Witte; Dale A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Witte; Dale A..The latest application filed is for "methods for producing diamond grits for a wafer slicing system".

Company Profile

0.11.14

Witte; Dale A. - Wentzville MO
Witte; Dale A. - O'Fallon MO
Witte; Dale A. - O'Fallong MO US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods For Producing Diamond Grits For A Wafer Slicing System App 20180117690 - Rezvanian; Omid ; et al.	2018-05-03
Systems and methods for manufacturing diamond coated wires Grant 9,873,159 - Rezvanian , et al. January 23, 2	2018-01-23
Methods for producing rectangular seeds for ingot growth Grant 9,499,920 - Chen , et al. November 22, 2	2016-11-22
Systems And Methods For Manufacturing Diamond Coated Wires App 20160184909 - Rezvanian; Omid ; et al.	2016-06-30
Methods For Producing Rectangular Seeds For Ingot Growth App 20150308011 - Chen; Jihong John ; et al.	2015-10-29
Methods for producing rectangular seeds for ingot growth Grant 9,111,745 - Chen , et al. August 18, 2	2015-08-18
Systems and methods for producing seed bricks Grant 8,900,972 - Witte , et al. December 2, 2	2014-12-02
Methods for in-situ passivation of silicon-on-insulator wafers Grant 8,859,393 - Ries , et al. October 14, 2	2014-10-14
Systems and methods for cleaving a bonded wafer pair Grant 8,845,859 - Ries , et al. September 30, 2	2014-09-30
Methods For Producing Rectangular Seeds For Ingot Growth App 20140182776 - Chen; Jihong John ; et al.	2014-07-03
Apparatus For Producing Rectangular Seeds App 20140186486 - Chen; Jihong John ; et al.	2014-07-03
Systems and Methods for Producing Seed Bricks App 20140137395 - Witte; Dale A. ; et al.	2014-05-22
Method of Preparing A Directional Solidification System Furnace App 20140137794 - Witte; Dale A. ; et al.	2014-05-22
Method For The Preparation Of A Multi-layered Crystalline Structure App 20130137241 - Witte; Dale A. ; et al.	2013-05-30
Systems and Methods for Cleaving A Bonded Wafer Pair App 20130062020 - Ries; Michael John ; et al.	2013-03-14
Method for the preparation of a multi-layered crystalline structure Grant 8,367,519 - Witte , et al. February 5, 2	2013-02-05
Methods For In-Situ Passivation Of Silicon-On-Insulator Wafers App 20120003814 - Ries; Michael J. ; et al.	2012-01-05
Method For The Preparation Of A Multi-layered Crystalline Structure App 20110159665 - Witte; Dale A. ; et al.	2011-06-30
Method and apparatus for slicing semiconductor wafers App 20030170948 - Bhagavat, Milind S. ; et al.	2003-09-11
Method of slicing silicon wafers for laser marking Grant 6,112,738 - Witte , et al. September 5, 2	2000-09-05

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