YANG; JO-WEI
Patent Applications and Registrations
Patent applications and USPTO patent grants for YANG; JO-WEI.The latest application filed is for "sensor package structure".
- YANG; JO-WEI - Hsin-Chu County TW
- Yang; Jo-Wei - Hsin-Chu Hsien TW
- Yang; Jo-Wei - Chu-Pei TW
| Patent | Date |
|---|---|
| Sensor Package Structure App 20210057470 - HUNG; LI-CHUN ; et al. | 2021-02-25 |
| Sensor package structure Grant 10,825,851 - Yang , et al. November 3, 2 | 2020-11-03 |
| Sensor package structure Grant 10,720,370 - Chen , et al. | 2020-07-21 |
| Sensor Package Structure App 20200119070 - YANG; SHENG ; et al. | 2020-04-16 |
| Sensor package structure Grant 10,600,830 - Chen , et al. | 2020-03-24 |
| Sensor Package Structure App 20190355639 - CHEN; JIAN-RU ; et al. | 2019-11-21 |
| Stack type sensor package structure Grant 10,340,250 - Chen , et al. | 2019-07-02 |
| Stack Type Sensor Package Structure App 20190057952 - Chen; Jian-Ru ; et al. | 2019-02-21 |
| Sensor Package Structure App 20190057992 - CHEN; JIAN-RU ; et al. | 2019-02-21 |
| Sensor package structure Grant 9,905,597 - Yang , et al. February 27, 2 | 2018-02-27 |
| Sensor Package Structure App 20180019274 - YANG; JO-WEI ; et al. | 2018-01-18 |
| Method for reducing tilt of optical unit during manufacture of image sensor Grant 9,184,331 - Chuang , et al. November 10, 2 | 2015-11-10 |
| Two-stage packaging method of image sensors Grant 8,969,120 - Huang , et al. March 3, 2 | 2015-03-03 |
| Two-stage Packaging Method Of Image Sensors App 20150011038 - HUANG; Chun-Lung ; et al. | 2015-01-08 |
| Structure and manufacturing method for high resolution camera module Grant 8,703,519 - Huang , et al. April 22, 2 | 2014-04-22 |
| Structure And Manufacturing Method For High Resolution Camera Module App 20140098287 - HUANG; Chun-Lung ; et al. | 2014-04-10 |
| Method For Reducing Tilt Of Optical Unit During Manufacture Of Image Sensor App 20130149805 - CHUANG; Chun-Hua ; et al. | 2013-06-13 |
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