U.S. patent application number 13/535660 was filed with the patent office on 2012-10-25 for enhanced modularity in heterogeneous 3d stacks.
This patent application is currently assigned to International Business Machines Corporation. Invention is credited to Philip G. Emma, Eren Kursun, Jude A. Rivers.
Application Number | 20120268909 13/535660 |
Document ID | / |
Family ID | 44972380 |
Filed Date | 2012-10-25 |
United States Patent
Application |
20120268909 |
Kind Code |
A1 |
Emma; Philip G. ; et
al. |
October 25, 2012 |
Enhanced Modularity in Heterogeneous 3D Stacks
Abstract
A three-dimensional computer processing chip stack that includes
a host layer disposed on at least one other layer in the stack. The
host layer includes cavities formed thereon for receiving chips
pre-configured with heterogeneous properties relative to each
other. The cavities are formed to accommodate the heterogeneous
properties of the chips. The chips are joined to respective
surfaces of the cavities, thereby forming an element having a
smooth surface with respect to the host layer and the chips.
Inventors: |
Emma; Philip G.; (Danbury,
CT) ; Kursun; Eren; (Ossining, NY) ; Rivers;
Jude A.; (Cortlandt Manor, NY) |
Assignee: |
International Business Machines
Corporation
Armonk
NY
|
Family ID: |
44972380 |
Appl. No.: |
13/535660 |
Filed: |
June 28, 2012 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
12774223 |
May 20, 2010 |
|
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13535660 |
|
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Current U.S.
Class: |
361/783 |
Current CPC
Class: |
H01L 23/147 20130101;
H01L 2924/15311 20130101; H01L 23/5389 20130101; H01L 25/18
20130101; H01L 2924/0002 20130101; H01L 23/5382 20130101; H01L
21/4803 20130101; Y10T 29/4913 20150115; H01L 23/13 20130101; Y10T
29/49137 20150115; H01L 25/0652 20130101; H05K 3/30 20130101; H01L
2924/00 20130101; H01L 2225/06575 20130101; Y10T 29/49128 20150115;
H01L 2924/0002 20130101; Y10T 29/49146 20150115; H05K 3/465
20130101; H01L 2225/06589 20130101 |
Class at
Publication: |
361/783 |
International
Class: |
H05K 7/02 20060101
H05K007/02 |
Claims
1. A three-dimensional computer processing chip stack, comprising:
a host layer disposed on at least one other layer in the stack, the
host layer including cavities formed thereon for receiving chips
pre-configured with heterogeneous properties relative to each
other, the cavities formed to accommodate the heterogeneous
properties of the chips; wherein the chips are joined to respective
surfaces of the cavities thereby forming an element having a smooth
surface with respect to the host layer and the chips.
2. The three-dimensional computer processing chip stack of claim 1,
further comprising: programmable wiring configured on the element,
such that communication is enabled among the chips disposed on the
host layer.
3. The three-dimensional computer processing chip stack of claim 1,
wherein the heterogeneous properties include variation in aspect
ratios.
4. The three-dimensional computer processing chip stack of claim 1,
wherein the heterogeneous properties include variation in size.
5. The three-dimensional computer processing chip stack of claim 1,
wherein the heterogeneous properties include variation in
thickness.
6. The three-dimensional computer processing chip stack of claim 1,
wherein the heterogeneous properties include variation in supply
voltages.
7. The three-dimensional computer processing chip stack of claim 1,
wherein the heterogeneous properties include variation in clock
specifications.
8. The three-dimensional computer processing chip stack of claim 1,
wherein the heterogeneous properties include at least one of
variation in technology generations and disparate technologies.
9. The three-dimensional computer processing chip stack of claim 1,
wherein each of the chips is configured to include a dedicated
power supply and a dedicated clock grid.
10. The three-dimensional computer processing chip stack of claim
1, wherein the cavities are formed by etching the host layer.
11. The three-dimensional computer processing chip stack of claim
1, wherein the cavities on the host layer are etched to receive the
chips, the chips selected for inclusion on the host layer based
upon individual requirements of the stack, wherein the host layer,
upon receiving the chips, is integrated with the at least one other
layer to form the stack and collectively functions to satisfy the
individual requirements of the stack.
12. The three-dimensional computer processing chip stack of claim
1, wherein the host layer is formed of thermally conductive
material and the host layer dissipates heat created by the chips on
the host layer and components of the at least one other layer
through the thermally conductive material.
13. The three-dimensional computer processing chip stack of claim
1, wherein the host layer is configured with mesh structures, and
the host layer provides shielding of the three-dimensional computer
processing chip stack from alpha radiation via the mesh
structures.
14. The three-dimensional computer processing chip stack of claim
1, wherein the chips include at least one patch chip.
15. The three-dimensional computer processing chip stack of claim
1, wherein the chips are selected from a set of pre-manufactured
and pre-tested modular computer chips having pre-defined functions,
wherein the pre-defined functions include at least one of:
acceleration; encryption; and redundancy.
16. The three-dimensional computer processing chip stack of claim
1, wherein the host layer further includes alignment markings for
aligning the host layer with the at least one other layer, the host
layer aligned with the at least one other layer via a laser beam
directed through the host layer, wherein the host layer and the at
least one other layer are successfully aligned when the laser beam
passes through the host layer and alignment holes provided on the
at least one other layer.
17. The three-dimensional computer processing chip stack of claim
1, wherein each of the chips is configured to include a different
supply voltage and clock grid.
18. The three-dimensional computer processing chip stack of claim
1, wherein the host layer includes embedded metal structures
configured to dissipate heat created by the chips.
19. The three-dimensional computer processing chip stack of claim
1, wherein the host layer further includes: cavities on a second
planar side of the host layer, the second planar side of the host
layer horizontally opposed to the first planar side of the host
layer, the cavities on the second planar side of the host layer
formed for receiving chips pre-configured with heterogeneous
properties, the cavities on the second planar side of the host
layer formed to accommodate the heterogeneous properties of the
chips; wherein the first planar side represents a bottom portion of
the host layer, and the second planar side represents a top portion
of the host layer.
20. The three-dimensional computer processing chip stack of claim
1, wherein each of the chips, when disposed on the host layer,
lacks an electrical and functional connection with others of the
chips on the host layer.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a Divisional of U.S. patent application
Ser. No. 12/774,223, filed May 20, 2010, the disclosure of which is
incorporated by reference herein in its entirety.
BACKGROUND
[0002] This invention relates generally to processing within a
computing environment, and more particularly to enhancing
modularity in heterogeneous 3D stacks.
[0003] In computer chip manufacturing, three-dimensional (3D)
stacks use layers of components, such as processing chips and
memory that are combined in a way that decreases the distance that
data must travel between the components. The decreased distance
between components results in faster data rates and lower heat as a
result of less electrical resistance.
[0004] Modularity and heterogeneous integration are important
advantages of 3D technology, yet they are limited to same size
chips. In the case of heterogeneous chip sizes, efficient use of
silicon in chip layers containing accelerator chips or redundancy
layers is challenging since these layers tend to be smaller than
the main processor chip itself. Integrating chips which are smaller
than the main processor chip results in either the use of silicon
as a filler to extend the chips to the same dimensions as the main
processor, or results in air gaps in the layers which contain the
smaller chips. Using extra silicon is inefficient, and leaving air
space creates uneven heat dissipation resulting in hot spots on the
chips. However, integrating smaller and less complicated layers,
such as accelerators/redundancies, has clear yield and cost
advantages, because chip size and complexity are major determinants
of yield. The thermal interface material between the silicon layers
and the lid, or heat sync, may not have full coverage if the
smaller chips are placed between the heat sync and main processor.
In addition, aligning these smaller chips can present issues, as
the underlying main processor, which is typically much larger than
these smaller chips, does not easily lend itself to layer alignment
procedures with chips of varying sizes.
BRIEF SUMMARY
[0005] An embodiment includes a three-dimensional computer
processing chip stack. The three-dimensional computer processing
chip stack includes a host layer disposed on at least one other
layer in the stack. The host layer includes cavities formed thereon
for receiving chips pre-configured with heterogeneous properties
relative to each other. The cavities are formed to accommodate the
heterogeneous properties of the chips. The chips are joined to
respective surfaces of the cavities, thereby forming an element
having a smooth surface with respect to the host layer and the
chips.
[0006] Additional features and advantages are realized through the
techniques of the present invention. Other embodiments and aspects
of the invention are described in detail herein and are considered
a part of the claimed invention. For a better understanding of the
invention with advantages and features, refer to the description
and to the drawings.
BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS
[0007] Referring now to the drawings wherein like elements are
numbered alike in the several FIGURES:
[0008] FIG. 1A depicts a block diagram of a side view of a
three-dimensional computer processing chip stack in accordance with
an exemplary embodiment;
[0009] FIG. 1B depicts a block diagram of a top view of the
three-dimensional computer processing chip stack of FIG. 1A in
accordance with an exemplary embodiment;
[0010] FIG. 1C depicts a block diagram of a side view of a
three-dimensional computer processing chip stack in accordance with
an alternative exemplary embodiment;
[0011] FIGS. 2A-2B depict a flow diagram describing a process for
forming a three-dimensional computer processing chip stack in an
exemplary embodiment;
[0012] FIG. 3 depicts a block diagram illustrating sample client
requirements and a three-dimensional computer processing chip stack
plan developed from the client requirements in accordance with an
exemplary embodiment;
[0013] FIG. 4 depicts a block diagram of a system upon which
manufacturing and design plans of three-dimensional computer
processing chip stacks may be implemented in an exemplary
embodiment; and
[0014] FIG. 5 depicts a computer program product in an exemplary
embodiment.
DETAILED DESCRIPTION
[0015] An exemplary embodiment of the present invention provides
for enhanced three-dimensional (3D) computer processing chip
stacks. The exemplary 3D computer processing chip stacks provide
improved design modularity and accommodate heterogeneity of
integrated layers employed in the 3D computer processing chip
stacks.
[0016] Turning now to FIGS. 1A and 1B, a side view and a top view,
respectively, of an exemplary 3D computer processing chip stack
100A will now be described. The 3D computer processing chip stack
100A refers to a system of integrated circuit chips and includes a
plurality of layers (e.g., layers 110, 112, and 114). The layers
110, 112, and 114 may be formed of semiconductor material and
include various components or structures, such as logic, memory,
and core processors. The layers 110, 112, and 114 are integrated
(e.g., stacked) to form a portion of the 3D computer processing
chip stack 100A. For example, layer 112 may be disposed on layer
114, and layer 110 may be disposed on layer 112. While the three
layers 110, 112, and 114 are illustrated in FIG. 1 as forming part
of the 3D computer processing chip stack 100A, it will be
understood that additional (or fewer) layers may be employed in
order to realize the advantages of the exemplary embodiments.
[0017] In an exemplary embodiment, the 3D computer processing chip
stack 100A also includes a host layer 104A (also referred to herein
as "carrier layer") on which dedicated regions 106 are formed for
receiving a number of chips 108. These chips 108 (also referred to
herein as "chiplets") may be defined as subsystems of a
microprocessor core that are modularized such that multiple
variations of cores can be configured from selected groupings of
these chiplets to produce customized functions. As shown in FIG.
1B, for illustrative purposes the host layer 104A includes seven
chips 108. It will be understood, however, that additional (or
fewer) chips 108 may be employed in order to realize the advantages
of the exemplary embodiments.
[0018] In an exemplary embodiment, each of the chips 108 includes a
dedicated power supply and a dedicated clock grid, such that each
operates independently of the others. In one exemplary embodiment,
the chips 108 support various voltage supplies and clock grids and
need not be compatible with one another (e.g., where power and
clock distribution networks and operating specifications are
incompatible with other chips). Once integrated with the stack
100A, the chips 108 are communicatively coupled to the layers 110,
112, and 114, e.g., via wiring or wire mesh. However, the chips 108
are not electrically connected to the host layer 104A. Rather, the
3D computer processing chip stack 100A also includes programmable
connections, such as the wiring grid (not shown), which enable the
chips 108 to communicate with other layers 110, 112, and 114 of the
3D processing chip stack 100A. In an exemplary embodiment, each of
the chips 108 may be communicatively coupled to other components in
any of the layers 110, 112, and 114.
[0019] A variety of types of the chips 108 may be manufactured such
that at least one of the chips 108 disposed on the host layer 104A
have properties that are different from those of others of the
chips 108. These heterogeneous properties may include, e.g.,
variations in chip size, variations in sizes, aspect ratios,
thicknesses, operating point specs (e.g., clock frequency, supply
voltage), number and characteristics of wiring layers, and the use
of disparate technologies. Examples of disparate technologies
employed by the chips 108 may include e.g., 22, 32, and 45
nanometer (nm) chips. The chips 108 may be configured for various
functions (e.g., the chips 108 may be cache chips, floating point
accelerators, encryption and decryption accelerators, or any other
type of computer chip as is known in the art).
[0020] The dedicated regions 106 may be formed on the host layer
104A by etching the host layer 104A to create openings, or
cavities, of a size sufficient to accommodate particular chips
sizes and thicknesses. The dimensions of the etching (e.g., length,
width, and depth) on the host layer 104A correspond to the
dimensions of the length, width, and thickness of the desired chips
108. In addition, the host layer 104A may be etched to form etch
stops to create borders for the dedicated regions 106.
[0021] In an exemplary embodiment, the host layer 104A may be
constructed of a thermally conductive material (e.g., silicon) in
order to provide increased cooling for the chips 108, as well as
the underlying layers 110, 112, and 114. Heat dissipation of the 3D
computer processing chip stack 100A may be improved due to the use
of the thermally conductive material. The chips 108 are not
electrically connected to the host layer 104A (e.g., they are
instead communicatively coupled to other layers 110, 112, and 114
via programmable wiring or a wire mesh that is provided on the host
layer 104A after the chips 108 have been integrated onto the host
layer 104A.
[0022] In addition, the host layer 104A may include infrastructure
or material (not shown) to improve the thermal conductivity (e.g.,
Cu thermal vias, embedded cooling channels, metal mesh structures,
and specialized interface materials to improve the heat conduction
from the chips 108 and other stack elements to the lid 102),
whereby chips 108 disposed on the host layer 104A provide even
contact with the infrastructure or material due to the thermally
conductive material used in constructing the host layer 104A,
thereby improving thermal conductivity of the 3D computer
processing chip stack 100A. The chips 108 disposed on the host
layer 104A are joined to respective surfaces of their corresponding
dedicated regions 106 through the application of this
infrastructure to the host layer 104A, thereby forming a monolithic
element with respect to the host layer 104A and chips 108. The
monolithic aspects provide a smooth seamless surface, as depicted
in the exemplary host layer 104A of FIG. 1A.
[0023] In alternative embodiments, the host layer 104A (having the
thermally conductive material and/or embedded metal structures to
enhance the thermal conductivity) may be used without any chips 108
to provide cooling and/or shielding with respect to the underlying
layers 110, 112, and 114. The shielding properties of the host
layer 104A material (e.g., via mesh structures) protect against
alpha rays that may otherwise cause interference.
[0024] Also included in the 3D computer processing chip stack 100A
is a lid 102, which may be a heat sync for use in facilitating the
dissipation of heat generated by the layers 104A, 110, 112, and
114. The lid 102 may be disposed on top of the host layer 104A,
e.g., as shown in FIG. 1A.
[0025] The 3D computer processing chip stack 100A may also include
connection pins 116 (FIG. 1A) which serve to connect the 3D
computer processing chip stack 100A to a hardware device (not
shown) within which it will operate.
[0026] As shown in FIG. 1B, the host layer 104A further includes
alignment marks 118. The alignment marks 118 assist in aligning the
host layer 104A with the other layers 110, 112, and 114. In
exemplary embodiment the alignment marks 118 are used to integrate
the layers 104A, 110, 112, and 114 using laser alignment, or other
alignment techniques as will be understood by those skilled in the
art.
[0027] During integration of the host layer 104A with the other
layers 110, 112, and 114, the host layer 104A is disposed on the
other layers 110, 112, and 114 (which layers 110, 112, and 114 are
vertically stacked as shown in FIG. 1A). The layers 110, 112, and
114 each include alignment holes corresponding to the placement of
the alignment markings 118 of the host layer 104A. The alignment of
the layers 104A, 110, 112, and 114 may be checked by pointing a
laser beam through the alignment marks 118. If the laser beam
completes its path through all of the layers 104A, 110, 112, and
114, the 3D processing chip stack 100A is successfully aligned.
Because the chips 108 are mounted to the host layer 104A, once the
host layer 104A is aligned with the other layers 110, 112, and 114,
the chips 108 will be properly aligned as well.
[0028] Turning now to FIG. 1C, a side view of a 3D computer
processing chip stack 100B will now be described. The 3D computer
processing chip stack 100B may include many of the elements
described above in FIG. 1A. To the extent these elements overlap,
they will not be further described herein. The exemplary host layer
100B refers to a system of integrated circuit chips and includes a
plurality of layers (denoted as layers 110-114). These layers may
include structures and material similar to those described above in
FIG. 1A. The layers 110-114 are integrated (e.g., stacked) to form
a portion of the 3D computer processing chip stack 100B. In the
exemplary embodiment shown in FIG. 1C, e.g., layer 112 may be
disposed on layer 114, the host layer 104B may be disposed on layer
112, and layer 110 may be disposed on the host layer 104B.
[0029] In an exemplary embodiment, the host layer 104B includes a
first planar side 160 (also referred to as a bottom portion) and a
second planar side 150 (also referred to as a top portion) upon
both of which dedicated regions 106 are formed for receiving a
number of chips 108. The first planar side 160 and the second
planar side 150 are horizontally disposed on opposing sides of each
other with respect to the host layer 104B. The chips 108 are
described fully in FIG. 1A and will not be further described
herein. Using the same or similar etching techniques described
above, the dedicated cavities 106 may be formed on both planar
sides (i.e., upper and lower portions 150 and 160) of the host
layer 104B as depicted, e.g., in FIG. 1C. Once integrated with the
stack 100B, the chips 108 are communicatively coupled to the layers
110-114, e.g., via wiring or wire mesh. Additionally, as described
above in FIG. 1A, the chips 108 of the host layer 104B are not
electrically connected to the host layer 104B. Rather, the 3D
computer processing chip stack 100B also includes programmable
connections, such as the wiring grid (not shown), which enable the
chips 108 to communicate with other layers 110-114 of the 3D
processing chip stack 100B. In an exemplary embodiment, each of the
chips 108 may be communicatively coupled to other components in any
of the layers 110, 112, and 114.
[0030] A variety of types of the chips 108 may be manufactured such
that at least one of the chips 108 disposed on the host layer 104B
have properties that are different from those of others of the
chips 108. These heterogeneous properties may include, e.g.,
variations in chip size, variations in sizes, aspect ratios,
thicknesses, operating point specs (e.g., clock frequency, supply
voltage), number and characteristics of wiring layers, and the use
of disparate technologies. The dedicated regions 106 may be formed
on the host layer 104B by etching the host layer 104B to create
openings, or cavities, of a size sufficient to accommodate
particular chips sizes and thicknesses. The dimensions of the
etching (e.g., length, width, and depth) on the host layer 104B
correspond to the dimensions of the length, width, and thickness of
the desired chips 108. In addition, the host layer 104 may be
etched to form etch stops to create borders for the dedicated
regions 106.
[0031] The chips 108 are selected for placement on the host layer
104 (e.g., one of the embodiments of host layer 104A and 104B) from
a set of chip types that are designed to work together to perform
various functions. In an exemplary embodiment, the chips 108 are
manufactured and tested, and a chip designer may select a number of
the chips 108 for inclusion in the host layer 104 based upon
customized requirements provided, e.g., by a customer or client. In
addition, the modular design of the host layer 104 allows the
efficient construction of computer processors with various modular
components without requiring the disclosure of the operation or
construction methods of the modular components. In this way, a
manufacturer may securely manufacture computer processors in a
restrictive environment such as, for example, in military
applications.
[0032] As indicated above, chips 108 may be manufactured and tested
for subsequent placement in the 3D computer processing chip stack
100. Because the chips 108 may be mounted in the host layer 104 at
some future time (e.g., as client or customer requirements
dictate), the chips 108 may be manufactured efficiently in large
batches, therefore increasing the yield. Since the host layer 104
is configured for varying chip sizes, the chips 108 may be made as
small as possible, thereby further increasing the yield and
lowering the manufacturing costs. Additionally, further
efficiencies may be realized because the chips 108 are designed as
independent, stand-alone components. As a result, each chip 108 may
be tested individually, and any defective chips may be discarded
without sacrificing the remaining components of the 3D processing
chip stack 100. This feature further increases the yield of the 3D
processing chip stacks 100 by ensuring that all components are
working before final assembly of the 3D processing chip stack
100.
[0033] FIGS. 2A-2B illustrate a flow diagram describing a process
for forming a three-dimensional computer processing chip stack in
an exemplary embodiment, FIG. 3 depicts a block diagram
illustrating sample client requirements and a three-dimensional
computer processing chip stack plan developed from the client
requirements in accordance with an exemplary embodiment, and FIG. 4
depicts a block diagram of a system upon which the manufacturing
and planning may be implemented in an exemplary embodiment.
[0034] The system 400 of FIG. 4 includes a computer system 402 and
manufacturing equipment 404 in communication with one or more
networks 406. The computer system 402 may be a general-purpose
computer processing device (e.g., a desktop computer) or may be a
high-powered system, such as a mainframe computer. The network(s)
406 may comprise any types of networks known in the art, e.g.,
Internet, local area network, wide area network, or a combination
of varying networks. In an alternative embodiment, the
manufacturing equipment 404 may be in direct communication with the
computer system 402, e.g., via cabling. The manufacturing equipment
404 may include various types of process equipment for
manufacturing computer processing chips, including the 3D computer
processing chip stack 100 described in FIG. 1. The computer system
402 executes logic 408 for implementing the exemplary processes
described herein. The computer system 402 may also execute various
applications typically associated with a manufacturing enterprise
(e.g., manufacturing enterprise system software, manufacturing
resource planning applications, etc. (not shown)). The computer
system 402 may also include internal or external memory for storing
data used in implementing the exemplary processes described herein.
The types of data that may be stored in the computer system memory
may include, e.g., client requirements 410 and manufacturing plans
412 (also referred to herein as 3D computer processing chip stack
plans), both of which are described further herein. The
manufacturing process, three-dimensional computer processing chip
stack planning, and system will now be described with respect to
FIGS. 2A-2B, FIG. 3, and FIG. 4.
[0035] At block 202, system requirements for a number of computer
processing devices are received at the computer system 402 and
analyzed via the logic 408. For example, as shown in FIG. 3, there
are three sets of system requirements for respective Clients 1, 2,
and 3. These requirements may be retrieved from storage (e.g.,
client requirements 410 stored in memory of the computer system
402).
[0036] At block 204, the logic 408 identifies any common processing
structures and technologies resulting from the analysis. Common
structures and technologies refer to components and related
technologies for client requirements that are shared among a
defined quantity or percentage of clients (e.g., 95-100% of clients
require 8 processing cores for a requested product (e.g., stack
100)). These common structures and technologies are also referred
to as baseline requirements and are extrapolated from the
collective client requirements (e.g., from Clients 1, 2, and 3).
The baseline requirements are assigned/reserved for placement on
one or more shared layers 110, 112, and 114. As shown in FIG. 3, a
common technology shared by all three Clients 1-3 is 22 nm
technology. Other examples of baseline requirements are shown in
box 302 of FIG. 3.
[0037] At block 206, the logic 408 identifies any uncommon and/or
incompatible structures from the analysis. Uncommon structures
refer to components and technologies for client requirements that
are not shared among any of the clients or may be common to a small
quantity or percentage of clients. Incompatible structures and
technologies refer to components and technologies for the client
requirements that are not compatible with any of the common
structures of these requirements. Examples of the types of
structures/technologies may include, e.g., repair or patch chips,
accelerators, encryption/decryption, and redundancies. These
uncommon and/or incompatible structures are assigned/reserved for
placement on the host layer 104 (i.e., the above-described chips
108 reflect these uncommon and/or incompatible structures or
technologies). An example of uncommon and/or incompatible
structures and technologies are shown in box 304 of FIG. 3.
Together, the data in boxes 302 and 304 form the collective
structures and technologies 306 of the system requirements
requested from the Clients 1-3.
[0038] At block 208, the logic 408 calculates sizes and aspect
ratios for uncommon/incompatible structures in box 304. For
example, if the chips 108 are manufactured by the same vendor
(hence, the vendor has full control over the size/aspect ratios of
these chips), the sizing calculations may be implemented to assess
the potential chip area utilization and select a configuration that
maximizes the amount of area used by the chips 108.
[0039] At block 210, the logic 408 identifies interconnectivity
requirements for the uncommon and/or incompatible structures in box
304.
[0040] At block 212, the logic 408 determines the number of host
layers 104 required in order to satisfy the client requirements
(e.g., from the uncommon and/or incompatible structure and
technology data in box 304). The determination may be made using
the aspect ratio calculations, the interconnection requirements,
and dimensions of the host layer 104.
[0041] At block 214, the logic 408 sends the baseline data in box
302 to the manufacturing equipment 404 (e.g., via network 406),
e.g., as one of the manufacturing plans 412, and the manufacturing
equipment 404 manufactures the common structures from the baseline
data as well as shared layers (e.g., multiple instances of each of
layers 110, 112, and 114). The manufacturing process may include
providing holes on the layers 110, 112, and 114 for subsequent
alignment during the integration process. These structures may also
be tested before performing the integration process.
[0042] At block 216, the logic 408 assesses clock and power
delivery requirements for the uncommon and/or incompatible
structures in box 304 (e.g., examining the specifications of the
various chips 108 in terms of Vdd, Vcs, Fclk ranges and target
levels to determine the compatibility of these values). If the Vdd
targets and clock ranges overlap, for example, the items in the
blocks 302/304 may be switched in the host layer design plan.
Alternatively, one or more of the chips 108 may share or switch
clock and voltage delivery infrastructure.
[0043] At block 218, the logic 408 sends the uncommon/incompatible
structure data in box 304 to the manufacturing equipment 404 (e.g.,
via network 406), and the manufacturing equipment 404 manufactures
the uncommon and/or incompatible structures (e.g., these structures
refer to the above-described chips 108). These structures may also
be tested before performing the integration process.
[0044] At block 220, the logic 408 determines placement of uncommon
and/or incompatible structures and interconnect blocks (e.g.,
wiring) on host layer 104. The placement of the chips 108 may be
determined using various analytical techniques. By way of example,
factors to consider may include whether a component of a layer is
required to overlap with another component in an underlying layer,
or whether a component need not overlap with another component but
needs to be in proximity of a number of other elements.
Additionally, the logic 408 may be configured to exploit the use of
a shared element by placing close together multiple chips 108 that
share use of the common element.
[0045] The logic 408 sends this information to the manufacturing
equipment 404 (e.g., via the network 406), and the manufacturing
equipment 404 prepares the host layer 104, as will now be
described. The host layer 104 is formed of a thermally conductive
material, which assists in the dissipation of heat created by the
chips 108 on the host layer 104 and components (e.g., the common
structures) of the shared layers (e.g., layers 110, 112, and 114)
through the thermally conductive material. In an exemplary
embodiment, the host layer 104 is configured to protect the chips
108 and the other layers from alpha radiation.
[0046] At block 222, dedicated regions 106 are formed on the host
layer 104 for receiving chips 108 that are pre-configured with
heterogeneous properties. One of the heterogeneous properties
includes size variation. Other heterogeneous properties may include
variation in thicknesses, aspect ratios, wiring
characteristics/number of wiring layers, supply voltage and clock
specifications, and the use of disparate technologies. As described
above, the disparate technologies may include, e.g., 22 nm, 32 nm,
and 45 nm technologies. The dedicated regions 106 (cavities) are
formed to accommodate the heterogeneous properties of the chips
(e.g., the dedicated regions 106 are formed of a size that
corresponds with the sizes of respective chips 108). The dedicated
regions 106 may be formed by etching the host layer 104. It will be
understood that in exemplary embodiments, the host layer 104 is
manufactured separately from the chips 108, and the other layers
110, 112, and 114. In exemplary embodiments, the host layer 104 may
be etched to create openings for the chips 108. In additional
exemplary embodiments, the host layer 104 may be etched to form
etch stops to create borders for the dedicated regions 106.
[0047] At block 224, alignment markings 118 are placed on the host
layer 104. The alignment markings 118 are configured to align the
host layer 104 with the at least one other layer (e.g., one or more
of layers 110, 112, and 114). The host layer 104 may be aligned
with other layers via a laser beam directed through the host layer
104. The host layer 104 and the other layers (110, 112, 114) are
successfully aligned when the laser beam passes through the host
layer 104 (via the alignment markings 118) and the alignment holes
provided on the other layers.
[0048] At block 226, the host layer 104 is further prepared by
disposing the chips 108 in corresponding dedicated regions 106 of
the host layer 104. As indicated above, each of the chips 108, when
disposed on the host layer 104, lacks an electrical and functional
connection with the other chips 108 on the host layer 104. Further,
as indicated above, the chips 108 disposed on the host layer 104
are joined to respective surfaces of their corresponding dedicated
regions 106 through the application of this infrastructure to the
host layer 104, thereby forming a monolithic element with respect
to the host layer 104 and chips 108. The monolithic aspects provide
a smooth seamless surface, as depicted in the exemplary host layer
104 of FIG. 1A.
[0049] At block 228, the host layer 104 is aligned with the one or
more other layers (e.g., layers 110, 112, and 114), as described
above in block 224.
[0050] At block 230, the host layer 104 is integrated, or joined,
with the other layers (e.g., layers 110, 112, and 114) to form the
stack 100.
[0051] Technical effects and benefits include a thermally
conductive host layer 104 that provides both efficient heat
displacement and protection from alpha radiation. In addition, the
host layer 104 provides a base layer for placement and alignment of
chips 108 via dedicated regions 106 formed on the host layer 104
that allow for the efficient and separate manufacture of
heterogeneous chips 108 for a 3D computer processing chip stack
100.
[0052] The terminology used herein is for the purpose of describing
particular embodiments only and is not intended to be limiting of
the invention. As used herein, the singular forms "a", "an" and
"the" are intended to include the plural forms as well, unless the
context clearly indicates otherwise. It will be further understood
that the terms "comprises" and/or "comprising," when used in this
specification, specify the presence of stated features, integers,
steps, operations, elements, and/or components, but do not preclude
the presence or addition of one or more other features, integers,
steps, operations, elements, components, and/or groups thereof.
[0053] The corresponding structures, materials, acts, and
equivalents of all means or step plus function elements in the
claims below are intended to include any structure, material, or
act for performing the function in combination with other claimed
elements as specifically claimed. The description of the present
invention has been presented for purposes of illustration and
description, but is not intended to be exhaustive or limited to the
invention in the form disclosed. Many modifications and variations
will be apparent to those of ordinary skill in the art without
departing from the scope and spirit of the invention. The
embodiment was chosen and described in order to best explain the
principles of the invention and the practical application, and to
enable others of ordinary skill in the art to understand the
invention for various embodiments with various modifications as are
suited to the particular use contemplated.
[0054] As will be appreciated by one skilled in the art, aspects of
the present invention may be embodied as a system, method or
computer program product. Accordingly, aspects of the present
invention may take the form of an entirely hardware embodiment, an
entirely software embodiment (including firmware, resident
software, micro-code, etc.) or an embodiment combining software and
hardware aspects that may all generally be referred to herein as a
"circuit," "module" or "system." Furthermore, aspects of the
present invention may take the form of a computer program product
embodied in one or more computer readable medium(s) having computer
readable program code embodied thereon.
[0055] Any combination of one or more computer readable medium(s)
may be utilized. The computer readable medium may be a computer
readable signal medium or a computer readable storage medium. A
computer readable storage medium may be, for example, but not
limited to, an electronic, magnetic, optical, electromagnetic,
infrared, or semiconductor system, apparatus, or device, or any
suitable combination of the foregoing. More specific examples (a
non-exhaustive list) of the computer readable storage medium would
include the following: an electrical connection having one or more
wires, a portable computer diskette, a hard disk, a random access
memory (RAM), a read-only memory (ROM), an erasable programmable
read-only memory (EPROM or Flash memory), an optical fiber, a
portable compact disc read-only memory (CD-ROM), an optical storage
device, a magnetic storage device, or any suitable combination of
the foregoing. In the context of this document, a computer readable
storage medium may be any tangible medium that can contain, or
store a program for use by or in connection with an instruction
execution system, apparatus, or device.
[0056] A computer readable signal medium may include a propagated
data signal with computer readable program code embodied therein,
for example, in baseband or as part of a carrier wave. Such a
propagated signal may take any of a variety of forms, including,
but not limited to, electro-magnetic, optical, or any suitable
combination thereof. A computer readable signal medium may be any
computer readable medium that is not a computer readable storage
medium and that may communicate, propagate, or transport a program
for use by or in connection with an instruction execution system,
apparatus, or device.
[0057] Program code embodied on a computer readable medium may be
transmitted using any appropriate medium, including but not limited
to wireless, wireline, optical fiber cable, RF, etc., or any
suitable combination of the foregoing.
[0058] Computer program code for carrying out operations for
aspects of the present invention may be written in any combination
of one or more programming languages, including an object oriented
programming language such as Java, Smalltalk, C++ or the like and
conventional procedural programming languages, such as the "C"
programming language or similar programming languages. The program
code may execute entirely on the user's computer, partly on the
user's computer, as a stand-alone software package, partly on the
user's computer and partly on a remote computer or entirely on the
remote computer or server. In the latter scenario, the remote
computer may be connected to the user's computer through any type
of network, including a local area network (LAN) or a wide area
network (WAN), or the connection may be made to an external
computer (for example, through the Internet using an Internet
Service Provider).
[0059] Aspects of the present invention are described above with
reference to flowchart illustrations and/or block diagrams of
methods, apparatus (systems) and computer program products
according to embodiments of the invention. It will be understood
that each block of the flowchart illustrations and/or block
diagrams, and combinations of blocks in the flowchart illustrations
and/or block diagrams, may be implemented by computer program
instructions. These computer program instructions may be provided
to a processor of a general purpose computer, special purpose
computer, or other programmable data processing apparatus to
produce a machine, such that the instructions, which execute via
the processor of the computer or other programmable data processing
apparatus, create means for implementing the functions/acts
specified in the flowchart and/or block diagram block or
blocks.
[0060] These computer program instructions may also be stored in a
computer readable medium that may direct a computer, other
programmable data processing apparatus, or other devices to
function in a particular manner, such that the instructions stored
in the computer readable medium produce an article of manufacture
including instructions which implement the function/act specified
in the flowchart and/or block diagram block or blocks.
[0061] The computer program instructions may also be loaded onto a
computer, other programmable data processing apparatus, or other
devices to cause a series of operational steps to be performed on
the computer, other programmable apparatus or other devices to
produce a computer implemented process such that the instructions
which execute on the computer or other programmable apparatus
provide processes for implementing the functions/acts specified in
the flowchart and/or block diagram block or blocks.
[0062] As described above, embodiments may be embodied in the form
of computer-implemented processes and apparatuses for practicing
those processes. In exemplary embodiments, the invention is
embodied in computer program code executed by one or more network
elements. Embodiments include a computer program product 500 on a
computer usable medium 502 with computer program code logic 504
containing instructions embodied in tangible media as an article of
manufacture. Exemplary articles of manufacture for computer usable
medium 502 may include floppy diskettes, CD-ROMs, hard drives,
universal serial bus (USB) flash drives, or any other
computer-readable storage medium, wherein, when the computer
program code logic 504 is loaded into and executed by a computer
402, the computer 402 becomes an apparatus for practicing the
invention. Embodiments include computer program code logic, for
example, whether stored in a storage medium, loaded into and/or
executed by a computer, or transmitted over some transmission
medium, such as over electrical wiring or cabling, through fiber
optics, or via electromagnetic radiation, wherein, when the
computer program code logic is loaded into and executed by a
computer, the computer becomes an apparatus for practicing the
invention. When implemented on a general-purpose microprocessor,
the computer program code logic segments configure the
microprocessor to create specific logic circuits.
[0063] The flowchart and block diagrams in the Figures illustrate
the architecture, functionality, and operation of possible
implementations of systems, methods, and computer program products
according to various embodiments of the present invention. In this
regard, each block in the flowchart or block diagrams may represent
a module, segment, or portion of code, which comprises one or more
executable instructions for implementing the specified logical
function(s). It should also be noted that, in some alternative
implementations, the functions noted in the block may occur out of
the order noted in the figures. For example, two blocks shown in
succession may, in fact, be executed substantially concurrently, or
the blocks may sometimes be executed in the reverse order,
depending upon the functionality involved. It will also be noted
that each block of the block diagrams and/or flowchart
illustration, and combinations of blocks in the block diagrams
and/or flowchart illustration, may be implemented by special
purpose hardware-based systems that perform the specified functions
or acts, or combinations of special purpose hardware and computer
instructions.
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