U.S. patent application number 14/200510 was filed with the patent office on 2015-03-12 for method of manufacturing magnetoresistive element.
The applicant listed for this patent is Satoshi INADA, Satoshi SETO, Kazuhiro TOMIOKA, Masatoshi YOSHIKAWA. Invention is credited to Satoshi INADA, Satoshi SETO, Kazuhiro TOMIOKA, Masatoshi YOSHIKAWA.
Application Number | 20150072439 14/200510 |
Document ID | / |
Family ID | 52463594 |
Filed Date | 2015-03-12 |
United States Patent
Application |
20150072439 |
Kind Code |
A1 |
TOMIOKA; Kazuhiro ; et
al. |
March 12, 2015 |
METHOD OF MANUFACTURING MAGNETORESISTIVE ELEMENT
Abstract
According to one embodiment, a method of manufacturing a
magnetoresistive element, the method includes forming a first
non-magnetic layer on a first magnetic layer, forming a second
magnetic layer on the first non-magnetic layer, forming a second
non-magnetic layer on the second magnetic layer, forming a third
magnetic layer on the second non-magnetic layer, patterning the
third magnetic layer by a RIE using an etching gas including a
noble gas and a nitrogen gas until a surface of the second
non-magnetic layer is exposed, and patterning the second
non-magnetic layer and the second magnetic layer after patterning
of the third magnetic layer.
Inventors: |
TOMIOKA; Kazuhiro; (Seoul,
KR) ; SETO; Satoshi; (Seoul, KR) ; YOSHIKAWA;
Masatoshi; (Seoul, KR) ; INADA; Satoshi;
(Yokohama-shi, JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
TOMIOKA; Kazuhiro
SETO; Satoshi
YOSHIKAWA; Masatoshi
INADA; Satoshi |
Seoul
Seoul
Seoul
Yokohama-shi |
|
KR
KR
KR
JP |
|
|
Family ID: |
52463594 |
Appl. No.: |
14/200510 |
Filed: |
March 7, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61877246 |
Sep 12, 2013 |
|
|
|
Current U.S.
Class: |
438/3 |
Current CPC
Class: |
H01L 43/12 20130101;
H01L 27/228 20130101 |
Class at
Publication: |
438/3 |
International
Class: |
H01L 43/12 20060101
H01L043/12 |
Claims
1. A method of manufacturing a magnetoresistive element, the method
comprising: forming a first non-magnetic layer on a first magnetic
layer; forming a second magnetic layer on the first non-magnetic
layer; forming a second non-magnetic layer on the second magnetic
layer; forming a third magnetic layer on the second non-magnetic
layer; patterning the third magnetic layer by a RIE using an
etching gas including a noble gas and a nitrogen gas until a
surface of the second non-magnetic layer is exposed; patterning the
second non-magnetic layer and the second magnetic layer after
patterning of the third magnetic layer; and patterning the first
non-magnetic layer and the first magnetic layer after patterning
the second magnetic layer.
2. The method of claim 1, further comprising: forming a nitrogen
compound of a nitrogen in the nitrogen gas and an element in the
second non-magnetic layer on the surface of the second non-magnetic
layer, when the surface of the second non-magnetic layer is exposed
in the patterning of the third magnetic layer.
3. The method of claim 1, further comprising: patterning the second
non-magnetic layer and the second magnetic layer by one of a RIE
using an etching gas including a noble gas and not including a
nitrogen gas, and a physical etching.
4. The method of claim 1, further comprising: patterning a lower
portion of the third magnetic layer by the RIE using the etching
gas including the noble gas and the nitrogen gas until the surface
of the second non-magnetic layer is exposed, after patterning an
upper portion of the third magnetic layer by one of a RIE using an
etching gas including a noble gas and not including a nitrogen gas,
and a physical etching.
5. The method of claim 1, wherein the etching gas does not include
an oxygen gas and a oxygen compound gas.
6. The method of claim 1, wherein the first magnetic layer is a
storage layer with a perpendicular and variable magnetization, and
the second magnetic layer is a reference layer with a perpendicular
and invariable magnetization.
7. The method of claim 1, wherein the second non-magnetic layer
includes one of Ta, W, Ti, Nb, Hf, Al, and B.
8. The method of claim 1, further comprising: forming a sidewall
insulating layer on a sidewall of the second magnetic layer after
patterning the second magnetic layer; and patterning the first
magnetic layer after forming the sidewall insulating layer.
9. The method of claim 1, further comprising: patterning the second
non-magnetic layer and the second magnetic layer in a chamber by
changing a gas in the chamber, after patterning the third magnetic
layer in the chamber.
10. The method of claim 1, further comprising: patterning the third
magnetic layer in a first chamber; transferring the
magnetoresistive element from the first chamber to a second chamber
in a state of being non-oxidized the magnetoresistive element; and
patterning the second non-magnetic layer and the second magnetic
layer in the second chamber.
11. A method of manufacturing a magnetoresistive element, the
method comprising: forming a non-magnetic layer on a first magnetic
layer; forming a second magnetic layer on the non-magnetic layer,
the second magnetic layer including CoFeX, where X is one of Ta, W,
Ti, Nb, Hf, Al, and B; forming a third magnetic layer on the second
magnetic layer; patterning the third magnetic layer by a RIE using
an etching gas including a noble gas and a nitrogen gas until a
surface of the second magnetic layer is exposed; patterning the
second magnetic layer after patterning of the third magnetic layer;
and patterning the non-magnetic layer and the first magnetic layer
after patterning the second magnetic layer.
12. The method of claim 11, further comprising: forming a nitrogen
compound of a nitrogen in the nitrogen gas and an element in the
second magnetic layer on the surface of the second magnetic layer,
when the surface of the second magnetic layer is exposed in the
patterning of the third magnetic layer.
13. The method of claim 11, further comprising: patterning the
second magnetic layer by one of a RIE using an etching gas
including a noble gas and not including a nitrogen gas, and a
physical etching.
14. The method of claim 11, further comprising: patterning a lower
portion of the third magnetic layer by the RIE using the etching
gas including the noble gas and the nitrogen gas until the surface
of the second magnetic layer is exposed, after patterning an upper
portion of the third magnetic layer by one of a RIE using an
etching gas including a noble gas and not including a nitrogen gas,
and a physical etching.
15. The method of claim 11, wherein the etching gas does not
include an oxygen gas and a oxygen compound gas.
16. The method of claim 11, wherein the first magnetic layer is a
storage layer with a perpendicular and variable magnetization, and
the second magnetic layer is a reference layer with a perpendicular
and invariable magnetization.
17. The method of claim 16, wherein the third magnetic layer is a
shift cancelling layer.
18. The method of claim 11, further comprising: forming a sidewall
insulating layer on a sidewall of the second magnetic layer after
patterning the second magnetic layer; and patterning the first
magnetic layer after forming the sidewall insulating layer.
19. The method of claim 11, further comprising: patterning the
second magnetic layer in a chamber by changing a gas in the
chamber, after patterning the third magnetic layer in the
chamber.
20. The method of claim 11, further comprising: patterning the
third magnetic layer in a first chamber; transferring the
magnetoresistive element from the first chamber to a second chamber
in a state of being non-oxidized the magnetoresistive element; and
patterning the second magnetic layer in the second chamber.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the benefit of U.S. Provisional
Application No. 61/877,246, filed Sep. 12, 2013, the entire
contents of which are incorporated herein by reference.
FIELD
[0002] Embodiments described herein relate generally to a method of
manufacturing a magnetoresistive element.
BACKGROUND
[0003] An MRAM (magnetic random access memory) chip employed as a
nonvolatile semiconductor storage uses a magnetoresistive element
as a storage element. The magnetoresistive element has a structure
in which a tunnel barrier layer (non-magnetic layer) is sandwiched
between a storage layer (magnetic layer) and a reference layer
(magnetic layer).
BRIEF DESCRIPTION OF THE DRAWINGS
[0004] FIG. 1 is a cross-sectional view showing an example of a
magnetoresistive element;
[0005] FIG. 2 to FIG. 9 are cross-sectional views showing a
manufacturing method of a first embodiment;
[0006] FIG. 10 to FIG. 12 are cross-sectional views showing a
manufacturing method of a second embodiment;
[0007] FIG. 13 is a cross-sectional view showing an example of a
magnetoresistive element;
[0008] FIG. 14 to FIG. 16 are cross-sectional views showing a
manufacturing method of a third embodiment;
[0009] FIG. 17 is a cross-sectional view showing an example of a
magnetoresistive element;
[0010] FIG. 18 to FIG. 21 are cross-sectional views showing a
manufacturing method of a fourth embodiment;
[0011] FIG. 22 is a cross-sectional view showing an example of a
magnetoresistive element;
[0012] FIG. 23 to FIG. 25 are cross-sectional views showing a
manufacturing method of a fifth embodiment;
[0013] FIG. 26 to FIG. 28 are block diagrams showing an example of
a multi-chamber;
[0014] FIG. 29 is an illustration showing an example of a
manufacturing device executing RIE;
[0015] FIG. 30 is a block diagram showing an example of a magnetic
random access memory; and
[0016] FIG. 31 is a cross-sectional view showing an example of a
memory cell.
DETAILED DESCRIPTION
[0017] In general, according to one embodiment, a method of
manufacturing a magnetoresistive element, the method comprises:
forming a first non-magnetic layer on a first magnetic layer;
forming a second magnetic layer on the first non-magnetic layer;
forming a second non-magnetic layer on the second magnetic layer;
forming a third magnetic layer on the second non-magnetic layer;
patterning the third magnetic layer by a RIE using an etching gas
including a noble gas and a nitrogen gas until a surface of the
second non-magnetic layer is exposed; patterning the second
non-magnetic layer and the second magnetic layer after patterning
of the third magnetic layer; and patterning the first non-magnetic
layer and the first magnetic layer after patterning the second
magnetic layer.
[0018] The embodiments will be hereinafter described with reference
to the attached drawings.
First Embodiment
[0019] Underlayer UL is disposed on lower electrode LE. First
magnetic layer 11 is disposed on underlayer UL. Non-magnetic layer
(tunnel barrier layer) 12 is disposed on first magnetic layer 11.
Second magnetic layer 13 is disposed on non-magnetic layer 12.
Non-magnetic layer (etching stopper layer) 14 is disposed on second
magnetic layer 13. Shift cancel layer SCL is disposed on
non-magnetic layer 14. Cap layer CAP is disposed on shift cancel
layer SCL. Hard mask layer HM is disposed on cap layer CAP.
[0020] Side wall insulating layers (side wall mask layers) SWM are
disposed on non-magnetic layer 12 to cover the side walls of hard
mask layer HM, cap layer CAP, shift cancel layer SCL, non-magnetic
layer 14 and second magnetic layer 13. Protective layer PL is
formed on lower electrode LE to cover the magnetoresistive
element.
[0021] One of first magnetic layer 11 and second magnetic layer 13
is a storage layer having variable magnetization while the other is
a reference layer having invariable magnetization. First magnetic
layer 11 and second magnetic layer 13 may be in a perpendicular
magnetization type having perpendicular magnetization or an
in-plane magnetization type having in-plane magnetization.
[0022] Shift cancel layer SCL can cancel a stray magnetic field
from reference layer 13 applied to storage layer 11 when, for
example, first magnetic layer 11 is a storage layer and second
magnetic layer 13 is a reference layer. Therefore, for example,
when the storage layer and the reference layer are in the
perpendicular magnetization type, shift cancel layer SCL also
comprises a magnetic layer in the perpendicular magnetization
type.
[0023] The variable magnetization indicates that the direction of
magnetization is variable to a predetermined rite current, and the
invariable magnetization indicates that the direction of
magnetization is invariable to a predetermined rite current.
[0024] First magnetic layer 11 and second magnetic layer 13
contain, for example, CoFeB. Shift cancel layer SCL contains, for
example, any one of CoPt, CoFe, PtMn, and NiFe.
[0025] First magnetic layer 11, second magnetic layer 13 and shift
cancel layer SCL may contain disordered alloy, artificial lattice,
ferrimagnet or a combination thereof.
[0026] (1) Examples of Disordered Alloy
[0027] Alloy containing cobalt (Co) as a main component and at
least one element of chrome (Cr), tantalum (Ta), niobium (Nb),
vanadium (V), tungsten (W), hafnium (Hf), titanium (Ti), zirconium
(Zr), platinum (Pt), palladium (Pd), iron (Fe), and nickel
(Ni).
[0028] For example, CoCr alloy, CoPt alloy, CoCrTa alloy, CoCrPt
alloy, CoCrPtTa alloy, CoCrNb alloy, etc. are included in this
group. In these alloys, a magnetic anisotropy energy density and a
saturation magnetization are controlled, based on a rate of
non-magnetic elements.
[0029] (2) Examples of Artificial Lattice
[0030] Laminate formed by alternately stacking a layer of a metal
containing at least one element of iron (Fe), cobalt (Co) and
nickel (Ni) and a layer of a metal containing at least one element
of chrome (Cr), platinum (Pt), palladium (Pd), iridium (Ir),
rhodium (Rh), ruthenium (Ru), osmium (Os), rhenium (Re), gold (Au),
and copper (Cu).
[0031] For example, Co/Pt artificial lattice, Co/Pd artificial
lattice, CoCr/Pt artificial lattice, Co/Ru artificial lattice,
Co/Os artificial lattice, Co/Au, Ni/Cu artificial lattice, and the
like are included in this group. In these materials, A/B indicates
alternately stacking two or more layers of A and B. In these
artificial lattices, the magnetic anisotropy energy density and the
saturation magnetization are controlled, based on the type of the
elements added to the magnetic layers, a ratio in thickness between
the magnetic layers and the non-magnetic layers, and the like.
[0032] (3) Examples of Ferrimagnet
[0033] Alloy of noble-earth metals and transition metals, and
amorphous alloys containing, for example, terbium (Tb), dysprosium
(Dy) or gadolinium (Gd), and at least one element of transition
metals.
[0034] For example, TbFe, TbCo, TbFeCo, DyTbFeCo, GdTbCo, etc. are
included in this group. In these alloys, the magnetic anisotropy
energy density and the saturation magnetization are controlled,
based on a composition ratio.
[0035] Hard mask layer HM contains, for example, one of W, Ta, TaN,
Ti, TiN, Ru, C (containing diamond-like carbon and graphite
carbon), Al, AlN and AlO. Cap layer CAP contains, for example, one
of Pt, W, Ta and Ru.
[0036] Non-magnetic layer 12 serving as a tunnel barrier layer is
an insulator and contains, for example, one of MgO and AlO.
Non-magnetic layer 14 serving as an etching stopper layer is an
insulator and contains, for example, one of Ta, W, Ti, Nb, Hf, Al
and B.
[0037] Underlayer UL contains, for example, one of Hf, AlN, and
TaAlN, and lower electrode LE contains, contains, for example, one
of W, Ta, TaN, Ti, and TiN. Side wall insulating layers SWM and
protective layer PL comprise insulator layers of, for example,
silicon nitride, silicon oxide, etc.
[0038] A structure shown in FIG. 1 is formed by, for example, a
first patterning process using hard mask layer HM as a mask and a
second patterning process using hard mask layer HM and side wall
insulating layers SWM as masks.
[0039] In the first patterning process, cap layer CAP, shift cancel
layer SCL, non-magnetic layer 14 and second magnetic layer 13 are
etched. In the second patterning process, non-magnetic layer 12,
first magnetic layer 11 and underlayer UL are etched. Protective
layer PL is formed after the first and second patterning
processes.
[0040] In the first patterning process, stopping the etching of
second magnetic layer 13 on the surface of non-magnetic layer
(tunnel barrier layer) 12, what is called "stop on tunnel barrier",
is important. This is because, if non-magnetic layer 12 is etched
and first magnetic layer 11 is further etched in the first
patterning process, once evaporated materials of first magnetic
layer 11 and second magnetic layer 13 are re-deposited on the side
walls of non-magnetic layer 12 and cause a short circuit to occur
in first magnetic layer 11 and second magnetic layer 13.
[0041] In the first embodiment, non-magnetic layer 14 is disposed
as an etching stopper layer on second magnetic layer 13 to
certainly execute "stop on tunnel barrier". Thus, in the first
patterning process, cap layer CAP, shift cancel layer SCL,
non-magnetic layer 14 and second magnetic layer 13 are not
sequentially etched at one time, but a first step of etching all
portions of cap layer CAP and some portions of shift cancel layer
SCL (up to a middle level), a second step of etching a remaining
portion of shift cancel layer SCL, and a third step of etching
non-magnetic layer 14 and second magnetic layer 13 are
executed.
[0042] By thus dividing the first patterning process into three
steps, "stop on tunnel barrier" may be certainly executed in the
third step. In the third step, since non-magnetic layer 14 and
second magnetic layer 13 having a sufficiently smaller thickness
than a total thickness of cap layer CAP, shift cancel layer SCL,
non-magnetic layer 14 and second magnetic layer 13 are only etched,
"stop on tunnel barrier" can be certainly executed by control of
the etching time, etc.
[0043] For example, a time to etch non-magnetic layer 14 and second
magnetic layer 13 is set at a value at which they can be completely
removed, i.e., an ideal value +.alpha., by considering variation in
manufacturing, etc. In this case, too, since a total thickness of
non-magnetic layer 14 and second magnetic layer 13 is sufficiently
small, the value of .alpha. is also sufficiently small.
[0044] Therefore, even if the variation in manufacturing enables
non-magnetic layer 12 serving as the tunnel barrier to be etched,
at the worst, the portion of non-magnetic layer 12 which is not
covered with hard mask layer HM is not thereby completely
removed.
[0045] An interface layer (magnetic layer) may be disposed between
non-magnetic layer 12 and second magnetic layer 13, in the first
embodiment. However, the interface layer is sufficiently thinner
than second magnetic layer 13.
[0046] In addition, in the first embodiment, the laminated
structure on non-magnetic layer 12 serving as the tunnel barrier
layer includes second magnetic layer 13, non-magnetic layer 14 and
shift cancel layer SCL. However, shift cancel layer SCL may be a
third magnetic layer different from shift cancel layer SCL. In
other words, the laminated structure on non-magnetic layer 12 may
be a structure of magnetic layer/non-magnetic layer/magnetic
layer.
[0047] Incidentally, in the first embodiment, each of the first,
second and third steps needs to be improved to execute the first
patterning process at three steps as described above. Then, an
example of a manufacturing method to obtain the structure shown in
FIG. 1 will be hereinafter described. The first, second and third
steps will be described in detail, in the example of the
manufacturing method.
[0048] FIG. 2 to FIG. 9 show an example of a manufacturing method
for obtaining the structure shown in FIG. 1.
[0049] First, underlayer UL is formed on lower electrode LE, first
magnetic layer 11 is formed on underlayer UL, non-magnetic layer
(tunnel barrier layer) 12 is formed on first magnetic layer 11, and
second magnetic layer 13 is formed on non-magnetic layer 12, as
shown in FIG. 2.
[0050] Subsequently, non-magnetic layer 14 and shift cancel layer
SCL are formed on second magnetic layer 13, cap layer CAP is formed
on shift cancel layer SCL, and hard mask layer HM is formed on cap
layer CAP.
[0051] Next, the first patterning process is executed. The first
patterning process comprises a first step, a second step and a
third step.
[0052] First, the first step is executed as shown in FIG. 3. In the
first step, all the portions of cap layer CAP are etched and some
portions of shift cancel layer SCL are etched (up to a middle
level), by using hard mask layer HM as a mask.
[0053] The etching is not specifically limited, but can be executed
by physical etching, for example, IBE, RIE using a noble gas, a
combination thereof, etc. It is desirable, however, that the gas
used for the etching should not contain oxygen gas or an oxidizing
gas such as oxygen compound gas to prevent oxidization of the
magnetoresistive element.
[0054] An etching time of cap layer CAP and shift cancel layer SCL
is controlled so as to prevent shift cancel layer SCL at a portion
which is not covered with hard mask layer HM from being completely
removed, in the first step. For example, the etching time may be
shorter than an ideal value of an etching time to completely etch
cap layer CAP and shift cancel layer SCL.
[0055] Consequently, all the portions of cap layer CAP are etched
and some portions of shift cancel layer SCL are etched (up to a
middle level), in the first step, as shown in FIG. 3.
[0056] Next, the second step is executed as shown in FIG. 4. In the
second step, a remainder of shift cancel layer SCL is etched by
using hard mask layer HM as a mask.
[0057] This etching is executed for the purpose of certainly
stopping the etching of shift cancel layer SCL when a surface of
non-magnetic layer 14 serving as the etching stopper layer is
exposed. For this reason, this etching is executed by RIE using a
noble gas and a non-oxidizing gas which contains nitrogen gas. The
non-oxidizing gas indicates a gas which does not contain oxygen gas
or an oxidizing gas such as an oxygen compound gas.
[0058] A reason why the etching of shift cancel layer SCL can be
certainly stopped by RIE using a noble gas and a non-oxidizing gas
which contains nitrogen gas when the surface of non-magnetic layer
14 serving as the etching stopper layer is exposed, will be
hereinafter explained.
[0059] The noble gas (for example, Ar gas) physically etches shift
cancel layer SCL by colliding with shift cancel layer SCL. In other
words, the noble gas is mainly used for the purpose of
anisotropically etching shift cancel layer SCL.
[0060] In addition, nitrogen gas reacts with elements (Ta, W, Ti,
Nb, Hf, Al, B, etc.) constituting non-magnetic layer 14 and forms
nitride 14N, when the surface of non-magnetic layer 14 is exposed.
Nitride 14N is formed to cover an overall surface of non-magnetic
layer 14 when the surface of non-magnetic layer 14 is exposed. In
other words, nitrogen gas is mainly used for the purpose of
preventing the etching of non-magnetic layer 14, by forming nitride
14N serving as an etching protective layer on the surface of
non-magnetic layer 14, in the second step.
[0061] For this reason, in the second step, the etching of shift
cancel layer SCL can be certainly stopped when the surface of
non-magnetic layer 14 serving as the etching stopper layer is
exposed.
[0062] Non-magnetic layer 14 serves as the etching stopper layer in
the second step as described above, but it is desirable that
non-magnetic layer 14 should be set to have a thickness affecting
no magnetic or electric characteristic of the magnetoresistive
element, for example, a thickness of not greater than 1 nm.
[0063] Examples of etching conditions in the second step are
described below:
[Conditions]
[0064] Noble gas: Ar gas (50 sccm-1,000 sccm) [0065] Nitrogen gas:
N.sub.2 gas (5 sccm-200 sccm) [0066] Bias power: 100 W-500 W [0067]
Pressure in chamber: 1 Pa-2 Pa (for example, 1.33 Pa)
[0068] Next, the third step is executed. In the third step,
non-magnetic layer 14 and second magnetic layer 13 are etched by
using hard mask layer HM as a mask. In this etching, non-magnetic
layer 14 and second magnetic layer 13 have only to be etched as
described above. Accordingly, the etching can be certainly stopped,
i.e., "stop on barrier layer" can be implemented when a surface of
non-magnetic layer 12 serving as the tunnel barrier layer is
exposed, as shown in FIG. 5.
[0069] The etching is not specifically limited, but can be executed
by physical etching, for example, IBE, RIE using a noble gas, a
combination thereof, etc. It is desirable, however, that the gas
used for the etching should not contain oxygen gas or an oxidizing
gas such as oxygen compound gas to prevent oxidization of the
magnetoresistive element.
[0070] Thus, in the first patterning process, "stop on barrier
layer" can be certainly implemented in the patterning of the
magnetoresistive element since the etching of cap layer CAP, shift
cancel layer SCL, non-magnetic layer 14, and second magnetic layer
13 is executed in three steps, i.e., the first step, the second
step and the third step.
[0071] Table 1 shows a summary of the first patterning process.
TABLE-US-00001 TABLE 1 First Patterning process A Upper layer
.uparw. Cap layer CAP RIE with noble gas or Layer Shift cancel
layer SCL Ion beam etching (IBE) Lower layer .dwnarw. Non-magnetic
layer 14 RIE with noble gas and Second magnetic layer 13 Nitrogen
gas RIE with noble gas or Ion beam etching (IBE)
[0072] Next, insulating layer (for example, silicon nitride) I to
cover hard mask layer HM, cap layer CAP, shift cancel layer SCL,
non-magnetic layer 14 and second magnetic layer 13 is formed by,
for example, CVD, as shown in FIG. 6.
[0073] Subsequently, side wall insulating layers (side wall mask
layers) SWM to cover side walls of hard mask layer HM, cap layer
CAP, shift cancel layer SCL, non-magnetic layer 14 and second
magnetic layer 13 are formed as shown in FIG. 7, by etching
insulating layer I in the etching method such as IBE and RIE.
[0074] Next, the second patterning process is executed as shown in
FIG. 8. In the second pattering process, non-magnetic layer 12,
first magnetic layer 11 and underlayer UL are etched by using hard
mask layer HM and side wall insulating layers SWM as masks.
[0075] The second patterning process is executed by a combination
of the physical etching such as IBE and RIE using a noble gas.
[0076] Table 2 shows a combination of etching methods which can be
selected in the second patterning process.
TABLE-US-00002 TABLE 2 Second patterning process A B C D Upper
layer .uparw. Non-magnetic layer 12 IBE RIE IBE IBE Layer First
magnetic layer 11 RIE RIE Lower layer .dwnarw. Foundation layer
UL
[0077] Since the second patterning process can be executed by a
well-known technique, explanation of the second patterning process
is omitted here.
[0078] Finally, protective layer (for example, silicon nitride) PL
to cover the magnetoresistive element is formed on lower electrode
LE as shown in FIG. 9.
[0079] The structure shown in FIG. 1 is completed in the
above-described steps.
[0080] According to the First Embodiment, the etching of second
magnetic layer 13 can be certainly stopped on the surface of
non-magnetic layer 12, i.e., what is called "stop on barrier layer"
can be certainly implemented as compared with executing the first
patterning process by the physical etching, for example, IBE, RIE
using halogen gas, etc.
Second Embodiment
[0081] Second Embodiment is a modified example of the first
patterning process of the First Embodiment. The Second Embodiment
is characterized in that the first patterning process comprises a
first step and a second step. In other words, the first patterning
process is executed in two steps, in the Second Embodiment. Since
the Second Embodiment is the same as the First Embodiment in view
of the other portions, the first patterning process alone will be
described here.
[0082] FIG. 10 to FIG. 12 show an example of a manufacturing method
for obtaining the structure shown in FIG. 1.
[0083] First, underlayer UL is formed on lower electrode LE, first
magnetic layer 11 is formed on underlayer UL, non-magnetic layer
(tunnel barrier layer) 12 is formed on first magnetic layer 11, and
second magnetic layer 13 is formed on non-magnetic layer 12, as
shown in FIG. 10.
[0084] Subsequently, non-magnetic layer 14 and shift cancel layer
SCL are formed on second magnetic layer 13, cap layer CAP is formed
on shift cancel layer SCL, and hard mask layer HM is formed on cap
layer CAP.
[0085] Next, the first patterning process is executed. The first
patterning process comprises a first step and a second step.
[0086] First, the first step is executed as shown in FIG. 11. In
the first step, cap layer CAP and shift cancel layer SCL are etched
by using hard mask layer HM as a mask.
[0087] This etching is executed for the purpose of certainly
stopping the etching of cap layer CAP and shift cancel layer SCL
when a surface of non-magnetic layer 14 serving as the etching
stopper layer is exposed. For this reason, this etching is executed
by RIE using a noble gas and a non-oxidizing gas which contains
nitrogen gas.
[0088] In this etching, nitride 14N of elements (Ta, W, Ti, Nb, Hf,
Al, B, etc.) constituting non-magnetic layer 14 is formed on a
surface of non-magnetic layer 14.
[0089] Next, the second step is executed. In the second step,
non-magnetic layer 14 and second magnetic layer 13 are etched by
using hard mask layer HM as a mask. In this etching, non-magnetic
layer 14 and second magnetic layer 13 have only to be etched as
described above. Accordingly, the etching can be certainly stopped
when a surface of non-magnetic layer 12 serving as the tunnel
barrier layer is exposed, i.e., "stop on barrier layer" can be
implemented, as shown in FIG. 12.
[0090] Thus, in the first patterning process, "stop on barrier
layer" can be certainly implemented in the patterning of the
magnetoresistive element since the etching of cap layer CAP, shift
cancel layer SCL, non-magnetic layer 14, and second magnetic layer
13 is executed in two steps, i.e., the first step and the second
step.
[0091] Table 3 shows a summary of the first patterning process.
TABLE-US-00003 TABLE 3 First Patterning process B Upper layer
.uparw. Cap layer CAP RIE with noble gas and Layer Shift cancel
layer SCL Nitrogen gas Lower layer .dwnarw. Non-magnetic layer 14
RIE with noble gas or Second magnetic layer Ion beam etching (IBE)
13
[0092] Since a subsequent process is the same as that in the First
Embodiment (FIG. 6 to FIG. 9), an explanation of the subsequent
process is omitted here.
[0093] The structure shown in FIG. 1 is completed in the
above-described steps.
[0094] According to the Second Embodiment, the etching of second
magnetic layer 13 can be certainly stopped on the surface of
non-magnetic layer 12, i.e., what is called "stop on barrier layer"
can be certainly implemented as compared with executing the first
patterning process by the physical etching, for example, IBE, RIE
using halogen gas, etc.
Third Embodiment
[0095] Third Embodiment is a modified embodiment of the First and
Second Embodiments.
[0096] The Third Embodiment is characterized in that second
magnetic layer 13 has first and second layers (magnetic layers) 13a
and 13b and non-magnetic layer 14' is disposed as an etching
stopper layer between first layer 13a and second layer 13b, as
compared with the First and Second Embodiments.
[0097] In this case, non-magnetic layer 14 between second magnetic
layer 13 and shift cancel layer SCL in the First and Second
Embodiments (see FIG. 1) may be omitted or left as it is. In the
Third Embodiment, an example of omitting non-magnetic layer 14
between second magnetic layer 13 and shift cancel layer SCL will be
described. An example of leaving non-magnetic layer 14 between
second magnetic layer 13 and shift cancel layer SCL as it is will
be described in Fourth Embodiment.
[0098] FIG. 13 shows a magnetoresistive element according to the
Third Embodiment.
[0099] Second magnetic layer 13 comprises first layer 13a on
non-magnetic layer 12 serving as a tunnel barrier layer,
non-magnetic layer 14' on first layer 13a, and second layer 13b on
non-magnetic layer 14'. Shift cancel layer SCL is disposed on
second layer 13b in second magnetic layer 13.
[0100] First layer 13a and second layer 13b contain, for example,
CoFeB. In addition, first layer 13a and second layer 13b may
contain the disordered alloy, artificial lattice, ferrimagnet, or a
combination thereof.
[0101] Non-magnetic layer 14' serving as an etching stopper layer
is a conductor and contains one of, for example, Ta, W, Ti, Nb, Hf,
Al, and B. It is desirable that non-magnetic layer 14' should be
set to have a thickness affecting no magnetic or electric
characteristic of the magnetoresistive element, for example, a
thickness of not greater than 1 nm.
[0102] Since the Third Embodiment is the same as the First and
Second Embodiments in view of the other portions, the same
components as those of the structure shown in FIG. 1 are denoted by
the same reference numbers and their explanations are omitted
here.
[0103] FIG. 14 to FIG. 16 show an example of a manufacturing method
for obtaining the structure shown in FIG. 13.
[0104] First, underlayer UL is formed on lower electrode LE, first
magnetic layer 11 is formed on underlayer UL, non-magnetic layer
(tunnel barrier layer) 12 is formed on first magnetic layer 11,
first layer 13a is formed on non-magnetic layer 12, non-magnetic
layer (etching stopper layer) 14' is formed on first layer 13a, and
second layer 13b is formed on non-magnetic layer 14', as shown in
FIG. 14.
[0105] Subsequently, shift cancel layer SCL is formed on second
layer 13b, cap layer CAP is formed on shift cancel layer SCL, and
hard mask layer HM is formed on cap layer CAP.
[0106] Next, a first patterning process is executed. The process
described in the First and Second Embodiments can be employed as
the first patterning process.
[0107] Table 4 shows the first patterning process.
TABLE-US-00004 TABLE 4 First Patterning process A Upper layer
.uparw. Cap layer CAP and Shift RIE with noble gas, RIE Layer
cancel layer SCL with noble gas and Lower layer .dwnarw. Second
layer 13b in Nitrogen gas, or second magnetic layer 13 Ion beam
etching (IBE) Non-magnetic layer 14' RIE with noble gas and First
layer 13a in Nitrogen gas second magnetic layer 13 RIE with noble
gas or Ion beam etching (IBE)
[0108] The first patterning process can be executed in two or three
steps as shown in Table 4.
[0109] Cap layer CAP and shift cancel layer SCL can be etched by
physical etching, for example, IBE, RIE using a noble gas, RIE
using a noble gas and nitrogen gas, etc. It is desirable, however,
that the gas used for the etching should not contain oxygen gas or
an oxidizing gas such as oxygen compound gas.
[0110] Similarly, an upper portion of second layer 13b in second
magnetic layer 13 can be etched by physical etching, for example,
IBE, RIE using a noble gas, RIE using a noble gas and nitrogen gas,
etc. However, a lower portion of second layer 13b in second
magnetic layer 13 is etched by the RIE using a noble gas and
nitrogen gas.
[0111] In other words, at least the etching of the lower portion of
second layer 13b is executed by the RIE using a noble gas and a
non-oxidizing gas containing nitrogen gas, for the purpose of
certainly stopping the etching of second layer 13b when a surface
of non-magnetic layer 14' serving as the etching stopper layer is
exposed. In this etching, nitride 14'N of elements (Ta, W, Ti, Nb,
Hf, Al, B, etc.) constituting non-magnetic layer 14' is formed on
the surface of non-magnetic layer 14' as described in the First and
Second Embodiments.
[0112] Consequently, a structure shown in FIG. 15 can be
obtained.
[0113] After this, non-magnetic layer 14' and first layer 13a are
etched by using hard mask layer HM as a mask.
[0114] In this etching, non-magnetic layer 14' and first layer 13a
have only to be etched.
[0115] Accordingly, the etching can be certainly stopped when a
surface of non-magnetic layer 12 serving as the tunnel barrier
layer is exposed, i.e., "stop on barrier layer" can be implemented,
as shown in FIG. 16.
[0116] Since a subsequent process is the same as that in the First
Embodiment (FIG. 6 to FIG. 9), an explanation of the subsequent
process is omitted here.
[0117] The structure shown in FIG. 13 is completed in the
above-described steps.
[0118] According to the Third Embodiment, the etching of second
magnetic layer 13 can be certainly stopped on the surface of
non-magnetic layer 12, i.e., what is called "stop on barrier layer"
can be certainly implemented as compared with executing the first
patterning process by the physical etching, for example, IBE, RIE
using halogen gas, etc.
Fourth Embodiment
[0119] In Fourth Embodiment, non-magnetic layer 14 is further
disposed between second magnetic layer 13 and shift cancel layer
SCL in the Third Embodiment. In other words, two layers,
non-magnetic layers 14 and 14' serving as etching stopper layers
are disposed in this embodiment.
[0120] FIG. 17 shows a magnetoresistive element according to the
Fourth Embodiment.
[0121] Second magnetic layer 13 comprises first layer 13a on
non-magnetic layer 12 serving as a tunnel barrier layer,
non-magnetic layer 14' on first layer 13a, and second layer 13b on
non-magnetic layer 14'. Non-magnetic layer 14 is disposed on second
layer 13b in second magnetic layer 13, and shift cancel layer SCL
is disposed on non-magnetic layer 14.
[0122] Non-magnetic layers 14 and 14' serving as etching stopper
layers are conductors and contain one of, for example, Ta, W, Ti,
Nb, Hf, Al, and B. It is desirable that each of non-magnetic layers
14 and 14' should be set to have a thickness affecting no magnetic
or electric characteristic of the magnetoresistive element, for
example, a thickness of not greater than 1 nm.
[0123] Since the Fourth Embodiment is the same as the Third
Embodiment in view of the other portions, the same components as
those of the structure shown in FIG. 13 are denoted by the same
reference numbers and their explanations are omitted here.
[0124] FIG. 18 to FIG. 21 show an example of a manufacturing method
for obtaining the structure shown in FIG. 17.
[0125] First, underlayer UL is formed on lower electrode LE, first
magnetic layer 11 is formed on underlayer UL, non-magnetic layer
(tunnel barrier layer) 12 is formed on first magnetic layer 11,
first layer 13a is formed on non-magnetic layer 12, non-magnetic
layer (etching stopper layer) 14' is formed on first layer 13a, and
second layer 13b is formed on non-magnetic layer 14', as shown in
FIG. 18.
[0126] Subsequently, non-magnetic layer (etching stopper layer) 14
is formed on second layer 13b, shift cancel layer SCL is formed on
non-magnetic layer 14, cap layer CAP is formed on shift cancel
layer SCL, and hard mask layer HM is formed on cap layer CAP.
[0127] Next, a first patterning process is executed. The process
described in the First and Second Embodiments can be employed as
the first patterning process.
[0128] Table 5 shows the first patterning process.
TABLE-US-00005 TABLE 5 First Patterning process A Upper layer
.uparw. Cap layer CAP and Shift RIE with noble gas, RIE Layer
cancel layer SCL with noble gas and Lower layer .dwnarw.
Non-magnetic layer 14 Nitrogen gas, or Second layer 13b in Ion beam
etching (IBE) second magnetic layer 13 RIE with noble gas and
Non-magnetic layer 14' Nitrogen gas First layer 13a in RIE with
noble gas, RIE second magnetic layer 13 with noble gas and Nitrogen
gas, or Ion beam etching (IBE) RIE with noble gas and Nitrogen gas
RIE with noble gas or Ion beam etching (IBE)
[0129] The first patterning process can be executed in two to five
steps as shown in Table 5.
[0130] First, cap layer CAP and an upper portion of shift cancel
layer SCL are etched by physical etching, for example, IBE, RIE
using a noble gas, RIB using a noble gas and nitrogen gas, etc. as
shown in FIG. 19. A lower portion of shift cancel layer SCL is
etched by the RIE using a noble gas and nitrogen gas. It is
desirable that the gas used for the etching should not contain
oxygen gas or an oxidizing gas such as oxygen compound gas.
[0131] In the etching of the lower portion of shift cancel layer
SCL, nitride 14N of elements (Ta, W, Ti, Nb, Hf, Al, B, etc.)
constituting non-magnetic layer 14 is formed on the surface of
non-magnetic layer 14 when the surface of non-magnetic layer 14 is
exposed. Accordingly, the etching of the lower portion of shift
cancel layer SCL can be certainly stopped when the surface of
non-magnetic layer 14 serving as the etching stopper layer is
exposed.
[0132] Next, non-magnetic layer 14 and an upper portion of second
layer 13b are etched by physical etching, for example, IBE, RIE
using a noble gas, RIE using a noble gas and nitrogen gas, etc. as
shown in FIG. 20. A lower portion of second layer 13b is etched by
the RIE using a noble gas and nitrogen gas. It is desirable that
the gas used for the etching should not contain oxygen gas or an
oxidizing gas such as oxygen compound gas.
[0133] In the etching of the lower portion of second layer 13b,
nitride 14'N of elements (Ta, W, Ti, Nb, Hf, Al, B, etc.)
constituting non-magnetic layer 14' is formed on the surface of
non-magnetic layer 14' when the surface of non-magnetic layer 14'
is exposed. Accordingly, the etching of the lower portion of second
layer 13b can be certainly stopped when the surface of non-magnetic
layer 14' serving as the etching stopper layer is exposed.
[0134] Next, non-magnetic layer 14' and first layer 13a are etched
by using hard mask layer HM as a mask as shown in FIG. 21.
[0135] In this etching, non-magnetic layer 14' and first layer 13a
have only to be etched.
[0136] Accordingly, the etching can be certainly stopped when a
surface of non-magnetic layer 12 serving as the tunnel barrier
layer is exposed, i.e., "stop on barrier layer" can be
implemented.
[0137] Since a subsequent process is the same as that in the First
Embodiment (FIG. 6 to FIG. 9), an explanation of the subsequent
process is omitted here.
[0138] The structure shown in FIG. 17 is completed in the
above-described steps.
[0139] According to the Fourth Embodiment, the etching of second
magnetic layer 13 can be certainly stopped on the surface of
non-magnetic layer 12, i.e., what is called "stop on barrier layer"
can be certainly implemented as compared with executing the first
patterning process by the physical etching, for example, IBE, RIE
using halogen gas, etc.
Fifth Embodiment
[0140] In Fifth Embodiment, unlike the First to Fourth Embodiments,
a non-magnetic layer serving as an etching stopper layer is not
deposited.
[0141] In the present embodiment, a magnetic or electric property
of a magnetoresistive element can be enhanced since the
non-magnetic layer serving as an etching stopper layer is not
deposited.
[0142] However, since certainly executing what is called "stop on
barrier layer" in the magnetoresistive element is a common gist of
the First to Fifth Embodiments, the present embodiment proposes a
method of certainly stopping, for example, etching of a shift
cancel layer (third magnetic layer) by RIE using an etching gas
containing a noble gas and nitrogen gas, when a surface of a second
magnetic layer is exposed, even if a non-magnetic layer serving as
an etching stopper layer is not disposed.
[0143] FIG. 22 shows a magnetoresistive element according to the
Fifth Embodiment.
[0144] This structure is characterized in that non-magnetic layer
14 serving as the etching stopper layer is omitted in the structure
of the First and Second Embodiments (FIG. 1).
[0145] In the present embodiment, since the etching stopper layer
is omitted, second magnetic layer 13 can secure an etching
selection ratio to shift cancel layer (third magnetic layer) SCL,
and comprises a material of which a nitride can be easily formed
with nitrogen gas. It is desirable that the etching selection ratio
between second magnetic layer 13 and shift cancel layer SCL should
be equal to or greater than 150.
[0146] Second magnetic layer 13 comprises, for example, CoFeX as
the material satisfying such a condition, where X is one of Ta, W,
Ti, Nb, Hf, Al, and B. In this case, if shift cancel layer SCL is
one of CoPt, CoFe, PtMn and NiFe, the etching selection ratio
between second magnetic layer 13 and shift cancel layer SCL can be
set to be equal to or greater than 150, at etching shift cancel
layer SCL by the RIE using an etching gas containing a noble gas
and nitrogen gas.
[0147] Since the Fifth Embodiment is the same as the First and
Second Embodiments (FIG. 1) in view of the other portions, the same
components as those of the structure shown in FIG. 1 are denoted by
the same reference numbers and their explanations are omitted
here.
[0148] FIG. 23 to FIG. 25 show an example of a manufacturing method
for obtaining the structure shown in FIG. 22.
[0149] First, underlayer UL is formed on lower electrode LE, first
magnetic layer 11 is formed on underlayer UL, non-magnetic layer
(tunnel barrier layer) 12 is formed on first magnetic layer 11, and
second magnetic layer 13 is formed on non-magnetic layer 12 as
shown in FIG. 23.
[0150] Subsequently, shift cancel layer SCL is formed on second
layer 13, cap layer CAP is formed on shift cancel layer SCL, and
hard mask layer HM is formed on cap layer CAP.
[0151] Next, a first patterning process is executed. The process
described in the First and Second Embodiments can be employed as
the first patterning process.
[0152] Table 6 shows the first patterning process.
TABLE-US-00006 TABLE 6 First Patterning process A Upper layer
.uparw. Cap layer CAP RIE with noble gas, RIE Layer Shift cancel
layer with noble gas and Lower layer .dwnarw. SCL Nitrogen gas, or
Second magnetic layer 13 Ion beam etching (IBE) RIE with noble gas
and Nitrogen gas RIE with noble gas or Ion beam etching (IBE)
[0153] The first patterning process can be executed in two to five
steps as shown in Table 6.
[0154] First, cap layer CAP and an upper portion of shift cancel
layer SCL are etched by physical etching, for example, IBE, RIE
using a noble gas, RIE using a noble gas and nitrogen gas, etc. as
shown in FIG. 24. A lower portion of shift cancel layer SCL is
etched by the RIE using a noble gas and nitrogen gas. It is
desirable that the gas used for the etching should not contain
oxygen gas or an oxidizing gas such as oxygen compound gas.
[0155] In the etching of the lower portion of shift cancel layer
SCL, nitride 13N of elements (Ta, W, Ti, Nb, Hf, Al, B, etc.)
constituting second magnetic layer 13 is formed on the surface of
second magnetic layer 13 when the surface of second magnetic layer
13 is exposed.
[0156] For example, when second magnetic layer 13 is CoFeB, nitride
(BN) 13N of boron (B) is formed on the surface of second magnetic
layer 13. When second magnetic layer 13 is CoFeTa, nitride (TaN)
13N of tantalum (Ta) is formed on the surface of second magnetic
layer 13.
[0157] Accordingly, the etching of the lower portion of shift
cancel layer SCL can be certainly stopped when the surface of
second magnetic layer 13 is exposed, even if the etching stopper
layer is not disposed.
[0158] Next, second magnetic layer 13 is etched by using hard mask
layer HM as a mask as shown in FIG. 25. In this etching, second
magnetic layer 13 has only to be etched.
[0159] Accordingly, the etching of second magnetic layer 13 can be
certainly stopped when a surface of non-magnetic layer 12 serving
as the tunnel barrier layer is exposed, i.e., "stop on barrier
layer" can be implemented.
[0160] Since a subsequent process is the same as that in the First
Embodiment (FIG. 6 to FIG. 9), an explanation of the subsequent
process is omitted here.
[0161] The structure shown in FIG. 22 is completed in the
above-described steps.
[0162] According to the Fifth Embodiment, the etching of second
magnetic layer 13 can be certainly stopped on the surface of
non-magnetic layer 12, i.e., what is called "stop on barrier layer"
can be certainly implemented as compared with executing the first
patterning process by the physical etching, for example, IBE, RIE
using halogen gas, etc.
Sixth Embodiment
[0163] In Sixth Embodiment, an example of a manufacturing apparatus
for executing the first patterning process according to the First
to Fifth Embodiments will be described.
[0164] In the First to Fifth Embodiments, the first patterning
process comprises at least two steps. To execute the at least two
steps, the manufacturing apparatus according to the present
embodiment comprises first chamber C1 in which a first step, for
example, physical etching is executed, and second chamber C2 in
which a second step, for example, RIE is executed, as shown in, for
example, FIG. 26. In other words, it is desirable that the
manufacturing method according to the First to Fifth Embodiments
should be executed in a multi-chamber shown in FIG. 26.
[0165] The multi-chamber enables the magnetoresistive element
(wafer) to be conveyed between first chamber C1 and second chamber
C2 in a state in which the magnetoresistive element is not exposed
to air, i.e., a state in which the magnetoresistive element is not
oxidized.
[0166] In addition, the manufacturing method according to the First
to Fifth Embodiments can also be executed in a multi-chamber shown
in FIG. 27.
[0167] For example, employment of three different etching methods,
i.e., physical etching, RIE using a noble gas and RIE using an
etching gas containing a noble gas and nitrogen gas in these
embodiments is considered here.
[0168] In this case, it is desirable that the first patterning
process should be executed in a multi-chamber comprising first
chamber C1 in which physical etching is executed, second chamber C2
in which RIE using a noble gas is executed, and third chamber C3 in
which RIE using a noble gas and an etching gas containing nitrogen
gas is executed.
[0169] The multi-chamber enables the magnetoresistive element
(wafer) to be conveyed among first chamber C1, second chamber C2
and third chamber C3 in a state in which the magnetoresistive
element is not exposed to air, i.e., a state in which the
magnetoresistive element is not oxidized.
[0170] However, the RIE using a noble gas and the RIE using a noble
gas and nitrogen gas can be executed in the same chamber since a
difference between the RIEs is containing nitrogen gas or not
alone.
[0171] The process can be modified to executing the physical
etching in first chamber C1, executing RIE in second chamber C2,
and executing CVD in third chamber C3 as shown in FIG. 28. In this
case, third chamber C3 is used for, for example, a process for
forming insulating layer I in FIG. 6.
[0172] FIG. 29 shows an example of a chamber in which RIE is
executed.
[0173] Wafer 33 is placed on wafer table (electrode) 32 in chamber
31. A noble gas and nitrogen gas are supplied from gas supply
modules 34 and 35, respectively, into chamber 31, through gas pipe
37. These gases are delivered evenly on a surface of wafer 33 by
shower plate (electrode) 38.
[0174] A pressure in chamber 31 is measured by pressure gauge 39.
Radio frequency power supplies 40 and 41 are connected to wafer
table 32 and shower plate 38, respectively.
[0175] Then, RIE is executed by forming plasma of an etching gas in
chamber 31 and accelerating ions of the etching gas toward wafer 33
while controlling electric powers of radio frequency power supplies
40 and 41 and the pressure in chamber 31.
[0176] If a noble gas is supplied into such a chamber, for example,
chamber 31, the RIE using the noble gas can be executed. In
addition, if a noble gas and nitrogen gas are supplied into such a
chamber, for example, chamber 31, RIE using the noble gas and
nitrogen gas can be executed.
[0177] In addition, an amount of generation of the nitride can be
controlled in the first patterning process by controlling a flow
rate of the nitrogen gas.
EXAMPLE OF APPLICATION
[0178] Application of the magnetoresistive element according to the
above-described embodiments to a magnetic random access memory will
be described here.
[0179] A 1T-1MTJ type memory cell array wherein a memory cell
comprises a magnetoresistive element and a select transistor will
be hereinafter described as an example of the application.
[0180] FIG. 30 shows an example of an equivalent circuit of the
1T-1MTJ type memory cell array.
[0181] Memory cell array 10 comprises arrayed memory cells MC. Each
of memory cells MC comprises magnetoresistive element MTJ and
select transistor (FET) SW.
[0182] Magnetoresistive element MTJ and select transistor (FET) SW
are serially connected, having one-side ends connected to first bit
line BL1 and the other-side ends connected to second bit line BL2.
A control terminal (gate terminal) of select transistor SW is
connected to word line EL.
[0183] First bit line BL1 extends in a first direction, having an
end connected to bit line driver/sinker 15. Second bit line BL2
extends in the first direction, having an end connected to bit line
driver/sinker and read circuit 16.
[0184] However, the circuit, can be modified such that first bit
line BL1 is connected to bit line driver/sinker and read circuit 16
and second bit line BL2 is connected to bit line driver/sinker
15.
[0185] In addition, bit line driver/sinker 15 and bit line
driver/sinker and read circuit 16 may be disposed at positions
opposite to each other or the same position.
[0186] Word line WL extends in a second direction, having an end
connected to word line driver 17.
[0187] FIG. 31 shows an example of the memory cell.
[0188] Select transistor SW is disposed in active area AA in
semiconductor substrate 18. Active area AA is surrounded by element
isolating/insulating layer 19 in semiconductor substrate 18. In
this example, element isolating/insulating layer 19 has an STI
(Shallow Trench Isolation) structure.
[0189] Select transistor SW comprises source/drain diffusion layers
20a and 20b in semiconductor substrate 18, gate insulation layer 21
on a channel between the layers, and gate electrode 22 on gate
insulation layer 21. Gate electrode 22 functions as word line
WL.
[0190] Interlayer insulation layer 23 covers select transistor SW.
A top surface of interlayer insulation layer 23 is flat, and lower
electrode LE is disposed on interlayer insulation layer 23. Lower
electrode LE is connected to source/drain diffusion layer 20b of
select transistor SW via contact plug 24.
[0191] Magnetoresistive element MTJ is disposed on lower electrode
LE. Upper electrode 25 is disposed on magnetoresistive element MTJ.
Upper electrode 25 functions as, for example, hard mask HM to be
used at processing magnetoresistive element MTJ.
[0192] Protective layer PL covers the side walls of
magnetoresistive element MTJ.
[0193] Interlayer insulation layer 26 is disposed on protective
layer PL to cover magnetoresistive element MTJ. A top surface of
interlayer insulation layer 26 is flat, and first bit line BL1 and
second bit line BL2 are disposed on interlayer insulation layer 26.
First bit line BL1 is connected to upper electrode 25. Second bit
line BL2 is connected to source/drain diffusion layer 20a of select
transistor SW via contact plug 27.
[0194] (Conclusion)
[0195] According to the above-described embodiments, etching the
magnetic layer alone disposed on the tunnel barrier layer, i.e.,
stopping the etching on the tunnel barrier layer surface (what is
called "stop on tunnel barrier") can be certainly executed, at the
two-step patterning of the magnetoresistive element.
[0196] While certain embodiments have been described, these
embodiments have been presented by way of example only, and are not
intended to limit the scope of the inventions. Indeed, the novel
embodiments described herein may be embodied in a variety of other
forms; furthermore, various omissions, substitutions and changes in
the form of the embodiments described herein may be made without
departing from the spirit of the inventions. The accompanying
claims and their equivalents are intended to cover such forms or
modifications as would fall within the scope and spirit of the
inventions.
* * * * *