loadpatents
Patent applications and USPTO patent grants for CHUNG; CHAO-TSAI.The latest application filed is for "automotive electronic device".
Patent | Date |
---|---|
Automotive Electronic Device App 20210298203 - CHUNG; CHAO-TSAI ;   et al. | 2021-09-23 |
Vapor chamber and method for manufacturing the same Grant 8,671,570 - Liu , et al. March 18, 2 | 2014-03-18 |
Heat dissipation device and method Grant 8,356,656 - Chang , et al. January 22, 2 | 2013-01-22 |
Heat Dissipating Apparatus and Method for Improving the Same App 20120211203 - Chang; Yu-Wei ;   et al. | 2012-08-23 |
Vapor Chamber And Method For Manufacturing The Same App 20110174474 - Liu; Juei-Khai ;   et al. | 2011-07-21 |
Vapor Chamber And Manufacturing Method Thereof App 20110108142 - Liu; Juei-Khai ;   et al. | 2011-05-12 |
Fixing structure of fixing a thermal module Grant 7,903,420 - Chung , et al. March 8, 2 | 2011-03-08 |
Motherboard Integrated With Fan App 20100254084 - Chen; Kuan-Ying ;   et al. | 2010-10-07 |
Vapor Chamber App 20100065255 - Liu; Juei-Khai ;   et al. | 2010-03-18 |
Heat Dissipation Device and Method App 20100065254 - Chang; Yu-Wei ;   et al. | 2010-03-18 |
Electronic Apparatus App 20100061052 - CHUNG; CHAO TSAI | 2010-03-11 |
Fin, Thermal Module, And Method For Assembling The Same App 20100059207 - CHANG; YU WEI ;   et al. | 2010-03-11 |
Heat Dissipation Device App 20090052136 - Chung; Chao-Tsai | 2009-02-26 |
Fixing structure App 20090009971 - Chung; Chao-Tsai ;   et al. | 2009-01-08 |
Heat Dissipation Module App 20070163269 - Chung; Chao-Tsai ;   et al. | 2007-07-19 |
Manufacturing method of heat pipe App 20060225282 - Chung; Chao-Tsai | 2006-10-12 |
Heat dissipating apparatus Grant 7,002,804 - Chung , et al. February 21, 2 | 2006-02-21 |
Heat dissipating apparatus App 20040240181 - Chung, Chao-Tsai ;   et al. | 2004-12-02 |
Heat dissipation module Grant 6,819,564 - Chung , et al. November 16, 2 | 2004-11-16 |
Side exhaust heat dissipation module Grant 6,711,016 - Chung , et al. March 23, 2 | 2004-03-23 |
Side-exhaust heat dissipation module App 20030210525 - Chung, Chao-Tsai ;   et al. | 2003-11-13 |
Heat dissipation module App 20030202327 - Chung, Chao-Tsai ;   et al. | 2003-10-30 |
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