U.S. patent application number 13/075147 was filed with the patent office on 2012-09-13 for fiber, fiber aggregate and adhesive having the same.
This patent application is currently assigned to OPTOPAC CO., LTD. Invention is credited to Deok Hoon Kim, Jae Ok Kim, Kyung Wook Paik, Kyoung Lim Suk.
Application Number | 20120231689 13/075147 |
Document ID | / |
Family ID | 46794813 |
Filed Date | 2012-09-13 |
United States Patent
Application |
20120231689 |
Kind Code |
A1 |
Kim; Deok Hoon ; et
al. |
September 13, 2012 |
FIBER, FIBER AGGREGATE AND ADHESIVE HAVING THE SAME
Abstract
Provided is a functional fiber and a fiber aggregate for
realizing various functions, an adhesive for easily bonding
electronic components, and a method for manufacturing the same.
Particularly, a fiber extended in a length direction includes a
carrier polymer and a plurality of functional particles, wherein
the plurality of functional particles are embedded in the carrier
polymer and physically fixed to the carrier polymer to be
integrated.
Inventors: |
Kim; Deok Hoon;
(Chungcheongbuk-Do, KR) ; Paik; Kyung Wook;
(Daejeon, KR) ; Suk; Kyoung Lim; (Daejeon, KR)
; Kim; Jae Ok; (Seoul, KR) |
Assignee: |
OPTOPAC CO., LTD
Chungcheongbuk-Do
KR
MICROPACK CO., LTD
Daejeon
KR
Korea Advanced Institute of Science and Technology
Daejeon
KR
|
Family ID: |
46794813 |
Appl. No.: |
13/075147 |
Filed: |
March 29, 2011 |
Current U.S.
Class: |
442/181 ;
252/301.36; 252/500; 252/512; 252/513; 252/514; 252/62.54 |
Current CPC
Class: |
C09J 133/20 20130101;
Y10T 428/2896 20150115; H01R 12/52 20130101; Y10T 428/28 20150115;
Y10T 428/254 20150115; C08L 71/00 20130101; C09J 143/04 20130101;
C08L 77/10 20130101; Y10T 428/287 20150115; Y10T 428/2878 20150115;
Y10T 428/2891 20150115; C09J 133/24 20130101; H01R 4/04 20130101;
D01F 1/10 20130101; C09J 135/06 20130101; C08L 77/00 20130101; C08L
81/06 20130101; Y10T 442/30 20150401; C09J 133/08 20130101; D01D
5/0007 20130101; H05K 2201/029 20130101; C08G 2650/40 20130101;
H05K 2201/0278 20130101; Y10T 428/2852 20150115; H05K 3/323
20130101; Y10T 428/2887 20150115; C08L 81/02 20130101; Y10T
428/2874 20150115; C08L 71/02 20130101; C08L 79/04 20130101 |
Class at
Publication: |
442/181 ;
252/500; 252/62.54; 252/301.36; 252/513; 252/514; 252/512 |
International
Class: |
D03D 15/00 20060101
D03D015/00; H01B 1/22 20060101 H01B001/22; C09K 11/08 20060101
C09K011/08; H01B 1/20 20060101 H01B001/20; H01F 1/01 20060101
H01F001/01 |
Foreign Application Data
Date |
Code |
Application Number |
Mar 11, 2011 |
KR |
10-2011-0022041 |
Claims
1. A fiber extended in a length direction, comprising: a carrier
polymer; and a plurality of functional particles, wherein the
plurality of functional particles are embedded in the carrier
polymer and physically fixed to the carrier polymer, wherein the
carrier polymer comprises coating parts each configured to coat a
respective one of the functional particles and extension parts
extended in a length direction and configured to connect the
functional particles, wherein a thickness of the coating part is
approximately 0.1% to approximately 50% of a radius of the
respective one of the functional particles, wherein the extension
parts are configured to fix distances between the coating parts
embedding the functional particles to maintain a dispersed state
between the functional particles.
2. (canceled)
3. The fiber of claim 1, wherein the carrier polymer comprises at
least one or a compound of polyolefine, polystyrene,
polyvinylalcohol, polyacrylonitrile, polyamide, polyester, aramide,
acrylic, polythylene oxide (PEO), polycaprolactone, polycarbonate,
polyethylene terephthalate, polybezimidazole (PBI),
poly(2-hydroxyethylmethacrylate), polyvinylidene fluoride,
poly(ether imide), styrene-butadiene-styrene triblock copolymer
(SBS), poly(ferrocenyldimethylsilane), polyphenylenesulfide and
polyetheretherketone.
4. The fiber of claim 1, wherein the functional particles comprise
at least one of an electrically conductive particle, a far-infrared
radiation particle, a fluorescent particle, a phosphorescent
particle, and a magnetic particle.
5. The fiber of claim 4, wherein the electrically conductive
particle comprises at least one of Ni, Ag, Cu, Au, Sn--Pb base,
Sn--Ag base, Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In
base, Sn--Zn--Al base and Sn--Bi--Ag base, the far-infrared
radiation particle comprises mullite containing SiO.sub.2 or
Al.sub.2O.sub.3 as a main component, cordierite, zircon,
aluminotitanate-based and spodumene-based materials, ZeO.sub.2,
Na.sub.2O, germanium compound (Ge, GeI.sub.4, GeO.sub.2), at least
one of CeO, K.sub.2O, LiO, BO.sub.3, Na.sub.2O, CaO and MgO, and a
ceramic where one of CuO, Fe.sub.2O.sub.3, MnO.sub.2, CoO and
TiO.sub.2 is added to mullite, cordierite, zircon, aluminotitanate
and spodumene, the fluorescent particle comprises at least one of
ZnO, Ca.sub.2(PO.sub.4).sub.2, CaF.sub.2:Sb, CaWO.sub.4 and
MgWO.sub.4, the phosphorescent particle comprises at least one of
ZnCl, PtOEP, Ir(piq).sub.3, Btp.sub.2Ir(acac), Ir(PPY).sub.3,
Ir(PPy2)(acac), Ir(mpyp).sub.3, F.sub.2Irpic, (f2ppu).sub.2Ir(tmd)
and Ir(dfppz).sub.3, and the magnetic particle comprises at least
one of Ni, Co, Fe.sub.3O.sub.4, Pt, Pd, ferrite, soft ferrite,
Mn--Zn ferrite, alnico ferrite, Nd--Fe--B and Samarium-Cobalt.
6. The fiber of claim 4, wherein a diameter of the electrically
conductive particle is approximately 0.1 .mu.m to approximately 50
.mu.m.
7. (canceled)
8. The fiber of claim 2, wherein a diameter of the extension part
forming the fiber is approximately 10 nm to approximately 100
.mu.m.
9. The fiber of claim 1, wherein a weight ratio between the carrier
polymer and the functional particles functional particle is
approximately 1:0.25 to approximately 1:25.
10. The fiber of claim 1, wherein the functional particles
comprise: a polymer core; and a functional film coated on an outer
surface of the polymer core.
11. The fiber of claim 10, wherein the functional film coated on
the polymer core comprises at least one of an electric conductive
film, a far-infrared radiation film, a fluorescent film, a
phosphorescent film, and a magnetic film, the electric conductive
film comprises at least one of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag
base, Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base and Sn--Bi--Ag base, the far-infrared radiation
film comprises mullite containing SiO.sub.2 or Al.sub.2O.sub.3 as a
main component, cordierite, zircon, aluminotitanate-based and
spodumene-based materials, ZeO.sub.2, Na.sub.2O, germanium compound
(Ge, GeI.sub.4, GeO.sub.2), at least one of CeO, K.sub.2O, LiO,
BO.sub.3, Na.sub.2O, CaO and MgO, and a ceramic where one of CuO,
Fe.sub.2O.sub.3, MnO.sub.2, CoO and TiO.sub.2 is added to mullite,
cordierite, zircon, aluminotitanate and spodumene, the fluorescent
film comprises at least one of ZnO, Ca.sub.2(PO.sub.4).sub.2,
CaF.sub.2:Sb, CaWO.sub.4 and MgWO.sub.4, the phosphorescent film
comprises at least one of ZnCl, PtOEP, Ir(piq).sub.3,
Btp.sub.2Ir(acac), Ir(PPY).sub.3, Ir(PPy2)(acac), Ir(mpyp).sub.3,
F.sub.2Irpic, (f2ppu).sub.2Ir(tmd) and Ir(dfppz).sub.3, and the
magnetic film comprises at least one of Ni, Co, Fe.sub.3O.sub.4,
Pt, Pd, ferrite, soft ferrite, Mn--Zn ferrite, alnico ferrite,
Nd--Fe--B and Samarium-Cobalt.
12. The fiber of claim 11, wherein a diameter of the functional
particles comprising the polymer core and the electric conductive
film coated on the outer surface of the polymer core is
approximately 0.1 .mu.m to approximately 50 .mu.m.
13. A fiber aggregate, comprising: a plurality of fibers each
comprising a carrier polymer and a plurality of functional
particles, wherein the functional particles are embedded in the
carrier polymer to be physically fixed to the carrier polymer,
wherein the plurality of fibers are tangled to form the fiber
aggregate, wherein the carrier polymer comprises coating parts each
configured to coat a respective one of the functional particles and
extension parts extended in a length direction and configured to
connect the functional particles, wherein a thickness of the
coating part is approximately 0.1% to approximately 50% of a radius
of the respective one of the functional particles, wherein the
extension parts are configured to fix distances between the coating
parts embedding the functional particles to maintain a dispersed
state between the functional particles.
14. The fiber aggregate of claim 13, wherein the plurality of
fibers are regularly arranged or irregularly arranged.
15. The fiber aggregate of claim 13, wherein the plurality of
fibers are arranged in a fabric structure of wefts and warp
threads.
16. The fiber aggregate of claim 13, wherein the functional
particle comprises at least one of an electrically conductive
particle, a far-infrared radiation particle, a fluorescent
particle, a phosphorescent particle, and a magnetic particle.
17. The fiber aggregate of claim 16, wherein the electrically
conductive particle comprises at least one of Ni, Ag, Cu, Au,
Sn--Pb base, Sn--Ag base, Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi
base, Sn--In base, Sn--Zn--Al base and Sn--Bi--Ag base, the
far-infrared radiation particle comprises mullite containing
SiO.sub.2 or Al.sub.2O.sub.3 as a main component, cordierite,
zircon, aluminotitanate-based and spodumene-based materials,
ZeO.sub.2, Na.sub.2O, germanium compound (Ge, GeI.sub.4,
GeO.sub.2), at least one of CeO, K.sub.2O, LiO, BO.sub.3,
Na.sub.2O, CaO and MgO, and a ceramic where one of CuO,
Fe.sub.2O.sub.3, MnO.sub.2, CoO and TiO.sub.2 is added to mullite,
cordierite, zircon, aluminotitanate and spodumene, the fluorescent
particle comprises at least one of ZnO, Ca.sub.2(PO.sub.4).sub.2,
CaF.sub.2:Sb, CaWO.sub.4 and MgWO.sub.4, the phosphorescent
particle comprises at least one of ZnCl, PtOEP, Ir(piq).sub.3,
Btp.sub.2Ir(acac), Ir(PPY).sub.3, Ir(PPy2)(acac), Ir(mpyp).sub.3,
F.sub.2Irpic, (f2ppu).sub.2Ir(tmd) and Ir(dfppz).sub.3, and the
magnetic particle comprises at least one of Ni, Co,
Fe.sub.3O.sub.4, Pt, Pd, ferrite, soft ferrite, Mn--Zn ferrite,
alnico ferrite, Nd--Fe--B and Samarium-Cobalt.
18. The fiber aggregate of claim 13, wherein the functional
particle comprises: a polymer core; and a functional film coated on
an outer surface of the polymer core.
19. The fiber aggregate of claim 18, wherein the functional film
coated on the polymer core comprises at least one of an electric
conductive film, a far-infrared radiation film, a fluorescent film,
a phosphorescent film, and a magnetic film, the electric conductive
film comprises at least one of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag
base, Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base and Sn--Bi--Ag base, the far-infrared radiation
film comprises mullite containing SiO.sub.2 or Al.sub.2O.sub.3 as a
main component, cordierite, zircon, aluminotitanate-based and
spodumene-based materials, ZeO.sub.2, Na.sub.2O, germanium compound
(Ge, GeI.sub.4, GeO.sub.2), at least one of CeO, K.sub.2O, LiO,
BO.sub.3, Na.sub.2O, CaO and MgO, and a ceramic where one of CuO,
Fe.sub.2O.sub.3, MnO.sub.2, CoO and TiO.sub.2 is added to mullite,
cordierite, zircon, aluminotitanate and spodumene, the fluorescent
film comprises at least one of ZnO, Ca.sub.2(PO.sub.4).sub.2,
CaF.sub.2:Sb, CaWO.sub.4 and MgWO.sub.4, the phosphorescent film
comprises at least one of ZnCl, PtOEP, Ir(piq).sub.3,
Btp.sub.2Ir(acac), Ir(PPY).sub.3, Ir(PPy2)(acac), Ir(mpyp).sub.3,
F.sub.2Irpic, (f2ppu).sub.2Ir(tmd) and Ir(dfppz).sub.3, and the
magnetic film comprises at least one of Ni, Co, Fe.sub.3O.sub.4,
Pt, Pd, ferrite, soft ferrite, Mn--Zn ferrite, alnico ferrite,
Nd--Fe--B and Samarium-Cobalt.
20-53. (canceled)
54. A fiber, comprising: a carrier polymer; and a plurality of
functional particles embedded in the carrier polymer, wherein the
carrier polymer comprises coating parts each configured to coat a
respective one of the functional particles and extension parts
extended in a length direction and configured to connect the
functional particles, wherein a thickness of the coating part is
approximately 0.1% to approximately 50% of a radius of a respective
one of the functional particles, wherein the coating parts coating
the functional particles are configured to be physically broken so
that an electric connection is achieved through the functional
particles when coupling a first electric connection part and a
second electric connection part using the fiber, wherein the
extension parts are configured to fix distances between the coating
parts embedding the functional particles to maintain a dispersed
state between the functional particles when coupling the first and
second electric connection parts.
55. The fiber of claim 54, wherein the carrier polymer is
configured to physically connect the functional particles without
creating conductivity along the length direction of the fiber,
wherein the coating parts coating the functional particles are
configured to not be physically broken in non-connection regions
when coupling the first and second electric connection parts, and
wherein the extension parts are configured to not be physically
broken after manufacturing the fiber.
56. A fiber aggregate, comprising: a plurality of fibers each
comprising a carrier polymer and a plurality of functional
particles, wherein the plurality of functional particles are
embedded in the carrier polymer to be physically fixed to the
carrier polymer, wherein the plurality of fibers are tangled to
form the fiber aggregate, wherein the carrier polymer comprises
coating parts each configured to coat a respective one of the
plurality of functional particles and extension parts extended in a
length direction and configured to connect adjacent ones of the
plurality of functional particles, wherein a thickness of the
coating part is approximately 0.1% to approximately 50% of a radius
of a respective one of the functional particles, wherein the
coating parts coating the functional particles are configured to be
physically broken so that an electric connection is achieved
through the functional particles when coupling a first electric
connection part and a second electric connection part using the
fiber aggregate, wherein the extension parts are configured to fix
distances between the coating parts embedding the plurality of
functional particles to maintain a dispersed state between the
plurality of functional particles when coupling the first and
second electric connection parts.
Description
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application claims priority to Korean Patent
Application No. 10-2011-0022041 filed on Mar. 11, 2011 and all the
benefits accruing therefrom under 35 U.S.C. .sctn.119, the contents
of which are incorporated by reference in their entirety.
BACKGROUND
[0002] The present disclosure relates to a fiber, a fiber
aggregate, and an adhesive having the same, and more particularly,
to a functional fiber and a fiber aggregate for realizing various
functions, an adhesive for easily bonding electronic components,
and a method for manufacturing the same.
[0003] An anisotropic conductive adhesive is a binder for
simultaneously performing an electrical connection between
electrodes by conductive particles and a mechanical connection by a
thermosetting property of thermosetting resins based on
thermosetting resins and conductive particles dispersed in the
thermosetting resins.
[0004] A method of connecting electronic components using an
anisotropic conductive adhesive is a lead free process which
replaces a conventional soldering process. According to the method,
a process is simple, environmentally friendly, and more thermally
stable because it is unnecessary to momentarily apply high heat to
products (low temperature process). In addition, manufacturing cost
can be reduced because of using an inexpensive substrate such as a
glass substrate or polyester flex, and it is possible to realize an
ultrafine electrode pitch because electronic components are
electrically connected by using fine conductive particles.
[0005] An anisotropic conductive adhesive having the
above-mentioned merits is widely used for display packaging such as
a smart card, a Liquid Crystal Display (LCD), a Plasma Display
Panel (PDP) and a computer, a cell phone, a communication system,
and the like.
[0006] One of the application fields where an anisotropic
conductive adhesive is most commonly used is display module
mounting. A market of an anisotropic conductive adhesive for an
Outer Lead Bonding (OLB) used for connecting a flexible substrate
to a glass substrate, and an anisotropic conductive adhesive for
Printed Circuit Board (PCB) used for bonding a flexible substrate
to a PCB is one of the fastest-growing markets.
[0007] Furthermore, the necessity of ultrafine pitch connection in
Chip On Glass (COG) bonding of directly connecting a driver IC chip
to a glass substrate and Chip On Film (COF) bonding of directly
flip-chip connecting a driver IC chip to a flexible substrate
becomes more important as a driver IC becomes highly integrated and
complicated. Therefore, the importance of anisotropic conductive
adhesive is also rapidly growing.
[0008] According to a technology of mounting electronic components
using an anisotropic conductive adhesive, a thermocompression
bonding process is basically used for completing connection by
virtue of conduction due to conductive particles between electrode
pads, and thermosetting of surrounding thermosetting resins.
[0009] During the thermocompression bonding process, conductive
particles are moved due to flow of thermosetting resins included in
an anisotropic conductive film. Therefore, a large amount of
conductive particles should be used for preventing an electrical
disconnection (hereinafter, referred as `open` for simplicity), and
conductive particles having a core-shell structure, where
conductive particles are embedded by nonconductive materials, or a
mixture of conductive particles and nonconductive particles should
be used for preventing an electrical short (hereinafter, referred
to as `short` for simplicity).
[0010] As the necessity of ultrafine pitch connection is increased,
the importance of technology for applying an electrical stability
in vertical direction and electrical selectivity in X-Y direction
without undesired electric current between electrodes is
increased->.
[0011] FIG. 1 illustrates a related art method of connecting two
electronic components using a related art anisotropic conductive
film. In detail, as illustrated in FIG. 1A, according to a related
art method for connecting two electronic components 10 and 30,
after an anisotropic conductive film 20 containing a thermosetting
polymer resin 22 and conductive metal particles 21 is attached on a
surface of the electronic component 10 where an electrode 11 is
formed, the electrode 11 is aligned with an electrode 31 of another
electronic component 30. Then, heat and pressure are applied
(thermally compressed) to thereby harden the thermosetting polymer
resin 22 and electrically connect the two electrodes 11 and 31 to
each other through the conductive particles 21.
[0012] However, according to such a related art method, as
illustrated in FIG. 1B, the conductive particles 21 are ousted from
an upper portion of the electrode 11 or 31 to the outside of the
electrode 11 or 31 because the thermosetting polymer resin in the
anisotropic film 20 flows during the thermocompression. This
results in an electrical disconnection (region `A` in FIG. 1B)
between the electrodes 11 or 31, or an undesired short (region `B`
in FIG. 1B) between the electrodes.
[0013] For preventing an open between electrodes, excessive
conductive particles should be used. Due to the excessive use of
conductive particles, composite particles composed of a shell of
nonconductive material and a core of conductive material should be
used, or nonconductive particles should be used with conductive
particles. However, even such a method cannot be a basic measure
for preventing a short in fine pitch electrodes and for obtaining
stable and selective electric connection, and requires high
manufacturing cost. Thus, the related art method still has a
limitation in connecting fine pitch electronic components using an
anisotropic conductive film.
SUMMARY
[0014] The present disclosure provides a functional fiber and a
fiber aggregate for implementing various electromagnetic or optical
functions.
[0015] The present disclosure also provides an adhesive for stable
bonding between electronic components.
[0016] The present disclosure also provides a fiber having
excellent mechanical strength for easily bonding ultrafine
connection parts, a fiber aggregate, and an adhesive including the
same, and manufacturing methods thereof.
[0017] In accordance with an exemplary embodiment, a fiber extended
in a length direction includes: a carrier polymer; and a plurality
of functional particles, wherein the plurality of functional
particles are embedded in the carrier polymer and physically fixed
to the carrier polymer to be integrated.
[0018] The carrier polymer may include a coating part configured to
coat the functional particle; and an extension part extended in a
length direction, and configured to connect a space between the
functional particles, wherein the coating part and the extension
part are connected to each other.
[0019] The carrier polymer may include at least one or a compound
of polyolefine, polystyrene, polyvinylalcohol, polyacrylonitrile,
polyamide, polyester, aramide, acrylic, polythylene oxide (PEO),
polycaprolactone, polycarbonate, polyethylene terephthalate,
polybezimidazole (PBI), poly(2-hydroxyethylmethacrylate),
polyvinylidene fluoride, poly(ether imide),
styrene-butadiene-styrene triblock copolymer (SBS),
poly(ferrocenyldimethylsilane), polyphenylenesulfide, and
polyetheretherketone.
[0020] The functional particle may include at least one of an
electrically conductive particle, a far-infrared radiation
particle, a fluorescent particle, a phosphorescent particle, and a
magnetic particle.
[0021] The electrically conductive particle may include at least
one or a compound of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base,
Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base, and Sn--Bi--Ag base; the far-infrared radiation
particle may include mullite containing SiO.sub.2 or
Al.sub.2O.sub.3 as a main component, cordierite, zircon,
aluminotitanate-based and spodumene-based materials, ZeO.sub.2,
Na.sub.2O, germanium compound (Ge, GeI.sub.4, GeO.sub.2), at least
one or a compound of CeO, K.sub.2O, LiO, BO.sub.3, Na.sub.2O, CaO
and MgO, and a ceramic where one of CuO, Fe.sub.2O.sub.3,
MnO.sub.2, CoO and TiO.sub.2 is added to mullite, cordierite,
zircon, aluminotitanate and spodumene; the fluorescent particle may
include at least one or a compound of ZnO,
Ca.sub.2(PO.sub.4).sub.2, CaF.sub.2:Sb, CaWO.sub.4 and MgWO.sub.4,
the phosphorescent particle may include at least one or a compound
of ZnCl, PtOEP, Ir(piq).sub.3, Btp.sub.2Ir(acac), Ir(PPY).sub.3,
Ir(PPy2)(acac), Ir(mpyp).sub.3, F.sub.2Irpic, (f2ppu).sub.2Ir(tmd)
and Ir(dfppz).sub.3; and the magnetic particle may include at least
one or a compound of Ni, Co, Fe.sub.3O.sub.4, Pt, Pd, ferrite, soft
ferrite, Mn--Zn ferrite, alnico ferrite, Nd--Fe--B and
Samarium-Cobalt.
[0022] A diameter of the electrically conductive particle may be
approximately 0.1 .mu.m to approximately 50 .mu.m.
[0023] A thickness of the coating part forming the fiber may be
approximately 0.1% to approximately 50% of a radius of the
functional particle.
[0024] A diameter of the extension part forming the fiber may be
approximately 10 nm to 100 .mu.m.
[0025] A weight ratio between the carrier polymer and the
functional particle may be approximately 1:0.25.about.25.
[0026] The functional particle may include a polymer core; and a
functional film coated on an outer surface of the polymer core.
[0027] The functional film coated on the polymer core may include
at least one of an electric conductive film, a far-infrared
radiation film, a fluorescent film, a phosphorescent film, and a
magnetic film; the electric conductive film may include at least
one or a compound of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base,
Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base, and Sn--Bi--Ag base; the far-infrared radiation
film may include mullite containing SiO.sub.2 or Al.sub.2O.sub.3 as
a main component, cordierite, zircon, aluminotitanate-based and
spodumene-based materials, ZeO.sub.2, Na.sub.2O, germanium compound
(Ge, GeI.sub.4, GeO.sub.2), at least one or a compound of CeO,
K.sub.2O, LiO, BO.sub.3, Na.sub.2O, CaO and MgO, and a ceramic
where one of CuO, Fe.sub.2O.sub.3, MnO.sub.2, CoO and TiO.sub.2 is
added to mullite, cordierite, zircon, aluminotitanate and
spodumene; the fluorescent film may include at least one or a
compound of ZnO, Ca.sub.2(PO.sub.4).sub.2, CaF.sub.2:Sb, CaWO.sub.4
and MgWO.sub.4; the phosphorescent film may include at least one or
a compound of ZnCl, PtOEP, Ir(piq).sub.3, Btp.sub.2Ir(acac),
Ir(PPY).sub.3, Ir(PPy2)(acac), Ir(mpyp).sub.3, F.sub.2Irpic,
(f2ppu).sub.2Ir(tmd) and Ir(dfppz).sub.3; and the magnetic film may
include at least one or a compound of Ni, Co, Fe.sub.3O.sub.4, Pt,
Pd, ferrite, soft ferrite, Mn--Zn ferrite, alnico ferrite,
Nd--Fe--B and Samarium-Cobalt.
[0028] A diameter of the functional particle including the polymer
core and the electric conductive film coated on the outer surface
of the polymer core may be approximately 0.1 .mu.m to approximately
50 .mu.m.
[0029] In accordance with another exemplary embodiment, a fiber
aggregate includes: a plurality of fibers including a carrier
polymer and a functional particle, wherein the functional particle
is embedded in the carrier polymer to be physically fixed to the
carrier polymer, wherein the plurality of fibers are tangled to
form the fiber aggregate.
[0030] The plurality of fibers may be regularly arranged or
irregularly arranged.
[0031] The plurality of fibers may be arranged in a fabric
structure of wefts and warp threads.
[0032] The functional particle may include at least one of an
electrically conductive particle, a far-infrared radiation
particle, a fluorescent particle, a phosphorescent particle, and a
magnetic particle.
[0033] The electrically conductive particle may include at least
one or a compound of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base,
Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base, and Sn--Bi--Ag base; the far-infrared radiation
particle may include mullite containing SiO.sub.2 or
Al.sub.2O.sub.3 as a main component, cordierite, zircon,
aluminotitanate-based and spodumene-based materials, ZeO.sub.2,
Na.sub.2O, germanium compound (Ge, GeI.sub.4, GeO.sub.2), at least
one or a compound of CeO, K.sub.2O, LiO, BO.sub.3, Na.sub.2O, CaO
and MgO, and a ceramic where one of CuO, Fe.sub.2O.sub.3,
MnO.sub.2, CoO and TiO.sub.2 is added to mullite, cordierite,
zircon, aluminotitanate and spodumene; the fluorescent particle may
include at least one or a compound of ZnO,
Ca.sub.2(PO.sub.4).sub.2, CaF.sub.2:Sb, CaWO.sub.4 and MgWO.sub.4;
the phosphorescent particle may include at least one or a compound
of ZnCl, PtOEP, Ir(piq).sub.3, Btp.sub.2Ir(acac), Ir(PPY).sub.3,
Ir(PPy2)(acac), Ir(mpyp).sub.3, F.sub.2Irpic, (f2ppu).sub.2Ir(tmd)
and Ir(dfppz).sub.3; and the magnetic particle may include at least
one or a compound of Ni, Co, Fe.sub.3O.sub.4, Pt, Pd, ferrite, soft
ferrite, Mn--Zn ferrite, alnico ferrite, Nd--Fe--B and
Samarium-Cobalt.
[0034] The functional particle may include a polymer core; and a
functional film coated on an outer surface of the polymer core.
[0035] The functional film coated on the polymer core may include
at least one of an electric conductive film, a far-infrared
radiation film, a fluorescent film, a phosphorescent film, and a
magnetic film; the electric conductive film may include at least
one or a compound of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base,
Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base, and Sn--Bi--Ag base; the far-infrared radiation
film may include mullite containing SiO.sub.2 or Al.sub.2O.sub.3 as
a main component, cordierite, zircon, aluminotitanate-based and
spodumene-based materials, ZeO.sub.2, Na.sub.2O, germanium compound
(Ge, GeI.sub.4, GeO.sub.2), at least one or a compound of CeO,
K.sub.2O, LiO, BO.sub.3, Na.sub.2O, CaO and MgO, and a ceramic
where one of CuO, Fe.sub.2O.sub.3, MnO.sub.2, CoO and TiO.sub.2 is
added to mullite, cordierite, zircon, aluminotitanate and
spodumene; the fluorescent film may include at least one or a
compound of ZnO, Ca.sub.2(PO.sub.4).sub.2, CaF.sub.2:Sb, CaWO.sub.4
and MgWO.sub.4; the phosphorescent film may include at least one or
a compound of ZnCl, PtOEP, Ir(piq).sub.3, Btp.sub.2Ir(acac),
Ir(PPY).sub.3, Ir(PPy2)(acac), Ir(mpyp).sub.3, F.sub.2Irpic,
(f2ppu).sub.2Ir(tmd) and Ir(dfppz).sub.3; and the magnetic film may
include at least one or a compound of Ni, Co, Fe.sub.3O.sub.4, Pt,
Pd, ferrite, soft ferrite, Mn--Zn ferrite, alnico ferrite,
Nd--Fe--B and Samarium-Cobalt.
[0036] In accordance with yet another exemplary embodiment, an
adhesive includes: at least one strand of fiber including a carrier
polymer and a functional particle, wherein the functional particle
is embedded in the carrier polymer to be physically fixed to the
carrier polymer; and a binding resin forming a certain area with
the fiber.
[0037] The carrier polymer may not be decomposed after synthesizing
fiber.
[0038] The functional particle may include at least one of an
electrically conductive particle, a far-infrared radiation
particle, a fluorescent particle, a phosphorescent particle, and a
magnetic particle.
[0039] The electrically conductive particle may include at least
one or a compound of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base,
Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base, and Sn--Bi--Ag base; the far-infrared radiation
particle may include mullite containing SiO.sub.2 or
Al.sub.2O.sub.3 as a main component, cordierite, zircon,
aluminotitanate-based and spodumene-based materials, ZeO.sub.2,
Na.sub.2O, germanium compound (Ge, GeI.sub.4, GeO.sub.2), at least
one or a compound of CeO, K.sub.2O, LiO, BO.sub.3, Na.sub.2O, CaO
and MgO, and a ceramic where one of CuO, Fe.sub.2O.sub.3,
MnO.sub.2, CoO and TiO.sub.2 is added to mullite, cordierite,
zircon, aluminotitanate and spodumene; the fluorescent particle may
include at least one or a compound of ZnO,
Ca.sub.2(PO.sub.4).sub.2, CaF.sub.2:Sb, CaWO.sub.4 and MgWO.sub.4;
the phosphorescent particle may include at least one or a compound
of ZnCl, PtOEP, Ir(piq).sub.3, Btp.sub.2Ir(acac), Ir(PPY).sub.3,
Ir(PPy2)(acac), Ir(mpyp).sub.3, F.sub.2Irpic, (f2ppu).sub.2Ir(tmd)
and Ir(dfppz).sub.3; and the magnetic particle may include at least
one or a compound of Ni, Co, Fe.sub.3O.sub.4, Pt, Pd, ferrite, soft
ferrite, Mn--Zn ferrite, alnico ferrite, Nd--Fe--B and
Samarium-Cobalt.
[0040] The functional particle may be an electrically conductive
particle, and a fiber embedding the electrically conductive
particle may be physically broken so that an electric connection
may be achieved through the electrically conductive particle.
[0041] Content of the electrically conductive particle may be
approximately 1 wt % to approximately 50 wt % out of a whole
weight.
[0042] The functional particle may include a polymer core; and a
functional film coated on an outer surface of the polymer core.
[0043] The functional film coated on the polymer core may include
at least one of an electric conductive film, a far-infrared
radiation film, a fluorescent film, a phosphorescent film, and a
magnetic film; the electric conductive film may include at least
one or a compound of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base,
Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base, and Sn--Bi--Ag base; the far-infrared radiation
film may include mullite containing SiO.sub.2 or Al.sub.2O.sub.3 as
a main component, cordierite, zircon, aluminotitanate-based and
spodumene-based materials, ZeO.sub.2, Na.sub.2O, germanium compound
(Ge, GeI.sub.4, GeO.sub.2), at least one or a compound of CeO,
K.sub.2O, LiO, BO.sub.3, Na.sub.2O, CaO and MgO, and a ceramic
where one of CuO, Fe.sub.2O.sub.3, MnO.sub.2, CoO and TiO.sub.2 is
added to mullite, cordierite, zircon, aluminotitanate and
spodumene; the fluorescent film may include at least one or a
compound of ZnO, Ca.sub.2(PO.sub.4).sub.2, CaF.sub.2:Sb, CaWO.sub.4
and MgWO.sub.4; the phosphorescent film may include at least one or
a compound of ZnCl, PtOEP, Ir(piq).sub.3, Btp.sub.2Ir(acac),
Ir(PPY).sub.3, Ir(PPy2)(acac), Ir(mpyp).sub.3, F.sub.2Irpic,
(f2ppu).sub.2Ir(tmd) and Ir(dfppz).sub.3; and the magnetic film may
include at least one or a compound of Ni, Co, Fe.sub.3O.sub.4, Pt,
Pd, ferrite, soft ferrite, Mn--Zn ferrite, alnico ferrite,
Nd--Fe--B and Samarium-Cobalt.
[0044] The binding resin may include a subsidence part into which
the fiber subsides to be arranged, and a bonding part formed in at
least one of an upper region and a lower region of the subsidence
part.
[0045] At least the subsidence part of the binding resin may be
evenly formed.
[0046] A release film arranged at one or more sides of the binding
resin may be included.
[0047] The binding resin may include at least one of epoxy, acryl,
cyanate ester, and silicon polyurethane.
[0048] The adhesive may be selected from a conductive adhesive, an
anisotropic conductive adhesive, and a nonconductive adhesive.
[0049] In accordance with still another exemplary embodiment, an
electronic component on one side of which an electric connection
part is formed includes: an adhesive bonded to the electric
connection part, wherein the adhesive includes at least one strand
of fiber including a carrier polymer and a functional particle,
wherein the functional particle is embedded in the carrier polymer
to be physically fixed to the carrier polymer, and a binding resin
forming a certain area with the fiber.
[0050] The functional particle may be an electrically conductive
particle.
[0051] The electrically conductive particle may include at least
one of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base, Sn--Ag--Cu base,
Sn--Bi base, Sn--Zn--Bi base, Sn--In base, Sn--Zn--Al base and
Sn--Bi--Ag base, a compound of them, or a particle where an
electric conductive film is coated on an outer surface of a polymer
core.
[0052] The carrier polymer may include at least one or a compound
of polyolefine, polystyrene, polyvinylalcohol, polyacrylonitrile,
polyamide, polyester, aramide, acrylic, polythylene oxide (PEO),
polycaprolactone, polycarbonate, polyethylene terephthalate,
polybezimidazole (PBI), poly(2-hydroxyethylmethacrylate),
polyvinylidene fluoride, poly(ether imide),
styrene-butadiene-styrene triblock copolymer (SBS),
poly(ferrocenyldimethylsilane), polyphenylenesulfide, and
polyetheretherketone.
[0053] The binding resin may include at least one of epoxy, acryl,
cyanate ester, and silicon polyurethane.
[0054] In accordance with yet still another exemplary embodiment, a
method of manufacturing a fiber includes: preparing a solution
including a functional particle and a carrier polymer; and drawing
a fiber by spinning the solution.
[0055] At a process of the preparing the solution, the solution may
be prepared by dispersing a functional particle to a solution where
the carrier polymer is dissolved.
[0056] At a process of the drawing the fiber by spinning the
solution, a method of electro spinning forming an electric field at
a region to which the solution is spun may be used during spinning
the solution.
[0057] The functional particle may include at least one of an
electrically conductive particle, a far-infrared radiation
particle, a fluorescent particle, a phosphorescent particle, and a
magnetic particle.
[0058] The electrically conductive particle may include at least
one of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base, Sn--Ag--Cu base,
Sn--Bi base, Sn--Zn--Bi base, Sn--In base, Sn--Zn--Al base and
Sn--Bi--Ag base, a compound of them, or a particle where an
electric conductive film is coated on an outer surface of a polymer
core.
[0059] The carrier polymer may include at least one or a compound
of polyolefine, polystyrene, polyvinylalcohol, polyacrylonitrile,
polyamide, polyester, aramide, acrylic, polythylene oxide (PEO),
polycaprolactone, polycarbonate, polyethylene terephthalate,
polybezimidazole (PBI), poly(2-hydroxyethylmethacrylate),
polyvinylidene fluoride, poly(ether imide),
styrene-butadiene-styrene triblock copolymer (SBS),
poly(ferrocenyldimethylsilane), polyphenylenesulfide, and
polyetheretherketone.
[0060] At a process of the drawing the fiber by spinning the
solution, plural strands of the fiber may be regularly arranged or
irregularly arranged forming a net structure.
[0061] In accordance with yet still another exemplary embodiment, a
method of manufacturing an adhesive includes: preparing a solution
including a functional particle and a carrier polymer; drawing a
fiber by spinning the solution; and forming an adhesive by allowing
the fiber to subside into a binding resin.
[0062] At a process of the drawing the fiber by spinning the
solution, a method of electro spinning forming an electric field at
a region to which the solution is spun may be used during spinning
the solution.
[0063] The forming the adhesive may include preparing an adhesive
film; arranging the fiber on the adhesive film; and allowing the
fiber to subside into the adhesive film.
[0064] The preparing the adhesive film may include preparing a
release film; and forming a binding resin layer by applying a
binding resin solution on one side of the release film.
[0065] The allowing of the fiber to subside into the adhesive film
may include applying heat and compressing pressure.
[0066] The allowing of the fiber to subside into the adhesive film
may include allowing the fiber to subside into the binding resin
layer of the adhesive film.
[0067] An electrically conductive particle is used for the
functional particle.
[0068] The electrically conductive particle may include at least
one of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base, Sn--Ag--Cu base,
Sn--Bi base, Sn--Zn--Bi base, Sn--In base, Sn--Zn--Al base and
Sn--Bi--Ag base, a compound of them, or a particle where an
electric conductive film is coated on an outer surface of a polymer
core.
[0069] The carrier polymer may include at least one or a compound
of polyolefine, polystyrene, polyvinylalcohol, polyacrylonitrile,
polyamide, polyester, aramide, acrylic, polythylene oxide (PEO),
polycaprolactone, polycarbonate, polyethylene terephthalate,
polybezimidazole (PBI), poly(2-hydroxyethylmethacrylate),
polyvinylidene fluoride, poly(ether imide),
styrene-butadiene-styrene triblock copolymer (SBS),
poly(ferrocenyldimethylsilane), polyphenylenesulfide, and
polyetheretherketone.
BRIEF DESCRIPTION OF THE DRAWINGS
[0070] Exemplary embodiments can be understood in more detail from
the following description taken in conjunction with the
accompanying drawings, in which:
[0071] FIG. 1 illustrates a method of connecting two electronic
components using a related art anisotropic conductive film;
[0072] FIG. 2 is a cross-sectional view illustrating a fiber
according to the present disclosure;
[0073] FIG. 3 is a cross-sectional view illustrating a fiber
according to an exemplary modification of the present
disclosure;
[0074] FIG. 4 is a diagram illustrating that fibers according to
the present disclosure are irregularly arranged;
[0075] FIG. 5 is a diagram illustrating that fibers according to
the present disclosure are regularly arranged;
[0076] FIG. 6 is a diagram illustrating an adhesive according to an
exemplary embodiment of the present disclosure;
[0077] FIG. 7 is a diagram illustrating an adhesive according to a
modified embodiment of the present disclosure;
[0078] FIG. 8 is a diagram illustrating an electronic component
according to an exemplary embodiment of the present disclosure;
[0079] FIG. 9 is a diagram illustrating a device for manufacturing
a fiber according to the present disclosure;
[0080] FIGS. 10A to 10C and FIGS. 11A to 11C sequentially
illustrate a method for manufacturing an adhesive according to the
present disclosure;
[0081] FIG. 12 is a magnified image of the fiber according to an
exemplary embodiment of the present disclosure;
[0082] FIGS. 13 A and 13B are magnified images for describing a
relation between a thickness of a coating part surrounding a
functional particle and a diameter of the functional particle;
and
[0083] FIGS. 14A to 14E are diagrams sequentially illustrating a
method for connecting electronic components using an adhesive
according to an exemplary embodiment of the present disclosure.
DETAILED DESCRIPTION OF EMBODIMENTS
[0084] Hereinafter, specific embodiments will be described in
detail with reference to the accompanying drawings. The present
invention may, however, be embodied in different forms and should
not be construed as limited to the exemplary embodiments set forth
herein. Rather, these embodiments are provided so that this
disclosure will be thorough and complete, and will fully convey the
scope of the present invention to those skilled in the art. Like
reference numerals refer to like elements throughout.
[0085] FIG. 2 is a cross-sectional view illustrating a fiber
according to the present disclosure, FIG. 3 is a cross-sectional
view illustrating a fiber according to an exemplary modification of
the present disclosure, FIG. 4 is a diagram illustrating that
fibers according to the present disclosure are irregularly
arranged, and FIG. 5 is a diagram illustrating that fibers
according to the present disclosure are regularly arranged.
[0086] As illustrated in FIG. 2, a fiber 110 according to the
present disclosure is extended in a length direction and includes a
functional particle 112 to exhibit various characteristics. The
fiber includes a plurality of functional particles 112 and a
carrier polymer 111 which embeds and fixes the plurality of
functional particles 112 and extends in a length direction.
[0087] The functional particle 112 includes a material having a
certain function according to a user's purpose. Accordingly, the
functional particle 112 may be materials showing electromagnetic
properties, optical properties, etc. That is, for instance, the
functional particle 112 may be fabricated using materials which
have electrical conductivity, magnetic properties, far-infrared
radiation, fluorescence, and phosphorescence.
[0088] For example, electrically conductive particles may include
at least one of Ni, Ag, Cu, Au, Sn--Pb base, Sn--Ag base,
Sn--Ag--Cu base, Sn--Bi base, Sn--Zn--Bi base, Sn--In base,
Sn--Zn--Al base, and Sn--Bi--Ag base, or a compound thereof.
[0089] And, far-infrared radiation particles may include mullite
mainly containing SiO.sub.2 or Al.sub.2O.sub.3, cordierite, zircon,
aluminotitanate-based and spodumene-based materials, ZeO.sub.2,
Na.sub.2O, germanium compound (Ge, GeI.sub.4, GeO.sub.2), at least
one or a compound of CeO, K.sub.2O, LiO, BO.sub.3, Na.sub.2O, CaO
and MgO, and a ceramic where one of CuO, Fe.sub.2O.sub.3,
MnO.sub.2, CoO and TiO.sub.2 is added to mullite, cordierite,
zircon, aluminotitanate and spodumene.
[0090] Also, fluorescence radiation particles may include at least
one or a compound of ZnO, Ca.sub.2(PO.sub.4).sub.2, CaF.sub.2:Sb,
CaWO.sub.4 and MgWO.sub.4.
[0091] And, phosphorescence radiation particles may include at
least one or a compound of ZnCl, PtOEP, Ir(piq).sub.3,
Btp.sub.2Ir(acac), Ir(PPY).sub.3, Ir(PPy2)(acac), Ir(mpyp).sub.3,
F.sub.2Irpic, (f2ppu).sub.2Ir(tmd) and Ir(dfppz).sub.3.
[0092] Also, magnetic particles may include at least one or a
compound of Ni, Co, Fe.sub.3O.sub.4, Pt, Pd, ferrite, soft ferrite,
Mn--Zn ferrite, alnico ferrite, Nd--Fe--B and Samarium-Cobalt.
[0093] Meanwhile, the functional particles 112 may be realized in
various ways not being limited to particles having certain
functions in themselves.
[0094] For instance, as illustrated in FIG. 3, the functional
particle 112 may include a polymer core 112a and a functional layer
112b coating an outer surface of the polymer core 112a. That is,
for the modified functional particle 112, the functional layer 112b
having a certain function coats an outer surface of the polymer
core 112a. Accordingly, a function of the functional particle 112
is exhibited by the functional layer 112b. Herein, the polymer core
112a may be fabricated using polymethylmethacrylate (PMMA),
polystyrene, benzoquanamine, acrylic copolymer and the like, and
the functional layer 112b may be fabricated using materials having
electrical conductivity, magnetic properties, far-infrared
radiation, fluorescence, and phosphorescence. For the functional
layer 112b, materials used as the above-mentioned functional
particles may be selectively used.
[0095] The carrier polymer 111 physically fixes the functional
particles by surrounding the plurality of functional particles 112.
It is preferable that the carrier polymer 111 is not decomposed
(flowing like liquid) during a following process after
manufacturing the fiber 110. Therefore, a free movement of the
functional particle 112 may be suppressed because the functional
particle 112 is embedded and fixed by the carrier polymer 111.
[0096] Herein, the carrier polymer 111 may be divided into a region
which surrounds each outer surface of the plurality of functional
particles 112 and a region which is extended in a length direction.
Hereinafter, for convenience, the region coating an outer surface
of the functional particle 112 is named a coating part 111b, and
the region except for the coating part 111b, which connects a
plurality of coating parts 111b, is named an extension part 111a.
Although it is described that the carrier polymer 111 is divided
into the extension part 111a and the coating part 111b for
convenience, the extension part 111a and the coating part 11b are
connected to each other in a body.
[0097] It is preferable to adjust a thickness of the coating part
111b for appropriately fixing the functional particle 112 without
hindering functions.
[0098] A length of the extension part 111a may be varied with the
content of the functional particle 112.
[0099] The coating part 111b may be physically broken due to an
external environment change during a following process where an
adhesive is used so that the functional particle 112 is exposed to
thereby exhibit characteristic functions of the functional particle
112. For example, in the case of an electric anisotropic adhesive
where a conductive particle is used for the functional particle
112, the coating part 111b is physically broken thereby exposing
the electrically conductive particle due to a thermocompression
bonding process when electric connection parts of electronic
components are bonded using the electric anisotropic adhesive. Due
to the exposed electrically conductive particle, the electric
connection parts of electronic components are connected so that an
electric connection is achieved.
[0100] For the carrier polymer 111, it is preferable to use
materials not hindering characteristics of the functional particle
112. For instance, at least one or a compound of polyolefine,
polystyrene, polyvinylalcohol, polyacrylonitrile, polyamide,
polyester, aramide, acrylic, polythylene oxide (PEO),
polycaprolactone, polycarbonate, polyethylene terephthalate,
polybezimidazole (PBI), poly(2-hydroxyethylmethacrylate),
polyvinylidene fluoride, poly(ether imide),
styrene-butadiene-styrene triblock copolymer (SBS),
poly(ferrocenyldimethylsilane), polyphenylenesulfide, and
polyetheretherketone.
[0101] Meanwhile, the fiber 110 may be configured as one strand.
However, a plurality of fibers 110 may be tangled to form a net
structure which may effectively suppress the movement of the
functional particle 112 included in the fiber 110 may. Hereinafter,
for convenience, the structure where the fibers 110 are tangled is
named a fiber aggregate 110A.
[0102] In the fiber aggregate 110A, the fibers 110 may be
irregularly tangled (unwoven), or may be regularly arranged (woven)
forming a net structure. That is, the fiber aggregate 110A may be
in a state where the fibers 110 are disorderedly tangled as
illustrated in FIG. 4. Alternatively, as illustrated in FIG. 5, the
fiber aggregate 110A may have a structure where some of the fibers
110 are arranged in a horizontal direction and the others are
arranged in a vertical direction. Preferably, the fiber aggregate
110A may have a fabric structure where the fibers 110 are arranged
according to the arrangement of wefts and warp threads.
[0103] The fibers 110 may subside into a later-described binding
resin 210 of an adhesive 300 (refer to FIG. 6) to have a certain
thickness and an area. Accordingly, mechanical strength of the
fiber aggregate 110A may be improved.
[0104] Next, an adhesive including the fiber 110 or the fiber
aggregate 110A is described.
[0105] FIG. 6 is a diagram illustrating an adhesive according to an
exemplary embodiment of the present disclosure.
[0106] As illustrated in FIG. 6, the adhesive 300 according to the
exemplary embodiment of the present disclosure includes: at least
one strand of fiber 110 including a carrier polymer 111 and a
functional particle 112 physically fixed to the carrier polymer 111
which is embedded by the carrier polymer 111; and a binding resin
210 forming a certain area with the fiber 110.
[0107] For the fiber 110, the above-described fiber 110 or fiber
aggregate 110A is used, and duplicate descriptions are omitted.
[0108] The binding resin 210 includes a subsidence part 210a where
the fiber 110 subsides into the binding resin 210 and is arranged
to form a certain area; and a bonding part 210b formed in at least
one of an upper region and a lower region of the subsidence part
210a.
[0109] The subsidence part 210 is a region of the binding resin 210
where the fiber 110 subsides and is formed at an approximately
middle region of the binding resin 210.
[0110] The bonding part 210b is a region where the fiber 110 does
not subside into the binding resin 210, and forms a surface of the
subsidence part 210. At a following process, the bonding part 210b
serves to adhere to an electronic component or bond electronic
components when the electronic components are connected to each
other. It is preferable that at least the subsidence part 210a be
formed evenly in the binding resin 210. This makes it easy for the
binding resin 210 to adhere to electronic components.
[0111] As described above, the fiber 110 is concentratedly
distributed in the subsidence part 210a of the binding resin 210,
and the bond between electronic components is achieved by the
bonding part 210b. Therefore, even though a small amount of the
fiber 110 is included in the resin 210, adhesive strength can be
improved and various functions caused by the fiber 110 can be
sufficiently exhibited as well.
[0112] For the binding resin 210, various materials for allowing
the fiber 110 to easily subside and for maintaining adhesive
strength after a following process may be used. Preferably,
thermosetting resin or photocurable resin hardened by external
stimulus such as heat or light may be used. For instance, the
binding resin 210 may have a monomer form initially, and then, may
become polymer during cross-linking at a thermocompression bonding
process. Accordingly, the binding resin 210 may include at least
one of epoxy, acryl, cyanate ester and silicon polyurethane, or a
mixture thereof.
[0113] Meanwhile, the above-described adhesive 300 may include not
only the fiber 110 and the binding resin 210 but also a release
film 220 for easily manufacturing and using adhesive.
[0114] FIG. 7 illustrates an adhesive according to a modified
embodiment of the present disclosure. As illustrated in FIG. 7, an
adhesive 300A according to the modified embodiment of the present
disclosure includes a release film 220, a binding resin 210
disposed at one side of the release film 220, and a fiber 110
subsiding into the binding resin 210. That is, the adhesive 300A
according to the modified embodiment of the present disclosure
includes the binding resin 210 and the fiber like the previous
exemplary embodiment. However, the adhesive 300A according to the
modified embodiment further includes the release film 220 which is
additionally attached to one side of the binding resin 210.
Although it is described that the release film 220 is attached to
one side of the binding resin 210 in the modified embodiment of the
present disclosure, the present invention is not limited thereto.
Thus, the release film 220 may be attached to one side and the
other side of the binding resin 210.
[0115] Although the above-described adhesive is a film type, the
adhesive is not limited thereto and may be formed in various types
such as a paste type.
[0116] Also, the adhesive may be a conductive adhesive, an
anisotropic conductive adhesive, and a nonconductive adhesive.
[0117] An electronic component including the above-described
adhesive 300 is described below.
[0118] FIG. 8 illustrates an electronic component according to an
exemplary embodiment of the present disclosure.
[0119] As illustrated in FIG. 8, an electric connection part 3110
is formed on one side of an electronic component 3100 according to
an exemplary embodiment of the present disclosure. The electronic
component 3100 includes an adhesive 300 adhering to the electric
connection part 3110.
[0120] For the adhesive 300, the above-described adhesive 300
including the above-described fiber 110 or the fiber aggregate 110A
is used, and duplicate descriptions are thus omitted herein.
[0121] The electric connection part 3110 of the electronic
component 3100 is merely bonded to one side of the binding resin
210 of the adhesive 300. Preferably, the electric connection part
3110 of the electronic component 3100 partly subsides into the
bonding part 210b of the binding resin 210 to be bonded.
[0122] Next, a method for manufacturing the adhesive according to
an exemplary embodiment of the present disclosure is described.
[0123] FIG. 9 illustrates a fiber manufacturing device according to
the present disclosure, and FIGS. 10A to 10C sequentially
illustrate a method for manufacturing the adhesive according to the
present disclosure.
[0124] Firstly, the fiber manufacturing device is described with
reference to FIG. 9.
[0125] As illustrated in FIG. 9, a fiber manufacturing device 1000
spins contents by an electrospinning method. The fiber
manufacturing device 1000 includes a spinning module 1100; a metal
foil 1200 arranged corresponding to one side of the spinning module
1100, where a fiber 110 spun from the spinning module 1100 is
collected; a power supply unit 1300 for applying power to the
spinning module 1100; and a power line 1400 one terminal of which
is connected to the power supply unit 1300 and the other terminal
of which is connected to the spinning module 1100.
[0126] The spinning module 1100 includes a syringe 1110 where an
internal space for accommodating a functional fiber manufacturing
mixture (mixed solution of carrier polymer solution and functional
particles) is provided; a needle 1120 which is arranged at one side
of the syringe 1110 and spins the functional fiber manufacturing
mixture; and a pressure adjusting member 1130 for moving the
mixture in the syringe 1110 to the needle 1120 by adjusting
pressure in the syringe 1110.
[0127] Herein, it is preferable that an opening of the needle 1120
facing the metal foil 1200 has a larger diameter than the
functional particle 112, and the other terminal of the power line
1400 is connected being adjacent to the needle 1120. In the
exemplary embodiment, a cylinder reciprocally moving in the syringe
1110 is used as the pressure adjusting member 1130 adjusting
pressure in the syringe 1110. However, although not limited
thereto, various methods for adjusting pressure in the syringe 1110
may be used.
[0128] A method for manufacturing a fiber using the fiber
manufacturing device is described.
[0129] Firstly, a carrier polymer solution is prepared, and the
functional particle 112 is dispersed in the carrier polymer
solution. Hereinafter, the solution where the carrier polymer
solution and the functional particle 112 are mixed is named
`functional fiber manufacturing mixture`. In the exemplary
embodiment, a solution where polyacrylonitrile is mixed with an
organic solvent is used as the carrier polymer solution.
[0130] When the carrier polymer solution and the functional
particle 112 are mixed, a thickness of the coating part 111b
embedding the functional particle 112 and viscosity of the
functional fiber manufacturing mixture may be adjusted according to
a weight ratio between the carrier polymer solution and the
functional particle 112. In detail, a thickness of the coating part
111b is determined according to a ratio between polymer and organic
solvent forming the carrier polymer solution.
[0131] For example, in the case of using an electrically conductive
particle for the functional particle 112, electrical conductivity
and contact resistance of the adhesive 300 may be adjusted due to a
thickness of the coating part 111b embedding the functional
particle 112.
[0132] After the functional fiber manufacturing mixture is
prepared, the functional fiber manufacturing mixture is injected
into the syringe 1110 of the spinning module 1100. And, by
adjusting pressure in the syringe 1110 by the pressure adjusting
member 1130, the mixture in the syringe 1110 is ejected to the
outside through the needle 1120. In the exemplary embodiment, since
a cylinder is used for the pressure adjusting member 1130, the
cylinder is moved in an arrangement direction of the syringe 1110
so that the functional fiber manufacturing mixture is discharged
from the needle 1120.
[0133] Herein, the power supply unit 1300 and the power line 1400
are used to apply power to a region adjacent to the needle 1120
where the functional fiber manufacturing mixture is ejected, and
the metal foil 1200 is grounded. At this time, an electric field is
generated between the spinning module 1100 and the metal foil 1200,
and the functional fiber manufacturing mixture discharged from the
spinning module 1100 is spun toward the metal foil 1200.
Accordingly, the fiber 110 is manufactured, which includes the
carrier polymer 111 extended in a length direction and the
functional particle 112.
[0134] Herein, the functional particle 112 is coated with the
carrier polymer 111. That is, the functional particle 112 is
physically fixed by the carrier polymer 111 to be integrated.
[0135] Herein, a diameter of the fiber 110, preferably, a diameter
of the extension part 111a and a thickness of the coating part 111b
are adjusted according to a diameter of the needle 1120 of the
fiber manufacturing device 1000, viscosity of the functional fiber
manufacturing mixture, intensity of power applied to the spinning
module 1100, and pressure applied to the syringe 1110 by the
pressure adjusting member 1130. Therefore, by adjusting a diameter
of the needle 1120, viscosity of the functional fiber manufacturing
mixture, intensity of applied power, and pressure of the syringe
1110, the fiber 110 may be manufactured having a diameter of the
extension part 111a and a thickness of the coating part 111b
desired by an operator.
[0136] In the above-described method, the fiber 110 is
consecutively spun to the metal foil 1200 using the spinning module
1100 so that a net structure where the fiber 110 is gathered and
tangled at the metal foil 1200, i.e., the fiber aggregate 110A, may
be formed.
[0137] The adhesive 300 is manufactured using the fiber 110 or the
fiber aggregate 110A.
[0138] FIGS. 10A to 10C and FIGS. 11A to 11C sequentially
illustrate a method for manufacturing an adhesive according to the
present disclosure.
[0139] As illustrated in FIG. 10A, the fiber 110 supported by the
metal foil 1200 is manufactured through the electrospinning method
using the fiber manufacturing device 1000, and an adhesive film 200
is prepared separately from the fiber 110. Although the metal foil
1200 is directly used for supporting the fiber 110, it is not
limited thereto and thus a special support member may also be
used.
[0140] The adhesive film 200 is prepared by applying the binding
resin 210 on the release film 220 with a certain area. For
instance, an epoxy solution is applied on one side of the release
film 220 and is heated to thereby manufacture a film having a
certain thickness. Therefore, as illustrated in FIG. 10A, the
adhesive film 200, where the binding resin 210 is layered on one
side of the release film 220, is manufactured.
[0141] After the fiber 110 and the adhesive film 200 are prepared,
the binding resin 210 of the adhesive film 200 is positioned to
face the fiber 110 as illustrated in FIG. 10B. Then, lamination is
performed on the adhesive film 200 and the fiber 110 facing each
other to thereby manufacture an adhesive 300B. For instance, by
passing the adhesive film 200 and the fiber 110 facing each other
between a pair of compression rollers 4100 and 4200, the fiber 110
subsides into the binding resin 210 as illustrated in FIG. 10C.
Herein, the fiber 110 is made to uniformly subside into the binding
resin 210 without physical damage by appropriately adjusting a
lamination atmosphere, e.g., heating temperature and compressing
pressure. Also, by adjusting the heating temperature and
compressing pressure, a position of the fiber 110 in the binding
resin 210 may be adjusted, and accordingly, thicknesses of the
subsidence part 210a and the bonding part 210b of the binding resin
210 may be adjusted.
[0142] However, as illustrated in FIG. 10C, it is limited to allow
the fiber 110 to subside into a center region of the binding resin
210 in the adhesive 300B manufactured through one-time
lamination.
[0143] To allow the fiber to subside into a center region of the
binding resin, it is preferable to perform lamination multiple
times.
[0144] After the adhesive 300B is prepared through the
above-described method illustrated in FIGS. 10A to 10C, an adhesive
film 400 is prepared separately from the adhesive 300B as
illustrated in FIG. 11A. Herein, the adhesive film 400 is prepared
by applying a binding resin 410 on a release film 420 with a
certain area.
[0145] After the adhesive 300B and the adhesive film 400 are
prepared, the binding resin 210 of the adhesive 300B is positioned
to face the binding resin 410 of the adhesive film 400 as
illustrated in FIG. 11B. Then, lamination is performed on the
adhesive 300B and the adhesive film 400 facing each other.
[0146] Then, the binding resin 410 of the adhesive film 400 is
mixed with an upper region of the binding resin 210 mixed with the
fiber 110 as illustrated in FIG. 11C. Therefore, an adhesive 300C,
where the fiber 110 is disposed at a center region of the mixed
binding resins 210 and 410, may be manufactured.
[0147] In the above-described method, lamination is performed using
the compression rollers 4100 and 4200; however, various apparatuses
capable of applying pressure to the fiber 110 and the binding
resins 210 and 410, e.g., a compression applying plate of a plate
form, may be used.
[0148] Meanwhile, the adhesive 300 may be formed in a paste form
having liquidity. For instance, liquefied carrier polymer and a
fiber are mixed with each other to manufacture an adhesive
manufacturing mixture, and the mixture is heated at a certain
temperature to increase viscosity so that an adhesive of a paste
form may be manufactured. And, such a paste type adhesive may be
used in a method of application using a dispenser which discharges
and dispenses processing materials.
[0149] Next, specific structures of the fiber and the adhesive
according to an exemplary embodiment of the present disclosure are
described.
[0150] FIG. 12 is a magnified image of the fiber according to the
present disclosure, and FIGS. 13 A and 13B are magnified images for
describing a relation between a thickness of the coating part
embedding the functional particle and a diameter of the functional
particle.
[0151] For using the adhesive 300 according to the exemplary
embodiment of the present disclosure as an adhesive for bonding
electronic components, e.g., a particle having a polymer core
coated with Ni film with excellent electrical conductivity is used
for the functional particle 112. Herein, the Ni film may be coated
with an Au film for preventing oxidation. And, PMMA is used for the
polymer core, and nonconductive material PAN is used for the
carrier polymer. Accordingly, the functional particle exhibits an
electric conductive function due to the functional film, i.e., the
Ni film.
[0152] It is preferable to appropriately adjust a diameter of the
functional particle 112 corresponding to a size of an electric
connection part of an electronic component and a distance to a
neighboring electric connection part. For instance, in the case of
bonding with a width of approximately 200 .mu.m and a distance of
approximately 200 .mu.m (pitch of approximately 400 .mu.m, refer to
FIG. 8) between electric connection parts, a relatively large
conductive particle, e.g., an electrically conductive particle
having a diameter of approximately 20 .mu.m, may be used. Also, in
the case where a distance between electric connection parts is a
fine pitch ranging from approximately 20 .mu.m to approximately 30
.mu.m, the functional particle 112 having a diameter of
approximately 3 .mu.m may be used. Therefore, it is good to use the
functional particle 112 for ACA (Anisotropic Conductive Adhesives)
having a diameter ranging from approximately 0.1 .mu.m to
approximately 50 .mu.m for bonding electronic components. More
preferably, it is good to use the functional particle 112 for ACA
having a diameter ranging from approximately 1 .mu.m to
approximately 20 .mu.m.
[0153] Also, it is preferable that the carrier polymer 111 and the
functional particle 112 included in the fiber 110 maintain a
certain weight ratio for achieving the best efficiency even though
a small amount of the functional particle 112 is used. For
instance, it is preferable that a weight ratio between the carrier
polymer 111 and the functional particle 112 is approximately
1:0.25.about.25. That is, in the case where a weight ratio of the
functional particle 112 is too smaller than approximately 0.25 wt
%, electrical conductivity cannot be sufficiently exhibited. In the
case where a weight ratio of the functional particle 112 is too
greater than approximately 25, a defect of short may occur when
electronic components are bonded to each other, and manufacturing
cost is increased because a large amount of functional particles is
unnecessarily used.
[0154] As an example, FIG. 12 is a magnified image illustrating the
fiber when a weight ratio between the carrier polymer 111 and the
functional particle 112 is approximately 1:2.5. As illustrated in
FIG. 12, it may be confirmed that the functional particles 112 are
arranged at appropriate intervals when a weight ratio between the
carrier polymer 111 and the functional particle 112 is
approximately 1:2.5. At this time, electrical conductivity is
excellent. Of course, when far-infrared radiation particles,
fluorescent particles, phosphorescent particles, or magnetic
particles are used for the functional particle 112 instead of the
functional particle 112, a ratio of carrier polymer to functional
particle may be appropriately adjusted.
[0155] Also, a thickness of the coating part 111b in the carrier
polymer 111 embedding the functional particle 112 is an important
factor which determines electrical conductivity and contact
resistance of the adhesive 300. It is preferable that a thickness
of the coating part 111b maintains approximately 0.1% to
approximately 50% of a radius of the functional particle 112.
[0156] As an example, FIG. 13A is a magnified image illustrating
the fiber 110 when a thickness of the coating part 111b embedding
the functional particle 112 is less than approximately 0.1% of a
radius of the functional particle 112, and FIG. 13B is a magnified
image illustrating the fiber 110 when a thickness of the coating
part 111b embedding the functional particle 112 is approximately
0.1% to approximately 50% of a radius of the functional particle
112.
[0157] In the case where a thickness of the coating part 111b
embedding the functional particle 112 is smaller than approximately
0.1% of a radius of the functional particle 112, the coating part
111b may not exist on a portion of an outer surface of the
functional particle 112 as illustrated in FIG. 13A. That is, a
portion of an outer surface of the functional particle 112 is
exposed and the other portion is coated with the coating part 111b.
Therefore, the functional particle 112 may not be stably fixed to
the carrier polymer 111, thereby influencing a following process.
As a result, in the case where the coating part 111b does not exist
partially, and thus neighboring functional particles 112 contact
each other, an electrical short may occur due to the neighboring
functional particles at a region where an electric connection is
not desired.
[0158] On the contrary, although not illustrated in the drawings,
in the case where a thickness of the coating part 111b embedding
the functional particle 112 is more than approximately 50% of a
radius of the functional particle 112, the coating part 111b is not
easily broken during thermocompression, leading to an increase in
contact resistance. For instance, if the coating part 111b
embedding the functional particle 112 is not easily broken when
thermocompression is performed for bonding a pair of bond objects
using an adhesive (not illustrated) including the fiber 110, the
functional particle 112 of which coating part 111b is not broken is
located at a region between the pair of bond objects where an
electric connection should be achieved, and thus contact resistance
between the pair of bond objects and the functional particle 112 is
increased. Such an increase in contact resistance causes
degradation of electrical conductivity between the pair of bond
objects.
[0159] Therefore, according to the present disclosure, a thickness
of the coating part 111b embedding the functional particle 112 is
made to be approximately 0.1% to approximately 50% of a radius of
the functional particle 112 so that the coating part 111b embeds
the functional particle relatively uniformly and the coating part
111b is easily broken during thermocompression as illustrated in
FIG. 13B.
[0160] Meanwhile, it is preferable that a diameter of the extension
part 111a of the fiber 111 is approximately 10 nm to approximately
100 .mu.m considering production quality during manufacture of an
adhesive, or production processability during a thermocompression
bonding process. For physically fixing distances between the
coating parts 111b embedding the functional particles 112 with the
maintenance of dispersed state, a diameter of the extension part
111a of the fiber 111 is limited as described above. For example,
in the case of using an electrically conductive particle having a
diameter of approximately 20 .mu.m for the functional particle 112,
it is preferable to maintain a diameter of the extension part 111a
of the fiber 111 as approximately 10 .mu.m.
[0161] Meanwhile, it is preferable that the functional particle 112
is included in the adhesive having a weight ranging from
approximately 1 wt % to approximately 50 wt %.
[0162] That is, in the case where the binding resin 210 is added to
the adhesive 300, it is more preferable that content of the
functional particle 112 is adjusted to be approximately 1 wt % to
approximately 50 wt % out of whole content in the adhesive 300
including the binding resin 210.
[0163] For stably performing both of combination (adherence)
between two electronic components physically separated from each
other and function exhibition of a selective functional particle, a
weight of the functional particle 112 is limited as described
above. For instance, in the case where content of the functional
particle 112 is larger than the above-described range, an
electrical short may occur during bonding electronic components and
manufacturing cost is increased due to unnecessarily excessive use
of functional particles. Also, in the case where content of the
functional particle 112 is smaller than the above-described range,
an electrical open may occur during bonding electronic components
because characteristics of electrical conductivity cannot be
sufficiently exhibited.
[0164] Although preferable conditions of a diameter of the
functional particle, and a thickness of the coating part and a
length of the extension part of the carrier polymer are suggested
exemplifying a particle having electrical conductivity as the
functional particle included in the fiber in the above-described
embodiment, a diameter of the functional particle, and a thickness
of the coating part and a length of the extension part of the
carrier polymer may be variously changed when another particle
having other characteristics is used for the functional
particle.
[0165] Next, structures and functions of electronic components
bonded using an adhesive are described with reference to
drawings.
[0166] FIGS. 14A to 14E are diagrams sequentially illustrating a
method for connecting electronic components using an adhesive
according to an exemplary embodiment of the present disclosure.
[0167] A particle having electrical conductivity is used for the
functional particle 112 included in the fiber 110 of the adhesive
300, nonconductive polymer is used for the carrier polymer 111, and
thermosetting resin is used for the binding resin 210.
[0168] Referring to FIG. 14A, a first bond object, e.g., a first
electronic component 3100, is prepared. Herein, a plurality of
first connection parts 3110 separated from each other is formed on
an upper surface of the first electronic component 3100. And, the
adhesive 300 according to the exemplary embodiment is arranged over
the first electronic component 3100 where the first connection
parts 3110 are formed. The adhesive 300 includes the binding resin
210 and the fiber 110, and has a film form having a certain
thickness.
[0169] And, as illustrated in FIG. 14B, the adhesive 300 is bonded
to an upper portion of the first connection part 3110. Herein, the
bonding part 210b of the binding resin 210 included in the adhesive
300, where the fiber 110 dose not subside, is bonded to an upper
portion of the first connection part 3110.
[0170] Thereafter, a second electronic component 4100 at one side
of which a plurality of second connection parts 4110 are formed is
prepared. Herein, the number of the second connection parts 4110
corresponds to that of the first connection parts 3110, and it is
preferable to manufacture the second connection parts 4110 with
conductive materials. And, as illustrated in FIG. 14C, the first
connection part 3110 of the first electronic component 3100 is
disposed to face the second connection part 4110 of the second
electronic component 4100. Herein, it is preferable that the second
connection part 4110 is positioned right over the first connection
part 3110.
[0171] Thereafter, as illustrated in FIG. 14D, pressure is applied
to the first electronic component 3100 from bottom to top, and to
the second electronic component from top to bottom while applying
heat to the first and second connection parts 3110 and 4110 and the
adhesive 300. Herein, heating and pressuring time is preferably
several seconds to several tens of seconds, heating temperature is
preferably approximately 120.degree. C. to approximately
200.degree. C., and compressing pressure is preferably
approximately 40 Mpa to approximately 80 Mpa.
[0172] Through the thermocompression bonding process, as
illustrated in FIG. 14E, the first connection part 3110 of the
first electronic component 3100 and the second connection part 4110
of the second electronic component 4100 subside into the adhesive
300. A region of an upper portion of the first electronic component
3100 where the first connection part 3110 is not formed and a
region of an upper portion of the second electronic component 4100
where the second connection part 4110 is not formed are bonded to
the adhesive 300, preferably to, a region of the bonding part 210b
on and under the binding resin 210.
[0173] Accordingly, compressing pressure applied through the first
and second electronic components 3100 and 4100 is delivered to the
adhesive 300. Herein, due to the compressing pressure delivered to
the adhesive 300, fluidness (or flow) of the binding resin 210
occurs. Preferably, the binding resin 210 flows from a region
between the first connection part 3110 and the second connection
part 4110 to other regions except for the region between the first
connection part 3110 and the second connection part 4110. However,
the fiber 110 tangled in a net structure is prevented from being
moved in spite of the fluidness of the binding resin 210, and thus
the functional particle 112 is also prevented from being moved.
[0174] Also, a separation distance between the first connection
part 3110 and the second connection part 4110 is shorter than a
separation distance between an upper surface of the first
electronic component 3100 where the first connection part 3110 is
not formed and a lower surface of the second electronic component
4100 where the second connection part 4110 is not formed.
Therefore, a region of the subsidence part 210a positioned between
the first connection part 3110 and the second connection part 4110
out of a whole region of the adhesive 300 receives higher
compressing pressure in comparison with the other regions.
Therefore, as illustrated in a magnified diagram of FIG. 14E, due
to the pressure delivered to the adhesive 300, the carrier polymer
111 embedding the functional particle 112 positioned between the
first connection part 3110 and the second connection part 4110,
i.e., the coating part 111b, is physically broken, and thus the
corresponding functional particle 112 is exposed.
[0175] Due to the physical brokenness of the coating part 111b, the
first connection part 3110 is connected to the second connection
part 4110 by the functional particle 112 so that an electric
connection is achieved. And, the coating part 111b positioned
between regions where the first and second connection regions 3110
and 4110 are not formed is not broken. Therefore, positions where
an electric connection is not desired, i.e., a region of the first
electronic component 3100 where the first connection part 3110 is
not formed and a region of the second electronic component 4100
where the second connection part 4110 is not formed, may be
prevented from being electrically connected to each other. That is,
an electrical short may be prevented.
[0176] As described above, the pair of electronic components 3100
and 4100 may be easily bonded to each other using the adhesive 300
including the fiber 110 according to the present disclosure. That
is, by suppressing movement of the functional particle 112 during
the thermocompression bonding process using the fiber 110 in which
the functional particle 112 is fixed, an open and a short between
the pair of electronic components 3100 and 4100 may be prevented.
Further, an electrical connection between the first connection part
3110 and the second connection part 4110 may be easily achieved
using functional particles of same diameters even though sizes of
the first and second connection parts 3110 and 4110 are decreased.
Furthermore, since the functional particle 112 of the fiber 110 is
physically fixed to the carrier polymer 111 and the fiber 110
itself is regularly or irregularly tangled, it is strong against an
external physical impact.
[0177] Although it is described above that plural connection parts
are bonded to each other, the adhesive of the present disclosure
may be used for various forms of bonding. For instance, the
adhesive may be used for bonding a single electronic component and
a substrate, and for bonding electronic components each of which
has a single connection part. Also, a fiber including functional
particles and a film including the fiber may be used for various
uses besides a bond of electronic components.
[0178] According to the exemplary embodiments of the present
disclosure, functional particles having various electromagnetic or
optical functions are embedded in carrier polymer to be physically
fixed, and thus a functional fiber having various functions and
high stability can be manufactured.
[0179] Further, since the functional particle is stably fixed in
the carrier polymer and stably and sufficiently exhibits its
functions, a high-functional fiber exhibiting high functions with
small amount of functional particles can be manufactured. Also, a
method for manufacturing the functional fiber is easy, and mass
production is possible at low cost.
[0180] The adhesive according to the exemplary embodiments of the
present disclosure includes the fiber where the functional particle
is fixed by the carrier polymer, and is realized in a fiber
aggregate form where fibers are regularly or irregularly arranged
in a net form. Therefore, fluidness of the functional particle can
be suppressed during a following process or during use of an
adhesive. For instance, by using the adhesive according to the
exemplary embodiments of the present disclosure for bonding
electronic components, excessive movement of the functional
particle due to flow of the binding resin can be suppressed even
during thermocompression bonding process, and thus a short or an
open occurring at a bonding part of an electronic component can be
prevented.
[0181] Further, since a large amount of functional particles are
not needed for preventing the open phenomenon in comparison with
the related art, the adhesive having excellent adhesive performance
can be manufactured with relatively small amount of functional
particles.
[0182] Furthermore, in those instances where a convention analogous
to "at least one of A, B, and C, etc." is used, in general such a
construction is intended in the sense one having skill in the art
would understand the convention (for example, "a compound having at
least one of A, B, and C" would include but not be to compounds
that have A alone, B alone, C alone, A and B together, A and C
together, B and C together, and/or A, B, and C together, etc.).
[0183] Although the fiber, the fiber aggregate, and the adhesive
having the same have been described with reference to the specific
embodiments, they are not limited thereto. Therefore, it will be
readily understood by those skilled in the art that various
modifications and changes can be made thereto without departing
from the spirit and scope of the present invention defined by the
appended claims.
* * * * *