U.S. patent application number 13/600235 was filed with the patent office on 2012-12-27 for magnetic head manufacturing method.
This patent application is currently assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION. Invention is credited to Tsuneo NAKAGOMI, Teruaki TOKUTOMI.
Application Number | 20120324720 13/600235 |
Document ID | / |
Family ID | 41081569 |
Filed Date | 2012-12-27 |
United States Patent
Application |
20120324720 |
Kind Code |
A1 |
NAKAGOMI; Tsuneo ; et
al. |
December 27, 2012 |
MAGNETIC HEAD MANUFACTURING METHOD
Abstract
A magnetic head manufacturing method is provided. The method
includes a wafer process, a rowbar process for slicing a bar-shaped
rowbar from a wafer passing through the wafer process, and
performing lapping, air bearing surface (ABS) formation, cleaning,
and carbon protective film deposition processes on the rowbar, a
write pole test process for measuring an effective track width of
the magnetic heads in the bar-shaped rowbar by using a magnetic
force microscope (MFM), a scanning Hall probe microscope (SHPM), or
a scanning magneto resistance effect microscope (SMRM), a read
element test process for measuring electromagnetic conversion
characteristics of each of read elements within the bar-shaped
rowbar, a slider process for dividing up each of the magnetic heads
and machining the bar-shaped rowbar into individual chip shape
sliders, and a head gimbal assembly (HGA) process.
Inventors: |
NAKAGOMI; Tsuneo; (Kanagawa,
JP) ; TOKUTOMI; Teruaki; (Kanagawa, JP) |
Assignee: |
HITACHI HIGH-TECHNOLOGIES
CORPORATION
Tokyo
JP
|
Family ID: |
41081569 |
Appl. No.: |
13/600235 |
Filed: |
August 31, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12394041 |
Feb 27, 2009 |
8278917 |
|
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13600235 |
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Current U.S.
Class: |
29/603.07 |
Current CPC
Class: |
G11B 5/455 20130101;
Y10T 29/49032 20150115; G11B 5/3173 20130101 |
Class at
Publication: |
29/603.07 |
International
Class: |
G11B 5/127 20060101
G11B005/127 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 28, 2008 |
JP |
2008-048349 |
Oct 10, 2008 |
JP |
2008-263746 |
Claims
1. A magnetic head manufacturing method, adapted to manufacture a
magnetic head by following processes, comprising: a wafer process,
for performing film deposition, etching, and cleaning processes; a
rowbar process, for slicing a bar-shaped rowbar from a wafer
passing through the wafer process, and performing lapping, air
bearing surface (ABS) formation, cleaning, and carbon protective
film deposition processes on the rowbar; a write pole test process,
for measuring an effective track width of the magnetic heads in the
bar-shaped rowbar by using a magnetic force microscope (MFM), a
scanning Hall probe microscope (SHPM), or a scanning magneto
resistance effect microscope (SMRM); a read element test process,
for measuring electromagnetic conversion characteristics of each of
read elements within the bar-shaped rowbar; a slider process, for
dividing up each of the magnetic heads and machining the bar-shaped
rowbar into individual chip shape sliders, and performing a
cleaning and an inspection process; and a head gimbal assembly
(HGA) process, for connecting the magnetic head already machined
into the chip shape to a suspension, and performing a cleaning and
an inspection process.
2. A magnetic head manufacturing method, adapted to manufacture a
magnetic head by following processes, comprising: a wafer process,
for performing film deposition, eaching, and cleaning processes; a
rowbar process, for slicing a bar-shaped rowbar from a wafer
passing through the wafer process, and performing lapping, air
bearing surface (ABS) formation, cleaning, and carbon protective
film deposition processes on the rowbar; a write pole test process,
for enabling a magnetic probe of a cantilever means of a magnetic
force microscope (MFM) to perform a scanning motion along a surface
of a write pole portion of the magnetic head while being maintained
at a position with a distance from a recording portion of the
magnetic head equivalent to a flying height of the magnetic head
relative to a magnetic disk, and detect a signal representing an
oscillation state of the cantilever means, and measure an effective
track width of the magnetic head according to the signal in a state
that the write pole portion of the magnetic head in the bar-shaped
rowbar is provided with an excitation signal; a read element test
process, for measuring electromagnetic conversion characteristics
of a read element within the bar-shaped rowbar; a slider process,
for dividing up each of the magnetic heads and machining the
bar-shaped rowbar into individual chip shape sliders, and
performing a cleaning and an inspection process; and a head gimbal
assembly (HGA) process, for connecting the magnetic head already
machined into the chip shape to a suspension, and performing a
cleaning and an inspection process.
3. A magnetic head manufacturing method, adapted to manufacture a
magnetic head by following processes, comprising: a wafer process,
for performing film deposition, etching, and cleaning processes; a
rowbar process, for slicing a bar-shaped rowbar from a wafer
passing through the wafer process, and performing lapping, air
bearing surface (ABS) formation, cleaning, and carbon protective
film deposition processes on the rowbar; a write pole test process,
for enabling a Hall element or a magneto resistance (MR) element
mounted on a cantilever means of an atomic force microscope (AFM)
to perform a scanning motion along a surface of a write pole
portion of the magnetic head while being maintained at a position
with a distance from a recording portion of the magnetic head
equivalent to a flying height of the magnetic head relative to a
magnetic disk, and detect a signal from the Hall element or the MR
element, and measure an effective track width of the magnetic head
according to the signal in a state that the write pole portion of
the magnetic head in the bar-shaped rowbar is provided with an
excitation signal; a read element test process, for measuring
electromagnetic conversion characteristics of a read element within
the bar-shaped rowbar; a slider process, for dividing up each of
the magnetic heads and machining the bar-shaped rowbar into
individual chip shape sliders, and performing a cleaning and an
inspection process; and a head gimbal assembly (HGA) process, for
joining the magnetic head already machined into the chip shape to a
suspension, and performing a cleaning and an inspection process.
Description
CROSS REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional application of and claims
the priority benefit of U.S. application Ser. No. 12/394,041, filed
Feb. 27, 2009, now allowed, which claims the priority benefit of
Japanese applications Ser. No. 2008-048349, filed on Feb. 28, 2008
and Ser. No. 2008-263746, filed on Oct. 10, 2008. The entirety of
each of the above-mentioned patent applications is hereby
incorporated by reference herein and made a part of this
specification.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] The present invention generally relates to a magnetic head
manufacturing method.
[0004] 2. Description of Related Art
[0005] In recent years, with the rapid increase of surface
recording density of the hard disk drive (HDD), the write track
width of a thin film magnetic head becomes miniaturized, and thus
the importance of the technology of accurately inspecting a write
track width written onto a magnetic disk by using a write pole
(element) included in the thin film magnetic head continues to
increase.
[0006] In the past, an optical microscope was employed to measure
the shape of the write pole (element) included in the thin film
magnetic head. However, with the miniaturization of the track
width, the write track width reaches an optical system resolution
limit or is narrower than the optical system resolution. Thus, it
is difficult to use the optical microscope to measure the shape of
the write pole (element). As a result, a scanning electron
microscope (SEM) has been recently adopted to replace the optical
microscope for measuring the shape of the write pole (element).
However, the measurement performed by using the SEM is a kind of
destructive inspection. Moreover, similar to the optical
microscope, the SEM only measures the physical shape of the write
pole (element), which results in the following problem. That is, it
is difficult to measure the correlation with the effective magnetic
track width (write track width) actually written onto the magnetic
disk. In addition, even if the technology of using an atomic force
microscope (AFM) to measure the shape of the write pole (element)
is adopted, the same problem as described above may also exist.
Recently, Japanese Patent Laid-Open Publication No. 2003-248911 has
disclosed a magnetic head measuring device. The magnetic head
measuring device is formed in a manner that the magnetic field
characteristics, i.e., the magnetic field saturation phenomenon, of
a write pole may be observed visually by using a magnetic force
microscope (MFM).
[0007] When the shape of the magnetic head (write pole) is measured
by using the SEM or AFM as in the past, though the physical shape
of the write pole (element) can be measured, the effective magnetic
track width (write track width) actually written onto the magnetic
disk cannot be measured. Therefore, in the past, a head disk
dedicated measuring device called a spin stand is employed to
inspect the write track width in a state after the magnetic head is
integrated with a suspension (i.e., a head-gimbal assembly (HGA)
state) or in a simulated HGA state.
[0008] However, if the inspection with the spin stand is not
performed in a final process of magnetic head manufacturing in an
HGA state or a simulated HGA state, the inspection of the write
track width cannot be implemented. Thus, the inspection with the
spin stand is not ideal for improving the productivity or dealing
with the requirement for an early feedback in the manufacturing
process.
SUMMARY OF THE INVENTION
[0009] Accordingly, the present invention is directed to a magnetic
head manufacturing method, which is characterized in that, a
magnetic head is manufactured by using the magnetic head inspection
method disclosed in the first, second, or third feature or the
magnetic head inspection device disclosed in the first or second
feature. The magnetic head is manufactured by using either the
magnetic head inspection method or the magnetic head inspection
device.
[0010] The present invention has the effect of inspecting the write
track width of the magnetic head in a phase as early as possible
during the manufacturing process.
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0012] FIG. 1 is a schematic of a magnetic head inspection device
in one aspect of the present invention.
[0013] FIGS. 2(A) and 2(B) are schematic views illustrating an
inspection of the magnetic head inspection device in FIG. 1,
wherein FIG. 2(A) is a schematic view of a constitution of a
magnetic head portion, and FIG. 2(B) is a view illustrating an
example of a displacement signal of a cantilever portion.
[0014] FIG. 3 is a chart illustrating an example of a magnetic head
manufacturing process including an inspection process of a write
pole using an MFM of the present invention.
[0015] FIG. 4 is a schematic of a magnetic head inspection device
in another aspect of the present invention.
[0016] FIG. 5 is a schematic illustrating the inspection method of
the magnetic head inspection device in FIG. 4 and is a schematic
view illustrating an enlarged construction of a magnetic head
portion.
DESCRIPTION OF THE EMBODIMENTS
[0017] Reference will now be made in detail to the present
embodiments of the invention, examples of which are illustrated in
the accompanying drawings. Wherever possible, the same reference
numbers are used in the drawings and the description to refer to
the same or like parts.
[0018] FIG. 1 is a schematic illustrating the composition of a
magnetic head inspection device in one aspect of the present
invention. In the magnetic head inspection device in FIG. 1, the
effective track width of an MR magnetic head, a giant magneto
resistive (GMR) magnetic head, a tunnelling magneto resistive (TMR)
magnetic head, and the like (referred to as an MR magnetic head
below) can be measured in a rowbar state (a block formed by an
arrangement of head sliders in block form) prior to the dicing
process where the rowbar is separated into individual sliders (or
chips).
[0019] Generally, the rowbar is a long and thin block of around 3
cm to 5 cm sliced from a wafer. One rowbar is composed of around 40
to 60 head sliders. In this embodiment of the magnetic head
inspection device, the prescribed inspection is performed on the
rowbar 1 as a work piece. Generally, the rowbars are provided in a
tray with around 20 to 30 rowbars 1 are arranged side by side at a
fixed spacing in the direction of the minor axis. A handling robot
(not shown) extracts the rowbars 1 one by one from the tray (not
shown) and transports the rowbars onto an inspection stage 10. The
rowbar 1 that has been transported and placed on the inspection
stage 10 is inspected in the following manner.
[0020] The inspection stage 10 is formed by an X stage 11 and a Y
stage 12 capable of enabling the rowbar 1 to move in X and Y
directions. The rowbar 1 is positioned by making preliminary
contact of a single side surface in the direction of the major axis
therefore and the reference surface of the Y stage 12. A carrier
portion 121 for scanning the rowbar 1 is located on top of the Y
stage 12. A stepped portion approximately coinciding with the
rowbar 1 in shape is located at one side on the upper edge of the
carrier portion 121. The rowbar 1 is placed in position by pressing
against each of the bottom surface and side surface of the stepped
portion. The rear surface (opposite to that having connecting
terminals for the magnetic head) of the rowbar 1 is pressed against
the back surface of the stepped portion. The stepped portion has
reference surfaces that are each parallel to or orthogonal to the
moving direction of the X stage 11 (X axis) and the moving
direction of the Z stage 13 (Z axis). Therefore, the rowbar 1 may
be accurately positioned in the X and Z directions by placing the
rowbar 1 against the bottom surface and the side surface of the
stepped portion of the carrier portion 121.
[0021] Although not shown, a camera for measuring position offset
is located above the Y stage 12. The Z stage 13 moves the
cantilever portion 7 of the MFM in the Z direction. The X stage 11,
the Y stage 12, and the Z stage 13 of the inspection stage 10 are
each composed of piezo stages. When the positioning is finished,
suction holds the rowbar 1 on the carrier portion 121, and the
front of a probe card (not shown) contacts the terminals at the
front surface of the rowbar 1. Thereby, the write pole of a
magnetic head in the rowbar 1 can be energized through its
recording head coil.
[0022] A piezo driver 20 performs drive control of the X stage 11,
the Y stage 12, and the Z stage 13 (the piezo stages) of the
inspection stage 10. The control portion 30 comprising of a control
computer that takes the form of a personal computer (PC) including
a monitor as its basic configuration. As shown in the figure, the
cantilever portion 7 having a sharp magnetic probe at its free end
is located at a position above and pointing towards the rowbar 1
carried on the Y stage 12 of the inspection stage 10. The
cantilever portion 7 is installed on an oscillator mounted below
the Z stage 13. The oscillator comprising of a piezo element with
an alternating current (AC) voltage applied at a frequency close to
its mechanical resonance frequency via the piezo driver 20, that
causes it to vibrate the magnetic probe up and down.
[0023] A displacement detection portion comprising of a
semiconductor laser element 41, reflecting mirrors 42 and 43, and a
displacement sensor 44. The displacement sensor 44 comprising of a
dual-photo detector element. Light emitted from the semiconductor
laser element 41 impinges onto the cantilever portion 7 after being
deflected there by the reflecting mirror 42. Light reflected by the
cantilever portion 7 is directed into the displacement sensor 44 by
the reflecting mirror 43. A differential amplifier 50 implements a
specific operation on the differential signal of the two signals
output from the displacement sensor 44, and outputs its signal to a
direct current (DC) converter 60. That is, the differential
amplifier 50 outputs a displacement signal corresponding to a
difference between the two signals output from the displacement
sensor 44 to the DC converter 60. The DC converter 60 comprising of
a root mean squared value to direct current (RMS-DC) converter that
converts the displacement signal output from the differential
amplifier 50 into an effective DC signal value.
[0024] The displacement signal output from the differential
amplifier 50 is a signal corresponding to a displacement of the
cantilever portion 7. Due to the oscillation of the cantilever
portion 7, the displacement signal becomes an AC signal. The signal
output from the DC converter 60 is output to a feedback controller
70. The feedback controller 70 outputs the signal output from the
DC converter 60 as a signal for monitoring the amplitude of
oscillation of the cantilever portion 7 to the control portion 30,
and outputs the signal output from the DC converter 60 as a control
signal for the Z stage 13 for adjusting the amplitude of
oscillation of the cantilever portion 7 to the piezo driver 20. The
control portion 30 monitors the signal and controls the Z stage 13
of the piezo driver 20 according to a value of the signal, in order
that an initial position of the cantilever portion 7 can be
adjusted before the measurement starts. In this aspect, the
magnetic head flying height of an HDD is set as the initial
position of the cantilever portion 7. A signal generator 80
provides an oscillating signal for oscillation of the cantilever
portion 7 via the piezo driver 20. The piezo driver 20 vibrates the
cantilever portion 7 at the frequency of the oscillating signal
from the signal generator 80.
[0025] FIG. 2(A) and 2(B) are schematic views illustrating an
inspection manner of the magnetic head inspection device in FIG. 1,
wherein FIG. 2(A) is a view illustrating an enlarged construction
of a magnetic head portion, and FIG. 2(B) is a view illustrating an
example of a displacement signal of the cantilever portion. As
shown in FIGS. 1 and 2(A), the cantilever portion 7 is positioned
by the Z stage 13, such that the front end portion of the magnetic
probe of the cantilever portion 7 is at a height from the surface
of a magnetic head in the rowbar 1 equivalent to the magnetic head
flying height Hf. The cantilever portion 7 performs a scanning
motion in the scanning direction 71 relative to the rowbar 1
(magnetic head). In this aspect, the rowbar 1 moves via the X stage
11 and the Y stage 12.
[0026] At this point, the write pole of the magnetic head is
undergoing an AC excitation, and thus the cantilever portion 7 is
displaced synchronously with the AC excitation. The displacement of
the cantilever portion 7 is shown by the displacement signal in
FIG. 2(B), and thus an effective track width of the magnetic head
can be detected from the displacement signal. Furthermore, the
actual pole width of the magnetic head may be measured by
performing a normal inspection with the MFM instead of with the AC
excitation on the write pole.
[0027] In this way, for a conventional MFM, although the actual
pole width of the magnetic head can be detected, the effective
track width of the write pole of the magnetic head can also be
inspected through the AC excitation performed on the write pole of
the magnetic head while at the same time through the scanning
motion performed by the cantilever portion 7 at a flying height of
the magnetic head, thereby achieving inspection of the write track
width of the magnetic head in the earliest possible phase of the
manufacturing process, as shown in this implementation aspect.
[0028] FIG. 3 is a flow chart illustrating an example of a magnetic
head manufacturing process including an inspection process of the
write pole using an MFM of the present invention. Referring to the
figure, in the wafer process, film deposition, etching, cleaning,
and other semiconductor like processes are performed. In the rowbar
process, a bar-shaped rowbar is sliced from a wafer, and lapping,
air bearing surface (ABS) formation, cleaning, carbon protective
film deposition, and other processes are performed on the rowbar.
In the write pole test process, the effective track width of the
write pole is measured for the bar-shaped rowbar using the MFM in
FIG. 1. In the read element test process, similarly,
electromagnetic conversion characteristics of each read element are
measured within the bar-shaped rowbar. In the slider process, the
bar-shaped rowbar is divided up (diced) and each slider is machined
into a chip shape, a cleaning and an inspection process are
performed. In the HGA process, a magnetic head slider already
machined into the chip shape is connected to a suspension, and a
cleaning process and an inspection process are performed.
Afterwards, the HDD processes (head stack assembly (HSA) process
and head disk assembly (HDA) process) (not shown) are performed.
According to this embodiment, a good-or-bad determination may be
performed on the effective track width of the write pole in the
rowbar shape, thereby improving the productivity and enabling early
feedback on previous processes.
[0029] FIG. 4 is a schematic view illustrating the construction of
another embodiment of a magnetic head inspection device in an
implementation aspect of the present invention. In FIG. 4, like
symbols are used to indicate parts having the same constitution as
those in FIG. 1, and thus descriptions thereof are omitted. FIG. 5
is a schematic view illustrating an inspection manner of the
magnetic head inspection device in FIG. 4 and is a schematic view
illustrating an enlarged construction of a magnetic head portion.
The difference between the magnetic head inspection device in FIGS.
4 and 5 and that in FIGS. 1 and 2 lies in that, a Hall element 90
is mounted on the cantilever portion 7, and the shape of the
magnetic field (an absolute value of the magnetic field) generated
by the magnetic head is directly measured, so that an effective
magnetic track width can be measured. That is, the magnetic head
inspection device in FIG. 4 is characterized in an SHPM (Scanning
Hall Probe Microscope) that makes the Hall element 90 infinitely
close to the magnetic material to be observed so as to detect and
visualize the magnetic field. The Hall element 90 is formed by
patterning a GaAs/AlGaAs epitaxial wafer through photolithography.
A Hall element controller 91 provides a current to terminals of the
Hall element 90. The Hall element controller 91 adopts a nanovolt
meter or other meters to measure the Hall voltage generated between
the other terminals of the Hall element 90, and outputs the
measured Hall voltage to the control portion 30. A PC of the
control portion 30 makes a two-dimensional distribution of surface
magnetic field emission according to the Hall voltage, and measures
the effective track width of the magnetic head according to the
two-dimensional distribution.
[0030] Instead of the Hall element 90 being installed on the
cantilever portion 7 of the magnetic head inspection device in
FIGS. 4 and 5, an MR sensor element may also be installed at the
front end portion of the cantilever portion 7, so as to apply an
SMRM (Scanning Magneto-Resistance Microscope) in the aforementioned
magnetism measurement. At this point, an MR sensor controller may
be used to replace the Hall element controller to cope with the
above situation. In this manner, the Hall element or MR element can
be installed on the cantilever portion 7 of the MFM, so that SHPM
or SMRM is capable of implementing the shape measurement and
magnetism measurement (measurement of the effective track width) of
the write pole at the same time.
[0031] It will be apparent to those skilled in the art that various
modifications and variations can be made to the structure of the
present invention without departing from the scope or spirit of the
invention. In view of the foregoing, it is intended that the
present invention cover modifications and variations of this
invention provided they fall within the scope of the following
claims and their equivalents.
* * * * *