U.S. patent application number 13/398985 was filed with the patent office on 2012-08-23 for heat dissipating apparatus and method for improving the same.
This patent application is currently assigned to PEGATRON CORPORATION. Invention is credited to Yu-Wei Chang, Chao-Tsai Chung.
Application Number | 20120211203 13/398985 |
Document ID | / |
Family ID | 46651786 |
Filed Date | 2012-08-23 |
United States Patent
Application |
20120211203 |
Kind Code |
A1 |
Chang; Yu-Wei ; et
al. |
August 23, 2012 |
Heat Dissipating Apparatus and Method for Improving the Same
Abstract
A heat dissipating apparatus and a method for improving the same
are provided. The heat dissipating apparatus includes a heat pipe
including a heat-insulating section, a heat-absorbing part, and a
heat-dissipating part. The heat-absorbing part is connected with
one end of the heat-insulating section. The heat-absorbing part for
contacting a heat source is thinner than the heat-insulating
section. The heat-dissipating part is connected with the other end
of the heat-insulating section.
Inventors: |
Chang; Yu-Wei; (Taipei,
TW) ; Chung; Chao-Tsai; (Taipei, TW) |
Assignee: |
PEGATRON CORPORATION
Taipei
TW
|
Family ID: |
46651786 |
Appl. No.: |
13/398985 |
Filed: |
February 17, 2012 |
Current U.S.
Class: |
165/104.26 |
Current CPC
Class: |
H01L 2924/0002 20130101;
F28D 15/0233 20130101; F28D 15/0275 20130101; H01L 2924/0002
20130101; H01L 2924/00 20130101; H01L 23/427 20130101 |
Class at
Publication: |
165/104.26 |
International
Class: |
F28D 15/04 20060101
F28D015/04 |
Foreign Application Data
Date |
Code |
Application Number |
Feb 22, 2011 |
TW |
100105812 |
Claims
1. A heat dissipating apparatus for contacting a heat source,
comprising: a heat pipe including: a heat-insulating section; a
heat-absorbing part connected with one end of the heat-insulating
section, the heat-absorbing part for contacting the heat source
being thinner than the heat-insulating section; and a
heat-dissipating part connected with the other end of the
heat-insulating section.
2. The heat dissipating apparatus according to claim 1, wherein the
heat-absorbing part is a solid sheet.
3. The heat dissipating apparatus according to claim 1, further
comprising a fin disposed at the heat-dissipating part.
4. The heat dissipating apparatus according to claim 1, further
comprising a fin disposed at the heat-dissipating part.
5. The heat dissipating apparatus according to claim 1, wherein the
heat-absorbing part, the heat-insulating section, and the
heat-dissipating part are integrally formed.
6. The heat dissipating apparatus according to claim 1, further
comprising a fastening portion fastening the heat-absorbing part on
the heat source.
7. The heat dissipating apparatus according to claim 1, wherein the
heat-absorbing part is formed by punching one end of the
heat-insulating section.
8. A method for improving a heat dissipating apparatus, comprising
the following steps of: providing a heat pipe; punching one end of
the heat pipe to form a heat-absorbing part, the other end of the
heat pipe being a heat-dissipating part, a heat-insulating section
formed between the heat-dissipating part and the heat-absorbing
part, wherein the heat-absorbing part is thinner than the
heat-insulating section; and contacting a heat source with the
heat-absorbing part to cool the heat source.
9. The method for improving a heat dissipating apparatus according
to claim 8, wherein in the step of punching the heat pipe, the
heat-absorbing part forms a solid sheet.
10. The method for improving a heat dissipating apparatus according
to claim 8, after the step of providing the heat pipe, further
comprising a step of providing a fin disposed at the
heat-dissipating part.
11. The method for improving a heat dissipating apparatus according
to claim 10, wherein the fin is formed by extending the
heat-dissipating part.
12. The method for improving a heat dissipating apparatus according
to claim 8, after the step of allowing the heat-absorbing part to
contact the heat source, further comprising a step of providing a
fastening portion fastening the heat-absorbing part on the heat
source.
13. The method for improving a heat dissipating apparatus according
to claim 8, wherein the heat-absorbing part, the heat-insulating
section, and the heat-dissipating part are integrally formed.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This Non-provisional application claims priority under 35
U.S.C. .sctn.119(a) on Patent Application No(s). 100105812 filed in
Taiwan, Republic of China on Feb. 22, 2011, the entire contents of
which are hereby incorporated by reference.
BACKGROUND
[0002] 1. Technology Field
[0003] This invention relates to a heat dissipating apparatus and,
more particularly, to a heat dissipating apparatus and a method for
improving the same.
[0004] 2. Description of the Related Art
[0005] As technology develops, all the electronic apparatus tend
towards the thin-type. For example, the trend of a computer main
body or a notebook is to make it lighter and thinner. The thinner
electronic apparatus not only save the occupied space but also can
facilitate carry and operation for a user.
[0006] In addition, to improve the heat dissipation effect, most of
notebooks or other electronic apparatus have heat dissipating
modules. However, heat dissipation is a great problem when the
electronic apparatus such as a notebook tends towards the
thin-type. Generally, the heat dissipating module includes a copper
block for contacting a chip of the electronic apparatus, an elastic
sheet, a heat pipe, a fin, and a fan, and therefore the assembly
height of the heat dissipating elements including the chip, the
copper block, the elastic sheet, and the heat pipe is too high.
Containing space of the electronic apparatus has to be increased to
contain the assembled heat dissipating elements. Accordingly, the
volume of the electronic apparatus is increased, thus deviating
from the appeal of thin-type electronic apparatus.
[0007] To reduce the assembly height of the heat dissipating
module, eccentric technology may be used. That is, the copper block
for contacting the heat source extends to be connected with the
heat pipe, thus allowing the heat pipe not to be stacked over the
heat source. Although the height can be reduced, large thermal
resistance is generated between two extending end points of the
copper block, thus deteriorating the heat transfer efficiency of
the heat dissipating module.
SUMMARY
[0008] Accordingly, one embodiment of the invention provides a heat
dissipating apparatus for contacting a heat source. The heat
dissipating apparatus includes a heat pipe. The heat pipe includes
a heat-insulating section, a heat-absorbing part, and a
heat-dissipating part. The heat-absorbing part is connected with
one end of the heat-insulating section. The heat-absorbing part for
contacting the heat source is thinner than the heat-insulating
section. The heat-dissipating part is connected with the other end
of the heat-insulating section.
[0009] In one embodiment, the heat-absorbing part may be formed by
punching one end of the heat-insulating section thus to form a
solid sheet.
[0010] In one embodiment, the heat dissipating apparatus may
further include a fin disposed at the heat-dissipating part. The
fin may be formed by extending the heat-dissipating part.
[0011] In one embodiment, the heat dissipating apparatus may
further include a fastening portion fastening the heat-absorbing
part on the heat source.
[0012] The embodiment of the invention further provides a method
for improving a heat dissipating apparatus. The method includes the
following steps. A heat pipe is provided. One end of the heat pipe
is punched to form a heat-absorbing part, and the other end of the
heat pipe is a heat-dissipating part. A heat-insulating section is
formed between the heat-dissipating part and the heat-absorbing
part, and the heat-absorbing part is thinner than the
heat-insulating section. The heat-absorbing part is contact with a
heat source thus to cool the heat source.
[0013] In one embodiment, in the step of punching the heat pipe,
the heat-absorbing part may form a solid sheet.
[0014] In one embodiment, after the step of providing the heat
pipe, the method may further include a step of providing a fin
disposed at the heat-dissipating part. The fin may be formed by
extending the heat-dissipating part.
[0015] In one embodiment, after the step of allowing the
heat-absorbing part to contact the heat source, the method may
further include a step of providing a fastening portion fastening
the heat-absorbing part on the heat source.
[0016] According to the method for improving a heat dissipating
apparatus, one end of the heat-insulating section is punched to
form a heat-absorbing part, and the heat-absorbing part forms a
solid sheet, thus allowing the heat-absorbing part is thinner than
the heat-insulating section. Accordingly, the assembly height of
the heat dissipating apparatus can be reduced. Since the
heat-absorbing part is punched to form the solid sheet, the
strength of the heat-absorbing part can be enhanced, thus replacing
the conventional copper block while the heat dissipation efficiency
is not deteriorated.
[0017] These and other features, aspects, and advantages of the
present invention will become better understood with regard to the
following description, appended claims, and accompanying
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0018] FIG. 1 is a schematic diagram showing a heat pipe according
to one embodiment of the invention;
[0019] FIG. 2 is a schematic diagram showing a heat-absorbing part
and a heat-insulating section according to one embodiment of the
invention;
[0020] FIG. 3 is an exploded diagram showing a heat dissipating
apparatus according to one embodiment of the invention;
[0021] FIG. 4 is an overall structure diagram showing a heat
dissipating apparatus according to one embodiment of the invention;
and
[0022] FIG. 5 is a flow chart showing a method for improving a heat
dissipating apparatus according to one embodiment of the
invention.
DETAILED DESCRIPTION
[0023] FIG. 1 is a schematic diagram showing a heat pipe according
to one embodiment of the invention. A heat dissipating apparatus
according to the embodiment of the invention is used for contacting
a heat source. The heat dissipating apparatus includes a heat pipe
10 including a heat-insulating section 20, a heat-absorbing part
30, and a heat-dissipating part 40.
[0024] FIG. 2 is a schematic diagram showing a heat-absorbing part
and a heat-insulating section according to one embodiment of the
invention. Please refer to FIG. 1 and FIG. 2 together. The
heat-insulating section 20 is about strip-shaped. For example, in
the embodiment, the heat-insulating section 20 is flat. However,
the invention is not limited thereto. In other embodiments, the
heat-insulating section 20 can be cylindrical. Further, the
heat-insulating section 20 may be a tubular vacuum-sealed casing,
and the inner wall of the casing has capillary structure such as
sintered powder, groove structure, or mesh structure. Preferably,
the heat-insulating section 20 may be made of metal such as copper,
aluminum, or other material with high thermal conductivity.
[0025] The heat-absorbing part 30 is connected with one end of the
heat-insulating section 20. Preferably, the heat-absorbing part 30
is formed by punching one end of the heat-insulating section 20,
thus allowing the heat-absorbing part 30 to be thinner than the
heat-insulating section 20. In this embodiment, the heat-insulating
section 20 is flat, and one end of the heat-insulating section 20
is punched by an external force to compress the interior space of
the tubular casing until no interior space is remained, thus
forming a solid sheet. Accordingly, the heat-absorbing part 30 is
thin than the heat-insulating section 20.
[0026] The heat-dissipating part 40 is about strip-shaped, and it
is connected with the other end of the heat-insulating section 20.
Accordingly, one end of the heat-insulating section 20 is the
heat-absorbing part 30, and the other end is the heat-dissipating
part 40. In this embodiment, the heat-dissipating part 40 and the
heat-insulating section 20 are integrally formed, and the
aforementioned heat-absorbing part 30 and the heat-insulating
section 20 are also integrally formed. However, the invention is
not limited thereto. Further, the heat-dissipating part 40 may be
formed by bending the other end of the heat-insulating section 20.
The heat-dissipating part 40 and the heat-insulating section 20 are
at two sides of the bent portion, respectively, thus allowing the
heat-dissipating part 40 and the heat-insulating section 20 to form
an L-shaped object. In the embodiment, the heat dissipating
apparatus further includes fins 50 disposed at the heat-dissipating
part 40. The fins 50 may also be made of material with high thermal
conductivity, and they are arranged at regular intervals. The fins
50 may be formed by extending the heat-dissipating part 40.
However, the invention is not limited thereto.
[0027] FIG. 3 is an exploded diagram showing a heat dissipating
apparatus according to one embodiment of the invention. FIG. 4 is
an overall structure diagram showing a heat dissipating apparatus
according to one embodiment of the invention. Please refer to FIG.
3 and FIG. 4 together. A fastening portion 60 is rectangle. Part of
one surface of the fastening portion 60 is recessed thus to allow
the corresponding part of the opposite surface to be protruded.
Accordingly, the fastening portion 60 is U-shaped. The
heat-absorbing part 30 may be fastened at the recessed portion of
the U-shaped fastening portion 60. Further, the fastening portion
60 may extend to form brackets 61. In this embodiment, the number
of the bracket 61 may be four, and the four brackets 61 are at four
end points of the fastening portion 60, respectively, thus forming
a cross. Accordingly, the heat-absorbing part 30 can be fastened on
the heat source by the brackets 61. However, the invention is not
limited thereto. All the apparatus which fasten the heat-absorbing
part 30 are within the scope of this invention. Further, the
aforementioned heat source may be a chip of a computer or other
electronic elements. However, the invention is not limited
thereto.
[0028] FIG. 5 is a flow chart showing a method for improving a heat
dissipating apparatus according to one embodiment of the invention.
Please refer to FIG. 5. In this embodiment, the method includes the
following steps.
[0029] In step 501, a heat pipe is provided.
[0030] The heat pipe 10 (please refer to FIG. 1) is about
strip-shaped and is a bit flat. However, the invention is not
limited thereto. The heat pipe 10 can also be cylindrical. The heat
pipe 10 may be a tubular vacuum-sealed casing, and the inner wall
of the casing has capillary structure such as sintered powder,
groove structure, or mesh structure.
[0031] In step 502, one end of the heat pipe is punched to form a
heat-absorbing part, and the other end of the heat pipe is a
heat-dissipating part. A heat-insulating section is formed between
the heat-dissipating part and the heat-absorbing part. The
heat-absorbing part is thinner than the heat-insulating
section.
[0032] The heat pipe 10 mainly includes the heat-insulating section
20, the heat-absorbing part 30, and the heat-dissipating part 40.
One end of the heat pipe 10 forms the heat-absorbing part 30, while
the other end forms the heat-dissipating part 40, thus allowing the
heat-insulating section 20 to be located between the
heat-dissipating part 40 and the heat-absorbing part 30. Further,
preferably, the heat-absorbing part 30, the heat-insulating section
20, and the heat-dissipating part 40 are integrally formed.
However, the invention is not limited thereto. The heat-absorbing
part 30 is punched by an external force to compress the interior
space of the tubular casing until no interior space is remained,
thus forming a solid sheet. Accordingly, the heat-absorbing part 30
is thinner than the heat-insulating section 20.
[0033] Further, after the step 501 of providing the heat pipe, the
method further includes the step of providing a fin disposed at the
heat-dissipating part.
[0034] In this embodiment, the fins 50 are disposed at the
heat-dissipating part 40. The fins 50 can be made of material with
high thermal conductivity, and they are arranged at regular
intervals. The fins 50 may be formed by extending the
heat-dissipating part 40. However, the invention is not limited
thereto.
[0035] In step 503, the heat-absorbing part contacts a heat source
thus to cool the heat source.
[0036] In this embodiment, the heat-absorbing part 30 contacts the
heat source which may be a chip of a computer or other electronic
elements. However, the invention is not limited thereto. When the
heat-absorbing part 30 contacts the heat source, heat can be
transferred to the heat-dissipating part 40 thus to cool the heat
source.
[0037] In step 504, a fastening portion is provided to fasten the
heat-absorbing part on the heat source.
[0038] In this embodiment, the heat-absorbing part 30 can be
fastened at the recessed portion of the U-shaped fastening portion
60, and then the heat-absorbing part is fastened on the heat source
for contacting the heat source.
[0039] In the embodiments of the invention, the heat-insulating
section can be filled with some liquid such as water, alcohol,
acetone and so on. The liquid changes into vapor when the liquid is
heated at the heat-absorbing part, and thus heat is lost due to the
latent heat of the phase change of the vapor. The vapor can be
condensed to the liquid due to the exothermic reaction of the vapor
at the heat-dissipating part and the enhancement of the fin, and
further the liquid can circulate again by the gravity or the
capillary force in the tubular casing. The heat-absorbing part is
punched to form a flat solid sheet, and therefore the thickness of
the heat-absorbing part can be reduced and the strength can be
enhanced. Accordingly, the heat-absorbing part can replace the
conventional copper block while the heat dissipation efficiency is
not deteriorated. Further, the assembly height of the heat
dissipating apparatus can be reduced since the conventional copper
block is no longer needed.
[0040] Although the present invention has been described in
considerable detail with reference to certain preferred embodiments
thereof, the disclosure is not for limiting the scope of the
invention. Persons having ordinary skill in the art may make
various modifications and changes without departing from the scope
and spirit of the invention. Therefore, the scope of the appended
claims should not be limited to the description of the preferred
embodiments described above.
* * * * *