Yoshioka; Junichiro
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yoshioka; Junichiro.The latest application filed is for "electrochemical deposition method".
Company Profile
0.25.31
- Yoshioka; Junichiro - Kanagawa JP
- Yoshioka; Junichiro - Tokyo JP
- Yoshioka; Junichiro - Toyko JP
- Yoshioka; Junichiro - Yokohama JP
Patent Activity
| Patent | Date |
|---|---|
| Substrate plating jig Grant 9,865,493 - Yoshioka , et al. January 9, 2 | 2018-01-09 |
| Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 9,714,476 - Yoshioka , et al. July 25, 2 | 2017-07-25 |
| Electrochemical deposition method Grant 9,624,596 - Yoshioka , et al. April 18, 2 | 2017-04-18 |
| Electrochemical deposition method Grant 9,593,430 - Yoshioka , et al. March 14, 2 | 2017-03-14 |
| Electrochemical deposition method Grant 9,506,162 - Yoshioka , et al. November 29, 2 | 2016-11-29 |
| Electrochemical Deposition Method App 20160319454 - YOSHIOKA; Junichiro ; et al. | 2016-11-03 |
| Electrochemical Deposition Method App 20160319455 - YOSHIOKA; Junichiro ; et al. | 2016-11-03 |
| Electrochemical Deposition Method App 20160319456 - YOSHIOKA; Junichiro ; et al. | 2016-11-03 |
| Electrochemical deposition method Grant 9,388,505 - Yoshioka , et al. July 12, 2 | 2016-07-12 |
| Substrate Plating Device App 20160138181 - YOSHIOKA; Junichiro ; et al. | 2016-05-19 |
| Substrate Plating Jig App 20150294894 - Yoshioka; Junichiro ; et al. | 2015-10-15 |
| Electrochemical Deposition Method App 20150136610 - YOSHIOKA; Junichiro ; et al. | 2015-05-21 |
| Semiconductor Wafer Holder And Electroplating System For Plating A Semiconductor Wafer App 20150122635 - YOSHIOKA; Junichiro ; et al. | 2015-05-07 |
| Substrate Plating Jig And Plating Device Using Same App 20150068890 - Yoshioka; Junichiro ; et al. | 2015-03-12 |
| Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 8,961,755 - Yoshioka , et al. February 24, 2 | 2015-02-24 |
| Electrochemical deposition apparatus Grant 8,936,705 - Yoshioka , et al. January 20, 2 | 2015-01-20 |
| Substrate Electroplating Jig App 20140251798 - Yoshioka; Junichiro ; et al. | 2014-09-11 |
| Electrochemical deposition apparatus App 20130081941 - YOSHIOKA; Junichiro ; et al. | 2013-04-04 |
| Plating Apparatus And Plating Method App 20130015075 - SEKIMOTO; Masahiko ; et al. | 2013-01-17 |
| Substrate holder and plating apparatus Grant 8,337,680 - Yoshioka , et al. December 25, 2 | 2012-12-25 |
| Substrate holder, plating apparatus, and plating method Grant 8,133,376 - Yoshioka , et al. March 13, 2 | 2012-03-13 |
| Semiconductor Wafer Holder And Electroplating System For Plating A Semiconductor Wafer App 20120048727 - Yoshioka; Junichiro ; et al. | 2012-03-01 |
| Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 8,075,756 - Yoshioka , et al. December 13, 2 | 2011-12-13 |
| Plating apparatus and method Grant 8,012,332 - Yoshioka , et al. September 6, 2 | 2011-09-06 |
| Substrate Holder And Plating Apparatus App 20110127159 - Yoshioka; Junichiro ; et al. | 2011-06-02 |
| Substrate holder and plating apparatus Grant 7,901,551 - Yoshioka , et al. March 8, 2 | 2011-03-08 |
| Semiconductor Wafer Holder And Electroplating System For Plating A Semiconductor Wafer App 20110036722 - Yoshioka; Junichiro ; et al. | 2011-02-17 |
| Substrate Holder, Plating Apparatus, And Plating Method App 20100320090 - YOSHIOKA; Junichiro ; et al. | 2010-12-23 |
| Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 7,833,393 - Yoshioka , et al. November 16, 2 | 2010-11-16 |
| Substrate holder, plating apparatus, and plating method Grant 7,807,027 - Yoshioka , et al. October 5, 2 | 2010-10-05 |
| Substrate Holder and Plating Apparatus App 20100000858 - Yoshioka; Junichiro ; et al. | 2010-01-07 |
| Plating Apparatus And Plating Method App 20090301395 - SEKIMOTO; Masahiko ; et al. | 2009-12-10 |
| Substrate holder and plating apparatus Grant 7,601,248 - Yoshioka , et al. October 13, 2 | 2009-10-13 |
| Plating Apparatus And Method App 20080245669 - Yoshioka; Junichiro ; et al. | 2008-10-09 |
| Plating apparatus and method Grant 7,402,227 - Yoshioka , et al. July 22, 2 | 2008-07-22 |
| Plating method and apparatus Grant 7,118,664 - Yoshioka , et al. October 10, 2 | 2006-10-10 |
| Semiconductor wafer holder and electroplating system for plating a semiconductor wafer App 20060151317 - Yoshioka; Junichiro ; et al. | 2006-07-13 |
| Plating apparatus and plating method App 20060141157 - Sekimoto; Masahiko ; et al. | 2006-06-29 |
| Plating apparatus and plating method App 20060081478 - Sahoda; Tsuyoshi ; et al. | 2006-04-20 |
| Semiconductor wafer holder and electroplating system for plating a semiconductor wafer Grant 7,022,211 - Yoshioka , et al. April 4, 2 | 2006-04-04 |
| Substrate holder, plating apparatus, and plating method App 20050092600 - Yoshioka, Junichiro ; et al. | 2005-05-05 |
| Plating apparatus and method App 20050082163 - Yoshioka, Junichiro ; et al. | 2005-04-21 |
| Substrate holder and plating apparatus App 20050014368 - Yoshioka, Junichiro ; et al. | 2005-01-20 |
| Substrate holder, plating apparatus, and plating method Grant 6,844,274 - Yoshioka , et al. January 18, 2 | 2005-01-18 |
| Plating method and apparatus App 20040159550 - Yoshioka, Junichiro ; et al. | 2004-08-19 |
| Plating method and apparatus Grant 6,716,332 - Yoshioka , et al. April 6, 2 | 2004-04-06 |
| Substrate holder, plating apparatus, and plating method App 20040037682 - Yoshioka, Junichiro ; et al. | 2004-02-26 |
| Semiconductor element and fabricating method thereof Grant 6,569,752 - Homma , et al. May 27, 2 | 2003-05-27 |
| Wafer plating jig Grant 6,365,020 - Yoshioka , et al. April 2, 2 | 2002-04-02 |
| Semiconductor wafer holder and electroplating system for plating a semiconductor wafer App 20020029963 - Yoshioka, Junichiro ; et al. | 2002-03-14 |
| Plating apparatus and method App 20020027080 - Yoshioka, Junichiro ; et al. | 2002-03-07 |
| Spin processing apparatus Grant 6,269,548 - Shinozaki , et al. August 7, 2 | 2001-08-07 |
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