U.S. patent application number 13/796622 was filed with the patent office on 2014-04-10 for structure and manufacturing method for high resolution camera module.
This patent application is currently assigned to KINGPAK TECHNOLOGY INC.. The applicant listed for this patent is KINGPAK TECHNOLOGY INC.. Invention is credited to Chun-Lung HUANG, Hsiu-Wen TU, Rong-Chang WANG, Cheng-Chang WU, Chung-Yu YANG, Jo-Wei YANG.
Application Number | 20140098287 13/796622 |
Document ID | / |
Family ID | 50408047 |
Filed Date | 2014-04-10 |
United States Patent
Application |
20140098287 |
Kind Code |
A1 |
HUANG; Chun-Lung ; et
al. |
April 10, 2014 |
STRUCTURE AND MANUFACTURING METHOD FOR HIGH RESOLUTION CAMERA
MODULE
Abstract
The present invention discloses a structure and a manufacturing
method for a high-resolution camera module, wherein the method
includes the following steps: providing an image sensor wafer
comprising multiple image sensor chips; performing inspection and
defining if each image sensor chip is a good chip; disposing an
optical cover on the image sensor chip defined as the good chip,
wherein the optical cover faces a sensing area and does not cover
conductive contacts; cutting the image sensor wafer to obtain the
discrete image sensor chip covered with the optical cover; and
disposing a first surface of the divided image sensor chip on a
bottom surface of a ceramic substrate. The present invention can
seal the high resolution camera module during early stage of the
manufacturing process to improve the yield rate of the camera
module, and downsize the camera module effectively.
Inventors: |
HUANG; Chun-Lung; (Chu-Pei,
TW) ; TU; Hsiu-Wen; (Chu-Pei, TW) ; WU;
Cheng-Chang; (Chu-Pei, TW) ; YANG; Chung-Yu;
(Chu-Pei, TW) ; WANG; Rong-Chang; (Chu-Pei,
TW) ; YANG; Jo-Wei; (Chu-Pei, TW) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
KINGPAK TECHNOLOGY INC. |
Chu-Pei |
|
TW |
|
|
Assignee: |
KINGPAK TECHNOLOGY INC.
Chu-Pei
TW
|
Family ID: |
50408047 |
Appl. No.: |
13/796622 |
Filed: |
March 12, 2013 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61711594 |
Oct 9, 2012 |
|
|
|
Current U.S.
Class: |
348/374 ;
29/825 |
Current CPC
Class: |
H04N 5/2253 20130101;
Y10T 29/49117 20150115; H01L 2224/16 20130101; H01L 27/14618
20130101 |
Class at
Publication: |
348/374 ;
29/825 |
International
Class: |
H04N 5/225 20060101
H04N005/225 |
Claims
1. A method for making a high-resolution camera module comprising
the steps of: providing an image sensor wafer, wherein the image
sensor wafer comprises a plurality of image sensor chips, each
image sensor chip includes a first surface, a second surface, and a
plurality of conductive contacts, wherein the first surface has a
sensing area surrounded by the plurality of conductive contacts;
performing an inspection to inspect and define if each image sensor
chip is a good chip; disposing an optical cover on the first
surface of the image sensor chip defined as the good chip, wherein
the optical cover faces the sensing area and does not cover the
conductive contacts, and the surface of the optical cover is
smaller than the surface of the image sensor chip; cutting the
image sensor wafer to obtain the discrete image sensor chip covered
with the optical cover; disposing the image sensor chip on a
ceramic substrate, wherein the ceramic substrate has a hollow
portion, a bottom surface, and a top surface, a horizontal area of
the hollow portion is larger than the surface of the optical cover,
the first surface of the divided image sensor chip is adhered and
disposed to the bottom surface and faces the hollow portion, and
the conductive contacts of the image sensor chip are electrically
connected to the ceramic substrate; and forming a packaging portion
to cover a periphery of the image sensor chip and connection
between the image sensor chip and the ceramic substrate.
2. The method of claim 1, wherein the step of disposing the optical
cover comprises: a substep of applying an adhesive on the image
sensor chip, wherein the adhesive is applied on the first surface
and on a region between the sensing area and the conductive
contacts; and a substep of disposing the optical cover onto the
image sensor chip for bonding the optical cover on the image sensor
chip with the adhesive.
3. The method of claim 2, wherein the adhesive is further mixed
with ball spacers.
4. The method of claim 2, wherein the adhesive shows a closed loop
pattern.
5. The method of claim 1, wherein the step of disposing the optical
cover comprises: a substep of providing a dam on the optical cover,
wherein the dam is a closed loop structure and provided on a
periphery of a third surface of the optical cover, and the third
surface faces the image sensor chip; and a substep of disposing the
optical cover on the image sensor chip, wherein an adhesive is
pre-applied on the first surface between the sensing area and the
conductive contacts in a closed loop pattern, and the optical cover
is bonded to the image sensor chip by the adhesive.
6. The method of claim 5, wherein the dam is made of glass,
ceramic, liquid crystal polymer, molding compound, siloxane based
polymer, photosensitive dry film, or solder mask.
7. The method of claim 5, wherein a frame flange is formed on an
outer peripheral edge of an upper surface of the dam and combined
with lateral side of the optical cover, a depression is formed on
an inside of the dam, and an opening is formed between the optical
cover and the frame flange; and the method further comprises a step
of sealing the opening for sealing the opening with a sealant.
8. The method of claim 7, wherein the dam is made of glass,
ceramic, liquid crystal polymer, molding compound, siloxane based
polymer, photosensitive dry film, or solder mask.
9. The method of claim 2, wherein the adhesive shows a C shape
pattern with an opening; and the method further comprises a step of
sealing the opening for sealing the opening with a sealant.
10. The method of claim 2, wherein the adhesive shows two L shape
patterns, and the L shape patterns are disposed correspondingly to
form a square pattern with two openings in two diagonal corners;
and the method further comprises a step of sealing the opening for
sealing the opening with a sealant.
11. A structure of a high-resolution camera module, comprising: a
ceramic substrate having a hollow portion, a top surface, and a
bottom surface; a image sensor chip having a first surface, a
second surface, and a plurality of conductive contacts, wherein the
first surface has a sensing area surrounded by the plurality of
conductive contacts, and the first surface is disposed on the
bottom surface, such that the image sensor chip is electrically
connected to the ceramic substrate through the conductive contacts;
an optical cover disposed on the first surface by an adhesive,
wherein the adhesive is in the region between the sensing area and
the conductive contacts, and the optical cover is smaller than the
image sensor chip and faces the sensing area; and a packaging
portion covering a periphery of the image sensor chip and
connection between the image sensor chip and the ceramic
substrate.
12. The structure of claim 11, further comprising a plurality of
passive elements disposed on the top surface.
13. The structure of claim 11, wherein the adhesive is further
mixed with ball spacers.
14. The structure of claim 11, wherein the adhesive shows a closed
loop pattern.
15. The structure of claim 14, wherein the optical cover further
comprises a dam with a closed loop structure, the dam is provided
on a periphery of a third surface of the optical cover, and the
third surface faces the image sensor chip.
16. The structure of claim 15, wherein the dam is made of glass,
ceramic, liquid crystal polymer, molding compound, siloxane based
polymer, photosensitive dry film, or solder mask.
17. The structure of claim 15, wherein a frame flange is formed on
an outer peripheral edge of the upper surface of the dam and
combined with lateral side of the optical cover, a depression is
formed on an inside of the dam, an opening is formed between the
optical cover and the frame flange, and the opening is filled
air-tightly by a sealant.
18. The structure of claim 17, wherein the dam is made of glass,
ceramic, liquid crystal polymer, molding compound, siloxane based
polymer, photosensitive dry film, or solder mask.
19. The structure of claim 11, wherein the adhesive shows a C shape
pattern with an opening and the opening is filled air-tightly by a
sealant.
20. The structure of claim 11, wherein the adhesive shows two L
shape patterns, the L shape patterns are disposed correspondingly
to form a square pattern with two openings in two diagonal corners,
and the opening is filled air-tightly by a sealant.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Technical Field
[0002] The present invention relates to a structure and a
manufacturing method for a camera module. More particularly, the
present invention relates to a structure and a manufacturing method
for a high resolution camera module.
[0003] 2. Description of Related Art
[0004] The portability of mobile phones has brought increased
efficiency and convenience to our daily lives. At the same time,
continuous improvement in technology has provided mobile phones
with more and more functions, including picture taking and video
recording for example. In order to meet the requirement for using a
high-resolution camera module having advantages of being light,
compact, and suitable for mass-production in a mobile phone, the
manufacturing process of such camera modules must be effectively
simplified, and the module structure must be downsized.
[0005] FIG. 1 shows the structure of a conventional high-resolution
camera module in cross-section, and FIG. 2 is the flowchart of a
conventional method for making a high-resolution camera module.
Referring to FIG. 1, a conventional high-resolution camera module
10 includes: a ceramic substrate 11, a glass cover 12, an image
sensor chip 13, a packaging portion 14, and a plurality of passive
elements 15. As shown in FIG. 2, a method S100 for making a
high-resolution camera module includes the steps of: providing a
ceramic substrate attached with a glass cover (step S10), providing
an image sensor chip onto the ceramic substrate by a flip-chip
technique (step S20), and packaging the image sensor chip along its
periphery (step S30).
[0006] The ceramic substrate 11 provided in step S10 is formed with
a hollow portion and has a glass bonding surface 111 and a chip
bonding surface 112. The glass bonding surface 111 and the chip
bonding surface 112 are the top surface and the bottom surface of
the ceramic substrate 11 respectively. The glass cover 12, which is
bonded to the glass bonding surface 111, has an upper surface 121
and a lower surface 122. The periphery of the lower surface 122 is
bonded to the glass bonding surface 111 such that the glass cover
12 covers the hollow portion of the ceramic substrate 11.
[0007] In step S20, the periphery of an upper surface of the image
sensor chip 13 is connected to the chip bonding surface 112 by a
flip-chip technique while a sensing area of the image sensor chip
13 is aligned with the hollow portion of the ceramic substrate 11,
allowing external light to impinge on the sensing area through the
glass cover 12. The image sensor chip 13 is electrically connected
to the ceramic substrate 11 by conductive elements 16, e.g., solder
balls. Thus, a cavity 17 is formed between the image sensor chip
13, the glass cover 12, and the ceramic substrate 11. The height of
the cavity 17 is at least greater than the thickness of the ceramic
substrate 11. The image sensor chip 13 may be a CMOS image sensor
chip.
[0008] In step S30, the periphery of the image sensor chip 13 and
the joint between the image sensor chip 13 and the ceramic
substrate 11 are sealed with a mold compound by an underfill
technique or an epoxy dispensing technique. Thus, the cavity 17 is
sealed, and the packaging portion 14 is formed. A plurality of
passive elements 15 may be additionally provided on the glass
bonding surface 111 and be electrically connected to the ceramic
substrate 11 by the conductive elements 16.
[0009] Nevertheless, the manufacturing method and structure
described above have the following problems and limitations. First
of all, as the surface of the image sensor chip 13 is not covered
and protected by the glass cover 12 until a later stage of the
manufacturing process, moisture or dust particles are likely to
enter the image sensor chip 13 during manufacture, resulting in a
high fraction defective and consequently a low yield rate. Further,
the cavity 17 formed between the image sensor chip 13, the glass
cover 12, and the ceramic substrate 11 is too large, which not only
prevents the camera module from being effectively downsized, but
also compromises the stability of temperature cycling tests.
SUMMARY OF THE INVENTION
[0010] The present invention discloses a structure and a
manufacturing method for a high-resolution camera module, wherein
the method comprises the following steps: providing an image sensor
wafer; performing inspection; disposing an optical cover; cutting
the image sensor wafer; disposing an image sensor chip on a ceramic
substrate; and forming a packaging portion. The present invention
improves yield rate of a high-resolution camera module by sealing
the high-resolution camera module during early stage of the
manufacturing process, and downsizes the high-resolution camera
module.
[0011] The present invention provides a method for making a
high-resolution camera module comprising the steps of: providing an
image sensor wafer, wherein the image sensor wafer comprises a
plurality of image sensor chips, each image sensor chip includes a
first surface, a second surface, and a plurality of conductive
contacts, wherein the first surface has a sensing area surrounded
by the plurality of conductive contacts; performing an inspection
to inspect and define if each image sensor chip is a good chip;
disposing an optical cover on the first surface of the image sensor
chip defined as the good chip, wherein the optical cover faces the
sensing area and does not cover the conductive contacts, and the
surface of the optical cover is smaller than the surface of the
image sensor chip; cutting the image sensor wafer to obtain the
discrete image sensor chip covered with the optical cover;
disposing the image sensor chip on a ceramic substrate, wherein the
ceramic substrate has a hollow portion, a bottom surface, and a top
surface, a horizontal area of the hollow portion is larger than the
surface of the optical cover, the first surface of the divided
image sensor chip is adhered and disposed to the bottom surface and
faces the hollow portion, and the conductive contacts of the image
sensor chip is electrically connected to the ceramic substrate; and
forming a packaging portion to cover a periphery of the image
sensor chip and connection between the image sensor chip and the
ceramic substrate.
[0012] The present invention also provides a structure of a
high-resolution camera module, comprising: a ceramic substrate
having a hollow portion, a top surface, and a bottom surface; a
image sensor chip having a first surface and a plurality of
conductive contacts, wherein the first surface has a sensing area
surrounded by the plurality of conductive contacts, and the first
surface is disposed on the bottom surface, such that the image
sensor chip is electrically connected to the ceramic substrate
through the conductive contacts; an optical cover disposed on the
first surface by an adhesive, wherein the adhesive is in the region
between the sensing area and the conductive contacts, and the
optical cover is smaller than the image sensor chip and faces the
sensing area; and a packaging portion covering a periphery of the
image sensor chip and connection between the image sensor chip and
the ceramic substrate.
[0013] At least the following improvements can be achieved with
implementation of the present invention:
[0014] 1. Improving yield rate of a high-resolution camera module
by sealing the camera module during early stage of the
manufacturing process; and
[0015] 2. Downsizing the camera module effectively.
[0016] The detailed features and advantages of the present
invention will be described in detail with reference to the
preferred embodiment so as to enable persons skilled in the art to
gain insight into the technical disclosure of the present
invention, implement the present invention accordingly, and readily
understand the objectives and advantages of the present invention
by perusal of the contents disclosed in the specification, the
claims, and the accompanying drawings.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0017] FIG. 1 is a sectional view for a structure of a conventional
high-resolution camera module;
[0018] FIG. 2 is a flowchart of a conventional method for making a
high-resolution camera module;
[0019] FIG. 3 is a sectional view for a structure of a
high-resolution camera module according to an embodiment of the
present invention;
[0020] FIG. 4 is a flowchart of a method for making a
high-resolution camera module according to an embodiment of the
present invention;
[0021] FIG. 5 is a top view and a partial enlarged view for a wafer
of a high-resolution camera module according to an embodiment of
the present invention;
[0022] FIG. 6 is a flowchart of an epoxy dispensing method for
disposing an optical cover according to an embodiment of the
present invention;
[0023] FIG. 7A is a top view of region AA' in FIG. 3 according to
an embodiment of the present invention;
[0024] FIG. 7B is another top view of region AA' in FIG. 3
according to an embodiment of the present invention;
[0025] FIG. 7C is still another top view of region AA' in FIG. 3
according to an embodiment of the present invention;
[0026] FIG. 8 is a flowchart of a dam forming method for disposing
an optical cover according to an embodiment of the present
invention;
[0027] FIG. 9A is an isometric view of an optical cover combined
with a dam according to an embodiment of the present invention;
[0028] FIG. 9B is another sectional view for a structure of a
high-resolution camera module according to an embodiment of the
present invention;
[0029] FIG. 10A is an isometric view of a darn according to an
embodiment of the present invention;
[0030] FIG. 10B is another isometric view of an optical cover
combined with a dam according to an embodiment of the present
invention;
[0031] FIG. 10C is still another sectional view for a structure of
a high-resolution camera module according to an embodiment of the
present invention; and
[0032] FIG. 10D is a top view of region AA' in FIG. 10C according
to an embodiment of the present invention.
DETAILED DESCRIPTION OF THE EMBODIMENTS OF THE INVENTION
[0033] Referring to FIG. 3, a high-resolution camera module 20
according to an embodiment of the present invention includes: a
ceramic substrate 21, an optical cover 22, an image sensor chip 23,
and a packaging portion 24. Referring to FIG. 4, a method S200 for
making a high-resolution camera module according to an embodiment
of the present invention includes the steps of: providing an image
sensor wafer (step S210), performing inspection to define good
chips (step S220), disposing an optical cover onto each good chip
(step S230), cutting the image sensor wafer (step S240), disposing
each image sensor chip onto a ceramic substrate (step S250), and
forming a packaging portion (step S260).
[0034] The step of providing an image sensor wafer (step S210) is
now described with reference to FIG. 5. An image sensor wafer 30 is
made by a wafer manufacturing process and includes a plurality of
wafer-level image sensor chips 23. Each image sensor chip 23 has a
first surface 231 and a second surface 232, wherein the first
surface 231 is an upper surface of the image sensor chip 23 and has
a sensing area 233 surrounded by conductive contacts 26. The
conductive contacts 26 may be bond pads.
[0035] The step of performing inspection to define good chips (step
S220) is carried out as follows. All the finished image sensor
chips 23 on the image sensor wafer 30 are inspected, by an image
test or an electrical test for example, to determine whether each
image sensor chip 23 functions properly and is defect-free.
Additionally, a particle inspection is performed to determine if
any image sensor chip 23 is rendered defective by an excessive
amount of particles lying thereon. Those image sensor chips 23
which function properly and are free of defects are defined as good
chips 31, and those image sensor chips 23 which fail to function
properly or are defective are defined as bad chips 32.
[0036] Next, the step of disposing an optical cover onto each good
chip (step S230) is executed. An optical cover 22 is provided onto
the first surface 231 of each of the good chips 31 to keep the good
chips 31 from particle contamination during the following packaging
process (e.g., cutting process or connecting process).
[0037] In the following steps, only the good chips 31 are used, and
the bad chips 32 are not used; therefore, all the image sensor
chips 23 hereinafter mentioned are good chips 31. Please note that
the optical covers 22 must be smaller than the good chips 31 and
must not cover the conductive contacts 26 of the good chips 31.
Moreover, each optical cover 22 must be located right above the
sensing area 233. The optical cover 22 may be a glass cover
allowing light to impinge on the sensing area 233 through the glass
cover.
[0038] To prevent the optical cover 22 from tilting while being
disposed on the image sensor chip 23, the step of disposing an
optical cover (step S230) can be performed with the following two
ways: the first one is epoxy dispensing and the second one is dam
forming.
[0039] Referring to FIGS. 3, 6, and 7A, in the epoxy dispensing
method, the step of disposing an optical cover (step S230')
includes: applying an adhesive on the image sensor chip (step S231)
and disposing the optical cover onto the image sensor chip (step
S232).
[0040] To begin with, in step S231, an adhesive 281 is applied, by
an epoxy dispensing technique, to the first surface 231 of the
image sensor chip 23 at positions approximately between the
conductive contacts 26 and the sensing area 233, i.e., at positions
where the optical cover 22 is to be bonded. The adhesive 281 can be
applied in a closed loop pattern to form and seal a cavity 27
between the optical cover 22 and the image sensor chip 23.
[0041] Then, in step S232, the optical cover 22 is bonded to the
image sensor chip 23 by the adhesive 281. The adhesive 281 may be
used in conjunction with ball spacers 282. The adhesive 281 may be
used in conjunction with ball spacers 282, whose height prevents
the flowing adhesive 281 from forming various heights and thereby
prevents the optical cover 22 from tilting. Should the optical
cover 22 tilt, the yield rate will be lowered.
[0042] Referring to FIG. 7B as well, the adhesive 281 may be in a C
shape pattern with an opening 283. It prevents gas pressure inside
the cavity 27 from varying due to rising temperature, and thereby
prevents the optical cover 22 from tilting or the adhesive 281 from
overflowing.
[0043] Referring to FIG. 7C as well, the adhesive 281 may be in two
L shape patterns. These L shape patterns may be disposed diagonally
to form a square pattern with two openings 283 in two diagonal
corners. The opening 283, formed among the adhesive 281, the
optical cover 22 and the image sensor chip 23, may balance the gas
pressure inside and outside the cavity 27 to prevent excessively
high pressure inside the cavity 27 from pushing the optical cover
22 or the adhesive 281 and causing tilt of the optical cover 22 or
overflow of the adhesive 281.
[0044] As shown in FIG. 8 to FIG. 9B, in the method of dam forming,
the step of disposing an optical cover (step S230'') includes:
providing a dam onto an optical cover (step S233) and disposing the
optical cover onto an image sensor chip (step S234).
[0045] First, in step S233, a dam 29 is provided on a periphery of
a third surface 221, which faces the image sensor chip 23, of an
optical cover 22. The dam 29 may be a closed loop structure which
flushes with sides of the third surface 211 or is located on the
interior of the third surface 211 and keeps a distance from the
sides of the third surface 211.
[0046] In step S234 that follows, the adhesive 281 is pre-applied
to the first surface 231 of the image sensor chip 23 at positions
approximately between the conductive contacts 26 and the sensing
area 233. The optical cover 22 on which the dam 29 has been formed
is bonded to the image sensor chip 23 by adhering a bottom surface
of the dam 29 with the adhesive 281 such that the optical cover 22
lies above the image sensor chip 23. The adhesive 281 is also in a
closed loop pattern to form and completely seal a cavity 27 among
the optical cover 22, the dam 29 and the image sensor chip 23.
[0047] A fixed height of the dam 29 ensures that the optical cover
22 is parallel to the image sensor chip 23 without tilting.
Furthermore, a volume of the cavity 27 can be effectively reduced
by controlling the fixed height of the dam 29. The dam 29 can be
made of any one of the following or a combination thereof: epoxy,
silicone, liquid crystal polymer, molding compound, siloxane based
polymer, photosensitive dry film, solder mask, glass, and
ceramic.
[0048] As shown in FIG. 10A to FIG. 10D, to solve unsteady bonding
of the optical cover 22 or overflow of the adhesive due to
excessively high air pressure inside the cavity 27 under
temperature variation during process, a depression 293 may be
formed on an inside of the dam 29. Because of the depression, a
lower plane is formed inside an upper surface 291 of the dam 29 on
the depression 293, and stepwise level differences are formed
longitudinally and transversely. A frame flange 292 may be formed
on an outer peripheral edge of the upper surface 291 of the dam 29,
and a thickness for a portion of the frame flange 292 corresponding
to the depression 293 may be smaller.
[0049] When the frame flange 292 is combined with the optical cover
22, a periphery of a lower surface of the optical cover 22 may be
disposed on the interior of the upper surface 291 of the dam 29,
and the lateral side of the optical cover 22 connects the frame
flange 292. However, the lower plane on the depression 293 cannot
contact the optical cover 22, and the thickness for the portion of
the frame flange 292 corresponding to the depression 293 is
smaller, it cannot tightly contact the periphery of the optical
cover 22. An opening 283' with L shaped section is formed where the
optical cover 22, the frame flange 292, and the dam 29 do not
contact with each other. The opening 283' may be used to circulate
gas inside and outside the cavity 27 to balance gas pressure.
[0050] As shown in the FIGS. 4, 7B, 7C and 10C, if openings
283/283' are used to balance gas pressure inside and outside the
cavity 27, the method S200 may further include an opening sealing
step S235 for sealing the openings 283/283' with a sealant 284
after completion of the step S230. Thus, the high-resolution camera
module 20 further includes a sealant 284 air-tightly filling the
openings 283/283' to prevent contamination or damage to the image
sensor chip 23 during early stage of the manufacturing process and
increase yield rate.
[0051] As shown in FIGS. 4, 5, 9B and 10C, in the step of cutting
the image sensor wafer (step S240), at last, the image sensor wafer
30 is cut to obtain the discrete image sensor chip 23 covered with
the optical cover 22 respectively.
[0052] As shown in the FIGS. 3 to 5, 9B and 10C, in the step of
disposing the image sensor chip onto a ceramic substrate (step
S250), the divided image sensor chip 23 is then electrically
connected to a ceramic substrate 21 by a flip-chip technique. The
ceramic substrate 21 has a hollow portion 213, a bottom surface
211, and a top surface 212, wherein the top surface 212 is an upper
surface of the ceramic substrate 21 and the bottom surface 211 is a
lower surface of the ceramic substrate 21. A horizontal area of the
hollow portion 213 is larger than the surface of the optical cover
22 such that the optical cover 22 can be accommodated in a space
formed by the hollow portion 213 when the optical cover 22 is
covered on the image sensor chip 23. The first surface 231 of the
divided image sensor chip 23 is adhered and disposed to the bottom
surface 211 of the ceramic substrate 21 and faces the hollow
portion 213 such that the image sensor chip 23 is electrically
connected to a circuit structure on the bottom surface 211 of the
ceramic substrate 21 through conductive contacts 26.
[0053] In the step of forming a packaging portion (step S260), a
mold compound or a liquid compound is used to fill a periphery of
the image sensor chip 23 and connection between the image sensor
chip 23 and the ceramic substrate 21 to form a packaging portion
24. Thus, the packaging portion 24 covers the periphery of the
image sensor chip 23 and the connection between the image sensor
chip 23 and the ceramic substrate 21 to improve protection for the
periphery of the image sensor chip 23 and prevent it from collision
damages.
[0054] The high-resolution camera module 20 may further include a
plurality of passive elements 25 disposed on the top surface 212 of
the ceramic substrate 21. The passive elements 25 may be
electrically connected to the image sensor chip 23 through the
conductive contacts 26.
[0055] The disclosed method S200 for making a high-resolution
camera module and the high-resolution camera modules 20 made
thereby feature a relatively small cavity 27, which not only
reduces the volume of the high-resolution camera modules 20, but
also increases temperature cycling reliability. By disposing the
optical covers 22 respectively onto only the good chips 31 which
have been inspected in advance, a wasteful use of materials is
avoided, and the yield rate can be improved. Moreover, as the
optical covers 22 are respectively disposed on the image sensor
chips 23 on the image sensor wafer 30 before the image sensor wafer
30 is cut, the image sensor chips 23 are protected from the very
beginning to avoid contamination, allowing the yield rate and
production efficiency of the high-resolution camera modules to be
increased.
[0056] The features of the present invention are disclosed above by
the preferred embodiment to allow persons skilled in the art to
gain insight into the contents of the present invention and
implement the present invention accordingly. The preferred
embodiment of the present invention should not be interpreted as
restrictive of the scope of the present invention. Hence, all
equivalent modifications or amendments made to the aforesaid
embodiment should fall within the scope of the appended claims.
* * * * *