Lin; Tai-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lin; Tai-Wei.The latest application filed is for "heat dissipation system".
Company Profile
0.24.50
- Lin; Tai-Wei - New Taipei TW
- LIN; TAI-WEI - Tu-Cheng TW
- Lin; Tai-Wei - Taipei Hsien TW
- Lin; Tai-Wei - Hsin-Chu N/A TW
- Lin; Tai-Wei - Hsinchu Science Park TW
- Lin; Tai-Wei - Hsinchu TW
- LIN; Tai-Wei - Hsinchu City TW
- Lin; Tai-Wei - I-Lan City TW
- Lin; Tai Wei - Taipei City TW
Patent Activity
| Patent | Date |
|---|---|
| Container data center Grant 9,609,784 - Lin March 28, 2 | 2017-03-28 |
| Container data center Grant 9,426,925 - Lin August 23, 2 | 2016-08-23 |
| Heat Dissipation System App 20150114616 - LIN; TAI-WEI | 2015-04-30 |
| Heat Dissipation System App 20150096715 - LIN; TAI-WEI | 2015-04-09 |
| Electronic Device With Heat Dissipation Function App 20150062826 - LIN; TAI-WEI | 2015-03-05 |
| Container data center system Grant 8,966,930 - Lin March 3, 2 | 2015-03-03 |
| Heat Sink App 20150013955 - LIN; TAI-WEI ; et al. | 2015-01-15 |
| Chassis Of Electronic Device App 20140323028 - LIN; TAI-WEI ; et al. | 2014-10-30 |
| Container Data Center App 20140287670 - LIN; TAI-WEI | 2014-09-25 |
| Container Data Center App 20140199934 - LIN; TAI-WEI | 2014-07-17 |
| Cooling System App 20140182812 - LIN; TAI-WEI | 2014-07-03 |
| Cooling system for electronic device and electronic device having same Grant 8,717,763 - Lin , et al. May 6, 2 | 2014-05-06 |
| Container Data Center App 20140120824 - Lin; Tai-Wei | 2014-05-01 |
| Room And Container Data Center In The Room App 20140120825 - LIN; TAI-WEI ; et al. | 2014-05-01 |
| Electronic Device Having Fans App 20140118938 - LIN; TAI-WEI | 2014-05-01 |
| Air Duct And Heat Dissipation System Having The Same App 20140110089 - LIN; TAI-WEI | 2014-04-24 |
| Electronic Device With Heat Dissipation Module App 20140111939 - LIN; TAI-WEI | 2014-04-24 |
| Container Data Center App 20140016256 - LIN; TAI-WEI | 2014-01-16 |
| Container Data Center App 20140016255 - LIN; TAI-WEI | 2014-01-16 |
| Electronic device with heat dissipation apparatus Grant 8,625,275 - Lin January 7, 2 | 2014-01-07 |
| Computer casing Grant 8,625,274 - Lin January 7, 2 | 2014-01-07 |
| Internet-protocol camera device with heat dissipation plates Grant 8,582,025 - Lin November 12, 2 | 2013-11-12 |
| Cooling System For Electronic Device And Electronic Device Having Same App 20130286584 - LIN; TAI-WEI | 2013-10-31 |
| Container data center having high heat dissipating efficiency Grant 8,488,313 - Lin July 16, 2 | 2013-07-16 |
| Container data center system Grant 8,477,489 - Lin July 2, 2 | 2013-07-02 |
| Electronic Device With Heat Dissipation Apparatus App 20130163176 - LIN; TAI-WEI | 2013-06-27 |
| Cooling System For Electronic Device And Electronic Device Having Same App 20130155614 - LIN; TAI-WEI ; et al. | 2013-06-20 |
| Cooling System App 20130105136 - CHEN; CHIN-HUI ; et al. | 2013-05-02 |
| Cooling System For Electronic Device And Electronic Device Having Same App 20130094143 - LIN; TAI-WEI | 2013-04-18 |
| Computer Casing App 20130083478 - LIN; TAI-WEI | 2013-04-04 |
| Container data center Grant 8,405,977 - Lin March 26, 2 | 2013-03-26 |
| Container Data Center Having High Heat Dissipating Efficiency App 20130050935 - LIN; Tai-Wei | 2013-02-28 |
| Heat dissipation module and projection apparatus using the same Grant 8,371,700 - Lin , et al. February 12, 2 | 2013-02-12 |
| Cooling System App 20130014532 - TAN; ZEU-CHIA ; et al. | 2013-01-17 |
| Container Data Center System App 20130008197 - LIN; TAI-WEI | 2013-01-10 |
| Printed circuit board with heat sink Grant 8,339,788 - Lin December 25, 2 | 2012-12-25 |
| Container Data Center App 20120244793 - LIN; TAI-WEI ; et al. | 2012-09-27 |
| Container Data Center App 20120168141 - LIN; TAI-WEI | 2012-07-05 |
| Heat Dissipation Device App 20120162919 - LIN; TAI-WEI | 2012-06-28 |
| Container Data Center System App 20120152777 - LIN; TAI-WEI | 2012-06-21 |
| Modular Data Center App 20120147543 - SU; TSUNG-HAN ; et al. | 2012-06-14 |
| Internet-protocol Camera Device With Heat Dissipation Plates App 20120140113 - LIN; TAI-WEI | 2012-06-07 |
| Printed Circuit Board With Heat Sink App 20120120606 - LIN; TAI-WEI | 2012-05-17 |
| Heat dissipation module and projection apparatus using the same App 20100265468 - Lin; Tai-Wei ; et al. | 2010-10-21 |
| Optoelectronic semiconductor package and method for attaching heat dissipation element thereto Grant 7,781,885 - Lin , et al. August 24, 2 | 2010-08-24 |
| Illumination module and projection apparatus Grant 7,740,379 - Lin , et al. June 22, 2 | 2010-06-22 |
| Optoelectronic Semiconductor Package And Method For Attaching Heat Dissipation Element Thereto App 20090052483 - LIN; Tai-Wei ; et al. | 2009-02-26 |
| Illumination Module And Projection Apparatus App 20080232100 - Lin; Tai-Wei ; et al. | 2008-09-25 |
| Interactive Entertainment Robot and Method of Controlling the Same App 20080215183 - Chen; Ying-Tsai ; et al. | 2008-09-04 |
| Socket With Force Appplying Member App 20070134971 - Chen; Michael ; et al. | 2007-06-14 |
| Socket with force applying member Grant 7,226,306 - Chen , et al. June 5, 2 | 2007-06-05 |
| Conveying apparatus of a vehicle washing machine App 20070028796 - Lin; Tai Wei | 2007-02-08 |
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