U.S. patent application number 14/351802 was filed with the patent office on 2014-09-11 for substrate electroplating jig.
This patent application is currently assigned to JCU CORPORATION. The applicant listed for this patent is Takashi Murayama, Junichiro Yoshioka. Invention is credited to Takashi Murayama, Junichiro Yoshioka.
Application Number | 20140251798 14/351802 |
Document ID | / |
Family ID | 48140479 |
Filed Date | 2014-09-11 |
United States Patent
Application |
20140251798 |
Kind Code |
A1 |
Yoshioka; Junichiro ; et
al. |
September 11, 2014 |
SUBSTRATE ELECTROPLATING JIG
Abstract
A substrate plating jig including a first plate-shaped holding
member and a second holding member including a ring-shaped seal
packing, including an internal circumferential part, an external
circumferential part, and an opening formed at the center of the
ring-shaped seal packing. Leading edges of the internal
circumferential part and external circumferential part of the
ring-shaped seal packing come in close contact with a substrate
surface-to-be plated and the first holding member, respectively.
The edge of the substrate-to-be-plated is held between the internal
circumferential part and the external circumferential part of the
ring-shaped seal packing. The substrate surface-to-be-plated is
exposed in the opening. A first ring-shaped conducting member
includes multiple protruding contact points inside the ring-shaped
seal packing, and the substrate surface-to-be-plated comes in
contact with the protruding contact points inside the ring-shaped
seal packing by interposing and clamping the substrate-to-be-plated
between the first holding member and the second holding member.
Inventors: |
Yoshioka; Junichiro;
(Kanagawa, JP) ; Murayama; Takashi; (Kanagawa,
JP) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Yoshioka; Junichiro
Murayama; Takashi |
Kanagawa
Kanagawa |
|
JP
JP |
|
|
Assignee: |
JCU CORPORATION
Tokyo
JP
|
Family ID: |
48140479 |
Appl. No.: |
14/351802 |
Filed: |
October 19, 2011 |
PCT Filed: |
October 19, 2011 |
PCT NO: |
PCT/JP2011/074032 |
371 Date: |
April 14, 2014 |
Current U.S.
Class: |
204/297.01 |
Current CPC
Class: |
C25D 7/123 20130101;
C25D 17/005 20130101; C25D 17/001 20130101; C25D 17/004 20130101;
C25D 17/06 20130101 |
Class at
Publication: |
204/297.01 |
International
Class: |
C25D 17/06 20060101
C25D017/06 |
Claims
1-5. (canceled)
6. A substrate plating jig comprising: a first plate-shaped holding
member; and a second holding member including a ring-shaped seal
packing including an internal circumferential part and an external
circumferential part and an opening formed at the center of the
ring-shaped seal packing, wherein a substrate-to-be-plated is
interposed and clamped between the first holding member and the
second holding member so as to be held therebetween, so that
leading edges of the internal circumferential part and the external
circumferential part of the ring-shaped seal packing come into
close contact with a substrate surface-to-be-plated and the first
holding member, respectively, and an edge of the
substrate-to-be-plated is held between the internal circumferential
part and the external circumferential part of the ring-shaped seal
packing, and the substrate surface-to-be-plated is exposed in the
opening; and a second conducting member or a fourth conducting
member configured to conduct electricity with an external electrode
is provided on the first holding member, a first ring-shaped
conducting member having multiple protruding contact points is
provided inside the ring-shaped seal packing, the
substrate-to-be-plated is interposed and clamped between the first
holding member and the second holding member so as to be held
therebetween, whereby the substrate surface-to-be-plated and the
protruding contact points come into contact with each other inside
the ring-shaped seal packing.
7. The substrate plating jig according to claim 6, wherein the
substrate-to-be-plated is interposed and clamped between the first
holding member and the second holding member so as to be held
therebetween, whereby the first ring-shaped conducting member
having multiple protruding contact points and the second conducting
member come into contact with each other inside the ring-shaped
seal packing and electricity is conducted.
8. The substrate plating jig according to claim 6, wherein contact
between the first conducting member and the second conducting
member is achieved by sliding contact.
9. The substrate plating jig according to claim 6, wherein the
fourth conducting member is connected directly to the first
ring-shaped conducting member having multiple protruding contact
points via wiring, and electricity is conducted.
10. The substrate plating jig according to claim 6, wherein the
first plate-shaped holding member and the second holding member are
connected by a hinge mechanism.
11. The substrate plating jig according to claim 9, wherein the
fourth conducting member is bent or expanded and contracted to be
accommodated inside the ring-shaped seal packing when the
substrate-to-be-plated is interposed and clamped between the first
holding member and the second holding member so as to be held
therebetween.
Description
TECHNICAL FIELD
[0001] The present invention relates to a plating jig for holding a
substrate when performing electrolytic plating on the
substrate.
BACKGROUND ART
[0002] When applying electrolytic plating on substrates such as
semiconductor wafers, glass plates, or ceramic plates, a plating
jig that holds the substrate is configured to cause a conducting
pin to come into contact with a conductive film on the substrate in
a state of holding the substrate. Subsequently, in a state of
holding the substrate with the plating jig, the substrate is
immersed in electrolytic plating solution in a plating solution
bath together with the jig, and electric current is passed from the
conducting pin, so that the electrolytic plating is achieved.
[0003] However, since the conducting pin of the plating jig of the
related art is exposed to the plating solution, plating is
precipitated also on the conducting pin, and hence plating
efficiency is low and replacement of the conducting pin requires
time.
[0004] Reported technologies to avoid exposure of the conducting
pin to the plating solution include, for example, a configuration
in which a sealing member to seal a semiconductor wafer is provided
so as to prevent plating solution from flowing over surfaces other
than a plating surface of the semiconductor wafer, and a cathode
contact point is provided on a surface of the sealed semiconductor
wafer that does not come into contact with the plating solution
(PTL 1).
[0005] The present inventors also report a plating jig for
semiconductor wafers provided with a conducting member having an
angular U-shape in a side view instead of the conducting pin inside
a seal packing and configured to cause the angular U-shaped
conducting member to come into contact with a conductive film
exposed to the surface of the semiconductor wafer so as to straddle
a member that conducts electricity with an external electrode (PTL
2).
[0006] Although these technologies can suppress exposure of the
conducting pin and the conducting member to the plating solution,
they have problems that the conducting pin and the conducting
member are not configured to reliably come into contact with the
semiconductor wafer for conducting electricity, replacement of the
conducting pin and the conducting member requires time because of
being too small in size, and replacement of the seal packing also
requires time.
CITATION LIST
Patent Literature
[0007] PTL 1: JP-A-6-108285
[0008] PTL 2: Japanese patent No. 3847434
SUMMARY OF INVENTION
Technical Problem
[0009] Accordingly, the present invention aims to provide a plating
jig which prevents a conducting pin and a conducting member from
being exposed to plating solution during plating of a substrate
such as a semiconductor wafer, a glass plate, or a ceramic plate,
ensures conduction of electricity to the substrate, and allows easy
replacement of the conducting pin, the conducting member, and a
seal packing.
Solution to Problem
[0010] As a result of earnest investigation to solve the
above-described problem, in a substrate plating jig including: a
second holding member provided with a ring-shaped seal packing
having an internal circumferential part and an external
circumferential part and an opening formed at the center of the
ring-shaped seal packing, wherein a substrate-to-be-plated is
interposed and clamped between the first holding member and the
second holding member so as to be held therebetween, so that
leading edges of the internal circumferential part and the external
circumferential part of the ring-shaped seal packing come into
close contact with a surface-to-be-plated of the
substrate-to-be-plated and the first holding member, respectively,
and an edge of the substrate-to-be-plated is held between the
internal circumferential part and the external circumferential part
of the ring-shaped seal packing, and the substrate
surface-to-be-plated is exposed in the opening, the present
inventors have found the fact that, by providing a special-shaped
conducting member inside the ring-shaped seal packing, the
conducting member is not exposed to plating solution during plating
of the substrate-to-be-plated, and conduction of electricity to the
substrate-to-be-plated is ensured and, in addition, replacement of
the seal packing can be easily performed. Thus the invention was
completed.
[0011] In other words, the present invention provides a substrate
plating jig including: a first plate-shaped holding member; and a
second holding member provided with a ring-shaped seal packing
having an internal circumferential part and an external
circumferential part and an opening formed at the center of the
ring-shaped seal packing, wherein a substrate-to-be-plated is
interposed and clamped between the first holding member and the
second holding member so as to be held therebetween, so that
leading edges of the internal circumferential part and the external
circumferential part of the ring-shaped seal packing come into
close contact with a surface-to-be-plated of the
substrate-to-be-plated and the first holding member, respectively,
and an edge of the substrate-to-be-plated is held between the
internal circumferential part and the external circumferential part
of the ring-shaped seal packing, and the substrate
surface-to-be-plated is exposed in the opening, wherein a first
ring-shaped conducting member having multiple protruding contact
points is provided inside the ring-shaped seal packing, and the
substrate-to-be-plated is interposed and clamped between the first
holding member and the second holding member so as to be held
therebetween, so that the substrate surface-to-be-plated and the
protruding contact points come into contact with each other inside
the ring-shaped seal packing.
Advantageous Effects of Invention
[0012] By using the substrate plating jig of the present invention,
the conducting member is not exposed to the plating solution, and
conduction of electricity to the substrate may be ensured and, in
addition, replacement of the seal packing is easily performed
during plating of substrates such as semiconductor wafers, glass
plates, or ceramic plates.
BRIEF DESCRIPTION OF DRAWINGS
[0013] [FIG. 1] FIG. 1 is a perspective view of an entire substrate
plating jig of the invention.
[0014] [FIG. 2] FIG. 2 is a general view of a first ring-shaped
conducting member 5 having multiple protruding contact points
(substantially trapezoidal shape) used for the substrate plating
jig of the invention.
[0015] [FIG. 3] FIG. 3 is a cross-sectional view taken along the
line A-A' in FIG. 2.
[0016] [FIG. 4] FIG. 4 is a partial view of the first ring-shaped
conducting member 5 having multiple protruding contact points
(substantially rectangular shape) used for the substrate plating
jig of the invention.
[0017] [FIG. 5] FIG. 5 is a partial view of the first ring-shaped
conducting member 5 having multiple protruding contact points
(substantially triangular shape) used for the substrate plating jig
of the invention.
[0018] [FIG. 6] FIG. 6 is a partial view of the first ring-shaped
conducting member 5 having multiple protruding contact points
(substantially rod shape) used for the substrate plating jig of the
invention.
[0019] [FIG. 7] FIG. 7 is a diagram illustrating a positional
relationship among members when a first holding member 2 of the
substrate plating jig of the invention is stacked on a second
holding member 3.
DESCRIPTION OF EMBODIMENTS
[0020] Hereinafter, a description of the present invention will be
continued by reference to drawings illustrating a mode of the
invention.
[0021] FIG. 1 is a perspective view of an entire substrate plating
jig configured to hold a circular semiconductor wafer. In the
drawing, reference numeral 1 denotes a substrate plating jig, 2
denotes a first holding member, 3 denotes a second holding member,
4 denotes a ring-shaped seal packing, 5 denotes a first ring-shaped
conducting member having multiple protruding contact points, 6
denotes an opening, 7 denotes a second conducting member, 8 denotes
a substrate base, 9 denotes a semiconductor wafer, 10 denotes a
grip, and 11 denotes a hinge mechanism.
[0022] The substrate base 8 having substantially the same shape as
the semiconductor wafer 9 is provided on an upper surface of the
first holding member 2. Although the height of the substrate base 8
is not specifically limited, a height sufficient for providing a
space which accommodates parts such as the first ring-shaped
conducting member 5 having multiple protruding contact points
inside the ring-shaped seal packing 4 is required. Also, the second
conducting member 7 configured to conduct electricity with an
external electrode is provided on the upper surface of the first
holding member 2. The second conducting member 7 is positioned so
as to come into contact with the first ring-shaped conducting
member 5 having multiple protruding contact points inside the
ring-shaped seal packing 4 and conduct electricity when the
semiconductor wafer 9 is interposed and clamped between the first
holding member 2 and the second holding member 3 so as to be held
therebetween. Electricity is conducted to the second conducting
member 7 by a connection between the second conducting member 7 and
a conductive member (not illustrated) embedded in the first holding
member 2 or drawn from a rear surface.
[0023] The shape of the second conducting member 7 is not
specifically limited as long as it allows the second conducting
member 7 to come into contact with the first ring-shaped conducting
member 5 having multiple protruding contact points easily, and
shapes of a leaf spring, a coil spring, and the like are
exemplified. A third conducting member (not illustrated) is
preferably provided at a position corresponding to the position
where the second conducting member 7 comes into contact with the
first ring-shaped conducting member 5 having multiple protruding
contact points in order to further ensure the contact. Although a
contact method between the second conducting member 7 and the third
conducting member of this case is not specifically limited, for
example, sliding contact utilizing a plug type conducting member is
preferable.
[0024] In the above description, electricity is conducted by the
second conducting member 7 which is configured to conduct
electricity with the external electrode and provided on the first
holding member 2 so as to come into contact with the first
ring-shaped conducting member 5 having multiple protruding contact
points. Basically, however, the method of conduction of electricity
from the external electrode to the first ring-shaped conducting
member 5 having multiple protruding contact points is not
specifically limited as long as sealing property of the ring-shaped
seal packing 4 is not hindered when the semiconductor wafer 9 is
interposed and clamped between the first holding member 2 and the
second holding member 3 so as to be held therebetween. Examples of
such a method include, in addition to the method described above, a
method where a fourth conducting member (not illustrated)
configured to conduct electricity with the external electrode is
provided on the first holding member 2 and is connected directly to
the first ring-shaped conducting member 5 having multiple
protruding contact points via wiring to conduct electricity. The
fourth conducting member used here is preferably formed of a soft
conductive member (not illustrated) and is configured to bend or
expand and contract so as to be accommodated inside the ring-shaped
seal packing 4 when the semiconductor wafer 9 is interposed and
clamped between the first holding member 2 and the second holding
member 3 so as to be held therebetween. Since the length of the
fourth conducting member may be decreased, the connection of the
fourth conducting member to the second conducting member 7 and the
first ring-shaped conducting member 5 having multiple protruding
contact points is preferably performed in the vicinity of the hinge
mechanism 11.
[0025] On the other hand, the second holding member 3 includes the
ring-shaped seal packing 4 and the opening 6 having a slightly
smaller inner diameter than the semiconductor wafer 9 at the center
of the seal packing 4 on an upper surface thereof. The first
ring-shaped conducting member 5 having multiple protruding contact
points is provided inside the ring-shaped seal packing 4. In
addition, the second holding member 3 may be provided with a groove
or a shoulder which allows the ring-shaped seal packing 4 to be
fixed easily.
[0026] The ring-shaped seal packing 4 is not specifically limited
as long as it has an internal circumferential part and an external
circumferential part, and is preferably formed into a substantially
C-shape, a substantially J-shape, a substantially U-shape, and a
substantially angular U-shape. Among these shapes, the
substantially angular U-shape having a higher edge on the external
circumferential part than on the internal circumferential part is
preferable.
[0027] The first ring-shaped conducting member 5 having multiple
protruding contact points is provided inside the ring-shaped seal
packing 4. FIG. 2 shows a general view of the first ring-shaped
conducting member 5 having multiple protruding contact points, and
FIG. 3 shows a cross-sectional view of the ring-shaped first
conducting member 5 having multiple protruding contact points taken
along the line A-A'.
[0028] The first ring-shaped conducting member 5 having multiple
protruding contact points has a size enough to be accommodated
inside the ring-shaped seal packing 4, and includes a ring-shaped
conducting member 5a and protruding contact points 5b. Multiple
protruding contact points 5b have, for example, a substantially
trapezoidal shape, a substantially rectangular shape, a
substantially triangular shape, or a substantially rod shape, and
are provided on the ring-shaped conducting member 5a toward a
center of the ring-shaped seal packing 4 or the opening 6 at an
angle of .theta.. Other examples of the shape of the protruding
contact points 5b are shown in FIG. 4 to FIG. 6. The protruding
contact points 5b may be formed separately from the ring-shaped
conducting member 5a and coupled with the ring-shaped conducting
member 5a by welding or the like. However, in terms of ease of
replacement, the ring-shaped conducting member 5a and the
protruding contact points 5b are preferably formed integrally by
press work or the like from a board-shaped material. The number of
the protruding contact points 5b cannot be specified because it
varies depending on the size of the semiconductor wafer, but six or
more is preferable. The angle .theta. of the protruding contact
points 5b provided on the ring-shaped conducting member 5a ranges
from 15 to 45.degree., preferably 30.degree.. The material of the
conducting member 5a and the protruding contact points 5b is not
specifically limited as long as it conducts electricity, and
materials such as phosphor bronze or stainless spring steel having
a certain degree of hardness and resiliency are exemplified. By
using the first ring-shaped conducting member 5 having multiple
protruding contact points as described above, electricity is surely
conducted to the semiconductor wafer 9 interposed and clamped
between the first holding member 2 and the second holding member 3
so as to be held therebetween. In addition, by providing the first
ring-shaped conducting member 5 having multiple protruding contact
points inside the ring-shaped seal packing 4, the ring-shaped seal
packing 4 may be held at a uniform pressure when the semiconductor
wafer 9 is interposed and clamped between the first holding member
2 and the second holding member 3 so as to be held therebetween and
hence, deformation of the seal packing may be reduced.
Consequently, the sealing property of the seal packing is improved,
and entry of the plating solution into the conducting portion may
be suppressed.
[0029] In order to fix the first ring-shaped conducting member 5
having multiple protruding contact points inside the ring-shaped
seal packing 4, chemical means such as a double-faced adhesive tape
or an adhesive agent, or physical means such as screwing may be
employed. If the physical means such as screwing is employed,
replacement of the ring-shaped seal packing 4 or the first
ring-shaped conducting member 5 having multiple protruding contact
points is easily performed.
[0030] In order to interpose and clamp the semiconductor wafer 9
between the first holding member 2 and the second holding member 3
and hold the same, for example, the hinge mechanism 11 is provided
on the first holding member 2 and the second holding member 3, and
edges on the sides opposite to the hinge mechanism 11 may be fixed
with a clamp or an angular U-shaped fixture (both not illustrated).
For the fixation of the first holding member 2 and the second
holding member 3, a clamper disclosed in Japanese Patent No.3629396
may be used.
[0031] FIG. 7 is a diagram illustrating a positional relationship
among the first holding member 2, the second holding member 3, the
ring-shaped seal packing 4, the first ring-shaped conducting member
5 having multiple protruding contact points, the second conducting
member 7, the substrate base 8, the semiconductor wafer 9, and a
conductive member 12 in a case where the second holding member 3 is
stacked on the first holding member 2. By stacking the second
holding member 3 on the first holding member 2, leading edges of an
internal circumferential part 4a and an external circumferential
part 4b of the ring-shaped seal packing 4 come into close contact
with a surface-to-be-plated of the semiconductor wafer 9 and the
first holding member 2, respectively, so as to be sealed. An edge
of the semiconductor wafer 9 is held between the internal
circumferential part 4a and the external circumferential part 4b of
the ring-shaped seal packing 4, and the surface-to-be-plated of the
semiconductor wafer 9 and the first ring-shaped conducting member 5
having multiple protruding contact points come into contact with
each other inside the ring-shaped seal packing 4. Further, the
second conducting member 7 that conducts electricity with the
external electrode through the conductive member 12 comes into
contact with the first ring-shaped conducting member 5 having
multiple protruding contact points, and thus electricity is
conducted. Consequently, the inside of the ring-shaped seal packing
4 is sealed, and hence the first ring-shaped conducting member 5
having multiple protruding contact points and the second conducting
member 7 conducting electricity with the external electrode are not
exposed to the plating solution.
[0032] By performing electrolytic plating using the substrate
plating jig described thus far, the conducting member is not
exposed to the plating solution and conduction of electricity to
the substrate may be ensured and, in addition, easy replacement of
the seal packing is enabled.
INDUSTRIAL APPLICABILITY
[0033] The substrate plating jig of the invention may be used for
manufacture of semiconductors.
REFERENCE SIGNS LIST
[0034] 1: substrate plating jig
[0035] 2: first holding member
[0036] 3: second holding member
[0037] 4: ring-shaped seal packing
[0038] 4a: internal circumferential part
[0039] 4b: external circumferential part
[0040] 5: first ring-shaped conducting member having multiple
protruding contact points
[0041] 5a: ring-shaped conducting member
[0042] 5b: protruding contact point
[0043] 6: opening
[0044] 7: second conducting member
[0045] 8: substrate base
[0046] 9: semiconductor wafer
[0047] 10: grip
[0048] 11: hinge mechanism
[0049] 12: conductive member
* * * * *