U.S. patent application number 13/472147 was filed with the patent office on 2013-11-21 for heat dissipation structure for heat dissipation device.
The applicant listed for this patent is Chih-Yeh Lin, Hsiu-Wei Yang. Invention is credited to Chih-Yeh Lin, Hsiu-Wei Yang.
Application Number | 20130306275 13/472147 |
Document ID | / |
Family ID | 49580335 |
Filed Date | 2013-11-21 |
United States Patent
Application |
20130306275 |
Kind Code |
A1 |
Yang; Hsiu-Wei ; et
al. |
November 21, 2013 |
HEAT DISSIPATION STRUCTURE FOR HEAT DISSIPATION DEVICE
Abstract
A heat dissipation structure for heat dissipation device
includes a heat dissipation device main body that internally
defines a chamber, and the chamber is internally provided with at
least a whisker layer and a working fluid. The whisker layer is
provided on an inner wall surface of the chamber. By providing the
whisker layer in the chamber, it is able to provide largely
upgraded capillary effect in the chamber to thereby increase the
vapor/liquid cycling efficiency of the working fluid in the heat
dissipation device, enabling the latter to have upgraded heat
transfer performance.
Inventors: |
Yang; Hsiu-Wei; (New Taipei
City, TW) ; Lin; Chih-Yeh; (New Taipei City,
TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
Yang; Hsiu-Wei
Lin; Chih-Yeh |
New Taipei City
New Taipei City |
|
TW
TW |
|
|
Family ID: |
49580335 |
Appl. No.: |
13/472147 |
Filed: |
May 15, 2012 |
Current U.S.
Class: |
165/104.21 ;
165/104.11 |
Current CPC
Class: |
F28D 15/046 20130101;
F28F 2255/20 20130101; F28D 15/02 20130101 |
Class at
Publication: |
165/104.21 ;
165/104.11 |
International
Class: |
F28D 15/02 20060101
F28D015/02; F28D 15/00 20060101 F28D015/00 |
Claims
1. A heat dissipation structure for heat dissipation device,
comprising a heat dissipation device main body internally defining
a chamber, the chamber being internally provided with at least a
whisker layer and a working fluid, and the whisker layer being
continuously provided on an inner wall surface of the chamber.
2. The heat dissipation structure for heat dissipation device as
claimed in claim 1, wherein the heat dissipation device main body
is a heat pipe, and the chamber includes at least a first, a second
and a third section, which are connected to and communicable with
one another; and the whisker layer being provided in one of or each
of the first, the second, and the third section.
3. The heat dissipation structure for heat dissipation device as
claimed in claim 1, wherein the inner wall surface of the chamber
is a smooth wall surface.
4. The heat dissipation structure for heat dissipation device as
claimed in claim 2, wherein the chamber is further internally
provided with a coating, and the coating being selectively provided
in any one of the first, the second, and the third section.
5. The heat dissipation structure for heat dissipation device as
claimed in claim 1, wherein the heat dissipation device main body
is selected from the group consisting of a vapor chamber, a heat
pipe, a loop heat pipe, and a heat exchanger.
6. The heat dissipation structure for heat dissipation device as
claimed in claim 1, wherein the chamber is further internally
provided between the inner wall surface and the whisker layer with
a wick structure.
7. The heat dissipation structure for heat dissipation device as
claimed in claim 6, wherein the wick structure is selected from the
group consisting of a sintered powder structure, a mesh structure,
a fibrous structure, a porous structure, and a grooved
structure.
8. The heat dissipation structure for heat dissipation device as
claimed in claim 1, wherein the heat dissipation device main body
is a heat pipe, and the whisker layer being axially extended over
the inner wall surface of the chamber of the heat pipe.
9. The heat dissipation structure for heat dissipation device as
claimed in claim 2, wherein a portion of the whisker layer provided
in the second section of the chamber has a density higher than that
of other portions of the whisker layer provided in the first and
the third section.
10. The heat dissipation structure for heat dissipation device as
claimed in claim 2, wherein a portion of the whisker layer provided
in the second section of the chamber has a density lower than that
of other portions of the whisker layer provided in the first and
the third section.
11. The heat dissipation structure for heat dissipation device as
claimed in claim 1, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
12. The heat dissipation structure for heat dissipation device as
claimed in claim 2, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
13. The heat dissipation structure for heat dissipation device as
claimed in claim 3, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
14. The heat dissipation structure for heat dissipation device as
claimed in claim 4, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
15. The heat dissipation structure for heat dissipation device as
claimed in claim 5, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
16. The heat dissipation structure for heat dissipation device as
claimed in claim 6, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
17. The heat dissipation structure for heat dissipation device as
claimed in claim 7, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
18. The heat dissipation structure for heat dissipation device as
claimed in claim 8, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
19. The heat dissipation structure for heat dissipation device as
claimed in claim 9, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
20. The heat dissipation structure for heat dissipation device as
claimed in claim 10, wherein the whisker layer is formed of a
plurality of individual whiskers; the individual whiskers
respectively having a fixed connecting end located on the inner
wall surface of the chamber and another opposite end extending
toward an interior of the chamber to form a free end; and the free
ends of the individual whiskers being sharp ends.
Description
FIELD OF THE INVENTION
[0001] The present invention relates to a heat dissipation
structure for heat dissipation device, and more particularly to a
heat dissipation structure that enables a working fluid in a heat
dissipation device to have upgraded vapor/liquid cycling
efficiency.
BACKGROUND OF THE INVENTION
[0002] It is known that various heat transfer components, such as
heat pipes, vapor chambers, loop heat pipes and heat exchangers,
are currently widely employed in electronic apparatuses for
transferring and dissipating heat at high efficiency.
[0003] Such heat transfer components have excellent heat transfer
rate several times to several tens times as high as that of copper,
aluminum and the like, and are therefore used in various electronic
apparatuses as cooling components. Regarding heat pipes, they can
be divided according to their shapes into circular heat pipes, flat
heat pipes and D-shaped heat pipes. For cooling an electronic
component in an electronic apparatus that produces heat during
operation or working, such as a CPU or an executing component, it
is preferable to use a vapor chamber, a flat heat pipe or a
thin-type heat exchanger as the heat transfer or cooling component
in view of the easy installation and large contact area thereof.
Meanwhile, due to the demands for a miniaturized cooling mechanism,
heat pipes therefor must also be extremely thin to adapt to the
very limited internal space in the cooling mechanism.
[0004] Further, for a working fluid provided in the above-mentioned
heat transfer components to cyclically convert between vapor phase
and liquid phase, capillary structures with capillary force, such
as grooved structures, metal mesh structures or sintered
structures, are also provided in the heat transfer components to
help the working fluid to carry on the vapor/liquid cycling
smoothly.
[0005] For using in a narrow space, the heat transfer components
must be manufactured to be very thin. However, other than the
thickness of the heat transfer component, the capillary structures
inside the heat transfer component form another major obstacle in
further thinning the heat transfer component.
[0006] Moreover, the capillary force of the thinned capillary
structures will degrade to adversely affect the vapor/liquid
cycling efficiency of the working fluid to thereby largely reduce
the heat transfer efficiency of the heat transfer component.
Therefore, the conventional heat transfer components have the
following disadvantages: (1) poor heat transfer efficiency; and (2)
unable to be effectively thinned.
SUMMARY OF THE INVENTION
[0007] To overcome the above-mentioned drawbacks in the prior art
heat transfer components, it is a primary object of the present
invention to provide a heat dissipation structure for heat
dissipation device that enables upgraded heat transfer and heat
dissipation efficiency.
[0008] Another object of the present invention is to provide a heat
dissipation structure for heat dissipation device that enables a
working fluid in a thin-type heat dissipation device to have
enhanced vapor/liquid cycling efficiency.
[0009] To achieve the above and other objects, the heat dissipation
structure for heat dissipation device according to the present
invention includes a heat dissipation device main body that
internally defines a chamber. The chamber is internally provided
with at least a whisker layer and a working fluid, and the whisker
layer is continuously provided on an inner wall surface of the
chamber.
[0010] According to the present invention, the heat dissipation
device main body can be any one of a heat pipe, a loop heat pipe, a
flat heat pipe, a vapor chamber, and a heat exchanger.
[0011] The whisker layer is able to largely upgrade the
vapor/liquid cycling efficiency of the working fluid in the heat
dissipation device main body because it has a dense structure to
maintain a capillary force even in a thin-type heat dissipation
device, and can therefore help the working fluid to carry on
vapor/liquid cycling smoothly.
BRIEF DESCRIPTION OF THE DRAWINGS
[0012] The structure and the technical means adopted by the present
invention to achieve the above and other objects can be best
understood by referring to the following detailed description of
the preferred embodiments and the accompanying drawings,
wherein
[0013] FIG. 1 is a perspective view of a heat dissipation structure
for heat dissipation device according to a first embodiment of the
present invention;
[0014] FIG. 2 is a sectional view taken along line A-A of FIG.
1;
[0015] FIG. 2A is an enlarged view of the circled area of FIG.
2;
[0016] FIG. 3 is a sectional view of a heat dissipation structure
for heat dissipation device according to a second embodiment of the
present invention;
[0017] FIG. 4 is a sectional view of a heat dissipation structure
for heat dissipation device according to a third embodiment of the
present invention;
[0018] FIG. 5 is a sectional view of a heat dissipation structure
for heat dissipation device according to a fourth embodiment of the
present invention;
[0019] FIG. 6 is a sectional view of a heat dissipation structure
for heat dissipation device according to a fifth embodiment of the
present invention;
[0020] FIG. 7 is a sectional view of a heat dissipation structure
for heat dissipation device according to a sixth embodiment of the
present invention;
[0021] FIG. 8 is a sectional view of a heat dissipation structure
for heat dissipation device according to a seventh embodiment of
the present invention;
[0022] FIG. 9 is a sectional view of a heat dissipation structure
for heat dissipation device according to an eighth embodiment of
the present invention;
[0023] FIG. 10 is a sectional view of a heat dissipation structure
for heat dissipation device according to a ninth embodiment of the
present invention; and
[0024] FIGS. 10A-10D are SEM images of the whisker layer in the
present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0025] The present invention will now be described with some
preferred embodiments thereof and with reference to the
accompanying drawings. For the purpose of easy to understand,
elements that are the same in the preferred embodiments are denoted
by the same reference numerals.
[0026] Please refer to FIG. 1 that is a perspective view of a heat
dissipation structure for heat dissipation device according to a
first embodiment of the present invention, and to FIGS. 2 and 2A
that are respectively a sectional view taken along line A-A of FIG.
1 and an enlarged view of the circled area of FIG. 2. As shown, in
the first embodiment thereof, the heat dissipation structure for
heat dissipation device includes a heat dissipation device main
body 1 that internally defines a chamber 11, in which at least a
whisker layer 111 and a working fluid 112 are provided. The whisker
layer 111 is continuously provided on a whole or part of the inner
wall surface of the chamber 11, and is formed of a plurality of
individual whiskers. The individual whiskers respectively have an
end fixedly located on the inner wall surface of the chamber 11 and
referred to as a fixed connecting end herein, and another opposite
end extending toward an interior of the chamber 11 and being a free
end. As can be seen from some SEM (scanning electron microscope)
images of the whisker layer 111 shown in the FIGS. 10A-10D, the
individual whiskers have sharp free ends.
[0027] The main body 1 can be any one of a vapor chamber, a flat
heat pipe, a loop heat pipe, and a heat exchanger. In the
illustrated first embodiment of the present invention, the main
body 1 is a flat heat pipe without being limited thereto. Further,
the chamber 11 has a smooth inner wall surface.
[0028] Please refer to FIG. 3 that is a sectional view of a heat
dissipation structure for heat dissipation device according to a
second embodiment of the present invention. As shown, in the second
embodiment, the heat dissipation device main body 1 is also
illustrated as a heat pipe but not necessarily limited thereto, and
the whisker layer 111 axially extends along the inner surface of
the chamber 11 of the heat pipe.
[0029] FIG. 4 is a sectional view of a heat dissipation structure
for heat dissipation device according to a third embodiment of the
present invention. As shown, in the third embodiment, the heat
dissipation device main body 1 is also illustrated as a heat pipe
but not necessarily limited thereto, and the chamber 11 includes at
least a first section 113, a second section 114 and a third section
115 connected to and communicable with one another. The whisker
layer 111 can be selectively provided in any one of the first, the
second and the third section 113, 114, 115. In the illustrated
third embodiment, the whisker layer 111 is provided only in the
second section 114 but not necessarily restricted thereto.
[0030] FIG. 5 is a sectional view of a heat dissipation structure
for heat dissipation device according to a fourth embodiment of the
present invention. As shown, the fourth embodiment is generally
structurally similar to the third embodiment, except that the
chamber 11 in the fourth embodiment is further internally provided
with a coating 2, which has both super-hydrophilic and
super-hydrophobic properties. The coating 2 is selectively provided
in any one of the first, the second and the third section 113, 114,
115. In the illustrated fourth embodiment, the coating 2 is
provided in the third section 115.
[0031] Please refer to FIG. 6 that is a sectional view of a heat
dissipation structure for heat dissipation device according to a
fifth embodiment of the present invention. As shown, the fifth
embodiment is generally structurally similar to the third
embodiment, except that the chamber 11 in the fifth embodiment is
further internally provided with a coating 2, and the coating 2 is
provided in the first and the third section 113, 115 of the chamber
11.
[0032] Please refer to FIG. 7 that is a sectional view of a heat
dissipation structure for heat dissipation device according to a
sixth embodiment of the present invention. As shown, the sixth
embodiment is generally structurally similar to the second
embodiment, except that, in the sixth embodiment, a wick structure
3 is further provided between the inner wall surface of the chamber
11 and the whisker layer 111. The wick structure 3 can be any one
of a sintered powder structure, a mesh structure, a fibrous
structure, a porous structure, a grooved structure, and any
combinations thereof. In the sixth embodiment, the wick structure
is illustrated as a grooved structure without being limited
thereto. The grooved structure includes a plurality of grooves
formed on and sunken from the inner wall surface of the chamber 11,
and the whisker layer 111 covers both the grooves and the inner
wall surface of the chamber 11.
[0033] FIG. 8 is a sectional view of a heat dissipation structure
for heat dissipation device according to a seventh embodiment of
the present invention. As shown, the seventh embodiment is
generally structurally similar to the second embodiment, except
that, in the seventh embodiment, a coating 2 is further provided
between the inner wall surface of the chamber 11 and the whisker
layer 111.
[0034] FIG. 9 is a sectional view of a heat dissipation structure
for heat dissipation device according to an eighth embodiment of
the present invention. As shown, the eighth embodiment is generally
structurally similar to the third embodiment, except that the
chamber 11 in the eighth embodiment further includes at least a
first section 113, a second section 114 and a third section 115
that are connected to and communicable with one another, and a
portion of the whisker layer 111 provided in the second section 114
has a density higher than that of other portions of the whisker
layer 111 provided in the first and the third section.
[0035] FIG. 10 is a sectional view of a heat dissipation structure
for heat dissipation device according to a ninth embodiment of the
present invention. As shown, the ninth embodiment is generally
structurally similar to the third embodiment, except that the
chamber 11 in the ninth embodiment further includes at least a
first section 113, a second section 114 and a third section 115
that are connected to and communicable with one another, and a
portion of the whisker layer 111 provided in the second section 114
has a density lower than that of other portions of the whisker
layer 111 provided in the first and the third section.
[0036] In brief, by providing the whisker layer 111 in the heat
pipe, the vapor chamber, the flat heat pipe and the loop heat pipe,
the whisker layer 111 is able to change the surface tension of the
working fluid 112 in the chamber 11, so that the working fluid 112
can flow back at an increased speed to provide excellent
vapor/liquid cycling efficiency for the heat dissipation device to
have largely upgraded heat transfer performance.
[0037] The FIG. 10A-10D shows some SEM images of the whisker layer
111, which can be covered over a wick structure.
[0038] The present invention has been described with some preferred
embodiments thereof and it is understood that many changes and
modifications in the described embodiments can be carried out
without departing from the scope and the spirit of the invention
that is intended to be limited only by the appended claims.
* * * * *