U.S. patent application number 14/394806 was filed with the patent office on 2015-03-12 for substrate plating jig and plating device using same.
This patent application is currently assigned to JCU CORPORATION. The applicant listed for this patent is Takashi Murayama, Junichiro Yoshioka. Invention is credited to Takashi Murayama, Junichiro Yoshioka.
Application Number | 20150068890 14/394806 |
Document ID | / |
Family ID | 49383111 |
Filed Date | 2015-03-12 |
United States Patent
Application |
20150068890 |
Kind Code |
A1 |
Yoshioka; Junichiro ; et
al. |
March 12, 2015 |
SUBSTRATE PLATING JIG AND PLATING DEVICE USING SAME
Abstract
A plating jig and a plating device used for plating treatment of
a substrate. The plating jig includes a mechanism rotatably driving
a substrate holder, and detachably mounted on a plating bath
integrally with a support portion. The plating jig includes the
support portion which is formed in an engageable manner with a side
wall of the plating bath, and the substrate holder which is
vertically rotatably mounted on the support portion. The plating
jig further includes a rotary mechanism for the substrate holder.
The plating device utilizes the plating jig.
Inventors: |
Yoshioka; Junichiro;
(Kanagawa, JP) ; Murayama; Takashi; (Kanagawa,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Yoshioka; Junichiro
Murayama; Takashi |
Kanagawa
Kanagawa |
|
JP
JP |
|
|
Assignee: |
JCU CORPORATION
Taito-ku
JP
|
Family ID: |
49383111 |
Appl. No.: |
14/394806 |
Filed: |
April 20, 2012 |
PCT Filed: |
April 20, 2012 |
PCT NO: |
PCT/JP2012/060655 |
371 Date: |
October 16, 2014 |
Current U.S.
Class: |
204/297.01 |
Current CPC
Class: |
C25D 17/06 20130101;
C25D 17/001 20130101 |
Class at
Publication: |
204/297.01 |
International
Class: |
C25D 17/06 20060101
C25D017/06 |
Claims
1-9. (canceled)
10. A plating jig comprising: a support portion detachably engaged
with a side wall of a plating bath; a substrate holder held on the
support portion in a vertically rotatable manner; a rotary means
for the substrate holder which utilizes a flow of plating solution;
and a rotary means for the substrate holder which is rotated by a
drive part; or a combination of the rotary means for the substrate
holder which utilizes the flow of the plating solution and the
rotary means for the substrate holder which is rotated by the drive
part.
11. The plating jig according to claim 10, wherein the substrate
holder comprises: a holding member including a substrate mounting
surface; an annular sealing member configured to sandwich the
substrate between the sealing member and the holding member; an
outer frame member configured to be fitted on peripheries of the
holding member and the sealing member; and a shaft portion
configured to be inserted into a hole portion formed in a center
portion of the holding member.
12. The plating jig according to claim 11, wherein the rotary means
for the substrate holder includes a blade portion formed on an
outer peripheral surface of the outer frame member of the substrate
holder in a projecting manner.
13. The plating jig according to claim 11, wherein the rotary means
for the substrate holder includes a recessed portion formed on an
outer peripheral surface of the outer frame member of the substrate
holder.
14. The plating jig according to claim 11, wherein the rotary means
for the substrate holder is configured to transmit a rotational
force to the shaft portion of the substrate holder by a rotary
shaft of a drive part mounted on the support portion.
15. The plating jig according to claim 11, wherein the rotary means
for the substrate holder is configured to transmit a rotational
force to the shaft portion of the substrate holder or the outer
frame member by a gear member from a drive part mounted on the
support portion.
16. The plating jig according to claim 10, wherein the rotary means
for the substrate holder is formed by combining a plurality of
rotary means.
17. A plating device, wherein the plating jig according to claim 10
is engageable with a side wall of a plating bath, and a paddle
which is movable in a reciprocating manner in a lateral direction
is arranged between the substrate holder and an anode plate which
is arranged to face the substrate holder in an opposed manner.
18. A plating device, wherein the plating jig according to claim 12
is engageable with a side wall of a plating bath, and a plating
solution jetting port is formed in a bottom portion of the plating
bath disposed below the substrate holder.
Description
TECHNICAL FIELD
[0001] The present invention relates to a plating jig and a plating
device used for substrate plating processing, and more particularly
to a plating jig for forming a plating film on a fine wiring
groove, a hole, and a resist opening portion formed on a surface to
be plated of a semiconductor wafer and the like or for forming a
bump (projecting electrode) which electrically connects a
semiconductor chip and a substrate to each other on a surface to be
plated of a semiconductor wafer, and a plating device which uses
the plating jig.
BACKGROUND ART
[0002] In general, an electrolytic plating method is roughly
classified into a jet-type or cup-type plating method where plating
is performed such that a substrate such as a semiconductor wafer or
the like is horizontally placed with a surface to be plated of the
substrate facing down, and a plating solution is jetted from below,
and a dip-type plating method where plating is performed such that
a substrate is vertically disposed in an erected manner in a
plating bath, a plating solution is jetted into the plating bath
from below the plating bath, the substrate is immersed in the
plating solution in the plating bath while allowing the overflow of
the plating solution from the plating bath. The reason why plating
is performed with the substrate disposed in a vertically erected
manner in the dip-type electrolytic plating method is that bubbles
generated on the surface to be plated of the substrate can be
easily removed and that it is possible to make it difficult for
particles or the like adhere to the surface to be plated of the
substrate. In this manner, with the use of the electrolytic plating
method where plating is performed with the substrate disposed in a
vertically erected manner, babbles which are formed by a vigorous
reduction action at the time of performing high-speed plating can
be easily removed. Accordingly, this electrolytic plating method is
desirable.
[0003] An electrolytic plating device which adopts the
above-mentioned conventional dip-type electrolytic plating method
includes a substrate holder which holds a substrate such as a
semiconductor wafer in a detachable manner in a state where outer
peripheral edge surfaces and a back surface of the substrate are
sealed and a front surface (a surface to be plated) is exposed, and
the surface to be plated of the substrate is plated by immersing
the substrate holder into a plating solution together with the
substrate.
[0004] However, in such a conventional electrolytic plating method
which adopts dip-type plating, the substrate is immersed while
holding the substrate in a vertically erected state in the plating
solution, and the plating solution is made to flow in the upward
direction from a lower portion of the plating bath. Accordingly,
the plating solution jetted into the plating bath is always
supplied toward an upper portion from a lower portion of the
surface to be plated of the substrate and hence, a flow speed of
the plating solution becomes non-uniform between the upper portion
and the lower portion of the surface to be plated of the substrate
thus giving rise to a drawback that a delicate difference occurs in
film thickness of plating depending on a place of the surface to be
plated of the substrate. Further, non-uniformity of current density
also becomes a factor which causes non uniformity of plating.
[0005] To overcome such drawbacks, patent literatures 1, 2 disclose
a plating method and a plating device where a substrate holder
which holds a substrate such as a semiconductor wafer is rotated in
a plating bath by a drive unit so that non-uniformity in flow speed
or non-uniformity in current density of a plating solution are
eliminated whereby the uniformity of a plating film thickness is
increased.
[0006] However, as in the case of a plating method such as the
plating method disclosed in patent literature (PTL) 1 where a shaft
is connected to the substrate holder in a state where the shaft
from the drive unit arranged outside the plating bath penetrates a
side wall of the plating bath, sealing treatment of a penetrating
portion arises as a problem to be solved. To cope with this
drawback, in the method disclosed in PTL 1, sealing treatment is
not applied to the penetrating portion intentionally such that the
shaft and the side wall of the plating bath are brought into a
non-contact state from each other, and a plating solution flows out
through a gap formed between the shaft and the side wall. Such
constitution, however, requires the modification of the plating
bath. On the other hand, in the plating method disclosed in PTL 2,
a drive shaft is arranged at a predetermined angle and hence, the
drive shaft does not penetrate a side wall of a plating bath.
However, it is necessary to modify the plating bath itself
eventually including the arrangement of an anode plate at a
predetermined angle so as to make an anode plate face an object to
be plated or the formation of a bottom portion of the plating bath
along an angle of the shaft.
LIST OF RELATED ART
Patent Literature
[0007] PTL 1: JP-A-2004-300462
[0008] PTL 2: JP-A-2002-327291
SUMMARY OF INVENTION
Technical Problem
[0009] Accordingly, the present invention has been made to overcome
such drawbacks of the conventional plating device, and it is an
object of the present invention to provide a plating jig which
includes a rotation drive unit for rotatably driving a substrate
holder and is detachably mountable on a plating bath without
modifying the plating bath, and a plating device which utilizes the
plating jig.
Solution to Problem
[0010] The present invention has been made to overcome the
above-mentioned drawbacks, and provides a plating jig which is
characterized by including: a support portion formed in an
engageable manner with a side wall of a plating bath; and a
substrate holder mounted on the support portion in a vertically
rotatable manner, wherein the plating jig further includes a rotary
means for rotating the substrate holder.
[0011] The present invention also provides a plating device which
is characterized in that the plating jig is engageable with the
side wall of the plating bath, and a paddle which is movable in a
reciprocating manner in the lateral direction is arranged between
the substrate holder and an anode plate which faces the substrate
holder in an opposed manner.
Advantageous Effects of Invention
[0012] According to the plating jig of the present invention, the
plating jig can be easily mounted on the plating device by merely
making the plating jig engage with the side wall of the plating
bath, a plating solution flow is used as a rotary drive unit for
rotating the substrate holder, or power of a drive part is
transmitted to the substrate holder by way of a rotary shaft or a
gear member. None of these provisions requires the modification of
the plating bath.
[0013] Further, according to the plating device provided with the
plating jig of the present invention which is also provided with
the paddle for agitation between the substrate holder and the anode
plate, a plating solution flow which flows along a surface to be
plated of the substrate can be made uniform also by the agitation
generated by the paddle in addition to the rotation of the plating
jig and hence, it is possible to form a plating film having a more
uniform film thickness.
[0014] In the case where the plating device provided with the
plating jig of the present invention is also provided with a
plating solution jetting port on a bottom portion of the plating
bath disposed below the substrate holder, a rotational force can be
generated more efficiently by providing a difference in strength of
the plating solution flow between left and right sides of the
substrate holder.
BRIEF DESCRIPTION OF DRAWINGS
[0015] FIG. 1 An exploded perspective view of a plating jig of the
present invention.
[0016] FIG. 2 A schematic constitutional view of a plating device
on which the plating jig of the present invention is mounted.
[0017] FIG. 3 (a) A side view of an outer frame member of the
plating jig of the present invention.
[0018] (b) A front view of the outer frame member of the plating
jig of the present invention.
[0019] FIG. 4 (a) A side view of the outer frame member of the
plating jig of the present invention.
[0020] (b) A front view of the outer frame member of the plating
jig of the present invention.
[0021] FIG. 5 (a) A side view of the outer frame member of the
plating jig of the present invention.
[0022] (b) A front view of the outer frame member of the plating
jig of the present invention.
[0023] FIG. 6 (a) A view showing a different mode of a blade
portion of the outer frame member of the plating jig of the present
invention.
[0024] (b) A view showing a different mode of the blade portion of
the outer frame member of the plating jig of the present
invention.
[0025] FIG. 7 A schematic constitutional view of the plating device
on which the plating jig of the present invention is mounted.
[0026] FIG. 8 A schematic constitutional view of the plating device
on which the plating jig of the present invention is mounted.
[0027] FIG. 9 A partially enlarged cross-sectional view of a
substrate holder in the plating jig of the present invention.
DESCRIPTION OF EMBODIMENTS
[0028] Hereinafter, embodiments of a plating jig of the present
invention and a plating device which uses the plating jig are
explained in detail by reference to drawings. The present invention
is not particularly limited to the embodiments.
[0029] FIG. 1 is an exploded perspective view of the plating jig of
the present invention, and FIG. 2 is a schematic constitutional
view of the plating device on which the plating jig of the present
invention is mounted. In the drawings, symbol 1 indicates the
plating device, symbol 2 indicates the plating jig, symbol 10
indicates a plating bath, symbol 11 indicates a side wall, symbol
12 indicates a jetting port, symbol 20 indicates an overflow tank,
symbol 30 indicates a substrate holder, symbol 31 indicates a
holding member, symbol 32 indicates a sealing member, symbol 33
indicates an outer frame member, symbol 34 indicates a shaft
portion, symbol 35 indicates a fixing bolt, symbol 36 indicates a
fixing bolt, symbol 37 indicates a fixing bolt, symbol 40 indicates
a support portion, symbol 41 indicates a hole portion, symbol 50
indicates an anode plate, symbol 60 indicates a paddle, symbol 70
indicates a power source, symbol 71 indicates an electricity supply
path, symbol 80 indicates a piping, symbol 81 indicates a pump,
symbol 82 indicates a filter, symbol 311 indicates a base portion,
symbol 312 indicates a substrate mounting surface, symbol 313
indicates a hole portion, symbol 314 indicates a first electricity
supply member, symbol 321 indicates an opening portion, symbol 331
indicates connecting portions, symbol 332 indicates blade portions,
and symbol W indicates a substrate respectively.
[0030] As shown in the drawings, the plating jig 2 of the present
invention is constituted of: the support portion 40 which is formed
in an engageable manner with the side wall of the plating bath; and
the substrate holder 30 which is rotatably mounted on the support
portion 40. The respective portions are explained in detail by
reference to FIG. 1. The support portion 40 is formed of a
columnar-shaped member having an upper portion thereof formed into
a hook shape such that the support portion 40 can be engaged with
an upper end of the side wall of the plating bath, and the hole
portion 41 into which the shaft portion 34 can be inserted is
formed in a lower portion of the support portion 40. The substrate
holder 30 having a disc shape is held by the hole portion 41 by way
of the shaft portion 34 in a vertically rotatable manner.
[0031] The substrate holder 30 is constituted of: the holding
member 31; the sealing member 32; the outer frame member 33; the
shaft portion 34; and the fixing bolts 35, 36, 37. Among these
components, with respect to the holding member 31, on an upper
surface of the base portion 311 formed in a disc shape, the
substrate mounting surface 312 having a diameter smaller than a
diameter of the base portion 311 is mounted in a projecting manner.
The substrate mounting surface 312 has the substantially same shape
and size as the substrate W to which plating is applied. A
plurality of first electricity supply members 314 are mounted on
the base portion 311 around the substrate mounting surface 312 in a
projecting manner. Further, the hole portion 313 into which the
shaft portion 34 can be inserted is formed in a center portion of
the substrate mounting surface 312.
[0032] The sealing member 32 is formed into an annular shape having
the substantially same diameter as the holding member 31, and the
opening portion 321 of the sealing member 32 is formed with an
inner diameter slightly smaller than an outer diameter of the
substrate W. On a surface of the sealing member 32 which faces the
holding member 31 in an opposed manner, an annular-shaped seal
packing 322 and a second electricity supply member 323 (not shown
in FIG. 1) are mounted. At the time of assembling the substrate
holder 30, the substrate W is sandwiched between the sealing member
32 and the holding member 31 thus sealing the first electricity
supply member 314 on the base portion 311 and supplying electricity
to the substrate W.
[0033] The outer frame member 33 is constituted of two members
consisting of semi-annular left and right members. The outer frame
member 33 has an approximately U-shaped cross section. At the time
of assembling the substrate holder 30, the outer frame member 33 is
fitted on outer peripheral edges of the holding member 31 and the
sealing member 32. To be more specific, two outer frame members 33
are mounted on the outer peripheral edges of the holding member 31
and the sealing member 32 from left and right sides, and the outer
frame members 33 are fastened and fixed to each other at upper and
lower connecting portions 331 using bolts or the like. In the
plating jig 2 shown in FIG. 1, the plurality of blade portions 332
are formed on an outer peripheral surface of the outer frame member
33 in a projecting manner. However, as described later, when other
rotary means is used, such blade portions 332 are not always
necessary.
[0034] The substrate holder 30 is mounted on the support portion 40
such that the shaft portion 34 having a threaded portion is
inserted into the hole portion 313 formed in the holding member 31
and the hole portion 41 formed in the support portion 40, and the
fixing bolts 35, 36, 37 are threadedly engaged with the threaded
portion of the shat portion 34 thus fixing the substrate holder 30
to the support portion 40. In this case, it is desirable to seal
the fixing bolt 36 which are exposed to a plating solution by
applying coating or the like to the fixing bolt 36 after the bolt
36 is fixed to the shaft portion 34. Although the fixing bolt 37 is
exposed to the plating solution in the same manner as the fixing
bolt 36, it is desirable to form recessed portions into which the
fixing bolt 37 can be embedded on a back surface of the support
portion 40 as shown in FIG. 1, and to mask an opening portion of
the recessed portion using a vinyl chloride plate, a tape or the
like. Further, it is also desirable that coating is applied to a
portion of the shaft portion 34 which is exposed to the plating
solution using Teflon (registered trademark), an epoxy-system resin
or the like.
[0035] Further, a method of mounting the substrate holder 30 on the
support portion 40 which differs from the above-mentioned method is
explained hereinafter. Firstly, the support portion 40 is formed
such that the support portion 40 is split into two parts as viewed
from a front side, that is, left and right members, and the
recessed portion in which the shaft portion 34 and the fixing bolt
37 can be embedded is formed on the left and right members
respectively. Then, the shaft portion 34 on which the fixing bolt
37 is preliminarily mounted is arranged on either one of the left
and right members of the support portion 40 having the split
structure, and the other member of the support portion 40 is
abutted and fixed to one member thus finishing the mounting of the
substrate holder 30 on the support portion 40. Due to such a
mounting method, the whole length of the shaft portion 34 can be
further shortened and, at the same time, as described above, it is
unnecessary to seal the opening portion formed on a back side of
the support portion 40.
[0036] Next, a method of supplying electricity to the substrate W
is explained. An electricity supply path 71 which is embedded into
the support portion 40 or drawn into the inside of the support
portion 40 from a back surface supplies electricity to the shaft
portion 34 via an electricity supply brush (not shown in the
drawing) from the external power source 70. The shaft portion 34 is
made of a conductive raw material such as a titanium material, a
phosphor bronze material, a pure copper material or the like, and
supplies electricity to the fixing bolt 35 which is also made of a
conductive raw material. Then, electricity is supplied to the first
electricity supply members 314 via an electricity supply paths (not
shown in the drawing) which is embedded in the inside of the
holding member 31 from the fixing bolts 35, 36 provided for fixing
the holding member 31.
[0037] FIG. 9 is a partially-enlarged view showing a conduction
mode in a state where the substrate holder 30 is assembled while
sandwiching the substrate W between the sealing member 32 and the
holding member 31. As shown in FIG. 9, on a surface of the sealing
member 32 which faces the holding member 31 in an opposed manner,
the annular seal packing 322 and the second electricity supply
member 323 are mounted. The seal packing 322 has a U-shaped
cross-sectional shape where a length of an upper and a length of
lower side differ from each other. The second electricity supply
member 323 is formed into a flat disc shape. A plurality of
projecting contact points 324 are formed on an inner periphery of
the second electricity supply member 323 in a projecting manner. At
the time of assembling the substrate holder 30, a flat plate
portion of the second electricity supply member 323 is brought into
contact with the first electricity supply member 314 mounted on the
base portion 311, and the projecting contact points 324 are brought
into contact with a plated surface of the substrate W. Due to such
a constitution, electricity can be supplied to the substrate W from
the first electricity supply member 314 via the second electricity
supply member 323. The above-mentioned conducting method is
desirable from a viewpoint that electricity can be surely supplied
to the substrate W without exposing the first electricity supply
member 314 and the second electricity supply member 323 into the
plating solution due to the seal packing 322. However, a method of
supplying electricity to the plating jig of the present invention
is not limited to the above-mentioned method.
[0038] Next, the rotary means for the substrate holder 30 is
explained. As the rotary means for the substrate holder 30 in the
plating jig 2 of the present invention, a method which makes use of
the flow of plating solution by providing blade portions or
recessed portions on an outer peripheral surface of the outer frame
member or a method which rotates the substrate holder 30 by a drive
part can be adopted. FIG. 3(a) and FIG. 3(b) show the constitution
where blade portions 332 are formed on the outer peripheral surface
of the outer frame member 33 in a projecting manner. As shown in
the drawings, with respect to the rotary means of this embodiment,
the plurality of blade portions 332 having a rectangular-plate
shape are formed on the outer peripheral surface of the outer frame
member 33 equidistantly. The blade portion 332 is formed on the
outer peripheral surface in an approximately vertically erected
manner, and a blade portion is arranged horizontally as viewed in a
side view. The rotary means where the blade portions are mounted on
the outer frame member 33 can generate a rotational force when a
plaiting solution flow impinges on the blade portions 332 so that
the substrate holder 30 can be rotated.
[0039] FIG. 4 (a) and FIG. 4 (b) show blade portions 333 formed in
a different mode. As shown in the drawings, the blade portions 333
are formed on an outer peripheral surface of the outer frame member
33 in an approximately vertically-erected manner. However, the
blade portions 333 are not arranged horizontally but are arranged
with an angle such that the blade portions 333 are inclined
downwardly from a front side to a rear side. By giving such angle
to the blade portions 333 in this manner, the rotary means can
catch the flow of plating solution from a front side more
effectively. Further, by forming the blade portion into an
approximately U shape or an approximately V shape instead of a
rectangular plate shape, as shown in FIG. 6 (a) and FIG. 6 (b), the
rotary means can catch the flow of plating solution more
easily.
[0040] FIG. 5 (a) and FIG. 5 (b) show the rotary means where
recessed portions 334 are formed on an outer peripheral surface of
an outer frame member 33 in a recessed manner. As shown in the
drawings, in this embodiment, the plurality of recessed portions
334 each having a rectangular shape are formed on the outer
peripheral surface of the outer frame member 33 equidistantly. In
this manner, by forming the recessed portions 334 on the outer
peripheral surface of the outer frame member 33, the recessed
portions catch the flow of the plating solution in the same manner
as the blade portions and can generate a rotational force so that
the substrate holder 30 can be rotated.
[0041] FIG. 7 shows a first mode of rotating a substrate holder 30
by a drive part. As shown in FIG. 7, a rotational force is
transmitted to a gear 93 mounted on a shaft portion 34 by way of a
shaft 91 from a drive part 90 such as an electrically-operated
motor. The gear 34 transmits a rotational force of the shaft 91 to
the shaft portion 34 while converting the rotation of the shaft 91
into the rotation of the shaft portion 34. Accordingly, the
substrate holder 30 can be rotated. The drive part 90 may be
directly mounted on the support portion 40, or may be detachably
mounted on a mounting portion 92. An additional support portion may
be provided outside a plating bath for supporting the drive part
90. The transmission of a rotational force to the shaft portion 34
from the drive part 90 may be, besides the transmission using the
combination of the shaft and the gear as in the case of this
embodiment, the transmission using the combination of a plurality
of gear members, or the transmission using a belt.
[0042] FIG. 8 shows a second mode of rotating a substrate holder 30
by a drive part. As shown in FIG. 8, a gear portion 94 is mounted
on an upper portion of the substrate holder 30, and a gear 95
having the same pitch as the gear portion 94 is mounted on an outer
frame member of the substrate holder 30. When a rotational force is
transmitted to the gear portion 94 from the drive part 90, the
rotational force is transmitted to the gear 95 mounted on the outer
frame member so that the substrate holder 30 can be rotated. The
transmission of a rotational force to the gear portion 94 from the
drive part 90 may be the transmission using the combination of the
shaft and the gear as in the case of the first embodiment, the
transmission using the combination of a plurality of gear members
or the transmission using a belt.
[0043] The rotary means for the substrate holder 30 is not limited
to either one of the above-mentioned methods, that is, the method
which makes use of the flow of plating solution by forming the
blade portions or the recessed portions on the outer peripheral
surface of the outer frame member 33, and the method which rotates
the substrate holder 30 by the drive part, and the rotary means may
be combination of these rotary means. That is, a rotational force
may be imparted to the substrate holder 30 by forming the blade
portions or the recessed portions on the outer peripheral surface
of the outer frame member 33 and, at the same time, a rotational
force may be imparted to the substrate holder 30 by using an
external drive part. In this manner, with the use of two kinds of
different rotational forces, the rotation of the substrate holder
30 can be made further stable thus suppressing the power
consumption.
[0044] Next, a plating device which uses the plating jig 2 of the
present invention is explained. FIG. 2 is a schematic
constitutional view of the plating device 1 on which the plating
jig 2 of the present invention is mounted. As shown in FIG. 2, the
plating device 1 of the present invention includes the plating bath
10, and the overflow tank 20 arranged on an outer periphery of the
plating bath 10. The plating jig 2 is mounted on the side wall 11
of the plating bath 10. In the inside of the plating bath 10, the
anode plate 50 is arranged at a position facing a plated surface of
the substrate W held by the substrate holder 30 in an opposed
manner. The paddle 60 may be arranged between the anode plate 50
and the substrate holder 30 as in the case of this embodiment. The
paddle 60 can make the flow of plating solution along the plated
surface of the substrate uniform by moving in a reciprocating
manner parallel to the plated surface of the substrate W.
Accordingly, a plating film having a further uniform film thickness
can be formed by a synergistic effect brought about by the paddle
60 and the substrate holder 30 having the rotary means. From the
above reasons, the provision of the paddle 60 is desirable.
[0045] A jetting port 12 to which the piping 80 is connected is
formed in the bottom portion of the plating bath 10, and a plating
solution is supplied into the inside of the plating bath 10 through
the jetting port 12. When the jig which makes use of the flow of
the plating solution by forming the blade portions or the recessed
portions on the outer peripheral surface of the outer frame members
shown in FIG. 1 and FIG. 3 to FIG. 6 is utilized, it is desirable
to arrange the jetting port 12 at a position where the flow of
plating solution can effectively transmit a rotational force to the
blade portions or the recessed portions of the outer frame member
33. To be more specific, it is desirable to arrange the jetting
port 12 below the substrate holder 30 and along the direction
parallel to the substrate holder 30. In this case, by providing the
jetting port 12 to only one side of the plating bath 10 or by
making jetting amounts of the plating solution from the jetting
ports 12 different from each other between the left and right sides
so as to make a strength of the flow of plating solution different
between the left and right sides of the substrate holder 30, a
rotational force can be generated more efficiently. Accordingly, it
is desirable to adopt such a constitution.
REFERENCE SIGNS LIST
[0046] 1: plating device [0047] 2: plating jig [0048] 10: plating
bath [0049] 11: side wall [0050] 12: jetting port [0051] 20:
overflow tank [0052] 30: substrate holder [0053] 31: holding member
[0054] 32: sealing member [0055] 33: outer frame member [0056] 34:
shaft portion [0057] 35: fixing bolt [0058] 36: fixing bold [0059]
37: fixing bolt [0060] 40: support portion [0061] 41: hole portion
[0062] 50: anode plate [0063] 60: paddle [0064] 70: power source
[0065] 71: electricity supply path [0066] 80: piping [0067] 81:
pump [0068] 82: filter [0069] 90: drive part [0070] 91: shaft
[0071] 92: mounting portion [0072] 93: gear [0073] 94: gear portion
[0074] 95: outer frame member [0075] 311: base portion [0076] 312:
substrate mounting surface [0077] 313: hole portion [0078] 314:
first electricity supply member [0079] 321: opening portion [0080]
322: seal packing [0081] 323: second electricity supply member
[0082] 324: projecting contact point [0083] 331: connection portion
[0084] 332: blade portion [0085] 333: blade portion [0086] 334:
recessed portion [0087] W: substrate
* * * * *