U.S. patent application number 13/025676 was filed with the patent office on 2011-12-22 for identifying defective semiconductor components on a wafer using thermal imaging.
This patent application is currently assigned to Broadcom Corporation. Invention is credited to Arya Reza BEHZAD, Michael Boers, Jesus Alfonso Castaneda, Ahmadreza Rofougaran, Sam Ziqun Zhao.
Application Number | 20110309842 13/025676 |
Document ID | / |
Family ID | 45328082 |
Filed Date | 2011-12-22 |
United States Patent
Application |
20110309842 |
Kind Code |
A1 |
BEHZAD; Arya Reza ; et
al. |
December 22, 2011 |
Identifying Defective Semiconductor Components on a Wafer Using
Thermal Imaging
Abstract
Methods and apparatus are disclosed to simultaneously,
wirelessly test semiconductor components formed on a semiconductor
wafer. The semiconductor components transmit respective outcomes of
a self-contained testing operation to wireless automatic test
equipment via a common communication channel. Multiple receiving
antennas observe the outcomes from multiple directions in three
dimensional space. The wireless automatic test equipment determines
whether one or more of the semiconductor components operate as
expected and, optionally, may use properties of the three
dimensional space to determine a location of one or more of the
semiconductor components. The wireless testing equipment may
additionally determine performance of the semiconductor components
by detecting infrared energy emitted, transmitted, and/or reflected
by the semiconductor wafer before, during, and/or after a
self-contained testing operation.
Inventors: |
BEHZAD; Arya Reza; (Poway,
CA) ; Rofougaran; Ahmadreza; (Newport Coast, CA)
; Zhao; Sam Ziqun; (Irvine, CA) ; Castaneda; Jesus
Alfonso; (Los Angeles, CA) ; Boers; Michael;
(Irvine, CA) |
Assignee: |
Broadcom Corporation
Irvine
CA
|
Family ID: |
45328082 |
Appl. No.: |
13/025676 |
Filed: |
February 11, 2011 |
Related U.S. Patent Documents
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Application
Number |
Filing Date |
Patent Number |
|
|
61355226 |
Jun 16, 2010 |
|
|
|
61429277 |
Jan 3, 2011 |
|
|
|
Current U.S.
Class: |
324/501 |
Current CPC
Class: |
H01L 23/544 20130101;
H01L 2223/54433 20130101; H01L 2924/00 20130101; G01R 31/3025
20130101; H01L 2924/0002 20130101; G01R 31/319 20130101; G01R
31/2834 20130101; H01L 2924/0002 20130101; Y10T 29/49121 20150115;
G01R 31/311 20130101 |
Class at
Publication: |
324/501 |
International
Class: |
G01R 31/00 20060101
G01R031/00 |
Claims
1. A wireless automatic test equipment for simultaneously testing a
performance of a plurality of semiconductor components formed onto
a semiconductor wafer, comprising: a thermal imaging module
configured to observe infrared energy produced by the semiconductor
wafer to provide an observed thermal infrared energy.
2. The wireless automatic test equipment of claim 1, wherein the
thermal imaging module comprises: a thermal imaging device
configured to detect the infrared energy of the electromagnetic
spectrum from the semiconductor wafer.
3. The wireless automatic test equipment of claim 1, further
comprising: a thermogram processor configured to determine a
semiconductor wafer thermogram based upon the observed thermal
infrared energy and to isolate a plurality of semiconductor
component thermograms from the semiconductor wafer thermogram.
4. The wireless automatic test equipment of claim 3, wherein the
thermogram processor is further configured to compare each of the
plurality of semiconductor component thermograms to plurality of
predetermined semiconductor component thermograms to provide a
performance measure from among a plurality of performance
measurements.
5. The wireless automatic test equipment of claim 4, further
comprising: a testing processor configured to determine a first
group of semiconductor components from among the plurality of
semiconductor components that operate as expected based upon the
plurality of performance measurements.
6. The wireless automatic test equipment of claim 5, further
comprising: a testing processor configured to determine a second
group of semiconductor components from among the plurality of
semiconductor components that operate unexpectedly based upon the
plurality of performance measurements.
7. The wireless automatic test equipment of claim 3, wherein the
thermogram processor is further configured to determine a first
group of semiconductor components from among the plurality of
semiconductor components that operate as expected based upon the
plurality of performance measurements.
8. The wireless automatic test equipment of claim 7, wherein the
thermogram processor is further configured to determine a second
group of semiconductor components from among the plurality of
semiconductor components that operate unexpectedly based upon the
plurality of performance measurements.
9. The wireless automatic test equipment of claim 3, wherein the
plurality of predetermined semiconductor component thermograms are
assigned to a corresponding indicia of performance from among a
plurality of indices of performance.
10. The wireless automatic test equipment of claim 9, wherein the
thermogram processor is further configured to compare each of the
plurality of semiconductor component thermograms to plurality of
predetermined semiconductor component thermograms and to assign the
corresponding indicia of performance that is assigned to a
corresponding one of the plurality of predetermined semiconductor
component thermograms that closely approximates each of the
plurality of semiconductor component thermograms.
11. A method for simultaneously testing a performance of a
plurality of semiconductor components formed onto a semiconductor
wafer, comprising: (a) observing infrared energy produced by the
semiconductor wafer to provide an observed thermal infrared
energy.
12. The method of claim 11, wherein step (a) comprises: (a)
observing, by a thermal imaging device, the infrared energy of an
electromagnetic spectrum produced by the semiconductor wafer.
13. The method of claim 11, further comprising: (b) determining a
semiconductor wafer thermogram based upon the observed thermal
infrared energy; and (c) isolating a plurality of semiconductor
component thermograms from the semiconductor wafer thermogram.
14. The method of claim 13, further comprising: (d) comparing each
of the plurality of semiconductor component thermograms to
plurality of predetermined semiconductor component thermograms to
provide a performance measure from among a plurality of performance
measurements.
15. The method of claim 14, further comprising: (e) determining a
first group of semiconductor components from among the plurality of
semiconductor components that operate as expected based upon the
plurality of performance measurements.
16. The method of claim 15, further comprising: (f) determining a
second group of semiconductor components from among the plurality
of semiconductor components that operate unexpectedly based upon
the plurality of performance measurements.
17. The method of claim 13, wherein the plurality of predetermined
semiconductor component thermograms are assigned to a corresponding
indicia of performance from among a plurality of indices of
performance.
18. The method of claim 17, further comprising: (d) comparing each
of the plurality of semiconductor component thermograms to
plurality of predetermined semiconductor component thermograms; and
(e) assigning the corresponding indicia of performance that is
assigned to a corresponding one of the plurality of predetermined
semiconductor component thermograms that closely approximates each
of the plurality of semiconductor component thermograms.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] The present application claims the benefit of U.S.
Provisional Patent Appl. Nos. 61/355,226, filed Jun. 16, 2010, and
61/429,277, filed on Jan. 3, 2011, each of which is incorporated
herein by reference in its entirety.
BACKGROUND
[0002] 1. Field of Invention
[0003] The present invention relates generally to testing of
semiconductor components within a semiconductor wafer and
specifically to wireless testing of the semiconductor components
within the semiconductor wafer simultaneously and, optionally,
measuring a performance of the semiconductor components within the
semiconductor wafer.
[0004] 2. Related Art
[0005] A semiconductor device fabrication operation is commonly
used to manufacture components onto a semiconductor substrate to
form a semiconductor wafer. The semiconductor device fabrication
operation uses a predetermined sequence of photographic and/or
chemical processing steps to form components onto the semiconductor
substrate. However, imperfections within the semiconductor wafer,
such as imperfections of the semiconductor substrate, imperfections
of the semiconductor device fabrication operation, or imperfections
in design of the components themselves, may cause one or more of
the semiconductor components to operate differently than
expected.
[0006] Conventional automatic test equipment (ATE) is commonly used
to verify that the semiconductor components within the
semiconductor wafer operate as expected. The conventional automatic
test equipment includes a full complement of electronic testing
probes to carry out a testing operation. This full complement of
electronic testing probes includes electronic testing probes to
apply power, digital testing signals, and/or analog testing signals
to each of the semiconductor components to perform the testing
operation. This full complement of electronic testing probes also
includes electronic probes to read signals at various nodes of the
semiconductor components to verify that each of the semiconductor
components operates as expected during the testing operation.
[0007] Improvements in semiconductor device fabrication techniques
have allowed the manufacture of more complex semiconductor
components, in greater quantities, onto the semiconductor substrate
requiring more electronic probes to perform the testing operation.
Typically, the electronic probes are in direct contact with
specially designated locations, commonly referred to as testing
points, within the semiconductor components. These more complex
semiconductor components require more testing points to perform the
testing operation which occupy more real estate on the
semiconductor substrate that could be allocated elsewhere. As a
result, these improvements in semiconductor device fabrication have
led to an increase of the overall size and cost of the conventional
automatic test equipment.
[0008] Thus, there is a need for automatic test equipment that
verify the semiconductor components within the semiconductor wafer
operate as expected that overcomes the shortcomings described
above. Further aspects and advantages of the present invention will
become apparent from the detailed description that follows.
BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES
[0009] Embodiments of the invention are described with reference to
the accompanying drawings. In the drawings, like reference numbers
indicate identical or functionally similar elements. Additionally,
the left most digit(s) of a reference number identifies the drawing
in which the reference number first appears.
[0010] FIG. 1 illustrates a first schematic block diagram of a
wireless component testing environment according to a first
exemplary embodiment of the present invention.
[0011] FIG. 2 illustrates a first schematic block diagram of a
semiconductor component according to a first exemplary embodiment
of the present invention.
[0012] FIG. 3 illustrates a schematic block diagram of a first
transmitter module implemented as part of one of the semiconductor
components according to a first exemplary embodiment of the present
invention.
[0013] FIG. 4 illustrates a schematic block diagram of a first
wireless automatic test equipment according to a first exemplary
embodiment of the present invention.
[0014] FIG. 5A illustrates a first exemplary positioning of
receiving antennas of the wireless automatic test equipment
according to a first exemplary embodiment.
[0015] FIG. 5B illustrates a second exemplary positioning of the
receiving antennas of the wireless automatic test equipment
according to a first exemplary embodiment.
[0016] FIG. 5C illustrates a third exemplary positioning of the
receiving antennas of the wireless automatic test equipment
according to a first exemplary embodiment.
[0017] FIG. 6 illustrates a schematic block diagram of a receiver
module implemented as part of the wireless automatic test equipment
according to an exemplary embodiment of the present invention.
[0018] FIG. 7 graphically illustrates a first transmission field
pattern of more than one of the semiconductor components according
to an exemplary embodiment of the present invention.
[0019] FIG. 8 illustrates a schematic block diagram of a second
wireless component testing environment according to a second
exemplary embodiment of the present invention.
[0020] FIG. 9 illustrates a schematic block diagram of a second
semiconductor component according to a first exemplary embodiment
of the present invention.
[0021] FIG. 10 illustrates a schematic block diagram of a receiver
module implemented as part of the second exemplary semiconductor
component according to an exemplary embodiment of the present
invention.
[0022] FIG. 11 illustrates a schematic block diagram of a second
wireless automatic test equipment according to a first exemplary
embodiment of the present invention.
[0023] FIG. 12 illustrates a schematic block diagram of a first
transmitter module implemented as part of the second wireless
automatic test equipment according to a first exemplary embodiment
of the present invention.
[0024] FIG. 13 is a flowchart of exemplary operational steps of a
wireless automatic test equipment according to an exemplary
embodiment of the present invention.
[0025] FIG. 14 illustrates a schematic block diagram of an
integrated circuit under test implemented as part of the first
and/or the second exemplary semiconductor components according to
an exemplary embodiment of the present invention.
[0026] FIG. 15 illustrates a schematic block diagram of a thermal
imaging module that may be implemented as part of the first or the
second exemplary wireless automatic test equipment according to an
exemplary embodiment of the present invention.
[0027] FIG. 16 illustrates a schematic block diagram of an optional
performance measurement module implemented as part of the first or
the second exemplary wireless automatic test equipment according to
an exemplary embodiment of the present invention.
[0028] FIG. 17A illustrates an operation of a thermogram processor
used in the second wireless automatic test equipment according to
an exemplary embodiment of the present invention.
[0029] FIG. 17B illustrates predetermined semiconductor component
thermograms according to an exemplary embodiment of the present
invention.
[0030] FIG. 18 is a flowchart of exemplary operational steps of the
second wireless component testing environment according to an
exemplary embodiment of the present invention.
[0031] Embodiments of the invention will now be described with
reference to the accompanying drawings. In the drawings, like
reference numbers generally indicate identical, functionally
similar, and/or structurally similar elements. The drawing in which
an element first appears is indicated by the leftmost digit(s) in
the reference number.
DETAILED DESCRIPTION OF THE INVENTION
[0032] The following Detailed Description refers to accompanying
drawings to illustrate exemplary embodiments consistent with the
invention. References in the Detailed Description to "one exemplary
embodiment," "an exemplary embodiment," "an example exemplary
embodiment," etc., indicate that the exemplary embodiment described
may include a particular feature, structure, or characteristic, but
every exemplary embodiment may not necessarily include the
particular feature, structure, or characteristic. Moreover, such
phrases are not necessarily referring to the same exemplary
embodiment. Further, when a particular feature, structure, or
characteristic is described in connection with an exemplary
embodiment, it is within the knowledge of those skilled in the
relevant art(s) to effect such feature, structure, or
characteristic in connection with other exemplary embodiments
whether or not explicitly described.
[0033] The exemplary embodiments described herein are provided for
illustrative purposes, and are not limiting. Other exemplary
embodiments are possible, and modifications may be made to the
exemplary embodiments within the spirit and scope of the invention.
Therefore, the Detailed Description is not meant to limit the
invention. Rather, the scope of the invention is defined only in
accordance with the following claims and their equivalents.
[0034] The following Detailed Description of the exemplary
embodiments will so fully reveal the general nature of the
invention that others can, by applying knowledge of those skilled
in relevant art(s), readily modify and/or adapt for various
applications such exemplary embodiments, without undue
experimentation, without departing from the spirit and scope of the
present invention. Therefore, such adaptations and modifications
are intended to be within the meaning and plurality of equivalents
of the exemplary embodiments based upon the teaching and guidance
presented herein. It is to be understood that the phraseology or
terminology herein is for the purpose of description and not of
limitation, such that the terminology or phraseology of the present
specification is to be interpreted by those skilled in relevant
art(s) in light of the teachings herein.
[0035] Embodiments of the invention may be implemented in hardware,
firmware, software, or any combination thereof. Embodiments of the
invention may also be implemented as instructions stored on a
machine-readable medium, which may be read and executed by one or
more processors. A machine-readable medium may include any
mechanism for storing or transmitting information in a fotin
readable by a machine (e.g., a computing device). For example, a
machine-readable medium may include read only memory (ROM); random
access memory (RAM); magnetic disk storage media; optical storage
media; flash memory devices; electrical, optical, acoustical or
other forms of propagated signals (e.g., carrier waves, infrared
signals, digital signals, etc.), and others. Further, firmware,
software, routines, instructions may be described herein as
performing certain actions. However, it should be appreciated that
such descriptions are merely for convenience and that such actions
in fact result from computing devices, processors, controllers, or
other devices executing the firmware, software, routines,
instructions, etc.
[0036] First Exemplary Wireless Component Testing Environment
[0037] FIG. 1 illustrates a first schematic block diagram of a
wireless component testing environment according to a first
exemplary embodiment of the present invention. A semiconductor
device fabrication operation is commonly used to manufacture
components onto a semiconductor substrate to form a semiconductor
wafer. The semiconductor device fabrication operation uses a
predetermined sequence of photographic and/or chemical processing
steps to form the components onto the semiconductor substrate.
However, imperfections within the semiconductor wafer, such as
imperfections of the semiconductor substrate, imperfections of the
semiconductor device fabrication operation, or imperfections in
design of the components themselves to provide some examples, may
cause one or more of the components to operate differently than
expected.
[0038] A wireless testing environment 100 allows for simultaneous
testing of semiconductor components 106.1 through 106.n, herein
referred to as the semiconductor components 106 by wireless
automatic test equipment 104. The semiconductor components 106
represent any combination of electrical components, such as any
combination of active components, passive components, or other
suitable components that will be apparent to those skilled in the
relevant art(s) to provide some examples, that are configured and
arranged to form one or more integrated circuits. The semiconductor
components 106 may be similar and/or dissimilar to each other. The
semiconductor substrate 108 represents a base that the
semiconductor device fabrication operation forms the semiconductor
components 106 onto. The semiconductor substrate 108 is typically a
thin slice of semiconductor material, such as a silicon crystal,
but may include other materials, or combinations of materials, such
as sapphire or any other suitable material that will be apparent to
those skilled in the relevant art(s) without departing from the
spirit and scope of the present invention. The semiconductor wafer
102 represents the semiconductor substrate 108 having the
semiconductor components 106 formed onto by the semiconductor
device fabrication operation.
[0039] The wireless automatic test equipment 104 wirelessly tests
one or more of the semiconductor components 106 simultaneously to
verify that these one or more of the semiconductor components 106
operate as expected. The wireless automatic test equipment 104
provides an initiate testing operation signal 150 to the
semiconductor components 106. The initiate testing operation signal
150 represents a radio communication signal that is wirelessly
transmitted to the semiconductor components 106.
[0040] The initiate testing operation signal 150 is simultaneously
observed by one or more of the semiconductor components 106. The
semiconductor components 106 that received the initiate testing
operation signal 150 enter into a testing mode of operation,
whereby these semiconductor components 106 execute a self-contained
testing operation. The self-contained testing operation may utilize
a first set of parameters provided by the initiate testing
operation signal 150 to be used by a first set of instructions that
are stored within the semiconductor components 106. Alternatively,
the self-contained testing operation may execute a second set of
instructions provided by the initiate testing operation signal 150
and/or a second set of parameters to be used by the second set of
instructions that are provided by the initiate testing operation
signal 150. In another alternate, the self-contained testing
operation may include any combination of the first set of
instructions, the second set of instructions, the first set of
parameters and/or the second set of parameters. The wireless
automatic test equipment 104 may provide the initiate testing
operation signal 150 during the self-contained testing operation to
provide additional parameters and/or instructions to the
semiconductor components 106.
[0041] After completion of the self-contained testing operation,
the semiconductor components 106 wirelessly transmit testing
operation outcomes 152.1 through 152.n, herein testing operation
outcomes 152, to the wireless automatic test equipment 104 via a
common communication channel 154. The common communication channel
154 represents a communication channel that is be simultaneously
utilized or shared by the semiconductor components 106.
Collectively, the semiconductor components 106 communicate the
testing operation outcomes 152 over the common communication
channel 154 using a multiple access transmission scheme. The
multiple access transmission scheme may include any single carrier
multiple access transmission scheme such as code division multiple
access (CDMA), frequency division multiple access (FDMA), time
division multiple access (TDMA), and/or any other suitable single
carrier multiple access scheme that will be apparent by those
skilled in the relevant art(s) without departing from the spirit
and scope of the present invention. Alternatively, the multiple
access transmission scheme may include any multiple carrier
multiple access transmission scheme such as discrete multi-tone
(DMT) modulation, orthogonal frequency division multiplexing
(OFDM), coded OFDM (COFDM), and/or any other suitable multiple
carrier multiple access scheme that will be apparent by those
skilled in the relevant art(s) without departing from the spirit
and scope of the present invention. In another alternate, the
multiple access transmission scheme may include any combination of
the single carrier multiple access transmission scheme and the
multiple carrier multiple access transmission scheme.
[0042] The wireless automatic test equipment 104 observes the
testing operation outcomes 152 as they pass through the common
communication channel 154 using one or more receiving antennas
positioned in three-dimensional space. The wireless automatic test
equipment 104 determines one or more signal metrics, such as a
mean, a total energy, an average power, a mean square, an
instantaneous power, a root mean square, a variance, a noun, a
voltage level and/or any other suitable signal metric that will be
apparent by those skilled in the relevant art(s) provide some
examples, of the testing operation outcomes 152 as observed by the
one or more receiving antennas. The wireless automatic test
equipment 104 uses the one or more signal metrics to map the
testing operation outcomes 152 to the semiconductor components 106.
The wireless automatic test equipment 104 determines a first group
of semiconductor components from among the semiconductor components
106 that operate as expected, and optionally their location within
the semiconductor wafer 102, based upon the testing operation
outcomes 152 as observed by the one or more receiving antennas.
Alternatively, the wireless automatic test equipment 104 may
determine a second group of semiconductor components from among the
semiconductor components 106 that operate unexpectedly based upon
the testing operation outcomes 152 as observed by the one or more
multiple receiving antennas. The wireless automatic test equipment
104 may, optionally, provide a location of the second group of
semiconductor components within the semiconductor wafer 102. In
another alternate, the wireless automatic test equipment 104 may
determine any combination of the first group of semiconductor
components and the second group of semiconductor components and,
optionally, provide their corresponding locations within the
semiconductor wafer 102.
[0043] First Exemplary Semiconductor Component
[0044] FIG. 2 illustrates a first schematic block diagram of a
semiconductor component according to a first exemplary embodiment
of the present invention. A semiconductor component 200 observes
the initiate testing operation signal 150 from the wireless
automatic test equipment 104. The semiconductor component 200
represents an exemplary embodiment of one of the semiconductor
components 106. The semiconductor component 200 performs the
self-contained testing operation in response to receiving the
initiate testing operation signal 150. After completion of the
self-contained testing operation, the semiconductor component 200
wirelessly transmits an individual testing operation outcome 250 of
the self-contained testing operation. The individual testing
operation outcome 250 represents an exemplary embodiment of one of
the testing operation outcomes 152.
[0045] The semiconductor component 200 includes a transceiver
module 202, an integrated circuit under test 204, and a testing
module 206. The transceiver module 202 provides an initiate test
control signal 252 based upon the initiate testing operation signal
150 and the individual testing operation outcome 250 based upon an
indication of operability 254. More specifically, the transceiver
module 202 includes a receiver module 208 and a transmitter module
210. The receiver module 208 downconverts, demodulates, and/or
decodes the initiate testing operation signal 150 to provide the
initiate test control signal 252. Similarly, the transmitter module
210 encodes, modulates, and/or upconverts the indication of
operability 254 in accordance with the multiple access transmission
scheme, as discussed above, to provide the individual testing
operation outcome 250.
[0046] Exemplary Transmitter Module Implemented as Part of the
First Exemplary Semiconductor Component
[0047] FIG. 3 illustrates a schematic block diagram of a first
transmitter module implemented as part of one of the semiconductor
components according to a first exemplary embodiment of the present
invention. A transmitter module 300 encodes, modulates, and/or
upconverts the indication of operability 254 to provide the
individual testing operation outcome 250 in accordance with the
multiple access transmission scheme, as discussed above. The
transmitter module 300 represents an exemplary embodiment of the
transmitter module 210.
[0048] The transmitter module 300 includes an encoding module 302,
a modulating module 308, and an upconverter module 310. The
encoding module 302 encodes the indication of operability 254 in
accordance with the multiple access transmission scheme to provide
an encoded indication of operability 350. In an exemplary
embodiment, the encoding module 302 encodes the indication of
operability 254 in accordance with a code division multiple access
(CDMA) scheme. In this exemplary embodiment, the encoding module
302 includes a spreading code generator 304 and a spreading module
306. The spreading code generator 304 provides a unique random,
pseudo-random, and/or non-random sequence of data, referred to as a
spreading code 352, to the spreading module 306. The spreading code
352 represents to a sequence of bits that is unique to each of the
semiconductor components 106, or groups of the semiconductor
components 106, to encode the indication of operability 254. The
spreading module 306 utilizes the spreading code 352 to encode the
indication of operability 254 to provide the spreaded indication of
operability 350.
[0049] The modulating module 308 modulates the spreaded indication
of operability 350 using any suitable analog or digital modulation
techniques such as amplitude modulation (AM), frequency modulation
(FM), phase modulation (PM), phase shift keying (PSK), frequency
shift keying (FSK), amplitude shift keying (ASK), quadrature
amplitude modulation (QAM) and/or any other suitable modulation
technique that will be apparent to those skilled in the relevant
art(s) to provide a modulated indication of operability 354.
[0050] The upconverter module 310 frequency translates or
upconverts the modulated indication of operability 354 to provide
the individual testing operation outcome 250. More specifically,
the upconverter module 310 may upcovert the individual testing
operation outcome 250 using a single carrier frequency and/or among
multiple carriers to implement the multiple access transmission to
provide the individual testing operation outcome 250. In an
exemplary embodiment, the upconverter module 310 is optional. In
this exemplary embodiment, the modulating module 308 directly
provides the modulated indication of operability 354 as the
individual testing operation outcome 250.
[0051] Referring again to FIG. 2, the testing module 206 provides
the self-contained testing operation 256 in response to the
initiate test control signal 252. The self-contained testing
operation 256 may utilize a first set of parameters provided by the
initiate testing operation signal 150 to be used by a first set of
instructions that are stored within the testing module 206.
Alternatively, the self-contained testing operation 256 may execute
a second set of instructions provided by the initiate testing
operation signal 150 and/or a second set of parameters to be used
by the second set of instructions that are provided by the initiate
testing operation signal 150. In another alternate, the
self-contained testing operation 256 may include any combination of
the first set of instructions, the second set of instructions, the
first set of parameters and/or the second set of parameters.
[0052] The initiate test control signal 252 causes the testing
module 206 to enter into a testing mode of operation. In the
testing mode of operation, the testing module 206 may load the
first set of instructions and/or the first set of parameters of the
self-contained testing operation 256 from one or more memory
devices. The testing module 206 may provide the first set of
instructions and/or the first set of parameters individually, or as
a group, to the integrated circuit under test 204 as the testing
routine 256. Alternatively, the testing module 206 may gather the
second set of instructions and/or the second set of parameters of
the self-contained testing operation 256 from the self-contained
testing operation 252. The testing module 206 may provide the
second set of instructions and/or the second set of parameters
individually, or as a group, to the integrated circuit under test
204 as the testing routine 256. Alternatively, the testing module
206 may provide any combination of the first and the second set of
instructions and/or the first and the second set of parameters to
the integrated circuit under test 204 as the testing routine
256
[0053] The integrated circuit under test 204 executes the
self-contained testing operation 256 to determine whether the
integrated circuit under test 204 operates as expected. The
integrated circuit under test 204 provides an indication of
operability 258 during and/or after execution of the self-contained
testing operation 256 to the testing module 206. The indication of
operability 258 indicates whether the integrated circuit under test
204 operates as expected or, alternatively, whether the integrated
circuit under test 204 operates unexpectedly and, optionally, one
or more locations within the integrated circuit under test 204 that
operate unexpectedly.
[0054] The testing module 206 may additionally analyze the
indication of operability 258, format the indication of operability
258 by appending a unique identification number of the
semiconductor component 200 to the indication of operability 258,
or by formatting the indication of operability 258 according to a
known communications standard to provide some examples, and/or
encode the indication of operability 258 using any suitable error
correction coding such as a block code, a convolutional code,
and/or any other suitable error correction coding scheme that will
be apparent to those skilled in the relevant art(s), before
providing the indication of operability 254 to the transceiver
module 202. In an exemplary embodiment, the testing module 206
includes a random number generator to generate the unique
identification number. However, this exemplary embodiment is not
limiting, those skilled in the relevant art(s) will recognize that
other methods may be used to generate the unique identification
number without departing from the spirit and scope of the present
invention. For example, the unique identification number may be
generated by wireless automatic test equipment 104 and provided to
the semiconductor component 200 using a direct current (DC) probe
for storage into a memory device, such as any suitable non-volatile
memory, any suitable volatile memory, or any combination of
non-volatile and volatile memory that will be apparent to those
skilled in the relevant art(s).
[0055] In an exemplary embodiment, the testing module 206 only
provides the indication of operability 254 to the transceiver
module 202 when the indication of operability 258 indicates the
integrated circuit under test 204 operates as expected. In this
situation, the transceiver module 202 does not provide the
individual testing operation outcome 250 when the integrated
circuit under test 204 operates unexpectedly. Alternatively, the
testing module 206 only provides the indication of operability 254
to the transceiver module 202 when the indication of operability
258 indicates the integrated circuit under test 204 operates
unexpectedly. In this situation, the transceiver module 202 does
not provide the individual testing operation outcome 250 when the
integrated circuit under test 204 operates as expected.
[0056] First Exemplary Wireless Automatic Test Equipment
[0057] FIG. 4 illustrates a schematic block diagram of a first
wireless automatic test equipment according to a first exemplary
embodiment of the present invention. The semiconductor components
106 transmit the testing operation outcomes 152 to the wireless
automatic test equipment 400 via the common communication channel
154. The wireless automatic test equipment 400 includes one or more
receiving antennas to observe the testing operation outcomes 152
from one or more directions in three dimensional space. The
wireless automatic test equipment 400 may determine whether one or
more of the semiconductor components 106 operate as expected and,
optionally, may use properties of the three dimensional space, such
as distance between each of multiple receiving antennas and/or the
semiconductor components 106 to provide an example, to determine a
location of the one or more of the semiconductor components 106
within the semiconductor wafer 102. The wireless automatic test
equipment 400 represents an exemplary embodiment of the wireless
automatic test equipment 104.
[0058] The wireless automatic test equipment 400 includes receiving
antennas 402.1 through 402.i, a receiver module 404, a metric
measurement module 406, a testing processor 408, an operator
interface module 410, a transmitter module 412, and a transmitting
antenna 414. The receiving antennas 402.1 through 402.i, herein
referred to as the receiving antennas 402, are positioned at
corresponding positions in the three dimensional space. In an
exemplary embodiment, the receiving antennas 402 include two
receiving antennas, namely a first receiving antenna 402.1 and a
second receiving antenna 402.2. In this exemplary embodiment, the
first receiving antenna 402.1 and the second receiving antenna
402.2 are placed at a distance of d.sub.1 and d.sub.2,
correspondingly, from a center of the semiconductor wafer 102, the
distance d.sub.1 and the distance d.sub.2 being similar to or
dissimilar from each other. In this exemplary embodiment, the first
receiving antenna 402.1 is separated from the second receiving
antenna 402.2 by an angle .theta., such as ninety degrees to
provide an example.
[0059] First Exemplary Positioning of Receiving Antennas of the
Wireless Automatic Test Equipment
[0060] FIG. 5A illustrates a first exemplary positioning of
receiving antennas of the wireless automatic test equipment
according to a first exemplary embodiment. As shown in FIG. 5A, the
receiving antennas 402 may be placed along a radius r of a
spherical shell 502 in the three dimensional space proximate to the
semiconductor wafer 102. In an exemplary embodiment, the receiving
antennas 402 may form corners of a polygon that is positioned
within a plane that intersects the spherical shell 502. The polygon
may be characterized as having sides of similar or dissimilar
length. However, this example is not limiting, those skilled in the
relevant art(s) will recognize that the receiving antennas 402 may
be placed along any suitable radius r in one or more planes that
intersect the spherical shell 502 without departing from the sprit
and scope of the present invention.
[0061] Second Exemplary Positioning of the Receiving Antennas of
the Wireless Automatic Test Equipment
[0062] FIG. 5B illustrates a second exemplary positioning of the
receiving antennas of the wireless automatic test equipment
according to a first exemplary embodiment. The receiving antennas
402 may be placed along a corresponding radius r.sub.1 through
r.sub.1 of a corresponding spherical shell 504.1 through 504.i in
the three dimensional space proximate to the semiconductor wafer
102. For example, the receiving antenna 402.1 may be placed along a
radius r.sub.1 of a first spherical shell 504.1 in the three
dimensional space. Likewise, the receiving antenna 402.i may be
placed along a radius r.sub.n of an i.sup.th spherical shell 504.i
in the three dimensional space. A radius having a greater subscript
may be greater than, less than, or equal to a radius having a
lesser subscript. For example, the radius r.sup.n may be greater
than, less than, or equal to the radius r.sub.1.
[0063] Although FIG. 5A and FIG. 5B illustrate positioning of the
receiving antennas 402 in relation to a spherical shell, those
skilled in the relevant art(s) will recognize that any other
regular geometric structure, irregular geometric structure, open
structure, close structure, or any combination thereof may be used
to position the receiving antennas 402 in the three dimensional
space without departing from the spirit and scope of the present
invention.
[0064] Third Exemplary Positioning of the Receiving Antennas of the
Wireless Automatic Test Equipment
[0065] FIG. 5C illustrates a third exemplary positioning of the
receiving antennas of the wireless automatic test equipment
according to a first exemplary embodiment. Each of the receiving
antennas 402 may be positioned anywhere along a geometric structure
506 in the three dimensional space proximate to the semiconductor
wafer 102. The geometric structure 506 may represent an irregular
geometric structure, as shown, or any regular geometric structure
that will be apparent to those skilled in the relevant art(s).
Additionally, the geometric structure 506 may represent a closed
structure, as shown, or any open structure that will be apparent to
those skilled in the relevant art(s).
[0066] Referring again to FIG. 4, the receiving antennas 402
observe testing operation outcomes 452.1 through 452.i, herein
testing operation outcomes 452, to provide one or more observed
testing operation outcomes 454.1 through 454.i, herein observed
testing operation outcomes 454. The testing operation outcomes 452
represent the testing operation outcomes 152 as they propagate
through the common communication channel 154 as observed by the
receiving antennas 402 at their corresponding positions in the
three-dimensional space. For example, the observed testing
operation outcome 454.1 represents the testing operation outcomes
152 as they propagate through the common communication channel 154
as observed by the receiving antenna 402.1 at a first position in
the three-dimensional space. Likewise, the observed testing
operation outcome 454.2 represents the testing operation outcomes
152 as they propagate through the common communication channel 154
as observed by the receiving antenna 402.2 at a second
corresponding position in the three-dimensional space.
[0067] The receiver module 404 downconverts, demodulates, and/or
decodes the observed testing operation outcomes 454 to provide
recovered testing outcomes 456.1 through 456.k, herein recovered
testing outcomes 456, in accordance with the multiple access
transmission scheme, as discussed above. More specifically, the
wireless automatic test equipment 400 includes i receiving antennas
402 to observe the testing operation outcomes 152 as they propagate
through the common communication channel 154 to provide observed
testing operation outcomes 454. Each of the observed testing
operation outcomes 454 includes the testing operation outcomes 152
as observed by its corresponding receiving antenna 402. For
example, the observed testing operation outcomes 454.1 includes the
testing operation outcomes 152 as observed the receiving antenna
402.1 and the observed testing operation outcomes 454.i includes
the testing operation outcomes 152 as observed the receiving
antenna 402.i.
[0068] The receiver module 404 downconverts, demodulates, and/or
decodes the observed testing operation outcomes 454 to provide a
corresponding recovered testing outcome 456 for each of the n
testing operation outcomes 152 for each of the i testing operation
outcomes 454 for a total of n*i=k recovered testing outcomes 456.
In other words, the receiver module 404 downconverts, demodulates,
and/or decodes each of the testing operation outcomes 454 as
observed by each of the receiving antennas 402. In an exemplary
embodiment, the testing operation outcome 456.1 represents the
testing operation outcome 152.1 as observed by the receiving
antenna 402.1, the testing operation outcome 456.2 represents the
testing operation outcome 152.2 as observed by the receiving
antenna 402.1. In this exemplary embodiment, the testing operation
outcome 456.k represents the testing operation outcome 152.n as
observed by the receiving antenna 402.i.
[0069] Exemplary Receiver Module Implemented as Part of the
Wireless Automatic Test Equipment
[0070] FIG. 6 illustrates a schematic block diagram of a receiver
module implemented as part of the wireless automatic test equipment
according to an exemplary embodiment of the present invention. A
receiver module 600 downconverts, demodulates, and/or decodes the
observed testing operation outcomes 454 to provide the recovered
testing outcomes 456 in accordance with the multiple carrier access
transmission scheme. The receiver module 600 represents an
exemplary embodiment of the receiver module 404.
[0071] The receiver module 600 includes a downconverter module 602,
a demodulating module 604, and a decoding module 606. The
downconverter module 602 frequency translates or downconverts the
observed testing operation outcomes 454 to a baseband frequency or
an intermediate frequency (IF) to provide downconverted testing
operation outcomes 652.1 through 652.i, herein downconverted
testing operation outcomes 652. More specifically, the
downconverter module 602 may downconvert the observed testing
operation outcomes 454 using a single carrier frequency to
implement the single carrier multiple access transmission scheme or
among multiple carriers to implement the multiple carrier multiple
access transmission scheme to provide the downconverted testing
operation outcomes 652. In an exemplary embodiment, the
downconverter module 602 is optional. In this exemplary embodiment,
the demodulating module 604 directly observes the observed testing
operation outcomes 454.
[0072] The demodulating module 604 demodulates the downconverted
testing operation outcomes 652 using any suitable analog or digital
demodulation technique for any suitable modulation technique such
as amplitude modulation (AM), frequency modulation (FM), phase
modulation (PM), phase shift keying (PSK), frequency shift keying
(FSK), amplitude shift keying (ASK), quadrature amplitude
modulation (QAM) and/or any other suitable modulation technique
that will be apparent to those skilled in the relevant art(s) to
provide demodulated testing operation outcomes 654.1 through 654.i,
herein demodulated testing operation outcomes 654.
[0073] The decoding module 606 decodes the demodulated testing
operation outcomes 654 using any suitable multiple access
transmission scheme to provide the recovered testing outcomes 456.
In an exemplary embodiment, the decoding module 606 decodes the
demodulated testing operation outcomes 654 in accordance with a
code division multiple access (CDMA) scheme. In this exemplary
embodiment, the decoding module 606 includes a despreading code
generator 608 and a despreading module 610. The despreading code
generator 608 provides unique random, pseudo-random, and/or
non-random sequences of data, referred to as despreading codes
656.1 through 656.n, to the despreading module 610. Each of the
despreading codes 656.1 through 656.n represent a corresponding one
of the spreading codes that were used to by the semiconductor
components 106 to provide their corresponding testing operation
outcome 152. For example, the despreading code 656.1 represents the
spreading code used by the semiconductor component 106.1 to provide
the testing operation outcome 152.1. The despreading code module
610 utilizes the despreading codes 656.1 through 656.n to decode
the demodulated testing operation outcomes 654 to provide a total
of n*i=k recovered testing outcomes 456.
[0074] Referring again to FIG. 4, the metric measurement module 406
determines one or more signal metrics of the recovered testing
outcomes 456 to provide measured signal metrics 458.1 through
458.k, herein measured signal metrics 458. The one or more signal
metrics may include a mean, a total energy, an average power, a
mean square, an instantaneous power, a root mean square, a
variance, a norm, a voltage level and/or any other suitable signal
metric of the recovered testing outcomes 456 that will be apparent
by those skilled in the relevant art(s) without departing from the
spirit and scope of the present invention.
[0075] The testing processor 408 may determine a first group of
semiconductor components from among the semiconductor components
106 that operate as expected based upon the recovered testing
outcomes 456. The testing processor 408 evaluates the recovered
testing outcomes 456 for each of the unique identification numbers
to determine whether its corresponding semiconductor component 106
is part of the first group of semiconductor components.
Alternatively, the testing processor 408 may determine the first
group of semiconductor components based upon the recovered testing
outcomes 456.1 through 456.i that correspond to the first receiving
antenna 402.1, based upon the recovered testing outcomes 456.(k-i)
through 456.k that correspond to the receiving antenna 402.i, or
any suitable combination of antennas that will be apparent to those
skilled in the relevant art(s) without departing from the spirit
and scope of the present invention. Alternatively, the testing
processor 408 may determine a second group of semiconductor
components from among the semiconductor components 106 that operate
unexpectedly based upon the recovered testing outcomes 456. In
another alternate, the testing processor 408 may determine any
combination of the first group of semiconductor components and the
second group of semiconductor components.
[0076] In an exemplary embodiment, the testing processor 408 may
provide the testing operation command signal 464 to the transmitter
module 412 that causes the transmitter module 412 to provide the
initiate testing operation signal 466 that causes those
semiconductor components 106 that operate as expected to enter into
a transmitting state and those semiconductor components 106 that
operate unexpectedly to enter into a non-transmitting state.
Alternatively, the testing processor 408 may provide the testing
operation command signal 464 to the transmitter module 412 that
causes the transmitter module 412 to provide the initiate testing
operation signal 466 that causes those semiconductor components 106
that operate unexpectedly to enter into a transmitting state and
those semiconductor components 106 that operate as expected to
enter into a non-transmitting state. In these exemplary
embodiments, only those semiconductor components 106 that are in
the transmitting state provide their respective testing operation
outcome 152.
[0077] The testing processor 408 may, optionally, determine a
location of the semiconductor components 106 within the
semiconductor wafer 102 based upon the measured signal metrics 458.
The testing processor 408 may determine the location of each of the
semiconductor components 106, those semiconductor components 106 in
the transmitting state, those semiconductor components 106 in the
non-transmitting state, and/or any combination thereof.
[0078] First Exemplary Mapping of the Testing Operation
Outcomes
[0079] FIG. 7 graphically illustrates a first transmission field
pattern 700 of more than one of the semiconductor components
according to an exemplary embodiment of the present invention. As
discussed above, the semiconductor components 106 communicate the
testing operation outcomes 152 over the common communication
channel 154 to the wireless automatic test equipment 400.
[0080] A first semiconductor component 702.1 transmits a first
testing operation outcome 752.1 using a first antenna, such as a
dipole antenna, over the common communication channel 154 in
accordance with the multiple access scheme. However this example is
not limiting, those skilled in the relevant art(s) will recognize
that other types of antenna such as a random wire antenna, a horn,
a parabolic antenna, a patch antenna, or any other suitable antenna
that is capable of converting an electromagnetic wave into a
current to provide some examples, or combinations of antenna may be
utilized by the first semiconductor component 702.1. The first
testing operation outcome 752.1 propagates through the common
communication channel 154 to a first receiving antenna 402.1 and a
second receiving antenna 402.2 as illustrated by a first field
pattern 704.1. Those skilled in the relevant art(s) will recognize
that more receiving antennas 402 may be utilized, as shown in FIG.
5A through 5C, without departing from the spirit and scope of the
present invention.
[0081] Likewise, a second semiconductor component 702.2
substantially simultaneously transmits a second testing operation
outcome 752.2 using a second antenna over the common communication
channel 154 in accordance with the multiple access scheme. The
second testing operation outcome 752.2 propagates through the
common communication channel 154 to the first receiving antenna
402.1 and the second receiving antenna 402.2 as illustrated by a
second field pattern 704.2.
[0082] The first semiconductor component 702.1 and the second
semiconductor component 702.2 represent exemplary embodiments of
any two of the semiconductor components 106. Likewise, the first
testing operation outcome 752.1 and the second testing operation
outcome 752.2 represent exemplary embodiments of any two of the
testing operation outcomes 152.
[0083] Placement of the first receiving antenna 402.1 at a distance
d.sub.1 from the semiconductor wafer 102 in the three dimensional
space and the second receiving antenna 402.2 at a distance d.sub.2
in the three dimensional space from the semiconductor wafer 102
allows the wireless automatic test equipment 400 to determine that
the first testing operation outcome 752.1 is being provided by the
first semiconductor component 702.1 and the second testing
operation outcome 752.2 is being provided by the second
semiconductor component 702.2. More specifically, the one or more
signal metrics of the first testing operation outcome 752.1 and the
second testing operation outcome 752.2 deviate as they propagate
through the common communication channel 154. For example, the
first testing operation outcome 752.1 and the second testing
operation outcome 752.2 as observed by the first receiving antenna
402.1 will be substantially similar since the first semiconductor
component 702.1 and the second semiconductor component 702.2 are
substantially equidistant from the first receiving antenna 402.1.
As a result, the one or more signal metrics of the first testing
operation outcome 752.1 and the one or more signal metrics of the
second testing operation outcome 752.2 will be substantially
similar allowing the wireless automatic test equipment 400 to
determine that the first semiconductor component 702.1 and the
second semiconductor component 702.2 are equidistant from the first
receiving antenna 402.1.
[0084] However, the first testing operation outcome 752.1 and the
second testing operation outcome 752.2 as observed by the second
receiving antenna 402.2 will not be substantially similar since the
first semiconductor component 702.1 and the second semiconductor
component 702.2 are not equidistant from the second receiving
antenna 402.2. For example, the one or more signal metrics of the
first testing operation outcome 752.1 along the radius r.sub.1 are
less than the one or more signal metrics of the second testing
operation outcome 752.2 along the radius r.sub.2. As a result, the
one or more signal metrics of the first testing operation outcome
752.1 and the one or more signal metrics of the second testing
operation outcome 752.2 will differ allowing the wireless automatic
test equipment 400 to determine that the first semiconductor
component 702.1 and the second semiconductor component 702.2 are
not equidistant from the second receiving antenna 402.2. Rather,
the first semiconductor component 702.1 is farther away from the
second receiving antenna 402.2 when compared to the second
semiconductor component 702.2.
[0085] Referring again to FIG. 4, the testing processor 408 assigns
the recovered testing outcomes 456 to corresponding coordinates
from among i sets of coordinates in the three dimensional space to
determine the location of the semiconductor components 106 within
the semiconductor wafer 102. For example, in an embodiment of the
wireless automatic test equipment 400 having a first receiving
antenna 402.1 and a second receiving antenna 402.2, the first
receiving antenna 402.1 and the second receiving antenna 402.2
observe the testing operation outcome 452.1 and the testing
operation outcome 452.2, correspondingly. In this example, the
testing processor 408 designates the measured signal metrics 458.1
and 458.i that correspond to the first receiving antenna 402.1 as a
first coordinate for each of the i sets of coordinates in the three
dimensional space. Similarly, the testing processor 408 designates
the measured signal metrics 458.(i+1) and 458.k that correspond to
the second receiving antenna 402.2 as a second coordinate for each
of the i sets of coordinates in the three dimensional space.
[0086] The testing processor 408 extracts the unique identification
number for each of the semiconductor components 106 from the
recovered testing outcomes 456, or a subset of, from the recovered
testing outcomes 456, such as the recovered testing outcomes 456.1
through 456.i to provide an example. The testing processor 408
assigns the unique identification number for each of the
semiconductor components 106 that is embedded within the testing
operation outcomes 452 to the i sets of coordinates.
[0087] The testing processor 408 maps the unique identification
numbers to their corresponding semiconductor component 106 to
determine the location of the semiconductor components 106 within
the semiconductor wafer 102. The testing processor 408 may
determine the location of the semiconductor components 106 within
the semiconductor wafer 102 by comparing the measured signal
metrics 458 corresponding to each of the unique identification
number to predetermined signal metrics for each of the
semiconductor components 106. The predetermined signal metrics
represent expected values of the measured signal metrics 458. For
example, one or more predetermined signal metrics, or range of
signal metrics, for each of the semiconductor components 106 are
determined prior to the testing operation. The testing processor
408 may compare the i sets of coordinates for the unique
identification numbers to the one or more predetermined signal
metric for each of the semiconductor components 106 to effectively
map the unique identification numbers to the semiconductor
components 106. Alternatively, the testing processor 408 may
iteratively interpolate the location of the unique identification
numbers to the semiconductor components 106 within the
semiconductor wafer 102 based upon relationships between their
corresponding measured signal metrics 458. For example, if a first
coordinate from among a first set of coordinates that is assigned
to a first unique identification number is greater than a first
coordinate from among a second set of coordinates that is assigned
to a second unique number, then the semiconductor component 106
that provided the first unique identification number is closer to
the first receiving antenna 402.1 when compared to the
semiconductor component 106 that provided the second unique number.
As another example, if the first coordinate from among the first
set of coordinates is less than a first coordinate from among a
third set of coordinates that is assigned to a third unique
identification number, then the semiconductor component 106 that
provided the first unique identification number is further from the
first receiving antenna 402.1 when compared to the semiconductor
component 106 that provided the third unique identification
number.
[0088] The testing processor 408 may provide a listing of testing
results 460 to the operator interface module 410. The listing of
testing results 460 may indicate whether at least one the
semiconductor components 106 operate as expected, and optionally
their location within the semiconductor wafer 102, whether at least
one of the semiconductor components 106 operate unexpected, and
optionally their location within the semiconductor wafer 102, or
any combination thereof. Alternatively, the testing processor 408
may store the listing of test results 460 within an internal
memory. In another alternate, the listing of testing results 460
may include a first indication that all of the semiconductors 106
that operate as expected and/or a second indication that indicates
at least one of the semiconductor components 106 operate
unexpectedly.
[0089] The operator interface module 410 may further process the
listing of testing results 460 for display on a graphical user
interface. For example, the operator interface module 410 may
display the listing of testing results 460 on a video monitor for
interpretation by an end user. Alternatively, the operator
interface module 410 may provide the listing of testing results 460
to the end user. For example, the operator interface module 410 may
record the listing of testing results 460 onto a digital recording
medium. In another alternate, the operator interface module 410 may
store the listing of testing results 460 for future recovery by the
end user.
[0090] The operator interface module 410 additionally observes an
indication from the end user the initiate the self-contained
testing operation, whereby the operator interface module sends an
initiate self-contained testing operation 462 to the testing
processor 408 to initiate the self-contained testing operation. The
end user may additionally specify the second set of instructions to
be performed and/or the second set of parameters to be used by the
second set of instructions prior to initiating the self-contained
testing operation. Alternatively, the testing processor 408 may
load the second set of instructions and/or the second set of
parameters from the internal memory. The operator interface module
410 provides the second set of instructions and/or the second set
of parameters to the testing processor 408 as part of the initiate
self-contained testing operation 462.
[0091] The transmitter module 412 receives the initiate
self-contained testing operation 462 from the testing processor 408
via an initiate self-contained testing operation 464. The
transmitter module 412 encodes, modulates and/or upconverts the
testing operation command signal 464 to provide an initiate testing
operation signal 466 to the semiconductor wafer 102 via a
transmitting antenna 414. In an exemplary embodiment, the
transmitter module 412 wirelessly sends the initiate testing
operation signal 466 to all of the semiconductor components 106
within the semiconductor wafer 102. However, this example is not
limiting, those skilled in the relevant art(s) will recognize that
the initiate testing operation signal 466 may be sent to a lesser
number of the semiconductor components 106 within the semiconductor
wafer 102 without departing from the spirit and scope of the
present invention. The initiate testing operation signal 466
represents an exemplary embodiment of the initiate testing
operation signal 150.
[0092] Second Exemplary Wireless Component Testing Environment
[0093] As an alternate to the semiconductor mapping as described
above, each of the one or more semiconductor components is tagged
at manufacturing, during testing, or implementation in the field
with a unique identification number. The unique identification
number represents a series of bits that is unique to each of the
one or more semiconductor components.
[0094] FIG. 8 illustrates a schematic block diagram of a second
wireless component testing environment according to a second
exemplary embodiment of the present invention. A wireless testing
environment 800 allows for simultaneous testing of the
semiconductor components 106 by wireless automatic test equipment
802. The wireless automatic test equipment 802 wirelessly tests one
or more of the semiconductor components 106 simultaneously to
verify that these one or more of the semiconductor components 106
operate as expected.
[0095] The wireless automatic test equipment 802 sends initiate
testing operation signals 850.1 through 850.n, herein initiate
testing operation signals 850, to the semiconductor components 106.
The initiate testing operation signals 850 represent one or more
radio communication signals that are wirelessly transmitted using
the common communication channel 154 to the semiconductor
components 106 using one or more transmitting antennas positioned
in three-dimensional space as described above in FIG. 5A through
FIG. 5C. The wireless automatic test equipment 802 may serially
provide the initiate testing operation signals 850 or,
alternatively, simultaneously provide the initiate testing
operation signals 850 using a multiple access transmission scheme.
In an exemplary embodiment, the wireless automatic test equipment
802 may encode each of the initiate testing operation signals 850
using a different spreading code in accordance with code division
multiple access (CDMA) scheme. For example, the wireless automatic
test equipment 802 may encode a first initiate testing operation
signal 850.1 and a second initiate testing operation signal 850.2
using a first spreading code and a second spreading code,
correspondingly, and simultaneously provide the first initiate
testing operation signal 850.1 and the second initiate testing
operation signal 850.2 to the semiconductor components 106 over the
common communication channel 854.
[0096] One or more of the semiconductor components 106 observe the
initiate testing operation signals 850 as they pass through the
common communication channel 854. These semiconductor components
106 determine one or more signal metrics, such as a mean, a total
energy, an average power, a mean square, an instantaneous power, a
root mean square, a variance, a norm, a voltage level and/or any
other suitable signal metric that will be apparent by those skilled
in the relevant art(s) provide some examples, of the initiate
testing operation signals 850. The semiconductor components 106
utilize the one or more signal metrics to generate a unique
identification number, or tag, which may be used by the wireless
automatic test equipment 802 to determine a location of the
semiconductor components 106 within the semiconductor wafer 102.
The semiconductor components 106 may store their corresponding
unique identification number into one or more memory devices such
as any suitable non-volatile memory, any suitable volatile memory,
or any combination of non-volatile and volatile memory that will be
apparent by those skilled in the relevant art(s) without departing
from the spirit and scope of the present invention.
[0097] The semiconductor components 106 that received the initiate
testing operation signals 850 enter into a testing mode of
operation, whereby these semiconductor components 106 execute the
self-contained testing operation as described above. After
completion of the self-contained testing operation, the
semiconductor components 106 wirelessly transmit a testing
operation outcome 852 to the wireless automatic test equipment 802
via the common communication channel 854. Collectively, the
semiconductor components 106 communicate the testing operation
outcome 852 over the common communication channel 154 using the
multiple access transmission scheme as described above. The testing
operation outcome 852 includes the unique identification number for
each of the semiconductor components 106 to allow the wireless
automatic test equipment 802 to determine the location of the
semiconductor components 106 within the semiconductor wafer
102.
[0098] The wireless automatic test equipment 802 observes the
testing operation outcome 852 as it passes through the common
communication channel using a receiving antenna positioned in the
three-dimensional space. The wireless automatic test equipment 802
determines a first group of semiconductor components from among the
semiconductor components 106 that operate as expected, and
optionally their location within the semiconductor wafer 102, based
upon the testing operation outcome 852 as observed by the receiving
antenna. Alternatively, the wireless automatic test equipment 802
may determine a second group of semiconductor components from among
the semiconductor components 106 that operate unexpectedly based
upon the testing operation outcome 852 as observed by the receiving
antenna. The wireless automatic test equipment 802 may, optionally,
provide a location of the second group of semiconductor components
within the semiconductor wafer 102. In another alternate, the
wireless automatic test equipment 104 may determine any combination
of the first group of semiconductor components and the second group
of semiconductor components and, optionally, provide their
corresponding locations within the semiconductor wafer 102.
[0099] Second Exemplary Semiconductor Component
[0100] FIG. 9 illustrates a schematic block diagram of a second
semiconductor component according to a first exemplary embodiment
of the present invention. A semiconductor component 900 observes
the initiate testing operation signals 850 from the wireless
automatic test equipment 802. The semiconductor component 900
represents an exemplary embodiment of one of the semiconductor
components 106. The semiconductor component 900 determines one or
more signal metrics of the initiate testing operation signals 850
to generate a unique identification number, or tag, that may be
used by the wireless automatic test equipment 802 to determine a
location of the semiconductor components 106 within the
semiconductor wafer 102. The semiconductor component 900 performs
the self-contained testing operation in response to receiving the
initiate testing operation signals 850. After completion of the
self-contained testing operation, the semiconductor component 900
wirelessly transmits an individual testing operation outcome 950 of
the self-contained testing operation. The individual testing
operation outcome 950 represents an exemplary embodiment of one of
the testing operation outcomes 852.
[0101] The semiconductor component 900 includes the integrated
circuit under test 214, a transceiver module 902, a metric
measurement module 904, and a testing module 906. The transceiver
module 902 provides initiate test control signals 952.1 through
952.i, herein initiate test control signals 952.1, based upon the
initiate testing operation signals 850 and the individual testing
operation outcome 950 based upon the indication of operability 254.
More specifically, the transceiver module 902 includes a receiver
module 908 and a transmitter module 910. The receiver module 908
downconverts, demodulates, and/or decodes the initiate testing
operation signals 850 to provide the initiate test control signals
952.
[0102] Exemplary Receiver Module Implemented as Part of the Second
Exemplary Semiconductor Component
[0103] FIG. 10 illustrates a schematic block diagram of a receiver
module implemented as part of the second exemplary semiconductor
component according to an exemplary embodiment of the present
invention. A receiver module 1000 downconverts, demodulates, and/or
decodes the initiate testing operation signals 850 to provide the
initiate test control signals 952 in accordance with the multiple
access transmission scheme. The receiver module 1000 represents an
exemplary embodiment of the receiver module 908.
[0104] The receiver module 1000 includes a downconverter module
1002, a demodulating module 1004, and a decoding module 1006. The
downconverter module 1002 frequency translates or downconverts the
initiate testing operation signals 850 to a baseband frequency or
an intermediate frequency (IF) to provide downconverted testing
operation outcomes 1052.1 through 1052.i, herein downconverted
testing operation outcomes 1052. More specifically, the
downconverter module 1002 may downconvert the initiate testing
operation signals 850 using a single carrier frequency to implement
the single carrier multiple access transmission scheme or among
multiple carriers to implement the multiple carrier multiple access
transmission scheme to provide the downconverted testing operation
outcomes 1052. In an exemplary embodiment, the downconverter module
1002 is optional. In this exemplary embodiment, the demodulating
module 1004 directly observes the initiate testing operation
signals 850.
[0105] The demodulating module 1004 demodulates the downconverted
testing operation outcomes 1052 using any suitable analog or
digital demodulation technique for any suitable modulation
technique such as amplitude modulation (AM), frequency modulation
(FM), phase modulation (PM), phase shift keying (PSK), frequency
shift keying (FSK), amplitude shift keying (ASK), quadrature
amplitude modulation (QAM) and/or any other suitable modulation
technique that will be apparent to those skilled in the relevant
art(s) to provide demodulated testing operation outcomes 1054.1
through 1054.i, herein demodulated testing operation outcomes
1054.
[0106] The decoding module 1006 decodes the demodulated testing
operation outcomes 1054 using any suitable multiple access
transmission scheme to provide the initiate test control signals
952. In an exemplary embodiment, the decoding module 1006 decodes
the demodulated testing operation outcomes 1054 in accordance with
a code division multiple access (CDMA) scheme. In this exemplary
embodiment, the decoding module 1006 includes a despreading code
generator 1008 and a despreading module 1010. The despreading code
generator 1008 provides unique random, pseudo-random, and/or
non-random sequences of data, referred to as despreading codes
1056.1 through 1056.n, to the despreading module 1010. Each of the
despreading codes 1056.1 through 1056.n represent a spreading code
that corresponds to each of the initiate testing operation signals
850. For example, the despreading code 1056.1 represents the
spreading code used by the wireless automatic test equipment 802 to
provide the initiate testing operation signal 850.1. The
despreading code module 1010 utilizes the despreading codes 1056.1
through 1056.n to decode the demodulated testing operation outcomes
1054 to provide a total of n*i=k initiate test control signals
952.
[0107] Referring again to FIG. 9, the transmitter module 210
encodes, modulates, and/or upconverts the indication of operability
254 in accordance with the multiple access transmission scheme to
provide the individual testing operation outcome 950, as discussed
above.
[0108] The metric measurement module 904 determines one or more
signal metrics of the initiate test control signals 952 to provide
measured signal metrics 954.1 through 954.k, herein measured signal
metrics 954. The one or more signal metrics may include a mean, a
total energy, an average power, a mean square, an instantaneous
power, a root mean square, a variance, a norm, a voltage level
and/or any other suitable signal metric of the initiate test
control signals 952 that will be apparent by those skilled in the
relevant art(s) without departing from the spirit and scope of the
present invention.
[0109] The testing module 906 operates in a substantially similar
manner as the testing module 216; therefore only differences
between the testing module 216 and the testing module 906 are to be
discussed in further detail. The testing module 906 utilizes the
measured signal metrics 954 to generate a unique identification
number, or tag, which corresponds to the semiconductor component
900. Specifically, the measured signal metrics 954 for each of the
semiconductor components 900 within the semiconductor wafer 106 may
differ as a result of differences in distances between each of the
semiconductor components 900 and the one or more transmitting
antennas that provide the initiate testing operation signals 850.
The testing module 906 may quantify the measured signal metrics 954
to generate the unique identification number. For example, in an
embodiment of the wireless automatic test equipment 802 having a
first transmitting antenna and a second transmitting antenna, the
testing module 906 may quantify the measured signal metric 954.1
corresponding to the initiate testing operation signal 850.1
provided by the first transmitting antenna as r bits of an s bit
unique identification number and the measured signal metric 954.2
corresponding to the initiate testing operation signal 850.2
provided by the second transmitting antenna as t bits of the s bit
unique identification number. The testing module 906 may quantify
the measured signal metrics 954 using a look-up table, an analog to
digital converter (ADC), or any other suitable means that will be
apparent to those skilled in the relevant art(s) without departing
from the spirit and scope of the present invention. The testing
module 906 may store the unique identification number into one or
more memory devices such as any suitable non-volatile memory, any
suitable volatile memory, or any combination of non-volatile and
volatile memory that will be apparent by those skilled in the
relevant art(s) without departing from the spirit and scope of the
present invention.
[0110] The testing module 906 may additionally append the unique
identification number stored in the one or more memory devices as a
header to the indication of operability 258, or within the
indication of operability 258, before providing the indication of
operability 254 to the transceiver module 902.
[0111] In an exemplary embodiment, the testing module 906 only
provides the indication of operability 254 to the transceiver
module 202 when the indication of operability 258 indicates the
integrated circuit under test 204 operates as expected. In this
situation, the transceiver module 202 does not provide the
individual testing operation outcome 950 when the integrated
circuit under test 204 operates unexpectedly. Alternatively, the
testing module 906 only provides the indication of operability 254
to the transceiver module 202 when the indication of operability
258 indicates the integrated circuit under test 204 operates
unexpectedly. In this situation, the transceiver module 202 does
not provide the individual testing operation outcome 950 when the
integrated circuit under test 204 operates as expected.
[0112] Second Exemplary Wireless Automatic Test Equipment
[0113] FIG. 11 illustrates a schematic block diagram of a second
wireless automatic test equipment according to a first exemplary
embodiment of the present invention. The wireless automatic test
equipment 1100 includes one or more transmitting antennas to
provide the initiate testing operation signals 850 to the
semiconductor components 106 via one or more directions in three
dimensional space via the common communication channel 154. The
wireless automatic test equipment 1100 includes a receiving antenna
to observe the testing operation outcomes 852 in the three
dimensional space. The wireless automatic test equipment 1100 may
determine whether one or more of the semiconductor components 106
operate as expected and, optionally, may determine a location of
the one or more of the semiconductor components 106 within the
semiconductor wafer 102 using unique identification number embedded
within the testing operation outcomes 852. The wireless automatic
test equipment 1100 represents an exemplary embodiment of the
wireless automatic test equipment 104.
[0114] The wireless automatic test equipment 1100 includes the
operator interface module 410, a receiving antenna 1102, a receiver
module 1104, a testing processor 1106, a transmitter module 1108,
and transmitting antennas 1110.1 through 1110.i. The receiving
antenna 1102 observes the testing operation outcome 852 as it
passes through the common communication channel 154 to provide an
observed testing operation outcome 1152. Alternatively, the
wireless automatic test equipment 1100 may include multiple
receiving antennas 1102.1 through 1102.i that are substantially
similar to the receiving antennas 402 as discussed above to observe
the testing operation outcome 852 it passes through the common
communication channel 154 at corresponding positions in the three
dimensional space to provide observed testing operation outcomes
1152.1 through 1152.i.
[0115] The receiver module 1104 downconverts, demodulates, and/or
decodes the observed testing operation outcome 1152 to provide
recovered testing outcomes 1154.1 through 1154.i, herein recovered
testing outcomes 1154, in accordance with the multiple access
transmission scheme, as discussed above. In an exemplary
embodiment, the receiver module 1104 may be implemented in a
substantially manner as the receiver module 600. In this exemplary
embodiment, the receiver module 600 is implemented using a single
input, namely the observed testing operation outcome 1152, to
provide multiple outputs, namely the recovered testing outcomes
1154.
[0116] The testing processor 1106 may determine a first group of
semiconductor components from among the semiconductor components
106 that operate as expected based upon the recovered testing
outcomes 1154. Alternatively, the testing processor 1106 may
determine a second group of semiconductor components from among the
semiconductor components 106 that operate unexpectedly based upon
the recovered testing outcomes 1154. In another alternate, the
testing processor 1106 may determine any combination of the first
group of semiconductor components and the second group of
semiconductor components.
[0117] In an exemplary embodiment, the testing processor 1106 may
provide the testing operation command signal 1156 to the
transmitter module 1108 that causes the transmitter module 1108 to
provide the initiate testing operation signals 850 that causes
those semiconductor components 106 that operate as expected to
enter into a transmitting state and those semiconductor components
106 that operate unexpectedly to enter into a non-transmitting
state. Alternatively, the testing processor 1106 may provide the
testing operation command signal 1156 to the transmitter module
1108 that causes the transmitter module 1108 to provide the
initiate testing operation signals 850 that causes those
semiconductor components 106 that operate unexpectedly to enter
into a transmitting state and those semiconductor components 106
that operate as expected to enter into a non-transmitting state. In
these exemplary embodiments, only those semiconductor components
106 that are in the transmitting state provide their respective
testing operation outcome 852.
[0118] The testing processor 1106 may, optionally, determine a
location of the semiconductor components 106 within the
semiconductor wafer 102 based upon the unique identification number
for each of the semiconductor components 106 that is embedded
within the testing operation outcome 852. The testing processor
1106 may determine the location of each of the semiconductor
components 106, those semiconductor components 106 in the
transmitting state, those semiconductor components 106 in the
non-transmitting state, and/or any combination thereof. The testing
processor 1106 may assemble a map indicating the location of the
semiconductor components 106 within the semiconductor wafer 102 by
comparing the unique identification numbers to a predetermined
mapping of the unique identification numbers to their respective
locations within the semiconductor wafer 102. Alternatively, the
testing processor 1106 may iteratively interpolate the location of
the semiconductor components 106 within the semiconductor wafer 102
based upon relationships between the unique identification numbers
for each of the semiconductor components 106. For example, the
unique identification numbers embedded within the testing operation
outcome 852 may include a first unique identification number and a
second unique identification number. In this example, the testing
processor 1106 may compare the first r bits of the first unique
identification number with the first r bits of the second unique
identification number. If the first r bits of the first unique
identification number are greater than the first r bits of the
second unique identification number, then the semiconductor
component 106 that corresponds to the first unique identification
is closer to the receiving antenna 1102 when compared to the
semiconductor component 106 that corresponds to the second unique
identification. As another example, if the first r bits of the
first unique identification number are less than the first r bits
of the second unique identification number, then the semiconductor
component 106 that corresponds to the first unique identification
is farther from the receiving antenna 1102 when compared to the
semiconductor component 106 that corresponds to the second unique
identification.
[0119] The transmitter module 1108 receives an testing operation
command signal 1156 from the testing processor 1106. The
transmitter module 1108 encodes, modulates and/or upconverts the
testing operation command signal 1156 to provide initiate testing
operation signals 1158.1 through 1158.i.
[0120] Exemplary Transmitter Module Implemented as Part Of the
Second Exemplary Wireless Automatic Test Equipment
[0121] FIG. 12 illustrates a schematic block diagram of a first
transmitter module implemented as part of the second wireless
automatic test equipment according to a first exemplary embodiment
of the present invention. A transmitter module 1200 encodes,
modulates, and/or upconverts the indication of operability 254 to
provide the individual testing operation outcome 250 in accordance
with the multiple access transmission scheme, as discussed above.
The transmitter module 1200 represents an exemplary embodiment of
the transmitter module 210.
[0122] The transmitter module 1200 includes an encoding module
1202, a modulating module 1208, and an upconverter module 1210. The
encoding module 1202 encodes the testing operation command signal
1156 in accordance with the multiple access transmission scheme to
provide an encoded indication of operability 1250. In an exemplary
embodiment, the encoding module 1202 encodes the testing operation
command signal 1156 in accordance with a code division multiple
access (CDMA) scheme. In this exemplary embodiment, the encoding
module 1202 includes a spreading code generator 1204 and a
spreading module 1206. The spreading code generator 1204 provides a
unique random, pseudo-random, and/or non-random sequence of data,
referred to as a spreading code 1252, to the spreading module 1206.
The spreading code 1252 represents to a sequence of bits that is
unique to each of the transmitting antennas 1110.1 through 1110.i,
herein the transmitting antennas 1110, or groups of the
transmitting antennas 1110, to encode the indication of operability
254. The spreading module 1206 utilizes the spreading code 1252 to
encode the testing operation command signal 1156 to provide
spreaded initiate self-contained testing operations 1254.1 through
1254.1.
[0123] The modulating module 1208 modulates the spreaded initiate
self-contained testing operations 1254.1 through 1254.1 using any
suitable analog or digital modulation techniques such as amplitude
modulation (AM), frequency modulation (FM), phase modulation (PM),
phase shift keying (PSK), frequency shift keying (FSK), amplitude
shift keying (ASK), quadrature amplitude modulation (QAM) and/or
any other suitable modulation technique that will be apparent to
those skilled in the relevant art(s) to provide modulated initiate
self-contained testing operations 1256.1 through 1256.i.
[0124] The upconverter module 1210 frequency translates or
upconverts the modulated initiate self-contained testing operations
1256.1 through 1256.i to provide the initiate testing operation
signals 1158.1 through 1158.i. More specifically, the upconverter
module 1210 may upcovert the modulated initiate self-contained
testing operations 1256.1 through 1256.i using a single carrier
frequency and/or among multiple carriers to implement the multiple
access transmission to provide the initiate testing operation
signals 1158.1 through 1158.i. In an exemplary embodiment, the
upconverter module 1210 is optional. In this exemplary embodiment,
the modulating module 1208 directly provides the modulated initiate
self-contained testing operations 1256.1 through 1256.1 as the
initiate testing operation signals 1158.1 through 1158.i.
[0125] Referring again to FIG. 11, the transmitting antennas 1110
provide the initiate testing operation signals 1158.1 through
1158.i as the initiate testing operation signals 850.1 through
850.i to the semiconductor components 106. In an exemplary
embodiment, the transmitter module 1108 wirelessly sends the
initiate testing operation signals 850.1 through 850.i to all of
the semiconductor components 106 within the semiconductor wafer
102. However, this example is not limiting, those skilled in the
relevant art(s) will recognize that initiate testing operation
signals 850.1 through 850.i may be sent to a lesser number of the
semiconductor components 106 within the semiconductor wafer 102
without departing from the spirit and scope of the present
invention. The transmitting antennas 1110 may be positioned in the
three dimensional space in a substantially similar manner as the
receiving antennas 402. In another exemplary embodiment, the
transmitting antennas 1110 include two transmitting antennas,
namely a first transmitting antenna 1110.1 and a second
transmitting antenna 1110.2. In this exemplary embodiment, the
first transmitting antenna 1110.1 and the second transmitting
antenna 1110.2 are placed at a distance of d.sub.1 and d.sub.2,
correspondingly, from a center of the semiconductor wafer 102, the
distance d.sub.1 and the distance d.sub.2 being similar to or
dissimilar from each other. In this exemplary embodiment, the first
transmitting antenna 1110.1 is separated from the second
transmitting antenna 1110.2 by an angle .theta., such as ninety
degrees to provide an example.
[0126] It should be noted that particular features, structures, or
characteristics of the wireless automatic test equipment 400 and/or
the wireless automatic test equipment 1100 are not limited to the
embodiments of these wireless automatic test equipment as discussed
above in FIG. 4 and FIG. 11. Rather, particular features,
structures, or characteristics of the wireless automatic test
equipment 400 may be combined with particular features, structures,
or characteristics of the wireless automatic test equipment 1100 to
provide additional exemplary embodiments of the wireless automatic
test equipment. For example, another exemplary embodiment of the
wireless automatic test equipment may include the receiving
antennas 402 as discussed above in FIG. 4 and the transmitting
antenna 1110 as discussed above in FIG. 11. Likewise, particular
features, structures, or characteristics of the semiconductor
component 200, and/or the semiconductor component 900 are not
limited to the embodiments of these semiconductor components as
discussed above in FIG. 2 and FIG. 9. Rather, particular features,
structures, or characteristics of the semiconductor component 200
and/or the semiconductor component 900 may be combined with
features, structures, or characteristics from one another to
provide additional exemplary embodiments of the semiconductor
component.
[0127] Methods to Verify the Semiconductor Components Operate as
Expected and, Optionally, to Determine a Location of the
Semiconductor Components within the Semiconductor Wafer
[0128] FIG. 13 is a flowchart 1300 of exemplary operational steps
of a wireless automatic test equipment according to an exemplary
embodiment of the present invention. The invention is not limited
to this operational description. Rather, it will be apparent to
persons skilled in the relevant art(s) from the teachings herein
that other operational control flows are within the scope and
spirit of the present invention. The following discussion describes
the steps in FIG. 13.
[0129] At step 1302, one or more semiconductor components, such as
one or more semiconductor components from among the semiconductor
components 106 to provide an example, within a semiconductor wafer,
such as the semiconductor wafer 102 to provide an example, are
activated. The one or more semiconductor components may represent
some or all of the semiconductor components that are formed onto
the semiconductor wafer. The one or more semiconductor components
may be activated by wirelessly receiving power from wireless
automatic test equipment, such as the wireless automatic test
equipment 104 or the wireless automatic test equipment 802 to
provide some examples, as disclosed in U.S. patent application Ser.
No. 12/877,955, filed on Sep. 8, 2010, which claims the benefit of
U.S. Provisional Patent Application No. 61/298,751, filed on Jan.
27, 2010, each of which is incorporated by reference in its
entirety. Alternatively, the one or more semiconductor components
may receive power from a reduced semiconductor wafer testing probe.
The reduced semiconductor wafer testing probe is less complicated
than the conventional wafer testing probe, namely this reduced
semiconductor wafer testing probe does not include a full
complement of electronic testing probes to verify that the
semiconductor components operate as expected. In an exemplary
embodiment, this reduced semiconductor wafer testing probe only
includes sufficient probes to provide the power to the one or more
semiconductor components.
[0130] At step 1304, the wireless automatic test equipment provides
a first initiate testing operation signal, such as the initiate
testing operation signal 150 and/or a second initiate testing
operation signal, such as the initiate testing operation signal 850
to the one or more semiconductor components from step 1302. The
wireless automatic test equipment provides the first initiate
testing operation signal using a transmitting antenna, such as a
transmitting antenna 414 to provide an example, and/or the second
initiate testing operation signal using multiple transmitting
antennas, such as the transmitting antennas 1110 to provide an
example, positioned in three dimensional space as described in FIG.
5A through FIG. 5C. The one or more semiconductor components from
step 1302 may optionally determine one or more signal metrics of
the second initiate testing operation signal from each of the
multiple transmitting antennas. The one or more semiconductor
components from step 1302 may generate a unique identification
number, or tag, based upon the one or more signal metrics which may
be used by the wireless automatic test equipment to determine a
location of the one or more semiconductor components from step 1302
within the semiconductor wafer from step 1302. Alternatively, the
one or more semiconductor components from step 1302 may include a
random number generator to generate the unique identification
number.
[0131] The first initiate testing operation signal and/or the
second initiate testing operation signal may include a first set of
parameters to be used by a first set of instructions that are
stored within the one or more semiconductor components from step
1302 to perform a self-contained testing operation. Alternatively,
the first initiate testing operation signal and/or the second
initiate testing operation signal may include a second set of
instructions and/or a second set of parameters to be used by the
second set of instructions that are to be used by the one or more
semiconductor components from step 1302 to perform a self-contained
testing operation. In another alternate, the first initiate testing
operation signal and/or the second initiate testing operation
signal may include any combination of the first set of parameters,
the second set of parameters, and/or the second set of
instructions.
[0132] At step 1306, the one or more semiconductor components from
step 1302 execute the self-contained testing operation. The
self-contained testing operation may utilize the first set of
parameters provided by the first initiate testing operation signal
and/or the second initiate testing operation signal from step 1304
to perform the first set of instructions that are stored within the
one or more semiconductor components from step 1302. Alternatively,
the self-contained testing operation may execute the second set of
instructions provided by the first initiate testing operation
signal and/or the second initiate testing operation signal from
step 1304 and/or the second set of parameters to be used by the
second set of instructions that are provided by the by the first
initiate testing operation signal and/or the second initiate
testing operation signal from step 1304. In another alternate, the
self-contained testing operation may include any combination of the
first set of instructions, the second set of instructions, the
first set of parameters and/or the second set of parameters.
[0133] At step 1308, the one or more semiconductor components from
step 1302 communicate a testing operation outcome, such as the
testing operation outcomes 152 and/or the testing operation outcome
852 to provide some examples, of the self-contained testing
operation to the wireless automatic test equipment from step 1302.
The one or more semiconductor components from step 1302 wirelessly
transmit the testing operation outcomes to the wireless automatic
test equipment from step 1302 over a common communication channel
using the multiple access transmission scheme as described above.
The testing operation outcome may include the unique identification
number from step 1304 to allow the wireless automatic test
equipment from step 1302 to determine the location of the
semiconductor components from step 1302 within the semiconductor
wafer from step 1302.
[0134] At step 1310, the wireless automatic test equipment from
step 1302 observes the testing operation outcomes from step 1308 as
they pass through the common communication channel. The wireless
automatic test equipment from step 1302 may observe the testing
operation outcomes from step 1308 using a receiving antenna, such
as a receiving antenna 1102 to provide an example, or multiple
receiving antennas, such as the receiving antennas 402 to provide
an example, positioned in three dimensional space as described in
FIG. 5A through FIG. 5C.
[0135] At step 1312, the wireless automatic test equipment from
step 1302 may determine which of the one or more semiconductor
components from step 1302 operate as expected and, optionally,
their location within the semiconductor wafer from step 1302 based
upon the testing operation outcomes observed from step 1310.
[0136] The wireless automatic test equipment from step 1302 may
determine a first group of semiconductor components from among the
one or more semiconductor components from step 1302 that operate as
expected based upon the testing operation outcomes observed from
step 1310. The wireless automatic test equipment from step 1302
evaluates the testing operation outcomes observed from step 1310
for each of the unique identification numbers from step 1304 to
determine whether its corresponding the one or more semiconductor
components from step 1302 is part of the first group of
semiconductor components. Alternatively, the wireless automatic
test equipment from step 1302 may determine a second group of
semiconductor components from among the one or more semiconductor
components from step 1302 that operate unexpectedly based upon the
testing operation outcomes observed from step 1310. In another
alternate, the wireless automatic test equipment from step 1302 may
determine any combination of the first group of semiconductor
components and the second group of semiconductor components. The
wireless automatic test equipment from step 1302 may, optionally,
determine one or more signal metrics of the testing operation
outcomes observed from step 1310 to determine a location of the one
or more semiconductor components from step 1302 within the
semiconductor wafer from step 1302.
[0137] The wireless automatic test equipment from step 1302 may
assign the one or more signal metrics to corresponding coordinates
from among i sets of coordinates in the three dimensional space.
The wireless automatic test equipment from step 1302 assigns the
unique identification number from step 1304 to the i sets of
coordinates. The wireless automatic test equipment from step 1302
maps the unique identification number from step 1304 to their
corresponding semiconductor component 106 to determine the location
of the one or more semiconductor components from step 1302 within
the semiconductor wafer from step 1302. The wireless automatic test
equipment from step 1302 may determine the location of the one or
more semiconductor components from step 1302 by comparing the one
or more signal metrics corresponding to each of the unique
identification number from step 1304 to predetermined signal
metrics for each of the one or more semiconductor components from
step 1302. Alternatively, the wireless automatic test equipment
from step 1302 may iteratively interpolate the location of the
unique identification numbers from step 1304 to the semiconductor
components from step 1302 within the semiconductor wafer from step
1302 based upon relationships between their corresponding one or
more signal metrics.
[0138] Alternatively, the wireless automatic test equipment from
step 1302 may assemble a map indicating the location of the
semiconductor components from step 1302 within the semiconductor
wafer from step 1302 by comparing the unique identification numbers
to a predetermined mapping of the unique identification numbers to
their respective locations within the semiconductor wafer from step
1302. Alternatively, the wireless automatic test equipment from
step 1302 may iteratively interpolate the location of the
semiconductor components from step 1302 within the semiconductor
wafer from step 1302 based upon relationships between the unique
identification numbers for each of the semiconductor components
from step 1302.
[0139] Tagging of Functional Blocks of the Semiconductor
Components
[0140] FIG. 14 illustrates a schematic block diagram of an
integrated circuit under test implemented as part of the first
and/or the second exemplary semiconductor components according to
an exemplary embodiment of the present invention. An integrated
circuit under test 1400 executes the self-contained testing
operation 256 to determine whether it operates as expected. The
integrated circuit under test 1400 includes one or more hardware
modules, whereby some of these hardware modules may be divided into
functional blocks B1 through B4. However, this example is for
illustrative purposes only, it will be apparent to those skilled in
the relevant art(s) that the integrated circuit under test 1400 may
be divided differently into a lesser or a greater number of
functional blocks without departing from the spirit and scope of
the present invention.
[0141] The functional blocks B1 through B4 may encompass different
hardware modules of the integrated circuit under test 1400 which
may perform differing and/or similar functions. For example, a
first functional block B1 may encompass a first transmitter that is
configured to operate in accordance with an Institute of Electrical
and Electronics Engineers (IEEE) communication standard, such as
the IEEE 802.11 communications standard to provide an example. In
this example, a second functional block B2 may encompass a second
transmitter that is configured to operate in accordance with a
Bluetooth communication standard. Additionally, some of the
hardware modules of the integrated circuit under test 1400 may be
assigned to more than one of the functional blocks B1 through B4.
From the example above, the first transmitter and the second
transmitter may share a common amplifier module. This common
amplifier module may be assigned to the first functional block B1
and the second functional block B2 or assigned to a third
functional block B3 that encompasses different hardware from the
first functional block B1 and the second functional block B2.
[0142] Each of the functional blocks B1 through B4 may be assigned,
or tagged, with a unique identifier. The unique identifier
represents a sequence of bits that is unique to each of the
functional blocks B1 through B4. In an exemplary embodiment, the
unique identifier for each of the functional blocks B1 through B4
is stored in a memory device, such as any suitable non-volatile
memory, any suitable volatile memory, or any combination of
non-volatile and volatile memory that will be apparent to those
skilled in the relevant art(s), that is implemented as part of a
testing module, such as the testing module 206 or the testing
module 906 to provide some examples. In another exemplary
embodiment, the unique identifiers for the functional blocks B1
through B4 may be provided to the memory device by wireless
automatic test equipment, such as the wireless automatic test
equipment 400 or the wireless automatic test equipment 1100 to
provide some examples. In this exemplary embodiment, the unique
identifiers for the functional blocks B1 through B4 may be provided
by the wireless automatic test equipment via an initiate testing
operation signal, such as the initiate testing operation signal 150
or the initiate testing operation signals 850 to provide an
example. Alternatively, the unique identifiers for the functional
blocks B1 through B4 may be written into the memory device during
manufacture of a semiconductor component that includes the
integrated circuit under test 1400. In another alternate, each of
the functional blocks B1 through B4 may include the memory device
which stores the unique identifier for each of the functional
blocks B1 through B4.
[0143] The functional blocks B1 through B4 may execute the
self-contained testing operation 256, or a portion thereof, to
determine whether they operate as expected. For example, the
self-contained testing operation 256 may include one or more
testing routines to be performed by the functional blocks B1
through B4. The one or more testing routines may include any
combination of the first set of instructions, the second set of
instructions, the first set of parameters and/or the second set of
parameters as discussed above. In this example, the functional
block B1 and the functional block B2 may execute a first testing
routine and a second testing routine, respectively, thereof, to
determine whether they operate as expected. Alternatively, the
functional block B1 may execute the first testing routine and
provide information resulting from the execution of the first
testing routine to the functional block B2. The functional block B2
may use this information to execute the second testing routine to
determine whether it operates as expected.
[0144] The functional blocks B1 through B4 provide the indication
of operability 258 to the testing module, such as the testing
module 206 or the testing module 906 to provide some examples,
during and/or after execution of the self-contained testing
operation 256. The indication of operability indicates whether the
functional blocks B1 through B4 operate as expected or,
alternatively, whether the functional blocks B1 through B4 operate
unexpectedly and, optionally, the one or more of the functional
blocks B1 through B4 that operates unexpectedly. Alternatively, the
functional blocks B1 through B4 may provide their unique identifier
as the indication of operability 258 to indicate that its
corresponding functional block B1 through B4 operates as expected
or, alternatively, operates unexpectedly.
[0145] The testing module, such as the testing module 206 or the
testing module 906 to provide some examples, may analyze the
indication of operability 258 to provide an indication of
operability, such as the indication of operability 254 to provide
an example. The testing module may provide the indication of
operability that indicates that the functional blocks B1 through B4
operate as expected or, alternatively, or indicates that the
functional blocks B1 through B4 operate unexpectedly and,
optionally, the unique identifier corresponding to the functional
blocks B1 through B4 that operates unexpectedly.
[0146] The tagging of the functional blocks of the semiconductor
components in the manner as described above allows the wireless
automatic test equipment, such as the wireless automatic test
equipment 400 or the wireless automatic test equipment 1100 to
provide some examples, to determine which functional blocks operate
as expected. This allows manufacturers of the semiconductor
components to distribute semiconductor components having lesser
functionality even though these semiconductor components may be
designed to perform greater functionality. For example, the
integrated circuit under test 1400 may include a first transmitter
that is configured to operate in accordance with the IEEE
communication standard and a second transmitter that is configured
to operate in accordance with the Bluetooth communication standard.
In this example, the manufacturers of the integrated circuit under
test 1400 may be able to distribute the semiconductor component
having the integrated circuit under test 1400 as having the first
transmitter even though the second transmitter does not operate as
expected.
[0147] Optional Modules that May be Implemented as Part of the
First or the Second Exemplary Wireless Automatic Test Equipment
[0148] FIG. 15 illustrates a schematic block diagram of a thermal
imaging module that may be implemented as part of the first or the
second exemplary wireless automatic test equipment according to an
exemplary embodiment of the present invention. A wireless testing
environment 1500 includes a wireless testing equipment 1502 to
allow for simultaneous testing of the semiconductor wafer 152 to
verify that the semiconductor components 106 operate as expected.
The wireless testing equipment 1502 has many features in common
with the wireless testing equipment 104 and/or the wireless testing
equipment 802 as discussed above; therefore, only differences
between the wireless testing equipment 1502 and the wireless
testing equipment 104 and/or the wireless testing equipment 802 are
to be described in further detail.
[0149] The wireless testing equipment 1502 includes a performance
measurement module 1504 to measure a performance of the
semiconductor components 106. The performance measurement module
1504 observes semiconductor wafer infrared energy 1550 that is
produced by the semiconductor wafer 152. More specifically, the
semiconductor components 106 produce a corresponding one of
semiconductor component infrared energies 1552.1 through 1552.n
before, during, and/or after execution of the self-contained
testing operation. For example, the semiconductor component 156.1
produces the semiconductor component infrared energy 1552.1 during
execution of the self-contained testing operation.
[0150] The performance measurement module 1504 processes the
semiconductor wafer infrared energy 1550 to provide a semiconductor
wafer thermogram of the semiconductor wafer 152. The performance
measurement module 1504 isolates a semiconductor component
thermogram for the semiconductor components 106 from the
semiconductor wafer thermogram. The performance measurement module
1504 compares the semiconductor component thermograms to one or
more predetermined semiconductor component thermograms to measure
the performance of the semiconductor components 106.
[0151] Second Exemplary Wireless Automatic Test Equipment
[0152] FIG. 16 illustrates a schematic block diagram of an optional
performance measurement module implemented as part of the first or
the second exemplary wireless automatic test equipment according to
an exemplary embodiment of the present invention. A performance
measurement module 1600 includes a thermal imaging module 1602 and
a thermogram processor 1604 to measure a performance of the
semiconductor components 106 based upon the semiconductor wafer
infrared energy 1550. The performance measurement module 1600 may
represent an exemplary embodiment of the performance measurement
module 1504.
[0153] The thermal imaging module 1602 includes a thermal imaging
device, such as a thermographic camera, a thermographic sensor,
and/or any other suitable device that is capable of detecting
infrared energy of the electromagnetic spectrum that is emitted,
transmitted, and/or reflected by the semiconductor wafer 102. The
thermal imaging module 1602 observes the semiconductor wafer
infrared energy 1550 that is emitted, transmitted, and/or reflected
by the semiconductor wafer 102. More specifically, the thermal
imaging module 1602 observes the semiconductor component infrared
energy 1552.1 through 1552.n as the semiconductor wafer infrared
energy 1550 before, during, and/or after execution of the
self-contained testing operation. The thermal imaging module 1602
provides an observed thermal infrared energy 1650 to the thermogram
processor 1604.
[0154] The thermogram processor 1604 processes the observed thermal
infrared energy 1650 to provide a performance measure 1652 for the
semiconductor components 106. The performance measure 1652 may be
provided to an operator interface module, such as the operator
interface module 410 to provide an example, for further processing
for display on a graphical user interface. Alternatively, the
performance measure 1652 may be provided to a testing processor,
such as the testing processor 408 and/or the testing processor 1106
to provide some examples, to be included as part of the listing of
testing results 460.
[0155] Exemplary Processing of Thermograms
[0156] FIG. 17A illustrates an operation of a thermogram processor
used in the optional performance measurement module according to an
exemplary embodiment of the present invention. The thermogram
processor 1604 processes the observed thermal infrared energy 1650
to provide a semiconductor wafer thermogram 1700. The semiconductor
wafer thermogram 1700 indicates the infrared energy emitted,
transmitted, and/or reflected by the semiconductor wafer 102 as
interpreted by one or more thermal processing algorithms. Those
areas of the semiconductor wafer thermogram 1700 that are lightly
shaded emit, transmit, and/or reflect more infrared energy than
those areas of the semiconductor wafer thermogram 1700 that are
heavily shaded. The semiconductor wafer thermogram 1700 as shown is
for illustrative purposes only; those skilled in the relevant
art(s) will recognize that other semiconductor wafer thermograms
are possible without departing from the spirit and scope of the
present invention.
[0157] The thermogram processor 1604 isolates a corresponding
semiconductor component thermogram 1702.1 through 1702.n for each
of the semiconductor components 106 from the semiconductor wafer
thermogram 1700. For example, the thermogram processor 1604
isolates the semiconductor component thermogram 1702.1
corresponding to the semiconductor component 106.1 from the
semiconductor wafer thermogram 1700. Alternatively, the testing
processor 408 may provide information relating to those
semiconductor components 106 that operate as expected and their
location within the semiconductor wafer 102. In this alternate, the
thermogram processor 1604 isolates a corresponding semiconductor
component thermogram 1702.1 through 1702.n for those semiconductor
components 106 that operate as expected from the semiconductor
wafer thermogram 1700.
[0158] The thermogram processor 1604 compares the semiconductor
component thermograms 1702.1 through 1702.n to one or more
predetermined semiconductor component thermograms to provide the
performance measure 1152 for each of the semiconductor components
106, or, alternatively, for those semiconductor components 106 that
operate as expected.
[0159] FIG. 17B illustrates predetermined semiconductor component
thermograms according to an exemplary embodiment of the present
invention. The thermogram processor 1604 compares the semiconductor
component thermograms 1702.1 through 1702.n to a predetermined
semiconductor wafer thermogram 1704 to provide the performance
measure 1152.
[0160] The predetermined semiconductor component thermogram 1704
includes predetermined semiconductor wafer thermograms 1706.1
through 1706.n. Each of the predetermined semiconductor wafer
thermograms 1706.1 through 1706.n are assigned to an indicia of
performance 1708.1 through 1708.n. In an exemplary embodiment, the
indicia of performance 1708.1 represents semiconductor components
of the lowest quality and the indicia of performance 1708.n
represents semiconductor components of the highest quality. The
semiconductor components of the lowest quality emit, transmit,
and/or reflect more infrared energy when compared to the
semiconductor components of the highest quality when performing the
self-contained testing operation. As a result, the semiconductor
components of the highest quality components are suitable to
operate at higher operational speeds when compared to the
semiconductor components of the lower quality.
[0161] The semiconductor components 106 that have a corresponding
semiconductor component thermogram 1702.1 through 1702.n that
closely approximates one of the predetermined semiconductor wafer
thermograms 1706.1 through 1706.n are assigned to the corresponding
indicia of performance 1708.1 through 1708.n. For example, the
semiconductor components 106.1 and 106.n exhibit the semiconductor
component thermograms 1702.1 and 1702.n, correspondingly, that
closely approximate the predetermined semiconductor wafer
thermogram 1706.1; therefore, the semiconductor components 106.1
and 106.n is assigned to the indicia of performance 1708.1.
Similarly, the semiconductor component 106.2 exhibits the
semiconductor component thermogram 1702.2 that closely approximates
the predetermined semiconductor wafer thermogram 1706.2; therefore,
the semiconductor components 106.2 is assigned to the indicia of
performance 1708.2.
[0162] Methods to Measure a Performance of the Semiconductor
Components within the Semiconductor Wafer
[0163] FIG. 18 is a flowchart 1800 of exemplary operational steps
of the second wireless component testing environment according to
an exemplary embodiment of the present invention. The invention is
not limited to this operational description. Rather, it will be
apparent to persons skilled in the relevant art(s) from the
teachings herein that other operational control flows are within
the scope and spirit of the present invention. The following
discussion describes the steps in FIG. 18.
[0164] At step 1802, one or more semiconductor components, such as
the semiconductor components 106 to provide an example, are formed
onto a semiconductor wafer, such as the semiconductor wafer 102 to
provide an example, execute a self-contained testing operation in a
testing mode of operation. The self-contained testing operation
represents instructions to be performed and/or one or more
parameters to be used by the instructions that are used by the one
or more semiconductor components to determine whether they operate
as expected.
[0165] At step 1804, a wireless testing equipment, such as the
wireless testing equipment 1100 to provide an example, observes
infrared energy that is emitted, transmitted, and/or reflected by
the semiconductor wafer before, during, and/or after execution of
the self-contained testing operation. The wireless testing
equipment may use a thermal imaging device, such as a thermographic
camera, a thermographic sensor, and/or any other suitable device
that is capable of detecting infrared energy of the electromagnetic
spectrum that is emitted, transmitted, and/or reflected by the
semiconductor wafer.
[0166] At step 1806, the wireless testing equipment processes the
observed infrared energy to provide a semiconductor wafer
thermogram of the semiconductor wafer 102. The semiconductor wafer
thermogram indicates the infrared energy emitted, transmitted,
and/or reflected by the semiconductor wafer as interpreted by one
or more thermal processing algorithms.
[0167] At step 1808, the wireless testing equipment isolates a
semiconductor component thermogram for each of the semiconductor
components from the semiconductor wafer thermogram.
[0168] At step 1810, the wireless testing equipment compares the
semiconductor component thermograms to one or more predetermined
semiconductor component thermograms to measure the performance of
the semiconductor components. Each of the predetermined
semiconductor wafer thermograms are assigned to an indicia of
performance. The semiconductor components that have a corresponding
semiconductor component thermogram that closely approximates one of
the predetermined semiconductor wafer thermograms are assigned to
the corresponding indicia of performance.
CONCLUSION
[0169] It is to be appreciated that the Detailed Description
section, and not the Abstract section, is intended to be used to
interpret the claims. The Abstract section may set forth one or
more, but not all exemplary embodiments, of the present invention,
and thus, are not intended to limit the present invention and the
appended claims in any way.
[0170] The present invention has been described above with the aid
of functional building blocks illustrating the implementation of
specified functions and relationships thereof. The boundaries of
these functional building blocks have been arbitrarily defined
herein for the convenience of the description. Alternate boundaries
may be defined so long as the specified functions and relationships
thereof are appropriately performed.
[0171] It will be apparent to those skilled in the relevant art(s)
that various changes in form and detail can be made therein without
departing from the spirit and scope of the invention. Thus, the
present invention should not be limited by any of the
above-described exemplary embodiments, but should be defined only
in accordance with the following claims and their equivalents.
* * * * *