U.S. patent application number 14/252378 was filed with the patent office on 2015-01-15 for heat sink.
This patent application is currently assigned to HON HAI PRECISION INDUSTRY CO., LTD.. The applicant listed for this patent is HON HAI PRECISION INDUSTRY CO., LTD.. Invention is credited to CHIH-TA HUANG, TAI-WEI LIN.
Application Number | 20150013955 14/252378 |
Document ID | / |
Family ID | 52276195 |
Filed Date | 2015-01-15 |
United States Patent
Application |
20150013955 |
Kind Code |
A1 |
LIN; TAI-WEI ; et
al. |
January 15, 2015 |
HEAT SINK
Abstract
A heat sink includes a base and a number of fins mounted
parallelly on the base. Each fin defines a number of vents, and two
heat dissipating pieces protrude from opposite sides of each vent.
The heat dissipating pieces of each vent cooperatively bounds an
opening communicating with the corresponding vent. The number of
openings of each fin is aligned with the number of openings of the
other fins. The aligned openings of the number of fins
cooperatively define a number of first air channels perpendicular
to the number of fins. The number of heat dissipating pieces bound
a number of second air channels parallel to the number of fins.
Inventors: |
LIN; TAI-WEI; (New Taipei,
TW) ; HUANG; CHIH-TA; (New Taipei, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
HON HAI PRECISION INDUSTRY CO., LTD. |
New Taipei |
|
TW |
|
|
Assignee: |
HON HAI PRECISION INDUSTRY CO.,
LTD.
New Taipei
TW
|
Family ID: |
52276195 |
Appl. No.: |
14/252378 |
Filed: |
April 14, 2014 |
Current U.S.
Class: |
165/185 |
Current CPC
Class: |
F28F 3/027 20130101;
H01L 2924/0002 20130101; H01L 23/3672 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101; H01L 23/467 20130101; F28F 3/06
20130101; F28F 2215/08 20130101 |
Class at
Publication: |
165/185 |
International
Class: |
F28F 3/08 20060101
F28F003/08 |
Foreign Application Data
Date |
Code |
Application Number |
Jul 10, 2013 |
TW |
102124785 |
Claims
1. A heat sink, comprising: a base; and a plurality of parallel
fins mounted on the base, wherein each fin defines a plurality of
vents, and at least two heat dissipating pieces protruding from
each fin bounding two opposite sides of each vent, the heat
dissipating pieces at opposite sides of each vent cooperatively
bound an opening communicating with the corresponding vent, the
plurality of openings of each fin is aligned with the plurality of
openings of the other fins, the aligned openings of the plurality
of fins form a plurality of first air channels perpendicular to the
plurality of fins, the plurality of heat dissipating pieces of each
fin bound a plurality of second air channels parallel to the
plurality of fins.
2. The heat sink of claim 1, wherein each fin is substantially
rectangular, the plurality of vents is arrayed along a lengthwise
direction and a widthwise direction of the fin.
3. The heat sink of claim 2, wherein each vent is substantially
rectangular.
Description
FIELD
[0001] The present disclosure relates to a heat sink.
BACKGROUND
[0002] During operation of many electronic devices, electronic
components of the electronic devices generate large amounts of
heat. The heat must be immediately removed to prevent the
electronic devices from being damaged. Heat sinks are frequently
used to dissipate heat from the electronic devices. The heat sinks
may include a number of parallel fins. The fins cooperatively
define a number of parallel ventilation slots aligning with system
airflow to assist in dissipating heat.
BRIEF DESCRIPTION OF THE DRAWINGS
[0003] Many aspects of the present embodiments can be better
understood with reference to the following drawings. The components
in the drawings are not necessarily drawn to scale, the emphasis
instead being placed upon clearly illustrating the principles of
the present embodiments. Moreover, in the drawings, like reference
numerals designate corresponding parts throughout the several
views.
[0004] FIG. 1 is an exploded, isometric view of an embodiment of a
heat sink and an electronic component.
[0005] FIG. 2 is an assembled view of FIG. 1.
[0006] FIG. 3 is a sectional view of FIG. 2, taken along line
III-III.
DETAILED DESCRIPTION
[0007] The present disclosure, including the accompanying drawings,
is illustrated by way of examples and not by way of limitation. It
should be noted that references to "an" or "one" embodiment in this
disclosure are not necessarily to the same embodiment, and such
references mean "at least one."
[0008] FIG. 1 illustrates an embodiment of a heat sink 100 for
dissipating heat from an electronic component 200. The heat sink
100 comprises a base 101 and a plurality of substantially parallel
fins 10.
[0009] FIGS. 2 and 3 illustrate assembled views of the heat sink
100 and the electronic component 200. In the embodiment of FIGS. 2
and 3, each fin 10 is substantially rectangular and defines a
plurality of substantially rectangular vents 111. The vents 111 are
arrayed along a lengthwise direction and a widthwise direction of
the fin 10. Two heat dissipating pieces 12 substantially
perpendicularly extend from opposite sides of each vent 111. The
heat dissipating pieces 12 of each vent 111 cooperatively bound an
opening 13 communicating with the corresponding vent 111.
[0010] The fins 10 are mounted on the base 101, such that the vents
111 of the fins 10 align with each other. The aligned vents 111 of
the fins 10 cooperatively define a plurality of first air channels
14 extending along a direction substantially perpendicular to the
fins 10. The openings 13 bound by the heat dissipating pieces 12
cooperatively define a plurality of second air channels 15
extending along a direction substantially parallel to the fins
10.
[0011] In use, a bottom surface of the base 101 is attached to the
electronic component 200, such that heat generated by the
electronic component 200 is transferred to the base 101 and the
fins 10. If system airflow aligns with the first air channels 14,
the system airflow flows through the first air channels 14. Thus,
the system airflow can fully contact the fins 10 to increase
heat-dissipation ability of the fins 10. If the system airflow
aligns with the second air channels 15, the system airflow flows
through the second channels 15. Thus, heat-dissipation ability of
the fins 10 is similarly increased.
[0012] Even though numerous characteristics and advantages of the
embodiments have been set forth in the foregoing description,
together with details of the structure and function of the
embodiments, the present disclosure is illustrative only, and
changes may be made in detail, especially in the matters of shape,
size, and arrangement of parts within the principles of the
embodiments to the full extent indicated by the broad general
meaning of the terms in which the appended claims are
expressed.
* * * * *