U.S. patent application number 13/759048 was filed with the patent office on 2014-08-07 for vapor chamber structure.
This patent application is currently assigned to ASIA VITAL COMPONENTS CO., LTD.. The applicant listed for this patent is ASIA VITAL COMPONENTS CO., LTD.. Invention is credited to Hsiu-Wei Yang.
Application Number | 20140216691 13/759048 |
Document ID | / |
Family ID | 51258291 |
Filed Date | 2014-08-07 |
United States Patent
Application |
20140216691 |
Kind Code |
A1 |
Yang; Hsiu-Wei |
August 7, 2014 |
VAPOR CHAMBER STRUCTURE
Abstract
An improvement to a vapor chamber structure comprises a first
body, a second body, and a working fluid. The first body has a
plurality of first channels and a plurality of second channels, the
first and second channels communicating with one another. The
second body has a third channel, the first and second bodies and
the first, second, and third channels communicate with one another
and has a wick structure and are filled with a working fluid. By
means of such a design of the present invention, the first body has
the effect of uniform heat dissipation and the remote heat
dissipation can be achieved through the second body. Consequently,
the whole heat dissipation can be considerably improved.
Inventors: |
Yang; Hsiu-Wei; (New Taipei
City, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
ASIA VITAL COMPONENTS CO., LTD. |
New Taipei City |
|
TW |
|
|
Assignee: |
ASIA VITAL COMPONENTS CO.,
LTD.
New Taipei City
TW
|
Family ID: |
51258291 |
Appl. No.: |
13/759048 |
Filed: |
February 5, 2013 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
F28D 15/0275 20130101;
F28D 15/0266 20130101; F28D 15/04 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Claims
1. An improvement to a vapor chamber structure, comprising: a first
body having a plurality of first channels and a plurality of second
channels, the first and second channels communicating with one
another; a second body having a third channel, wherein the second
body is connected to the first body such that the third channel and
the first and second channels communicate with one another, wherein
a wick structure is disposed on the wall surfaces of the first,
second, and third channels; and a working fluid filled in the first
and second bodies.
2. The improvement to a vapor chamber structure according to claim
1, wherein the wick structure is selected to be one of mesh, fiber,
sintered powder, and grooves.
3. The improvement to a vapor chamber structure according to claim
1, wherein the first and second channels communicate with and
intersect with one another at right angles.
4. The improvement to a vapor chamber structure according to claim
1, wherein the first body is formed by extrusion.
5. The improvement to a vapor chamber structure according to claim
1, wherein the second body is a heat pipe.
6. The improvement to a vapor chamber structure according to claim
1, wherein the first body further comprises a first enclosure side
and a second enclosure side which seal two ends of the first
channels, respectively .
7. The improvement to a vapor chamber structure according to claim
1, wherein the second body further comprises a first end and a
second end, wherein the first end is connected to the first body,
wherein the second end extends away from the first end.
8. The improvement to a vapor chamber structure according to claim
1, further comprising a heat dissipater connected to one end of the
second body opposite to the first body.
9. The improvement to a vapor chamber structure according to claim
1, wherein the second body further has a first end and a second
end, wherein the first and second ends are connected to the first
body, wherein a transfer portion connected to a heat dissipater is
disposed between the first and second ends of the second body.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present invention relates to an improvement to a vapor
chamber structure and in particular to an improvement to a vapor
chamber structure with a large area for uniform heat transfer and
remote heat dissipation.
[0003] 2. Description of Prior Art
[0004] With the compact size of the present electronic apparatus
gradually becoming the appealing demand, each component of the
electronic apparatus thus continues to shrink. However, the size
shrinking of the electronic apparatus is accompanied with the heat
dissipation issue which becomes the major barrier against an
improvement to the performance of the electronic apparatus and
system. Even the semiconductor sizes of the electronic components
continue to shrink; there is still a constant demand for
outstanding performance
[0005] When the semiconductor size shrinks, the induced heat flux
increases consequently. The challenge caused by an increase in heat
flux to cool the heated product is more severe than the total
amount of the increased heat. Due to the increase in heat flux, the
overheating issue about the electronic products will occur for
various sizes at any time, causing damage to and failure in the
electronic components.
[0006] In order to overcome the issue concerning heat dissipation
in a compact space caused by the prior art technology, those
skilled in the art used a VC (Vapor Chamber) attached on the chip
for heat dissipation. In order to increase the capillary attraction
capability, the wick structures with porous supports such as copper
pillars, sintered coating, sintered pillars and foam pillars are
used as support and return paths. The design of the above-mentioned
support is for the connection between the upper and lower walls of
the micro VC in which the two walls are quite thin (applied with
thickness below 1.5 mm) and may fail due to thermal expansion.
[0007] The prior art VC applies the uniform heat transfer of
plane-to-plane in which the heated surface at one side of the VC
contacts with a heat source and then transfers the heat uniformly
to a cooling surface at opposite side of the VC. It has the
advantages of a larger area for heat transfer and a fast heat
transfer rate; however, its disadvantage is that it can not
transfer and dissipate the heat to a remote end. If the heat can
not be dissipated immediately, the heat will be accumulated around
the heat source. This is the main disadvantage of the VC.
SUMMARY OF THE INVENTION
[0008] In order to effectively overcome the above disadvantage of
the prior art, the primary objective of the present invention is to
provide an improvement to a vapor chamber structure, which can
improve the heat dissipation.
[0009] In order to achieve the above objective, the present
invention provides an improvement to a vapor chamber structure
comprising a first body, a second body, and a working fluid.
[0010] The first body has a plurality of first channels and a
plurality of second channels, the first and second channels
communicating with one another. The second body has a third
channel; the second body is connected to the first body; the third
channel and the first and second channels communicate with one
another; a wick structure is disposed on the wall surfaces of the
first, second, and third channels. The working fluid is filled in
the first and second bodies.
[0011] By means of the present invention, the VC can have the
effects of heat transfer through a large area and remote heat
dissipation, further considerably improving the whole heat
dissipation of the VC.
BRIEF DESCRIPTION OF DRAWING
[0012] FIG. 1 is a perspective view of the improvement to a vapor
chamber structure according to the first embodiment of the present
invention;
[0013] FIG. 2 is a cross-sectional assembled view of the
improvement to a vapor chamber structure according to the first
embodiment of the present invention;
[0014] FIG. 3 is a perspective assembled view of the improvement to
a vapor chamber structure according to the second embodiment of the
present invention; and
[0015] FIG. 4 is a perspective assembled view of the improvement to
a vapor chamber structure according to the third embodiment of the
present invention.
DETAILED DESCRIPTION OF THE INVENTION
[0016] The above objective and structural and functional features
of the present invention will be described with reference to the
preferred embodiments in the accompanying drawings.
[0017] Please refer to FIGS. 1 and 2, which are the perspective
view and cross-sectional assembled view of the improvement to a
vapor chamber structure according to the first embodiment. As shown
in FIGS. 1 and 2, the improvement to a vapor chamber structure
according to the current embodiment comprises a first body 11, a
second body 12, and a working fluid 2.
[0018] The first body 11 has a plurality of first channels 111 and
a plurality of second channels 112, the first and second channels
111, 112 communicating with one another.
[0019] The first and second channels 111, 112 communicate with and
intersect with one another at right angles. The first body 11
comprises a first enclosure side 113 and a second enclosure side
114 which seal two ends of the first channels 111,
respectively.
[0020] The second body 12 has a third channel 121; the second body
12 is connected to the first body 11 such that the third channel
121 and the first and second channels 111, 112 communicate with one
another. A wick structure 3 is disposed on the wall surfaces of the
first, second, and third channels 111, 112, 121. The second body 12
is a heat pipe. The second body 12 further comprises a first end
122 and a second end 123; the first end 122 is connected to the
first body 11; the second end 123 extends away from the first end
122. The wick structure 3 is selected to be one of mesh, fiber,
sintered powder, and grooves. In the current embodiment, the
grooves are used for explanation, but not limited to this. The
working fluid 2 is filled in the first and second bodies 11,
12.
[0021] The first body 11 may be formed by extrusion. When the first
body 11 is extruded, the first channels 111 in the first body 11
are formed at the same time and a plurality of grooves 1111 are
disposed on the wall surfaces of the first channels 111. Then, the
second channels 112 are formed in the first body 11 by machining,
and communicate and intersect with the first channels 111 at right
angles. Next, the two open ends of the first channels 111 are
sealed; the second body 12 is connected to the first body 11 such
that the first, second, and third channels 111, 112, 113
communicate with one another. Finally, the first and second bodies
11, 12 are pumped to vacuum and the working fluid 2 is filled
therein.
[0022] Please refer to FIG. 3, which is a perspective assembled
view of the improvement to a vapor chamber structure according to
the second embodiment of the present invention. As shown in FIG. 3,
some structures of the second embodiment are the same as those of
the first embodiment, not described again here. The main difference
between the first and second embodiments is that the second
embodiment further comprises a heat dissipater 4 which is connected
to one end of the second body 12 opposite to the first body 11. The
absorbed heat is transferred through the second body 12 and the
working fluid 2 therein to the connection point between the second
body 12 and the heat dissipater 4, finally through the heat
dissipater 4 to perform cooling.
[0023] Please refer to FIG. 4, which is a perspective assembled
view of the improvement to a vapor chamber structure according to
the third embodiment of the present invention. As shown in FIG. 4,
some structures of the third embodiment are the same as those of
the first embodiment, not described again here. The main difference
between the first and third embodiments is that in the third
embodiment the first and second ends 112, 123 of the second body 12
are connected to the first body 11; a transfer portion 124
connected to a heat dissipater 4 is disposed between the first and
second ends 122, 123 of the second body 12.
[0024] Through the first, second, and third embodiments of the
present invention, the disadvantage of large heat accumulation
around the heat source in the prior art VC can be overcome,
effectively achieving the effect of remote heat dissipation.
* * * * *