QIN; JI-YUN
Patent Applications and Registrations
Patent applications and USPTO patent grants for QIN; JI-YUN.The latest application filed is for "heat sink incorporating interlocked fin".
- QIN; JI-YUN - Foshan CN
- QIN; Ji-Yun - Shenzhen CN
- QIN; JI-YUN - Shenzhen City CN
- Qin; Ji-Yun - Guangdong CN
| Patent | Date |
|---|---|
| Heat Sink Incorporating Interlocked Fin App 20140318757 - YAN; QIANG ; et al. | 2014-10-30 |
| Heat Dissipation Device App 20130264042 - QIN; JI-YUN ; et al. | 2013-10-10 |
| Heat Dissipation Apparatus For Electronic Device App 20130258601 - QIN; Ji-Yun | 2013-10-03 |
| Heat Dissipation Device App 20130112387 - QIN; JI-YUN ; et al. | 2013-05-09 |
| Heat dissipation device Grant 8,381,801 - Zhou , et al. February 26, 2 | 2013-02-26 |
| Heat Dissipation Device App 20130020056 - PENG; XUE-WEN ; et al. | 2013-01-24 |
| Heat Dissipation Device With Heat Pipe App 20120273168 - PENG; XUE-WEN ; et al. | 2012-11-01 |
| Heat dissipation device Grant 8,267,157 - Qin , et al. September 18, 2 | 2012-09-18 |
| Heat dissipation device Grant 8,069,909 - Qin , et al. December 6, 2 | 2011-12-06 |
| Heat Dissipation Device App 20100258273 - QIN; JI-YUN ; et al. | 2010-10-14 |
| Heat dissipation assembly Grant 7,813,132 - Zhou , et al. October 12, 2 | 2010-10-12 |
| Heat Dissipation Device App 20100206522 - ZHOU; ZHI-YONG ; et al. | 2010-08-19 |
| Heat Dissipation Device App 20090321054 - Qin; Ji-Yun ; et al. | 2009-12-31 |
| Heat Dissipation Assembly App 20090268409 - ZHOU; ZHI-YONG ; et al. | 2009-10-29 |
| Heat dissipation device having a fan holder for attachment of a fan Grant 7,365,975 - Xia , et al. April 29, 2 | 2008-04-29 |
| Heat dissipation device Grant 7,349,212 - Xia , et al. March 25, 2 | 2008-03-25 |
| Heat Dissipation Device App 20080019094 - Xia; Wan-Lin ; et al. | 2008-01-24 |
| Heat Dissipation Device Having A Fan Holder For Attachment Of A Fan App 20070258210 - Xia; Wan-Lin ; et al. | 2007-11-08 |
| Heat dissipation device Grant 7,278,470 - Xia , et al. October 9, 2 | 2007-10-09 |
| Back Plate Assembly For Mounting A Heat Sink Assembly To A Motherboard App 20070121300 - Xia; Wan-Lin ; et al. | 2007-05-31 |
| Heat Dissipation Device App 20070114009 - Xia; Wan-Lin ; et al. | 2007-05-24 |
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