SUK; Kyoung Lim

Patent Applications and Registrations

Patent applications and USPTO patent grants for SUK; Kyoung Lim.The latest application filed is for "semiconductor package".

Company Profile

24.16.29

SUK; Kyoung Lim - Suwon-si KR
Suk; Kyoung Lim - Daejeon N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package App 20220293501 - JANG; Jaegwon ; et al.	2022-09-15
Semiconductor package and method of fabricating the same Grant 11,348,876 - Suk , et al. May 31, 2	2022-05-31
Semiconductor Package With Redistribution Substrate App 20220157810 - SUK; Kyoung Lim ; et al.	2022-05-19
Semiconductor Packages App 20220130685 - Lee; Seokhyun ; et al.	2022-04-28
Semiconductor Package App 20220102282 - SUK; KYOUNG LIM ; et al.	2022-03-31
Semiconductor Package App 20220077048 - Suk; Kyoung Lim ; et al.	2022-03-10
Semiconductor Package And Method Of Fabricating The Same App 20220077007 - KIM; MINJUNG ; et al.	2022-03-10
Semiconductor Package And Method Of Fabricating The Same App 20220068818 - SONG; Inhyung ; et al.	2022-03-03
Semiconductor Package App 20220037294 - HWANG; HYEONJEONG ; et al.	2022-02-03
Semiconductor Pacakge App 20210398890 - KIM; DONGKYU ; et al.	2021-12-23
Semiconductor Package Method Of Fabricating Semiconductor Package And Method Of Fabricating Re-distribution Structure App 20210375642 - SUK; KYOUNG LIM	2021-12-02
Semiconductor package, method of fabricating semiconductor package, and method of fabricating redistribution structure Grant 11,152,309 - Suk October 19, 2	2021-10-19
Semiconductor package method of fabricating semiconductor package and method of fabricating re-distribution structure Grant 11,107,700 - Suk August 31, 2	2021-08-31
Semiconductor package and method of manufacturing the same Grant 11,101,231 - Kim , et al. August 24, 2	2021-08-24
Semiconductor Package And Method Of Fabricating The Same App 20210193636 - SUK; KYOUNG LIM ; et al.	2021-06-24
Method of fabricating semiconductor package Grant 11,018,108 - Min , et al. May 25, 2	2021-05-25
Semiconductor Package And Method Of Fabricating The Same App 20210111128 - SUK; KYOUNG LIM ; et al.	2021-04-15
Semiconductor package and method of fabricating the same Grant 10,964,643 - Suk , et al. March 30, 2	2021-03-30
Semiconductor Package And Method Of Manufacturing The Same App 20210074754 - JANG; JAEGWON ; et al.	2021-03-11
Semiconductor package and method of fabricating the same Grant 10,930,625 - Suk , et al. February 23, 2	2021-02-23
Semiconductor package and method of manufacturing the same Grant 10,879,292 - Jang , et al. December 29, 2	2020-12-29
Semiconductor package and method of fabricating the same Grant 10,879,187 - Suk , et al. December 29, 2	2020-12-29
Method Of Fabricating Semiconductor Package App 20200328175 - Min; Youn Ji ; et al.	2020-10-15
Method of fabricating semiconductor package Grant 10,741,518 - Min , et al. A	2020-08-11
Semiconductor Package And Method Of Manufacturing The Same App 20200219834 - KIM; Jong-youn ; et al.	2020-07-09
Semiconductor package and method of manufacturing the same Grant 10,622,320 - Kim , et al.	2020-04-14
Semiconductor Package Method Of Fabricating Semiconductor Package And Method Of Fabricating Re-distribution Structure App 20200111681 - SUK; KYOUNG LIM	2020-04-09
Semiconductor Package, Method Of Fabricating Semiconductor Package, And Method Of Fabricating Redistribution Structure App 20200111747 - SUK; Kyoung Lim	2020-04-09
Method Of Fabricating Semiconductor Package App 20200098716 - MIN; Youn Ji ; et al.	2020-03-26
Semiconductor Package And Method Of Fabricating The Same App 20200098694 - SUK; Kyoung Lim ; et al.	2020-03-26
Semiconductor Package And Method Of Manufacturing The Same App 20200091215 - JANG; JAEGWON ; et al.	2020-03-19
Semiconductor Package And Method Of Fabricating The Same App 20200083201 - SUK; KYOUNG LIM ; et al.	2020-03-12
Method of fabricating semiconductor package Grant 10,546,829 - Min , et al. Ja	2020-01-28
Semiconductor package and method of fabricating the same Grant 10,522,471 - Suk , et al. Dec	2019-12-31
Semiconductor Package And Method Of Fabricating The Same App 20190051607 - SUK; Kyoung Lim ; et al.	2019-02-14
Method Of Fabricating Semiconductor Package App 20190035756 - MIN; YOUN JI ; et al.	2019-01-31
Semiconductor Package And Method Of Manufacturing The Same App 20190027451 - KIM; Jong-youn ; et al.	2019-01-24
Semiconductor Package And Method Of Fabricating The Same App 20180366411 - SUK; KYOUNG LIM ; et al.	2018-12-20
Fiber, fiber aggregate and adhesive having the same Grant 8,486,318 - Kim , et al. July 16, 2	2013-07-16
Fiber, Fiber Aggregate And Adhesive Having The Same App 20120228805 - KIM; Deok Hoon ; et al.	2012-09-13
Fiber, Fiber Aggregate And Adhesive Having The Same App 20120231689 - Kim; Deok Hoon ; et al.	2012-09-13
Fiber, Fiber Aggregate And Adhesive Having The Same App 20120231260 - KIM; Deok Hoon ; et al.	2012-09-13

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