U.S. patent application number 13/248045 was filed with the patent office on 2012-01-26 for semiconductor package.
Invention is credited to Nan-Jang Chen, Yau-Wai Wong.
Application Number | 20120018862 13/248045 |
Document ID | / |
Family ID | 42171334 |
Filed Date | 2012-01-26 |
United States Patent
Application |
20120018862 |
Kind Code |
A1 |
Chen; Nan-Jang ; et
al. |
January 26, 2012 |
SEMICONDUCTOR PACKAGE
Abstract
A semiconductor package includes a die pad; a semiconductor die
mounted on the die pad; a plurality of leads in a first horizontal
plane disposed along peripheral edges of the die pad; a ground bar
downset from the first horizontal plane to a second horizontal
plane between the leads and the die pad; a plurality of downset tie
bars connecting the ground bar with the die pad; a plurality of
ground wires bonding to both of the ground bar and the die pad; and
a molding compound at least partially encapsulating the die pad,
inner ends of the leads such that bottom surface of the die pad is
exposed within the molding compound.
Inventors: |
Chen; Nan-Jang; (Hsinchu
City, TW) ; Wong; Yau-Wai; (Hsinchu County,
TW) |
Family ID: |
42171334 |
Appl. No.: |
13/248045 |
Filed: |
September 29, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
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12273559 |
Nov 19, 2008 |
8058720 |
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13248045 |
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Current U.S.
Class: |
257/670 ;
257/E23.052 |
Current CPC
Class: |
H01L 2224/48253
20130101; H01L 2224/48257 20130101; H01L 2924/01006 20130101; H01L
2224/49113 20130101; H01L 2224/49433 20130101; H01L 23/49503
20130101; H01L 2924/10162 20130101; H01L 2224/48247 20130101; H01L
2224/05554 20130101; H01L 23/49551 20130101; H01L 2224/4911
20130101; H01L 2924/01047 20130101; H01L 2924/19107 20130101; H01L
2224/48091 20130101; H01L 2924/01033 20130101; H01L 2924/01014
20130101; H01L 2924/181 20130101; H01L 2924/00014 20130101; H01L
2924/30107 20130101; H01L 2924/01078 20130101; H01L 23/49541
20130101; H01L 24/49 20130101; H01L 24/48 20130101; H01L 2924/01082
20130101; H01L 2224/4943 20130101; H01L 2224/49109 20130101; H01L
2224/48091 20130101; H01L 2924/00014 20130101; H01L 2224/4911
20130101; H01L 2224/48247 20130101; H01L 2924/19107 20130101; H01L
2224/49109 20130101; H01L 2224/48247 20130101; H01L 2924/00
20130101; H01L 2924/00014 20130101; H01L 2224/45099 20130101; H01L
2924/00014 20130101; H01L 2224/05599 20130101; H01L 2924/181
20130101; H01L 2924/00012 20130101; H01L 2224/49433 20130101; H01L
2224/48247 20130101; H01L 2924/00012 20130101 |
Class at
Publication: |
257/670 ;
257/E23.052 |
International
Class: |
H01L 23/495 20060101
H01L023/495 |
Claims
1. A semiconductor package, comprising: a die pad; a semiconductor
die mounted on the die pad; a plurality of leads in a first
horizontal plane disposed along peripheral edges of the die pad; a
ground bar downset from the first horizontal plane to a second
horizontal plane between the leads and the die pad; a plurality of
downset tie bars connecting the ground bar with the die pad; a set
of first ground wires directly electrically connected to the
semiconductor die and the ground bar; a set of second ground wires
directly electrically connected to the semiconductor die and the
die pad; a molding compound at least partially encapsulating the
die pad, inner ends of the leads such that bottom surface of the
die pad is exposed within the molding compound; a plurality of
signal wires provided to connect signal pads on the semiconductor
die to the leads; and a plurality of power wires provided to
connect power pads on the semiconductor die to the leads.
2. The semiconductor package according to claim 1 wherein the first
ground wires are analog ground and the second ground wires are
digital ground.
3. The semiconductor package according to claim 2 wherein the first
ground wires are directly bonded to the ground bar and the second
ground wires are directly bonded to the die pad.
4. The semiconductor package according to claim 3 wherein the
second ground wires are bonded to a peripheral groove partially
etched into the die pad.
5. The semiconductor package according to claim 2 wherein the first
and second ground wires are all bonded to the ground bar, and
wherein at least one discontinuity is provided in the ground bar to
separate the first ground wires from the second ground wires.
6. The semiconductor package according to claim 1 wherein the
ground bar has T shape, U shape, .PI. shape, L shape, serpentine
shape or irregular shapes.
7. The semiconductor package according to claim 1 wherein a
plurality of bonding wires extend between the die pad and the
ground bar.
8. A semiconductor package, comprising: a die pad; a semiconductor
die mounted on the die pad; a plurality of leads in a first
horizontal plane disposed along peripheral edges of the die pad; a
first ground bar downset from the first horizontal plane to a
second horizontal plane; a second ground bar flush with and
separated from the leads; a first downset tie bar connecting the
first ground bar to the die pad; a second downset tie bar
connecting the second ground bar with the first ground bar; a
plurality of first ground wires for conveying digital ground
directly and electrically connected to the first ground bar; a
plurality of second ground wires for conveying analog ground
directly and electrically connected to the second ground bar; and a
molding compound at least partially encapsulating the die pad,
inner ends of the leads such that bottom surface of the die pad is
exposed within the molding compound; wherein a plurality of third
bonding wires are provided to connect signal or power pads to the
leads and a plurality of third bonding wires are provided to
connect signal or power pads to the leads.
9. The semiconductor package according to claim 8 wherein a
plurality of fourth bonding wires are provided to connect the
semiconductor die with the die pad.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This is a continuation application of U.S. patent
application Ser. No. 12/273,559 filed Nov. 19, 2008, which is
incorporated herein by reference.
BACKGROUND OF THE INVENTION
[0002] 1. Field of the Invention
[0003] This invention relates generally to packaging of
semiconductors, and in particular, to a leadframe semiconductor
package.
[0004] 2. Description of the Prior Art
[0005] Leadframe semiconductor packages are well known in the art.
A conventional leadframe typically includes a plurality of metal
leads temporarily held together in a planar arrangement about a
central region during package manufacture by a rectangular frame. A
die pad is supported in the central region by a plurality of tie
bars that attach to the frame. The leads extend from a first end
integral with the frame to an opposite second end adjacent to, but
spaced apart from, the die pad.
[0006] During package manufacture, a semiconductor die is attached
to the die pad. Wire-bonding pads on the die are then connected to
selected ones of the inner ends of the leads by fine, conductive
bonding wires to convey power, ground or signals between the die
and the leads. A protective body of an epoxy resin is molded over
the assembly to enclose and seal the die, the inner ends of the
leads, and the wire bonds against harmful environmental elements.
The rectangular frame and the outer ends of the leads are left
exposed outside of the body, and after molding, the frame is cut
away from the leads and discarded, and the outer ends of the leads
are appropriately formed for interconnection of the package with an
external printed circuit board.
[0007] One known type of the leadframe semiconductor packages is
the so-called exposed die pad (E-pad) leadframe package that
exposes the bottom surface of the die pad to the outside of the
encapsulation body. The exposed die pad acts as a heat sink and can
improve the heat-dissipation efficiency. Typically, the exposed die
pad is electrically connected to a ground plane of the external
printed circuit board.
[0008] It has been found that the E-pad leadframe package is
subject to attacks of moisture. To avoid reliability problems due
to moisture attacks and delamination along the plastic body-metal
interface, the ground wires extended from the ground pads of the
semiconductor die are not directly bonded onto the surface of the
die pad, but instead the ground wires are bonded to a rectangular
ring shaped ground bridge bar that encircles the die pad at
different downset planes. Typically, the ground bridge bar is
supported by tie bars that connected with the die pad.
[0009] However, the prior art leadframe package with such ground
bridge bar configuration has a shortcoming of that the analog and
digital ground wires randomly bonded together onto the ground
bridge bar can result in noise or ground coupling, which is also
known as water wave effects in TV systems. Another shortcoming is
that the ground bridge bar is vulnerable to twist and deform,
leading to poor bonding strength. It is therefore desirable to
provide an improved leadframe package structure that may eliminate
the aforesaid digital and analog ground coupling and the water wave
effects in TV systems.
SUMMARY OF THE INVENTION
[0010] It is one objective of this invention to provide an improved
semiconductor package structure with improved performance and
reduced ground coupling.
[0011] To these ends, according to one aspect of the present
invention, there is provided a semiconductor package including a
die pad; a semiconductor die mounted on the die pad; a plurality of
leads in a first horizontal plane disposed along peripheral edges
of the die pad; a ground bar downset from the first horizontal
plane to a second horizontal plane between the leads and the die
pad; a plurality of downset tie bars connecting the ground bar with
the die pad; a plurality of ground wires bonding to both of the
ground bar and the die pad; and a molding compound at least
partially encapsulating the die pad, inner ends of the leads such
that bottom surface of the die pad is exposed within the molding
compound.
[0012] In one aspect, a semiconductor package includes a die pad; a
semiconductor die mounted on the die pad; a plurality of leads in a
first horizontal plane disposed along peripheral edges of the die
pad; a first ground bar downset from the first horizontal plane to
a second horizontal plane; a second ground bar flush with the
leads; a first downset tie bar connecting the first ground bar to
the die pad; a second downset tie bar connecting the second ground
bar with the first ground bar; a plurality of first ground wires
for conveying digital ground bonding to the first ground bar; a
plurality of second ground wires for conveying analog ground
bonding to the second ground bar; and a molding compound at least
partially encapsulating the die pad, inner ends of the leads such
that bottom surface of the die pad is exposed within the molding
compound.
[0013] These and other objectives of the present invention will no
doubt become obvious to those of ordinary skill in the art after
reading the following detailed description of the preferred
embodiment that is illustrated in the various figures and
drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The accompanying drawings are included to provide a further
understanding of the invention, and are incorporated in and
constitute a part of this specification. The drawings illustrate
embodiments of the invention and, together with the description,
serve to explain the principles of the invention. In the
drawings:
[0015] FIG. 1 is a top view of a semiconductor package according to
one embodiment of the present invention;
[0016] FIG. 2 is a schematic, cross-sectional view of the
semiconductor package of FIG. 1;
[0017] FIG. 3 shows some examples of the separated ground bar
segments according to this invention;
[0018] FIG. 4 is a schematic, cross-sectional view of a
semiconductor package in accordance with another embodiment of this
invention; and
[0019] FIG. 5 is a partial plan view of the semiconductor package
in FIG. 4.
DETAILED DESCRIPTION
[0020] The technology trend in the consumer electronics can be
summarized as more functionalities in a smaller geometry with low
cost. The exposed pad low-profile quad flat package (E-pad LQFP) is
a low cost solution for multimedia chips, but its disadvantages are
limited pin count and worse electrical characteristics.
[0021] As previously mentioned, one problem relates to delamination
of the leadframe components from the plastic package body, and the
attendant problem of penetration of the package by moisture. In
particular, the various parts of a semiconductor package experience
greatly different amounts of thermal expansion and contraction with
temperature changes due to the relatively large differences in the
coefficients of thermal expansion of their respective materials,
e.g., metal, epoxy resin, and silicon. As a result, the leadframe
components can become delaminated from the package body with
temperature cycling of the package during manufacture or
operation.
[0022] Where delamination occurs at a boundary of the package body,
a microscopic crack is created for the penetration of the package
by moisture. The moisture can corrode metallization present in its
path, resulting in subsequent current leakage through the corrosive
path. To avoid reliability problems due to moisture attacks and
delamination, the ground wires are typically not bonded onto the
surface of the die pad. Instead, the ground wires, either digital
ground wires or analog ground wires, are bonded to a ground bridge
bar that encircles the die pad at different downset planes.
However, such configuration results in ground signal coupling
noise. The present invention addresses this problem.
[0023] One or more implementations of the present invention will
now be described with reference to the attached drawings, wherein
like reference numerals are used to refer to like elements
throughout, and wherein the illustrated structures are not
necessarily drawn to scale.
[0024] FIG. 1 is a top view of a semiconductor package according to
one embodiment of the present invention. FIG. 2 is a schematic,
cross-sectional view of the semiconductor package of FIG. 1. As
shown in FIG. 1 and FIG. 2, according to the first embodiment of
this invention, a semiconductor package 10 comprises a
semiconductor die 20 mounted onto the first surface 110a of a die
pad 110, a plurality of leads 120 in a first horizontal plane
disposed along the peripheral edges of the die pad 110, a ground
bar 130 downset from the first horizontal plane to a second
horizontal plane between inner ends 120a of the leads 120 and the
die pad 110, four connecting bars 142 extending outward from four
corners of the die pad 110, and a plurality of downset tie bars 144
connecting the ground bar 130 with the die pad 110. A molding
compound 30 at least partially encapsulates the die pad 110, the
inner ends 120a of the leads 120 such that the bottom surface 110b
of the die pad 110 is exposed within the molding compound 30.
[0025] According to this embodiment, a peripheral groove 112 is
etched into the first surface 110a of the die pad 110 and is
disposed around the semiconductor die 20. A plating layer 114 such
as silver or noble metals may be formed within the peripheral
groove 112 for wire bonding purposes. The peripheral groove 112 can
increase the coupling strength. To securely lock the leadframe
components to the plastic body of the package, thereby effectively
reducing both the amount of delamination of the leadframe from the
body and the resulting penetration of the body by moisture, the
bottom surface 110b of the die pad 110 may be partially etched
along the periphery of the die pad 110 to form a step 116.
[0026] The semiconductor die 20 comprises a plurality of bonding
pads 202 on its active surface 20a. The bonding pads 202 further
comprise a plurality of first ground pads 202a and a plurality of
second ground pads 202b. According to this embodiment, the
plurality of first ground pads 202a are sensitive analog ground
pads, while the plurality of second ground pads 202b are digital
ground pads. In another embodiment, the plurality of first ground
pads 202a are digital ground pads, while the plurality of second
ground pads 202b are sensitive analog ground pads.
[0027] A plurality of first bonding wires 212 are provided to
connect the respective first ground pads 202a to the ground bar
130. A plurality of second bonding wires 214 are provided to
connect the respective second ground pads 202b to the plated top
surface of the peripheral groove 112. A plurality of third bonding
wires 216 are provided to connect the bond pads 202c such as signal
or power pads to the leads 120. According to this embodiment, a
plurality of fourth bonding wires 218 are provided to connect the
die pad 110 with the ground bar 130 in order to reduce the ground
inductance. By separating the digital ground path from the analog
ground path, the sensitive analog ground signal is not interfered
by the digital ground signal during operation and the water wave
effect can be eliminated.
[0028] The ground bar 130 may have a continuous ring shape.
However, the present invention is not limited thereto.
Discontinuities 132 may be provided in the ground bar 130, thereby
forming separated ground bar segments 130a and 130b. Each of the
ground bar segments 130a and 130b are supported by respective tie
bars 144. A plurality of fifth bonding wires 220 are provided to
connect the second ground pads 202b to the ground bar segment 130b.
A plurality of sixth bonding wires 222 are provided to connect the
first ground pads 202a to the ground bar segment 130a. Since the
digital ground path is separated from the analog ground path by
wire bonding to separate ground bar segments 130a and 130b, the
sensitive analog ground signal is not interfered by the digital
ground signal.
[0029] The separated ground bar segments may have various shapes,
for example, T shape, U shape, .PI. shape, L shape, serpentine
shape or irregular shapes. FIG. 3 shows some examples of the
separated ground bar segments according to this invention. It is
one germane feature of the present invention that the bonding wires
for conveying digital ground signal are boned to one of the
separated ground bar segments, while the bonding wires for
conveying analog ground signal are bonded to the other. In doing
so, the interference between the digital ground and the analog
ground is avoided.
[0030] FIG. 4 is a schematic, cross-sectional view of a
semiconductor package 10a in accordance with another embodiment of
this invention. FIG. 5 is a partial plan view of the semiconductor
package in FIG. 4. As shown in FIG. 4 and FIG. 5, likewise, the
semiconductor package 10a comprises a semiconductor die 20 mounted
onto the first surface 110a of a die pad 110, a plurality of leads
120 in a first horizontal plane disposed along the peripheral edges
of the die pad 110, a ground bar 320 downset from the first
horizontal plane to a second horizontal plane between inner ends
120a of the leads 120 and the die pad 110, and a plurality of
downset tie bars 144a connecting the ground bar 320 with the die
pad 110.
[0031] An extended ground bar 330 that is flush with the plurality
of leads 120 in the first horizontal plane is provided between the
inner ends 120a of the leads 120 and the ground bar 320. The
extended ground bar 330 is supported by the downset tie bar 144b
that connects to the ground bar 320. A molding compound 30 at least
partially encapsulates the die pad 110, the inner ends 120a of the
leads 120 such that the bottom surface 110b of the die pad 110 is
exposed within the molding compound 30.
[0032] To securely lock the leadframe components to the plastic
body of the package, thereby effectively reducing both the amount
of delamination of the leadframe from the body and the resulting
penetration of the body by moisture, the bottom surface 110b of the
die pad 110 may be partially etched along the periphery of the die
pad 110 to form a step 116. In addition, a peripheral groove may be
etched into the first surface 110a of the die pad 110 to improve
the interlock between the molding compound 30 and the die pad
110.
[0033] The semiconductor die 20 comprises a plurality of bonding
pads 202 on its active surface 20a. The bonding pads 202 further
comprise a plurality of first ground pads 202a and a plurality of
second ground pads 202b. According to this embodiment, the
plurality of first ground pads 202a are digital ground pads, while
the plurality of second ground pads 202b are sensitive analog
ground pads. A plurality of first bonding wires 312 are provided to
connect the respective first ground pads 202a to the ground bar
320. A plurality of second bonding wires 314 are provided to
connect the respective second ground pads 202b to the extended
ground bar 330. A plurality of third bonding wires 316 are provided
to connect the bond pads 202c such as signal or power pads to the
leads 120. Optionally, a plurality of fourth bonding wires 318 are
provided to connect the die pad 110 with the die 20. By separating
the digital ground path from the analog ground path, the sensitive
analog ground signal is not interfered by the digital ground signal
during operation and the water wave effect can be eliminated.
[0034] Those skilled in the art will readily observe that numerous
modifications and alterations of the device and method may be made
while retaining the teachings of the invention. Accordingly, the
above disclosure should be construed as limited only by the metes
and bounds of the appended claims.
* * * * *