U.S. patent application number 13/730011 was filed with the patent office on 2013-05-30 for method for the preparation of a multi-layered crystalline structure.
This patent application is currently assigned to MEMC Electronic Materials, Inc.. The applicant listed for this patent is MEMC Electronic Materials, Inc.. Invention is credited to Jeffrey L. Libbert, Dale A. Witte.
Application Number | 20130137241 13/730011 |
Document ID | / |
Family ID | 43587555 |
Filed Date | 2013-05-30 |
United States Patent
Application |
20130137241 |
Kind Code |
A1 |
Witte; Dale A. ; et
al. |
May 30, 2013 |
METHOD FOR THE PREPARATION OF A MULTI-LAYERED CRYSTALLINE
STRUCTURE
Abstract
This invention generally relates to a process for making a
multi-layered crystalline structure. The process includes
implanting ions into a donor structure, bonding the implanted donor
structure to a second structure to form a bonded structure,
cleaving the bonded structure, and removing any residual portion of
the donor structure from the finished multi-layered crystalline
structure.
Inventors: |
Witte; Dale A.; (Wentzville,
MO) ; Libbert; Jeffrey L.; (O'Fallon, MO) |
|
Applicant: |
Name |
City |
State |
Country |
Type |
MEMC Electronic Materials, Inc.; |
St. Peters |
MO |
US |
|
|
Assignee: |
MEMC Electronic Materials,
Inc.
St. Peters
MO
|
Family ID: |
43587555 |
Appl. No.: |
13/730011 |
Filed: |
December 28, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12974772 |
Dec 21, 2010 |
8367519 |
|
|
13730011 |
|
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61290961 |
Dec 30, 2009 |
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Current U.S.
Class: |
438/458 ;
428/119 |
Current CPC
Class: |
H01L 21/76254 20130101;
Y10T 428/24174 20150115; H01L 21/78 20130101 |
Class at
Publication: |
438/458 ;
428/119 |
International
Class: |
H01L 21/78 20060101
H01L021/78 |
Claims
1. A method for the preparation of a multi-layered crystalline
structure, the method comprising: implanting ions selected from the
group consisting of hydrogen, helium and combinations thereof into
a donor structure, wherein the donor structure comprises a central
axis, a device layer having an implantation surface and device
surface which are generally perpendicular to the central axis and
an average thickness, t, extending in the axial direction from the
implantation surface to the device surface of the device layer, a
handle layer, and an intervening layer which is positioned along
the central axis of the donor structure between the device surface
and the handle layer, wherein the ions are implanted into the donor
structure through the implantation surface to an implantation depth
D1 which is greater than the thickness, t, of the device layer to
form in the implanted donor structure a damage layer which is
generally perpendicular to the axis and located in the intervening
layer and/or in the handle layer; bonding the implanted donor
structure to a second structure to form a bonded structure;
cleaving the donor structure along the damaged layer to form a
multi-layered crystalline structure comprising the second
structure, the device layer and residual material, the residual
material comprising at least a portion of the intervening layer and
optionally a portion of the handle layer; and, removing the
residual material from the multi-layered crystalline structure.
2. The method of claim 1 wherein at least about 1.times.10.sup.16
ions/cm.sup.2 are
3. The method of claim 1 wherein at least about 1.times.10.sup.17
ions/cm.sup.2 are implanted into the donor structure.
4. The method of claim 1 further comprising thermally treating the
implanted donor structure to begin the formation of a cleave
plane.
5. The method of claim 4 wherein thermally treating the implanted
donor structure comprises heating the implanted donor structure to
a temperature of from about 150.degree. C. to about 300.degree. C.
for a period of from about 1 hour to about 100 hours.
6. The method of claim 1 wherein bonding the implanted donor
structure to a second structure comprises thermally treating the
bonded structure to strengthen the bond between the donor structure
and the second structure and to form the damage layer.
7. The method of claim 6 wherein thermally treating the bonded
structure comprises subjecting the bonded structure to a low
temperature thermal anneal.
8. The method of claim 6 wherein the low temperature thermal anneal
comprises heating the multi-layered structure to a temperature of
from about 150.degree. C. to about 600.degree. C. for a period of
from about 1 minute to about 100 hours.
9. The method of claim 1 wherein the device layer comprises a
material selected from the group consisting of silicon, silicon
carbide, sapphire, germanium, silicon germanium, gallium nitride,
aluminum nitride, gallium arsenic, indium gallium arsenic or any
combination thereof
10. The method of claim 1 wherein the intervening layer is a
dielectric layer selected from the group consisting of silicon
dioxide and silicon nitride.
11. The method of claim 1 wherein the handle layer comprises a
material selected from the group consisting of silicon, silicon
carbide, sapphire, germanium, silicon germanium, gallium nitride,
aluminum nitride, gallium arsenic, indium gallium arsenic or any
combination thereof
12. The method of claim 1 wherein the second structure is selected
from the group consisting of sapphire, quartz crystal, glass,
silicon carbide, silicon, gallium nitride, aluminum nitride,
gallium aluminum nitride, gallium arsenic, indium gallium arsenic
or any combination thereof
13. The method of claim 1 wherein implanting the donor structure
comprises implanting atoms selected from the group consisting of
helium and hydrogen through the device layer and into the
intervening layer of the donor structure.
14. The method of claim 1 wherein the ions are implanted to depth
D1 of at least about 200 Angstroms.
15. The method of claim 1 wherein the ions are implanted to depth
D1 of from about 200 Angstroms to about 1 micron beneath the
implantation surface.
16. The method of claim 1 wherein the second structure comprises a
material selected from the group consisting of sapphire.
17. The method of claim 1 wherein the second structure comprises a
multi-layer substrate.
18. The method of claim 1 wherein the method further comprises
depositing or growing a bonding layer on at least one of the second
structure and the device layer prior to bonding the donor structure
to the second structure.
19. The method of claim 1 wherein the bonded structure consists
essentially of the donor structure and the second structure.
20. A bonded structure for preparing a multi-layered crystalline
structure, the bonded structure comprising: a donor structure
comprising a central axis, a device layer having an implantation
surface and device surface which are generally perpendicular to the
central axis and an average thickness, t, extending in the axial
direction from the implantation surface to the device surface of
the device layer, a handle layer, and dielectric layer which is
positioned along the central axis of the donor structure between
the device surface and the handle layer, a damage layer which is
generally perpendicular to the axis and located in the dielectric
layer and/or in the handle layer; and a second structure bonded to
the donor structure.
21. The bonded structure of claim 20 wherein the damage layer
comprises ions.
22. The bonded structure of claim 20 wherein the device layer
comprises a material selected from the group consisting of silicon,
silicon carbide, sapphire, germanium, silicon germanium, gallium
nitride, aluminum nitride, gallium arsenic, indium gallium arsenic
or any combination thereof
23. The bonded structure of claim 20 wherein the dielectric layer
is selected from the group consisting of silicon dioxide and
silicon nitride.
24. The bonded structure of claim 20 wherein the handle layer
comprises a material selected from the group consisting of silicon,
silicon carbide, sapphire, germanium, silicon germanium, gallium
nitride, aluminum nitride, gallium arsenic, indium gallium arsenic
or any combination thereof
25. The bonded structure of claim 20 wherein the second structure
is selected from the group consisting of sapphire, quartz crystal,
glass, silicon carbide, silicon, gallium nitride, aluminum nitride,
gallium aluminum nitride, gallium arsenic, indium gallium arsenic
or any combination thereof
26. The bonded structure of claim 20 wherein the second structure
comprises a material selected from the group consisting of
sapphire.
27. The bonded structure of claim 20 wherein the second structure
comprises a multi-layer substrate.
28. The bonded structure of claim 20 comprising a bonding layer
interposed between the donor structure and second structure.
29. The bonded structure of claim 20 wherein the bonded structure
consists essentially of the donor structure and the second
structure.
30. The bonded structure of claim 20 wherein the donor structure is
a silicon-on-insulator structure.
31. The bonded structure of claim 20 wherein the damage layer is
located in the intervening layer.
32. The bonded structure of claim 20 wherein the damage layer is
located in the handle layer.
33. The bonded structure of claim 20 wherein the damage layer is at
a depth D1 from the implantation surface, D1 being at least about
200 Angstroms.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a Continuation of U.S. patent
application Ser. No. 12/974,772, filed Dec. 21, 2010, which claims
the benefit of U.S. Provisional Application No. 61/290,961, filed
Dec. 30, 2009, both of which are incorporated herein by reference
in their entirety.
FIELD OF THE INVENTION
[0002] The present invention relates generally to a process for the
preparation of a multi-layered crystalline structure.
BACKGROUND OF THE INVENTION
[0003] Multi-layered structures comprising a device layer with a
device quality surface, such as a silicon-geranium or sapphire
layer, and a silicon substrate that has a different crystal lattice
structure than the material of the device layer are useful for a
number of different purposes. These multi-layered structures
typically comprise multiple layers of material having differing
coefficients of thermal expansion. During manufacture of such
structures, however, the different rates of thermal expansion can
create very large stresses in the multilayered structures when they
are heated, which can fracture the device layer or substrate. This
places severe constraints on the maximum temperature that these
dissimilar pairs can be exposed to during manufacture.
[0004] Multi-layered structures comprising a device quality layer
bonded to a substrate may be fabricated or manufactured in a number
of ways. For example, in one approach, the multi-layered structure
may be formed by direct layer transfer. In this process, an
implanted wafer is bonded directly to the substrate, subjected to a
low temperature anneal, and cleaved thermally and/or mechanically
to result in a thin, but rough, layer on the surface of the
substrate. The rough layer must then be smoothed. Some degree of
smoothing may be done using a chemo-mechanical polishing step at
relatively low temperatures. However, chemo-mechanical polishing is
generally not suitable to achieve the uniformity required for state
of the art multilayered structures and is therefore not desirable.
Thermal methods may also be used to thin and smooth a wafer
surface; however, while thermal methods easily achieve film target
thicknesses, uniformity, and smoothness, they require that the
wafer be heated to high temperatures, which damage the
crystallinity of the film due to the aforementioned stresses.
[0005] Another method by which such multi-layered structures may be
fabricated or manufactured while solving the smoothing problem
includes bonding a silicon on insulator wafer to the dissimilar
substrate and subjecting both to a low temperature bond
strengthening anneal. (See, e.g., D. V. Singh, L. Shi, K. W.
Guarni, P. M. Mooney, S. J. Koester, and A. Grill, "Electronic
Materials" Vol. 32, no. 11, pg. 1339, 2003). The handle wafer may
then be ground or etched down to the BOX layer and the BOX layer is
removed by a hydrofluoric etch. The exposed silicon layer surface
then has the same thickness as the starting silicon-on-insulator
wafer and the finally exposed surface has roughness similar to a
polished surface with no chemo-mechanical polishing or thermal step
needed. Preparing a multi-layer structure in this way, however, is
not without problems. For example, as the entire handle wafer must
be ground or etched away, the process can become both time
consuming and costly.
SUMMARY OF THE INVENTION
[0006] Briefly, therefore, the present invention is directed to a
method for the preparation of a multi-layered crystalline
structure. The method comprises implanting ions selected from the
group consisting of hydrogen, helium and combinations thereof into
a donor structure. The donor structure comprises a central axis and
a device layer having an implantation surface and device surface
which are generally perpendicular to the central axis and an
average thickness, t, extending in the axial direction from the
implantation surface to the device surface of the device layer. The
donor structure further comprises a handle layer and an intervening
layer, which is positioned along the central axis of the donor
structure between the device surface and the handle layer. The ions
are implanted into the donor structure through the implantation
surface to an implantation depth, D1, which is greater than the
thickness, t, of the device layer to form, in the implanted donor
structure, a damage layer which is generally perpendicular to the
axis and located in the intervening layer and/or in the handle
layer. The method further comprises bonding the implanted donor
structure to a second structure to form a bonded structure,
cleaving the donor structure along the damaged layer to form a
multi-layered crystalline structure comprising the second
structure, the device layer and residual material, the residual
material comprising at least a portion of the intervening layer and
optionally a portion of the handle layer, and removing the residual
material from the multi-layered crystalline structure.
[0007] In another aspect, the current invention is directed to a
method for the preparation of a multi-layered microelectric device.
The method comprises providing a microelectric device and bonding
the microelectric device to the multi-layered crystalline structure
formed by the process described above.
[0008] Other objects and features of this invention will be in part
apparent and in part pointed out hereinafter.
BRIEF DESCRIPTION OF THE DRAWINGS
[0009] FIG. 1A is a cross-sectional, schematic drawing of a donor
structure 10 comprising a device layer 14, a handle layer 20, and
an intervening layer 22. The dashed line 24 in the handle layer 20
represents a damage layer 24, present therein.
[0010] FIG. 1B is a cross-sectional, schematic drawing of a second
structure 26, prior to bonding with the donor structure of 1A.
[0011] FIG. 2 is a cross-sectional, schematic drawing of a bonded
structure 30, resulting from contacting the surface of the device
layer 14 of the donor structure (illustrated in FIG. 1A) to the
surface of the second structure 26 (illustrated in FIG. 1B).
[0012] FIG. 3 is a cross-sectional, schematic drawing which
illustrates separation of the bonded structure 30 along the damage
layer 24 in the handle layer 20, and thus the transfer of the
device layer 14, the intervening layer 22, and a residual portion
40 of the handle layer 20 that may optionally be present thereon,
to the second structure 26.
[0013] FIG. 4 is a cross-sectional, schematic drawing of the
multi-layered crystalline structure of the present invention
42.
[0014] Corresponding reference characters indicate corresponding
parts throughout the drawings.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0015] In accordance with the present invention, an improved
process for making a multi-layered crystalline structure has been
discovered. More specifically, it has been discovered that the use
of layer transfer and chemical etching techniques provides an
improved method for more efficiently producing a multi-layered
crystalline structure. In accordance with the invention, the donor
structure may be any structure generally comprising at least a
device layer, a handle wafer, and an intervening layer disposed
therebetween. Advantageously, the handle wafer of the donor
structure may be recycled multiple times. For exemplary purposes
herein, the donor structure is a silicon-on-insulator
structure.
[0016] It is to be noted that the silicon-on-insulator structure
used for the donor structure in the exemplary embodiment of the
instant invention may be formed by known processes. Such processes
include, for example, SOI formation by oxygen implantation (Simox),
bonding a semiconductor wafer to an oxidized handle and
grinding/etching a portion of the semiconductor wafer away (BESOI),
or bonding and layer transfer techniques described in U.S. Patent
Application Publication Nos. 2007/0041566 and 2007/0117350, the
entire contents of which are incorporated herein by reference for
all purposes. Preferably, the process of the present invention
utilizes wafer bonding and layer transfer techniques to prepare the
donor structure. The present invention will therefore be set forth
in greater detail below in the context of these techniques. It is
to be understood, however, that this is for purposes of
illustration and should not be viewed in a limiting sense. It is to
be further understood that, in the practice of the present
invention, these techniques may be suitably carried out using a
variety of apparatus and process conditions well-known in the art
and, in some instances, may be omitted or combined with other
techniques and conditions without departing from the scope of the
present invention.
1. Formation of the Multi-Layered Crystalline Structure
[0017] The multi-layered crystalline structure of the present
invention may be prepared by implanting ions into a donor structure
comprising a device layer, a handle layer and an intervening layer,
bonding the donor structure to a second structure to form a bonded
structure, cleaving a portion or all of the handle layer and
optionally a portion of the intervening layer from the device layer
which remains bonded to the second structure and optionally etching
a portion or all of the remaining handle layer and/or intervening
layer from the device layer thereby exposing the device layer. In
one embodiment, the first structure (referred to herein as the
"donor structure") is an SOI structure, and the second structure is
a sapphire wafer.
[0018] The donor structure provides the device layer for the final
multi-layered crystalline structure. The other substrate will be
referred to hereinafter as the "second structure." The second
structure may be comprised of sapphire, quartz crystal, silicon
carbide, silicon, or glass. In one alternative embodiment, an
amount of a bonding layer is disposed on at least one of the donor
structure or the second structure prior to bonding the donor
structure to the second structure.
[0019] A. Donor Structure
[0020] Referring now to FIG. 1A, the donor structure 10 comprises a
central axis 12 and a device layer 14, wherein the device layer 14
comprises an implantation surface 16 and a device surface 18. The
implantation surface 16 and device surface 18 are generally
perpendicular to the central axis 12. An average thickness, t,
extends in the axial direction from the implantation surface 16 to
the device surface 18 of the device layer 14. The donor structure
10 further comprises a handle layer 20 and an intervening layer 22,
which is positioned along the central axis 12 of the donor
structure 10 between the device surface 18 and the handle layer
20.
[0021] The device layer comprises any material suitable for use in
the production of microelectronic or photovoltaic devices. The
device layer typically comprises a material selected from the group
consisting of silicon, silicon carbide, sapphire, germanium,
silicon germanium, gallium nitride, aluminum nitride, or any
combination of these. In one preferred embodiment, the device layer
comprises silicon.
[0022] In general, the device layer has an average thickness, t,
which is suitable for use in the production of microelectronic or
photovoltaic devices; however the device layer may have a thickness
greater than those typically used without departing from the scope
of the present invention. Generally, the device layer has an
average thickness, t, of at least about 20 nm, typically at least
about 90 nm and may have a thickness, t, of from about 20 nm to
about 500 nm.
[0023] The intervening layer may be any material capable of
adhering to both the device layer and handle layer and which may be
permeated by ion implantation. Typically, the intervening layer is
a dielectric layer and comprises a material selected from the group
consisting of silicon dioxide and silicon nitride. In general, the
intervening layer has an average thickness of at least about 10 nm,
typically at least about 500 nm.
[0024] The handle layer may be any material upon which an
intervening layer may be deposited. In some embodiments of the
present invention, ions are implanted into the handle layer. In
such embodiments, the handle layer comprises a material suitable
for ion implantation and is capable of being cleaved by ion
implantation and delamination techniques known in the art.
Typically, the handle layer comprises a material selected from the
group consisting of silicon, silicon carbide, sapphire, germanium,
silicon germanium, gallium nitride, aluminum nitride, gallium
arsenic, indium gallium arsenic or any combination thereof
[0025] In general, the handle layer may have any thickness capable
of providing sufficient structural integrity to allow delamination
of the device layer and at least a portion of the intervening layer
and optionally a portion of the handle layer without departing from
the scope of the present invention. In general, the handle layer
may have an average thickness of at least about 100 microns,
typically at least about 200 microns and may have a thickness of
from about 100 to about 900 microns, or even from about 500 to
about 800 microns.
[0026] In some embodiments, the donor structure 10 may further
include a bonding layer, such as an oxide layer, deposited oxides,
TEOS, CVD nitrides, or organic adhesives, that is formed on the
implantation surface 16 prior to or after the implantation of ions
into the donor structure 10 and/or prior to the bonding of the
donor structure 10 to the second structure 26. Alternatively or in
addition, a bonding layer may be formed on the second structure
prior to bonding. The application of the bonding layer provides a
bonding interface between the donor structure 10 and the second
structure 26 so as to prevent the formation of interfacial gaps
that may occur during direct bonding of the donor structure 10 and
the second structure 26. While not required, when present, the
bonding layer may have an average thickness of at least 10 nm, and
may have an average thickness of at least about 1 micron, at least
about 3 microns or greater.
[0027] It should be noted that any technique generally known in the
art may be used to form the donor structure. For example, the donor
structure may be formed using a layer transfer process, a back side
etch process, or a SIMOX process.
[0028] It should be further noted that the ranges and minimum
thickness values set forth above are not narrowly critical to the
invention, so long as the thickness is sufficient to perform a
transfer of the device layer to the second structure by any of the
aforementioned processes.
[0029] Referring again to FIG. 1A, ions, such as hydrogen and/or
helium ions, are implanted through the implantation surface 16 at a
substantially uniform depth. In the exemplary embodiment, the ions
are implanted through the implantation surface 16 and into the
handle layer 20 to an implantation depth D.sub.1, wherein D.sub.1
is greater than the combined thickness of the device layer and the
intervening layer. In another embodiment, however, the ions may be
implanted through the implantation surface 16 and into the
intervening layer 22 such that the ions do not reach the handle
layer. It should be noted that in embodiments wherein a bonding
layer is deposited on the implantation surface before the
implantation takes place, the implantation depth, D.sub.1, may be
increased to account for the added thickness of the bonding layer.
The ion implantation defines a damage layer 24 in the layer in
which the ions are implanted. In the exemplary embodiment, as shown
in FIG. 1A, the ion implantation defines a damage layer 24 within
the handle layer 20.
[0030] In general, ions are implanted to an average depth that is
sufficient to ensure a satisfactory transfer of the device layer 14
upon a subsequent bonding and cleaving process. Preferably, the
implantation depth is minimized to decrease the amount of handle
layer 20 and/or intervening layer transferred with the device
layer. In general, the ions are implanted to a depth of at least
about 200 Angstroms or even at least about 1 micron beneath the
implantation surface depending on the thicknesses of the device
layer and intervening layer. In some embodiments, the ions may be
implanted to a depth of at least about 20 nm, typically at least
about 90 nm, at least about 250 nm or even at least about 500 nm.
It should be noted, however, that larger implantation depths may be
used without departing from the scope of the present invention as
they merely increase the amount of intervening layer and/or handle
layer that will have to be removed after cleaving to reveal the
device layer. As such, it may be preferable to implant the ions to
a depth of from about 200 Angstroms to about 1 micron or even from
about 20 nm to about 500 nm.
[0031] Ion implantation may be achieved using means known in the
art. For example, implantation may be achieved in a manner
according to the process of U.S. Pat. No. 6,790,747, the entire
contents of which are incorporated herein by reference. In some
embodiments, an energy of, for example, at least about 10 keV, at
least about 20 keV, at least about 80 keV, or at least about 120
keV may be used to implant hydrogen at a dosage of at least about
1.times.10.sup.16 ions/cm.sup.2, at least about 2.times.10.sup.16
ions/cm.sup.2, at least about 1.times.10.sup.17 ions/cm.sup.2, or
even at least about 2.times.10.sup.17 ions/cm.sup.2. Typically, the
concentration of hydrogen implanted may be from about
2.times.10.sup.16 ions/cm.sup.2 to about 6.times.10.sup.16
ions/cm.sup.2. It should be noted, that hydrogen may be implanted
as H.sub.2.sup.+ or alternatively as H.sup.+ without departing from
the scope of the present invention.
[0032] In other embodiments, an energy of, for example, at least
about 10 keV, at least about 20 keV, or at least about 30 keV, at
least about 50 keV, at least about 80 KeV or even at least about
120 keV may be used to implant helium at a dosage of at least about
5.times.10.sup.15 ions/cm.sup.2, at least about 1.times.10.sup.16
ions/cm.sup.2, at least about 5.times.10.sup.16 ions/cm.sup.2, or
even at least about 1.times.10.sup.17 ions/cm.sup.2. Typically, the
concentration of helium implanted may be from about
1.times.10.sup.16 ions/cm.sup.2 to about 3.times.10.sup.16
ions/cm.sup.2.
[0033] In other embodiments, both hydrogen and helium ions are
implanted. It should be noted that the implantation of both
hydrogen and helium in combination may be done concurrently or
sequentially with hydrogen being implanted prior to the helium or
alternatively, with helium being implanted prior to the hydrogen.
Preferably, the hydrogen and helium are implanted sequentially with
the helium being implanted first using at least about 10 keV, at
least about 20 keV, or at least about 30 keV, at least about 50
keV, at least about 80 KeV or even at least about 120 keV to
implant helium at a dosage of at least about 5.times.10.sup.15
ions/cm.sup.2, at least about 1.times.10.sup.16 ions/cm.sup.2, at
least about 5.times.10.sup.16 ions/cm.sup.2, or even at least about
1.times.10.sup.17 ions/cm.sup.2 and then implanting hydrogen at
substantially the same depth as the helium using at least about 10
keV, at least about 20 keV, or at least about 30 keV, at least
about 50 keV, at least about 80 KeV or even at least about 120 keV
to implant hydrogen at a dosage of at least about 5.times.10.sup.15
ions/cm.sup.2, at least about 1.times.10.sup.16 ions/cm.sup.2, at
least about 5.times.10.sup.16 ions/cm.sup.2, or even at least about
1.times.10.sup.17 ions/cm.sup.2. In one embodiment, for example,
about 1.times.10.sup.16 He.sup.+ ions/cm.sup.2 are implanted using
about 36 keV into the donor structure after which about
0.5.times.10.sup.16 H.sub.2.sup.+ ions/cm.sup.2 are implanted at
about 48 keV or alternatively about 1.times.10.sup.16H.sup.+
ions/cm.sup.2 are implanted at about 24 keV are implanted into the
donor structure. The specific amount of energy required to perform
the implantation of the ions into the donor structure depends on
type and form of ion(s) selected, the crystallographic structure of
the material through which and into which the ions are being
implanted and the desired implantation depth. It should be noted
that the implantation may be carried out at any temperature
suitable for such implantation. Typically, however, the
implantation may be carried out at room temperature. It should be
further noted that in this regard, the implantation temperature
referred to is the global temperature and that localized
temperature spikes may occur at the actual site of the ion beam due
to the nature of ion implantation.
[0034] After implantation is performed, the donor structure 10 may
be thermally treated to begin the formation a cleave plane at the
damage layer 24. For example, the donor structure may be thermally
treated at a temperature of from about 150.degree. C. to about
375.degree. C. for a period of from about 1 hour to about 100
hours. In an alternative embodiment, as is described below, this
thermal treatment may be combined with a thermal treatment
performed after the bonding of the donor structure 10 to the second
structure 26 so as to simultaneously strengthen the bond between
the donor structure 10 and the second structure 26 and begin the
formation of the cleave plane at the damage layer 24.
[0035] B. Handle Wafer Structure
[0036] Referring now to FIG. 1B, the second structure 26 comprises
either a single wafer or a multi-layer wafer having a bonding
surface 28. In the exemplary embodiment, as is shown in FIG. 1B,
the second structure 26 is a single wafer. The second structure 26
may be comprised of a material selected from the group consisting
of sapphire, quartz crystal, glass, silicon carbide, silicon,
gallium nitride, aluminum nitride, gallium aluminum nitride, or any
combination thereof. In one preferred embodiment, the second
structure 26 comprises a sapphire wafer.
[0037] C. Wafer Bonding and Transfer of the Device Layer
[0038] Once the donor structure 10 and the second structure 26 have
been prepared or selected, forming the final multi-layered
crystalline structure comprises transferring the device layer 14 of
the donor structure 10 onto the second structure 26. Generally
speaking, this transfer is achieved by contacting the implantation
surface 16 of the device layer 14 to the bonding surface 28 of the
second structure 26 in order to form a single, bonded structure 30
with a bond interface 32 between the two surfaces, and then
cleaving or separating the bonded structure along the cleave plane
formed along the damage layer 24.
[0039] Prior to bonding, the implantation surface 16 and/or the
bonding surface 28 may optionally undergo cleaning, a brief
etching, and/or planarization to prepare these surfaces for
bonding, using techniques known in the art. Without being bound by
a particular theory, it is generally believed that the quality of
both surfaces prior to bonding will have a direct impact on the
quality or strength of the resulting bond interface.
[0040] Alternatively or in addition to further conditioning the
implantation surface 16 and/or bonding surface 28, a bonding layer
may be formed on the implantation surface and/or bonding surface
prior to bonding the donor structure to the second structure. It
should be noted that when forming a bonding layer on the donor
structure, such formation may be performed prior to or after the
implantation step. The bonding layer may comprise any material
suitable for bonding the donor structure to the second structure
including for example an oxide layer such as silicon dioxide,
silicon nitride, deposited oxides, such as TEOS, and bonding
adhesives. Without being bound by a particular theory, the
inclusion of the bonding layer provides a bonding interface between
the donor structure 10 and the second structure 26 so as to prevent
the formation of interfacial gaps that may occur during direct
bonding of the donor structure 10 and the second structure 26. The
thermal oxide growth temperature may range from at least about
800.degree. C. to about 1100.degree. C., and the thickness of the
bonding layer typically ranges from about 10 nm to about 200 nm.
The atmosphere under which the bonding layer is grown typically
comprises oxygen, nitrogen, argon, and/or mixtures thereof for dry
oxidations and water vapor for wet oxidations. CVD deposited oxides
are typically deposited at low temperatures (i.e. from about
400.degree. C. to about 600.degree. C.). Further, some bonding
adhesives may be applied at a thickness of at least 1 micron at
room temperature, or slightly higher, and then baked or cured at
temperatures to approximately 200.degree. C.
[0041] The roughness of the surface is one way by which the surface
quality is quantitatively measured, with lower surface roughness
values corresponding to a higher quality surface. Therefore, the
implantation surface 16 of the device layer 14 and/or the bonding
surface 28 of the second structure 26 may undergo processing to
reduce the surface roughness. For example, in one embodiment, the
surface roughness is less than about 5 angstroms. This lowered RMS
value can be achieved prior to bonding by cleaning and/or
planarization. Cleaning may be carried out according to a wet
chemical cleaning procedure, such as a hydrophilic surface
preparation process. One common hydrophilic surface preparation
process is a RCA SCl clean process, wherein the surfaces are
contacted with a solution containing ammonium hydroxide, hydrogen
peroxide, and water at a ratio of, for example, 1:4:20 at about
60.degree. C. for about 10 minutes, followed by a deionized water
rinse and spin dry. Planarization may be carried out using a
chemical mechanical polishing (CMP) technique. Further, one or both
of the surfaces may be subjected to a plasma activation to increase
the resulting bond strength before, after, or instead of a wet
cleaning process. The plasma environment may include, for example,
oxygen, ammonia, argon, nitrogen, diboran, or phosphine. In one
preferred embodiment, the plasma activation environment is selected
from the group consisting of nitrogen, oxygen, and combinations
thereof
[0042] Referring now to FIG. 2, the donor structure 10 is bonded to
the second structure 26 by bringing the implantation surface 16 of
the device layer 14 and the bonding surface 28 of the second
structure 26 together to form a bond interface 32. Generally
speaking, wafer bonding may be achieved using essentially any
technique known in the art, provided the energy employed to achieve
formation of the bond interface is sufficient to ensure the
integrity of the bond interface is sustained during subsequent
processing, such as layer transfer by cleaving or separation.
Typically, however, wafer bonding is achieved by contacting the
surface of the device layer and the second structure at room
temperature, followed by a low temperature anneal for a period of
time sufficient to produce a bond interface having a bond strength
greater than about 500 mJ/m.sup.2, about 750 mJ/m.sup.2, about 1000
mJ/m.sup.2, or more. To achieve such bond strength values,
typically heating takes place at temperatures of at least about
200.degree. C., 300.degree. C., 400.degree. C., or even 500.degree.
C. for a period of time of at least about 5 minutes, 30 minutes, 60
minutes, or even 300 minutes. As noted above, in one embodiment,
this low temperature thermal anneal may be performed in addition
to, or in place of, the thermal treatment of the donor structure 10
prior to bonding, which is described above. In an embodiment
wherein the donor structure 10 is not thermally annealed prior to
bonding, the low temperature thermal anneal of the bonded structure
30 facilitates both the strengthening of the bond interface as well
as the formation of the cleave plane that is located along the
damage layer 24.
[0043] Referring now to FIG. 3, after the bond interface 32 has
been formed, the resulting bonded structure 30 is subjected to
conditions sufficient to induce a fracture along the damage layer
24 within the handle layer 20. Generally speaking, this fracture
may be achieved using techniques known in the art, such as by a
mechanical or thermal cleave. Typically, however, fracturing is
achieved by annealing the bonded structure at an elevated
temperature for a period of time to induce fracture. For example,
the annealing temperature may be at least about 200.degree. C., at
least about 250.degree. C. or higher. In some embodiments, the
anneal may even be carried out at temperatures of at least about
350.degree. C., 450.degree. C., 550.degree. C., 650.degree. C., or
even 750.degree. C., typically at temperatures of from about
200.degree. C. to about 750.degree. C., and more typically from
about 200.degree. C. to about 400.degree. C. It should be noted,
however, that because of the differing coefficients of thermal
expansion of the various material involve (e.g. silicon and
sapphire), it is often preferable to carry out the aforementioned
anneal at lower temperatures due to the thermal mismatch between
the donor material and the handle. As such the anneal may be
preferably carried out using an annealing temperature of from about
200.degree. C. to about 300.degree. C. The anneal is performed over
a time period of at least about 5 minutes, 30 minutes, 60 minutes,
or even 300 minutes. Higher annealing temperatures will require
shorter anneal times, and vice versa. The annealing step can be
conducted in an ambient or inert atmosphere, e.g., argon or
nitrogen.
[0044] In one preferred embodiment, the separation (i.e.,
fracturing the structure along the damage layer 24 within the
handle layer 20) includes the application of mechanical force,
either alone or in addition to the annealing process. The actual
means of applying such a mechanical force is not critical to this
invention; i.e., any known method of applying a mechanical force to
induce separation in a semiconductor structure may be employed, so
long as substantial damage to the device layer is avoided.
[0045] Referring again to FIG. 3, two structures (34 and 36) are
formed upon separation. If the separation of the bonded structure
30 occurs along the damage layer 24 in the handle layer 20, and the
cleave plane does not coincide with the bond interface 32, but
rather is present in the handle layer 20, a portion of the handle
layer is part of both structures (i.e., a portion of the handle
layer is transferred along with the intervening layer 22 and device
layer 14). In the exemplary embodiment, structure 34 comprises some
portion 38 of the handle layer 20. Structure 36 comprises the
second structure 26, the device layer 14, the intervening layer 22,
and a residual portion 40 of the handle layer 20 on the surface
thereof In an alternative embodiment, wherein the ions are
implanted to a depth so as to form the damage layer completely
within the intervening layer, structure 34 comprises the entire
handle layer and optionally a portion of the intervening layer and
structure 36 comprises the second structure 26, the device layer
14, and all or a portion of the intervening layer 22.
[0046] When present, the residual portion 40 of the handle layer 20
has a thickness (T) that is approximately equivalent to the depth
at which ions were implanted into the handle layer 20. Accordingly,
this thickness (T) is typically greater than about 10 nm. For
example, in some instances the residual layer may optionally be at
least bout 20 nm, 50 nm, 75 nm, 100 nm, 200 nm thick or more.
Preferably, the thickness (T) is sufficient to avoid damage to the
device layer 14 upon separation; for example, in one preferred
embodiment, the residual portion is between about 20 nm to about
200 nm thick.
2. Finishing the Multi-layered Crystalline Structure after Layer
Transfer
[0047] A. Removal of Residual Handle Layer
[0048] In accordance with this invention and referring to FIGS. 3
and 4, after the device layer 14, at least a portion of the
intervening layer 22, and optionally a residual portion 40 of
handle layer 20 have been transferred to the second structure 26 to
form bonded structure 30, bonded structure 30 is subjected to
additional processing to produce a multi-layered crystalline
structure having desirable features for device fabrication thereon.
For example, if a residual portion 40 of handle layer 20 is
present, bonded structure 30 may be subjected to one or more
processing steps in order to remove this residual portion as well
as intervening layer 22. Although essentially any technique known
in the art may be used, the residual portion 40 and intervening
layer 22 are preferably removed via etching. The etching
composition may be selected according to various factors, including
the composition of the residual portion 40 of the handle layer 20,
the composition of the intervening layer 22, and the selectivity of
the etchant. In one embodiment, the entire residual portion 40 of
the handle layer 20 and substantially the entire intervening layer
22 are removed via a wet etching process using an etchant
comprising NH.sub.4OH, H.sub.2O.sub.2 and H.sub.2O. This etchant is
generally know to those skilled in the art and is commonly referred
to as an "SCl" solution. Such an etching process is typically
carried out at a temperature of from about 50.degree. C. to about
80.degree. C., with the time period of such an etch depending on
the thickness of the layer to be removed, the exact composition of
the SCl composition, and the temperature under which the etch is
performed. In another embodiment, a KOH solution may be used to
remove the handle layer, and an HF solution may be used to remove
the intervening layer. Advantageously, the HF solution will remove
the intervening layer without roughening the device layer surface.
In yet another embodiment, an SCl solution is used to remove the
handle layer and an HF solution is used to remove the intervening
layer.
[0049] As shown in FIG. 4, the final multi-layered crystalline
structure 42 comprises the second structure 26 and the device layer
14. In one preferred embodiment, the final multi-layered
crystalline structure 42 comprises a sapphire layer with a silicon
layer bonded thereto.
3. Multi-layered Crystalline Structure
[0050] The multi-layered crystalline structure prepared in
accordance with the present invention may have a substantially
uniform thickness ranging from about 300 .mu.m to about 800 .mu.m
thick. Preferably, in these or other embodiments, the device layer
has a thickness of from about 20 nm to about 200 nm and the second
structure has a thickness of from about 300 .mu.m to about 800
.mu.m.
[0051] Multi-layered crystalline structures manufactured according
to this invention may be used in various technologies. For example,
the multi-layered crystalline structure of this invention is
suitable for use in the manufacture of a multi-layered
microelectric device comprising a microelectric device and the
multi-layered crystalline structure of the instant invention.
Suitable microelectric devices include, but are not limited to
transistors and antenna structures.
* * * * *