Zhao; Sam Ziqun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Zhao; Sam Ziqun.The latest application filed is for "redistribution metal and under bump metal interconnect structures and method".

Company Profile

6.151.161

Zhao; Sam Ziqun - Irvine CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Redistribution metal and under bump metal interconnect structures and method Grant 11,049,829 - Zhao , et al. June 29, 2	2021-06-29
Thin recon interposer package without TSV for fine input/output pitch fan-out Grant 10,615,110 - Zhao , et al.	2020-04-07
Redistribution Metal And Under Bump Metal Interconnect Structures And Method App 20200105698 - Zhao; Sam Ziqun ; et al.	2020-04-02
Redistribution metal and under bump metal interconnect structures and method Grant 10,504,862 - Zhao , et al. Dec	2019-12-10
High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer Grant 10,276,403 - Zhao , et al.	2019-04-30
Redistribution Metal And Under Bump Metal Interconnect Structures And Method App 20190123007 - Zhao; Sam Ziqun ; et al.	2019-04-25
Thin Recon Interposer Package Without Tsv For Fine Input/output Pitch Fan-out App 20180308791 - ZHAO; Sam Ziqun ; et al.	2018-10-25
Heat spreader having thermal interface material retainment Grant 10,079,191 - Zhao , et al. September 18, 2	2018-09-18
Reconstituted Interposer Semiconductor Package App 20180233440 - Law; Edward ; et al.	2018-08-16
Thin recon interposer package without TSV for fine input/output pitch fan-out Grant 10,008,439 - Zhao , et al. June 26, 2	2018-06-26
Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments Grant 9,891,951 - Rofougaran , et al. February 13, 2	2018-02-13
High Density Redistribution Layer (rdl) Interconnect Bridge Using A Reconstituted Wafer App 20170365565 - ZHAO; Sam Ziqun ; et al.	2017-12-21
Wafer level system in package (SiP) using a reconstituted wafer and method of making Grant 9,842,827 - Zhao , et al. December 12, 2	2017-12-12
Fan-out 3D IC integration structure without substrate and method of making the same Grant 9,837,378 - Khan , et al. December 5, 2	2017-12-05
Wafer Level System In Package (sip) Using A Reconstituted Wafer And Method Of Making App 20170301651 - Zhao; Sam Ziqun ; et al.	2017-10-19
Wireless bus for intra-chip and inter-chip communication, including adaptive link and route embodiments Grant 9,772,880 - Rofougaran , et al. September 26, 2	2017-09-26
Magnetic-core three-dimensional (3D) inductors and packaging integration Grant 9,693,461 - Zhao , et al. June 27, 2	2017-06-27
Semiconductor device with a variable-width vertical channel formed through a plurality of semiconductor layers Grant 9,680,002 - Zhao , et al. June 13, 2	2017-06-13
Fan-out 3D IC Integration Structure without Substrate and Method of Making the Same App 20170117251 - KHAN; Rezaur Rahman ; et al.	2017-04-27
Heat Spreader Having Thermal Interface Material Retainment App 20170110384 - Zhao; Sam Ziqun ; et al.	2017-04-20
Apparatus and method to monitor thermal runaway in a semiconductor device Grant 9,618,560 - Zhao April 11, 2	2017-04-11
Wireless bus for intra-chip and inter-chip communication, including resource borrowing embodiments Grant 9,612,871 - Rofougaran , et al. April 4, 2	2017-04-04
Wireless communicating among vertically arranged integrated circuits (ICs) in a semiconductor package Grant 9,570,420 - Castaneda , et al. February 14, 2	2017-02-14
Semiconductor interposer having a cavity for intra-interposer die Grant 9,548,251 - Khan , et al. January 17, 2	2017-01-17
Thin Recon Interposer Package Without TSV for Fine Input/Output Pitch Fan-Out App 20170011993 - ZHAO; Sam Ziqun ; et al.	2017-01-12
Apparatus and Method to Monitor Thermal Runaway in a Semiconductor Device App 20170003339 - ZHAO; Sam Ziqun	2017-01-05
Semiconductor Device with a Vertical Channel Formed Through a Plurality of Semiconductor Layers App 20160308042 - ZHAO; Sam Ziqun ; et al.	2016-10-20
Hybrid thermal interface material for IC packages with integrated heat spreader Grant 9,472,485 - Saeidi , et al. October 18, 2	2016-10-18
Creating a system on the fly and applications thereof Grant 9,459,921 - Rofougaran , et al. October 4, 2	2016-10-04
Semiconductor package with a bridge interposer Grant 9,431,371 - Karikalan , et al. August 30, 2	2016-08-30
Compliant dielectric layer for semiconductor device Grant 9,431,370 - Khan , et al. August 30, 2	2016-08-30
Interposer package-on-package structure Grant 9,406,636 - Zhao , et al. August 2, 2	2016-08-02
Semiconductor device with a vertical channel formed through a plurality of semiconductor layers Grant 9,406,793 - Zhao , et al. August 2, 2	2016-08-02
Semiconductor border protection sealant Grant 9,390,993 - Zhao , et al. July 12, 2	2016-07-12
Interconnect Structure For Molded Ic Packages App 20160190057 - Zhao; Sam Ziqun ; et al.	2016-06-30
Stacked Packaging Using Reconstituted Wafers App 20160155728 - ZHAO; Sam Ziqun ; et al.	2016-06-02
Method and Apparatus for Cooling Semiconductor Device Hot Blocks and Large Scale Integrated Circuit (IC) Using Integrated Interposer for IC Packages App 20160148890 - KHAN; Rezaur Rahman ; et al.	2016-05-26
Apparatus for reconfiguring an integrated waveguide Grant 9,318,785 - Rofougaran , et al. April 19, 2	2016-04-19
Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages Grant 9,299,634 - Khan , et al. March 29, 2	2016-03-29
Stacked packaging using reconstituted wafers Grant 9,293,393 - Hu , et al. March 22, 2	2016-03-22
Wireless bus for intra-chip and inter-chip communication, including data center/server embodiments Grant 9,286,121 - Rofougaran , et al. March 15, 2	2016-03-15
System-in-package with integrated socket Grant 9,275,976 - Zhao , et al. March 1, 2	2016-03-01
Semiconductor Border Protection Sealant App 20160049348 - ZHAO; Sam Ziqun ; et al.	2016-02-18
Semiconductor Device With A Vertical Channel App 20160005850 - ZHAO; Sam Ziqun ; et al.	2016-01-07
Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding Grant 9,230,875 - Zhao , et al. January 5, 2	2016-01-05
Reconstituted Interposer Semiconductor Package App 20150340308 - LAW; Edward ; et al.	2015-11-26
Magnetic-core Three-dimensional (3d) Inductors And Packaging Integration App 20150302974 - ZHAO; Sam Ziqun ; et al.	2015-10-22
Semiconductor package with improved testability Grant 9,153,507 - Zhao , et al. October 6, 2	2015-10-06
Wireless Bus For Intra-Chip and Inter-Chip Communication, Including Wireless-Enabled Component (WEC) Embodiments App 20150282235 - ROFOUGARAN; Ahmadreza (Reza) ; et al.	2015-10-01
Passive Probing Of Various Locations In A Wireless Enabled Integrated Circuit (ic) App 20150276856 - Castaneda; Jesus Alfonso ; et al.	2015-10-01
Package 3D interconnection and method of making same Grant 9,129,980 - Khan , et al. September 8, 2	2015-09-08
Interposer Package-on-package Structure App 20150249061 - ZHAO; Sam Ziqun ; et al.	2015-09-03
Semiconductor Package With A Bridge Interposer App 20150235992 - KARIKALAN; Sampath K. ; et al.	2015-08-20
Hybrid Thermal Interface Material For Ic Packages With Integrated Heat Spreader App 20150228553 - Saeidi; Mehdi ; et al.	2015-08-13
Creating a System on the Fly and Applications Thereof App 20150223275 - ROFOUGARAN; Ahmadreza (Reza) ; et al.	2015-08-06
Thermal Interface Material For Integrated Circuit Package And Method Of Making The Same App 20150206821 - ZHAO; Sam Ziqun ; et al.	2015-07-23
Thermal Improvement For Hotspots On Dies In Integrated Circuit Packages App 20150200149 - ZHAO; Sam Ziqun ; et al.	2015-07-16
Passive probing of various locations in a wireless enabled integrated circuit (IC) Grant 9,075,105 - Castaneda , et al. July 7, 2	2015-07-07
Interposer package-on-package structure Grant 9,070,627 - Zhao , et al. June 30, 2	2015-06-30
Compliant Dielectric Layer For Semiconductor Device App 20150179610 - Khan; Rezaur Rahman ; et al.	2015-06-25
Package 3D interconnection and method of making same Grant 9,064,781 - Zhao , et al. June 23, 2	2015-06-23
Semiconductor package with a bridge interposer Grant 9,059,179 - Karikalan , et al. June 16, 2	2015-06-16
Identifying defective components on a wafer using component triangulation Grant 9,046,576 - Behzad , et al. June 2, 2	2015-06-02
Hybrid thermal interface material for IC packages with integrated heat spreader Grant 9,041,192 - Saeidi , et al. May 26, 2	2015-05-26
Programmable interposer with conductive particles Grant 9,041,171 - Zhao , et al. May 26, 2	2015-05-26
Enhanced Die-up Ball Grid Array And Method For Making The Same App 20150137343 - KHAN; Reza-ur Rahman ; et al.	2015-05-21
System having co-located functional resources and applications thereof Grant 9,031,506 - Castaneda , et al. May 12, 2	2015-05-12
Thermal interface material for integrated circuit package Grant 9,024,436 - Zhao , et al. May 5, 2	2015-05-05
Thermal improvement for hotspots on dies in integrated circuit packages Grant 9,013,035 - Zhao , et al. April 21, 2	2015-04-21
Semiconductor package with ultra-thin interposer without through-semiconductor vias Grant 9,013,041 - Karikalan , et al. April 21, 2	2015-04-21
Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments Grant 9,008,589 - Rofougaran , et al. April 14, 2	2015-04-14
Simultaneous testing of semiconductor components on a wafer Grant 9,002,673 - Behzad , et al. April 7, 2	2015-04-07
Creating a system on the fly and applications thereof Grant 8,995,931 - Rofougaran , et al. March 31, 2	2015-03-31
Interposer Package-on-package Structure App 20150069637 - ZHAO; Sam Ziqun ; et al.	2015-03-12
Wireless bus for intra-chip and inter-chip communication, including scalable wireless bus embodiments Grant 8,971,806 - Rofougaran , et al. March 3, 2	2015-03-03
Tagging of functional blocks of a semiconductor component on a wafer Grant 8,952,712 - Behzad , et al. February 10, 2	2015-02-10
Semiconductor package with integrated electromagnetic shielding Grant 8,928,128 - Karikalan , et al. January 6, 2	2015-01-06
Device having wirelessly enabled functional blocks Grant 8,928,139 - Zhao , et al. January 6, 2	2015-01-06
Establishing a wireless communications bus and applications thereof Grant 8,923,765 - Behzad , et al. December 30, 2	2014-12-30
Thermal Interface Material For Integrated Circuit Package And Method Of Making The Same App 20140374897 - ZHAO; Sam Ziqun ; et al.	2014-12-25
Interconnect Structure For Molded Ic Packages App 20140367854 - Zhao; Sam Ziqun ; et al.	2014-12-18
Test board for use with devices having wirelessly enabled functional blocks and method of using same Grant 8,901,945 - Zhao , et al. December 2, 2	2014-12-02
Semiconductor packages with integrated heat spreaders Grant 8,872,321 - Zhao , et al. October 28, 2	2014-10-28
Simultaneously tagging of semiconductor components on a wafer Grant 8,866,502 - Behzad , et al. October 21, 2	2014-10-21
Integrated Circuit Device Facilitating Package on Package Connections App 20140291818 - ZHAO; Sam Ziqun ; et al.	2014-10-02
Semiconductor package including interposer with through-semiconductor vias Grant 8,829,656 - Zhao , et al. September 9, 2	2014-09-09
Semiconductor package including a substrate and an interposer Grant 8,829,655 - Zhao , et al. September 9, 2	2014-09-09
Semiconductor package with interposer Grant 8,829,654 - Zhao , et al. September 9, 2	2014-09-09
Semiconductor package with interface substrate having interposer Grant 8,823,144 - Khan , et al. September 2, 2	2014-09-02
Methods and systems for on-chip osmotic airflow cooling Grant 8,817,472 - Zhao , et al. August 26, 2	2014-08-26
Interposer Package Structure For Wireless Communication Element, Thermal Enhancement, And Emi Shielding App 20140235183 - ZHAO; Sam Ziqun ; et al.	2014-08-21
Thermally And Electrically Enhanced Ball Grid Array Package App 20140210083 - Zhao; Sam Ziqun ; et al.	2014-07-31
Semiconductor package having an interposer configured for magnetic signaling Grant 8,791,533 - Chen , et al. July 29, 2	2014-07-29
Semiconductor package with integrated selectively conductive film interposer Grant 8,749,072 - Zhao , et al. June 10, 2	2014-06-10
Stacked Packaging Using Reconstituted Wafers App 20140151900 - HU; Kevin Kunzhong ; et al.	2014-06-05
Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding Grant 8,718,550 - Zhao , et al. May 6, 2	2014-05-06
Die Down Integrated Circuit Package With Integrated Heat Spreader And Leads App 20140103505 - Zhao; Sam Ziqun ; et al.	2014-04-17
Thermally and electrically enhanced ball grid array package Grant 8,686,558 - Zhao , et al. April 1, 2	2014-04-01
Signal distribution and radiation in a wireless enabled integrated circuit (IC) using a leaky waveguide Grant 8,670,638 - Rofougaran , et al. March 11, 2	2014-03-11
Semiconductor Package with Interposer App 20140061886 - Zhao; Sam Ziqun ; et al.	2014-03-06
Semiconductor Package Including Interposer with Through-Semiconductor Vias App 20140061946 - Zhao; Sam Ziqun ; et al.	2014-03-06
Semiconductor Package Including a Substrate and an Interposer App 20140061945 - Zhao; Sam Ziqun ; et al.	2014-03-06
Hybrid Thermal Interface Material For Ic Packages With Integrated Heat Spreader App 20140061893 - Saeidi; Seyed Mahdi ; et al.	2014-03-06
Interface substrate with interposer Grant 8,664,772 - Khan , et al. March 4, 2	2014-03-04
Semiconductor Package with Interface Substrate Having Interposer App 20140035163 - Khan; Rezaur Rahman ; et al.	2014-02-06
Interface Substrate with Interposer App 20140035162 - Khan; Rezaur Rahman ; et al.	2014-02-06
Semiconductor Package Including an Integrated Waveguide App 20140027903 - Boers; Michael ; et al.	2014-01-30
Identifying Defective Components on a Wafer Using Component Triangulation App 20130311127 - BEHZAD; Arya Reza ; et al.	2013-11-21
Semiconductor package including an organic substrate and interposer having through-semiconductor vias Grant 8,587,132 - Zhao , et al. November 19, 2	2013-11-19
Integrated circuit (IC) package stacking and IC packages formed by same Grant 8,581,381 - Zhao , et al. November 12, 2	2013-11-12
Package 3D Interconnection and Method of Making Same App 20130295723 - KHAN; Rezaur Rahman ; et al.	2013-11-07
Organic interface substrate having interposer with through-semiconductor vias Grant 8,558,395 - Khan , et al. October 15, 2	2013-10-15
Semiconductor Packages with Integrated Heat Spreaders App 20130221506 - Zhao; Sam Ziqun ; et al.	2013-08-29
Semiconductor Package with Integrated Selectively Conductive Film Interposer App 20130221525 - Zhao; Sam Ziqun ; et al.	2013-08-29
System-In-Package with Integrated Socket App 20130221500 - Zhao; Sam Ziqun ; et al.	2013-08-29
Semiconductor Package with Integrated Electromagnetic Shielding App 20130221499 - Karikalan; Sampath K.V. ; et al.	2013-08-29
Interposer Having Conductive Posts App 20130214408 - Zhao; Sam Ziqun ; et al.	2013-08-22
Organic Interface Substrate Having Interposer With Through-semiconductor Vias App 20130214410 - Khan; Rezaur Rahman ; et al.	2013-08-22
Semiconductor Package Including an Organic Substrate and Interposer Having Through-Semiconductor Vias App 20130214426 - Zhao; Sam Ziqun ; et al.	2013-08-22
Package 3D interconnection and method of making same Grant 8,508,045 - Khan , et al. August 13, 2	2013-08-13
Semiconductor package including an integrated waveguide Grant 8,508,029 - Boers , et al. August 13, 2	2013-08-13
Semiconductor Package with Improved Testability App 20130193996 - Zhao; Sam Ziqun ; et al.	2013-08-01
Semiconductor Package Having an Interposer Configured for Magnetic Signaling App 20130193587 - Chen; Xiangdong ; et al.	2013-08-01
Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Data Center/Server Embodiments App 20130191567 - ROFOUGARAN; Ahmadreza ; et al.	2013-07-25
Semiconductor Interposer Having a Cavity for Intra-Interposer Die App 20130181354 - Khan; Rezaur Rahman ; et al.	2013-07-18
System and method for dynamically configuring processing resources and memory resources of wireless-enabled components Grant 8,484,395 - Boers , et al. July 9, 2	2013-07-09
Semiconductor Package with Ultra-Thin Interposer Without Through-Semiconductor Vias App 20130168860 - Karikalan; Sampath K.V. ; et al.	2013-07-04
Semiconductor Package with a Bridge Interposer App 20130168854 - KARIKALAN; Sampath K.V. ; et al.	2013-07-04
Programmable Interposer with Conductive Particles App 20130168841 - Zhao; Sam Ziqun ; et al.	2013-07-04
Stacked Packaging Using Reconstituted Wafers App 20130154106 - Hu; Kevin Kunzhong ; et al.	2013-06-20
Wireless bus for intra-chip and inter-chip communication, including data center/server embodiments Grant 8,417,861 - Rofougaran , et al. April 9, 2	2013-04-09
Semiconductor Package Including An Integrated Waveguide App 20130082379 - Boers; Michael ; et al.	2013-04-04
Device Having Wirelessly Enabled Functional Blocks App 20130082363 - ZHAO; Sam Ziqun ; et al.	2013-04-04
Signal Distribution And Radiation In A Wireless Enabled Integrated Circuit (ic) Using A Leaky Waveguide App 20130082801 - ROFOUGARAN; Ahmadreza ; et al.	2013-04-04
Apparatus For Reconfiguring An Integrated Waveguide App 20130082800 - Rofougaran; Ahmadreza ; et al.	2013-04-04
Signal Distribution And Radiation In A Wireless Enabled Integrated Circuit (ic) App 20130082767 - Boers; Michael ; et al.	2013-04-04
Wirelessly Communicating Among Vertically Arranged Integrated Circuits (ICs) in a Semiconductor Package App 20130082403 - Castaneda; Jesus Alfonso ; et al.	2013-04-04
Passive Probing of Various Locations in a Wireless Enabled Integrated Circuit (IC) App 20130082730 - Castaneda; Jesus Alfonso ; et al.	2013-04-04
Interposer Package Structure for Wireless Communication Element, Thermal Enhancement, and EMI Shielding App 20130078915 - ZHAO; Sam Ziqun ; et al.	2013-03-28
Proximity coupling without Ohmic contact and applications thereof Grant 8,351,855 - Castaneda , et al. January 8, 2	2013-01-08
1-Layer Interposer Substrate With Through-Substrate Posts App 20130000968 - Zhao; Sam Ziqun ; et al.	2013-01-03
Methods and Systems for On-Chip Osmotic Airflow Cooling App 20120314367 - ZHAO; Sam Ziqun ; et al.	2012-12-13
Ball grid array package enhanced with a thermal and electrical connector Grant 8,310,067 - Zhao , et al. November 13, 2	2012-11-13
Package 3D Interconnection and Method of Making Same App 20120223429 - KHAN; Rezaur Rahman ; et al.	2012-09-06
Package 3D Interconnection and Method of Making Same App 20120225522 - ZHAO; Sam Ziqun ; et al.	2012-09-06
Test Board and Method of Using Same App 20120212244 - ZHAO; Sam Ziqun ; et al.	2012-08-23
Electromagnetic interference shield with integrated heat sink Grant 8,213,180 - Zhao , et al. July 3, 2	2012-07-03
Die Down Device With Thermal Connector App 20120126396 - Zhao; Sam Ziqun ; et al.	2012-05-24
Interposer for die stacking in semiconductor packages and the method of making the same Grant 8,183,687 - Khan , et al. May 22, 2	2012-05-22
No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement Grant 8,183,680 - Zhao , et al. May 22, 2	2012-05-22
Low profile ball grid array (BGA) package with exposed die and method of making same Grant 8,169,067 - Law , et al. May 1, 2	2012-05-01
Millimeter Devices On An Integrated Circuit App 20120086114 - ZHAO; Sam Ziqun ; et al.	2012-04-12
IC package sacrificial structures for crack propagation confinement Grant 8,102,027 - Zhao , et al. January 24, 2	2012-01-24
Thermally and Electrically Enhanced Ball Grid Array Package App 20110318885 - Zhao; Sam Ziqun ; et al.	2011-12-29
Package For A Wireless Enabled Integrated Circuit App 20110316139 - ZHAO; Sam Ziqun ; et al.	2011-12-29
Simultaneously Tagging of Semiconductor Components on a Wafer App 20110309852 - Behzad; Arya Reza ; et al.	2011-12-22
Identifying Defective Semiconductor Components on a Wafer Using Thermal Imaging App 20110309842 - BEHZAD; Arya Reza ; et al.	2011-12-22
Simultaneous Testing of Semiconductor Components on a Wafer App 20110313710 - BEHZAD; Arya Reza ; et al.	2011-12-22
Identifying Defective Semiconductor Components on a Wafer Using Component Triangulation App 20110313711 - BEHZAD; Arya Reza ; et al.	2011-12-22
Tagging of Functional Blocks of a Semiconductor Component on a Wafer App 20110309851 - Behzad; Arya Reza ; et al.	2011-12-22
Ball grid array package having one or more stiffeners Grant 8,039,949 - Zhao , et al. October 18, 2	2011-10-18
Die down ball grid array packages and method for making same Grant 8,021,927 - Khan , et al. September 20, 2	2011-09-20
Establishing A Wireless Communications Bus And Applications Thereof App 20110183617 - BEHZAD; Arya Reza ; et al.	2011-07-28
Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Wireless-Enabled Component (WEC) Embodiments App 20110183630 - ROFOUGARAN; Ahmadreza (Reza) ; et al.	2011-07-28
Proximity Coupling Without Ohmic Contact and Applications Thereof App 20110183610 - CASTANEDA; Jesus Alfonso ; et al.	2011-07-28
Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Adaptive Link and Route Embodiments App 20110182218 - Rofougaran; Ahmadreza (Reza) ; et al.	2011-07-28
System Having Co-Located Functional Resources Amd Applications Thereof App 20110183615 - CASTANEDA; Jesus Alfonso ; et al.	2011-07-28
Configurable System of Wireless-Enabled Components And Applications Thereof App 20110185092 - BOERS; Michael ; et al.	2011-07-28
Locating Wireless-Enabled Components and Applications Thereof App 20110183618 - BEHZAD; Arya Reza ; et al.	2011-07-28
Creating A System On The Fly And Applications Thereof App 20110183604 - ROFOUGARAN; Ahmadreza (Reza) ; et al.	2011-07-28
Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Data Center/Server Embodiments App 20110185091 - ROFOUGARAN; Ahmadreza (Reza) ; et al.	2011-07-28
Wireless Bus for Intra-Chip and Inter-Chip Communication, Including Scalable Wireless Bus Embodiments App 20110183616 - ROFOUGARAN; Ahmadreza (Reza) ; et al.	2011-07-28
Wireless bus for intra-chip and inter-chip communication, including resource borrowing embodiments App 20110183699 - ROFOUGARAN; Ahmadreza (Reza) ; et al.	2011-07-28
Electromagnetic Interference Shield With Integrated Heat Sink App 20110176279 - Zhao; Sam Ziqun ; et al.	2011-07-21
Ball Grid Array Package Enhanced With a Thermal and Electrical Connector App 20110140272 - ZHAO; Sam Ziqun ; et al.	2011-06-16
Ball grid array package enhanced with a thermal and electrical connector Grant 7,893,546 - Zhao , et al. February 22, 2	2011-02-22
Die Down Ball Grid Array Packages and Method for Making Same App 20100285637 - Khan; Reza-Ur Rahman ; et al.	2010-11-11
Leadframe IC packages having top and bottom integrated heat spreaders Grant 7,808,087 - Zhao , et al. October 5, 2	2010-10-05
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same Grant 7,791,189 - Zhao , et al. September 7, 2	2010-09-07
Die down ball grid array package Grant 7,786,591 - Khan , et al. August 31, 2	2010-08-31
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages Grant 7,781,266 - Zhao , et al. August 24, 2	2010-08-24
Flip chip package including a non-planar heat spreader and method of making the same Grant 7,719,110 - Zhao , et al. May 18, 2	2010-05-18
Interconnect structure and formation for package stacking of molded plastic area array package Grant 7,714,453 - Khan , et al. May 11, 2	2010-05-11
Ball Grid Array Package Having One or More Stiffeners App 20100052151 - ZHAO; Sam Ziqun ; et al.	2010-03-04
Methods and Apparatus for Improved Thermal Performance and Electromagnetic Interference (EMI) Shielding in Leadframe Integrated Circuit (IC) Packages App 20100035383 - Zhao; Sam Ziqun ; et al.	2010-02-11
External Heat Sink For Bare-die Flip Chip Packages App 20100019379 - Zhao; Sam Ziqun ; et al.	2010-01-28
I/O connection scheme for QFN leadframe and package structures Grant 7,646,083 - Yeung , et al. January 12, 2	2010-01-12
Ball grid array package with patterned stiffener surface and method of assembling the same Grant 7,629,681 - Zhao , et al. December 8, 2	2009-12-08
I/o Connection Scheme For Qfn Leadframe And Package Structures App 20090243054 - Yeung; Fan ; et al.	2009-10-01
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages Grant 7,582,951 - Zhao , et al. September 1, 2	2009-09-01
Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader Grant 7,579,217 - Zhao , et al. August 25, 2	2009-08-25
Enhanced Die-Up Ball Grid Array and Method for Making the Same App 20090203172 - Khan; Reza-ur Rahman ; et al.	2009-08-13
Ball grid array package with separated stiffener layer Grant 7,550,845 - Zhao , et al. June 23, 2	2009-06-23
Ball Grid Array Package Enhanced With a Thermal and Electrical Connector App 20090057871 - ZHAO; Sam Ziqun ; et al.	2009-03-05
IC package sacrificial structures for crack propagation confinement App 20090051010 - Zhao; Sam Ziqun ; et al.	2009-02-26
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same Grant 7,482,686 - Zhao , et al. January 27, 2	2009-01-27
Ball grid array package enhanced with a thermal and electrical connector Grant 7,462,933 - Zhao , et al. December 9, 2	2008-12-09
Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages Grant 7,432,586 - Zhao , et al. October 7, 2	2008-10-07
Interposer for die stacking in semiconductor packages and the method of making the same App 20080211089 - Khan; Rezaur Rahman ; et al.	2008-09-04
Enhanced die-down ball grid array and method for making the same Grant 7,402,906 - Rahman Khan , et al. July 22, 2	2008-07-22
Low profile ball grid array (BGA) package with exposed die and method of making same App 20080096312 - Law; Edward ; et al.	2008-04-24
Flip Chip Package Including a Non-Planar Heat Spreader and Method of Making the Same App 20080006934 - Zhao; Sam Ziqun ; et al.	2008-01-10
Integrated circuit (IC) package stacking and IC packages formed by same App 20070290376 - Zhao; Sam Ziqun ; et al.	2007-12-20
Thermal improvement for hotspots on dies in integrated circuit packages App 20070290322 - Zhao; Sam Ziqun ; et al.	2007-12-20
Leadframe IC packages having top and bottom integrated heat spreaders App 20070278632 - Zhao; Sam Ziqun ; et al.	2007-12-06
Interconnect structure and formation for package stacking of molded plastic area array package App 20070273049 - Khan; Rezaur Rahman ; et al.	2007-11-29
Integrated circuit package having exposed thermally conducting body App 20070273023 - Zhao; Sam Ziqun ; et al.	2007-11-29
No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement App 20070267734 - Zhao; Sam Ziqun ; et al.	2007-11-22
Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages App 20070267740 - Khan; Rezaur Rahman ; et al.	2007-11-22
Flip chip package including a non-planar heat spreader and method of making the same Grant 7,271,479 - Zhao , et al. September 18, 2	2007-09-18
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages App 20070200210 - Zhao; Sam Ziqun ; et al.	2007-08-30
Ball grid array package with stepped stiffener layer Grant 7,245,500 - Khan , et al. July 17, 2	2007-07-17
Method for assembling a ball grid array package with multiple interposers Grant 7,241,645 - Zhao , et al. July 10, 2	2007-07-10
Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages App 20070090502 - Zhao; Sam Ziqun ; et al.	2007-04-26
Method of assembling a ball grid array package with patterned stiffener layer Grant 7,202,559 - Zhao , et al. April 10, 2	2007-04-10
Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader App 20070045824 - Zhao; Sam Ziqun ; et al.	2007-03-01
Ball grid array package enhanced with a thermal and electrical connector App 20070007644 - Zhao; Sam Ziqun ; et al.	2007-01-11
Ball grid array package enhanced with a thermal and electrical connector Grant 7,161,239 - Zhao , et al. January 9, 2	2007-01-09
Enhanced die-up ball grid array packages and method for making the same Grant 7,132,744 - Zhao , et al. November 7, 2	2006-11-07
IC die support structures for ball grid array package fabrication Grant 7,078,806 - Khan , et al. July 18, 2	2006-07-18
Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same App 20060091542 - Zhao; Sam Ziqun ; et al.	2006-05-04
Flip chip package including a non-planar heat spreader and method of making the same App 20060091509 - Zhao; Sam Ziqun ; et al.	2006-05-04
Die down ball grid array packages and method for making same App 20060065972 - Khan; Reza-ur Rahman ; et al.	2006-03-30
Die-up ball grid array package with enhanced stiffener Grant 7,005,737 - Zhao , et al. February 28, 2	2006-02-28
Die-up ball grid array package with patterned stiffener opening Grant 6,989,593 - Khan , et al. January 24, 2	2006-01-24
Method of assembling a ball grid array package with patterned stiffener layer App 20050133905 - Zhao, Sam Ziqun ; et al.	2005-06-23
Ball grid array package with patterned stiffener layer Grant 6,906,414 - Zhao , et al. June 14, 2	2005-06-14
Method for making an enhanced die-up ball grid array package with two substrates Grant 6,887,741 - Zhao , et al. May 3, 2	2005-05-03
Thermally and electrically enhanced ball grid array packaging Grant 6,882,042 - Zhao , et al. April 19, 2	2005-04-19
Ball grid array package with patterned stiffener surface and method of assembling the same App 20050077545 - Zhao, Sam Ziqun ; et al.	2005-04-14
Enhanced die-up ball grid array package with two substrates Grant 6,876,553 - Zhao , et al. April 5, 2	2005-04-05
Ball grid array package with multiple interposers Grant 6,861,750 - Zhao , et al. March 1, 2	2005-03-01
Die-down ball grid array package with die-attached heat spreader and method for making the same Grant 6,853,070 - Khan , et al. February 8, 2	2005-02-08
Method for assembling a ball grid array package with multiple interposers App 20050023677 - Zhao, Sam Ziqun ; et al.	2005-02-03
Enhanced die-down ball grid array and method for making the same App 20050012203 - Rahman Khan, Reza-ur ; et al.	2005-01-20
IC die support structures for ball grid array package fabrication App 20040262754 - Khan, Reza-ur Rahman ; et al.	2004-12-30
Ball grid array package fabrication with IC die support structures Grant 6,825,108 - Khan , et al. November 30, 2	2004-11-30
Ball grid array package with patterned stiffener layer App 20040212051 - Zhao, Sam Ziqun ; et al.	2004-10-28
Method for making an enhanced die-up ball grid array package with two substrates App 20040113284 - Zhao, Sam Ziqun ; et al.	2004-06-17
Ball grid array package fabrication with IC die support structures App 20030146506 - Khan, Reza-ur Rahman ; et al.	2003-08-07
Ball grid array package with multiple interposers App 20030146511 - Zhao, Sam Ziqun ; et al.	2003-08-07
Ball grid array package with separated stiffener layer App 20030146509 - Zhao, Sam Ziqun ; et al.	2003-08-07
Ball grid array package with stepped stiffener layer App 20030146503 - Khan, Reza-ur Rahman ; et al.	2003-08-07
Ball grid array package enhanced with a thermal and electrical connector App 20030057550 - Zhao, Sam Ziqun ; et al.	2003-03-27
Die-up ball grid array package with attached stiffener ring App 20020185720 - Khan, Reza-Ur R. ; et al.	2002-12-12
Die-up ball grid array package with printed circuit board attachable heat spreader App 20020185734 - Zhao, Sam Ziqun ; et al.	2002-12-12
Die-up ball grid array package with enhanced stiffener App 20020185722 - Zhao, Sam Ziqun ; et al.	2002-12-12
Thermally and electrically enhanced ball grid array packaging App 20020135065 - Zhao, Sam Ziqun ; et al.	2002-09-26
Enhanced die-down ball grid array and method for making the same App 20020109226 - Khan, Reza-Ur Rahman ; et al.	2002-08-15
Enhanced die-up ball grid array and method for making the same App 20020079572 - Khan, Reza-ur Rahman ; et al.	2002-06-27
Enhanced die-up ball grid array packages and method for making the same App 20020079562 - Zhao, Sam Ziqun ; et al.	2002-06-27