LEE; Sang-Youp

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEE; Sang-Youp.The latest application filed is for "package substrate and manufacturing method thereof".

Company Profile

1.15.26

LEE; Sang-Youp - Seoul KR
LEE; Sang-Youp - Suwon-si KR
Lee; Sang-Youp - Seongnam-si KR
Lee; Sang Youp - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package Substrate And Manufacturing Method Thereof App 20170084528 - LEE; Sang-Youp ; et al.	2017-03-23
Apparatus For Receiving Substrate App 20150108029 - LIM; Sung-Taek ; et al.	2015-04-23
Method of manufacturing and insulating sheet Grant 8,997,340 - Sohn , et al. April 7, 2	2015-04-07
Heat dissipating substrate and method of manufacturing the same Grant 8,926,714 - Lee , et al. January 6, 2	2015-01-06
Heat Dissipating Substrate And Method Of Manufacturing The Same App 20140165346 - LEE; Sang Youp ; et al.	2014-06-19
Heat dissipating substrate and method of manufacturing the same Grant 8,704,100 - Lee , et al. April 22, 2	2014-04-22
Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip Grant 8,647,926 - Shin , et al. February 11, 2	2014-02-11
Method of manufacturing a printed circuit board Grant 8,499,441 - Park , et al. August 6, 2	2013-08-06
Printed circuit board with reinforced thermoplastic resin layer Grant 8,450,618 - Sohn , et al. May 28, 2	2013-05-28
Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board Grant 8,397,378 - Sohn , et al. March 19, 2	2013-03-19
Method And Device For Dna Sequence Analysis Using Multiple Pna App 20120282709 - Lee; Byung Chul ; et al.	2012-11-08
Apparatus And Method For Providing Augmented Reality User Interface App 20120098859 - LEE; Hee-Ju ; et al.	2012-04-26
Method of manufacturing printed circuit board App 20120030938 - Park; Ho-Sik ; et al.	2012-02-09
Printed circuit board App 20120018195 - Park; Ho-Sik ; et al.	2012-01-26
Method of manufacturing insulating sheet and printed circuit board having the same App 20120012247 - Sohn; Keungjin ; et al.	2012-01-19
Printed circuit board App 20120012379 - Park; Ho-Sik ; et al.	2012-01-19
Printed circuit board with reinforced thermoplastic resin layer App 20110315437 - Sohn; Keung-Jin ; et al.	2011-12-29
Universal Serial Bus Type Wireless Data Card App 20110187623 - KIM; Jung-Hwan ; et al.	2011-08-04
Printed circuit board and manufacturing method of the same App 20110139499 - Park; Jung-Hwan ; et al.	2011-06-16
Metallic Laminate And Manufacturing Method Of Core Substrate Using The Same App 20110126970 - LEE; Sang-Youp ; et al.	2011-06-02
Printed Circuit Board And Manufacturing Method Thereof App 20110127073 - Ryu; Joung-Gul ; et al.	2011-06-02
Core Substrate And Method Of Manufacturing Core Substrate App 20110123772 - Lee; Sang-Youp ; et al.	2011-05-26
Heat Dissipating Substrate And Method Of Manufacturing The Same App 20110114369 - LEE; Sang Youp ; et al.	2011-05-19
Semiconductor plastic package and fabricating method thereof Grant 7,893,527 - Shin , et al. February 22, 2	2011-02-22
Method of fabricating semiconductor plastic package App 20100330747 - Shin; Joon-Sik ; et al.	2010-12-30
Metal core package substrate and method for manufacturing the same App 20090288293 - Lee; Sang Youp ; et al.	2009-11-26
Manufacturing an insulating sheet, a copper clad laminate, and a printed circuit board App 20090255714 - Sohn; Keung-Jin ; et al.	2009-10-15
Printed circuit board and manufacturing method thereof App 20090250253 - Park; Ho-Sik ; et al.	2009-10-08
Insulating sheet and printed circuit board having the same App 20090242248 - Sohn; Keungjin ; et al.	2009-10-01
Printed circuit board and manufacturing method of the same App 20090084595 - Park; Jung-Hwan ; et al.	2009-04-02
Semiconductor plastic package and fabricating method thereof App 20090026604 - Shin; Joon-Sik ; et al.	2009-01-29
Controlling apparatus and method for bit rate Grant 7,451,080 - Lee November 11, 2	2008-11-11
Laminate for printed circuit board and method of manufacturing the same App 20060257622 - Shin; Joon Sik ; et al.	2006-11-16
Apparatus and method for manufacturing copper clad laminate with improved peel strength App 20060124228 - Lee; Sang Youp ; et al.	2006-06-15
Controlling apparatus and method for bit rate App 20060018553 - Lee; Sang-Youp	2006-01-26

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