Heat Dissipation Device With Heat Pipe

Abstract

An exemplary heat dissipation device includes a base and fasteners. The base includes a bottom plate, a top plate, a heat pipe, and a frame. The heat pipe is sandwiched between peripheries of the bottom plate and the top plate. The frame is sandwiched between the bottom plate and the top plate. The frame surrounds the heat pipe. The fasteners extend through the top plate, the frame and the bottom plate for fixing the heat dissipation device to a heat-generating component.

Description

BACKGROUND 1. Technical Field

[0001] The disclosure relates to heat dissipation devices in electronics, and more particularly to a heat dissipation device with a heat pipe.

[0002] 2. Description of Related Art

[0003] During operation of an electronic device such as a computer central processing unit (CPU), a large amount of heat is often produced. The heat must be quickly removed from the CPU to prevent it from becoming unstable or being damaged. Typically, a heat dissipation device is attached to an outer surface of the CPU to absorb the heat from the CPU.

[0004] Conventionally, a heat dissipation device includes a solid metal base attached to the CPU, and a plurality of fins arranged on the base. The base is intimately attached to the CPU, thereby absorbing the heat generated by the CPU. Most of the heat accumulated on the base is transferred firstly to the fins and then dissipates away from the fins. Thus the heat dissipation device achieves cooling of the CPU. However, as electronics technology continues to advance, increasing amounts of heat are being generated by powerful state-of-the-art CPUs. As a result, many conventional heat dissipation devices are no longer able to effectively remove heat from these CPUs.

[0005] What is needed, therefore, is a heat dissipation device which can overcome the limitations described.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

[0007] FIG. 1 is an assembled, isometric view of a heat dissipation device in accordance with a first embodiment of the disclosure.

[0008] FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.

[0009] FIG. 3 is an exploded view of a base of the heat dissipation device of FIG. 2.

[0010] FIG. 4 is a partially assembled view of the base of FIG. 3.

[0011] FIG. 5 is a cross-sectional view of a base of the heat dissipation device of FIG. 2, taken along a line V-V thereof.

[0012] FIG. 6 is similar to FIG. 5, but showing a cross-sectional view of a base of a heat dissipation device in accordance with a second embodiment of the disclosure.

DETAILED DESCRIPTION

[0013] Referring to FIGS. 1-2, a heat dissipation device 100 in accordance with a first embodiment of the disclosure is shown. The heat dissipation device 100 is used to thermally contact an electronic component (not shown) mounted on a printed circuit board (not shown) to dissipate heat generated by the electronic component. The heat dissipation device 100 includes a base 10, a fin assembly 30 mounted on the base 10, and four fasteners 50 extending through four corners of the base 10.

[0014] Referring also to FIGS. 3-5, the base 10 is substantially rectangular. The base 10 includes a bottom plate 11, a top plate 12, a frame 13 sandwiched between the bottom plate 11 and the top plate 12, and a heat pipe 14 enclosed by the frame 13, the bottom plate 11 and the top plate 12. In particular, the bottom plate 11, the top plate 12, and the frame 13 together enclose a chamber (not labeled) to receive the heat pipe 14 therein. The bottom plate 11 and the top plate 12 each are integrally made of metal having good thermal conductivity. That is, each of the bottom plate 11 and the top plate 12 is a monolithic, one-piece body of metal. In this embodiment, the bottom plate 11 and the top plate 12 each are integrally made of copper. The bottom plate 11 defines four through holes 110 at four corners thereof. The top plate 12 defines four through holes 120 at four corners thereof, corresponding to the through holes 110 of the bottom plate 11.

[0015] When viewed side-on, the frame 13 has a rectangular profile corresponding to that of the bottom plate 11 and the top plate 12. The frame 13 defines an opening (not labeled) in a center thereof. The frame 13 is made of aluminum; and in this embodiment, the frame 13 is a monolithic, one-piece body of aluminum. The frame 13 includes four supporting portions 131 formed at four sides thereof, respectively. In the illustrated embodiment, the supporting portions 131 are in the form of beams. The supporting portions 131 surround the heat pipe 14. In this embodiment, each of the supporting portions 131 has a transverse width less than that of the heat pipe 14. Each of the supporting portions 131 is sandwiched between corresponding edge portions of the bottom plate 11 and top plate 12. The frame 13 also includes four connecting portions 133 respectively formed at four corners thereof. Each of the connecting portions 133 defines a through hole 130 therein, corresponding to the through holes 110, 120 of the bottom and top plates 11, 12. Bottom surfaces of the supporting portions 131 and the connecting portions 133 are all coplanar to tightly contact a top surface of the bottom plate 11. Similarly, top surfaces of the supporting portions 131 and the connecting portions 133 are all coplanar to tightly contact a bottom surface of the top plate 12.

[0016] The heat pipe 14 is a vacuum casing containing a working fluid 16 therein. In this embodiment, the heat pipe 14 is generally S-shaped. The heat pipe 14 includes a middle evaporation section 141, two condensation sections 143 arranged at opposite sides of the evaporation section 141 and parallel to the evaporation section 141, and two connecting sections 142 interconnecting the evaporation section 141 and the condensation sections 143, respectively. The heat pipe 14 is flattened, to have a flat bottom wall that contacts the bottom plate 11 and a flat top wall that contacts the top plate 12.

[0017] In assembly, the bottom plate 11, the top plate 12, the frame 13 and the heat pipe 14 are soldered together to form the base 10. The heat pipe 14 is enclosed by the bottom plate 11, top plate 12 and the frame 13. The fin assembly 30 is mounted on the top plate 12 of the base 10. The fasteners 50 are arranged on the base 10, and extend through the through holes 110, 120, 130 of the bottom plate 11, the top plate 12 and the frame 13. Since the frame 13 has high mechanical strength, the edge portions of the bottom plate 11 and the top plate 12 are supported and protected by the frame 13, and the base 10 likewise has good mechanical strength and performance In use of the heat dissipation device 100, the bottom plate 11 of the base 10 absorbs heat from the electronic component to which the bottom plate 11 of the base 10 is attached, and then quickly transfers the heat to the top plate 12 via the heat pipe 14 and the frame 13. The heat is absorbed by the fin assembly 30 and subsequently dissipated to ambient air.

[0018] Referring to FIG. 6, a heat dissipation device 200 in accordance with a second embodiment of the disclosure is shown. Differently from the heat dissipation device 100 of the first embodiment, the bottom plate 11, the top plate 12 and the frame 13 of the heat dissipation device 200 together form a hermetical chamber to contain working fluid 60 therein. The working fluid 60 resides between lateral outer walls of the heat pipe 14 and inner walls of the frame 13, to enhance the heat dissipation capability of the heat dissipation device 200.

[0019] It is to be understood, however, that even though numerous characteristics and advantages of certain embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation device comprising: a base comprising a bottom plate, a top plate, a heat pipe sandwiched between the bottom plate and the top plate, and a frame sandwiched between peripheries of the bottom plate and the top plate and surrounding the heat pipe; and a plurality of fasteners extending through the top plate, the frame and the bottom plate for fixing the heat dissipation device to a heat-generating component.

2. The heat dissipation device of claim 1, wherein the frame comprises a plurality of supporting portions, and each of the supporting portions is sandwiched between corresponding edge portions of the bottom plate and top plate.

3. The heat dissipation device of claim 2, wherein a plurality of connecting portions is formed at corners of the frame, the fasteners extending through the connecting portions of the frame.

4. The heat dissipation device of claim 2, wherein each of the supporting portions has a transversewidth less than that of the heat pipe.

5. The heat dissipation device of claim 1, wherein the heat pipe has a flat bottom wall in contact with the bottom plate and a flat top wall in contact with the top plate.

6. The heat dissipation device of claim 1, wherein the top plate and the bottom plate each are rectangular, and the frame has a rectangular profile corresponding to that of the bottom plate and the top plate.

7. The heat dissipation device of claim 6, wherein the frame has outer edges matching with edges of the bottom plate and top plate.

8. The heat dissipation device of claim 1, wherein each of the bottom plate and the top plate is a monolithic, one-piece body of copper, and the frame is a monolithic, one-piece body of aluminum.

9. The heat dissipation device of claim 1, further comprising a fin assembly mounted on the top plate of the base, the fasteners extending through corners of the base.

10. A base for absorbing heat from a heat-generating component, the base comprising: a bottom plate; a top plate; a heat pipe sandwiched between the bottom plate and the top plate; and a frame sandwiched between peripheries of the bottom plate and the top plate and surrounding the heat pipe, the frame comprising a plurality of connecting portions at corners thereof, and a plurality of through holes being defined through the top plate, the connecting portions of the frame and the bottom plate for fasteners to extend through and fix the base to the heat-generating component.

11. The base of claim 10, wherein each of the supporting portions has a width less than that of the heat pipe.

12. The base of claim 10, wherein the heat pipe has a flat bottom wall in contact with the bottom plate and a flat top wall in contact with the top plate.

13. The base of claim 10, wherein the frame has a rectangular profile corresponding to that of the bottom plate and the top plate.

14. The base of claim 13, wherein the top plate and the bottom plate each are rectangular, and the frame has outer edges matching for edges of the bottom plate and top plate.

15. The base of claim 10, wherein the bottom plate and the top plate each are integrally made of copper as one piece, and the frame is integrally made of aluminum.

16. The base of claim 10, wherein the bottom plate, the top plate and the frame together form a hermetical chamber to contain working fluid between outer wall of the heat pipe and inner wall of the frame.

17. A heat dissipation device comprising: a base comprising a bottom plate, a top plate, and a frame sandwiched between peripheries of the bottom plate and the top plate, the bottom plate, the top plate and the frame cooperatively defining a chamber therebetween; a generally serpentine heat pipe received in the chamber and sandwiched between the bottom and top plates, wherein a size of a rectangular area within the frame occupied by the entire heat pipe is at least one half of a corresponding area of the chamber within the frame; working fluid contained in the heat pipe; and a plurality of fasteners configured to be seated on the top plate with portions of the fasteners extendable through the top plate, the frame and the bottom plate for fixing the heat dissipation device to a heat-generating component.

18. The heat dissipation device of claim 17, wherein the chamber is hermetical and contains working fluid between an outer wall of the heat pipe and an inner wall of the frame.

19. The heat dissipation device of claim 17, wherein the frame comprises a plurality of beams, and each of the beams is sandwiched between corresponding edge portions of the bottom plate and top plate.

20. The heat dissipation device of claim 17, wherein a plurality of connecting portions is formed at corners of the frame, with the portions of the fasteners extendable through the connecting portions of the frame.