Yang; Hsiu-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Yang; Hsiu-Wei.The latest application filed is for "manufacturing method of vapor chamber".
Company Profile
4.43.66
- Yang; Hsiu-Wei - New Taipei TW
- Yang; Hsiu-Wei - Sinjhuang N/A TW
- Yang; Hsiu-Wei - New Taipei City TW
- Yang; Hsiu-Wei - New Taipel City TW
- Yang; Hsiu-Wei - New Tapei TW
- Yang; Hsiu-Wei - Sinjhuang City TW
- YANG; HSIU-WEI - Kaohsiung TW
- Yang; Hsiu-Wei - Hsin-Chuang TW
- Yang; Hsiu Wei - Erie PA
- Yang; Hsiu-Wei - Taipei TW
- Yang; Hsiu-Wei - Hsin-Chuang City TW
Patent Activity
| Patent | Date |
|---|---|
| Heat-conducting case unit for handheld electronic device Grant 10,788,869 - Yang September 29, 2 | 2020-09-29 |
| Case heat dissipation unit of handheld electronic device Grant 10,785,894 - Yang Sept | 2020-09-22 |
| Back cover unit applied to portable device and having heat conduction function Grant 10,602,642 - Yang | 2020-03-24 |
| Micro vapor chamber Grant 10,502,496 - Yang Dec | 2019-12-10 |
| Manufacturing Method Of Vapor Chamber App 20190271510 - Yang; Hsiu-Wei | 2019-09-05 |
| Vapor Chamber Structure App 20190261537 - Yang; Hsiu-Wei | 2019-08-22 |
| Thermal module Grant 10,352,625 - Yang July 16, 2 | 2019-07-16 |
| Method for sealing a heat transfer unit Grant 10,307,874 - Yang | 2019-06-04 |
| Case Heat Dissipation Unit Of Handheld Electronic Device App 20180376619 - Yang; Hsiu-Wei | 2018-12-27 |
| Back Cover Unit Applied To Handheld Electronic Device With Heat Conduction And Heat Dissipation Effect App 20180376620 - Yang; Hsiu-Wei | 2018-12-27 |
| Back Cover Unit Applied To Portable Device And Having Heat Conduction Function App 20180368284 - Yang; Hsiu-Wei | 2018-12-20 |
| Heat-conducting Case Unit For Handheld Electronic Device App 20180321717 - Yang; Hsiu-Wei | 2018-11-08 |
| Manufacturing method of vapor chamber Grant 10,112,272 - Yang , et al. October 30, 2 | 2018-10-30 |
| Thermal module Grant 10,107,558 - Yang October 23, 2 | 2018-10-23 |
| Heat dissipation unit of handheld electronic device Grant 10,101,779 - Yang October 16, 2 | 2018-10-16 |
| Method of manufacturing heat dissipation device Grant 10,029,337 - Yang July 24, 2 | 2018-07-24 |
| Heat dissipation unit and thermal module thereof Grant 9,903,665 - Yang February 27, 2 | 2018-02-27 |
| Vapor chamber structure Grant 9,879,920 - Yang , et al. January 30, 2 | 2018-01-30 |
| Thin heat pipe structure and manufacturing method thereof Grant 9,802,240 - Yang October 31, 2 | 2017-10-31 |
| Thermal module Grant 9,772,143 - Yang September 26, 2 | 2017-09-26 |
| Vapor Chamber Structure App 20170248374 - Yang; Hsiu-Wei ; et al. | 2017-08-31 |
| Manufacturing Method Of Vapor Chamber App 20170246712 - Yang; Hsiu-Wei ; et al. | 2017-08-31 |
| Heat dissipation device and manufacturing method thereof Grant 9,700,930 - Yang July 11, 2 | 2017-07-11 |
| Raised bodied vapor chamber structure Grant 9,549,486 - Yang January 17, 2 | 2017-01-17 |
| Method Of Manufacturing Heat Dissipation Device App 20160288277 - Yang; Hsiu-Wei | 2016-10-06 |
| Heat dissipation unit Grant 9,453,688 - Yang September 27, 2 | 2016-09-27 |
| Manufacturing method of heat pipe structure Grant 9,421,648 - Yang , et al. August 23, 2 | 2016-08-23 |
| Method For Sealing A Heat Transfer Unit App 20160193702 - Yang; Hsiu-Wei | 2016-07-07 |
| Heat spreader structure and manufacturing method thereof Grant 9,303,927 - Yang , et al. April 5, 2 | 2016-04-05 |
| Micro vapor chamber Grant 9,291,398 - Yang , et al. March 22, 2 | 2016-03-22 |
| Heat Dissipation Unit And Thermal Module Thereof App 20150176919 - Yang; Hsiu-Wei | 2015-06-25 |
| Vapor Chamber Structure App 20150168078 - Yang; Hsiu-Wei | 2015-06-18 |
| Heat Dissipation Unit of Handheld Electronic Device App 20150160703 - Yang; Hsiu-Wei | 2015-06-11 |
| Plate-type heat pipe sealing structure and manufacturing method thereof Grant 9,032,624 - Yang May 19, 2 | 2015-05-19 |
| Heat Pipe Structure App 20150122460 - Yang; Hsiu-Wei ; et al. | 2015-05-07 |
| Flat plate heat pipe and method for manufacturing the same Grant 9,021,698 - Yang May 5, 2 | 2015-05-05 |
| Manufacturing Method Of Heat Pipe Structure App 20150113807 - Yang; Hsiu-Wei ; et al. | 2015-04-30 |
| Thin heat pipe structure and method of manufacturing same Grant 8,997,839 - Yang , et al. April 7, 2 | 2015-04-07 |
| Heat-dissipating unit having a hydrophilic compound film and method for depositing a hydrophilic compound film Grant 8,997,840 - Yang April 7, 2 | 2015-04-07 |
| Heat Dissipation Unit App 20150083372 - Yang; Hsiu-Wei | 2015-03-26 |
| Heat dissipation device with mounting structure Grant 8,985,196 - Yang March 24, 2 | 2015-03-24 |
| Thermal Module App 20150060020 - Yang; Hsiu-Wei | 2015-03-05 |
| Vapor Chamber Structure App 20150027668 - Yang; Hsiu-Wei | 2015-01-29 |
| Manufacturing Mehtod Of Vapor Chamber Structure App 20150026981 - Yang; Hsiu-Wei | 2015-01-29 |
| Heat pipe manufacturing method Grant 8,893,384 - Yang , et al. November 25, 2 | 2014-11-25 |
| Thermal Module App 20140318744 - Yang; Hsiu-Wei | 2014-10-30 |
| Thermal Module App 20140318745 - Yang; Hsiu-Wei | 2014-10-30 |
| Flat plate heat pipe and method for manufacturing the same Grant 8,869,878 - Yang October 28, 2 | 2014-10-28 |
| Heat Dissipation Unit And Manufacturing Method Thereof And Thermal Module Thereof App 20140237822 - Yang; Hsiu-Wei | 2014-08-28 |
| Heat Dissipation Device And Manufacturing Method Thereof App 20140237823 - Yang; Hsiu-Wei | 2014-08-28 |
| Vapor Chamber Structure App 20140216691 - Yang; Hsiu-Wei | 2014-08-07 |
| Heat Dissipating Device App 20140182819 - Yang; Hsiu-Wei | 2014-07-03 |
| Heat pipe structure Grant 8,757,247 - Yang , et al. June 24, 2 | 2014-06-24 |
| Thin Heat Pipe Structure And Manufacturing Method Thereof App 20140165401 - Yang; Hsiu-Wei | 2014-06-19 |
| Heat Dissipation Device and Method of Manufacturing Same App 20140144019 - Yang; Hsiu-Wei | 2014-05-29 |
| Thin Heat Pipe Structure And Method Of Manufacturing Same App 20140082943 - Yang; Hsiu-Wei ; et al. | 2014-03-27 |
| Heat Dissipation Structure For Heat Dissipation Device App 20130306275 - Yang; Hsiu-Wei ; et al. | 2013-11-21 |
| Heat Dissipation Structure For Heat Dissipation Unit App 20130306274 - Yang; Hsiu-Wei ; et al. | 2013-11-21 |
| Method for manufacturing flat plate heat pipe Grant 8,516,700 - Yang August 27, 2 | 2013-08-27 |
| Heat Pipe And Method For Manufacturing The Same App 20130168054 - Yang; Hsiu-Wei | 2013-07-04 |
| Heat Pipe Structure App 20130126133 - Wu; Chun-Ming ; et al. | 2013-05-23 |
| Flat Plate Heat Pipe and Method for Manufacturing the Same App 20130118012 - Yang; Hsiu-Wei | 2013-05-16 |
| Plate-Type Heat Pipe Sealing Structure and Manufacturing Method Thereof App 20130118011 - Yang; Hsiu-Wei | 2013-05-16 |
| Heat Dissipation Device And Manufacturing Method Thereof App 20130098592 - Yang; Hsiu-Wei | 2013-04-25 |
| Vapor Chamber Structure And Method Of Manufacturing Same App 20130092353 - Yang; Hsiu-Wei | 2013-04-18 |
| Vapor Chamber Structure And Method Of Manufacturing Same App 20130048252 - Yang; Hsiu-Wei | 2013-02-28 |
| Heat Dissipation Device And Method Of Manufacturing Same App 20130048253 - Yang; Hsiu-Wei | 2013-02-28 |
| Heat Dissipation Device With Mounting Structure App 20130042999 - Yang; Hsiu-Wei | 2013-02-21 |
| Heat Dissipation Unit And Manufacturing Method Thereof And Thermal Module Thereof App 20130008634 - Yang; Hsiu-Wei | 2013-01-10 |
| Heat Pipe Manufacturing Method App 20130000122 - Yang; Hsiu-Wei ; et al. | 2013-01-03 |
| Thin Heat Pipe Structure And Manufacturing Method Thereof App 20120312507 - Yang; Hsiu-Wei | 2012-12-13 |
| Heat Spreader Structure And Manufacturing Method Thereof App 20120305222 - Yang; Hsiu-Wei ; et al. | 2012-12-06 |
| Thin Heat Pipe Structure And Manufacturing Method Thereof App 20120305223 - Yang; Hsiu-Wei ; et al. | 2012-12-06 |
| Heat-dissipating Unit Having A Hydrophilic Compound Film And Method For Depositing A Hydrophilic Compound Film App 20120227936 - Yang; Hsiu-Wei | 2012-09-13 |
| Micro Vapor Chamber App 20120186784 - Yang; Hsiu-Wei ; et al. | 2012-07-26 |
| Thin Heat Pipe Structure And Method Of Manufacturing Same App 20120180995 - Yang; Hsiu-Wei ; et al. | 2012-07-19 |
| Heat Pipe Structure App 20120180994 - Yang; Hsiu-Wei ; et al. | 2012-07-19 |
| Plate-type Heat Pipe Sealing Structure And Manufacturing Method Thereof App 20120080170 - Yang; Hsiu-Wei | 2012-04-05 |
| Flat Type Heat Pipe Device App 20110186268 - YANG; HSIU-WEI ; et al. | 2011-08-04 |
| Manufacturing system for making a heat dissipating device Grant 7,721,439 - Lin , et al. May 25, 2 | 2010-05-25 |
| Process of making theaflavins enriched tea extract App 20090092690 - Yang; Hsiu Wei ; et al. | 2009-04-09 |
| Heat dissipating device Grant 7,469,740 - Lin , et al. December 30, 2 | 2008-12-30 |
| Method for making a heat dissipating device Grant 7,464,463 - Lin , et al. December 16, 2 | 2008-12-16 |
| Method for making a heat dissipating device Grant 7,461,450 - Lin , et al. December 9, 2 | 2008-12-09 |
| Flat Type Heat Pipe Device And Method Of Fabrication Thereof App 20080080133 - Yang; Hsiu-Wei ; et al. | 2008-04-03 |
| Method For Making Plate Type Heat Pipe App 20070261243 - Yang; Hsiu-Wei ; et al. | 2007-11-15 |
| Manufacturing system for making a heat dissipating device App 20060213056 - Lin; Jao-Ching ; et al. | 2006-09-28 |
| Heat dissipating device App 20060213647 - Lin; Jan-Ching ; et al. | 2006-09-28 |
| Method for making a heat dissipating device App 20060213062 - Lin; Jao-Ching ; et al. | 2006-09-28 |
| Method for making a heat dissipating device App 20060213063 - Lin; Jao-Ching ; et al. | 2006-09-28 |
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