U.S. patent application number 14/245813 was filed with the patent office on 2014-08-07 for vapor deposition reactor and method for forming thin film.
This patent application is currently assigned to Veeco ALD Inc.. The applicant listed for this patent is Veeco ALD Inc.. Invention is credited to Sang In Lee.
Application Number | 20140219905 14/245813 |
Document ID | / |
Family ID | 43300948 |
Filed Date | 2014-08-07 |
United States Patent
Application |
20140219905 |
Kind Code |
A1 |
Lee; Sang In |
August 7, 2014 |
VAPOR DEPOSITION REACTOR AND METHOD FOR FORMING THIN FILM
Abstract
A vapor deposition reactor and a method for forming a thin film.
The vapor deposition reactor includes at least one first injection
portion for injecting a reacting material to a recess in a first
portion of the vapor deposition reactor. A second portion is
connected to the first space and has a recess connected to the
recess of the first portion. The recess of the second portion is
maintained to have pressure lower than the pressure in the first
space. A third portion is connected to the second space, and an
exhaust portion is connected to the third space.
Inventors: |
Lee; Sang In; (Sunnyvale,
CA) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Veeco ALD Inc. |
Fremont |
CA |
US |
|
|
Assignee: |
Veeco ALD Inc.
Fremont
CA
|
Family ID: |
43300948 |
Appl. No.: |
14/245813 |
Filed: |
April 4, 2014 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12794209 |
Jun 4, 2010 |
8758512 |
|
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14245813 |
|
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|
61185076 |
Jun 8, 2009 |
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Current U.S.
Class: |
423/411 ;
427/255.28 |
Current CPC
Class: |
C23C 16/34 20130101;
C23C 16/40 20130101; C01B 21/076 20130101; C23C 16/45551 20130101;
C23C 16/32 20130101 |
Class at
Publication: |
423/411 ;
427/255.28 |
International
Class: |
C23C 16/455 20060101
C23C016/455; C01B 21/076 20060101 C01B021/076 |
Claims
1. A method for forming a thin film, comprising: filling a first
material in a first recess formed in a first portion of a vapor
deposition reactor to a first pressure by providing the first
material via at least one injection portion; receiving the first
material in a second recess formed in a second portion of the vapor
deposition reactor via the first recess, the second portion located
adjacent to the first portion, the second recess having a height
not greater than 2/3 of a width of the first recess; discharging
the first material via a third recess communicatively connected to
the second recess; and moving a portion of a substrate below the
first recess, the second recess and the third recess.
2. The method of claim 1, wherein the first material comprises one
or more selected from the group consisting of a source precursor, a
reactant precursor and an inert gas.
3. The method of claim 2, wherein the source precursor comprises an
inorganic compound and/or an organic compound.
4. The method of claim 2, wherein the reactant precursor comprises
one or more selected from the group consisting of H.sub.2O,
H.sub.2O.sub.2, O.sub.2, N.sub.2O, NO, O.sub.3, O* radical,
NH.sub.3, NH.sub.2--NH.sub.2, N* radical, CO, CO.sub.2, CH.sub.4,
C.sub.2H.sub.6, H.sub.2 and H* radical.
5. The method of claim 2, wherein the inert gas comprises one or
more selected from the group consisting of N.sub.2, Ar and He.
6. The method of claim 1, further comprising: filling a second
material in a fourth recess of the vapor deposition reactor;
receiving the second material in a fifth recess of the vapor
deposition reactor via the fourth recess; receiving the second
material in a sixth recess of the vapor deposition reactor via the
fifth recess; and moving the portion of the substrate below the
fourth recess, the fifth recess and the sixth recess.
7. The method of claim 6, wherein the second material comprises one
or more selected from the group consisting of a source precursor, a
reactant precursor and an inert gas.
8. The method of claim 7, wherein the source precursor comprises an
inorganic compound and/or an organic compound.
9. The method of claim 7, wherein the reactant precursor comprises
one or more selected from the group consisting of H.sub.2O,
H.sub.2O.sub.2, O.sub.2, N.sub.2O, NO, O.sub.3, O* radical,
NH.sub.3, NH.sub.2--NH.sub.2, N* radical, CO, CO.sub.2, CH.sub.4,
C.sub.2H.sub.6, H.sub.2 and H* radical.
10. The method of claim 7, wherein the inert gas comprises one or
more selected from the group consisting of N.sub.2, Ar and He.
11. The method of claim 6, wherein the portion of the substrate
moves below fourth recess, the fifth recess and the sixth recess
after moving below the first recess, the second recess and the
third recess.
12. The method of claim 6, wherein atomic layer deposition is
performed on the portion of the substrate by moving the portion of
the substrate below the first recess, the second recess, the third
recess, the fourth recess, the fifth recess and the sixth
recess.
13. The method of claim 1, wherein the height of the second recess
is not greater than 1/3 of the width of the first recess.
14. The method claim 1, wherein a distance between the substrate to
the vapor deposition reactor is 0.5 mm to 3 mm.
15. A substrate deposited with a thin film, the thin film deposited
on the substrate by a process comprising: filling a first material
in a first recess formed in a first portion of a vapor deposition
reactor to a first pressure by providing the first material via at
least one injection portion; receiving the first material in a
second recess formed in a second portion of the vapor deposition
reactor via the first recess, the second portion located adjacent
to the first portion, the second recess having a height not greater
than 2/3 of a widths of the first recess; discharging the first
material via a third recess communicatively connected to the second
recess; and moving a portion of a substrate below the first recess,
the second recess and the third recess.
16. The substrate of claim 15, wherein the first material comprises
one or more selected from the group consisting of a source
precursor, a reactant precursor and an inert gas.
17. The substrate of claim 16, wherein the source precursor
comprises an inorganic compound and/or an organic compound.
18. The substrate of claim 16, wherein the reactant precursor
comprises one or more selected from the group consisting of
H.sub.2O, H.sub.2O.sub.2, O.sub.2, N.sub.2O, NO, O.sub.3, O*
radical, NH.sub.3, NH.sub.2--NH.sub.2, N* radical, CO, CO.sub.2,
CH.sub.4, C.sub.2H.sub.6, H.sub.2 and H* radical.
19. The substrate of claim 16, wherein the inert gas comprises one
or more selected from the group consisting of N.sub.2, Ar and
He.
20. The substrate of claim 15, wherein the process further
comprises: filling a second material in a fourth recess of the
vapor deposition reactor; receiving the second material in a fifth
recess of the vapor deposition reactor via the fourth recess;
receiving the second material in a sixth recess of the vapor
deposition reactor via the fifth recess; and moving the portion of
the substrate below the fourth recess, the fifth recess and the
sixth recess.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional application and claims
priority to U.S. patent application Ser. No. 12/794,209 entitled
"Vapor Deposition Reactor and Method for Forming Thin Film," filed
on Jun. 4, 2010, which claims priority from and the benefit under
35 U.S.C. .sctn.119(e) of U.S. Patent Application No. 61/185,076,
entitled "Reactor Apparatus For Atomic Layer Deposition And Method
Of Forming Thin Film Using The Reactor Apparatus," filed on Jun. 8,
2009, which is incorporated by reference herein in its entirety.
This application is related to U.S. patent application Ser. No.
12/539,477, entitled "Vapor Deposition Reactor For Forming Thin
Film," filed on Aug. 11, 2009 (now issued as U.S. Pat. No.
8,470,718); U.S. patent application Ser. No. 12/539,490, entitled
"Vapor Deposition Reactor," filed on Aug. 11, 2009; and U.S. patent
Ser. No. 12/560,690, entitled "Vapor Deposition Reactor Using
Plasma And Method for Forming Thin Film Using the Same," filed on
Sep. 16, 2009, which are incorporated by reference herein in their
entirety.
BACKGROUND
[0002] 1. Field of the Invention
[0003] The disclosure relates to a vapor deposition reactor and a
method for forming a thin film using the same.
[0004] 2. Description of the Related Art
[0005] In general, a showerhead-type reactor is used in chemical
vapor deposition (CVD) for injecting a precursor. In the
showerhead-type reactor deposition is performed by mixing a source
precursor and a reactant precursor within the interior of a
showerhead and then spraying the mixed precursors onto a substrate.
On the other hand, in a reactor for atomic layer deposition (ALD),
a source precursor and a reactant precursor are alternately sprayed
so that they are not mixed with each other. Based on the direction
of the precursor spray, reactors are divided into (i) a cross-flow
or traveling-wave type reactor and (ii) a type of reactor that
injects the precursor vertically to the surface of the substrate.
The cross-flow or traveling-wave type reactor injects a precursor
in a direction parallel to a surface of a substrate surface for
deposition of the precursor.
[0006] The ALD uses the bonding force of a chemisorbed layer that
is different from the bonding force of a physisorbed layer. In the
ALD, a precursor is absorbed into the surface of a substrate and
then purged with an inert gas. As a result, physisorbed molecules
of the precursor (bonded by the Van der Waals force) are desorbed
from the substrate. However, chemisorbed molecules of the precursor
are covalently bonded, and hence, these molecules are strongly
adsorbed in the substrate. Hence, the chemisorbed molecules are not
desorbed from the substrate. The ALD is performed using the
properties that the chemisorbed molecules of the precursor
(adsorbed in the substrate) react and/or replace a reactant
precursor.
[0007] More specifically, a source precursor is injected into a
chamber so that the source precursor is excessively adsorbed on a
substrate. Then, the excessive precursor or physisorbed molecules
are removed by injecting a purge gas and/or pumping the chamber,
causing only chemisorbed molecules to remain on the substrate. The
chemisorbed molecules results in a mono molecule layer.
Subsequently, a reactant precursor (or replacement agent) is
injected into the chamber. Then, the excessive precursor or
physisorbed molecules are removed by injecting the purge gas and/or
pumping the chamber, obtaining a final atomic layer.
[0008] In the ALD, a basic unit consisting of these four processes
is usually referred to as a cycle. If a chemisorbed layer in a
saturation state is obtained, a deposition velocity of about 1
.ANG. per cycle is obtained. However, when a precursor is not
adsorbed on the substrate in the saturation state, a deposition
velocity is slower than about 1 .ANG. per cycle. If the physisorbed
molecule layer is not completely removed but a portion of the
physisorbed molecule layer remains on the substrate, the deposition
velocity is increased.
[0009] In the ALD, one atomic monolayer is usually formed per
cycle. In the ALD, a source precursor, a reactant precursor and a
purge gas are repeatedly injected into a chamber, and a valve and a
pump are used for exhaustion. For example, the ALD technique has
been disclosed in U.S. Pat. Nos. 7,422,636, 7,402,210, 6,511,539
and 6,820,570, which are incorporated by reference herein in their
entirety.
[0010] If precursors injected into a chamber in each process remain
in the chamber, a vapor phase reaction (referred to as a CVD
reaction) occurs through the reaction of a source precursor and a
reactant precursor. Therefore, only a valve for ALD operated at a
high speed is necessary to perform the ALD, and purging and/or
pumping must be performed so that no precursor remains in the
chamber. At this time, the valve used for ALD requires an extended
operation times. For example, operation times of more than 10.sup.3
for each of the processes of injecting the source precursor,
purging, injecting the reactant precursor, purging and the like are
usually necessary to deposit an atomic layer with a thickness of
100 nm. As a result, the lifetime of the valve is shortened, and
its reliability is decreased. As the number of operation times of
the valve operated at a high speed is increased, problems related
to the lifetime of the valve occur, such as erroneous operations or
particles.
[0011] However, when a thin film is formed using the ALD, it is
important to form the thin film having uniform characteristics
(i.e., physical, chemical and electrical characteristics) required
to satisfy requirements of a device. To this end, it is necessary
that times at which the respective source and reactant precursors
reach a substrate be identical in the injection of the source and
the reactant precursor. In the cross-flow or traveling-wave type
reactor in which precursors used for the ALD are injected parallel
to a substrate, an adsorption phenomenon is gradually performed
while the substrate is passes from the side adjacent to an
injection portion of the precursors and to the side of an exhaust
portion. Therefore, the adsorption phenomenon is represented by a
function of time. Particularly, for a large-area substrate, such a
phenomenon becomes more pronounced, and therefore, the composition,
thickness or property of the thin film varies depending on each
portion of the substrate. Particularly, the compositions,
thicknesses or properties of the thin films respectively positioned
at the injection and exhaust portions are different from each
other.
[0012] In the reactor for receiving the precursors, the precursors
are injected in a direction vertical to the substrate to avoid such
a problem. However, when the distance between the injection portion
(typically, showerhead) of the precursors and the substrate is
short, the thickness of the thin film is increased or decreased by
the proximity phenomenon in the vicinity of a hole of the
showerhead through which the precursors are injected, and
therefore, an irregular thin film having a hole pattern of the
showerhead is obtained. Accordingly, the distance between the
injection portion and the substrate need to be sufficiently large.
As a result, the space portion of the chamber is increased. Also, a
large amount of precursor is required because a sufficient amount
of precursor is necessarily filled in the interior of the chamber
for the purpose of saturation adsorption of precursors on a surface
of the substrate. Also, the source precursors and the reactant
precursors do not come in contact with each other so as to avoid a
CVD reaction. Therefore, much time is taken to perform sufficient
purging and/or pumping to prevent the source precursors or reactant
precursors from remaining in the chamber. In addition, since the
source precursors and the reactant precursors are exhausted through
the same exhaust line, a reactant byproduct (e.g., powder, gum or
the like) is produced by the reaction of these precursors.
Therefore, the reliability, durability and economy of the device
are decreased as well as yielding thinner film.
[0013] In U.S. Pat. No. 6,821,563, for example, gas steam flowed
through a plurality of gas ports is supplied to a substrate, and
purge and pump ports are installed adjacent to each other so that
the ALD is performed by purging and pumping while consecutively
injecting precursors. However, partitions for isolating or
separating the ports from each other are installed, and pumping
ports are positioned at both sides of each of the partitions,
respectively. Hence, its structure is complicated. In addition,
since the partitions serve as only physical barriers for isolating
the ports from each other, there is a structural limitation in that
pumping ports are necessarily positioned at both sides (or left and
right sides) of each of the ports through which the precursors are
injected or purged.
SUMMARY OF THE INVENTION
[0014] Embodiments provide a vapor deposition reactor of a
closed-loop type, which performs within its interior, a series of
processes of adsorbing a source precursor or a reactant precursor
on a substrate, desorbing physisorbed molecule layer of the source
precursor or the reactant precursor and externally exhausting the
desorbed molecule layer.
[0015] In one embodiment, the vapor deposition reactor includes at
least one first injection portion. The at least one first injection
portion injects a first material. A first portion of the vapor
deposition reactor has a first recess formed therein. The first
recess is connected to the at least one first injection portion to
receive the first material. A second portion is adjacent to the
first portion and has a second recess formed therein. The second
recess is connected to the first recess so that the first material
via the first recess. A third portion has a third recess formed
therein that is connected to the second recess, and receives the
first material via the second recess. The pressure of the third
recess is maintained lower than the first recess by an exhaust
portion. A substrate moves across the first recess, the second
recess and the third recess to absorb the first material in its
surface.
[0016] In one embodiment, the first portion includes a plurality of
first recesses, and the second portion includes a plurality of
second recesses. The vapor deposition reactor may be configured by
sequentially connecting the recesses in one of the first recesses,
one of the second recesses, the third recess of the third portion,
another of the first recesses and another of the second
recesses.
[0017] In one embodiment, the vapor deposition reactor further
includes an additional first portion and an additional second
portion. The additional first portion and the additional second
portion have an additional first recess and an additional second
recess formed therein, respectively. The pressure in the additional
second recess is lower than the pressure in the additional first
recess. The additional first and second recesses are filled with a
second material. The substrate moves across the first and second
recesses to absorb the second material on the substrate.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The above and other aspects, features and advantages of the
present invention will become apparent from the following
description of preferred embodiments given in conjunction with the
accompanying drawings, in which:
[0019] FIG. 1A is a sectional view of a vapor deposition reactor
according to one embodiment.
[0020] FIG. 1B is a bottom view of the vapor deposition reactor of
FIG. 1A, according to one embodiment.
[0021] FIG. 1C is a sectional view of a first portion in the vapor
deposition reactor of FIG. 1A, according to one embodiment.
[0022] FIG. 1D is a sectional view of a second portion in the vapor
deposition reactor of FIG. 1A, according to one embodiment.
[0023] FIG. 1E is a sectional view of a third portion in the vapor
deposition reactor of FIG. 1A, according to one embodiment.
[0024] FIGS. 2A to 2D are partial sectional views of vapor
deposition reactors, according to embodiments.
[0025] FIG. 3 is a bottom view of a vapor deposition reactor,
according to one embodiment.
[0026] FIGS. 4A to 4C are partial sectional views of the vapor
deposition reactor of FIG. 3, according to one embodiment.
[0027] FIG. 5 is a bottom view of a vapor deposition reactor
according to still another embodiment.
[0028] FIGS. 6A to 6C are partial sectional views of the vapor
deposition reactor of FIG. 5, according to one embodiment.
[0029] FIGS. 7A to 7C are partial sectional views of a vapor
deposition reactor, according to one embodiment.
[0030] FIG. 8A is a bottom view of a vapor deposition reactor,
according to one embodiment.
[0031] FIGS. 8B and 8C are partial sectional views of the vapor
deposition reactor of FIG. 8A, according to one embodiment.
[0032] FIGS. 9A and 9B are partial sectional views of a vapor
deposition reactor, according to one embodiment.
[0033] FIG. 10A is a sectional view of a vapor deposition reactor,
according to one embodiment.
[0034] FIG. 10B is a bottom view of the vapor deposition reactor of
FIG. 10A, according to one embodiment.
[0035] FIG. 11 is a sectional view of a vapor deposition reactor,
according to one embodiment.
[0036] FIG. 12 is a sectional view of a vapor deposition reactor,
according to one embodiment.
[0037] FIG. 13A is a sectional view of a vapor deposition reactor,
according to one embodiment.
[0038] FIG. 13B is a bottom view of the vapor deposition reactor of
FIG. 13A, according to one embodiment.
[0039] FIG. 14 is a sectional view of a vapor deposition reactor,
according to one embodiment.
[0040] FIG. 15A is a sectional view of a vapor deposition reactor,
according to one embodiment.
[0041] FIG. 15B is a bottom view of the vapor deposition reactor of
FIG. 15A, according to one embodiment.
[0042] FIGS. 16A to 16C are flowcharts illustrating method for
forming a thin film according to embodiments.
[0043] FIGS. 17A to 17E are exemplary sectional views of atomic
layer deposition (ALD) equipments including vapor deposition
reactors, according to embodiments.
[0044] FIGS. 18A to 18D are exemplary plan views of ALD equipments
including vapor deposition reactors, according to embodiments.
[0045] FIG. 19 is a schematic view of an experimental apparatus
using a vapor deposition reactor, according to one embodiment.
[0046] FIG. 20 is a schematic perspective view of a portion of the
vapor deposition reactor in the experimental apparatus of FIG. 19,
according to one embodiment.
[0047] FIG. 21A is a schematic sectional view of the experimental
apparatus of FIG. 19, according to one embodiment.
[0048] FIG. 21B is a schematic sectional view of a coaxial plasma
generator of the experimental apparatus of FIG. 19, according to
one embodiment.
[0049] FIGS. 22A to 22D are scanning electron microscope (SEM)
photographs of a TiN thin film formed using a vapor deposition
reactor, according to one embodiment.
[0050] FIGS. 23A to 23D are transmission electron microscope (TEM)
photographs of a TiN thin film formed using a vapor deposition
reactor, according to one embodiment.
[0051] FIGS. 24A to 24D are TEM photographs of a TiN thin film
formed using a vapor deposition reactor, according to one
embodiment.
DETAILED DESCRIPTION OF THE INVENTION
[0052] Exemplary embodiments now will be described more fully
hereinafter with reference to the accompanying drawings, in which
exemplary embodiments are shown. This disclosure may, however, be
embodied in many different forms and should not be construed as
limited to the exemplary embodiments set forth therein. Rather,
these example embodiments are provided so that this disclosure will
be thorough and complete, and will fully convey the scope of this
disclosure to those skilled in the art. In the description, details
of well-known features and techniques may be omitted to avoid
unnecessarily obscuring the presented embodiments.
[0053] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
this disclosure. As used herein, the singular forms "a", "an" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. Furthermore, the use of the
terms a, an, etc. does not denote a limitation of quantity, but
rather denotes the presence of at least one of the referenced item.
The use of the terms "first", "second", and the like does not imply
any particular order, but they are included to identify individual
elements. Moreover, the use of the terms first, second, etc. does
not denote any order or importance, but rather the terms first,
second, etc. are used to distinguish one element from another. It
will be further understood that the terms "comprises" and/or
"comprising", or "includes" and/or "including" when used in this
specification, specify the presence of stated features, regions,
integers, steps, operations, elements, and/or components, but do
not preclude the presence or addition of one or more other
features, regions, integers, steps, operations, elements,
components, and/or groups thereof.
[0054] Unless otherwise defined, all terms (including technical and
scientific terms) used herein have the same meaning as commonly
understood by one of ordinary skill in the art. It will be further
understood that terms, such as those defined in commonly used
dictionaries, should be interpreted as having a meaning that is
consistent with their meaning in the context of the relevant art
and the present disclosure, and will not be interpreted in an
idealized or overly formal sense unless expressly so defined
herein.
[0055] In the drawings, like reference numerals in the drawings
denote like elements. The shape, size and regions, and the like, of
the drawing may be exaggerated for clarity.
[0056] FIG. 1A is a sectional view of a vapor deposition reactor
according to an embodiment. FIG. 1B is a bottom view of the vapor
deposition reactor of FIG. 1A. A body 9 of the vapor deposition
reactor includes a first portion 10, a second portion 20 and a
third portion 30. Recesses or space formed in the first, second and
third portions 10, 20 and 30 may be connected to one another to
allow gas to communicate. The vapor deposition reactor may include
one or more injection portions 11 for injecting a reacting material
into the first portion 10. The injection portions 11 may be
connected to a channel 12 through which the reacting material is
transported.
[0057] For example, when the vapor deposition reactor is used in
atomic layer deposition (ALD), the reacting material may be a
source precursor or reactant precursor. The source precursor may be
determined depending on the type of thin film to be ultimately
formed in the vapor deposition reactor. For example, the source
precursor may be a compound containing atoms for forming a metal,
insulator or semiconductor thin film, and an organic or inorganic
compound may all be use as the source precursor. The reactant
precursor is a material that forms a metal, oxide, nitride,
carbide, material for semiconductor, or the like through reaction
and/or replacement of the reactant precursor with the source
precursor, thereby obtaining a thin film. For example, the reactant
precursor may include one or more of H.sub.2O, H.sub.2O.sub.2,
O.sub.2, N.sub.2O, NO, O.sub.3, O* radical, NH.sub.3,
NH.sub.2--NH.sub.2, N* radical, CO, CO.sub.2, CH.sub.4,
C.sub.2H.sub.6, H.sub.2 and H* radical.
[0058] In one embodiment, a substrate (not shown) may pass by the
first to third portions 10 to 30 by moving across the vapor
deposition reactor so that an atomic-layer or molecular-layer thin
film is formed on the substrate. For example, the substrate may be
moved in a linear or rotating manner adjacent to a lower portion of
the vapor deposition reactor so that a thin film is formed on the
substrate. In another embodiment, the vapor deposition reactor may
be moved with respect to the substrate with the substrate
fixed.
[0059] The first and second portions 10 and 20 include
square-column-shaped recesses formed on a bottom portion of the
body 9 of the vapor deposition reactor and have predetermined
widths W.sub.E and W.sub.C, heights H and z and lengths L. The
third portions 30 may have predetermined width W.sub.X and length
L, and an upper portion of the third portion 30 may be connected to
an exhaust portion 32 in which an exhaust portion 31 is formed. The
structure of the vapor deposition reactor is merely illustrative.
That is, the shapes of the first to third portions 10 to 30 may be
configured differently from those described above depending on the
object of the vapor deposition reactor.
[0060] The width of each of the first to third portions 10 to 30
herein refers to the dimension of recess formed in the first to
third portions 10 to 30 parallel to the moving direction of the
substrate. Also, the length of each of the first to third portions
10 to 30 refers to the dimension of each of the first to third
portions 10 to 30 in the direction perpendicular to the movement
direction of the substrate. Also, the height of each of the first
and second portions 10 and 20 refers to the distance between a
lower surface of the body 9 and an inner upper surface of the
corresponding recesses in the first and second portions 10 and
20.
[0061] Properties of the thin film formed on the substrate may be
determined at least partially based on the width W.sub.E and height
H of the first portion 10, the width W.sub.C and height z of the
second portion 20, the width W.sub.X of the third portion 30, and
the movement velocity v of the substrate. For example, assuming
that the movement velocity of the substrate is v and the width of a
corresponding portion through which the substrate passes among the
first to third portions 10 to 30 is x, the exposure time of the
substrate for the corresponding portion is determined by the
following equation:
t=x/v (1)
[0062] The recess of the first portion 10 may be filled with the
reacting material injected through the injection portion 11. If the
substrate moving at the movement velocity v passes by the lower
portion of the first portion 10, the substrate is exposed to the
reacting material for time W.sub.E/v. As a result, physisorbed and
chemisorbed layers of the reacting material may be formed on the
substrate. As the width W.sub.E of the first portion 10 is
increased, an increasing amount of the reacting material is
supplied to the first portion 10. As the width W.sub.E of the first
portion 10 is decreased, the possibility that the reacting material
is adsorbed on the substrate is decreased. Therefore, in designing
the vapor deposition reaction, the width W.sub.E of the first
portion 10 may be determined based on the property of the reacting
material. As the steam pressure of the reacting material is
increased, the width W.sub.E of the first portion 10 may be
decreased, and/or the movement velocity v of the substrate may be
increased. As a result, the amount of reacting material adsorbed on
the substrate can be adjusted since the period during which the
substrate resides at the first portion 10 is decreased.
[0063] The substrate passing by the lower portion of the first
portion 10 subsequently passes by a lower portion of the second
portion 20. The pressure P.sub.C in the recess of the second
portion 20 may be relatively lower than the pressure P.sub.E in the
recess of the first portion 10 (P.sub.C<P.sub.E). As a result, a
portion of the reactant precursor adsorbed on the substrate may be
desorbed for time W.sub.C/v during which the substrate passes by
the lower portion of the second portion 20. For example, the
physisorbed layer of the reacting material may be desorbed from a
surface of the substrate while the substrate passes by the lower
portion of the second portion 20.
[0064] The substrate passing by the lower portion of the second
portion 20 subsequently passes by a lower portion of the third
portion 30. The reacting material desorbed from the substrate while
the substrate posses by the second portion 20 may be discharged to
the exterior of the vapor deposition reactor through the exhaust
portion 31 for time W.sub.X/v at which the substrate passes by the
lower portion of the third portion 30. As a result, the physisorbed
layer of the reacting material is at least partially removed from
the substrate but the chemisorbed layer of the reacting material
remains on the substrate. In an embodiment, the pressure P.sub.X in
the third portion 30 may be relatively lower than the pressure
P.sub.E in the first portion 10 (P.sub.X<P.sub.E).
[0065] As described above, while a substrate passes by the first to
third portions 10 to 30 of the vapor deposition reactor, a series
of processes is performed. During the series of processes, the
substrate is exposed to a reacting material such as a source
precursor and/or reactant precursor, and the reacting material is
adsorbed in the surface of the substrate. Then, a physisorbed layer
of the reacting material is desorbed from the substrate for at
least partially removal from the substrate, and a chemisorbed layer
of the reacting material is formed on the substrate.
[0066] The aforementioned processes may be performed using a source
precursor as the reacting material in one vapor deposition reactor,
and the aforementioned processes may be performing using a reactant
precursor as the reacting material in a subsequent vapor deposition
reactor. As a result, the substrate passes by four processes of
adsorbing a source precursor, removing a physisorbed layer,
adsorbing a reactant precursor and removing the physisorbed layer
to form a thin film on the substrate. The produced thin film may be
an atomic layer or mono molecule layer or may include a plurality
of molecule layers. The moving velocity of the substrate that
passes by the vapor deposition reactor filled with the source
precursor may be controlled to be identical to or different from
the moving velocity of the substrate that passes by the vapor
deposition reactor filled with the reactant precursor.
[0067] The aforementioned processes may also be performed using a
single vapor deposition reactor by injecting a source precursor and
a reactant precursor alternately into the recess of the first
portion 10 of the vapor deposition reactor. For example, a valve
for ALD (not shown) and its driving unit may be connected to the
channel 12. The source precursor and the reactant precursor may be
injected in an alternating manner according to the opening or
closing of the valve. Further, an inert gas may be injected as a
purge gas after the injection of each of the source precursor and
the reactant precursor. In this case, the substrate that passes by
the first portion 10 undergoes the following four steps: adsorbing
the source precursor, injecting the inert gas, adsorbing the
reactant precursor and injecting the inert gas. As a result, an
atomic layer thin film may be formed on the substrate. A portion of
the precursor adsorbed on the substrate and/or the inert gas may be
desorbed from the substrate and discharged while the substrate
passes by the second portion 20 and the third portion 30.
[0068] When a source precursor, an inert gas and a reactant
precursor are injected into a single vapor deposition reactor in an
alternating manner, the moving velocity of the substrate that
passes by the single vapor deposition reactor may be relatively
smaller than the moving velocity of a substrate that passes by
another vapor deposition reactor into which only one of the source
precursor and the reactant precursor is injected. For example, the
moving velocity of the substrate may be controlled such that the
substrate is sequentially exposed to a source precursor, an inert
gas, a reactant precursor and an inert gas while the substrate
passes by one first portion 10. When the ALD is performed according
to the aforementioned processes, an atomic layer thin film may be
formed using the single vapor deposition reactor. Thus, the number
of atomic layer thin films which are formed using the same number
of vapor deposition reactors may be increased.
[0069] Meanwhile, the lower portion of the vapor deposition reactor
may be spaced apart from the substrate. For example, the lower
portion of the vapor deposition reactor may be spaced apart from
the substrate at about 0.5 mm to a few millimeters. Alternatively,
the interval between the lower portion of the vapor deposition
reactor and the substrate may be about 1 mm. When the interval
between the lower portion of the vapor deposition reactor and the
substrate is sufficiently small (e.g., when the interval between
the lower portion of the vapor deposition reactor and the substrate
is about 1 mm or less), the amount of the reacting material leaked
to the exterior from the vapor deposition reactor may be
negligible. However, in order to minimize the amount of the leaked
reacting material, an inert gas may be injected around the vapor
deposition reactor, or pumping may be performed around the vapor
deposition reactor. In this case, the inert gas may include one or
more gas selected from the group consisting of N.sub.2, Ar and
He.
[0070] The shapes of the first and second portions 10 and 20 affect
effective desorption of the reacting material adsorbed on the
substrate. Experiments were conducted using the first and second
portions 10 and 20 having various shapes to derive parameters
related to the desorption of the reacting material. For example,
trimethylaluminum (TMA) is sufficiently adsorbed on a substrate
maintained at about 250.degree. C. for one second, and the
substrate is then passed by the lower portion of the vapor
deposition reactor. At this time, an inert gas such as Ar gas may
be injected into the first portion 10. Since the pressure of the Ar
gas is lowered while the substrate passes by a lower portion of the
second portion 20, molecules of the TMA adsorbed on the substrate
are desorbed, and the desorbed molecules of the TMA may be
exhausted together with the Ar gas to the exterior via the third
portion 30. In this case, the desorption is examined while changing
the shapes of the first and second portions 10 and 20.
Alternatively, the desorption may be examined using the thickness
of an atomic-layer thin film formed by the vapor deposition
reactor.
[0071] The correlation of the width W.sub.E of the first portion
10, the height z of the recess in the second portion 20 and the
desorption are examined using a vapor deposition reactor in which
the height H of the first portion 10 is greater than the width
W.sub.E of the first portion 10. As a result, the results of the
following Table 1 were obtained. At this time, the experiment is
performed in a state where the width W.sub.E of the first portion
10 was identical to the width W.sub.X of the third portion 30 and
the width W.sub.C of the second portion 20 was about 1/2 of the
width W.sub.E of the first portion 10.
TABLE-US-00001 TABLE 1 Item 0 < z .ltoreq. W.sub.E/3 W.sub.E/3
< z .ltoreq. 2W.sub.E/3 2W.sub.E/3 < z .ltoreq. W.sub.E
Desorption Yes Yes Negligible phenomenon Material on Chemisorbed
Chemisorbed Chemisorbed substrate molecules molecules + some
molecules + of physisorbed physisorbed molecules molecules
Deposition Formation of Formation of plural Formation of
characteristic mono atomic- atomic-layer thin incomplete of thin
film layer thin films by chemisorbed atomic-layer through film by
layer and thin film adsorption chemisorbed physisorbed layer
layer
[0072] Also, the correlation of the width W.sub.C of the second
portion 20, the height z of the second portion 20 and the
desorption are examined using a vapor deposition reactor in which
the height H of the first portion 10 is greater than the width
W.sub.E of the first portion 10. As a result, following Table 2 was
obtained. The experiment was performed in a state where W.sub.E of
the first portion 10 is identical to the width W.sub.X of the third
portion 30 and the height z of the second portion 20 is about 1/2
of the width W.sub.E of the first portion 10.
TABLE-US-00002 TABLE 2 Item 0 < W.sub.C .ltoreq. 0.5z 0.5z <
W.sub.C .ltoreq. 3z W.sub.C > 3z Desorption Negligible Yes Yes
phenomenon Material on Chemisorbed Chemisorbed Chemisorbed
substrate layer + layer + layer physisorbed portion of layer
physisorbed layer Deposition Formation of Formation of Formation of
characteristic incomplete plural atomic- mono atomic- of thin film
atomic-layer layer thin films layer thin through thin film by the
chemisorbed film by adsorption layer and chemisorbed physisorbed
layer layer
[0073] On the other hand, the correlation of the height H of the
first portion 10, the height z of the second portion 20 and the
desorption are examined using a vapor deposition reactor in which
the height H of the first portion 10 is smaller than the width
W.sub.E of the first portion 10. As a result, following Table 3 was
obtained. The experiment is performed in a state where the width
W.sub.C of the second portion 20 is about 1/2 of the width W.sub.X
of the third portion 30.
TABLE-US-00003 TABLE 3 Item 0 < z .ltoreq. H/3 H/3 < z
.ltoreq. 2H3 2H3 < z .ltoreq. H Desorption Yes Yes Negligible
phenomenon Material on Chemisorbed Chemisorbed Chemisorbed
substrate layer layer + layer + portion of physisorbed physisorbed
layer layer Deposition Formation of Formation of Formation of
characteristic mono atomic- plural atomic- incomplete of thin film
layer thin layer thin films atomic-layer through film by by
chemisorbed thin film adsorption chemisorbed layer and layer
physisorbed layer
[0074] In Tables 1 to 3, when the height z of the second portion 20
is zero, the reacting material is leaked and diffused around the
vapor deposition reactor, and hence, the desorption caused by the
second portion 20 cannot be assessed. The result obtained when the
height z of the second portion 20 is zero is not represented in
Tables 1 to 3.
[0075] As can be seen from the results of Tables 1 to 3, the
desorption effect is increased as the height z of the second
portion 20 is decreased. Also, it can be seen that the desorption
effect is increased as the width W.sub.C of the second portion 20
is increased when the height z of the second portion 20 is
constant. In an embodiment, the width W.sub.C of the second portion
20 may be greater than about 1/2 of the height z of the second
portion 20. In another embodiment, the height z of the second
portion 20 may be greater than zero and equal to or less than 2/3
of the width W.sub.E of the first portion 10. Alternatively, the
height z of the second portion 20 may be greater than zero and
equal to or less than 2/3 of the height H of the first portion 10.
In still another embodiment, the height z of the second portion 20
may be equal to or less than the width W.sub.X of the third portion
30.
[0076] FIG. 1C is a sectional view of the first portion 10 in the
vapor deposition reactor described above. FIG. 1D is a sectional
view of the second portion 20 in the vapor deposition reactor. FIG.
1E is a sectional view of the third portion 30 in the vapor
deposition reactor.
[0077] Referring to FIG. 1E, to maximize conductance while the
substrate passes by the third portion 30, the curve connected to
the exhaust portion 31 in the third portion 30 may be configured to
have different curvatures from one another at a plurality of
portions 301, 302 and 303. For example, since the curvature at one
portion 301 has a negative (-) value, the portion 301 has a shape
that is concave outward from the third portion 30. Meanwhile, since
the curvature at another portion 303 has a positive (+) value, the
portion 303 has a shape that is convexed inward to the third
portion 30. The other portion 302 corresponds to an inflection
point between the two portions 301 and 303.
[0078] FIG. 2A is a partial sectional views of a second portion 20
in a vapor deposition reactor according to an embodiment. A first
portion 10, a second portion 20 and a third portion 30 are provided
at a lower portion of a body 209 of the vapor deposition reactor.
The second portion 20 is positioned between first and third
portions 10 and 30. The second portion has a recess defined by a
partition 200 having a predetermined width W.sub.C and is
positioned at a predetermined distance z from a substrate 40. The
pressure P.sub.2 of the second portion 20 is lower than the
pressure P.sub.1 in the first portion 10. As a result, while the
substrate passes by the second portion 20, a physisorbed layer of a
reacting material adsorbed on the substrate 40 may be desorbed from
the substrate 40 due to the lower pressure.
[0079] In the second portion 20 shown in FIG. 2A, the surface of
the partition 200 is formed parallel to a surface of the substrate
40. However, in another embodiment, the surface of the partition
200 may be formed to have a curved surface shape having varying
height with respect to the surface of the substrate 40. For
example, FIG. 2B shows a second portion 20 defined by a partition
200 having a surface that is convexed toward the substrate 40. The
partition 200 shown in FIG. 2B has a lower surface that is
symmetric about the center thereof. However, in another embodiment,
the lower surface of the partition 200 may be formed asymmetric.
For example, FIG. 2C shows a second portion 20 defined by a
partition 200 formed to have a surface that has relatively a large
height gradient at a region adjacent to the first portion 10. To
the contrary, FIG. 2D shows a second portion 20 defined by a
partition 200 formed to have a surface that has a relatively large
height gradient at a region adjacent to the third portion 30.
[0080] Meanwhile, in case of a rotary type vapor deposition reactor
in which a plurality of substrates are loaded and then deposited
while being rotated, an angular velocity is varied depending on the
radius of rotation. For example, when the substrates are loaded on
a rotating table and the table is activated, the angular velocity
at the outside of the rotating table is greater than that at the
inside of the rotating table. In this case, the time during which a
portion of the substrate at the outside of the rotating table is
subject to the processing by the vapor deposition reactor is
different from the time during which another portion of the
substrate inside the rotating table is exposed to the vapor
deposition reactor, and therefore, the desorption rates of the
reacting material at both of the portions are different from each
other.
[0081] FIG. 3 is a bottom view of a vapor deposition reactor that
may be used when the velocity at which a substrate passes by the
vapor deposition reactor is different at regions. FIG. 4A is a
sectional view of a second portion taken along line A-A' of FIG. 3.
FIG. 4B is a sectional view of the second portion taken along line
B-B' of FIG. 3. FIG. 4C is a sectional view of the second portion
taken along line C-C' of FIG. 3.
[0082] Referring to FIGS. 4A to 4C, the height Z.sub.3 of the
recess in the second portion 20 at portion C-C' of the vapor
deposition reactor may be smaller than the height Z.sub.1 of the
recess in the second portion 20 at portion A-A' of the vapor
deposition reactor (Z.sub.1>Z.sub.3). The height Z.sub.2 of the
second portion 20 at portion B-B' of the vapor deposition reactor
may have a value between the heights Z.sub.1 and Z.sub.3 of the
second portion 20 at both end portions of the vapor deposition
reactor (Z.sub.1>Z.sub.2>Z.sub.3). As the height of the
second portion 20 is decreased, the pressure in the second portion
20 is decreased, and therefore, the desorption rate of the reacting
material is increased on the substrate that passes by a
corresponding portion. Thus, a portion moving at a greater velocity
passes by the portion C-C' of the vapor deposition reactor, and a
portion moving at a lower velocity passes by the portion A-A' of
the vapor deposition reactor, thereby equalizing the desorption
rate across the entire region of the substrate.
[0083] FIG. 5 is a bottom view of another vapor deposition reactor
that may be used when the velocity at which a substrate passes by
the vapor deposition reactor differs at regions. FIG. 6A is a
sectional view of a second portion taken along line A-A' of FIG. 5.
FIG. 6B is a sectional view of the second portion taken along line
B-B' of FIG. 5. FIG. 6C is a sectional view of the second portion
taken along line C-C' of FIG. 5.
[0084] Referring to FIG. 6A, a surface of a partition 200 at
portion A-A' of the vapor deposition reactor may be parallel to a
substrate 40. In this case, the entire width of the partition 200
becomes the effective width W.sub.eff1 of the second portion 20 at
the portion A-A'. Referring to FIG. 6B, the surface of the
partition 200 at portion B-B' of the vapor deposition reactor may
have a gradient with respect to the substrate 40. In this case, the
effective width W.sub.eff2 of the second portion 20 at the portion
B-B' is limited to a region in which the surface of the partition
200 is parallel to the substrate 40, and therefore, is smaller than
the effective width W.sub.eff1 of the second portion 20 at the
portion A-A' (W.sub.eff1>W.sub.eff2). Referring to FIG. 6C, as
the gradient of the partition 200 at portion C-C' of the vapor
deposition reactor is more increased, the effective width
W.sub.eff3 of the second portion 20 at the portion C-C' is smaller
than the effective width W.sub.eff2 of the second portion 20 at the
portion B-B' (W.sub.eff2>W.sub.eff3).
[0085] FIGS. 7A to 7C are sectional views of a second portion in a
vapor deposition reactor according to still another embodiment.
Referring to FIGS. 7A to 7C, the vapor deposition reactor according
to the embodiment may have a structure obtained by combining the
structure shown in FIGS. 4A to 4C and the structure shown in FIGS.
6A to 6C. That is, the height of a second portion 20 may be
gradually decreased from one end portion to the other end portion
of the vapor deposition reactor (Z.sub.1>Z.sub.2>Z.sub.3).
Also, As a substrate 40 passes from the one end portion to the
other end portion of the vapor deposition reactor, the gradient of
a partition 200 is increased, and therefore, the effective width of
the second portion 20 may be gradually decreased
(W.sub.eff1>W.sub.eff2>W.sub.eff3).
[0086] Meanwhile, the shape of the vapor deposition reactor may be
modified based on the type and property of a reacting material.
Particularly, since adsorption and desorption characteristics
differ depending on the shape of the second portion, the shape of
the second portion may be optimized based the reacting material
used. For example, when a precursor with a low vapor pressure
and/or a high viscosity is used as the reacting material, a
structure with a relatively high desorption rate is necessary.
When, a precursor with a high vapor pressure and/or a low viscosity
is used as the reacting material, a structure with a relatively low
desorption rate is necessary. The characteristics of the second
portion can be varied for different reacting materials in one vapor
deposition reactor.
[0087] FIG. 8A is a bottom view of a vapor deposition reactor
configured to vary characteristics of a second portion according to
still another embodiment. The vapor deposition reactor according to
the embodiment may include a partition 200 that defines the second
portion and an adjustable wing 210 forming at least a partial
region of the partition 200.
[0088] FIG. 8B is a sectional view of the second portion in the
vapor deposition reactor of FIG. 8A. FIG. 8C is a sectional view of
the second portion when the adjustable wing 210 is moved to a drive
position in the vapor deposition reactor of FIG. 8A. If the
adjustable wing 210 is moved from an initial position shown in FIG.
8B to a driving position shown in FIG. 8C, the effective height
Z.sub.eff is decreased as compared with the initial height Z.sub.0.
Since the path of a gas that passes by the second portion 20 is
lengthened due to the adjustable wing 210, the pressure in the
region 25 adjacent to the adjustable wing 210 is further decreased.
Thus, although the vapor deposition reactor having the same
exhausting ability is used, the desorption rate of a reacting
material can be changed by the adjustable wing 210, and
accordingly, the deposition characteristic of a thin film can be
changed. Also, reacting materials with different chemical
properties such as viscosity or vapor pressure can be used in the
same vapor deposition reactor.
[0089] Meanwhile, when the adjustable wing 210 is positioned at the
driving position as shown in FIG. 8C, the reacting material
desorbed from a substrate 40 may enter into a gap between the
partition 200 and the adjustable wing 210. To address such a
problem, an inert gas may be injected as a curtain gas between the
partition 200 and the adjustable wing 210.
[0090] FIG. 9A is a sectional view of a second portion 20 in a
vapor deposition reactor including an injection portion of curtain
gas between a partition and an adjustable wing. FIG. 9B is a
sectional view of the second portion when the adjustable wing 210
is moved to a drive position in the vapor deposition reactor of
FIG. 9A. A channel 22 and one or more injection portions 21 may be
formed at a region in the partition 200 above the adjustable wing.
An inert gas may be injected as a curtain gas through the injection
portion 21. For example, the inert gas may include one or more
selected from the group consisting of N.sub.2, Ar and He. The inert
gas is injected at a higher pressure than that in the second
portion 20, so that it is possible to prevent a reacting material
desorbed from a substrate 40 from entering into the gap between the
partition 200 and the adjustable wing 210.
[0091] In the embodiment described with reference to FIGS. 8 and 9,
the adjustable wing 210 is inserted into the partition 200 to
change the shape of a partial region of the second portion 20.
However, in another embodiment, the position of the partition 200
may be moved along the direction in which the substrate 40
advances. If the position of the partition 200 is changed, the
ratio W.sub.E/W.sub.C of the width W.sub.E of the first portion 10
and the width W.sub.C of the second portion 20 is changed, and
therefore, the amount of the reacting material adsorbed on the
substrate 40 is changed. For example, when the partition 200 moves
toward the first portion 10 from the initial position thereof, the
desorption amount of the reacting material may be decreased in the
first portion 10. On the other hand, when the partition 200 moves
toward the second portion 20 from the initial position thereof, the
adsorption amount of the reacting material may be increased in the
first portion 10.
[0092] In still another embodiment, the adjustable wing 210 may
change the distance z between the partition 200 and the substrate
40, i.e., the height z of the second portion 20. If the distance
between the partition 200 and the substrate 40 is decreased, the
height z of the second portion 20 is decreased, and the pressure in
the second portion 20 is decreased. Therefore, the desorption rate
of the reacting material from the substrate 40 may be increased. On
the other hand, if the distance between the partition 200 and the
substrate 40 is increased, the height z of the second portion 20 is
increased, and the pressure in the second portion 20 is increased.
Therefore, the desorption rate of the reacting material from the
substrate 40 may be decreased.
[0093] According to the aforementioned embodiments, reacting
materials with different viscosity can be used in the vapor
deposition reactor having the same size by using the adjustable
wing. Also, the deposition characteristic of an atomic-layer thin
film and/or the desorption rate of adsorbed molecules can be
changed by using the vapor deposition reactor.
[0094] FIG. 10A is a sectional view of a vapor deposition reactor
according to still another embodiment. FIG. 10B is a bottom view of
the vapor deposition reactor of FIG. 10A. The vapor deposition
reactor includes a body 309. One or more first injection portions
11 for injecting a reacting material, and one or more second
injection portions 13 for injecting an inert gas are formed in the
body 309. The first injection portion 11 may be connected to a
first channel 12 through which the reacting material is
transported, and a second injection portion 13 may be connected to
the second channel 14 through which the inert gas is transported.
The first channel 12 may be connected to a transfer pipe 120
through which the reacting material is injected from the exterior
of the vapor deposition reactor, and the second channel 14 may be
connected to a transfer pipe 140 through which the inert gas is
injected from the exterior of the vapor deposition reactor. The
first and second injection portions 11 and 13 are provided in a
first portion 10 to fill the recess in the first portion 10 with
the reacting material and the inert gas.
[0095] As shown in FIG. 10A, the second injection portion 13 is
placed further away from a substrate (i.e., the second injection
portion 13 has a higher height) than the first injection portion
11. However, the embodiment is provided only for illustrative
purposes. In another embodiment, as shown in FIG. 11, the vapor
deposition reactor includes a body 409 having a first injection
portion 11 and a second injection portion 13 formed therein where
the second injection portion 13 is formed at a position closer from
the substrate than the first injection portion 11. Alternatively,
as shown in FIG. 12, the first and second injection portions 11 and
13 may be formed at substantially the same distance from the
substrate.
[0096] By using the vapor deposition reactors as described above,
an inert gas can be injected together with a source precursor or
reactant precursor into the recess of the first portion 10. The
inert gas functions to purge the reacting material adsorbed on the
substrate while the substrate passes by the second portion 20, and
therefore, the amount of physisorbed layer that remains on the
substrate is less than that of physisorbed layer that remains on
the substrate when only the source precursor or reactant precursor
is used. Thus, the vapor deposition reactor is advantageous in
formation of an atomic mono-layer.
[0097] FIG. 13A is a sectional view of a vapor deposition reactor
having a body 609 for injecting an inert gas together with a
reacting material according to still another embodiment. FIG. 13B
is a bottom view of the vapor deposition reactor of FIG. 13A. One
or more injection portions 11 and one or more second injection
portions 13 may be alternately arranged on one line perpendicular
to the direction in which a substrate is moved.
[0098] FIG. 14 is a sectional view of a vapor deposition reactor
for injecting an inert gas together with a reacting material
according to still another embodiment. Referring to FIG. 14, the
vapor deposition reactor may include a body 709 in which only one
injection portion 11 and one channel 12 are formed. However, a
transfer pipe 120 connected to the channel 12 to allow a material
to be injected therethrough may be divided into two transfer pipes
121 and 122 different from each other by a valve V.sub.3. The flow
of the material in each of the transfer pipes 121 and 122 may be
controlled by valves V.sub.1 and V.sub.2.
[0099] By using the vapor deposition reactor, the valves V.sub.1 to
V.sub.3 are opened or closed so that two different materials (e.g.,
a reacting material and an inert gas) can be injected into the
first portion 10 through the one injection portion 11 and the one
channel 12. In this case, the reacting material and the inert gas
can be simultaneously injected into the recess of the first portion
10 by simultaneously opening or closing the valves V.sub.1 and
V.sub.2. Alternatively, the reacting material and the inert gas may
be separately injected into the first portion 10 by alternately
opening or closing the valves V.sub.1 and V.sub.2. Meanwhile, a
plurality of first portions may be disposed in one vapor deposition
reactor so that a source precursor and a reactant precursor are all
injected onto a substrate in the one vapor deposition reactor. FIG.
15A is a sectional view of a vapor deposition reactor including a
body 809 with a plurality of first portions according to still
another embodiment. FIG. 15B is a bottom view of the vapor
deposition reactor of FIG. 15A.
[0100] Referring to FIGS. 15A and 15B, the body 809 of the vapor
deposition reactor may include two first portions 10 and 10', two
second portions 20 and 20', and a third portion 30. The two second
portions 20 and 20' may be disposed at both sides of the third
portion 30, respectively. The two first portions 10 and 10' may be
disposed at both outsides of the second portions 20 and 20',
respectively. That is, the first portion 10, the second portion 20,
the third portion 30, the second portion 20' and the first portion
10' are sequentially arranged in the vapor deposition reactor.
Also, the third portion 30 is shared with the second portions 20
and 20' and the first portions 10 and 10' placed at different sides
of the third portion 30.
[0101] First injection portions 11 and 11' may be formed in the
respective first portions 10 and 10'. The first injection portions
11 and 11' may be connected to channels 12 and 12', respectively. A
reacting material may be injected into the first portion 10 or 10'
through the first injection portion 11 or 11'. By using the vapor
deposition reactor having the two first portions 10 and 10'
positioned in the vapor deposition reactor, the reacting material
can be adsorbed twice on the substrate while a substrate passes by
the one vapor deposition reactor.
[0102] As an example, a source precursor may be injected into the
first portion 10, and a reactant precursor may be injected into the
first portion 10'. While the substrate that passes by the vapor
deposition reactor passes by the first portion 10, the source
precursor is adsorbed on the substrate. While the substrate passes
by the second portion 20, the third portion 30 and the second
portion 20', a physisorbed layer of the source precursor is
desorbed and exhausted. While the substrate passes by the first
portion 10', the reactant precursor is reacted and/or replaced with
the source precursor on the substrate, thereby forming an
atomic-layer thin film. As described above, the formation of the
atomic-layer thin film is described as an example. However, it will
be apparent that chemical vapor deposition (CVD) may also be
performed using the vapor deposition reactor.
[0103] Second injection portions 13 and 13' may be further formed
in the respective first portions 10 and 10'. The second injection
portions 13 and 13' may be connected to channels 14 and 14',
respectively. An inert gas may be injected into the first portion
10 or 10' through the second injection portion 13 or 13'. When the
inert gas is injected together with the source precursor or the
reactant precursor, it functions to purge the physisorbed layer
adsorbed on the substrate while the substrate passes by the second
portion 20 and 20' and the third portion 30 so that the desorption
is more effectively performed. Thus, the amount of the physisorbed
layer on the substrate is less than that of the physisorbed layer
on the substrate when only the source precursor or reactant
precursor is injected. Accordingly, it is advantageous in formation
of an atomic mono-layer.
[0104] Meanwhile, the reactant precursor physisorbed after forming
the atomic-layer thin film remains on the substrate that passes by
the vapor deposition reactor. Subsequently, if the substrate is
passed through another vapor deposition reactor, the reactant
precursor physisorbed on the substrate is reacted and/or replaced
with a source precursor injected from the new vapor deposition
reactor, thereby forming a thin film. Thus, the deposition velocity
of the thin film can be increased. This is referred to as a
pseudo-ALD mode.
[0105] Meanwhile, as another example, a source precursor (or
reactant precursor) may be injected as a reacting material into the
recess of the first portion 10, and only an inert gas may be
injected into the recess of the first portion 10' with no reacting
material. In this case, the reacting material is adsorbed on a
substrate while the substrate passes by the first portion. While
the substrate passes by the second portion 20, the third portion 30
and the second portion 20', the reacting material is desorbed and
exhausted. The desorption of the reacting material is accelerated
by the inert gas injected into the first portion 10', so that an
adsorbed layer with a superior quality can be obtained. When an
atomic-layer thin film is to be formed, an additional vapor
deposition reactor is necessary for the purpose of the adsorbing
the reactant precursor (or source precursor). However, an
atomic-layer thin film with excellent characteristics can be
formed.
[0106] The vapor deposition reactor shown in FIGS. 15A and 15B is
configured so that two reactors are symmetrically arranged opposite
to each other with a third portion interposed therebetween, on the
basis of the shape of the vapor deposition reactor shown in FIGS.
10A and 10B. However, the vapor deposition is provided only for
illustrative purposes. That is, the vapor deposition reactor may be
configured so that two reactors are arranged based on the shapes of
the aforementioned embodiments described with reference to FIGS. 1
to 14.
[0107] FIG. 16A is a flowchart illustrating a method for forming a
thin film, according to an embodiment. A reacting material is
injected S11 into a first portion of the vapor deposition reactor.
For example, the reacting material may be a source precursor and/or
reactant precursor. In an embodiment, an inert gas may be injected
S11 together with the reacting material into the first portion in
the process.
[0108] Subsequently, a substrate is moved S12 with respect to the
first portion so that the reacting material is adsorbed on a
surface of the substrate. At this time, chemisorbed and physisorbed
layers of the reacting material are formed on the substrate. The
relative movement of the substrate with respect to the first
portion may be performed by moving the substrate to be adjacent to
the vapor deposition reactor in the state that the vapor deposition
reactor is fixed. Alternatively, the vapor deposition reactor may
be moved in the state that the substrate is fixed.
[0109] Subsequently, the substrate is moved S13 with respect to a
second portion so that the physisorbed layer of the reacting
material is desorbed from the substrate. To this end, the pressure
in the second portion may be lower than that in the first portion.
Also, the desorption amount of the physisorbed layer may be
adjusted by controlling the position, width and height of the
second portion and/or the position of an adjustable wing in the
second portion. The entire physisorbed layer may be removed from
the substrate. Alternatively, the deposition velocity may be
increased by allowing a part of the physisorbed layer to remain on
the substrate.
[0110] Subsequently, the substrate is moved with respect to a third
portion so that the desorbed reacting material is exhausted S14 to
the exterior of the vapor deposition reactor through an exhaust
portion. As a result, the reacting material physisorbed on the
substrate can be at least partially removed. Through the
aforementioned processes, a thin film including the chemisorbed
layer of the reacting material can be formed on the substrate.
[0111] When the aforementioned processes S11 to S14 are repeatedly
performed while exchanging the reacting material, e.g., when the
aforementioned processes S11 to S14 are performed by alternately
using the source precursor and the reactant precursor as the
reacting material in process S11, an atomic-layer thin film can be
formed on the substrate. Alternatively, the source precursor and
the reactant precursor may be injected alternately into the first
portion as the reacting material in the single process S11. As a
result, an atomic layer thin film may be formed on the substrate
when the aforementioned processes S11 to S14 are performed once. In
this case, an inert gas may be injected as a purge gas after the
injection of each of the source precursor and the reactant
precursor.
[0112] FIG. 16B is a flowchart illustrating a method for forming a
thin film according to another embodiment. The method of FIG. 16B
may be performed using two vapor deposition reactors. For example,
the method may be performed using two vapor deposition reactors
according to the embodiment described with reference to FIGS. 1 to
14.
[0113] Referring to FIG. 16B, a source precursor and an inert gas
are injected into a first portion of a first reactor, and a
substrate is moved S12 with respect to the first portion of the
first reactor. As a result, the source precursor can be adsorbed on
a surface of the substrate. Meanwhile, in another embodiment, only
the source precursor may be injected S21 with no inert gas in the
process.
[0114] The substrate is moved S22 with respect to a second portion
of the first reactor. At this time, the pressure in the second
portion may be lower than that in the first portion. Then, the
substrate is move S23 with respect to a third portion of the first
reactor. While the substrate passes by the second and third
portions, a physisorbed layer of the source precursor adsorbed on
the substrate is at least partially desorbed from the substrate and
exhausted to the exterior of the first reactor.
[0115] A reactant precursor and an inert gas are injected into a
first portion of a second reactor, and the substrate is moved S24
with respect to the first portion of the second reactor. As a
result, the reactant precursor is adsorbed on the surface of the
substrate, and the source precursor adsorbed on the substrate is
reacted with the reactant precursor adsorbed on the substrate,
thereby forming an atomic-layer thin film. Meanwhile, in another
embodiment, only the reactant precursor may be injected S24 with no
inert gas in the process.
[0116] The substrate is moved with respect to a second portion S25
of the second reactor (S25). At this time, the pressure in the
second portion may be lower than that in the first portion. Then,
the substrate is moved S26 with respect to a third portion of the
second reactor. While the substrate passes by the second and third
portions, a portion of the reactant precursor may be desorbed from
the substrate and then exhausted to the exterior of the second
reactor.
[0117] The aforementioned processes (S21 to S26) are performed
until an atomic-layer thin film with a final thickness is formed
S27, thereby forming an atomic-layer thin film with a desired
thickness.
[0118] FIG. 16C is a flowchart illustrating a method for forming a
thin film according to still another embodiment. The method of FIG.
16 may be performed using a vapor deposition reactor including two
first portions. For example, the method may be performed using the
vapor deposition reactor according to the embodiment described with
reference to FIGS. 15A and 15B.
[0119] Referring to FIG. 16C, a source precursor and an inert gas
are injected S31 into a primary first portion of the vapor
deposition reactor, and a substrate is moved S31 with respect to
the primary first portion. As a result, the source precursor can be
adsorbed on a surface of the substrate. Meanwhile, in another
embodiment, only the source precursor may be injected S31 with no
inert gas in the process.
[0120] The substrate is moved S32 with respect to a primary second
portion. At this time, the pressure in the second portion may be
lower than that in the first portion. Then, the substrate is moved
S33 with respect to a third portion. Then, the substrate is move
S34 with respect to secondary second portion. While the substrate
passes by the two second portions and the third portion, a
physisorbed layer of the source precursor adsorbed on the substrate
is at least partially desorbed and exhausted to the exterior of the
vapor deposition reactor.
[0121] A reactant precursor and an inert gas are injected S35 into
a secondary first portion of the vapor deposition reactor, and the
substrate is moved S35 with respect to the secondary first portion.
As a result, the reactant precursor is adsorbed on the surface of
the substrate, and the source precursor adsorbed while the
substrate passes by the primary first portion is reacted with the
reactant precursor, thereby forming an atomic-layer thin film on
the substrate. In another embodiment, only the reactant precursor
may be injected S35 with no inert gas in the process.
[0122] The aforementioned processes (S31 to S35) are performed
until an atomic-layer thin film with a final thickness is formed
S36, thereby obtaining an atomic-layer thin film with a desired
thickness.
[0123] FIG. 17A is a sectional view showing an example in which a
vapor deposition reactor according to an embodiment is applied to
an atomic layer deposition (ALD) equipment. The ALD equipment may
be configured so that one or more vapor deposition reactors 1 and 2
each having a first, second and third portions 10, 20 and 30 are
disposed in a chamber 5. A substrate 40 is supported by a susceptor
400, and is moved to pass through a lower portion of each of the
vapor deposition reactors. The interior of the chamber 5 may be
controlled to be in a vacuum state using a pump or the like. The
interior of the chamber 50 may be filled with a filler 50 except
for a region adjacent to the substrate 40. The filler 50 may be
made of the same material as the outer wall of the chamber 5.
[0124] In the ALD equipment, a source precursor and an inert gas
may be filled in a first portion of a first vapor deposition
reactor 1. Also, a reactant precursor and an inert gas may be
filled in a first portion 10 of a second vapor deposition reactor
2. As the substrate 40 passes by the first portion 10 of the first
vapor deposition reactor 1, the source precursor may be adsorbed on
the substrate 40. Subsequently, as the substrate 40 passes by
second and third portions 20 and 30 of the first vapor deposition
reactor 1, pressure is lowered. Thus, a physisorbed layer of the
source precursor adsorbed on the substrate 40 is desorbed from the
substrate 40 and exhausted to the exterior of the first vapor
deposition reactor 1.
[0125] Subsequently, as the substrate passes by the first portion
10 of the second vapor deposition reactor 2, the reactant precursor
may be adsorbed on the substrate 40. The reactant precursor is
reacted with the source precursor adsorbed on the substrate,
thereby forming an atomic-layer thin film. Subsequently, as the
substrate 40 passes by second and third portions 20 and 30 of the
second vapor deposition reactor 2, the reactant precursor is at
least partially desorbed from the substrate 40 and exhausted to the
exterior of the second vapor deposition reactor 2. At this time,
the source precursor and the reactant precursor are injected into
and exhausted from the first and second vapor deposition reactors 1
and 2, respectively. Therefore, the source precursor and the
reactant precursor do not come in contact with each other. Thus, it
is possible to minimize a reactant byproduct such as powder or gum
or reactant product generated in an exhaust pipe.
[0126] FIG. 17B is a sectional view showing an example in which a
vapor deposition reactor according to another embodiment is applied
to the ALD equipment. The vapor deposition reactor is similar to
that shown in FIG. 17A, but the first and second vapor deposition
reactors 1 and 2 are spaced apart from each other at a
predetermined interval by the filler 50. Thus, it is possible to
minimize mixing of the source precursor injected into the first
vapor deposition reactor 1 with the reactant precursor injected
into the second vapor deposition reactor 2. At this time, the
interval between the first and second vapor deposition reactors 1
and 2 may be appropriately determined based on the interval between
the substrate 40 and the first and second vapor deposition reactors
1 and 2, the performance of a pump (not shown) for pumping the
chamber 5, the characteristics of the source precursor and the
reactant precursor, and/or the like.
[0127] FIG. 17C is a sectional view showing an example in which a
vapor deposition reactor according to still another embodiment is
applied to the ALD equipment. Referring to FIG. 17C, the vapor
deposition reactor is similar to that shown in FIG. 17B, but one or
more injection portions 51 and a channel 52 connected to the
injection portions 51 are formed in the filler 50 between the first
and second vapor deposition reactors 1 and 2. An inert gas may be
injected through the channel 52 and the injection portions 51. The
possibility that gas is to be mixed between the first and second
vapor deposition reactors 1 and 2 can be more reduced by the inert
gas.
[0128] FIG. 17D is a sectional view showing an example in which a
vapor deposition reactor according to still another embodiment is
applied to the ALD equipment. Referring to FIG. 17D, the vapor
deposition reactor is similar to that shown in FIG. 17C, but
injection portions 51 and a channels 52 for injecting the inert gas
are formed not only between the first and second vapor deposition
reactors 1 and 2 but also at outsides of the first and second vapor
deposition reactors 1 and 2.
[0129] In the ALD equipment shown in FIGS. 17C and 17D, the
interior of the chamber 5 is pumped by a separate pump (not shown).
Therefore, the inert gas injected through the injection portions 51
may be controlled to have a higher pressure than that the pressure
in the first portion 10 of each of the first and second vapor
deposition reactors 1 and 2. As a result, the pressure around the
first and second vapor deposition reactors 1 and 2 may be higher
than that in the first portion 10 of the first and second vapor
deposition reactors 1 and 2. Accordingly, leaking of the source
precursor and the reactant precursor to the exterior of the first
and second vapor deposition reactors 1 and 2 can be minimized.
[0130] The ALD equipment using the vapor deposition reactor shown
in FIGS. 10A and 10B as each of the first and second vapor
deposition reactors 1 and 2 has been shown in FIGS. 17A to 17D.
However, the ALD equipment is provided only for illustrative
purposes. That is, the ALD equipment may be configured using a
vapor deposition reactor according to other embodiments. As an
example, the ALD equipment may be configured using a vapor
deposition reactor including two first portions.
[0131] FIG. 17E is a sectional view of an ALD equipment configured
using a vapor deposition reactor including two first portions. In
the ALD equipment, each of the first and second vapor deposition
reactors 1 and 2 may include two first portions 10 and 10', two
second portions 20 and 20' and a third portion 30. In the ALD
equipment configured as described above, a source precursor may be
injected into a primary first portion 10 of the first vapor
deposition reactor 1, and an inert gas may be injected into a
secondary first portion 10' of the first vapor deposition reactor
1. A reactant precursor may be injected into a primary first
portion 10 of the second vapor deposition reactor 2, and an inert
gas may be injected into a secondary first portion 10' of the
second vapor deposition reactor 2.
[0132] While a substrate 40 passes by the first vapor deposition
reactor 1, the following processes are performed. First, while the
substrate 40 passes by the primary first portion 10, the source
precursor may be adsorbed on the substrate. While the substrate 40
passes by the primary second portion 20 and the third portion 30, a
physisorbed layer of the source precursor may be desorbed and
exhausted. Subsequently, while the substrate 40 passes by the
secondary second portion 20', the inert gas injected into the
secondary first portion 10' passes by the secondary second portion
20'. Therefore, pressure is lowered, and accordingly, additional
desorption occurs. Through the aforementioned processes, only a
pure chemisorbed layer can remain on the substrate 40 that passes
by the first vapor deposition reactor 1.
[0133] Processes performed while the substrate 40 passes by the
second vapor deposition reactor 2 are performed similarly to those
performed while the substrate passes by the first vapor deposition
reactor 1. However, the second vapor deposition reactor 2 is
different from the first vapor deposition reactor 1 in that the
reactant precursor is injected into the primary first portion 10 of
the second vapor deposition reactor 2. The reactant precursor is
reacted with a chemisorbed layer of the source precursor adsorbed
on the substrate 40, so that an atomic-layer thin film of a mono
molecular-layer can be formed on the substrate that passes by all
of the first and second vapor deposition reactors 1 and 2.
[0134] As described above, the shape of the vapor deposition
reactors included in the ALD equipments described with reference to
FIGS. 17A to 17E is provided only for illustrative purposes. That
is, it will be readily understood by those skilled in the art the
ALD equipments may be configured using vapor deposition reactors
according to other embodiments described in this disclosure or
various modifications that are not described herein.
[0135] FIG. 18A is a plan view of an ALD equipment including vapor
deposition reactors according to an embodiment. Referring to FIG.
18A, in the ALD equipment, a substrate 40 may be supported by a
susceptor 400 and disposed on a rotating table 410 to be rotatably
moved. First and second vapor deposition reactors 1 and 2 are
disposed on the rotating table 410. The first and second vapor
deposition reactors 1 and 2 may be disposed so that as the rotating
table 410 is rotated, the substrate 40 sequentially passes by lower
portions of the first and second vapor deposition reactors 1 and 2.
The number and shape of the first and second vapor deposition
reactors 1 and 2 are provided only for illustrative purposes. The
shape and/or number of the vapor deposition reactors 1 and 2 may be
appropriately controlled based on the characteristics of a thin
film to be formed.
[0136] FIG. 18B is a plan view of an ALD equipment including vapor
deposition reactors according to another embodiment. Referring to
FIG. 18B, a pair of first and second vapor deposition reactors 1
and 2 is configured, and one or more pairs of the first and second
vapor deposition reactors 1 and 2 may be arranged. Whenever a
substrate 40 passes by a lower portion of each of the pairs of the
first and second vapor deposition reactors 1 and 2, a one-layer of
thin film can be formed.
[0137] FIG. 18C is a plan view of an ALD equipment including vapor
deposition reactors according to still another embodiment.
Referring to FIG. 18C, the ALD equipment may be configured using
vapor deposition reactors each including two first portions 10 and
10', two second portions 20 and 20' and a third portion 30. A
source precursor and a reactant precursor are injected the two
first portions 10 and 10', respectively, so that a one-layer
atomic-layer thin film can be formed on a substrate 40 whenever the
substrate 40 passes by each of the vapor deposition reactors 1.
Alternatively, a source precursor and an inert gas may be injected
into the two first portions 10 and 10' of one vapor deposition
reactor 1, respectively, and a reactant precursor and an inert gas
may be injected into the two first portions 10 and 10' of a
subsequent vapor deposition reactor 1.
[0138] In the embodiments described with reference to FIGS. 18A to
18C, the rotating table 410 is rotated, and therefore, the angular
velocity of the substrate 40 moved at the inside of the rotating
table 410 is different from that of the substrate 40 moved at the
outside of the rotating table 410. As a result, the thickness
and/or characteristic of a thin film formed on the substrate 40
that passes by the vapor deposition reactors 1 and 2 may not be
uniform. To solve such a problem, the susceptor 400 is rotated
separately from the rotation of the rotating table 410, so that the
substrate 40 can pass through the lower portions of the vapor
deposition reactors 1 and 2 while being rotated. For example, the
substrate 40 may be rotated once while passing through one of the
vapor deposition reactors 1 and 2. However, the rotation velocity
of the substrate is not limited thereto, but may be properly
controlled based on the characteristics of the thin film, and the
like.
[0139] Meanwhile, the problem that the movement velocities of the
substrate 40, respectively rotated at the inside and outside of the
rotating table 410, are different from each other may be solved by
modifying the shape of the vapor deposition reactor. FIG. 18D is a
plan view of an ALD equipment including vapor deposition reactors
according to still another embodiment. Referring to FIG. 18D, since
the movement velocities of the substrate 40, respectively rotated
at the inside and outside of the rotating table 410, are different
from each other, the vapor deposition reactor 1 may be configured
to have a fan shape of which width is relatively narrow at the
inside of the rotating table 410 and is relatively wide at the
outside of the rotating table 410. Through the configuration
describe above, it is unnecessary to rotate the susceptor 400.
Example of Forming TiN Thin Film Using Vapor Deposition Reactor
[0140] FIG. 19 is a schematic view of an experimental apparatus for
forming a TiN atomic-layer thin film using a vapor deposition
reactor, according to an embodiment. FIG. 20 is a schematic
perspective view of a portion of the vapor deposition reactor in
the experimental apparatus of FIG. 19, according to one embodiment.
FIG. 21A is a schematic sectional view of the experimental
apparatus of FIG. 19. FIG. 21B is a schematic sectional view of a
coaxial capacitive plasma generator, according to one
embodiment.
[0141] Referring to FIGS. 19 to 21B, the experimental apparatus may
include a rotating susceptor 410 in which recesses are formed in a
depth of 0.5 mm so that two 2-inch substrates and two 3-inch
substrates can be positioned in the recesses, respectively. The
substrates supported by the rotating susceptor 410 may be
indirectly heated a metal heater 66 installed at a lower portion of
the rotating susceptor 410. A chamber 5 may include a hole 65 for
vacuum pumping, which may be connected to an exhaust pipe with a
diameter of 40 mm. An exhaust portion 31 of a vapor deposition
reactor 1 may be connected to an exhaust pipe with a diameter of 20
mm for the purpose of pumping. At this time, a throttle valve (not
shown) may be installed in the exhaust pipe of the chamber 5 or the
vapor deposition reactor 1 so as to control its exhaust velocity.
The vacuum degree of the chamber 5 may be measured by a vacuum
gauge 62, and the rotation velocity of the rotating susceptor 410
may be decelerated by 10:1 to about 18 rpm as compared with that of
a motor 61.
[0142] The experimental apparatus may further include a quartz tube
63 and a coil 64 so as to apply ICP (inductive coupled plasma) type
remote-plasma. A radio frequency (RF) voltage of about 5 to 100
watt may be applied to the coil 64 so as to generate NH.sub.3
plasma. However, in another embodiment, a TiN atomic-layer thin
film may be formed by a simple thermal reaction without generating
plasma. At this time, in the experimental apparatus, an additional
vapor deposition reactor may be installed in the portion in which
the quartz tube 63 and the coil 64 are to be installed, and
NH.sub.3 may be injected as a reactant precursor into the
additional vapor deposition reactor. TiCl4 may be supplied as a
source precursor to the vapor deposition reactor 1 using an Ar
bubbling method. In the vapor deposition reactor, the deposition
efficiency, i.e., the ratio of the source precursor used in the
formation of a thin film with respect to the source precursor
supplied, is high, and hence, TiCl.sub.4 is supplied from a
canister which is cooled down to about -4.degree. C.
[0143] The height of a first portion of the vapor deposition
reactor 1 is about 20 mm, the width of the first portion is about
10 mm, and the length of the first portion is about 100 mm. The
width of a third portion of the vapor deposition reactor 1 is about
16 mm. From the results obtained in Tables 1, 2 and 3, the vapor
deposition reactor 1 may be configured so that the height of a
second portion is about 2 mm and the width of the second portion is
about 4 mm. When the substrate 40 passes by a lower portion of the
vapor deposition reactor 1, the time at which the substrate 40 is
exposed to the first portion is about 105 msec at an inside of the
substrate 40 close to the center of the rotating table 410 when the
rotation velocity of the rotating table 410 is about 10 rpm, and
the time is about 60 msec when the rotation velocity of the
rotating table 410 is about 18 rpm. Meanwhile, the angular velocity
of an outside of the substrate 40 distant from the center of the
rotating table 410 is greater than that of the inside of the
substrate 40. As a result, when the rotation velocity of the
rotating table 410 is about 10 rpm and about 18 rpm, the times at
which the outside of the substrate 40 is exposed to the first
portion are about 80 msec and about 44 msec, respectively.
[0144] The time at which the inside of the substrate 40 passes by
the second and third portions is about 210 msec when the rotation
velocity of the rotating table 410 is about 10 rmp, and the time is
about 120 msec when the rotation velocity of the rotating table 410
is about 18 rpm. Also, the time at which the inside of the
substrate 40 completely passes by the vapor deposition reactor 1 is
about 315 msec when the rotation velocity of the rotating table 410
is about 10 rmp, and the time is about 180 msec when the rotation
velocity of the rotating table 410 is about 18 rpm.
[0145] The experimental apparatus may further include a coaxial
remote plasma generator 2 as illustrated in FIG. 21B. The plasma
generator 2 includes a body 2100 and valves Va, Vb and Vc for
transporting and controlling rates of materials for generating
plasma 1200. A voltage of 500V to 1500V is applied across the
electrodes 12A and 12B in a first portion 10 to generate plasma
1200. The generated plasma 2100 is provided through an injector
1100 in the form of slits. In one embodiment, the slits have widths
not smaller than 2 mm. In one embodiment, the distance between the
substrate and the upper end of the injector 1100 is preferably 15
to 20 mm. The diameter of the cylindrical space holding the plasma
1200 is 10 mm to 20 mm. In one embodiment the distance between the
substrate and the injector is 12 mm.
[0146] In one embodiment, reactant gas such as O.sub.2, H.sub.2 or
NH.sub.3 is provided via pipes 2202, 2204, 2206 and valves Va, Vb
and Vc to the cylindrical space. By applying voltage across the
electrodes 12A and 12B in the presence of the reactance gas, the
coaxial capacitive plasma is generated. The top surface of the
substrate is exposed to O* radical, N* radical or H* radicals
obtained from the coaxial capacitive plasma to form an ALD layer.
Remaining O* radical, N* radical or H* radicals are discharged via
a second portion 20, a third portion 30 and an exhaust portion
310.
[0147] Meanwhile, the experimental apparatus may include a halogen
lamp (not shown) installed between the vapor deposition reactors 1
or at the last position of the substrate 40 so that additional
thermal treatment can be performed during or after a thin film is
deposited. In addition, before an atomic-layer thin film is
deposited, cleaning or removing of a natural oxide film may be
performed with respect to the substrate 40. In this case, a gas for
removing an oxide film, such as ClF.sub.3 or NF.sub.3, may be
injected into the vapor deposition reactor 1, or hydrogen
remote-plasma may be generated in the vapor deposition reactor 1.
Thus, the atomic layer thin film may be deposited through in-situ
by performing a surface treatment or pre-processing process before
the atomic layer thin film is deposited. Alternatively, after the
natural oxide thin film is removed, nitriding may be performed with
respect to the substrate using nitrogen radical by nitrogen
remote-plasma. Then, a high-k thin film may be deposited through
in-situ.
[0148] FIG. 22A is a scanning electron microscope (SEM) photograph
of a TiN thin film formed using a vapor deposition reactor
according to an embodiment. FIGS. 22B to 22D are SEM photographs
obtained by enlarging upper, middle and lower portions 2200, 2210,
2220 of FIG. 22A, respectively.
[0149] FIG. 23A is a transmission electron microscope (TEM)
photograph of the TiN thin film formed using the vapor deposition
reactor according to an embodiment. FIGS. 23B to 23D are TEM
photographs obtained by enlarging upper, middle and lower portions
2300, 2310, 2320 of FIG. 23A, respectively.
[0150] The TiN thin films shown in FIGS. 22 and 23 are deposited on
a trench pattern with a diameter of about 135 nm so as to check
conformality that is a characteristic of the atomic-layer thin
film. At this time, the depth of a trench is about 8 .mu.m, and the
pattern density is 1:2. Ar gas of about 3 sccm is used to bubble
TiCl.sub.4 as a source precursor, and NH.sub.3 gas of about 20 sccm
is used as a reactant precursor. The deposition temperature of the
thin film is about 380.degree. C., and the rotating table is
rotated 200 times at a rotation velocity of about 10 rpm, thereby
depositing a TiN atomic-layer thin film with a thickness of about
13.5 nm. Whenever the substrate passes by the vapor deposition
reactor, a TiN thin film with a thickness of about 0.67 .ANG. is
formed. The TiN thin film has the (111) crystal direction with a
columnar shape, and has excellent conformality in which a bottom
coverage is 95%.
[0151] FIG. 24A is an SEM photograph of a TiN thin film formed
using a vapor deposition reactor according to another embodiment.
FIGS. 24B to 24D are SEM photographs obtained by enlarging upper,
middle and lower portions 2400, 2410, 2420 of FIG. 24A,
respectively. FIG. 24 illustrates a TiN atomic-layer thin film
formed using remote-plasma.
[0152] In the TiN thin film shown in FIG. 24, Ar gas of about 3
sccm is used to bubble TiCl.sub.4 as a source precursor, and
NH.sub.3 gas of about 15 sccm is used as a reactant precursor.
Power of 10 W is applied for generating plasma. The deposition
temperature of the thin film is about 380.degree. C., and the
rotating table is rotated 200 times at a rotation velocity of about
10 rpm, thereby depositing a TiN atomic-layer thin film with a
thickness of about 15.5 nm. Whenever the substrate passes by the
vapor deposition reactor, a TiN thin film with a thickness of about
0.77 .ANG. is formed. The TiN thin film has a step-coverage of
80%.
[0153] The TiN thin films shown in FIGS. 22 and 23 are compared
with the TiN thin film shown in FIG. 24. When radicals are
generated by plasma are used, the deposition velocity is increased,
but the conformality is decreased.
[0154] In the conventional methods of atomic layer deposition, a
precursor is injected into the chamber, and a thin film is obtained
using only a molecule layer adsorbed on the surface of the
substrate. Therefore, in the formation of an atomic layer, the
deposition efficiency, i.e., the ratio of a source used in the
deposition with respect to a total source injected, has a close
relationship with the size of the chamber.
[0155] However, if one of the vapor deposition reactors according
to the aforementioned embodiments are used, the reacting material
is filled only in the first portion of the vapor deposition
reactor, and hence, the deposition efficiency is very higher than
that in the conventional vapor deposition reactors. Also, since the
adsorption and desorption of the molecule layer are performed while
passing the substrate through the lower portion of the vapor
deposition reactor, the precursor is continuously supplied with no
valve for ALD or driving unit, and thus, the configuration of the
vapor deposition reactor can be simplified.
[0156] Also, since the injection, desorption and exhaustion of the
reacting material are performed in the interior of the vapor
deposition reactor, the deposition can be performed regardless of
the atmosphere in the interior of the chamber. Also, since the
source precursor and reactant precursor are injected into and
exhausted from separate vapor deposition reactors, respectively, a
reactant byproduct such as powder or gum is not produced in an
exhaust line. Accordingly, the reliability, durability and economy
of the apparatus can be improved in addition to the thin film.
[0157] While the present invention has been described in connection
with certain exemplary embodiments, it is to be understood that the
invention is not limited to the disclosed embodiments, but, on the
contrary, is intended to cover various modifications and equivalent
arrangements included within the spirit and scope of the appended
claims, and equivalents thereof
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