U.S. patent application number 14/150520 was filed with the patent office on 2015-04-23 for apparatus for receiving substrate.
This patent application is currently assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD.. The applicant listed for this patent is SAMSUNG ELECTRO-MECHANICS CO., LTD.. Invention is credited to Dong-Hoon KIM, Sang-Youp LEE, Sung-Taek LIM.
Application Number | 20150108029 14/150520 |
Document ID | / |
Family ID | 52825225 |
Filed Date | 2015-04-23 |
United States Patent
Application |
20150108029 |
Kind Code |
A1 |
LIM; Sung-Taek ; et
al. |
April 23, 2015 |
APPARATUS FOR RECEIVING SUBSTRATE
Abstract
An apparatus for receiving a substrate is disclosed. The
apparatus for receiving a substrate in accordance with an
embodiment of the present invention includes: a frame configured to
form a space for receiving the substrate inside thereof; a
substrate supporting part coupled to one side of the frame and
configured to support the substrate inserted in the space for
receiving the substrate; and a shock-absorbing part arranged at one
side of the frame and configured to mitigate a drop impact of the
substrate.
Inventors: |
LIM; Sung-Taek; (Suwon-si,
KR) ; KIM; Dong-Hoon; (Suwon-si, KR) ; LEE;
Sang-Youp; (Suwon-si, KR) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
Suwon-si |
|
KR |
|
|
Assignee: |
SAMSUNG ELECTRO-MECHANICS CO.,
LTD.
Suwon-si
KR
|
Family ID: |
52825225 |
Appl. No.: |
14/150520 |
Filed: |
January 8, 2014 |
Current U.S.
Class: |
206/521 |
Current CPC
Class: |
H05K 13/0084
20130101 |
Class at
Publication: |
206/521 |
International
Class: |
B65D 81/107 20060101
B65D081/107 |
Foreign Application Data
Date |
Code |
Application Number |
Oct 17, 2013 |
KR |
10-2013-0124125 |
Claims
1. An apparatus for receiving a substrate, comprising: a frame
configured to form a space for receiving the substrate inside
thereof; a substrate supporting part coupled to one side of the
frame and configured to support the substrate inserted in the space
for receiving the substrate; and a shock-absorbing part arranged at
one side of the frame and configured to mitigate a drop impact of
the substrate.
2. The apparatus of claim 1, wherein the shock-absorbing part
comprises: a frame supporting part arranged in a lower area of the
frame and configured to support the frame; and a shock-absorbing
member coupled to the frame supporting part and arranged in
parallel to the substrate supporting part in the space for
receiving the substrate.
3. The apparatus of claim 2, wherein the frame supporting part
further comprises a receiving groove in which the shock-absorbing
member is received.
4. The apparatus of claim 2, wherein the shock-absorbing part
further comprises an elastic member arranged in the receiving
groove and configured to support the shock-absorbing part.
5. The apparatus of claim 1, wherein the frame comprises a
plurality of row bars and a plurality of column bars that are
connected with one another to form a hexahedral shape having an
open upper face.
6. The apparatus of claim 5, wherein the substrate supporting part
is connected to the row bars facing each other or the column bars
facing each other at a lower end of the frame.
7. The apparatus of claim 1, further comprising a substrate guide
part installed on a lateral side of the frame and configured to
guide a path through which the substrate is inserted.
8. The apparatus of claim 7, wherein the substrate guide part is
formed by being bent so as to form a guide groove in which the
substrate is inserted.
9. The apparatus of claim 8, wherein the substrate guide part
comprises a first bent part and a second bent part, the first bent
part and the second bent part being bent to form the guide
groove.
10. The apparatus of claim 9, wherein an angle of bend between the
first bent part and the second bent part of the substrate guide
part is varied along a lengthwise direction of the substrate guide
part.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of Korean Patent
Application No. 10-2013-0124125, filed with the Korean Intellectual
Property Office on Oct. 17, 2013, the disclosure of which is
incorporated herein by reference in its entirety.
BACKGROUND
[0002] 1. Technical Field
[0003] The present invention relates to an apparatus for receiving
a substrate.
[0004] 2. Background Art
[0005] As today's electronic devices become thinner, the printed
circuit board, in which electronic parts are installed, has
increasingly become thinner.
[0006] The printed circuit board is used for an electronic device
by forming a circuit pattern on one or both surfaces of a
substrate, which is made of synthetic resin, and then arranging an
electronic part on the substrate. Several fabrication processes are
undertaken for the printed circuit board in order to form the
circuit pattern. Here, the printed circuit board is received by an
apparatus for receiving a substrate for transportation and handling
of the printed circuit board in between the processes.
[0007] However, the thin printed circuit board is easily destroyed
by an impact when the printed circuit board is received by the
apparatus for receiving a substrate.
[0008] The related art of the present invention is disclosed in
Korea Patent Publication No. 2010-0068754 (A BASKET FOR SUPPORTING
A SUBSTRATE; laid open on Jun. 24, 2010).
SUMMARY
[0009] The present invention provides an apparatus for receiving a
substrate that can mitigate a drop impact of the substrate.
[0010] An aspect of the present invention features an apparatus for
receiving a substrate, which includes: a frame configured to form a
space for receiving the substrate inside thereof; a substrate
supporting part coupled to one side of the frame and configured to
support the substrate inserted in the space for receiving the
substrate; and a shock-absorbing part arranged at one side of the
frame and configured to mitigate a drop impact of the
substrate.
[0011] The shock-absorbing part can include: a frame supporting
part arranged in a lower area of the frame and configured to
support the frame; and a shock-absorbing member coupled to the
frame supporting part and arranged in parallel to the substrate
supporting part in the space for receiving the substrate.
[0012] The frame supporting part can also include a receiving
groove in which the shock-absorbing member is received.
[0013] The shock-absorbing part can also include an elastic member
arranged in the receiving groove and configured to support the
shock-absorbing part.
[0014] The frame can include a plurality of row bars and a
plurality of column bars that are connected with one another to
form a hexahedral shape having an open upper face.
[0015] The substrate supporting part can be connected to the row
bars facing each other or the column bars facing each other at a
lower end of the frame.
[0016] The apparatus for receiving a substrate can also include a
substrate guide part installed on a lateral side of the frame and
configured to guide a path through which the substrate is
inserted.
[0017] The substrate guide part can be formed by being bent so as
to form a guide groove in which the substrate is inserted.
[0018] The substrate guide part can include a first bent part and a
second bent part that are bent to form the guide groove.
[0019] An angle of bend between the first bent part and the second
bent part of the substrate guide part can be varied along a
lengthwise direction of the substrate guide part.
BRIEF DESCRIPTION OF THE DRAWINGS
[0020] FIG. 1 shows a disassembled state of an apparatus for
receiving a substrate in accordance with an embodiment of the
present invention.
[0021] FIG. 2 shows an assembled state of the apparatus for
receiving a substrate in accordance with an embodiment of the
present invention.
[0022] FIG. 3 shows the structure of a shock-absorbing part in
accordance with another embodiment of the present invention.
[0023] FIGS. 4 and 5 show the structure of a substrate guide part
in accordance with another embodiment of the present invention.
[0024] FIG. 6 is a cross-sectional view of FIG. 5 along the I-I'
line.
[0025] FIG. 7 is a cross-sectional view of FIG. 5 along the II-II'
line.
DETAILED DESCRIPTION
[0026] Since there can be a variety of permutations and embodiments
of the present invention, certain embodiments will be illustrated
and described with reference to the accompanying drawings. This,
however, is by no means to restrict the present invention to
certain embodiments, and shall be construed as including all
permutations, equivalents and substitutes covered by the ideas and
scope of the present invention. Throughout the description of the
present invention, when describing a certain technology is
determined to evade the point of the present invention, the
pertinent detailed description will be omitted.
[0027] Terms such as "first" and "second" can be used in describing
various elements, but the above elements shall not be restricted to
the above terms. The above terms are used only to distinguish one
element from the other.
[0028] The terms used in the description are intended to describe
certain embodiments only, and shall by no means restrict the
present invention. Unless clearly used otherwise, expressions in a
singular form include a meaning of a plural form. In the present
description, an expression such as "comprising" or "including" is
intended to designate a characteristic, a number, a step, an
operation, an element, a part or combinations thereof, and shall
not be construed to preclude any presence or possibility of one or
more other characteristics, numbers, steps, operations, elements,
parts or combinations thereof.
[0029] Hereinafter, certain embodiments of an apparatus for
receiving a substrate in accordance with the present invention will
be described in detail with reference to the accompanying drawings.
In describing certain embodiments of the present invention with
reference to the accompanying drawings, any identical or
corresponding elements will be assigned with same reference
numerals, and their redundant description will not be provided.
[0030] FIG. 1 shows a disassembled state of an apparatus for
receiving a substrate in accordance with an embodiment of the
present invention, and FIG. 2 shows an assembled state of the
apparatus for receiving a substrate in accordance with an
embodiment of the present invention.
[0031] Referring to FIGS. 1 and 2, the apparatus for receiving a
substrate in accordance with an embodiment of the present invention
includes a frame 110, a substrate supporting part 120, a substrate
guide part 130 and a shock-absorbing part 140.
[0032] The frame 110 provides space for receiving the substrate
inside thereof. Here, the frame 110 can include a plurality of row
bars 112, a plurality of column bars 114 and a plurality of posts
116 that are connected to one another. The frame 110 can be
cubically formed by having the plurality of row bars 112, the
plurality of column bars 114 and the plurality of posts 116
connected to one another.
[0033] The row bars 112 and the column bars 114 can be connected
with one another to form a top frame and a bottom frame, each
having the shape of a rectangular frame. The posts 116 connect the
top frame to the bottom frame to form a hexahedron. Here, each of
the row bars 112, column bars 114 and posts 116 can have a
cross-sectional girth shape of a circle, ellipse or polygon.
Moreover, in order to accommodate a substrate 50 being inserted
from above, the frame 110 can be formed in such a way that the
posts 116 are longer than a width and a height of the substrate
50.
[0034] In case the apparatus for receiving a substrate in
accordance with an embodiment of the present invention is used in
an etching process of the substrate, the frame 110 can be made of a
material that cannot be etched by an etchant. For example, the
frame 110 can be made of a metal that is not etched by an etchant,
but the material for the frame 110 is not restricted to what is
described herein, and the frame 110 can be made of a variety of
materials.
[0035] The substrate supporting part 120 is coupled to one side of
the frame 110 to support the inserted substrate 50 in the space for
receiving the substrate. Specifically, at least one substrate
supporting part 120 can be installed in a lower end of the frame
110. Moreover, the substrate supporting part 120 can support a
lower end of the substrate 50 being inserted. Here, the substrate
supporting part 120 can be extended in one direction and connected
to the row bars 112 facing each other or the column bars 114 facing
each other at the lower end of the frame 110.
[0036] The substrate supporting part 120 can include a fastening
groove 125, to which the substrate 50 is inserted. The fastening
groove 125 can be formed in an orthogonal direction to the
lengthwise direction of the substrate supporting part 120. The
substrate supporting part 120 can fasten the substrate 50 inserted
in the fastening groove 125. The substrate supporting part 120 can
prevent the substrate 50 inserted in the fastening groove 125 from
moving in the lengthwise direction of the substrate supporting part
120. Moreover, the substrate supporting part 120 can support a
plurality of inserted substrates 50 by keeping the substrates 50
separated so as not to collide with one another.
[0037] In case the apparatus for receiving a substrate in
accordance with an embodiment of the present invention is used in
an etching process of the substrate, the substrate supporting part
120 can be made of a material that cannot be etched by an etchant.
For example, the substrate supporting part 120 can be made of a
metal that is not etched by an etchant, but the material for the
substrate supporting part 120 is not restricted to what is
described herein, and the substrate supporting part 120 can be made
of a variety of materials.
[0038] The substrate guide part 130 provides a path through which
the substrate 50 is inserted. The substrate guide part 130 can be
installed in plurality facing one another on lateral sides of the
frame 110. The substrate guide part 130 can be arranged in parallel
with the post 116 and guide the substrate 50 being inserted from an
upper side of the frame 110. For this, the substrate guide part 130
can be bent in such a way that a guide groove 135, in which the
substrate 50 is inserted, is formed. For example, the substrate
guide part 130 can be formed by being bent in such a way that the
cross-section orthogonal to the lengthwise direction of the
substrate guide part 130 has a "U" shape. Here, the guide groove
135 can be extended in the lengthwise direction of the substrate
guide part 130.
[0039] The shock-absorbing part 140 is arranged on one side of the
frame 110 and mitigates a drop impact of the substrate 50.
Specifically, the shock-absorbing part 140 can include a frame
supporting part 142, which is arranged in a lower portion of the
frame 110 and supports the frame 110, and a shock-absorbing member
150, which is coupled to the frame supporting part 142 and
mitigates the drop impact.
[0040] The frame supporting part 142 supports the frame 110 and the
shock-absorbing member 150 from the lower portion of the frame 110.
Here, the frame supporting part 142 can have an area corresponding
to the frame 110 so as to support the frame 110.
[0041] The shock-absorbing member 150 can be extended in one
direction, and at least one of the shock-absorbing member 150 can
be arranged in the lower portion of the frame 110. Here, the
shock-absorbing part 150 can be coupled to the frame supporting
part 142 to be arranged in parallel with the substrate supporting
part 120. Alternatively, the shock-absorbing part 150 can be
received in a receiving groove 145, which is formed in the frame
supporting part 142, to be arranged in parallel with the substrate
supporting part 120. For this, the frame supporting part 142 can be
formed in such a way that the receiving groove 145 in which the
shock-absorbing member 150 is received is extended in parallel with
the frame supporting part 120. Here, the receiving groove 145 can
be formed to be bigger than the shock-absorbing part 140 so that
the shock-absorbing part 140 is inserted therein. Alternatively,
the receiving groove 145 can be stepped so that only a portion of
the shock-absorbing part 140 is inserted therein.
[0042] The shock-absorbing member 150 is arranged to be parallel to
the substrate supporting part 120 and can mitigate the drop impact
when the substrate 50 is inserted to the fastening groove 125 of
the substrate supporting part 120. Moreover, the shock-absorbing
member 150 can be formed to be slightly higher than a floor of the
fastening groove 125 of the substrate supporting part 120 in order
to mitigate the drop impact of the substrate 50. For example, as
shown in FIG. 1, a height H2 of the shock-absorbing member 150 can
be higher than a floor height H1 of the fastening groove 125 of the
substrate supporting member 120. Accordingly, the substrate 50
makes contact with the shock-absorbing member 150 before hitting
the floor of the fastening groove 125, thereby slowing the dropping
speed of the substrate 50 and dispersing the impact given to the
substrate 50.
[0043] The shock-absorbing member 150 can be made of an elastic
material so as to absorb a shock. Here, the shock-absorbing member
150 can be made of a shock-absorbing polymer material, such as
rubber or sponge, but the material for the shock-absorbing member
150 is not restricted to what is described herein, and the
shock-absorbing member 150 can be made of a variety of
materials.
[0044] The apparatus for receiving a substrate in accordance with
an embodiment of the present invention can mitigate the drop impact
of the substrate 50, prevent the substrate 50 from being damaged
and prevent foreign substances from being generated, by arranging
the shock-absorbing part 140 in the lower portion of the frame
110.
[0045] FIG. 3 shows the structure of a shock-absorbing part in
accordance with another embodiment of the present invention.
[0046] Referring to FIG. 3, the shock-absorbing part 140 in
accordance with another embodiment of the present invention
includes a frame supporting part 142, in which a receiving groove
145 configured to receive a shock-absorbing member 150 is formed,
and an elastic member 160, which is received in the receiving
groove 145 and elastically supports the shock-absorbing member
150.
[0047] At least one elastic member 160 can be arranged in the
receiving groove 145. Moreover, the elastic member 160 can be made
of an elastic material that disperses a shock received by the
shock-absorbing member 150 and supports the sock-absorbing member
150. For example, the elastic member 160 can include an elastic
material such as spring.
[0048] The shock-absorbing part 140 in accordance with another
embodiment of the present invention can mitigate the drop impact of
the substrate 50 more effectively.
[0049] FIGS. 4 and 5 show the structure of a substrate guide part
in accordance with another embodiment of the present invention.
FIG. 6 is a cross-sectional view of FIG. 5 along the I-I' line.
FIG. 7 is a cross-sectional view of FIG. 5 along the II-II'
line.
[0050] Referring to FIGS. 4 to 7, a substrate guide part 130 in
accordance with another embodiment of the present invention
includes a first bent part 132 and a second bent part 134 that are
bent to form a guide groove 135.
[0051] Here, the first bent part 132 and the second bent part 134
of the substrate guide part 130 can be bent to a predetermined
angle. Moreover, the angle of bend between the first bent part 132
and the second bent part 134 at a cross-section orthogonal to the
lengthwise direction of the substrate guide part 130 can be varied
along the lengthwise direction of the substrate guide part 130.
[0052] Specifically, as shown in FIG. 6, which illustrates a
cross-section at an upper area of the substrate guide part 130, the
angle of bend between the first bent part 132 and the second bent
part 134 can be set as a first angle (.theta.1), and the distance
between and end part of the first bent part 132 and an end part of
the second bent part 134 can be set as a first distance (L1).
Moreover, as shown in FIG. 7, which illustrates a cross-section at
a lower area of the substrate guide part 130, the angle of bend
between the first bent part 132 and the second bent part 134 can be
set as a second angle (.theta.2), and the distance between and end
part of the first bent part 132 and an end part of the second bent
part 134 can be set as a first distance (L2).
[0053] Here, in the substrate guide part 130 in accordance with
another embodiment of the present invention, the second angle
(.theta.2) can be smaller than the first angle (.theta.1).
Moreover, the second distance (L2) can be smaller than the first
distance (L1).
[0054] In the substrate guide part 130 in accordance with another
embodiment of the present invention, a cross-sectional area thereof
orthogonal to the lengthwise direction of the guide groove 135 can
be gradually smaller toward the lower area of the substrate guide
part 130, making it possible to slow down the dropping speed of the
inserted substrate. Therefore, the substrate guide part 130 in
accordance with another embodiment of the present invention can
mitigate the drop impact of the substrate.
[0055] Although certain embodiments of the present invention have
been described, it shall be appreciated that there can be a very
large number of permutations and modification of the present
invention by those who are ordinarily skilled in the art to which
the present invention pertains without departing from the technical
ideas and boundaries of the present invention, which shall be
defined by the claims appended below.
[0056] It shall be also appreciated that many other embodiments
other than the embodiments described above are included in the
claims of the present invention.
* * * * *