Chen; Nan-Jang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Nan-Jang.The latest application filed is for "printed circuit board design for high speed application".
Company Profile
3.35.36
- Chen; Nan-Jang - Hsinchu TW
- Chen; Nan-Jang - Hsinchu City TW
- Chen; Nan-Jang - Taichung TW
Patent Activity
| Patent | Date |
|---|---|
| Printed Circuit Board Design For High Speed Application App 20200352023 - Chen; Nan-Jang | 2020-11-05 |
| Printed circuit board design for high speed application Grant 10,772,191 - Chen Sep | 2020-09-08 |
| Printed Circuit Board Design For High Speed Application App 20200022251 - Chen; Nan-Jang | 2020-01-16 |
| Printed circuit board design for high speed application Grant 10,485,095 - Chen Nov | 2019-11-19 |
| SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern Grant 10,426,035 - Chen , et al. Sept | 2019-09-24 |
| Semiconductor package Grant 10,211,134 - Chen Feb | 2019-02-19 |
| Semiconductor package Grant 10,163,767 - Chen Dec | 2018-12-25 |
| Sgs Or Gsgsg Pattern For Signal Transmitting Channel, And Pcb Assembly, Chip Package Using Such Sgs Or Gsgsg Pattern App 20180206339 - Chen; Nan-Jang ; et al. | 2018-07-19 |
| Early power compensation method and apparatus thereof Grant 10,019,048 - Chen July 10, 2 | 2018-07-10 |
| Printed Circuit Board Design For High Speed Application App 20180146543 - Chen; Nan-Jang | 2018-05-24 |
| SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern Grant 9,955,581 - Chen , et al. April 24, 2 | 2018-04-24 |
| Printed circuit board design for high speed application Grant 9,949,360 - Chen April 17, 2 | 2018-04-17 |
| Semiconductor Package App 20180096922 - Chen; Nan-Jang | 2018-04-05 |
| Semiconductor Package App 20180019192 - Chen; Nan-Jang | 2018-01-18 |
| Semiconductor package Grant 9,852,966 - Chen December 26, 2 | 2017-12-26 |
| Semiconductor package Grant 9,806,053 - Chen October 31, 2 | 2017-10-31 |
| Printed circuit board Grant 9,681,554 - Chen June 13, 2 | 2017-06-13 |
| Semiconductor Package App 20160300812 - Chen; Nan-Jang | 2016-10-13 |
| Semiconductor Package App 20160293521 - Chen; Nan-Jang | 2016-10-06 |
| Early Power Compensation Method And Apparatus Thereof App 20160246363 - Chen; Nan-Jang | 2016-08-25 |
| Semiconductor package Grant 9,406,595 - Chen August 2, 2 | 2016-08-02 |
| Semiconductor package Grant 9,392,696 - Chen July 12, 2 | 2016-07-12 |
| Sgs Or Gsgsg Pattern For Signal Transmitting Channel, And Pcb Assembly, Chip Package Using Such Sgs Or Gsgsg Pattern App 20160120034 - Chen; Nan-Jang ; et al. | 2016-04-28 |
| SGS or GSGSG pattern for signal transmitting channel, and PCB assembly, chip package using such SGS or GSGSG pattern Grant 9,269,653 - Chen , et al. February 23, 2 | 2016-02-23 |
| Semiconductor Package App 20150351245 - Chen; Nan-Jang | 2015-12-03 |
| Semiconductor package Grant 9,147,664 - Chen September 29, 2 | 2015-09-29 |
| Semiconductor Package App 20150102495 - Chen; Nan-Jang | 2015-04-16 |
| Semiconductor Package App 20150091147 - Chen; Nan-Jang | 2015-04-02 |
| Semiconductor package Grant 8,941,221 - Chen January 27, 2 | 2015-01-27 |
| Sgs Or Gsgsg Pattern For Signal Transmitting Channel, And Pcb Assembly, Chip Package Using Such Sgs Or Gsgsg Pattern App 20140002935 - Chen; Nan-Jang ; et al. | 2014-01-02 |
| Leadframe package for high-speed data rate applications Grant 8,525,310 - Chen , et al. September 3, 2 | 2013-09-03 |
| Semiconductor Package App 20130082371 - Chen; Nan-Jang | 2013-04-04 |
| Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product Grant 8,350,380 - Chen , et al. January 8, 2 | 2013-01-08 |
| Semiconductor chip package including a lead frame Grant 8,288,848 - Chen October 16, 2 | 2012-10-16 |
| Quad flat package with exposed common electrode bars Grant 8,283,757 - Chen , et al. October 9, 2 | 2012-10-09 |
| Printed Circuit Board Design For High Speed Application App 20120228006 - CHEN; Nan-Jang | 2012-09-13 |
| Semiconductor chip package Grant 8,212,343 - Chen July 3, 2 | 2012-07-03 |
| Electronic apparatus Grant 8,213,206 - Chen July 3, 2 | 2012-07-03 |
| Printed Circuit Board App 20120111623 - CHEN; Nan-Jang ; et al. | 2012-05-10 |
| Method For Manufacturing Leadframe, Packaging Method For Using The Leadframe And Semiconductor Package Product App 20120104588 - Chen; Nan-Jang ; et al. | 2012-05-03 |
| Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product Grant 8,124,461 - Chen , et al. February 28, 2 | 2012-02-28 |
| Printed circuit board Grant 8,120,927 - Chen , et al. February 21, 2 | 2012-02-21 |
| Semiconductor chip package Grant 8,106,490 - Chen January 31, 2 | 2012-01-31 |
| Semiconductor Package App 20120018862 - Chen; Nan-Jang ; et al. | 2012-01-26 |
| Semiconductor Chip Package App 20110291250 - Chen; Nan-Jang | 2011-12-01 |
| Semiconductor package Grant 8,058,720 - Chen , et al. November 15, 2 | 2011-11-15 |
| Leadframe Package For High-speed Data Rate Applications App 20110248394 - Chen; Nan-Jang ; et al. | 2011-10-13 |
| Semiconductor chip package Grant 8,018,037 - Chen September 13, 2 | 2011-09-13 |
| Electronic Apparatus App 20110176345 - Chen; Nan-Jang | 2011-07-21 |
| Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof Grant 7,932,586 - Chen , et al. April 26, 2 | 2011-04-26 |
| Semiconductor chip package Grant 7,875,965 - Chen , et al. January 25, 2 | 2011-01-25 |
| Semiconductor Chip Package App 20110012241 - CHEN; Nan-Jang | 2011-01-20 |
| Semiconductor Chip Package App 20110012244 - Chen; Nan-Jang | 2011-01-20 |
| Semiconductor chip package Grant 7,834,436 - Chen November 16, 2 | 2010-11-16 |
| Leadframe with extended pad segments between leads and die pad, and leadframe package using the same Grant 7,834,435 - Chen , et al. November 16, 2 | 2010-11-16 |
| Semiconductor Chip Package App 20100264533 - Chen; Nan-Jang | 2010-10-21 |
| Quad Flat Package With Exposed Common Electrode Bars App 20100207260 - Chen; Nan-Cheng ; et al. | 2010-08-19 |
| Semiconductor Package App 20100123226 - Chen; Nan-Jang ; et al. | 2010-05-20 |
| Printed Circuit Board App 20090251876 - Chen; Nan-Jang ; et al. | 2009-10-08 |
| Printed Circuit Board App 20090253278 - CHEN; Nan-Jang | 2009-10-08 |
| Semiconductor Chip Package App 20090236709 - Chen; Nan-Jang ; et al. | 2009-09-24 |
| Semiconductor Chip Package App 20090236706 - Chen; Nan-Jang | 2009-09-24 |
| Quad Flat Package With Exposed Common Electrode Bars App 20090020859 - CHEN; Nan-Cheng ; et al. | 2009-01-22 |
| Leadframe Package App 20080290486 - Chen; Nan-Jang ; et al. | 2008-11-27 |
| Method For Manufacturing Leadframe, Packaging Method For Using The Leadframe And Semiconductor Package Product App 20080211068 - Chen; Nan-Jang ; et al. | 2008-09-04 |
| Leadframe On Heat Sink (lohs) Semiconductor Packages And Fabrication Methods Thereof App 20080142937 - Chen; Nan-Jang ; et al. | 2008-06-19 |
| Quad flat non-leaded semiconductor package and method of fabricating the same Grant 6,703,691 - Chen , et al. March 9, 2 | 2004-03-09 |
| Quad flat non-leaded semiconductor package and method of fabricating the same App 20030042583 - Chen, Nan-Jang ; et al. | 2003-03-06 |
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