metal gate material 156 is deposited using
ALD. As described in U.S. Pat. No. 8,643,113 hereby incorporated by
reference, the thin NMOS TiN metal gate material 156 is deposited
with an oxygen content of less than about 1.times.10.sup.13
atoms/cm.sup.3 within one nanometer of the top surface of the
high-k gate dielectric 108 to provide a workfunction less than
about 4.25 eV.
[0074] As shown in FIG. 4E polysilicon gate material 110 is
deposited on the PMOS 184 and NMOS 186 TiN metal gate material 146
and 156. A transistor gate photo resist pattern 112 is formed on
the polysilicon gate material 110.
[0075] The cross section in FIG. 4F shows the integrated circuit
after the gates 120 and 122 are etched. Polysilicon 110 plus NMOS
TiN metal gate material 156 and PMOS TiN metal gate material 146
are etched to form the gate 120 of the PMOS high-k metal gate
transistor 184. Polysilicon 110 plus NMOS TiN metal gate material
156 is etched to form the gate 122 of the NMOS high-k metal gate
transistor 186.
[0076] Gate extension diffusions, 126 and 130, are formed,
dielectric sidewalls 124 are formed, and the deep source and drain
diffusions 128 and 132 are formed after gate etch. Additional
processing steps such as source and drain and gate silicidation and
stress enhancement of the transistor channels are omitted for
clarity. Pre metal dielectric (PMD) 134 which may be comprised of
several dielectric layers such as stress dielectric, gap fill
dielectric, and other deposited dielectrics is then deposited over
the high-k first, metal gate first transistors 184 and 186.
[0077] The PMD dielectric 134 may be planarized using CMP and
contacts may be formed to the deep source and drain diffusions, 128
and 132, and to the transistor gates, 120 and 122 to electrically
connect them to a first layer of interconnect. Additional layers of
dielectric and more levels of interconnect may be formed to
complete the integrated circuit.
[0078] Those skilled in the art to which this invention relates
will appreciate that many other embodiments and variations are
possible within the scope of the claimed invention.
* * * * *